Substrate design assistance device, substrate design assistance system, and data structure related to circuit information

Abstract

A substrate design assistance device (1) for assisting in disposing a bypass capacitor connected to a power supply line and a ground line via at least one pair of a power supply-side through conductor and a ground-side through conductor on a wiring substrate, the substrate design assistance device (1) comprising: a storage unit (30) for storing a bypass capacitor connected to a power supply line and a ground line via at least one pair of a power supply-side through conductor and a ground-side through conductor; a storage unit that stores, for each of a plurality of predetermined pitches between a pair of power-supply-side through conductors and a ground-side through conductor, circuit information indicating a unit including the pair of power-supply-side through conductors and the ground-side through conductor, and a capacitor element connected between the power-supply-side through conductors and the ground-side through conductor; an input receiving unit (21) that acquires a pitch between at least one pair of the power source-side through conductor and the ground-side through conductor set by a user, said pitch corresponding to any one of the plurality of prescribed pitches; and a calculation unit (22) that acquires, from the storage unit (30), circuit information corresponding to the pitch acquired by the input reception unit (21), and calculates the impedance of the power line on the basis of the acquired circuit information, the circuit information stored in the storage unit (30) includes at least one of an equivalent circuit (50) indicating the cell and a parameter corresponding to at least a part of the equivalent circuit indicating the cell. An equivalent circuit (60) indicating the capacitor element includes capacitance components (C1, C2, C3) set according to the corresponding predetermined pitch.

Description

Technical Field

[0001] The invention relates to a substrate design assisting device, a substrate design assisting system and a data structure related to circuit information. Background Art

[0002] Patent Document 1 describes the reproduction of an equivalent circuit model when a passive component alone has a plurality of elements in the same component.

[0003] Patent Document 2 describes a multi-terminal capacitor element buried in a substrate.

[0004] Prior art literature

[0005] Patent Literature

[0006] Patent Document 1: Japanese Patent Application Publication No. 2015-170004

[0007] Patent Document 2: Japanese Patent Application Publication No. 2020-167361 Summary of the invention

[0008] Problem that the invention aims to solve

[0009] In the design of the power line of the wiring board, the layout of capacitors (such as bypass capacitors) and inductors, which are passive components, is studied simultaneously with the layout of the power line. At this time, regarding the transmission characteristics of the power line as a whole including the substrate, such as impedance characteristics, it is necessary to prepare the following structures as independent elements and evaluate their characteristics in combination.

[0010] ·Equivalent circuit model of the substrate consisting of wiring, through-conductors (through holes, vias), substrate materials, etc.

[0011] Accurate equivalent circuit model of passive components (capacitors, inductors, etc.) mounted on the board

[0012] Here, the measured model that is the basis of the equivalent circuit model of the "substrate" and "component" needs to be able to perform measurements accurately. The measured model can accurately express how the element behaves after the node is connected if it can be measured without being affected by the measurement.

[0013] However, in a component in which a plurality of through-conductors are connected as lead terminals to a capacitor element (two electrodes separated by a dielectric) built into a substrate, such as the capacitor element described in Patent Document 2, it is difficult to obtain a measured model thereof. In particular, the difficulty increases when the XY dimensions of the component itself are large.

[0014] When the measured model of this component is measured by setting up two ports like a general two-terminal capacitor, the capacitor components at a location relatively far from the position where the ports are set up are observed through the internal path or wiring part of the capacitor, so the measurement can only be performed in a state where the RL components that are originally irrelevant are added to the path.

[0015] In this regard, the above problem can be eliminated by measuring with a special jig such as a substrate or socket designed in such a way that the impedance is equal from each terminal. However, in order to perform this measurement method on the above-mentioned components, which are different from general capacitor components with standardized dimensions and whose dimensions or layout may vary for each customer, it is necessary to assemble the designed products into finished products at one time. However, in general, the bypass capacitors required for power lines are selected in a state where the required impedance characteristics are estimated to some extent in advance, but if the finished products cannot be manufactured at one time, the actual measurement model cannot be obtained, and it is difficult to respond to customer needs quickly.

[0016] The model described in Patent Document 1 is also limited to reproducing the behavior of a passive component alone, and the impedance of the entire board can only be reproduced by combining the model after the wiring design of the wiring board.

[0017] The present invention has been made to solve the above-mentioned problems, and an object of the present invention is to provide a substrate design support device, a substrate design support system, and a data structure related to circuit information suitable for designing a power supply line to which a bypass capacitor is connected via a plurality of through conductors.

[0018] Solutions for solving problems

[0019] The substrate design assisting device of the present invention assists in arranging a bypass capacitor connected to a power line and a ground line via at least a pair of power-side through conductors and a ground-side through conductor on a wiring substrate, and the substrate design assisting device comprises: a storage unit that stores circuit information for each of a plurality of specified spacings between a pair of power-side through conductors and a ground-side through conductor, the circuit information indicating a unit including a pair of power-side through conductors and a ground-side through conductor, and a capacitor element connected between the power-side through conductors and the ground-side through conductor; an input receiving unit that obtains at least a pair of power-side through conductors set by a user; A spacing between the ground-side through conductors corresponding to any one of the above-mentioned multiple specified spacings; and a calculation unit, which obtains circuit information corresponding to the above-mentioned spacing obtained by the above-mentioned input acceptance unit from the above-mentioned storage unit, and calculates the impedance of the power line based on the obtained circuit information, wherein the above-mentioned circuit information stored in the above-mentioned storage unit includes at least one of an equivalent circuit representing the above-mentioned unit and a parameter equivalent to at least a part of the equivalent circuit representing the above-mentioned unit, and in the equivalent circuit representing the above-mentioned unit, the equivalent circuit representing the above-mentioned capacitor element includes a capacitance component set according to the corresponding above-mentioned specified spacing.

[0020] The substrate design assistance system of the present invention assists in arranging a bypass capacitor connected to a power line and a ground line via at least a pair of power-side through conductors and a ground-side through conductor on a wiring substrate, and the substrate design assistance system comprises: a storage unit that stores circuit information at each of a plurality of specified spacings between a pair of power-side through conductors and a ground-side through conductor, the circuit information indicating a unit including a pair of power-side through conductors and a ground-side through conductor, and a capacitor element connected between the power-side through conductors and the ground-side through conductor; an input receiving unit that obtains at least a pair of power-side through conductors set by a user, A spacing between the ground-side through conductors corresponding to any one of the above-mentioned multiple specified spacings; and a calculation unit, which obtains circuit information corresponding to the above-mentioned spacing obtained by the above-mentioned input acceptance unit from the above-mentioned storage unit, and calculates the impedance of the power line based on the obtained circuit information, wherein the above-mentioned circuit information stored in the above-mentioned storage unit includes at least one of an equivalent circuit representing the above-mentioned unit and a parameter equivalent to at least a part of the equivalent circuit representing the above-mentioned unit, and in the equivalent circuit representing the above-mentioned unit, the equivalent circuit representing the above-mentioned capacitor element includes a capacitance component set according to the corresponding above-mentioned specified spacing.

[0021] The data structure related to circuit information of the present invention is used for a substrate design assisting device or a substrate design assisting system. The substrate design assisting device or the substrate design assisting system comprises an input receiving unit, a storage unit and a computing unit, and performs assistance for arranging a bypass capacitor connected to a power line and a ground line via at least a pair of power side through conductors and a ground side through conductor on a wiring substrate. The data structure related to circuit information is stored in the storage unit. The data structure related to circuit information includes circuit information for each of a plurality of specified spacings between a pair of power side through conductors and a ground side through conductor. The circuit information indicates a pair of power side through conductors and a ground side through conductor, and a capacitor connected between the power side through conductors and the ground side through conductors. The unit of the element, and the data structure related to the circuit information is used for the following processing: based on the spacing between at least one pair of power-side through conductors and ground-side through conductors set by the user and obtained by the input acceptance unit, corresponding to any one of the multiple specified spacings, the calculation unit obtains the circuit information corresponding to the spacing obtained by the input acceptance unit from the storage unit, and calculates the impedance of the power line based on the obtained circuit information, the circuit information includes at least one of an equivalent circuit representing the unit and a parameter corresponding to at least a part of the equivalent circuit representing the unit, and in the equivalent circuit representing the unit, the equivalent circuit representing the capacitor element includes a capacitance component set according to the corresponding specified spacing.

[0022] Effects of the Invention

[0023] According to the present invention, it is possible to provide a substrate design support device, a substrate design support system, and a data structure related to circuit information suitable for designing a power supply line to which a bypass capacitor is connected via a plurality of through-conductors. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 This is a cross-sectional view schematically showing an example of a capacitor portion included in a wiring board whose design is assisted by the board design assisting device according to the first embodiment of the present invention.

[0025] Figure 2A It is along Figure 1 Top view of line A and line A'.

[0026] Figure 2B It is along Figure 1 Top view of line B and line B'.

[0027] Figure 2C It is along Figure 1 Top view of lines C and C'.

