Display device

Abstract

Disclosed is a display device including: a base layer including an active area divided to display an image and a non-active area adjacent to the active area; a planarization layer over the base layer; a bank layer over the planarization layer; an organic light emitting layer over the bank layer; an opening in a portion of the active region and penetrating the base layer and the one or more functional layers on the base layer; a light emitting unit in another portion of the active region; a cut-off structure located in the vicinity of the opening and provided to cut off a connection of the organic light-emitting layer between the light-emitting unit of the active region and the opening; and a blocking structure between the severing structure and the opening. The cut-off structure is on the same layer as the planarization layer, and the barrier structure is on the same layer as the combined planarization layer and bank layer.

Description

[0001] This application is a divisional application of the patent application with application number 202011078511.7 filed on October 10, 2020 and titled “Display Device”.

[0002] CROSS-REFERENCE TO RELATED APPLICATIONS

[0003] This application claims the priority of Korean Patent Application No. 10-2019-0138620 filed on November 1, 2019, in the Korean Intellectual Property Office, and Korean Patent Application No. 10-2019-0138627 filed on November 1, 2019, in the Korean Intellectual Property Office, the disclosures of which are incorporated herein by reference. Technical Field

[0004] The present disclosure relates to a display device in which an image pickup device is disposed in an active area. Background Art

[0005] Display devices use various display elements such as liquid crystal display devices or electroluminescent display devices to present various images. Among them, people try to find the best ratio between the expansion of the display area and the portability of the display device used in smart phones, and the recent display device makes full use of the flat area by setting the camera device in the active area.

[0006] In order to place the camera in the active region, it is necessary to form an opening hole in which the camera is housed. The camera hole is generally formed by a process of irradiating a laser beam to remove a portion of the active region.

[0007] However, in the process of irradiating a laser beam to remove a predetermined area in a display device, damage such as cracks may be caused, and the damage is transferred to an active area to reduce image quality or degrade a display element. Summary of the invention

[0008] An object of the present disclosure is to provide a structure for placing an image capture device such as a camera device within an active area. In addition, another object of the present disclosure is to provide a method for improving the vulnerability that may be caused in the placement structure.

[0009] The objects of the present disclosure are not limited to the above objects, and other objects not mentioned above can be clearly understood by those skilled in the art from the following description.

[0010] According to one aspect of the present disclosure, a display device is provided. The display device may include: a base layer, the base layer including an active area divided into an active area for displaying an image and an inactive area adjacent to the active area; an opening, the opening is located in a portion of the active area and penetrates the base layer and the functional layer thereon; and a cut-off structure, the cut-off structure is located near the opening and is configured to cut off the connection between the opening and the organic light-emitting layer between the light-emitting unit. A camera device may be provided in a position corresponding to the opening.

[0011] The cut-off structure may have a shape that suppresses the inorganic layer covering the cut-off structure from being laminated while forming a valley-like shape. In this case, the inorganic layer covering the cut-off structure may be an inorganic layer included in the encapsulation layer covering the active area. The side inclination of the cut-off structure may be 65 degrees or less. The cut-off structure has at least two side inclination angles, and the inclination angle of the lower portion of the cut-off structure may be less than the inclination angle of the upper portion of the cut-off structure.

[0012] The cut-off structure may be located between the opening of the active region and the light emitting unit to surround the opening. The inorganic insulating layer below the cut-off structure may be etched inwardly from an outer periphery of the cut-off structure.

[0013] The cut-off structure includes at least two protrusion structures, and each of the protrusion structures is formed of the same material as a planarization layer covering a source electrode or a drain electrode of a thin film transistor TFT included in a pixel circuit in an active area.

[0014] The display device further includes an encapsulation layer, the encapsulation layer including a first inorganic layer, an organic layer, and a second inorganic layer sequentially laminated and covering the active area; and a blocking structure, the blocking structure being configured to block the flow of the organic layer. The cut-off structure may be located on one side or both sides of the blocking structure. Two blocking structures may be provided, and the cut-off structure may be located between the two blocking structures.

[0015] According to another aspect of the present disclosure, a display device includes a first region through which a base layer and a functional layer thereon are penetrated, a second region surrounding the first region, and a third region surrounding the second region and provided with pixels. A cut-off structure configured to cut off connection of an organic light-emitting layer and a crack prevention structure adjacent to the cut-off structure are located in the second region.

[0016] According to another aspect of the present disclosure, a display device may include a base layer, the base layer including an active area divided into an active area for displaying an image and an inactive area adjacent to the active area; an opening, the opening being located in a portion of the active area and penetrating the base layer and a functional layer thereon; a cut-off structure adjacent to the opening; and a buffer layer adjacent to a side of the cut-off structure.

[0017] Additional details of example embodiments are included in the detailed description and the accompanying drawings.

[0018] According to an exemplary embodiment of the present disclosure, a display device that improves the fragility of a camera placement structure in an active area can be provided. Specifically, according to an exemplary embodiment of the present disclosure, damage and moisture penetration near a camera accommodation area can be effectively suppressed. Therefore, an exemplary embodiment of the present disclosure can provide a display device with improved reliability.

