Power semiconductor package with dual-side cooling and one-side liquid cooling

Abstract

A power module includes: one or more power switches; a passive heat dissipation element in contact with and facing the first surface of the one or more power switches, the passive heat dissipation element having a first planar surface and a second planar surface; and an active heat dissipation element, the active heat dissipation element being in contact with and facing the second surface of the one or more power switches, wherein the active heat dissipation element is positioned opposite and in thermal contact with the passive heat dissipation element relative to the one or more power switches.

Description

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0002] This application claims the benefit of priority to U.S. non-provisional patent application No. 18 / 162,430 filed on January 31, 2023, which claims the benefit of priority to U.S. Provisional Patent Application No. 63 / 377,486 filed on September 28, 2022, U.S. Provisional Patent Application No. 63 / 377,501 filed on September 28, 2022, U.S. Provisional Patent Application No. 63 / 377,512 filed on September 28, 2022, and U.S. Provisional Patent Application No. 63 / 378,601 filed on October 6, 2022, the entire contents of which are incorporated herein by reference. Technical Field

[0003] Various embodiments of the present disclosure relate generally to power switch cooling, and more particularly to a combination of passive and active cooling systems. Background Art

[0004] Automotive cooling systems typically use one or more heat sinks to dissipate heat from power switching components. Heat sinks provide an efficient way to dissipate heat by conducting the heat into a fluid medium, usually via a thermal interface material (TIM). Generally, a series of individual spring clamps provide the pressure required to compress the TIM over the life of the product.

[0005] The background description provided herein is for the purpose of generally presenting the context of the present disclosure. Unless otherwise indicated herein, the materials described in this section are not prior art to the claims in this application and are not admitted to be prior art or suggestion of prior art by inclusion in this section. Summary of the invention

[0006] In some aspects, the technology described herein relates to a power module comprising: one or more power switching components; a passive heat dissipation element, which contacts and faces a first surface of the one or more power switching components, the passive heat dissipation element having a first planar surface and a second planar surface; and an active heat dissipation element, which contacts and faces a second surface of the one or more power switching components, wherein the active heat dissipation element is positioned opposite to and in thermal contact with the passive heat dissipation element relative to the one or more power switching components.

[0007] In some aspects, the technology described herein relates to a power module in which a passive heat dissipation element is formed without a closure.

[0008] In some aspects, the technology described herein relates to a power module in which each surface of a passive heat dissipation element terminates in free space.

[0009] In some aspects, the technology described herein relates to a power module in which the one or more power switches are mechanically connected to at least one of an active heat dissipation element or a passive heat dissipation element via a clamping force.

[0010] In some aspects, the technology described herein relates to a power module in which the passive heat dissipation element includes a thermally conductive plate.

[0011] In some aspects, the technology described herein relates to a power module wherein a passive heat dissipation element includes a first end and a second end, and wherein the first end and the second end are in thermal contact with an active heat dissipation element.

[0012] In some aspects, the technology described herein relates to a power module wherein the passive heat dissipation element includes a third planar surface on the same plane as the first planar surface, wherein the second planar surface is on a different plane than the first planar surface and connects the first planar surface to the third planar surface.

[0013] In some aspects, the technology described herein relates to a power module that further includes a first curved surface connecting the first planar surface to the second planar surface and a second curved surface connecting the third planar surface to the second planar surface.

[0014] In some aspects, the technology described herein relates to a power module in which the second planar surface is in direct contact with an active heat dissipation element.

[0015] In some aspects, the technology described herein relates to a power module wherein the second planar surface is between a first power switch of the one or more power switches and a second power switch of the one or more power switches.

[0016] In some aspects, the technology described herein relates to a power module further comprising an inlet and an outlet, wherein the active heat dissipation element comprises a closure shaped for a fluid passage, the closure further shaped to receive fluid from the inlet and discharge the fluid via the outlet.

[0017] In some aspects, the technology described herein relates to a power module, wherein the power module is configured for fluid flow only through active heat dissipation elements.

[0018] In some aspects, the technology described herein relates to a method for dissipating heat, the method comprising: generating heat at a power switching element; dissipating at least a portion of the heat generated at the power switching element to a passive heat dissipation element that is in contact with and faces a first surface of the power switching element, wherein each surface of the passive heat dissipation element terminates in free space; and dissipating at least a portion of the heat dissipated to the passive heat dissipation element to an active heat dissipation element via thermal contact between the passive heat dissipation element and an active heat dissipation element that is in contact with and faces a second surface of the power switching element, wherein the active heat dissipation element comprises a fluid passage.

[0019] In some aspects, the technology described herein relates to a method in which a passive heat dissipation element is formed without a closure.

[0020] In some aspects, the technology described herein relates to a method further comprising dissipating at least a portion of the heat dissipated to the active heat dissipation element to a fluid in a fluid passageway.

[0021] In some aspects, the technology described herein relates to a method in which the at least a portion of the heat dissipated from the passive heat dissipation element to the active heat dissipation element is dissipated via one or more contact points thermally connecting the passive heat dissipation element and the active heat dissipation element.

[0022] In some aspects, the technology described herein relates to a power module comprising: a heat-generating electrical component; and a passive heat dissipation element, which contacts and faces a first surface of the heat-generating electrical component, the passive heat dissipation element comprising: a clamping structure; a contact interface; a planar surface, which faces the heat-generating electrical component; a first curved surface, which connects the planar surface to the clamping structure; and a second curved surface, which connects the planar surface to the contact interface, wherein at least one of the clamping structure or the contact interface is in direct contact with the active heat dissipation element.

[0023] In some aspects, the technology described herein relates to a power module in which a passive heat dissipation element is formed without a closure.

[0024] In some aspects, the technology described herein relates to a power module in which the active heat dissipation element is an active heat sink having a fluid passage.

[0025] In some aspects, the technology described herein relates to a power module in which each surface of a passive heat dissipation element terminates in free space.