[0028] Figure 2D It is along Figure 1The top view of the D line and D' line.

[0029] Figure 2E It is along Figure 1 Top view of Line E.

[0030] Figure 3 This is a block diagram showing an example of the configuration of the substrate design support device according to the first embodiment of the present invention.

[0031] Figure 4A This is a diagram showing an example of an equivalent circuit of a representation unit.

[0032] Figure 4B It is a diagram showing another example of an equivalent circuit representing a unit cell.

[0033] Figure 5 FIG. 1 is a diagram showing an example of an equivalent circuit of a power supply-side through conductor and a ground-side through conductor.

[0034] Figure 6 1 is a diagram showing an example of a data structure related to circuit information stored in a storage unit, and shows a case where an equivalent circuit representing a cell is included as circuit information.

[0035] Figure 7 It is a diagram showing another example of the data structure related to the circuit information stored in the storage unit.

[0036] Figure 8 FIG. 1 is a diagram showing an example of an equivalent circuit representing cells connected in parallel.

[0037] Fig. 9 : is a diagram showing an example of an equivalent circuit representing a capacitor element.

[0038] Fig. 10A It is a diagram showing an example of parameters corresponding to an equivalent circuit representing a cell.

[0039] Fig. 10B It is a diagram showing another example of parameters corresponding to an equivalent circuit representing a cell.

[0040] Fig.11 It is a diagram showing another example of parameters corresponding to an equivalent circuit representing a cell.

[0041] Fig.12 1 is a diagram showing another example of the data structure related to the circuit information stored in the storage unit, and shows a case where parameters are included as the circuit information.

[0042] Fig.13 1 is a diagram showing another example of the data structure related to the circuit information stored in the storage unit, and shows a case where parameters are included as the circuit information.

[0043] Fig.14 1 is a diagram showing another example of the data structure related to the circuit information stored in the storage unit, and shows a case where an equivalent circuit and parameters are included as the circuit information.

[0044] Fig.15 1 is a diagram showing another example of the data structure related to the circuit information stored in the storage unit, and shows a case where an equivalent circuit and parameters are included as the circuit information.

[0045] Fig.16 It is a diagram showing an example of parameters corresponding to an equivalent circuit representing cells connected in parallel.

[0046] Fig.17 It is a diagram showing another example of parameters corresponding to an equivalent circuit representing cells connected in parallel.

[0047] Fig.18 It is a diagram showing another example of an equivalent circuit representing a unit cell.

[0048] Fig.19 1 is a schematic diagram showing an example of a grid, and power supply-side through conductors and ground-side through conductors arranged at intersections of the grid.

[0049] Fig. 20 1 is a schematic diagram showing another example of a grid, and power supply-side through conductors and ground-side through conductors arranged at intersections of the grid.

[0050] Fig.21 This is a flowchart for explaining an example of the operation of the substrate design support device according to the first embodiment of the present invention. DETAILED DESCRIPTION

[0051] Next, the substrate design support device, the substrate design support system, and the data structure related to the circuit information of the present invention are described.

[0052] However, the present invention is not limited to the following structures, and can be appropriately changed and applied within the scope of the gist of the present invention. In addition, a structure in which two or more structures of each desired structure described below are combined also belongs to the present invention.

[0053] (Implementation Method 1)

[0054] In the substrate design assisting device involved in the present embodiment, when the user configures at least one pair of power side through conductors and ground side through conductors on the wiring substrate, capacitor elements are simultaneously configured between each pair of through conductors. That is, when a pair of power side through conductors and ground side through conductors are configured, a unit including the pair of through conductors and the capacitor element connected between the pair of through conductors is automatically set. In addition, an equivalent circuit that accurately reproduces the unit including a pair of power side through conductors and ground side through conductors, specifically an equivalent circuit including a capacitance component corresponding to the spacing between a pair of power side through conductors and ground side through conductors, is prepared in advance. In addition, an equivalent circuit that accurately reproduces the scaling when multiple units are connected, specifically an equivalent circuit corresponding to the number of connections of multiple units connected in parallel, is prepared in advance. Then, the impedance of the power line is calculated using the equivalent circuit (or a parameter equivalent thereto), thereby accurately estimating the impedance characteristics of the power line connected to the bypass capacitor via multiple through conductors according to the user's careful design verification even without using a measured model. In addition, it is also possible to accurately estimate the impedance characteristics of a power supply line in which a plurality of cells are connected in parallel.

[0055] Figure 1 This is a cross-sectional view schematically showing an example of a capacitor portion included in a wiring board whose design is assisted by the board design assisting device according to the first embodiment of the present invention. Figure 2A It is along Figure 1 Top view of line A and line A'. Figure 2B It is along Figure 1 Top view of line B and line B'. Figure 2C It is along Figure 1 Top view of lines C and C'. Figure 2D It is along Figure 1 Top view of line D and line D'. Figure 2E It is along Figure 1 A top view of line E. In addition, Figure 1 It is along Figure 2A Cross-sectional view of line II.

[0056] Figure 1 The capacitor unit 101 shown in the figure includes a capacitor element 110 and a through conductor 120. Figure 1 In the illustrated example, the capacitor portion 101 further includes a sealing layer 130 and conductive wiring layers 140A and 140B.

[0057] The capacitor element 110 includes: an anode plate 111 having a porous portion 111B on at least one main surface of a core portion 111A; a dielectric layer 113 disposed on the surface of the porous portion 111B; and a cathode layer 112 disposed on the surface of the dielectric layer 113. Thus, the capacitor element 110 constitutes an electrolytic capacitor. Figure 1 In the example shown, the anode plate 111 has the porous portion 111B on both main surfaces of the core portion 111A, but the porous portion 111B may be provided on only one main surface of the core portion 111A.

[0058] Cathode layer 112 includes, for example, a solid electrolyte layer provided on the surface of dielectric layer 113. Preferably, cathode layer 112 further includes a conductor layer provided on the surface of the solid electrolyte layer. When cathode layer 112 includes a solid electrolyte layer, capacitor element 110 constitutes a solid electrolytic capacitor.

[0059] The through conductor 120 has a thickness direction ( Figure 1 The vertical direction (in the middle) penetrates the dielectric layer 113 and the anode plate 111.

[0060] The through conductor 120 includes a cathode through conductor 120A electrically connected to the cathode layer 112 and an anode through conductor 120B electrically connected to the anode plate 111. The cathode through conductor 120A functions as a ground through conductor connected to the ground line, and the anode through conductor 120B functions as a power supply through conductor connected to the power supply line.

[0061] exist Figure 1 In the illustrated example, a plurality of cathode through conductors 120A are provided so as to penetrate the sealing layer 130 and the capacitor element 110 in the thickness direction. Each cathode through conductor 120A is connected to a conductor wiring layer 140A provided on the surface of the sealing layer 130 at an end.

[0062] Preferably, if Figure 2C As shown, the cathode through conductor 120A is present in the cathode layer 112 when viewed from above in the thickness direction of the anode plate 111 .

[0063] The cathode through conductor 120A only needs to be provided on at least the inner wall surface of the through hole that penetrates the sealing layer 130 and the capacitor element 110 in the thickness direction. That is, the cathode through conductor 120A may be provided only on the inner wall surface of the through hole, or may be provided on the entire interior of the through hole. In the case where the cathode through conductor 120A is provided only on the inner wall surface of the through hole, the space surrounded by the cathode through conductor 120A in the through hole may be filled with a material containing resin. That is, a resin filling portion 125A may be provided inside the cathode through conductor 120A.

[0064] like Figure 1 As shown, an insulating material such as the sealing layer 130 is filled between the through hole that penetrates the sealing layer 130 and the capacitor element 110 in the thickness direction and the cathode through conductor 120A.

[0065] exist Figure 1In the illustrated example, a plurality of anode through conductors 120B are provided so as to penetrate the sealing layer 130 and the capacitor element 110 in the thickness direction. Each anode through conductor 120B is connected to a conductor wiring layer 140B provided on the surface of the sealing layer 130 at an end portion.

[0066] Preferably, if Figure 2C As shown, the anode through conductor 120B is present in the cathode layer 112 when viewed from above in the thickness direction of the anode plate 111 .

[0067] The anode through conductor 120B only needs to be provided on at least the inner wall surface of the through hole that penetrates the sealing layer 130 and the capacitor element 110 in the thickness direction. That is, the anode through conductor 120B may be provided only on the inner wall surface of the through hole, or may be provided on the entire interior of the through hole. In the case where the anode through conductor 120B is provided only on the inner wall surface of the through hole, the space surrounded by the anode through conductor 120B in the through hole may be filled with a material containing resin. That is, the resin filling portion 125B may be provided inside the anode through conductor 120B.

[0068] Preferably, if Figure 1 As shown, the anode through conductor 120B is electrically connected to the anode plate 111 at the inner wall surface of the through hole that penetrates the sealing layer 130 and the capacitor element 110 in the thickness direction. More specifically, it is preferred that the anode through conductor 120B is electrically connected to the end surface of the anode plate 111 that faces the inner wall surface of the through hole in the plane direction. In this case, an insulating material such as the sealing layer 130 is not filled between the through hole that penetrates the sealing layer 130 and the capacitor element 110 in the thickness direction and the anode through conductor 120B.