[0019] The effects according to the present disclosure are not limited to the contents exemplified above, and more various effects are included in the present specification. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] The above and other aspects, features and other advantages of the present disclosure will be more clearly understood from the following detailed description taken in conjunction with the accompanying drawings, in which:

[0021] Figure 1 An exemplary display device that may be included in an electronic device is shown;

[0022] Figure 2 is a cross-sectional view schematically illustrating a first region, a second region, and a third region of a display device according to an exemplary embodiment of the present disclosure;

[0023] Figure 3A and Figure 3B is an exemplary diagram showing a cut-off structure of a display device according to an exemplary embodiment of the present disclosure;

[0024] FIG. 4A to FIG. 4C is a diagram illustrating a cut-off structure and a crack prevention structure of a display device according to another exemplary embodiment of the present disclosure; and

[0025] FIG. 5A to FIG. 5C is a diagram illustrating a cutoff structure and a crack prevention structure of a display device according to another exemplary embodiment of the present disclosure. DETAILED DESCRIPTION

[0026] By referring to the exemplary embodiments described in detail below in conjunction with the accompanying drawings, the advantages and features of the present disclosure and the methods for achieving these advantages and features will become clear. However, the present disclosure is not limited to the exemplary embodiments disclosed herein, but will be implemented in various forms. The exemplary embodiments are provided only as examples so that those skilled in the art can fully understand the disclosure of the present disclosure and the scope of the present disclosure. Therefore, the present disclosure will be limited only by the scope of the appended claims.

[0027] The shapes, sizes, ratios, angles, numbers, etc. shown in the drawings for describing the exemplary embodiments of the present disclosure are only examples, and the present disclosure is not limited thereto. Throughout the specification, the same reference numerals generally represent the same elements. In addition, in the following description of the present disclosure, the detailed description of known related technologies may be omitted to avoid unnecessarily obscuring the subject matter of the present disclosure. Terms such as "including", "having" and "consisting of..." used in this article are generally intended to allow the addition of other components, unless these terms are used together with the term "only". Any reference to the singular may include the plural, unless otherwise expressly provided. Even if not expressly stated, the components are interpreted as including ordinary error ranges.

[0028] When terms such as "on", "over", "under", and "adjacent" are used to describe the positional relationship between two components, one or more components may be located between the two components unless these terms are used together with the terms "immediately" or "directly". When an element or layer is disposed "on" another element or layer, the other layer or other element may be placed directly on the other element or directly between them.

[0029] Although the terms "first", "second", etc. are used to describe various components, these components are not limited by these terms. These terms are only used to distinguish one component from other components. Therefore, in the technical concept of the present disclosure, the first component to be mentioned below can be the second component.

[0030] Throughout the specification, like reference numerals generally refer to like elements.

[0031] For convenience of description, the size and thickness of each component shown in the drawings are shown, but the present disclosure is not limited to the size and thickness of the components shown.

[0032] The features of the various embodiments of the present disclosure may be partially or completely attached or combined with each other, and may be interlocked and operated in technically different ways, and these embodiments may be implemented independently of each other or in association with each other.

[0033] Hereinafter, a display device according to an exemplary embodiment of the present disclosure will be described in detail with reference to the accompanying drawings.

[0034] Figure 1 An exemplary display device that may be included in an electronic device is shown.

[0035] Reference Figure 1, the display device 100 includes at least one active area A / A divided into display images, and an array of pixels is formed in the active area A / A. One or more inactive areas I / A may be disposed near the active area A / A. That is, the inactive area I / A may be adjacent to one or more sides of the active area A / A. Figure 1 In the embodiment, the inactive area I / A surrounds the rectangular active area A / A. However, the shape of the active area A / A and the shape / placement of the inactive area I / A are not limited to Figure 1 The active area A / A and the inactive area I / A may have a shape suitable for the design of an electronic device mounted with the display device 100. Exemplary shapes of the active area A / A are pentagonal, hexagonal, circular, or elliptical.

[0036] Each pixel in the active area A / A may be associated with a pixel circuit. The pixel circuit may include one or more switch transistors and one or more drive transistors on the bottom plate. Each pixel circuit may be electrically connected to a gate line and a data line to communicate with one or more drive circuits such as a gate driver and a data driver located in the inactive area I / A.

[0037] The driving circuit can be implemented by a thin film transistor (TFT) in the non-active area I / A. The driving circuit can be referred to as a gate in panel (GIP). In addition, some components such as a data driver IC are mounted on a divided printed circuit board, and a circuit film such as a flexible printed circuit board (FPCB), a chip on film (COF) or a tape carrier package (TCP) can be used to couple to a connection interface (pad, bump or pin) provided in the non-active area I / A. The non-active area I / A is bent together with the connection interface so that the printed circuit (COF, PCB, etc.) can be located on the rear side of the display device 100.

[0038] The display device 100 may also include various additional elements to generate various signals or drive pixels in the active area A / A. The additional elements driving the pixels may include an inverter circuit, a multiplexer, or an electrostatic discharge circuit. The display device 100 may also include additional elements associated with functions other than the pixel driving function. For example, the display device 100 may include additional elements that provide a touch sensing function, a user authentication function (e.g., fingerprint recognition), a multi-level pressure sensing function, or a tactile feedback function. The above-mentioned additional elements may be located in a non-active area and / or in an external circuit connected to a connection interface.

[0039] The display device 100 may include an area for accommodating a camera in the active area A / A. The size of the display device (particularly the flat area) is generally limited due to manufacturing efficiency and / or aesthetic reasons. If the area for accommodating the camera is set in the non-active area I / A, the size of the non-active area I / A increases, and the size of the active area A / A is reduced accordingly. On the contrary, if the area for accommodating the camera is set in the active area A / A, the size of the non-active area I / A can be reduced accordingly, so that the size of the active area A / A is maximized.

[0040] Therefore, in the display device 100 according to the exemplary embodiment of the present disclosure, the area in which the image capturing element such as the camera is provided is provided in the active area A / A, so that the area of ​​the active area A / A can be expanded while reducing the area of ​​the inactive area I / A. In the following, for the convenience of description, the inside of the active area A / A is divided into a first area A1, a second area A2, and a third area A3. Although no image is displayed in the first area A1 and the second area A2, the first area A1 and the second area A2 are also surrounded by the third area A3 in which the image display element is displayed, so that the first area A1 and the second area A2 are classified as the active area A / A in the present disclosure. At the same time, the first area A1 and the second area A2 can be provided in any position on the flat surface, so that the position is not limited to Figure 1 Position shown.