[0026] Other objects and advantages of the disclosed embodiments will be described in part in the following description, and in part will be obvious from the description, or can be understood by practicing the disclosed embodiments. The objects and advantages of the disclosed embodiments will be realized and achieved by means of the elements and combinations particularly pointed out in the appended claims.

[0027] It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the disclosed embodiments, as claimed. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate various exemplary techniques and, together with the description, serve to explain the principles of the disclosed techniques.

[0029] Figure 1 An exemplary plate assembly cooling system is depicted in accordance with one or more embodiments.

[0030] Figure 2 Depicted is a diagram of a method according to one or more embodiments Figure 1 A cross-sectional view of an exemplary plate assembly cooling system.

[0031] Figure 3 Depicted is a diagram of a method according to one or more embodiments Figure 1 Side view of an exemplary plate assembly cooling system.

[0032] Figure 4 Depicted is a diagram of a method according to one or more embodiments Figure 1 Top view of an exemplary plate-combined cooling system

[0033] Figure 5 Depicted is a cross-sectional view of an exemplary fin-pack cooling system according to one or more embodiments.

[0034] Figure 6 Depicted is a bottom view of an exemplary fin-pack cooling system according to one or more embodiments.

[0035] Figure 7 Depicted is a cross-sectional view of an exemplary fin-pack cooling system in accordance with one or more embodiments.

[0036] Fig. 8A and Figure 8B An exemplary plate-fin combination cooling system is depicted in accordance with one or more embodiments.

[0037] Fig. 9 Depicted is an interior view of an exemplary fin-pack cooling system in accordance with one or more embodiments.

[0038] Fig.10Depicted is a flow diagram directed to dissipating heat using passive heat dissipation elements and active heat dissipation elements in accordance with one or more embodiments.

[0039] Fig.11 Depicted are schematic diagrams for connecting a cooling structure to an electrical component in accordance with one or more embodiments.

[0040] Fig.12 Depicted is a flow chart directed to connecting a cooling structure to an electrical component in accordance with one or more embodiments. DETAILED DESCRIPTION

[0041] The terms used herein may be interpreted in their broadest reasonable manner, although they are being used in conjunction with the detailed description of certain specific examples of the present disclosure. Indeed, certain terms may even be emphasized herein; however, any term intended to be interpreted in any constrained manner will be expressly and specifically so defined in this detailed description. Both the general description and the detailed description are exemplary and explanatory only and do not constrain the claimed features.

[0042] As used herein, the terms "comprises," "comprising," "having," "including," or other variations thereof, are intended to cover a non-exclusive inclusion such that a process, method, article, or apparatus that includes a list of elements includes not only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. In the present disclosure, relative terms such as, for example, "about," "substantially," "entirely," and "approximately" are used to indicate possible ±10% variations in the stated values. The term "exemplary" is used in the sense of "example" rather than "ideal." As used herein, the singular forms "a," "an," and "the" include plural references unless the context indicates otherwise.

[0043] An electronic device cooling system may include two active heat sinks on either side (e.g., opposite top and bottom sides) of one or more electrical components (such as power switching components). An active heat sink may be a heat sink having a component (e.g., fins or compartments) through which a coolant material flows. For simplicity, the present disclosure refers to the electrical component as a power switching component, but it will be understood that the technology disclosed herein is applicable to any electrical component (e.g., a power switching component, a chip, a chip component, a controller, etc.) that can generate heat. The two active heat sinks may provide heat dissipation by: drawing heat away from the one or more power switching components and toward the surface area of ​​the power switching component, and further toward the active heat sink that is in direct or indirect contact with a cooling medium (e.g., coolant or air) associated with the active heat sink. As discussed herein, the benefits of using a passive cooling structure include reduced risk of coolant leakage (e.g., leakage onto a power switching component), reduced or controlled thermal resistance, reduced complexity, etc. Therefore, it may be desirable to improve cooling system functionality, for example, by using a combination of active cooling (e.g., via an active heat sink) and passive cooling, alternative active cooling structures, etc.

[0044] According to an example implementation, the cooling system may include a combination of active and passive cooling systems. For example, the cooling system may include an active cooling system (e.g., an active heat sink) and a passive cooling system (e.g., a passive heat sink with a thermally conductive cooling structure). The thermally conductive cooling structure may include a plate of thermally conductive material, as described in more detail below. The passive heat sink (e.g., a thermally conductive cooling structure) may contact both the active heat sink and the power switch. The passive heat sink (e.g., a thermally conductive cooling structure) may be configured to dissipate heat away from the power switch and toward the active heat sink.

[0045] According to another example implementation, the cooling system may include a fin structure. The fin structure may include fins sintered to one side of each individual power switch and may be sealed against the power switch housing. The fin structure may be an active cooling system and may be combined with another active cooling system (e.g., an active heat sink) or a passive heat sink (e.g., a thermally conductive cooling structure). In some implementations, the fin structure may be in direct physical and / or thermal contact with the cooling structure (e.g., an active heat sink or a thermally conductive cooling structure) and each power switch substrate of the power module.

[0046] Figure 1An exemplary combined cooling system 100 according to one or more embodiments is depicted. The combined cooling system 100 may include one or more power switching elements 105 (collectively referred to as power switching elements 105), an active heat sink 110 (which may be a single active heat sink or a combination of adjacent and / or attached heat sinks), and a passive heat sink 115 (which may be a single component or a combination of adjacent and / or attached components). The active heat sink 110 may be an active cooling solution, and the passive heat sink 115 may be a passive cooling solution. For example, the active heat sink 110 may actively dissipate heat to a coolant medium, while the passive heat sink 115 may dissipate some or all of the heat to the active heat sink 110 or another heat dissipation component. As further discussed herein, the heat dissipated from the power switching element 105 may be dissipated via both the active heat sink 110 and the passive heat sink 115. The passive heat sink 115 may passively transfer heat to the active heat sink 110 via one or more contacts with the active heat sink 110, as further discussed below. According to embodiments of the disclosed subject matter, both active and passive cooling may be achieved by using the passive heat sink 115 and the active heat sink 110 disclosed herein.