[0069] Preferably, if Figure 1 As shown in FIG. 1 , core portion 111A and porous portion 111B are exposed at an end surface electrically connected to anode through conductor 120B of anode plate 111. In this case, in addition to core portion 111A, porous portion 111B is also electrically connected to anode through conductor 120B.

[0070] Preferably, when viewed from the thickness direction of the anode plate 111, Figure 2D and Figure 2E As shown, anode through conductor 120B is electrically connected to anode plate 111 over the entire circumference of a through hole that penetrates sealing layer 130 and capacitor element 110 in the thickness direction.

[0071] The anode through conductor 120B may be electrically connected to the anode plate 111 via an anode connecting layer, or may be directly connected to the end surface of the anode plate 111 .

[0072] Sealing layer 130 is provided so as to cover capacitor element 110 . Capacitor element 110 is protected by sealing layer 130 .

[0073] Preferably, if Figure 1 As shown, sealing layer 130 is provided on two main surfaces of capacitor element 110 that are opposite to each other in the thickness direction.

[0074] The conductor wiring layers 140A and 140B are provided on the surface of the sealing layer 130 , and are electrically connected to one of the cathode through conductor 120A and the anode through conductor 120B.

[0075] The conductor wiring layer 140A is electrically connected to the cathode through conductor 120A. Figure 1 In the illustrated example, the conductive wiring layer 140A is provided on the surface of the cathode through conductor 120A, and functions as a connection terminal of the capacitor portion 101 .

[0076] Specifically, in Figure 1 In the illustrated example, the conductive wiring layer 140A is electrically connected to the cathode layer 112 via a via conductor 145 that penetrates the sealing layer 130 , and functions as a connection terminal for the cathode layer 112 .

[0077] The conductor wiring layer 140B is electrically connected to the anode through conductor 120B. Figure 1 In the illustrated example, the conductive wiring layer 140B is provided on the surface of the anode through conductor 120B, and functions as a connection terminal of the capacitor portion 101 .

[0078] Specifically, in Figure 1 In the illustrated example, the conductor wiring layer 140B is electrically connected to the anode plate 111 via the anode through conductor 120B, and functions as a connection terminal for the anode plate 111 .

[0079] Furthermore, a ground line (not shown) provided on an insulating layer (not shown) covering the conductive wiring layers 140A and 140B is electrically connected to the conductive wiring layer 140A via a via conductor (not shown) penetrating the insulating layer, whereby the ground line is electrically connected to the cathode layer 112 of the capacitor element 110 via the cathode through conductor 120A. On the other hand, a power line (not shown) provided on the insulating layer covering the conductive wiring layers 140A and 140B is electrically connected to the conductive wiring layer 140B via a via conductor (not shown) penetrating the insulating layer, whereby the power line is electrically connected to the anode plate 111 of the capacitor element 110 via the anode through conductor 120B.

[0080] Figure 3 This is a block diagram showing an example of the configuration of the substrate design support device according to the first embodiment of the present invention.

[0081] Figure 3 The substrate design support device 1 shown is a device for supporting design of a wiring board, and supports placement of a bypass capacitor connected to a power line and a ground line via at least a pair of power-side through conductors and a ground-side through conductor on the wiring board.

[0082] The substrate design support device 1 includes an input unit 10 , a control unit 20 , a storage unit 30 , and a display unit 40 .

[0083] The input unit 10 is composed of, for example, a keyboard and a mouse, and the display unit 40 is composed of, for example, a liquid crystal display, etc. The substrate design support device 1 is configured so that a user (a designer of a wiring substrate, etc.) can design (draw) a wiring substrate by operating the input unit 10 while confirming an image displayed on the display unit 40.

[0084] The control unit 20 is configured as a computer system including a CPU (Central Processing Unit) etc. The control unit 20 implements various processes by executing a predetermined software program stored in the storage unit 30 in the CPU.

[0085] The storage unit 30 is composed of a storage device such as a RAM (Random Access Memory), a ROM (Read Only Memory), and a hard disk, and stores various programs and information (data) for controlling the substrate design support device 1. As a program, for example, a design support program as software for supporting the design of a wiring substrate is stored.

[0086] The storage unit 30 stores a data structure related to circuit information, the data structure having circuit information for each of a plurality of predetermined pitches between a pair of power-side through conductors and a ground-side through conductor, the circuit information indicating a unit including a pair of power-side through conductors and a ground-side through conductor, and a capacitor element connected between the power-side through conductors and the ground-side through conductor. Hereinafter, when simply referred to as "prescribed pitch", it refers to the predetermined pitch between the pair of power-side through conductors and the ground-side through conductor included in the unit.

[0087] More specifically, the circuit information includes an equivalent circuit representing a unit (hereinafter sometimes referred to as a "unit equivalent circuit"), the unit equivalent circuit includes an equivalent circuit representing a capacitor element included in the unit (hereinafter sometimes referred to as a "capacitor equivalent circuit"), and the capacitor equivalent circuit includes a capacitance component set according to the corresponding prescribed spacing. That is, the storage unit 30 stores a plurality of unit equivalent circuits pre-set (prepared) corresponding to a plurality of prescribed spacings. In addition, the capacitance component included in the capacitor equivalent circuit is set according to the prescribed spacing corresponding to the capacitance.

[0088] Here, the predetermined pitch refers to a preset pitch between a pair of power supply through conductors and ground through conductors included in a cell that can be selected in the substrate design support device 1. The number of predetermined pitches is not particularly limited as long as it is 2 or more, and can be set appropriately.

[0089] In addition, the data structure related to the circuit information can be pre-imported into the substrate design support device 1, or can be recorded in a computer-readable recording medium and provided to the user, or provided to the user via a network. In addition, the data structure related to the circuit information can also be embedded in a general design support program together with an add-in like a process design kit.

[0090] Preferably, the unit equivalent circuit includes an inductance component representing the power supply side through conductor and an inductance component representing the ground side through conductor that are not set according to the specified pitch. This can improve the calculation accuracy of the impedance of the power line. That is, preferably, the equivalent circuit representing the power supply side through conductor and the equivalent circuit representing the ground side through conductor each include at least an inductance component (the same inductance) common to all the specified pitches.

[0091] In this manner, it is preferable that the cell equivalent circuit includes an equivalent circuit representing the power supply side through conductor and an equivalent circuit representing the ground side through conductor.

[0092] Figure 4A A diagram showing an example of an equivalent circuit of a cell is shown.

[0093] Figure 4A The unit equivalent circuit 50 shown includes an equivalent circuit S representing a power supply side through conductor connected to a power supply line, an equivalent circuit G representing a ground side through conductor connected to a ground line, and a capacitor equivalent circuit C connected between the equivalent circuit S and the equivalent circuit G. The capacitor equivalent circuit C is connected to a node on the output port (Port2) side of the equivalent circuit S and the equivalent circuit G. The power supply and the ground are connected to the input port (Port1), and a load such as a CPU is connected to the output port (Port2). The unit equivalent circuit 50 represents a case where a capacitor element is formed only on one side of the surface and the back side of the anode plate.

[0094] Figure 5 FIG. 1 is a diagram showing an example of an equivalent circuit of a power supply-side through conductor and a ground-side through conductor.

[0095] like Figure 5As shown, the equivalent circuit S representing the power supply side through conductor and the equivalent circuit G representing the ground side through conductor each include an inductance component L and a resistance component R connected in series. The inductance component L is connected to the input port (Port 1), and the resistance component R is connected to the output port (Port 2) (refer to Figure 4A ).

[0096] Here, the inductance component L and the resistance component R are not set according to the specified spacing. That is, the inductance and resistance (the same inductance and the same resistance) used in common for all specified spacings are set. In the substrate design support device 1, the design rules are set to perform circuit design. In the circuit design, the diameter φ, the plating thickness, the material, and the thickness of the connected resin substrate (= the through-hole length) are also set for the through conductor. Therefore, at the time point when it is indicated which layer is connected by the through conductor, the inductance component L and the resistance component R for that part are theoretically calculated. In addition, the material of the through conductor is generally Cu, but it is not particularly limited to this, and the resistance component R corresponding to the set wiring type can be allocated.

[0097] Preferably, the equivalent circuit representing the through-conductor on the power supply side includes the first circuit section and the second circuit section connected in series between the input port and the output port, the equivalent circuit representing the through-conductor on the ground side includes the third circuit section and the fourth circuit section connected in series between the input port and the output port, and the capacitor equivalent circuit is connected to the node between the first circuit section and the second circuit section and the node between the third circuit section and the fourth circuit section. Thus, the components of each circuit section on the output port side can be set in consideration of the reflection characteristics on the output port side, so the accuracy of the substrate design assistance can be further improved.

[0098] Figure 4B It is a diagram showing another example of an equivalent circuit representing a unit cell.