[0041] The first area A1 is a portion in which an opening is provided so that an image capturing device such as a camera is provided. The first area A1 is provided in the active area A / A. The first area A1 is an area in which a camera is located so that an image is not displayed. The first area A1 may have a circular shape or an elliptical shape.

[0042] The third area A3 is a portion in which pixels are arranged. A pixel is a unit structure that presents color (or light). A pixel may include a red sub-pixel, a green sub-pixel, a blue sub-pixel, and a white sub-pixel. A pixel includes a light-emitting element (light-emitting diode) or a device control circuit.

[0043] The second area A2 is located between the first area A1 and the third area A3. Since the second area A2 surrounds the periphery of the first area A1, the second area A2 may have a shape corresponding to the shape of the first area A1, but the shape of the second area A2 is not limited thereto. For example, when the first area A1 has a circular shape, the second area A2 may have a circular shape or an elliptical shape.

[0044] The second region A2 separates the first region A1 from the third region A3 so that the first region A1 and the third region A3 are not affected by each other. For example, the second region A2 inhibits the organic light emitting layer and / or the encapsulation layer formed in the third region A3 from penetrating into the first region A1. In addition, the second region A2 inhibits the damage that may be caused when the first region A1 is formed from being transferred to the third region A3. The second region A2 may include a structure for the above-mentioned inhibition function.

[0045] Figure 2 is a cross-sectional view schematically illustrating a first region, a second region, and a third region of a display device according to an exemplary embodiment of the present disclosure.

[0046] The first area A1, the second area A2 and the third area A3 shown in the drawings may be applied to the reference Figure 1 At least a portion of the active area A / A described. Hereinafter, an electroluminescent display device will be used as an example to describe this area. The electroluminescent display device includes an organic light-emitting display device and an inorganic light-emitting display device.

[0047] The base layer 101 corresponding to the first area A1 and the functional layer thereon are removed. Therefore, the through hole and the image capture device (not shown) are located in the first area A1 in the vertical direction. In this case, the removal process can be a stamping process using a laser. The image capture device can be located below the base layer 101 in the first area A1.

[0048] In the third area A3 , thin film transistors (semiconductor layer 102 , gate electrode 104 , and source and drain electrodes 108 ), organic light emitting elements (first electrode 112 , organic light emitting layer 114 , and second electrode 116 ), and various functional layers are located on the base layer 101 .

[0049] The base layer 101 supports various components of the organic light-emitting display device 100. The base layer 101 may be formed of a transparent insulating material, for example, an insulating material such as glass or plastic. A substrate (array substrate) is also referred to as a concept including elements and functional layers formed on the base layer 101, such as a switching TFT, a driving TFT, an organic light-emitting element, and a passivation layer.

[0050] The buffer layer 103 may be located on the base layer 101. The buffer layer is a functional layer for protecting a thin film transistor (TFT) from impurities such as alkali ions leaking from the base layer 101 or a layer below it. The buffer layer may be formed of silicon oxide (SiOx), silicon nitride (SiNx) or a multilayer thereof. The buffer layer 103 may include a multi-buffer and / or an active buffer.

[0051] The thin film transistor is disposed on the base layer 101 or the buffer layer 103. Figure 2As shown, in the thin film transistor, the semiconductor layer (active layer) 102, the gate insulator 105, the gate electrode 104, the interlayer dielectric layer 107, and the source and drain electrodes 108 can be sequentially laminated. On the contrary, in the thin film transistor, the gate electrode, the gate insulator, the semiconductor layer, and the source and drain electrodes can be sequentially arranged.

[0052] The semiconductor layer 102 may be made of polycrystalline silicon (p-Si). In this case, a predetermined region may be doped with impurities. In addition, the semiconductor layer 102 may be made of amorphous silicon (a-Si) or various organic semiconductor materials such as pentacene. In addition, the semiconductor layer 102 may be made of oxide.

[0053] The gate electrode 104 may be made of various conductive materials such as magnesium (Mg), aluminum (Al), nickel (Ni), chromium (Cr), molybdenum (Mo), tungsten (W), gold (Au), or alloys thereof.

[0054] The gate insulator 105 and the interlayer dielectric layer 107 may be formed of an insulating material such as silicon oxide (SiOx) or silicon nitride (SiNx) or an insulating organic material. The gate insulator 105 and the interlayer dielectric layer 107 are selectively removed to form contact holes through which the source and drain regions are exposed.

[0055] The source and drain electrodes 108 may be formed as a single layer or multiple layers on the gate insulator 105 or the interlayer dielectric layer 107. If necessary, a passivation layer composed of an inorganic insulating material may cover the source and drain electrodes 108.

[0056] The planarization layer 109 may be located on the thin film transistor. The planarization layer 109 protects the thin film transistor and planarizes the upper portion thereof. The planarization layer 109 may be configured to have various shapes. The planarization layer 109 may be modified in various ways, for example, the planarization layer 109 may be formed of an organic insulating film such as benzocyclobutene (BCB) or acrylic or an inorganic insulating film such as a silicon nitride film (SiNx) or a silicon oxide film (SiOx), or may be formed of a single layer or a double layer or a multilayer.