[0047] The power switch 105 may include, for example, an approximately 400 volt or 800 volt silicon carbide inverter for an electrified vehicle, although other suitable structures and components are also contemplated. The power switch 105 may include one or more silicon carbide (SiC)-based power switches that provide, for example, relatively high power density and efficiency required to extend battery range and performance. The power switch 105 may include circuits and components configured to convert direct current (DC) from an electric vehicle battery into alternating current (AC) current, which may be utilized, for example, in an electric motor driving a propulsion system. The power switch 105 may be mounted on one or more power board assemblies. The power board assembly may include one or more power switches 105 (e.g., six power switches 105), one or more active heat sinks 110, one or more passive cooling structures or cooling jackets, and / or mechanical components for ensuring the mechanical integrity of the power module assembly. The power board assembly may include an array of electronic packages and input / output (I / O) devices disposed on a circuit board. The one or more power switches 105 may be of any suitable form (eg, electronic power switches) having any suitable configuration (eg, single pole single throw).

[0048] The power switch 105 may be disposed in or between one or more surfaces that may form a housing for the power switch. For example, the one or more power switches 105 may be disposed in a housing having a first surface and a second surface, the first surface including or facing an active heat sink 110, and the second surface including or facing a passive heat sink 115. The power switch 105 may be thermally and / or mechanically contacted with the surface of the active heat sink 110 and / or the surface of the passive heat sink 115 via any suitable means. These connections may allow for various assembly conditions. For example, the power switch 105 may be adhered to the one or more surfaces using welding or sintering, or the power switch may be attached using any mechanical or adhesive component (such as a clamp, a spring pressure component, etc.). The power switch 105 may mechanically contact the active heat sink 110, the passive heat sink 115, or both the active heat sink 110 and the passive heat sink 115. The contact may enable the heat generated from the operation of the power switch 105 to be dissipated across the active heat sink 110 and / or the passive heat sink 115, as described in more detail below.

[0049] A passive cooling system (e.g., passive heat sink 115) can be different from an active cooling system (e.g., active heat sink 110) such that the passive cooling system does not dissipate heat directly via a coolant (e.g., a fluid or air). Thus, in some embodiments, no portion of the passive cooling structure is in direct contact with the coolant. Instead, the passive cooling system can include, for example, a uniform conductive surface covering (e.g., partially or completely covering) or facing at least one surface of the power switch 105. The uniform conductive surface can be substantially parallel to the at least one surface of the power switch 105. Each power switch 105 can be associated with a corresponding uniform conductive surface of the passive cooling component, such as Figure 1 As shown. The surface of the power switching element 105 may be in contact with the uniform conductive surface of the passive cooling system. Further, considering that the passive cooling system (e.g., a passive heat sink) may not directly contact the coolant, the shape of the cooling system including one or more thermal conductive cooling systems may be customizable. For example, an active cooling system may be designed to have a coolant medium passing through a portion of the active cooling structure. Passive cooling structures may allow design flexibility because their design may not be limited by coolant flow considerations. Therefore, compared to active cooling systems, passive cooling systems can provide greater flexibility in components, size and / or location.

[0050] Figure 2 A cross-sectional view of an exemplary combined active and passive cooling system 100 is depicted. Figure 2As shown in more detail, the active heat sink 110 can provide a thermal interface for the power switch 105 so that heat radiated from the power switch 105 is dissipated via the active heat sink 110 (e.g., directly or via a passive heat sink 115, as further discussed herein). The active heat sink 110 may include multiple components. The material of the active heat sink 110 may be selected based on the applicable thermal properties for cooling the power switch 105. For example, the active heat sink 110 may include copper, aluminum alloys, other conductive materials, etc., or a combination thereof. In some embodiments, the active heat sink 110 may be similar in operation to a radiator used in an internal combustion engine. The active heat sink 110 may be configured to have one or more coolant channels 110A. The one or more coolant channels 110A may be used to disperse a coolant (e.g., a fluid or air) to the active heat sink 110. Further, a power module seal may be disposed between the one or more coolant channels 110A and the power switch 105 to prevent leakage. The active heat sink 110 may include an inlet ( Figure 2 not shown) and the outlet ( Figure 2 (not shown). The inlet and outlet may each extend through the base plate. The inlet and outlet may be configured to facilitate circulation of the coolant through the one or more coolant channels 110A. Figure 2 As shown, the active heat sink 110 may be mounted on an opposite side (eg, top side or bottom side) of the power switch 105 relative to the passive heat sink 115 .

[0051] Thus, the active heat sink 110 can dissipate heat generated at the power switching element 105 (e.g., via the coolant channel 110A). The passive heat sink 115 can be mounted on a side of the power switching element 105 opposite to the active heat sink 110 and can be in direct physical and thermal contact with the active heat sink 110. The passive heat sink 115 can include any material suitable for conducting and / or dissipating heat, including but not limited to copper, aluminum, etc., or a combination thereof. At least a portion of the passive heat sink 115 can be in direct contact with the active heat sink 110, so that there is no intervening structure between the passive heat sink 115 and the active heat sink 110. Therefore, the heat from the power switching element 105 can be dissipated via the passive heat sink 115, and can be further transferred to the active heat sink 110 for further dissipation. An active heat sink including only one surface facing the power switch 105 (e.g., such that the opposing surface of the power switch 105 faces the passive cooling system) can reduce the risk of leaks (e.g., coolant leaks) and can reduce costs associated with the production and / or maintenance of the device when compared to having two active heat sinks on opposing sides of the power switch 105.

[0052] The active heat sink 110 may include one or more fins 130 extending into a coolant medium (e.g., air, refrigerant, water, oil, etc.). The one or more fins 130 may be used to form a coolant channel 110A. The one or more fins 130 may be configured to have a high surface area to maximize heat dissipation into the coolant medium. The one or more fins 130 may have any suitable configuration, including but not limited to fins (e.g., cylindrical), straight fins, trumpet fins, etc. The one or more fins 130 may be made of any suitable material or combination of materials (such as copper, aluminum alloy, or a combination thereof). The coolant medium may flow through the active heat sink 110 and around the one or more fins 130. According to an embodiment, the one or more fins may extend vertically away from the surface of the power switching element 105 facing the active heat sink 110.

