Multi-dimensional constant temperature control system of high-power digital optical image processor

Abstract

The invention discloses a multi-dimensional constant-temperature control system of a high-power digital light image processor. The multi-dimensional constant-temperature control system comprises a circulating water system, a heat dissipation assembly and a processor module, the circulating water system is used for providing cooling water for the heat dissipation assembly; the heat dissipation assembly comprises a first refrigeration sheet, a second refrigeration sheet, a first liquid cooling plate and a second liquid cooling plate. The first refrigeration sheet is arranged on the front side or the back side of the processor module, the second refrigeration sheet is arranged on the outer side of the processor module in a sleeving mode, the first liquid cooling plate is arranged on the outer side of the first refrigeration sheet, and the second liquid cooling plate is arranged on the outer side of the second refrigeration sheet in a sleeving mode; at least five surfaces of the processor module are cooled through the first refrigeration sheet and the second refrigeration sheet, heat transfer is performed through the first liquid cooling plate and the second liquid cooling plate, the effect of rapidly cooling the processor module is achieved, the heat transfer efficiency can be improved by adding the heat conduction layer between the liquid cooling plates and the refrigeration sheets, and the cooling effect is improved.

Description

Technical Field

[0001] The present invention relates to the technical field of constant temperature control, and in particular to a multi-dimensional constant temperature control system for a high-power digital optical image processor. Background Art

[0002] Digital light modulator flat display devices are not only used in attenuators and filters, digital cameras, 3D scanning, optical neural networks, lithography, and other fields, but also in high-definition televisions and digital projection displays. Especially in the projection field, the brightness and quality of image output are increasingly required. The traditional heat pipe heat transfer and aluminum air cooling solutions cannot achieve the problem that when the incident light source power is greater than 100W / mm2, the digital light modulator cannot dissipate heat and cannot work. In particular, when a high-power laser light source or LED light source is irradiated to the digital light processor, a large amount of heat will be generated, causing the digital processor to fail to work normally. Summary of the invention

[0003] According to an embodiment of the present invention, a multi-dimensional constant temperature control system for a high-power digital optical image processor is provided, comprising: a circulating water system, a heat dissipation component and a processor module; The circulating water system is used to provide cooling water or coolant to the heat dissipation component; The heat dissipation assembly comprises: a first cooling fin, a second cooling fin, a first liquid cooling plate and a second liquid cooling plate; The first cooling fin is arranged on the front or rear of the processor module, the second cooling fin is sleeved on the outside of the processor module, the first liquid cooling plate is arranged on the outside of the first cooling fin, and the second liquid cooling plate is sleeved on the outside of the second cooling fin; A first heat-conducting layer is provided on the adjacent surfaces of the first cooling fin and the second cooling fin and the processor module, a second heat-conducting layer is provided on the adjacent surfaces of the first cooling fin and the first liquid cooling plate, and a third heat-conducting layer is provided between the second cooling fin and the second liquid cooling plate.

[0004] Furthermore, the shape of the first cooling fin includes but is not limited to elliptical, rectangular, polygonal and circular, and a transition material is provided between the first cooling fin and the processor module, and the transition material is used to conduct heat.

[0005] Furthermore, the transfer material includes but is not limited to pure aluminum, copper, a thermally conductive pad and a graphene sheet.

[0006] Furthermore, the second cooling fin is a ring-shaped structure, the wall thickness of the second cooling fin is related to the wall thickness of the processor module, an installation gap is provided between the second cooling fin and the processor module, and the installation gap is filled with a thermally conductive gasket.

[0007] Furthermore, the first liquid cooling plate is provided with a first liquid inlet and a first liquid outlet, the first liquid inlet and the first liquid outlet are provided on the same side of the first liquid cooling plate, and the first liquid inlet and the first liquid outlet are provided in parallel.

[0008] Furthermore, the middle portion of the first liquid cooling plate is used for the illumination light source to enter the light entrance of the processor module, and the opening size of the middle portion of the first liquid cooling plate is greater than 1.5 times the incident light spot.

[0009] Furthermore, the second liquid cooling plate is provided with a second liquid inlet and a second liquid outlet, the second liquid inlet and the second liquid outlet are relatively arranged at two ends of the second liquid cooling plate, the second liquid inlet is connected to the water outlet end of the circulating water system, the second liquid outlet is connected to the first liquid inlet, and the first liquid outlet is connected to the return water end of the circulating water system.