[0057] The organic light emitting element may be formed such that the first electrode 112, the organic light emitting layer 114, and the second electrode 116 are sequentially disposed. That is, the organic light emitting element may be composed of the first electrode 112 formed on the planarization layer 109, the organic light emitting layer 114 located on the first electrode 112, and the second electrode 116 located on the organic light emitting layer 114.

[0058] The first electrode 112 is electrically connected to the drain electrode 108 of the driving thin film transistor through a contact hole. When the organic light-emitting display device 100 is a top emission type, the first electrode 112 may be formed of an opaque conductive material having a high reflectivity. For example, the first electrode 112 may be formed of silver (Ag), aluminum (Al), gold (Au), molybdenum (Mo), tungsten (W), chromium (Cr), or an alloy thereof. The first electrode 112 may be an anode of an organic light-emitting diode.

[0059] The bank 110 is formed in the remaining area except the emission area. Therefore, the bank 110 has a bank hole that exposes the first electrode 112 corresponding to the emission area. The bank 110 can be made of an inorganic insulating material such as a silicon nitride film (SiNx) or a silicon oxide film (SiOx) or an organic insulating material such as BCB, acrylic resin or imide resin.

[0060] The organic light-emitting layer 114 is located on the first electrode 112. The organic light-emitting layer 114 may include a light-emitting layer, an electron injection layer, an electron transport layer, a hole transport layer, and a hole injection layer. According to needs or processes, these layers may be formed on the entire light-emitting unit (third region) or only in a partial region of the light-emitting unit (third region). The organic light-emitting layer may be configured with a single light-emitting layer structure that emits one type of light, or may be configured with a structure composed of multiple light-emitting layers to emit white light. Figure 3A and Figure 3B In the cut-off structure shown, the organic light emitting layer 114 may not be formed in the first area A1.

[0061] The second electrode 116 is located on the organic light emitting layer 114. When the organic light emitting display device 100 is a top emission type, the second electrode 116 is formed of a transparent conductive material such as indium tin oxide (ITO) or indium zinc oxide (IZO) to emit light generated in the organic light emitting layer 114 to an upper portion of the second electrode 116. The second electrode 116 may be a cathode of an organic light emitting diode.

[0062] The encapsulation layer 120 is located on the second electrode 116. The encapsulation layer 120 inhibits the penetration of oxygen and moisture from the outside, thereby inhibiting the oxidation of the light-emitting material and the electrode material. When the organic light-emitting element is exposed to moisture or oxygen, a pixel shrinkage phenomenon in which the emission area is reduced or a dark spot is generated in the emission area is caused. The encapsulation layer may be composed of an inorganic film formed of glass, metal, aluminum oxide (AlOx) or silicon (Si) based materials, or have a structure in which an organic layer 122 is alternately laminated with inorganic layers 121 and 123. In this case, the inorganic layers 121 and 123 are used to prevent the penetration of moisture or oxygen, and the organic layer 122 is used to flatten the surfaces of the inorganic layers 121 and 123. When the encapsulation layer is formed by a plurality of thin film layers, the movement path of moisture or oxygen is longer and more complicated than in the case of a single layer, making it difficult for moisture / oxygen to penetrate therein.

[0063] The barrier film may be located on the encapsulation layer 120 to encapsulate the entire base layer 101. The barrier film may be a phase difference film or an optically isotropic film. In this case, an adhesive layer may be located between the barrier film and the encapsulation layer 120. The adhesive layer combines the encapsulation layer 120 and the barrier film. The adhesive layer may be a thermosetting adhesive or a natural curing adhesive. For example, the adhesive layer may be composed of a material such as a barrier pressure sensitive adhesive (B-PSA).

[0064] The second area A2 does not include a light emitting element, but includes a bypass line (not shown), a blocking structure 190, and a cut-off structure 195 to block mutual influence between the first area A1 and the third area A3.

[0065] The bypass line is configured to extend various wirings passing through the first area A1 in a horizontal direction or a vertical direction to bypass the first area A1. The bypass line may be configured on the same layer as the original line or on a different layer from the original line.

[0066] The blocking structure 190 is provided to prevent the organic layer 122 of the encapsulation layer 120 from overflowing into the first area A1. Figure 2 , it is shown that the flow of the organic layer 122 is blocked by the blocking structure disposed at the inner side than the other blocking structure among the two blocking structures, but the organic layer 122 may pass over the inner blocking structure and may be blocked by the outer blocking structure.

[0067] The cut-off structure 195 is provided to cut off the connection of the organic light emitting layer 114. When the organic light emitting layer 114 is exposed to the outside, it may serve as a permeation path for moisture. In the first area A1, the organic light emitting layer 114 may be exposed to the outside, so that the cut-off structure 195 is necessary. Figure 3A The principle and structure of the cutting structure 195 are described.

[0068] Some of the functional layers of the third area A3 also remain in the second area A2. In addition, some of the functional layers may be used when forming the barrier structure 190 and the cut-off structure 195. For example, for the barrier structure 190, a material for the planarization layer 109 and / or the bank 110 may be used, and for the cut-off structure 195, a material for the planarization layer 109 may be used.

[0069] Meanwhile, in the non-active region I / A, various driving circuits (e.g., GIP), electrodes, wiring, and functional structures may be located on the base layer 101. Although pixel circuits and light-emitting elements are not provided in the non-active region I / A, the base layer 101 and the organic / inorganic functional layers 103, 105, 107, and 109 may also be provided. In addition, in the non-active region I / A, materials for constituting the active region A / A may be provided for different purposes. For example, the same metal as the gate electrode of the TFT in the active region or the same metal as the source / drain electrode may be provided in the non-active region I / A for wiring or electrodes. In addition, the same metal as one electrode (e.g., an anode) of an organic light-emitting diode may be provided in the non-active region I / A for wiring and electrodes.