[0053] like Figure 2 As shown, the one or more fins 130 may extend outwardly from the power switch 105 and terminate or be positioned within the heat sink fin compartment. In one embodiment, the power switch 105 may be located on or adjacent to a surface of the heat sink fin compartment. The weight of the power switch 105 may be structurally supported at least in part by the heat sink fin compartment or active heat sink 110. A modular approach may be taken by forming a heat sink fin compartment that may be sealed or welded to the main heat sink compartment.

[0054] The heat sink fin compartment may include or be connected to a seal at the point where the heat sink fin compartment is connected to the housing or other component of the active heat sink 110. The seal may include any suitable material (e.g., high polymer vinyl methyl polysiloxane (silicone), rubber, neoprene, nitrile, ethylene-propylene diene monomer (EPDM), fluorocarbon, etc.) or configuration (e.g., O-ring gasket, manifold seal, labyrinth seal, plate or sheet, elastomeric seal, etc.). In some embodiments, the one or more fins 130 may extend away from the power switch 105, etc. Such a configuration may form a seal around the fin 130 to prevent the coolant medium of the heat sink fin compartment from leaking or escaping.

[0055] Figure 3 Depicted Figure 1 A side view of an exemplary combined cooling system 100 is provided, and Figure 4 Depicted Figure 1 A top view of an exemplary combined cooling system 100 is shown. Figure 3 and Figure 4 As depicted in , the passive heat sink 115 can be configured to mechanically contact the one or more power switches 105 and the active heat sink 110. For example, Figure 3As shown, surface 115D may contact the power switch 105, and one or more contact surfaces (such as clamping structure 120 and / or contact interface 125) may contact the active heat sink 110 and / or a conductive component in direct contact with the active heat sink 110. According to an embodiment, a thermal interface material (TIM) may be positioned between one or more contact surfaces (such as clamping structure 120 and / or contact interface 125) and the active heat sink 110 and / or a conductive component in direct contact with the active heat sink 110. Heat may be dissipated from the surface of the power switch 105 facing surface 115D to the passive heat sink 115. Heat from the passive heat sink 115 may be dissipated from the passive heat sink 115 to the active heat sink 110 via the clamping structure 120 and / or contact interface 125. The passive heat sink 115 may include one or more components (e.g., single or multiple copper or other conductive material pieces) that, when combined or connected together, form a continuous or continuous passive heat sink 115. For example, a single component passive heat sink 115 may extend across multiple power switches 105. Alternatively, for example, multiple segments of the passive heat sink 115 may extend across respective power switches 105 and may be joined or connected to each other segment.

[0056] Figure 3 At least one cross-section of the power switch 105 is shown surrounded by the passive heat sink 115 and the active heat sink 110. Thus, heat dissipated by the power switch 105 may be dissipated by the passive heat sink 115 and / or the active heat sink 110.

[0057] like Figure 1 , Figure 2 and Figure 3 As shown, the passive heat sink 115 may include a planar portion 115A on a first plane, which may be connected to a corresponding clamping structure 120 and / or a contact interface 125 via a bent portion 115B. Different planar portions 115A may be on the same plane. The planar portion 115A may be on a first plane, and the clamping structure 120 and / or the contact interface 125 may be on a second plane. The first plane may be substantially above or above the plane of the surface of the power switching element 105 facing the passive heat sink 115. The second plane may be substantially below or parallel to the plane of the surface of the power switching element 105 facing away from the passive heat sink 115.

[0058] like Figure 3As shown, the active heat sink 110 may cover one surface of the power switch 105. The passive heat sink 115 may cover other surfaces of the power switch 105. As shown, the surface 115D of the planar portion 115A of the passive heat sink 115 may cover at least a portion of the surface of the power switch 105 facing the passive heat sink 115. The planar portion 115A is coupled to the clamping structure 120 and / or the contact interface 125 and / or the curved portion 115B including the clamping structure and / or the contact interface may cover one or more surfaces of the power switch 105.

[0059] The TIM may be disposed at a point where heat is dissipated between one or more components of the power module. Figure 3 As shown, TIM 111A may be disposed between the clamping structure 120 and the active heat sink 110, TIM 111B may be disposed between the passive heat sink 115 and the power switch 105, TIM 111C may be disposed between the power switch 105 and the active heat sink 110, and TIM 111D may be disposed between the contact interface 125 and the active heat sink 110. Figure 3 As shown, the passive heat sink 115 can be connected to the active heat sink 110 at sintering / welding points 112A (e.g., to connect the clamping structure 120 to the active heat sink 110) and / or connected to the active heat sink at sintering / welding points 112B (e.g., to connect the contact interface 125 to the active heat sink 110).

[0060] Figure 4 A top view of a passive heat sink 115 is shown, wherein at least a portion of the one or more power switches 105 extends outwardly beyond the passive heat sink 115. For example, one or more connection features 116 of the one or more power switches may extend outwardly and not directly contact the passive heat sink 115 and / or the active heat sink 110. Figure 4, the exterior of the passive heat sink 115 may terminate at either end of the cooling system and be connected to the active heat sink 110 via one or more clamping structures 120. The passive heat sink 115 may be bent or flexed to surround the power switch 105 (e.g., on three sides) and connect the passive heat sink 115 to the active heat sink 110 via one or more contact interfaces 125. The bends or flexures in the passive heat sink 115 may increase the amount of surface area in contact between the passive heat sink 115 and the active heat sink 110 (e.g., via the one or more contact interfaces 125) and / or between the passive heat sink 115 and the power switch 105. The one or more contact interfaces 125 may form a planar surface along the active heat sink 110. According to an embodiment, the passive heat sink 115 may include an amount of contact interfaces 125 that is proportional to the overall size of the cooling system 100, the amount of heat dissipated by the power switch 105, etc. For example, the surface area of ​​the one or more contact interfaces may be proportional to the average amount of heat dissipated by the power switch.