[0099] The unit equivalent circuit 50 is Figure 4A In addition to the circuit shown in the example, it can also be Figure 4BThe circuit illustrated. In this case, the equivalent circuit S representing the through conductor on the power supply side includes a first circuit portion S' and a second circuit portion S", which are connected in series between the input port (Port1) and the output port (Port2), and the equivalent circuit G representing the through conductor on the ground side includes a third circuit portion G' and a fourth circuit portion G", which are connected in series between the input port (Port1) and the output port (Port2), and the capacitor equivalent circuit C is connected to a node 51 between the first circuit portion S' and the second circuit portion S", and a node 52 between the third circuit portion G' and the fourth circuit portion G". Here, each component of the second circuit portion S" and the fourth circuit portion G" on the output port (Port2) side is set in consideration of the reflection characteristics on the output port (Port2) side. Therefore, the first circuit portion S' and the second circuit portion S" may have at least a part of their components different from each other, and similarly, the third circuit portion G' and the fourth circuit portion G" may have at least a part of their components different from each other.

[0100] In addition, if Figure 5 As shown, the first circuit section S', the second circuit section S", the third circuit section G' and the fourth circuit section G" respectively include an inductance component L and a resistance component R connected in series. In addition, in any circuit section, the inductance component L is located on the input port (Port1) side, and the resistance component R is located on the output port (Port2) side. Figure 4B In the illustrated cell equivalent circuit 50 , the inductance component L and the resistance component R are also not set based on a predetermined pitch.

[0101] Figure 6 1 is a diagram showing an example of a data structure related to circuit information stored in a storage unit, and shows a case where an equivalent circuit representing a cell is included as circuit information.

[0102] like Figure 6 As shown, the storage unit 30 stores a unit equivalent circuit at each of the prescribed spacings P1, P2, P3, ... between a pair of power-side through conductors and a ground-side through conductor. However, the equivalent circuit S representing the power-side through conductor and the equivalent circuit G representing the ground-side through conductor are common to each prescribed spacing. In addition, in this specification, two equivalent circuits are common or equivalent to each other, which means that the types, quantities, connections and values ​​(capacitance, inductance, resistance, etc.) of the constituent elements (components) are all the same. On the other hand, the capacitor equivalent circuit C includes capacitance components that are independently set at each prescribed spacing. In addition, multiple capacitance components set corresponding to different prescribed spacings usually have capacitances different from each other, but may also include multiple capacitance components with the same capacitance.

[0103] The storage unit 30 stores circuit information indicating cells in association with the number of cells connected in parallel, that is, the number of connections. That is, a cell equivalent circuit is stored as circuit information for each number of cells connected in parallel to the same power line.

[0104] Figure 7 It is a diagram showing another example of the data structure related to the circuit information stored in the storage unit.

[0105] like Figure 7 As shown, the storage unit 30 stores a unit equivalent circuit according to each number of connections of the unit. However, the equivalent circuit S representing the power supply side through conductor and the equivalent circuit G representing the ground side through conductor are common to each number of connections. On the other hand, the capacitor equivalent circuit C includes capacitance components independently set according to each number of connections. In addition, the multiple capacitance components set corresponding to different numbers of connections usually have different capacitances from each other, but may also include multiple capacitance components with the same capacitance.

[0106] Figure 8 FIG. 1 is a diagram showing an example of an equivalent circuit representing cells connected in parallel.

[0107] Figure 8 The equivalent circuit shown shows a plurality of, here three, cells connected in parallel to the same power line. Figure 4A The unit equivalent circuit 50 shown is connected in parallel between an input port (Port 1) and an output port (Port 2). In this case, the capacitor equivalent circuit C of each unit equivalent circuit 50 includes a common capacitance component corresponding to a predetermined pitch and a connection number (=3).

[0108] In addition, Figure 8 The equivalent circuit 50 of the units connected in parallel is shown in FIG. Figure 4A In the case of the circuit illustrated in the example, at least one of the unit equivalent circuits 50 may be Figure 4B The circuit illustrated.

[0109] Preferably, the capacitor equivalent circuit includes a ladder circuit. This makes it possible to reproduce with higher accuracy a capacitor element that is built into a substrate and to which a plurality of through conductors serving as lead terminals are connected.

[0110] From the viewpoint of calculation accuracy, it is preferable that the ladder circuit includes two or more capacitance components set according to the corresponding predetermined pitches.

[0111] In this way, the ladder circuit includes a plurality of capacitance components connected in parallel to each other, and the capacitances of these plurality of capacitance components are set according to the corresponding predetermined pitches.

[0112] The upper limit of the capacitance component included in the ladder circuit is not particularly limited and can be set appropriately, but is preferably 5 or less, and more preferably 4 or less. This is because the effect of improving calculation accuracy produced by the ladder circuit tends to be saturated as the number of capacitance components increases.

[0113] Fig. 9 : is a diagram showing an example of an equivalent circuit representing a capacitor element.

[0114] Fig. 9 The capacitor equivalent circuit 60 shown includes: a first terminal 61 connected to the power supply side through conductor; a second terminal 62 connected to the ground side through conductor; a first capacitor section 63; a second capacitor section 64; and an LR circuit 65 connected between the first terminal 61 and the first capacitor section 63.

[0115] The first capacitor 63 and the second capacitor 64 are equivalent to each other. That is, they are composed of the same RLC component. In addition, the first capacitor 63 and the second capacitor 64 are connected in parallel between the first terminal 61 and the second terminal 62.

[0116] The first capacitor section 63 and the second capacitor section 64 are respectively composed of three capacitor components C1, C2 and C3, four resistor components R1, R2, R3 and Rsh1, and an inductance component L1. The three capacitor components C1, C2 and C3 are connected to the three resistor components R1, R2 and R3 in a ladder shape. The resistor component Rsh1 is connected between the capacitor component C1 and the resistor component R1 of the first stage. The inductance component L1 is connected to the resistor component R1 of the first stage.

[0117] The LR circuit 65 is an LR series circuit composed of a resistance component RS1 and an inductance component LS1 connected in series. Thus, the capacitor equivalent circuit 60 includes an equivalent circuit portion (an equivalent circuit composed of the first capacitor portion 63 and the LR circuit 65) that reaches the capacitance components C1, C2, and C3 after passing through the LR circuit 65.

[0118] Here, these capacitance components C1, C2 and C3 are set at each predetermined pitch. In addition, other resistance components R1, R2, R3 and Rsh1 and inductance component L1 are also set at each predetermined pitch. That is, for each component, different components (capacitance, resistance or inductance) are set according to the predetermined pitch.

[0119] Each capacitance component, each inductance component, and each resistance component included in the capacitor equivalent circuit 60 is determined based on measured data. As described in the above question, when the number of connections of the unit increases, the characteristics of the state in which the RL component of the wiring part is enhanced are observed, so the scale effect is confirmed with the number of connections to the extent that its influence can be ignored, and each multiplier that is most consistent with the measured value and structural characteristics is set as the corresponding component, thereby defining the capacitor equivalent circuit 60.

[0120] Furthermore, the circuit information stored in the storage unit 30 may include parameters corresponding to at least a portion of the unit equivalent circuit (hereinafter sometimes referred to as replacement parameters) instead of the unit equivalent circuit, or may include both the unit equivalent circuit and the replacement parameters.

[0121] Specifically, the substitute parameters include the frequency characteristics of the impedance of the corresponding unit equivalent circuit and capacitor equivalent circuit, S parameters, etc. The substitute parameters may be parameters calculated based on the corresponding unit equivalent circuit and capacitor equivalent circuit, or may be parameters directly set based on actual measurements.

[0122] Fig. 10A It is a diagram showing an example of parameters corresponding to an equivalent circuit representing a cell.

[0123] Fig. 10A The substitution parameters shown are Figure 4A The parameters of the unit equivalent circuit 50 shown are Figure 4A The equivalent circuit S representing the power supply side through conductor, the equivalent circuit G representing the ground side through conductor, and the capacitor equivalent circuit C shown are replaced by the corresponding substitution parameters Z1, Z2, and Z3, respectively. Therefore, the connection relationship between the substitution parameters is the same as Figure 4A The same situation is shown.

[0124] Fig.11 It is a diagram showing another example of parameters corresponding to an equivalent circuit representing a cell.

[0125] Fig.11 The alternative parameters shown are also the same as Figure 4A The unit equivalent circuit 50 shown has similar parameters, but will Figure 4A The equivalent circuit S representing the power supply side through conductor, the equivalent circuit G representing the ground side through conductor, and the capacitor equivalent circuit C shown are replaced with a substitution parameter Zunit corresponding to their overall equivalent circuit. Therefore, the substitution parameter Zunit is a parameter that takes into account the equivalent circuit S representing the power supply side through conductor and the equivalent circuit G representing the ground side through conductor.

[0126] Fig. 10B It is a diagram showing another example of parameters corresponding to an equivalent circuit representing a cell.