[0070] Figure 3A and Figure 3B is an exemplary diagram illustrating a cut-off structure of a display device according to an exemplary embodiment of the present disclosure.

[0071] Figure 3A and Figure 3B It is an enlarged view of the second area A2, and elements other than the cut-off structure are omitted.

[0072] The cutting structure 195 may include at least two protruding structures, and Figure 3A and 3B , only some of the protruding structures are shown. The cut-off structure 195 is formed of the same material as the planarization layer 109 covering the source electrode or the drain electrode of the thin film transistor TFT. That is, the cut-off structure 195 can be made of the planarization layer 109 on the interlayer dielectric layer 107 to have a columnar shape. The dielectric layer 107 below the periphery of the column can be removed. Although in the drawings, it is shown that only one dielectric layer 107 is removed, if necessary, the dielectric layers 105 and 103 below the dielectric layer 107 can also be removed. The removal process can be performed by a dry etching process or a wet etching process.

[0073] When the dielectric layer below the peripheral portion of the cut-off structure is removed further inward (undercut), the layer deposited on the upper portion of the cut-off structure (e.g., reference numeral 114) does not completely cover the lower portion of the peripheral portion of the cut-off structure. Therefore, disconnection occurs as shown in the accompanying drawings. Using the above phenomenon, the lower layer of the cut-off structure is partially removed to isolate a specific layer. As described above, the organic light-emitting layer 114 serves as a moisture transfer path to cause defects in the display device, making a preventive structure such as the cut-off structure 195 of the present disclosure very useful.

[0074] At the same time, the inventors have found that the cut-off structure of the organic light-emitting layer has some fragility. One of them is that when some inorganic layers are further laminated on the cut-off structure, a recessed boundary S, also known as a seam, may be generated. The steeper the side slope of the cut-off structure, the more effectively the layers deposited thereon are disconnected, but on the contrary, the boundary portion S appears in the form of a deeper valley. Therefore, the boundary portion S is more susceptible to impact than other portions, so that the boundary portion may be easily broken. In addition, when damage occurs, moisture may penetrate through the boundary portion S. Therefore, a complementary shape / structure is required to suppress the occurrence of such fragility in the cut-off structure, and the inventors who recognized this problem have designed such a crack prevention structure.

[0075] FIG. 4A to FIG. 4C is a diagram illustrating a cutoff structure and a crack prevention structure of a display device according to another exemplary embodiment of the present disclosure.

[0076] Figure 4A Most of the components of the exemplary embodiment shown are similar to Figure 2 Therefore, the components of the exemplary embodiment of Figure 4A of Figure 2 The components are the same as the components described in the Figure 4A In the exemplary embodiment shown, the position or shape of the cutting structure 495 is Figure 2 The position or shape of the cutoff structure 195 in the exemplary embodiment of FIG. 1 is different. Hereinafter, the difference will be mainly described.

[0077] The display device 400 may include: a first area A1, from which the base layer 401 and the functional layer thereon are penetrated; a second area A2, which surrounds the first area A1; and a third area A3, which surrounds the second area A2 and has pixels arranged thereon. In the first area A1, that is, in a position corresponding to the opening, a camera device may be arranged. A cutting structure 495 arranged to cut off the connection of the organic light-emitting layer 414 may be located in the second area A2. In this case, the cutting structure 495 is formed as a seam that suppresses the depression generated on the inorganic layer deposited thereon.

[0078] The cut-off structure 495 is located between the opening of the active region (first region A1) and the light emitting unit (third region A3). The cut-off structure 495 may be formed of the same material as the planarization layer 409 covering the source electrode or drain electrode 408 of the thin film transistor TFT.

[0079] The cut-off structure 495 is disposed between the opening and the light-emitting unit to cut off the connection of the organic light-emitting layer 414. The principle of cutting off the continuity of the organic light-emitting layer 414 by the cut-off structure 495 is as described with reference to Figure 3A To this end, Figure 4B or Figure 4C As shown, the inorganic insulating layer 407 below the cut-off structure 495 may be etched further inward from the outermost periphery of the cut-off structure 495 .

[0080] The cut-off structure 495 may include at least two protruding structures. Figure 4B and Figure 4C 4 is an enlarged view of one of the protruding structures. In each of the protruding structures, the inorganic insulating layer 407 below the protruding structure is dug further inward from the outermost periphery of the protruding structure.

[0081] The display device 400 includes: a base layer 401, the base layer 401 includes an active area divided into an active area for displaying an image and an inactive area near the active area; an opening, the opening is set in a part of the active area and penetrates the base layer 401 and the functional layer thereon; and a cutting structure 495, the cutting structure 495 is located near the opening and is set between the opening and the light-emitting unit to cut off the connection of the organic light-emitting layer.

[0082] The cut-off structure has a shape that suppresses the inorganic layer covering the cut-off structure from being laminated while forming a valley-like shape. The inventors have learned that the side inclination angle θ of the cut-off structure (each of the protruding structures) affects this phenomenon, such as Figure 3B According to the research results, in Figure 4B In the cut structure shown, the steeper the side slope, the more seams are generated in the inorganic layer deposited thereon. On the contrary, as the slope is gentle, this phenomenon does not occur. That is, the side inclination angle θ is proportional to the occurrence rate of seams.

[0083] Therefore, it is advantageous that the side inclination angle of the cut-off structure is equal to or less than a predetermined value. Through research and experiments, the inventors have found that when the side inclination angle is 65 degrees (°) or less, the cut-off structure does not produce a valley-like shape and the resulting cracks. In addition, the inventors also found that when the side inclination angle is 70 degrees (°) or greater, the cut-off structure forms a large number of valley-like shapes and cracks caused thereby. Therefore, the cut-off structure according to an exemplary embodiment of the present disclosure is formed so that the side inclination angle is 65 degrees or less. Tables 1 and 2 below are the results of high temperature / high humidity reliability experiments based on the inclination angle of the cut-off structure. The experiment was carried out twice, and the number of samples with poor moisture penetration was counted in each experiment.