[0061] The passive heat sink 115 may be in a bent or curved configuration such that portions of the passive heat sink 115 (e.g., via a clamping structure 120 and / or a contact interface 125) contact the active heat sink 110 at either / both ends of the power switch 105. Portions of the passive heat sink 115 may mechanically and / or thermally contact the power switch 105. Portions of the passive heat sink 115 may mechanically and / or thermally contact the active heat sink 110. The use of the clamping structure 120 and / or the contact interface 125 may provide multiple thermal paths to an active cooling system (e.g., via the active heat sink 110) and / or a coolant. In some embodiments, the passive heat sink 115 may be mechanically connected directly to the active heat sink 110 using the clamping structure 120 (e.g., via a spring clamp, sintering, welding, or other connection mechanism). According to an embodiment, connecting the active heat sink 110 and the passive heat sink 115 via a spring loading system can distribute forces across the passive heat sink 115, thereby better strengthening the connection between the structures and applying a clamping force to the power switch 105. The passive heat sink 115 can mechanically and / or thermally contact the power switch 105 via a planar surface of the power switch 105 (e.g., via a TIM), and can mechanically and / or thermally contact the active heat sink 110 via one or more clamping structures 120 and / or contact interfaces 125. The one or more clamping structures 120 and / or contact interfaces 125 can be configured as a planar surface that can extend along the planar surface of the active heat sink 110. The one or more contact interfaces 125 can be attached or connected to the active heat sink 110 via any suitable method (e.g., laser welding, clamping force, spring loading, etc.). The strength of the attachment or connection between the one or more interfaces 125 and the active heat sink 110 and / or between the passive heat sink 115 and the one or more power switches 105 can exceed the strength or connection of a brazed copper fluid carrying structure. Thus, the passive heat sink 115 may create a rigid structure that facilitates clamping and distribution of forces across the plurality of power switches 105 .

[0062] Passive cooling structures, such as passive heat sink 115, may be formed without enclosures. As discussed herein, without enclosures may refer to structures that do not include chambers or fluid pathways. For example, as disclosed herein, active heat sink 110 includes a fluid pathway chamber for fluid flow. Passive cooling structures may not include chambers or other enclosures such that fluid cannot flow through the passive cooling structure. Passive cooling structures may be formed such that each surface of the passive heat dissipation element terminates in free space. For example, as disclosed herein, Figures 1 to 4As shown, each surface of the passive heat sink 115 may be non-overlapping such that no chamber or passage is formed by connecting one portion of the passive heat sink 115 to another portion of the passive heat sink 115. It will be appreciated that, although each surface of the passive heat sink 115 terminates in free space, one or more portions of the passive heat sink 115 may be in contact with other components (e.g., the active heat sink 110) or may be otherwise connected to other components. For example, Figure 3 As shown, the passive heat sink 115 may contact the active heat sink 110 at the clamping structure 120 and / or the contact interface 125. Thus, each surface of the passive heat dissipation element may terminate in free space, and one or more portions of the passive heat dissipation element that terminate in free space may be in direct and / or thermal contact with one or more other components (e.g., the active heat sink 110).

[0063] There may be a relationship between the heat transferred from the power switch 105 to the passive heat sink 115 (e.g., described by Fournier's law or any other applicable transformation, algorithm, etc.). In other words, the passive heat sink 115 may be configured to dissipate heat from the power switch 105 in a linear or nonlinear manner. Depending on the specific implementation, the configuration of the active heat sink 110 and the passive heat sink 115 may be sufficient to meet the heat dissipation requirements for the power switch 105 operating below the threshold current. For example, the threshold current may be about 500 amperes or less, about 450 amperes, about 400 amperes, etc.

[0064] Although the passive heat sink 115 is shown with the active heat sink 110 below the power switch 105 and the passive heat sink 115, it will be understood that the components may be in any suitable configuration. For example, in some embodiments, the active heat sink 110 may be configured to be located above the power switch 105 and below the passive heat sink 115. Figure 2 The configuration shown is on the opposite side of the radiator (eg, such that the active radiator 110 and the passive radiator 115 are swapped). In another example, the component can be configured to be mounted in a vertical or angled orientation (eg, to an engine or vehicle component).

[0065] By adding a passive heat sink (e.g., a thermally conductive structure) instead of an active second heat sink that actively flows coolant through it, production and / or maintenance costs can be significantly reduced. Further, because the coolant passes through a single heat sink, the risk of coolant leakage can be reduced compared to when the coolant passes through multiple heat sinks. The passive heat sink 115 can further provide structural support to the device based on its rigid form and can be configured to distribute pressure more evenly than the active heat sink 110. For example, a passive heat sink can have greater rigidity (e.g., based on material properties, configuration, and / or one or more continuous portions) than an active heat sink. A passive heat sink can experience reduced deformation compared to a heat sink composed of soft annealed copper.

[0066] In some embodiments, instead of one or more active heat sinks 110, the one or more fins may be adhered (e.g., sintered) to a base plate (such as a direct bonded copper structure disposed between the fins and the power switch 105). In this way, the power switch 105 may be in the direct thermal path of the coolant flow to minimize the thermal resistance of the system. Any suitable number of fins may be adhered to the base plate, for example, approximately 200 fins per power switch 105. The number and placement of the fins 130 may be optimized to ensure proper flow characteristics and sintering capabilities.