[0010] Furthermore, the processor module includes: an array micromirror, a fixing structure and a window piece; The fixing structure is used to fix the array micromirror, the window piece is arranged on the outside of the array micromirror, and each micromirror in the array micromirror can independently modulate spatial light.

[0011] Furthermore, the circulating water system comprises: a water tank, a water pump and a heat exchanger; The water tank stores cooling water, the inlet end of the water pump is connected to the water tank, and the outlet end is connected to the first liquid cooling plate, the inlet end of the heat exchanger is connected to the second liquid cooling plate, and the outlet end is connected to the water tank.

[0012] Furthermore, the circulating water system further comprises: a first quick-release joint and a second quick-release joint; The first quick-release joint is located between the outlet end of the water pump and the first liquid cooling plate, the second quick-release joint is located between the inlet end of the heat exchanger and the second liquid cooling plate, and the first quick-release joint is connected to the second quick-release joint.

[0013] According to a multi-dimensional constant temperature control system for a high-power digital optical image processor of an embodiment of the present invention, the present application provides cooling water to the heat dissipation component through a circulating water system, cools at least five sides of the processor module through a first cooling plate and a second cooling plate, and then transfers heat through a first liquid cooling plate and a second liquid cooling plate, and quickly transfers the heat generated by the processor module through the coolant, thereby achieving the effect of quickly cooling the processor module. By setting a thermal conductive layer, the efficiency of heat transfer can be increased and the cooling effect can be improved.

[0014] It is to be understood that both the foregoing general description and the following detailed description are exemplary, and are intended to provide further explanation of the technology as claimed. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 It is a structural diagram of a multi-dimensional constant temperature control system of a high-power digital optical image processor according to an embodiment of the present invention; Figure 2 It is a front view of a heat dissipation component of a multi-dimensional constant temperature control system of a high-power digital light image processor according to an embodiment of the present invention; Figure 3 A side view of a heat dissipation component of a multi-dimensional constant temperature control system for a high-power digital optical image processor according to an embodiment of the present invention; Figure 4 It is a structural diagram of a processor module of a multi-dimensional constant temperature control system of a high-power digital light image processor according to an embodiment of the present invention; Figure 5 It is a structural diagram of a first cooling plate of a multi-dimensional constant temperature control system of a high-power digital light image processor according to an embodiment of the present invention; Figure 6 It is a structural diagram of a second cooling plate of a multi-dimensional constant temperature control system of a high-power digital light image processor according to an embodiment of the present invention; Figure 7 It is a structural diagram of a first liquid cooling plate of a multi-dimensional constant temperature control system for a high-power digital optical image processor according to an embodiment of the present invention; Figure 8 It is a structural diagram of a second liquid cooling plate of a multi-dimensional constant temperature control system for a high-power digital optical image processor according to an embodiment of the present invention; Fig. 9 The structure diagram of a liquid cooling plate of a multi-dimensional constant temperature control system for a high-power digital optical image processor according to an embodiment of the present invention.

[0016] The reference numerals in the figure are: 1 is a water tank, 2 is a water pump, 3 is a heat dissipation component, 31 is a first cooling fin, 32 is a second cooling fin, 33 is a first liquid cooling plate, 331 is a first liquid inlet, 332 is a first liquid outlet, 34 is a second liquid cooling plate, 341 is a second liquid inlet, 342 is a second liquid outlet, 4 is a processor module, 41 is an array micromirror, 42 is a fixed structure, 43 is a window piece, 5 is a heat exchanger, 6 is a first quick-release connector, and 7 is a second quick-release connector. DETAILED DESCRIPTION

[0017] The preferred embodiments of the present invention will be described in detail below in conjunction with the accompanying drawings to further illustrate the present invention.

[0018] First, combine Figure 1 to Figure 9 A multi-dimensional constant temperature control system for a high-power digital optical image processor according to an embodiment of the present invention is described, which is used for cooling a high-power processor.