[0084] [Table 1]

[0085]

[0086]

[0087] [Table 2]

[0088]

[0089] At the same time, if Figure 4C As shown, the cut-off structure may have at least two side inclination angles θ1 and θ2. In this case, it is advantageous that the inclination angle θ2 of the lower portion of the cut-off structure is smaller than the inclination angle θ1 of the upper portion of the cut-off structure. When θ2 is smaller than θ1, the side of the cut-off structure may be formed to be more gentle.

[0090] The cut-off structure according to the exemplary embodiment of the present disclosure has the following features: Figure 4B or Figure 4C The shape shown is such that the layer (eg, 423) deposited over the cut-off structure 495 does not result in a valley-like shape, so that the formation of Figure 3B Boundary gap shown.

[0091] The display device 400 according to the exemplary embodiment may further include an encapsulation layer 420 covering the active area. The encapsulation layer 420 may include a first inorganic layer 421, an organic layer 422, and a second inorganic layer 423 which are sequentially laminated.

[0092] The display device 400 according to the exemplary embodiment may further include a blocking structure 490 in the second area A2 to control the flow of the organic layer 422. In this case, the blocking structure 490 may be located between the cut-off structure 495 of the active area and the light emitting unit. Alternatively, the blocking structure 490 may be located between the cut-off structure 495 and the opening. That is, the cut-off structure 495 may be located inside or outside the blocking structure 490, and in some exemplary embodiments, the cut-off structure 495 may be provided on both sides of the blocking structure 490, or as Figure 4A As shown, the cut-off structure 495 may be disposed between two barrier structures 490. In this case, the two barrier structures 490 may have different heights, and the barrier structure 490 closer to the opening may have a higher height. In order to manufacture barrier structures having different heights, a lower barrier structure may be formed only by the planarization layer 409, and a higher barrier structure may be formed by the planarization layer 409 and the bank layer 410.

[0093] FIG. 5A to FIG. 5C is a diagram illustrating a cutoff structure and a crack prevention structure of a display device according to still another exemplary embodiment of the present disclosure.

[0094] Figure 5A Most of the components of the exemplary embodiment shown are similar to Figure 2 Therefore, the components of the exemplary embodiment of Figure 5A of Figure 2 However, the organic layer 522 of the encapsulation layer 520 and the second inorganic layer 523 thereon are the same as those of the encapsulation layer 520. Figure 2 The organic layer 122 and the second inorganic layer 123 in the exemplary embodiment of are different. Therefore, Figure 5A The outer periphery of the cutting structure 595 is Figure 2 Hereinafter, the differences will be mainly described.

[0095] The display device may include: a base layer 501, the base layer 501 including an active area divided into an active area for displaying an image and an inactive area near the active area; an opening, the opening being arranged in a portion of the active area and penetrating the base layer 501 and a functional layer thereon; and a cutting structure 595 arranged near the opening; and a buffer layer 522' adjacent to a side of the cutting structure 595.

[0096] The cut-off structure 595 is located between the opening of the active region (first region A1) and the light emitting unit (third region A3). The cut-off structure 595 may be formed of the same material as the planarization layer 509 that covers the source electrode or drain electrode 508 of the thin film transistor TFT included in the pixel circuit of the active region.

[0097] The cut-off structure 595 is provided to cut off the connection between the opening and the organic light-emitting layer 514 between the light-emitting units. The principle of cutting off the continuity of the organic light-emitting layer 514 by the cut-off structure 595 is as described in reference to Figure 3A To this end, Figure 5C As shown, the inorganic insulating layer 507 below the cut-off structure 595 may be etched further inward from the outermost periphery of the cut-off structure 595 .

[0098] The cut-off structure 595 may include at least two protruding structures. Figure 5C 5 is an enlarged view showing one of the protruding structures. In each of the protruding structures, the inorganic insulating layer 507 below it digs inward from the outermost periphery of the protruding structure. The buffer layer 522' is provided between the protruding structures. The buffer layer 522' fills the valley on the side of the cut-off structure 595 and makes the slope of the side more gentle. Therefore, the layer (e.g., 523) deposited on the cut-off structure 595 and the buffer layer 522' will not be rolled into the valley below it, thereby suppressing the Figure 3B The creation of boundary gaps is shown.

[0099] The display device according to the exemplary embodiment may further include an encapsulation layer 520 covering the active area. The encapsulation layer 520 may include a first inorganic layer 521, an organic layer 522, and a second inorganic layer 523 sequentially laminated. In this case, the buffer layer 522' may be formed of the same material as a portion of the encapsulation layer, such as the organic layer 522. With this configuration, the buffer layer 522' may be disposed between the first inorganic layer 521 and the second inorganic layer 523. The buffer layer 522' may be coated together with the organic layer 522 or may be filled between the protruding structures by a separate process (e.g., a spot welding process).

[0100] The display device according to the exemplary embodiment may further include a blocking structure 590 in the second area A2 to control the flow of the organic layer 522. In this case, the blocking structure 590 may be located between the cut-off structure 595 of the active area and the light emitting unit. Alternatively, the blocking structure 590 may be located between the cut-off structure 595 and the opening. That is, the cut-off structure 595 may be located inside or outside the blocking structure 590, and in some exemplary embodiments, the cut-off structure 595 may be provided on both sides of the blocking structure 590, or, as shown in FIG. Figure 5B As shown, the cut-off structure 595 may be disposed between two barrier structures 590. In this case, the two barrier structures 590 may have different heights, and the barrier structure 590 closer to the opening may have a higher height. To manufacture barrier structures having different heights, a lower barrier structure may be formed only by the planarization layer 509, and a higher barrier structure may be formed by the planarization layer 509 and the bank layer 510.