[0067] According to an embodiment of the disclosed subject matter, a fin system can be used for active cooling of electronic components, such as power switches 105 . Figure 5 A cross-sectional view of an exemplary cooling system 500 is depicted, which may include one or more power switches 105 (collectively referred to herein as power switches 105), an active heat sink 110, and a fin system 131. As shown, the one or more power switches 105 may be disposed between one or more surfaces. For example, the one or more power switches 105 may be disposed within a housing. A first surface of the power switch 105 may face and / or be attached to an active heat sink 110 or a passive cooling structure ( Figure 5 ), and a second surface (e.g., an opposing surface) of the power switch 105 may face and / or be attached to the fin system 131. The power switch 105 may thermally and / or mechanically contact (e.g., adhered to, attached to, connected to, etc.) a surface of the active heat sink 110, a passive cooling structure (e.g., a passive heat sink 115), and / or a surface of the fin system 131 via any suitable means. For example, the one or more power switches 105 may be adhered to the one or more surfaces using welding or sintering, as described in more detail below. The contact may allow heat generated from the operation of the one or more power switches 105 to be dissipated across the active heat sink 110, the passive cooling structure, and / or the fin system 131, as described in more detail below.

[0068] Unlike the continuous fins of some active heat sinks, the fins of the fin system 131 can be discrete, such that each fin of the fin system 131 can be separated from each other fin of the fin system 131. Therefore, the fins of the fin system 131 can be connected through a base plate so that all surfaces of the fins are exposed except for a single surface of each fin at the base plate. In addition, the fins of the active heat sink can extend substantially the length of one surface of the active heat sink. The discrete fins of the fin system 131 may not extend the length of the surface of the heat sink, but may extend approximately less than 20%, less than 15%, less than 10%, less than 5%, less than 3%, etc. of the length of the surface of the heat sink. In addition, as discussed herein, the discrete fins of the fin system 131 can be directly connected to a base plate attached to the power switch 105, such as via sintering or welding.

[0069] Fin system 131 (e.g., Figure 5 and Figure 8B ) may be positioned in a fin housing 145, which includes Fig. 8A The fin housing base 145A and casting 145B are shown. The fin system 131 may include a plurality of fins (e.g., rods) extending away from the power switch 105 toward the fin housing base 145A. The power switch 105 may be sealed isolated from the fin system 131 so that the coolant (e.g., a fluid passing through the fluid passage formed between the fin system 131 and the fin housing 145) does not leak into the power switch 105. For example, the power switch 105 may be sealed isolated from the fin system 131 via an elastic seal (e.g., where the elastic seal connects the casting 145B to the fin housing base 145A). The fin housing base 145A may include a surface facing the fin system 131. The fin housing base 145A and the casting 145B may form a chamber through which the coolant may flow. The casting may be connected to or contact an external surface of the power switch 105 (e.g., via the base plate 119 or other components). The fin housing 145 may include one or more protrusions, as shown in FIG. Fig. 8A and Figure 8BFurther discussed, the one or more protrusions friction stir weld the outer surface of the power switch 105 to the casting. Friction stir welding can generate sufficient friction to seal the power switch 105 to the fin housing 145 to prevent coolant leakage. The fin housing 145 may include one or more protrusions that epoxy the outer surface of the power switch 105 to the casting. The epoxy attachment can provide a sufficient seal to connect the power switch 105 to the fin housing 145 to prevent coolant leakage. The fin housing 145 (e.g., via the casting 145B) can be sealingly attached to the power switch via friction stir welding the fin housing 145 to the outer surface of the power switch 105 (e.g., with or without the protrusions). The fin housing 145 (e.g., via the casting 145B) can be sealingly attached to the power switch via epoxy attaching the fin housing 145 to the outer surface of the power switch 105 (e.g., with or without the protrusions). Thus, the exterior surface of the power switch 105 , the casting 145B, and the fin housing base 145A may form a chamber through which a coolant medium flows to dissipate heat away from the fin system 131 .

[0070] Figure 6 Depicted is a bottom view of an exemplary fin assembly cooling system. Figure 6 As depicted in , the active heat sink 110 may include an inlet 150a and an outlet 150b. The inlet 150a and the outlet 150b may be on opposite sides of the active heat sink 110. The inlet 150a and the outlet 150b may extend through the base plate 140 so that the fluid is received via the inlet 150a and discharged through the outlet 150b for fluid flow through the active heat sink 110. The one or more fin systems 131 may be configured to have one or more coolant channels through the fin system 131. This embodiment may include a single active heat sink 110, which is mounted on the opposite side of the power switch 105 relative to the fin system 131. Therefore, heat can be actively dissipated via both the active heat sink 110 and the fin system 131. Including only one active heat sink can reduce the risk of leakage (e.g., coolant leakage) and can reduce costs associated with production and / or maintenance.

[0071] Alternatively, a passive cooling component (eg, passive heat sink 115) may be positioned facing a surface of power switch 105, as described below with reference to Fig. 8A and Figure 8BThe passive cooling structure may passively dissipate heat (e.g., in the absence of a coolant medium) and / or may transfer heat to the fin system 131 via one or more contacts of the fin system, as further discussed herein. Thus, a passive cooling system (e.g., passive heat sink 115) may be in contact with the fin system 131 via a direct or indirect connection. Heat may be dissipated from the passive cooling system to the fin system 131 in a manner similar to that discussed above with respect to dissipating heat from the passive cooling system to the active heat sink 110.

[0072] Figure 7 A cross-sectional view of an exemplary fin assembly cooling system 500 is depicted. The fin system 131 may include one or more fins 132 that may extend into a coolant medium (eg, air, refrigerant, water, oil, etc.), such as Figure 7 As depicted in . It will be understood that, although fins having a cylindrical configuration are shown, the fins may have any applicable shape, such as, for example, pin-shaped, wavy, rectangular or oblong, etc. The one or more fins 132 may be configured to have a surface area that maximizes heat dissipation into the coolant medium and / or facilitates coolant flow. The one or more fins 132 may include a first external surface (as further described herein) in contact with the base plate 119, so that each other external surface of the corresponding fin is a floating surface. The external surface may be any exposed surface of the fin (e.g., exposed to air or coolant). The floating surface may not be mechanically or electrically connected to any other component and may float in free space (e.g., so that each other surface except the first surface may be configured to extend into the coolant material and / or dissipate heat via contact with the coolant material). The one or more fins 132 may include any suitable material or material combination, such as copper, aluminum alloy, or any other conductive material, or a combination thereof. The coolant medium may flow through the fin system 131 and around the one or more fins 132.