[0019] like Figure 1 to Figure 9As shown, a multi-dimensional constant temperature control system for a high-power digital optical image processor according to an embodiment of the present invention comprises: a circulating water system, a heat dissipation component 3 and a processor module 4; The circulating water system is used to provide cooling water or coolant to the heat dissipation component 3; The heat dissipation assembly 3 includes: a first cooling fin 31, a second cooling fin 32, a first liquid cooling plate 33 and a second liquid cooling plate 34; The first cooling fin 31 is arranged on the front or rear of the processor module 4, the second cooling fin 32 is sleeved on the outside of the processor module 4, the first liquid cooling plate 33 is arranged on the outside of the first cooling fin 31, and the second liquid cooling plate 34 is sleeved on the outside of the second cooling fin 32; A first heat-conducting layer is provided on the adjacent surfaces of the first cooling fin 31 and the second cooling fin 32 and the processor module 4 , a second heat-conducting layer is provided on the adjacent surfaces of the first cooling fin 31 and the first liquid cooling plate 33 , and a third heat-conducting layer is provided between the second cooling fin 32 and the second liquid cooling plate 34 .

[0020] The present application provides cooling water to the heat dissipation component 3 through a circulating water system, cools at least five surfaces of the processor module 4 through the first cooling fins 31 and the second cooling fins 32, and then transfers heat through the first liquid cooling plate 33 and the second liquid cooling plate 34. The heat generated by the processor module 4 is quickly transferred out through the coolant, thereby achieving the effect of quickly cooling the processor module 4. By setting a thermal conductive layer, the efficiency of heat transfer can be increased and the cooling effect can be improved.

[0021] In this embodiment, the first heat-conducting layer, the second heat-conducting layer and the third heat-conducting layer use thermal grease to increase the efficiency of heat transfer.

[0022] like Figure 2~Figure 5 As shown, the shape of the first cooling plate 31 includes but is not limited to ellipse, rectangle, polygon and circle, and a transition material is provided between the first cooling plate 31 and the processor module 4, and the transition material is used to conduct heat. The transition material includes but is not limited to pure aluminum, copper, thermal pads and graphene sheets.

[0023] The first cooling sheet 31 is arranged on the front or back of the processor module 4, and semiconductor cooling is performed on the front or back of the processor module 4. The transition material is installed between the first cooling sheet 31 and the processor module 4, and the heat conduction efficiency is improved by the transition material. In other embodiments, the first cooling sheet 31 can be directly attached to the back of the processor module 4.

[0024] like Figure 2~Figure 6As shown, the second cooling fin 32 is a ring-shaped structure, the wall thickness of the second cooling fin 32 is related to the wall thickness of the processor module 4, and there is an installation gap between the second cooling fin 32 and the processor module 4, and the installation gap is filled with a thermal conductive gasket.

[0025] The processor module 4 and the second cooling plate 32 are installed in a gap assembly manner. A gap of 0.5 mm is reserved between the processor module 4 and the second cooling plate 32. After assembly, a 0.6 mm thermal conductive gasket is filled in the gap, and the thermal conductive gasket is deformed by its own compression.

[0026] like Figure 2~Figure 7 As shown, the first liquid cooling plate 33 is provided with a first liquid inlet 331 and a first liquid outlet 332, the first liquid inlet 331 and the first liquid outlet 332 are arranged on the same side of the first liquid cooling plate 33, and the first liquid inlet 331 and the first liquid outlet 332 are arranged in parallel. The middle part of the first liquid cooling plate 33 is used for the light inlet of the illumination light source entering the processor module 4, and the opening size of the middle part of the first liquid cooling plate 33 is greater than 1.5 times the incident light spot.

[0027] The middle part of the first liquid cooling plate 33 is not designed with a water channel and is used for the illumination light source to enter the light entrance of the processor module 4. In order to prevent the middle interior of the first liquid cooling plate 33 from blocking the incident light, considering the actual processing and installation and debugging errors, the opening size of the middle part of the first liquid cooling plate 33 is larger than 1.5 times the incident light spot.

[0028] like Figure 7~Figure 8 As shown, the second liquid cooling plate 34 is provided with a second liquid inlet 341 and a second liquid outlet 342, and the second liquid inlet 341 and the second liquid outlet 342 are relatively arranged at two ends of the second liquid cooling plate 34, the second liquid inlet 341 is connected to the water outlet end of the circulating water system, the second liquid outlet 342 is connected to the first liquid inlet 331, and the first liquid outlet 332 is connected to the return water end of the circulating water system.