[0127] Fig. 10B The substitution parameters shown are Figure 4B The parameters of the unit equivalent circuit 50 shown are Figure 4BThe first circuit portion S' and the second circuit portion S" of the equivalent circuit S representing the power supply side through conductor are replaced by the corresponding replacement parameters Z1' and Z1", and the third circuit portion G' and the fourth circuit portion G" of the equivalent circuit G representing the ground side through conductor are replaced by the corresponding replacement parameters Z2' and Z2", and the capacitor equivalent circuit C is replaced by the corresponding replacement parameter Z3. Therefore, the connection relationship of each replacement parameter is the same as Figure 4B Here, the substitution parameters Z1" and Z2" on the output port (Port2) side are set in consideration of the reflection characteristics on the output port (Port2) side. Therefore, the accuracy of the substrate design assistance can be further improved.

[0128] also, Fig.11 The alternative parameter Zunit shown can also be Figure 4B The parameters of the unit equivalent circuit 50 shown are equivalent to each other. That is, Fig.11 The alternative parameters Zunit shown can also be used with Fig. 10B The alternative parameters shown are equivalent parameters.

[0129] Fig.12 1 is a diagram showing another example of the data structure related to the circuit information stored in the storage unit, and shows a case where parameters are included as the circuit information.

[0130] like Fig.12 As shown, the storage unit 30 may also store, at each specified spacing, an alternative parameter Z1 corresponding to the equivalent circuit representing the power side through conductor, an alternative parameter Z2 corresponding to the equivalent circuit representing the ground side through conductor, and an alternative parameter Z3 corresponding to the capacitor equivalent circuit. However, the alternative parameter Z1 corresponding to the equivalent circuit representing the power side through conductor is common to each specified spacing, and the alternative parameter Z2 corresponding to the equivalent circuit representing the ground side through conductor is also common to each specified spacing. On the other hand, the alternative parameter Z3 corresponding to the capacitor equivalent circuit reflects the capacitance component of the capacitor equivalent circuit independently set at each specified spacing. In addition, in this specification, two alternative parameters are common means that these alternative parameters are equivalent to two equivalent circuits that are equivalent to each other.

[0131] In addition, the replacement parameters Z1' and Z1" corresponding to the first circuit portion S' and the second circuit portion S" of the equivalent circuit S representing the power supply side through-conductor are also common for each specified spacing, and the replacement parameters Z2' and Z2" corresponding to the third circuit portion G' and the fourth circuit portion G" of the equivalent circuit G representing the ground side through-conductor are also common for each specified spacing.

[0132] In addition, you can also store Fig. 10B The alternative parameters Z1' and Z1" are shown to replace Fig.12 At least one of the alternative parameters Z1 shown in FIG. Fig. 10B The alternative parameters Z2' and Z2" are shown to replace Fig.12 At least one of the alternative parameters Z2 shown.

[0133] Fig.13 1 is a diagram showing another example of the data structure related to the circuit information stored in the storage unit, and shows a case where parameters are included as the circuit information.

[0134] like Fig.13 As shown, the storage unit 30 may also store, at each specified pitch, a substitution parameter Zunit corresponding to an equivalent circuit representing a power supply side through conductor, an equivalent circuit representing a ground side through conductor, and the entire capacitor equivalent circuit. Therefore, the substitution parameter Zunit reflects the capacitance component of the capacitor equivalent circuit independently set at each specified pitch.

[0135] Fig.14 1 is a diagram showing another example of the data structure related to the circuit information stored in the storage unit, and shows a case where an equivalent circuit and parameters are included as the circuit information.

[0136] like Fig.14 As shown, the storage unit 30 may also store, at each specified interval, a portion of the unit equivalent circuit (e.g., a capacitor equivalent circuit C) and alternative parameters (e.g., alternative parameters Z1 and Z2) corresponding to the remainder of the unit equivalent circuit (e.g., an equivalent circuit representing a through conductor on the power supply side and an equivalent circuit representing a through conductor on the ground side).

[0137] In addition, you can also store Fig. 10B The alternative parameters Z1' and Z1" are shown to replace Fig.14 At least one of the alternative parameters Z1 shown in FIG. Fig. 10B The alternative parameters Z2' and Z2" are shown to replace Fig.14 At least one of the alternative parameters Z2 shown.

[0138] Fig.15 1 is a diagram showing another example of the data structure related to the circuit information stored in the storage unit, and shows a case where an equivalent circuit and parameters are included as the circuit information.

[0139] like Fig.15 As shown, the storage unit 30 may store cell equivalent circuits corresponding to one or more predetermined pitches and substitution parameters Zunit (corresponding to the entire cell equivalent circuit) corresponding to another one or more predetermined pitches.

[0140] In addition, the storage unit 30 may also store Figure 6 , Figure 12 to Figure 15 The circuit information shown is appropriately combined and stored.

[0141] Fig.16 It is a diagram showing an example of parameters corresponding to an equivalent circuit representing cells connected in parallel.

[0142] Fig.16 The substitution parameters shown are Figure 8 The parameters corresponding to the equivalent circuit of the units connected in parallel are shown in FIG. Figure 8 The equivalent circuit S representing the power supply side through conductor, the equivalent circuit G representing the ground side through conductor, and the capacitor equivalent circuit C shown in FIG. 1 are replaced by the corresponding substitution parameters Z1, Z2, and Z3, respectively. Therefore, the connection relationship between the substitution parameters is the same as Figure 8 The same situation is shown.

[0143] In addition, Fig.16 The alternative parameters that are connected in parallel are shown in Fig. 10A The parameters are shown in the example, but at least one of these alternative parameters can also be Fig. 10B Parameters illustrated.

[0144] Fig.17 It is a diagram showing another example of parameters corresponding to an equivalent circuit representing cells connected in parallel.

[0145] Fig.17 The alternative parameters shown are also the same as Figure 8 The parameters shown are equivalent to the equivalent circuit of the units connected in parallel, but are replaced by Figure 8 The equivalent circuit of the entire three unit equivalent circuits 50 shown is obtained by replacing the parameter Ztot.

[0146] also, Fig.17 The alternative parameter Ztot shown can also be Figure 8 At least one of the unit equivalent circuits 50 shown is Figure 4B Parameters corresponding to the equivalent circuit of the illustrated circuit.

[0147] Preferably, the unit equivalent circuit includes a first equivalent circuit representing a first capacitor element and a second equivalent circuit representing a second capacitor element as a capacitor equivalent circuit, the first equivalent circuit and the second equivalent circuit are equivalent to each other, the first equivalent circuit is connected to a node of a power side through conductor on the side of one main surface (first main surface) of the wiring substrate and a node of a ground through conductor on the side of one main surface (first main surface) of the wiring substrate, and the second equivalent circuit is connected to a node of a power side through conductor on the side of another main surface (second main surface) of the wiring substrate and a node of a ground through conductor on the side of another main surface (second main surface) of the wiring substrate. Thus, it is possible to reproduce with high accuracy the case where the unit includes a first capacitor element and a second capacitor element connected in parallel between a pair of power side through conductors and a ground side through conductor as capacitor elements. These first capacitor elements and second capacitor elements are independently arranged on the surface and back of the anode plate via the anode plate.

[0148] Fig.18 It is a diagram showing another example of an equivalent circuit representing a unit cell.

[0149] Fig.18 The unit equivalent circuit 80 shown includes an equivalent circuit S representing a power supply side through conductor connected to the power supply line, an equivalent circuit G representing a ground side through conductor connected to the ground line, and two capacitor equivalent circuits C connected between the equivalent circuit S and the equivalent circuit G. One capacitor equivalent circuit C is a first equivalent circuit 81 representing a first capacitor element, and is connected to a node 83 on the output port (Port2) side of the equivalent circuit S and a node 84 on the output port (Port2) side of the equivalent circuit G. The other capacitor equivalent circuit C is a second equivalent circuit 82 representing a second capacitor element, and is connected to a node 85 on the input port (Port1) side of the equivalent circuit S and a node 86 on the input port (Port1) side of the equivalent circuit G. The unit equivalent circuit 80 is for Figure 4A The cell equivalent circuit 50 shown is obtained by adding a capacitor equivalent circuit C to the input port (Port 1) side of the equivalent circuit S and the equivalent circuit G. The cell equivalent circuit 80 shows a case where the first capacitor element and the second capacitor element are formed on both sides of the front and back surfaces of the anode plate.

[0150] The first equivalent circuit 81 and the second equivalent circuit 82 are Fig. 9 The capacitor equivalent circuit 60 shown is the same, and the first equivalent circuit 81 and the second equivalent circuit 82 are equivalent to each other. That is, they are composed of the same RLC component. Fig. 9 The first terminal 61 is shown connected to the node 83 or 85, Fig. 9 The second terminal 62 is shown connected to either node 84 or 86 .