[0073] One or more fins 132 may be mechanically adhered and / or directly connected to one or more power switching elements 105. For example, the fins 132 may be connected to a base plate 119 that contacts the one or more power switching elements 105. In another example, one or more fins 132 may be directly welded, sintered, etc. to a separate power switching element 105. In another example, the one or more fins 132 may be adhered and / or connected (e.g., welded, sintered, etc.) to a direct bonded copper structure that is disposed between the fins 132 and the power switching element 105. In this way, the power switching element 105 may be in a direct path of coolant flow through the fins 132 to minimize its thermal resistance. Any suitable number of fins 132 may be adhered to the power switching element 105, for example, approximately 200 fins 132 per power switching element 105. The number and placement of the fins 132 may be optimized to ensure proper flow characteristics and sintering capabilities.

[0074] Fig. 8A and Figure 8B An exemplary fin cooling system 800 is depicted. One or more fins 132 may extend outwardly from the power switch 105 into the fin housing 145, such as Fig. 8A and Figure 8B In one embodiment, the power switch 105 may be attached to or against a surface of the fin housing 145, and its weight may be at least partially structurally supported by the fin housing 145. The fin housing 145 may be modular and may include one or more modular components that may be combined (e.g., packaged) together. For example, the modular components of the fin housing 145 may be combined in a structural carrier (such as a die casting) that may be sealed or welded to the main housing.

[0075] Fig. 8A depicts a perspective view of the fin housing 145, and Figure 8B A cross-sectional view of the fin housing 145 is depicted. In some embodiments, the fin housing 145 may include a seal that contacts one or more power switches 105. For example, the base of the fin housing 145 may include a die casting, as described above, to form three walls. The base plate 119 (e.g., Fig. 9 The power switch 105 may be positioned on the base plate 119, as shown in FIG. Fig. 8A The fins 132 may be connected to the base plate 119 . This structure may provide heat dissipation away from the power switch 105 while preventing fluid from leaking or escaping the fin housing 145 .

[0076] In some embodiments, the fin housing 145 may include a seal at one or more points where the base plate 119 is connected to the fin housing 145. In some embodiments, one or more seals may surround the base plate 119 connected to the power switch 105 to prevent coolant from entering the power switch 105. The seal may include any suitable material (e.g., high polymer vinyl methyl polysiloxane (silicone), rubber, neoprene, nitrile, ethylene-propylene diene monomer (EPDM), fluorocarbon, etc.) or configuration (e.g., O-ring gasket, manifold seal, labyrinth seal, etc.). One or more protrusions 142 may extend from the fin housing 145 in a direction facing the power switch 105 to provide friction stir welding or epoxy resin attachment to the casting to form a coolant seal.

[0077] Fig. 9 800. In some embodiments, the one or more fins 132 may be sealed within a fin housing 145 ( Fig. 9 ) and / or against the power switch 105 (eg, via the base plate 119), such as Fig. 9 The sealing substrate may be positioned between the power switch 105 and the base plate 119 and may include one or more plates or sheets of sealing material such as silicone, neoprene, EPDM, etc.

[0078] The use of the fin system 131 as disclosed herein in place of a heat sink (e.g., a single or dual heat sink configuration) can reduce cost and complexity. In some embodiments, cost and complexity can be further reduced by using a passive cooling structure (e.g., a passive heat sink 115) with the fin system 131, such as Fig. 8A and Figure 8B . An active and passive combined cooling system including, for example, a passive heat sink 115 and a fin system 131 may provide even lower cost per product and reduced risk of leakage. Additionally, the passive heat sink 115 may further provide additional structural stability and / or force dispersion across a given structure, as discussed herein.

[0079] Although the cooling system is generally discussed herein as having a passive heat sink 115 or an active heat sink 110 opposite the fin system 131, it should be understood that the components may be in any suitable configuration. For example, in some embodiments, the passive heat sink 115 or the active heat sink 110 may be configured to be on the opposite side of the power switch 105 compared to that discussed above (e.g., such that the fin system 131 and the passive heat sink 115 or the active heat sink 110 are swapped). In another example, the device may be configured such that the components may be in a vertical or angled orientation.

[0080] Fig.10A flow chart for dissipating heat using passive heat dissipation elements and active heat dissipation elements as discussed herein is depicted. At step 1002, heat may be generated at an electrical component (such as a power switch 105). Heat may be generated based on the use of the electrical component (e.g., to convert power, to generate power or signals, to transfer power or signals, etc.). At step 1004, at least a portion of the heat generated at the electrical component may be dissipated to a passive heat dissipation element (e.g., a passive heat sink 115). The heat may be dissipated via a TIM and / or other thermal connections between the electrical component and the passive heat dissipation element. As disclosed herein, the passive heat dissipation element may not include a fluid passage and / or may not provide other coolant-based dissipation. The passive heat dissipation element may be shaped so that each surface of the passive heat dissipation element terminates in free space, as discussed herein.

[0081] At step 1006, at least a portion of the heat received at the passive heat dissipation element may be further dissipated to an active heat dissipation element (e.g., active heat sink 110). According to the techniques disclosed herein, heat may be dissipated from a passive heat dissipation element to an active heat dissipation element. At step 1008, at least a portion of the heat received at the active heat dissipation element may be further dissipated via a fluid. The fluid may flow through a fluid passage of the active heat dissipation element.