[0029] The first cooling fin 31 is heat-transferred through the first liquid cooling plate 33, so that the cooling water takes away the heat on the first cooling fin 31; the second cooling fin 32 is heat-transferred through the second liquid cooling plate 34, so that the cooling water takes away the heat on the second cooling fin 32, and then the cooling water is passed into the heat exchanger 5, and the cooling water is heat-exchanged through the heat exchanger 5, so that the cooling water is recycled.

[0030] like Fig. 9As shown, in this embodiment, the first liquid cooling plate 33 and the second liquid cooling plate 34 are both composed of a cooling plate cover 352 and a cooling plate base 351. A sealing ring 353 is provided at the connection between the cooling plate cover 352 and the cooling plate base 351. The cooling plate base 351 is provided with heat transfer fins 354. Between every two heat transfer fins 354 is a flow groove, and cooling water flows through the flow groove for heat exchange, which effectively improves the cooling effect of the liquid cooling plate.

[0031] like Figure 2~Figure 4 As shown, the processor module 4 includes: an array micromirror 41, a fixing structure 42 and a window piece 43; The fixing structure 42 is used to fix the array micromirror 41 . The window piece 43 is arranged outside the array micromirror 41 . Each micromirror in the array micromirror 41 can independently modulate spatial light.

[0032] The fixing structure 42 is used to fix the array micromirror 41. Each micromirror of the array micromirror 41 can independently modulate spatial light. In this embodiment, the fixing structure 42 is a conventional technical means in the prior art.

[0033] like Figure 1 As shown, the circulating water system comprises: a water tank 1, a water pump 2 and a heat exchanger 5; The water tank 1 stores cooling water, the inlet end of the water pump 2 is connected to the water tank 1 and the outlet end is connected to the first liquid cooling plate 33 , the inlet end of the heat exchanger 5 is connected to the second liquid cooling plate 34 and the outlet end is connected to the water tank 1 .

[0034] The circulating water system further comprises: a first quick-release joint 6 and a second quick-release joint 7; The first quick-release joint 6 is located between the outlet end of the water pump 2 and the first liquid cooling plate 33 , and the second quick-release joint 7 is located between the inlet end of the heat exchanger 5 and the second liquid cooling plate 34 . The first quick-release joint 6 is connected to the second quick-release joint 7 .

[0035] Cooling water is stored in the water tank 1, and the cooling water is transported to the first liquid cooling plate 33 through the water pump 2, so that the first liquid cooling plate 33 and the second liquid cooling plate 34 are cooled, and the cooled cooling water is passed into the heat exchanger 5, and the cooling water is heat exchanged through the heat exchanger 5. The cooling water after the heat exchange is passed into the water tank 1 for circulation, and the heat dissipation component 3 and the processor module 4 can be disassembled through the first quick-release joint 6 and the second quick-release joint 7, which is convenient for maintenance of the heat dissipation component 3 and the processor module 4.

[0036] Above, refer to Figure 1 to Figure 9As shown, a multi-dimensional constant temperature control system for a high-power digital optical image processor according to an embodiment of the present invention is described. The present application provides cooling water to the heat dissipation component 3 through a circulating water system, cools at least five sides of the processor module 4 through the first cooling plate 31 and the second cooling plate 32, and then transfers heat through the first liquid cooling plate 33 and the second liquid cooling plate 34. The heat generated by the processor module 4 is quickly transferred out through the coolant, thereby achieving the effect of quickly cooling the processor module 4. By setting a thermal conductive layer, the efficiency of heat transfer can be increased and the cooling effect can be improved.

[0037] The present invention effectively solves the industry pain points that high-power light irradiation on a small-area digital light processor cannot achieve constant temperature control, has high operating temperature, and has unstable performance, and enables the digital light processor to operate stably in an environment of -30℃~50℃.

[0038] It should be noted that, in this specification, the terms "include", "comprises" or any other variations thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also includes other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the sentence "comprises..." do not exclude the existence of other identical elements in the process, method, article or device including the elements.