[0151] In addition, the first equivalent circuit 81 is connected to the node of the power-side through conductor on one main surface side of the wiring substrate and the node of the ground through conductor on one main surface side of the wiring substrate, and the second equivalent circuit 82 is connected to the node of the power-side through conductor on the other main surface side of the wiring substrate and the node of the ground through conductor on the other main surface side of the wiring substrate. That is, nodes 83 and 84 are equivalent to the node of the power-side through conductor on one main surface side of the wiring substrate and the node of the ground through conductor on one main surface side of the wiring substrate, and nodes 85 and 86 are equivalent to the node of the power-side through conductor on the other main surface side of the wiring substrate and the node of the ground through conductor on the other main surface side of the wiring substrate.

[0152] like Fig.18 As described, the unit equivalent circuit may also include 2×n (where n is an integer greater than 2) capacitor equivalent circuits. Thus, it is possible to reproduce a situation in which the unit includes 2×n capacitor elements connected in parallel between a pair of power side through conductors and a ground side through conductor as capacitor elements. Such a unit can be realized by forming a through conductor that penetrates these substrates at once after stacking a plurality of substrates with built-in capacitor elements. The 2×n capacitor equivalent circuits are connected in parallel to each other, and the n capacitor equivalent circuits are connected to the input port (Port1) side of the equivalent circuit representing the power side through conductor and the input port (Port1) side of the equivalent circuit representing the ground through conductor, and the remaining n capacitor equivalent circuits are connected to the output port (Port2) side of the equivalent circuit representing the power side through conductor and the output port (Port2) side of the equivalent circuit representing the ground through conductor.

[0153] In addition, Fig.18 The example in FIG. 1 shows a case where the number of connections of the unit is 1, but the number of connections of the unit may be 2 or more. In this case, at least one unit may include Fig.18 The first equivalent circuit 81 and the second equivalent circuit 82 shown in FIG. 8 are shown in FIG. 8 , but preferably, all units respectively include Fig.18 The first equivalent circuit 81 and the second equivalent circuit 82 shown in FIG. In addition, in either case, Fig.18 At least a part of the equivalent circuit G, the equivalent circuit G, the first equivalent circuit 81 and the second equivalent circuit 82 shown are replaced with replacement parameters corresponding thereto.

[0154] Next, the functions of the control unit 20 will be described in detail.

[0155] like Figure 3 As shown, the control unit 20 includes an input receiving unit 21 , a calculation unit 22 , and an output unit 23 .

[0156] The input receiving unit 21 performs processing for obtaining a spacing between at least one pair of power-side through conductors and ground-side through conductors set by the user that corresponds to (is consistent with) any one of a plurality of predetermined spacings. That is, in the substrate design supporting device 1, the user cannot arrange (design) the power-side through conductors and the ground-side through conductors on the wiring substrate at an arbitrary spacing, and can only arrange (design) the power-side through conductors and the ground-side through conductors on the wiring substrate at a spacing that is consistent with any one of the predetermined spacings set in advance.

[0157] Furthermore, regarding the distance between each pair of power-side through conductors and ground-side through conductors set by the user, for example, the input accepting unit 21 can acquire the distance based on coordinate information of the pair of power-side through conductors and ground-side through conductors.

[0158] Furthermore, the input accepting unit 21 performs processing for acquiring the number of connections (the number of units connected in parallel) set by the user.

[0159] In addition, the connection number can be obtained from the number of pairs of power-side through conductors and ground-side through conductors connected in parallel to the same power line, for example.

[0160] In addition, it is preferable that each pair of power supply through conductors and ground through conductors set by the user is located at the intersection of a predetermined grid. This allows the capacitor element with reduced equivalent series resistance (ESR) and equivalent series inductance (ESL) to be arranged.

[0161] More specifically, for example, when the user configures the first power-side through conductor or the ground-side through conductor by means of the input unit 10, a predetermined grid at which the through conductor is located at the intersection is displayed on the display unit 40. Here, the type and spacing of the grid are configured to be set (specified) by the user, and the spacing of the grid is consistent with any one of the multiple predetermined spacings between a pair of power-side through conductors and the ground-side through conductors. Moreover, the second and subsequent power-side through conductors and ground-side through conductors are set to be configured only at other intersections of the grid. At this time, it is preferred that a pair of power-side through conductors and the ground-side through conductors are located at adjacent intersections of the grid, but they may also be located at non-adjacent intersections of the grid.

[0162] Fig.19 1 is a schematic diagram showing an example of a grid and power supply-side through conductors and ground-side through conductors arranged at the intersections thereof.

[0163] exist Fig.19 In the example shown, a square grid is shown, and the power supply side through conductors 71 and the ground side through conductors 72 are arranged in a square shape. In the square arrangement, the power supply side through conductors 71 and the ground side through conductors 72 are arranged at the vertices of the square shape. Fig.19As shown, the power-side through conductors 71 and the ground-side through conductors 72 may be arranged alternately in the up-down direction and the left-right direction.

[0164] Fig. 20 1 is a schematic diagram showing another example of a grid and power supply-side through conductors and ground-side through conductors arranged at the intersections thereof.

[0165] exist Fig. 20 In the example shown, a rhombus-shaped grid (with an internal angle of 60° or 120°) is shown, and the power-side through conductors 71 and the ground-side through conductors 72 are arranged in a hexagonal shape. In the hexagonal arrangement, the power-side through conductors 71 and the ground-side through conductors 72 are arranged at the vertices of the regular hexagon and at the center of the regular hexagon. Fig. 20 As shown in FIG. 1 , the power-side through conductors 71 and the ground-side through conductors 72 may be arranged alternately in the vertical direction.

[0166] In addition, Fig.19 and Fig. 20 In FIG. 1 , the rectangular dotted line surrounding the pair of power supply-side through conductors 71 and the ground-side through conductors 72 is a virtual line indicating a cell region.

[0167] The input receiving unit 21 also obtains information set by the user regarding components other than the unit of the substrate, namely, substrate information. That is, information designed (e.g., drawn) by the user is obtained regarding components other than the unit. As substrate information, for example, information regarding wiring, resin substrate, through-conductors (vias, through holes) not included in the unit, etc. are cited. The information related to wiring includes, for example, the layout (coordinates) of wiring, the conductor thickness of the wiring layer, etc. The information related to the resin substrate includes, for example, the thickness of the resin substrate portion when multi-layering is performed, etc. The information related to the through-conductor not included in the unit includes, for example, the coordinates and dimensions of the through-conductor.

[0168] In addition, the substrate information is input according to the prescribed design rules. That is, the substrate information set by the user is limited to the information that satisfies the design rules. In addition, instead of accepting only the substrate information that complies with the design rules, it is also possible to verify whether the input substrate information satisfies the design rules, and if there is an item that does not satisfy the design rules, an error is notified on the display unit 40 to urge the user to change the item.

[0169] The design rules include various information required for forming a wiring board, such as the conductor thickness of the wiring layer, the L / S rule of the wiring, the conductor amount of the through conductor, and the thickness of the resin substrate portion when multilayering is performed.

[0170] The calculation unit 22 performs the following processing: the circuit information corresponding to the spacing between each pair of power-side through conductors and the ground-side through conductors and the number of connections of the unit obtained by the input receiving unit 21 is obtained from the storage unit 30, and the impedance of the power line is calculated based on the obtained circuit information (unit equivalent circuit and / or parameter). The circuit information corresponding to the spacing can reproduce the unit in which a pair of power-side through conductors and the ground-side through conductors are arranged at the spacing with high accuracy, so the impedance characteristics of the power line can be calculated with high accuracy. In addition, since the circuit information is prepared for each number of connections of the unit, the calculation accuracy of the impedance characteristics of the power line can be further improved.

[0171] More specifically, the calculation unit 22 performs processing for calculating the impedance of the power line based on the substrate information acquired by the input acceptance unit 21 in addition to the circuit information corresponding to the pitch and the number of connections acquired by the input acceptance unit 21 .

[0172] At this time, the calculation unit 22 performs the following processing: based on the acquired circuit information (unit equivalent circuit and / or parameter), the impedance characteristics of the unit are calculated; and based on the acquired substrate information, the impedance characteristics of the substrate (but excluding the unit) are calculated. In addition, the following processing is performed: the impedance characteristics of the two are synthesized, and the impedance characteristics of the entire substrate, in this case, the power line, are calculated in the synthesized state. SPICE (Simulation Program with Integrated Circuit Emphasis: General Integrated Circuit Simulation Program) can be used in these calculation processes.

[0173] The output unit 23 performs processing for causing the display unit 40 to display the impedance of the power line, which is the calculation result obtained by the calculation unit 22 .

[0174] Next, the operation of the substrate design supporting device 1 (the substrate design supporting method performed by the substrate design supporting device 1 ) will be described.

[0175] Fig.21 This is a flowchart for explaining an example of the operation of the substrate design support device according to the first embodiment of the present invention.

[0176] like Fig.21 As shown, first, the input receiving unit 21 acquires the pitch between at least one pair of power side through conductors and ground side through conductors corresponding to any one of a plurality of prescribed pitches, the number of parallel connection connections of the cells, and substrate information via the input unit 10 (step S11).