[0101] The display device may include: a first area A1, through which a base layer and a functional layer thereon pass; a second area A2, which surrounds the first area A1; and a third area A3, which surrounds the second area A2 and has pixels disposed thereon. A camera device may be disposed in the first area A1. A cut-off structure 595 disposed to cut off the connection of the organic light-emitting layer 514 and a crack prevention structure 522' adjacent to the cut-off structure 595 may be located in the second area A2. The crack prevention structure 522' is disposed to suppress the boundary (seam) of the depression caused in the inorganic layer deposited above the cut-off structure 595 due to the shape of the cut-off structure 595.

[0102] The crack prevention structure 522' may be disposed on the dielectric layer. In this case, at least one of the dielectric layers 503, 505, and 507 below the cut-off structure 595 may be disposed inwardly from the periphery of the cut-off structure 595, such as Figure 3A As shown, this is used to cut off the organic light emitting layer.

[0103] The crack-preventing structure 522' includes a buffer layer adjacent to a side of the cut-off structure 595. The cut-off structure 595 includes at least two protruding structures, and the crack-preventing structure 522' is located between the protruding structures.

[0104] The display device may further include an encapsulation layer 520 covering the light-emitting pixels of the third area A3. The encapsulation layer 520 may include a first inorganic layer 521, an organic layer 522, and a second inorganic layer 523 that are sequentially laminated. In this case, the crack prevention structure 522' may be formed of the same material as a portion of the encapsulation layer, such as the organic layer 522. With this configuration, the crack prevention structure 522' is disposed between the first inorganic layer 521 and the second inorganic layer 523.

[0105] The above structure can provide a display device that can be free from damage (eg, cracks) caused by impact during or after the opening is formed. In addition, the structure can reduce element defects caused by moisture penetration.

[0106] The embodiments of the present disclosure disclose but are not limited to the following schemes:

[0107] Solution 1. A display device, comprising:

[0108] a base layer, the base layer comprising an active area divided into an active area for displaying an image and an inactive area adjacent to the active area;

[0109] an opening located in a portion of the active region and penetrating the base layer and a functional layer on the base layer; and

[0110] A cut-off structure is located near the opening and is configured to cut off the connection of the organic light-emitting layer between the opening in the active region and the light-emitting unit.

[0111] Solution 2. The display device according to Solution 1, wherein the cut structure has a shape that forms a valley shape while suppressing lamination of an inorganic layer covering the cut structure.

[0112] Solution 3. The display device according to Solution 2, wherein the side inclination angle of the cut-off structure is 65 degrees or less.

[0113] Solution 4. The display device according to Solution 2, wherein the cut-off structure has at least two side inclination angles, and the inclination angle of the lower portion of the cut-off structure is smaller than the inclination angle of the upper portion of the cut-off structure.

[0114] Solution 5. The display device according to Solution 2 further includes:

[0115] a packaging layer, wherein the packaging layer covers the active area,

[0116] The inorganic layer covering the cutting structure is an inorganic layer included in the encapsulation layer.

[0117] Solution 6. The display device according to Solution 1, wherein the cut-off structure is located between the opening of the active area and the light-emitting unit to surround the opening.

[0118] Solution 7. The display device according to Solution 1, wherein the inorganic insulating layer below the cut-off structure is etched inward from the outer periphery of the cut-off structure.

[0119] Option 8. A display device according to Option 1, wherein the cut-off structure includes at least two protruding structures, and each of the at least two protruding structures is formed of the same material as a planarization layer, and the planarization layer covers a source electrode or a drain electrode of a thin film transistor TFT included in a pixel circuit in the active area.

[0120] Solution 9. The display device according to Solution 1 further includes:

[0121] an encapsulation layer, the encapsulation layer comprising a first inorganic layer, an organic layer, and a second inorganic layer sequentially laminated and covering the active area; and

[0122] a blocking structure configured to block the flow of the organic layer, and

[0123] Wherein, the cutting structure is located on one side or both sides of the blocking structure.

[0124] Solution 10. The display device according to Solution 9, wherein two blocking structures are provided, and the cut-off structure is located between the two blocking structures.

[0125] Solution 11. The display device according to Solution 1, further comprising:

[0126] A buffer layer is adjacent to a side surface of the cut-off structure.

[0127] Solution 12. The display device according to Solution 11, wherein the cut-off structure includes at least two protruding structures, and the buffer layer is located between the at least two protruding structures.

[0128] Solution 13. The display device according to Solution 11 further includes:

[0129] an encapsulation layer, the encapsulation layer covering the active layer,

[0130] The buffer layer is made of the same material as a part of the encapsulation layer.

[0131] Embodiment 14. The display device according to Embodiment 13, wherein the encapsulation layer includes a first inorganic layer, an organic layer, and a second inorganic layer laminated sequentially, and the buffer layer is provided between the first inorganic layer and the second inorganic layer.

[0132] Embodiment 15. The display device according to Embodiment 11, wherein the buffer layer fills the valleys on the sides of the cut-off structure.

[0133] Solution 16. A display device comprising:

[0134] a first region through which a base layer and a functional layer on the base layer penetrate;

[0135] a second area, the second area surrounding the first area; and

[0136] a third region, the third region surrounding the second region and provided with pixels,

[0137] In the second region, a cutting structure configured to cut off the connection of the organic light emitting layer and a crack prevention structure adjacent to the cutting structure are provided.