[0039] Although the content of the present invention has been described in detail through the above preferred embodiments, it should be appreciated that the above description should not be considered as a limitation of the present invention. After reading the above content, it will be apparent to those skilled in the art that various modifications and substitutions of the present invention will occur. Therefore, the protection scope of the present invention should be limited by the appended claims.

Claims

1. A multi-dimensional constant temperature control system for a high-power digital optical image processor, characterized in that: include: Circulating water system, cooling components and processor modules; The circulating water system is used to provide cooling water or coolant to the heat dissipation component; The heat dissipation assembly comprises: a first cooling fin, a second cooling fin, a first liquid cooling plate and a second liquid cooling plate; The first cooling fin is arranged on the front or rear of the processor module, the second cooling fin is sleeved on the outside of the processor module, the first liquid cooling plate is arranged on the outside of the first cooling fin, and the second liquid cooling plate is sleeved on the outside of the second cooling fin; A first heat-conducting layer is provided on the adjacent surfaces of the first cooling fin and the second cooling fin and the processor module, a second heat-conducting layer is provided on the adjacent surfaces of the first cooling fin and the first liquid cooling plate, and a third heat-conducting layer is provided between the second cooling fin and the second liquid cooling plate.

2. A multi-dimensional constant temperature control system for a high-power digital light image processor as claimed in claim 1, characterized in that: The shape of the first cooling fin includes but is not limited to elliptical, rectangular, polygonal and circular. A transition material is provided between the first cooling fin and the processor module, and the transition material is used for conducting heat.

3. A multi-dimensional constant temperature control system for a high-power digital light image processor as claimed in claim 2, characterized in that: The transfer material includes but is not limited to pure aluminum, copper, a thermal conductive pad and a graphene sheet.

4. A multi-dimensional constant temperature control system for a high-power digital light image processor as claimed in claim 1, characterized in that: The second cooling fin is a ring-shaped structure, the wall thickness of the second cooling fin is related to the wall thickness of the processor module, there is an installation gap between the second cooling fin and the processor module, and the installation gap is filled with a thermal conductive gasket.

5. A multi-dimensional constant temperature control system for a high-power digital light image processor as claimed in claim 1, characterized in that: The first liquid cooling plate is provided with a first liquid inlet and a first liquid outlet, the first liquid inlet and the first liquid outlet are arranged on the same side of the first liquid cooling plate, and the first liquid inlet and the first liquid outlet are arranged in parallel.

6. A multi-dimensional constant temperature control system for a high-power digital light image processor as claimed in claim 5, characterized in that: The middle part of the first liquid cooling plate is used for the illumination light source to enter the light entrance of the processor module, and the opening size of the middle part of the first liquid cooling plate is greater than 1.5 times the incident light spot.

7. A multi-dimensional constant temperature control system for a high-power digital light image processor as claimed in claim 5, characterized in that: The second liquid cooling plate is provided with a second liquid inlet and a second liquid outlet, which are relatively arranged at two ends of the second liquid cooling plate, the second liquid inlet is connected to the water outlet end of the circulating water system, the second liquid outlet is connected to the first liquid inlet, and the first liquid outlet is connected to the return water end of the circulating water system.

8. A multi-dimensional constant temperature control system for a high-power digital light image processor as claimed in claim 1, characterized in that: The processor module includes: an array micromirror, a fixing structure and a window piece; The fixing structure is used to fix the array micromirror, the window piece is arranged on the outside of the array micromirror, and each micromirror in the array micromirror can independently modulate spatial light.

9. A multi-dimensional constant temperature control system for a high-power digital light image processor as claimed in claim 1, characterized in that: The circulating water system comprises: a water tank, a water pump and a heat exchanger; The water tank stores cooling water, the inlet end of the water pump is connected to the water tank, and the outlet end is connected to the first liquid cooling plate, the inlet end of the heat exchanger is connected to the second liquid cooling plate, and the outlet end is connected to the water tank.

10. A multi-dimensional constant temperature control system for a high-power digital light image processor as claimed in claim 9, characterized in that: The circulating water system further comprises: a first quick-release joint and a second quick-release joint; The first quick-release joint is located between the outlet end of the water pump and the first liquid cooling plate, the second quick-release joint is located between the inlet end of the heat exchanger and the second liquid cooling plate, and the first quick-release joint is connected to the second quick-release joint.

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