[0177] Next, the calculation unit 22 performs a process of acquiring circuit information (cell equivalent circuit and / or parameter) corresponding to the pitch and the number of connections acquired in step S11 from the storage unit 30 (step S12 ).

[0178] Next, the calculation unit 22 performs a process of calculating the impedance characteristics of the cell based on the circuit information acquired in step S12 (step S13 ).

[0179] Next, the calculation unit 22 performs a process of calculating the impedance characteristics of the substrate (excluding the cells) based on the substrate information acquired in step S11 (step S14 ).

[0180] In addition, the order of steps S12, S13 and S14 is not particularly limited to this order, and for example, steps S14, S12 and S13 may be performed in the order, or steps S12 and S13 and step S14 may be performed in parallel.

[0181] Next, the calculation unit 22 performs processing to combine the impedance characteristics of the cell calculated in step S13 and the impedance characteristics of the substrate (excluding the cell) calculated in step S14 and calculate the impedance characteristics of the power line in the combined state (step S15).

[0182] Then, the output unit 23 performs processing to cause the display unit 40 to display the impedance of the power line, which is the calculation result obtained by the calculation unit 22 , and the operation of the substrate design support device 1 ends.

[0183] The user can increase or decrease, for example, the number of bypass capacitors, i.e., the number of pairs of power-side through conductors and ground-side through conductors, and the distance between a pair of power-side through conductors and ground-side through conductors based on the impedance of the power line displayed on the display unit 40 .

[0184] As described above, the substrate design support device according to the above-described embodiment can be advantageously used in designing a power supply line to which a bypass capacitor is connected via a plurality of through-conductors.

[0185] In addition, in the above-mentioned embodiment, the case of using the circuit information corresponding to the prescribed spacing between the power supply side through conductor and the ground side through conductor and the number of connections of the unit is described, but the circuit information can be set at least for each prescribed spacing. For example, in addition to the spacing and the number of connections, the circuit information can also be set based on the capacitance of the capacitor element included in the unit, the number of layers of the wiring substrate, etc., or in addition to the spacing, the circuit information can also be set based on the capacitance of the capacitor element included in the unit, the number of layers of the wiring substrate, etc. instead of the number of connections.

[0186] In addition, in the above-mentioned embodiment, the case where the substrate design auxiliary device is configured as one device is described, but it can also be realized by appropriately distributing the functions of the substrate design auxiliary device in a distributed processing system of multiple devices. For example, it is also possible that only information input and operation results are displayed in the terminal device used by the user, and the impedance operation processing based on the circuit information corresponding to the input information is performed in the server device (for example, the cloud). In this case, the circuit information can also be stored in the storage unit of the server device. In addition, for example, the operation processing of the impedance of the unit based on the circuit information and the operation processing of the impedance of the substrate (but excluding the unit) based on the substrate information can also be performed in different devices (terminal device, server device).

[0187] The following contents are disclosed in this specification.

[0188] <1>

[0189] A substrate design assisting device assists in placing a bypass capacitor connected to a power line and a ground line via at least a pair of power-side through conductors and a ground-side through conductor on a wiring substrate, the substrate design assisting device comprising:

[0190] a storage unit storing circuit information for each of a plurality of predetermined pitches between a pair of power-side through conductors and a ground-side through conductor, the circuit information indicating a unit including a pair of power-side through conductors and a ground-side through conductor, and a capacitor element connected between the power-side through conductors and the ground-side through conductor;

[0191] an input receiving unit configured to obtain a spacing between at least one pair of power-side through conductors and ground-side through conductors set by a user and corresponding to any one of the plurality of predetermined spacings; and

[0192] a calculation unit that acquires, from the storage unit, circuit information corresponding to the interval acquired by the input receiving unit, and calculates the impedance of the power line based on the acquired circuit information,

[0193] wherein the circuit information stored in the storage unit includes at least one of an equivalent circuit representing the unit and a parameter corresponding to at least a part of the equivalent circuit representing the unit,

[0194] In the equivalent circuit representing the cell, the equivalent circuit representing the capacitor element includes a capacitance component set according to the corresponding predetermined pitch.

[0195] <2>

[0196] According to the substrate design support device described in <1>,

[0197] The equivalent circuit representing the cell includes an inductance component representing the power supply-side through-conductor and an inductance component representing the ground-side through-conductor that are not set according to the predetermined pitch.

[0198] <3>

[0199] The substrate design assisting device according to <1> or <2>, wherein:

[0200] The equivalent circuit representing the unit includes an equivalent circuit representing the power supply side through conductor and an equivalent circuit representing the ground side through conductor,

[0201] The equivalent circuit of the power supply side through conductor includes a first circuit portion and a second circuit portion connected in series between an input port and an output port,

[0202] The equivalent circuit of the ground through-conductor includes a third circuit section and a fourth circuit section connected in series between the input port and the output port,

[0203] An equivalent circuit representing the capacitor element is connected to a node between the first circuit portion and the second circuit portion and a node between the third circuit portion and the fourth circuit portion.

[0204] <4>

[0205] The substrate design support device according to any one of <1> to <3>, wherein:

[0206] An equivalent circuit representing the capacitor element includes a ladder circuit.

[0207] <5>

[0208] According to the substrate design assisting device described in <4>,

[0209] The ladder circuit includes two or more capacitance components.

[0210] <6>

[0211] The substrate design support device according to any one of <1> to <5>, wherein:

[0212] The unit includes, as the capacitor elements, a first capacitor element and a second capacitor element connected in parallel between the pair of power supply side through conductors and the ground side through conductors,

[0213] the equivalent circuit representing the unit includes a first equivalent circuit representing the first capacitor element and a second equivalent circuit representing the second capacitor element as equivalent circuits representing the capacitor element,

[0214] The first equivalent circuit and the second equivalent circuit are equivalent to each other,

[0215] The first equivalent circuit is connected to a node of the power supply through conductor on the one main surface side of the wiring substrate and a node of the ground through conductor on the one main surface side of the wiring substrate.

[0216] The second equivalent circuit is connected to a node of the power supply-side through conductor on the other main surface side of the wiring substrate and a node of the ground through conductor on the other main surface side of the wiring substrate.

[0217] <7>

[0218] The substrate design support device according to any one of <1> to <6>, wherein:

[0219] The equivalent circuit representing the capacitor element includes an equivalent circuit portion that reaches the capacitance component after passing through the LR circuit.

[0220] <8>

[0221] The substrate design support device according to any one of <1> to <7>, wherein:

[0222] The unit includes, as the capacitor element, 2×n (where n is an integer greater than or equal to 2) capacitor elements connected in parallel between the pair of power-side through conductors and the ground-side through conductors,

[0223] The equivalent circuit representing the unit cell includes 2×n equivalent circuits representing the capacitor elements.

[0224] <9>

[0225] The substrate design support device according to any one of <1> to <8>, wherein:

[0226] Each pair of the power supply-side through conductor and the ground-side through conductor set by the user is located at the intersection of a predetermined grid.

[0227] <10>

[0228] The substrate design support device according to any one of <1> to <9>, wherein:

[0229] The input receiving unit further acquires substrate information, which is information set by a user and is related to components of the substrate other than the unit.

[0230] The calculation unit calculates the impedance of the power line based on the circuit information and the substrate information acquired by the input receiving unit.

[0231] <11>

[0232] The substrate design support device according to any one of <1> to <10>, wherein:

[0233] The storage unit stores circuit information indicating the unit in association with the number of parallel connections of the unit, i.e., the number of connections.

[0234] The input receiving unit further obtains the number of connections set by the user.

[0235] The calculation unit acquires, from the storage unit, circuit information corresponding to the pitch and the number of connections acquired by the input receiving unit, and calculates the impedance of the power line based on the acquired circuit information.

[0236] <12>

[0237] A substrate design support system is provided for supporting placement of a bypass capacitor connected to a power line and a ground line via at least one pair of power-side through conductors and ground-side through conductors on a wiring substrate, the substrate design support system comprising:

[0238] a storage unit storing circuit information for each of a plurality of predetermined pitches between a pair of power-side through conductors and a ground-side through conductor, the circuit information indicating a unit including a pair of power-side through conductors and a ground-side through conductor, and a capacitor element connected between the power-side through conductors and the ground-side through conductor;

[0239] an input receiving unit configured to obtain a spacing between at least one pair of power-side through conductors and ground-side through conductors set by a user and corresponding to any one of the plurality of predetermined spacings; and

[0240] a calculation unit that acquires, from the storage unit, circuit information corresponding to the interval acquired by the input receiving unit, and calculates the impedance of the power line based on the acquired circuit information,

[0241] wherein the circuit information stored in the storage unit includes at least one of an equivalent circuit representing the unit and a parameter corresponding to at least a part of the equivalent circuit representing the unit,

[0242] In the equivalent circuit representing the cell, the equivalent circuit representing the capacitor element includes a capacitance component set according to the corresponding predetermined pitch.