[0138] Solution 17. A display device according to Solution 16, wherein the cut-off structure includes at least two protruding structures, and the crack prevention structure is located between the at least two protruding structures.

[0139] Solution 18. The display device according to Solution 16 further includes:

[0140] an encapsulation layer, the encapsulation layer covers the light-emitting pixels of the third region and includes a first inorganic layer, an organic layer, and a second inorganic layer laminated sequentially,

[0141] Wherein, the crack prevention structure is located between the first inorganic layer and the second inorganic layer.

[0142] Embodiment 19. The display device according to Embodiment 16, wherein at least one of the inorganic insulating layers below the cut-off structure is disposed inwardly from an outer periphery of the cut-off structure.

[0143] Solution 20. The display device according to Solution 19, wherein the crack prevention structure is provided to suppress a boundary of a recess caused on an inorganic layer deposited over the cut-off structure due to a shape of the cut-off structure.

[0144] Solution 21. The display device according to Solution 18, further comprising:

[0145] a blocking structure configured to block the flow of the organic layer,

[0146] Wherein, the cutting structure is located on one side or both sides of the blocking structure.

[0147] Option 22. A display device according to Option 21, wherein two blocking structures are provided, and the cutting structure is located between the two blocking structures.

[0148] Although the exemplary embodiments of the present disclosure have been described in detail with reference to the accompanying drawings, the present disclosure is not limited thereto and can be implemented in many different forms without departing from the technical concept of the present disclosure. Therefore, the exemplary embodiments of the present disclosure are provided for illustrative purposes only and are not intended to limit the technical concept of the present disclosure. The scope of the technical concept of the present disclosure is not limited thereto. Therefore, it should be understood that the above exemplary embodiments are illustrative in all aspects and do not limit the present disclosure. The scope of protection of the present disclosure should be interpreted based on the attached claims, and all technical concepts within their equivalent scope should be interpreted as falling within the scope of the present disclosure.

Claims

1. A display device, comprising: a base layer including an active area divided to display an image and an inactive area adjacent to the active area; a planarization layer over the base layer; a bank layer above the planarization layer; an organic light emitting layer above the bank layer; an opening located in a portion of the active region and penetrating the base layer and one or more functional layers on the base layer; a light emitting unit located in another portion of the active area; a cut-off structure, the cut-off structure being located near the opening and configured to cut off a connection of the organic light-emitting layer between the light-emitting unit in the active region and the opening; and a blocking structure located between the cutting structure and the opening, Wherein, the cut-off structure is located on the same layer as the planarization layer, and the barrier structure is located on the same layer as the combined planarization layer and bank layer.

2. The display device according to claim 1, wherein: The organic light emitting layer extends from the light emitting unit to the opening.

3. The display device according to claim 1, wherein: The barrier structure is a multi-layer structure formed of the same material as the planarization layer and the bank layer.

4. The display device according to claim 1, further comprising an encapsulation layer above the organic light emitting layer, and in, The encapsulation layer has a structure in which inorganic layers and organic layers are alternately laminated.

5. The display device according to claim 4, further comprising a buffer layer disposed between the protruding structures of the cut-off structure, in, The buffer layer is disposed between the first inorganic layer and the second inorganic layer, and The second inorganic layer is directly disposed on the first inorganic layer on the protruding structure of the cut-off structure.

6. The display device according to claim 5, wherein: At least one of the first inorganic layer and the second inorganic layer covers the cut-off structure, and Here, the cut structure has a shape that suppresses an inorganic layer covering the cut structure from being laminated while forming a valley shape.

7. The display device according to claim 6, wherein: The side inclination angle of the cutting structure is 65 degrees or less.

8. The display device according to claim 6, wherein: The cut-off structure has at least two side inclination angles, and the inclination angle of the lower portion of the cut-off structure is smaller than the inclination angle of the upper portion of the cut-off structure.

9. The display device according to claim 6, in, The encapsulation layer covers the active area, and The inorganic layer covering the cut-off structure is the first inorganic layer and is included in the encapsulation layer. 10 . The display device according to claim 1 , further comprising an inorganic insulating layer under the cut-off structure, the inorganic insulating layer being etched inwardly from an outer periphery of the cut-off structure.

11. The display device according to claim 1, further comprising: a pixel circuit in the active area, the pixel circuit comprising a thin film transistor, and The cut-off structure includes at least two protruding structures, and each of the at least two protruding structures is formed of the same material as the planarization layer, and the planarization layer covers the source electrode or the drain electrode of the thin film transistor in the pixel circuit included in the active area.

12. The display device according to claim 4, in, The encapsulation layer includes a first inorganic layer, an organic layer, and a second inorganic layer which are sequentially laminated and cover the active area, The blocking structure blocks the flow of the organic layer, and The cutting structure is located on one side or both sides of the blocking structure.

13. The display device according to claim 12, further comprising another blocking structure, the other blocking structure being configured to block the flow of the organic layer, wherein: The cut-off structure is located between the blocking structure and the another blocking structure.

14. The display device according to claim 5, in, The buffer layer is disposed adjacent to a side surface of the cut-off structure.

15. The display device according to claim 14, in, The buffer layer is made of the same material as a portion of the encapsulation layer.

16. The display device according to claim 15, wherein: The encapsulation layer includes the first inorganic layer, an organic layer, and the second inorganic layer which are sequentially laminated, and Wherein, the buffer layer is formed of the same material as the organic layer.

17. The display device according to claim 14, wherein: The buffer layer fills the valleys on the sides of the cut-off structure.

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