[0243] <13>

[0244] A data structure related to circuit information is used in a substrate design assisting device or a substrate design assisting system, wherein the substrate design assisting device or the substrate design assisting system comprises an input receiving unit, a storage unit, and a computing unit, and performs assistance for arranging a bypass capacitor connected to a power line and a ground line via at least a pair of power side through conductors and a ground side through conductor on a wiring substrate,

[0245] The data structure related to the circuit information is stored in the storage unit,

[0246] The data structure related to the circuit information includes circuit information for each of a plurality of specified intervals between a pair of power-side through conductors and a ground-side through conductor, the circuit information indicating a unit including a pair of power-side through conductors and a ground-side through conductor, and a capacitor element connected between the power-side through conductors and the ground-side through conductor, and,

[0247] The data structure related to the circuit information is used for the following processing: based on the spacing between at least one pair of power-side through conductors and ground-side through conductors set by the user and acquired by the input accepting unit, corresponding to any one of the plurality of prescribed spacings, the computing unit acquires from the storage unit the circuit information corresponding to the spacing acquired by the input accepting unit, and computes the impedance of the power line based on the acquired circuit information,

[0248] The circuit information includes at least one of an equivalent circuit representing the unit and a parameter corresponding to at least a part of the equivalent circuit representing the unit.

[0249] In the equivalent circuit representing the cell, the equivalent circuit representing the capacitor element includes a capacitance component set according to the corresponding predetermined pitch.

[0250] Description of Reference Numerals

[0251] 1: substrate design support device; 10: input unit; 20: control unit; 21: input receiving unit; 22: operation unit; 23: output unit; 30: storage unit; 40: display unit; 50, 80: unit equivalent circuit; 51, 52, 83, 84, 85, 86: node; 60: capacitor equivalent circuit; 61: first terminal; 62: second terminal; 63: first capacitor unit; 64: second capacitor unit; 65: LR circuit; 71: power supply side through conductor; 72: ground side through conductor Conductor; 81: first equivalent circuit; 82: second equivalent circuit; 101: capacitor part; 110: capacitor element; 111: anode plate; 111A: core; 111B: porous part; 112: cathode layer; 113: dielectric layer; 120: through conductor; 120A: cathode through conductor; 120B: anode through conductor; 125A, 125B: resin filling part; 130: sealing layer; 140A, 140B: conductor wiring layer; 145: via conductor.

Claims

1. A substrate design assisting device for assisting in placing a bypass capacitor connected to a power line and a ground line via at least one pair of power-side through conductors and ground-side through conductors on a wiring substrate, the substrate design assisting device comprising: a storage unit storing circuit information for each of a plurality of predetermined pitches between a pair of power-side through conductors and a ground-side through conductor, the circuit information indicating a unit including a pair of power-side through conductors and a ground-side through conductor, and a capacitor element connected between the power-side through conductors and the ground-side through conductor; an input receiving unit configured to obtain a spacing between at least one pair of power-side through conductors and ground-side through conductors set by a user and corresponding to any one of the plurality of predetermined spacings; as well as a calculation unit that acquires, from the storage unit, circuit information corresponding to the interval acquired by the input receiving unit, and calculates the impedance of the power line based on the acquired circuit information, wherein the circuit information stored in the storage unit includes at least one of an equivalent circuit representing the unit and a parameter corresponding to at least a part of the equivalent circuit representing the unit, In the equivalent circuit representing the cell, the equivalent circuit representing the capacitor element includes a capacitance component set according to the corresponding predetermined pitch.

2. The substrate design assisting device according to claim 1, wherein: The equivalent circuit representing the cell includes an inductance component representing the power supply-side through-conductor and an inductance component representing the ground-side through-conductor that are not set according to the predetermined pitch.

3. The substrate design assisting device according to claim 1 or 2, wherein: The equivalent circuit representing the unit includes an equivalent circuit representing the power supply side through conductor and an equivalent circuit representing the ground side through conductor, The equivalent circuit of the power supply side through conductor includes a first circuit portion and a second circuit portion connected in series between an input port and an output port, The equivalent circuit of the ground through-conductor includes a third circuit section and a fourth circuit section connected in series between the input port and the output port, An equivalent circuit representing the capacitor element is connected to a node between the first circuit portion and the second circuit portion and a node between the third circuit portion and the fourth circuit portion.

4. The substrate design assisting device according to any one of claims 1 to 3, wherein: An equivalent circuit representing the capacitor element includes a ladder circuit.

5. The substrate design assisting device according to claim 4, wherein: The ladder circuit includes two or more capacitance components.

6. The substrate design assisting device according to any one of claims 1 to 5, wherein: The unit includes, as the capacitor elements, a first capacitor element and a second capacitor element connected in parallel between the pair of power supply side through conductors and the ground side through conductors, the equivalent circuit representing the unit includes a first equivalent circuit representing the first capacitor element and a second equivalent circuit representing the second capacitor element as equivalent circuits representing the capacitor element, The first equivalent circuit and the second equivalent circuit are equivalent to each other, The first equivalent circuit is connected to a node of the power supply through conductor on the one main surface side of the wiring substrate and a node of the ground through conductor on the one main surface side of the wiring substrate. The second equivalent circuit is connected to a node of the power supply-side through conductor on the other main surface side of the wiring substrate and a node of the ground through conductor on the other main surface side of the wiring substrate.

7. The substrate design assisting device according to any one of claims 1 to 6, wherein: The equivalent circuit representing the capacitor element includes an equivalent circuit portion that reaches the capacitance component after passing through the LR circuit.

8. The substrate design assisting device according to any one of claims 1 to 7, wherein: The unit includes 2×n capacitor elements connected in parallel between the pair of power-side through conductors and the ground-side through conductors as the capacitor elements, wherein n is an integer greater than or equal to 2, The equivalent circuit representing the unit cell includes 2×n equivalent circuits representing the capacitor elements.

9. The substrate design assisting device according to any one of claims 1 to 8, wherein: Each pair of the power supply-side through conductor and the ground-side through conductor set by the user is located at the intersection of a predetermined grid.

10. The substrate design assisting device according to any one of claims 1 to 9, wherein: The input receiving unit further acquires substrate information, which is information set by a user and is related to components of the substrate other than the unit. The calculation unit calculates the impedance of the power line based on the circuit information and the substrate information acquired by the input receiving unit.

11. The substrate design assisting device according to any one of claims 1 to 10, wherein: The storage unit stores circuit information indicating the unit in association with the number of parallel connections of the unit, i.e., the number of connections. The input receiving unit further obtains the number of connections set by the user. The calculation unit acquires, from the storage unit, circuit information corresponding to the pitch and the number of connections acquired by the input receiving unit, and calculates the impedance of the power line based on the acquired circuit information.

12. A substrate design support system for providing support for placing a bypass capacitor connected to a power line and a ground line via at least one pair of power-side through conductors and ground-side through conductors on a wiring substrate, the substrate design support system comprising: a storage unit storing circuit information for each of a plurality of predetermined pitches between a pair of power-side through conductors and a ground-side through conductor, the circuit information indicating a unit including a pair of power-side through conductors and a ground-side through conductor, and a capacitor element connected between the power-side through conductors and the ground-side through conductor; an input receiving unit configured to obtain a spacing between at least one pair of power-side through conductors and ground-side through conductors set by a user and corresponding to any one of the plurality of predetermined spacings; as well as a calculation unit that acquires, from the storage unit, circuit information corresponding to the interval acquired by the input receiving unit, and calculates the impedance of the power line based on the acquired circuit information, wherein the circuit information stored in the storage unit includes at least one of an equivalent circuit representing the unit and a parameter corresponding to at least a part of the equivalent circuit representing the unit, In the equivalent circuit representing the cell, the equivalent circuit representing the capacitor element includes a capacitance component set according to the corresponding predetermined pitch.

13. A data structure related to circuit information, used in a substrate design assistance device or a substrate design assistance system, wherein: The substrate design support device or substrate design support system includes an input receiving unit, a storage unit, and a computing unit, and performs support for arranging a bypass capacitor connected to a power line and a ground line via at least a pair of power-side through conductors and a ground-side through conductor on a wiring substrate. The data structure related to the circuit information is stored in the storage unit, The data structure related to the circuit information includes circuit information for each of a plurality of specified intervals between a pair of power-side through conductors and a ground-side through conductor, the circuit information indicating a unit including a pair of power-side through conductors and a ground-side through conductor, and a capacitor element connected between the power-side through conductors and the ground-side through conductor, and, The data structure related to the circuit information is used for the following processing: based on the spacing between at least one pair of power-side through conductors and ground-side through conductors set by the user and acquired by the input accepting unit, corresponding to any one of the plurality of prescribed spacings, the computing unit acquires from the storage unit the circuit information corresponding to the spacing acquired by the input accepting unit, and computes the impedance of the power line based on the acquired circuit information, The circuit information includes at least one of an equivalent circuit representing the unit and a parameter corresponding to at least a part of the equivalent circuit representing the unit. In the equivalent circuit representing the cell, the equivalent circuit representing the capacitor element includes a capacitance component set according to the corresponding predetermined pitch.

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