[0082] Fig.11 Techniques for connecting (e.g., sintering and / or welding) cooling structures to one or more power switches 105 are depicted. In various embodiments, as disclosed herein, one or more power module components or devices can be configured for dual-sided active cooling (e.g., using two active heat sinks 110), active and passive cooling (e.g., using an active heat sink 110 and a passive heat sink 115), or single-sided cooling (e.g., using only an active heat sink 110), as disclosed herein. A sinter to base and / or sinter on top process can be implemented to connect the power switch to one or more cooling structures, as further discussed herein. The complete assembly (e.g., the power switch 105 assembly and one or more cooling structures) can be placed into a lower casting (e.g., a base plate 140, as disclosed herein). Figure 7 140). The complete assembly may be adhered to a lower casting (e.g., base plate 140). Alternatively or in addition, the complete assembly or a portion thereof may be connected to the casting in any applicable manner (such as friction stir welding, epoxy attachment of the complete assembly or a portion thereof to the casting, etc.). The complete assembly may be connected to the casting using a TIM, one or more seals 121, or any other applicable technique. Such connections (e.g., via sintering or welding) may provide improved thermal resistance for one or more power switches 105.

[0083] like Fig.11As shown, the base substrate 162 may include a top substrate 162a, a connecting material 162b (e.g., silicon nitride (SiN)), and a bottom substrate 162c. The top substrate 162a and the bottom substrate 162c may be formed of a conductive material such as copper, double bonded copper (DBC), etc. The connecting material 162b may be sandwiched between the top substrate 162a and the bottom substrate 162c and may be thermodynamically stable. Fig.12 Describes the following areas: Fig.11 Flowchart of steps for a technique for connecting (e.g., sintering or welding) one or more cooling structures to one or more power switches 105. At step 1202, the base plate 119 of the fin system 131 may be sintered to the base substrate 162. The base plate 119 may be sintered to the base substrate 162 at one or more points such that the base plate 119 is sealingly secured to the base substrate 162. The base plate 119 may be sintered to the base substrate 162 via a sintering layer 174 (e.g., a sintered film, a segmented sintered film, a sintered strip, a sintered portion, etc.).

[0084] exist Fig.12 At step 1204, one or more components (e.g., drain, die, lead frame, etc.) associated with the power switch 105 may be sintered or soldered to the top substrate 162a of the base substrate 162 and / or one or more other components of the power switch 105. The one or more components associated with the power switch 105 may be sintered to the top substrate 162a of the base substrate 162 via a sintering layer 176 (e.g., a sintering film, a segmented sintering film, a sintering strip, a sintering portion, etc.). For example, one or more drains of the power switch 105 and / or the lower lead frame of the power switch 105 may be sintered to the base substrate 162 at one or more points via the sintering layer 176. According to another example, the power switch 105 may be die-sintered to the power switch 105 lower lead frame, and the power switch 105 lower lead frame and / or one or more power switch 105 drains may be sintered to the base substrate 162 via the sintering layer 176 .

[0085] like Fig.11 As shown, the base substrate 161 may include a top substrate 161a, a connecting material 161b (e.g., SiN), and a bottom substrate 161c. The top substrate 161a and the bottom substrate 161c may be formed of a conductive material such as copper, double bonded copper (DBC), etc. The connecting material 161b may be sandwiched between the top substrate 161a and the bottom substrate 161c and may be thermodynamically stable. Fig.12At step 1206, one or more components associated with the power switch 105 (e.g., field transistor source, lead frame, plate, die, electrical component, electrical trace, etc.) may be sintered to the bottom substrate 161c of the base substrate 161. The one or more components associated with the power switch 105 may be sintered to the bottom substrate 161c of the base substrate 161 via a sintering layer 172 (e.g., a sintering film, a segmented sintering film, a sintering strip, a sintering portion, etc.). For example, the power switch 105 field transistor source and / or the upper lead frame may be sintered to the base substrate 161 at one or more points via the sintering layer 172. The power switch 105 components 170 (such as internal gate drivers and / or decoupling capacitors) may have soldered interconnects.

[0086] exist Fig.12 At step 1208, an active heat dissipation element (e.g., active heat sink 110) or a passive heat dissipation element (e.g., passive heat sink 115) may be connected to the base substrate 161 via any suitable means, including but not limited to via welding or via TIM. Fig.11 and Fig.12 The technology of the present invention may not require one or more internal welding of the silicon carbide (SiC) grains. Therefore, the base substrate 161 can be welded to an active heat dissipation element (e.g., active heat sink 110) or a passive heat dissipation element (e.g., passive heat sink 115) without using a TIM.

[0087] According to an embodiment, the robotic system may automatically perform Fig.11 and Fig.12 The robotic system may include one or more arms (e.g., having one or more degrees of motion), sensors (e.g., motion sensors, position sensors, optical sensors, force sensors, pressure sensors, electrical sensors, etc.), sintering parts, welding parts, picking and placing parts, moving mechanisms (e.g., gantries, rollers, motors, joints, etc.), etc. The robotic system may be responsive to and / or use a computer program (e.g., via a processor), one or more signals (e.g., sensor signals), memory, processor, etc. to execute Fig.11 and Fig.12 All or some of the techniques disclosed in .

[0088] According to an embodiment, one or more fins (e.g., fins 132) may be attached to individual power switches 105 via base plate 119, and the one or more fins or corresponding fin systems 131 may be individually tested to facilitate first pass quality test (FTQ). FTQ may be a measure of the ease with which a given component can be manufactured. According to an embodiment, the fin system 131 and base plate 119 may be sealingly attached to the power switch 105 and / or base plate 140 or other castings via any suitable means, such as adhesive, epoxy attachment, and / or friction stir welding, to form a coolant seal.

[0089] Can be passed through Fig.11 and Fig.12 The connected power switch 105 and fin system 131 connected by the techniques described in the above are placed into the casting (e.g., base plate 140), as discussed herein. Such a configuration can result in a reduction in overall height and / or improved sealing of the cooling channels formed by the fin system 131. The switch assembly can be completed or in accordance with Fig.11 and Fig.12 Overmolding of the component is performed when the entire component is configured using the techniques described in the accompanying drawings.

[0090] Other embodiments of the disclosure will be apparent to those skilled in the art from consideration of the specification and practice of the invention disclosed herein. It is intended that the specification and examples be considered exemplary only, with the true scope and spirit of the invention being indicated by the following claims.

Claims

1. A power module, comprising: one or more power switching components; a passive heat dissipation element in contact with and facing the first surface of the one or more power switching components, the passive heat dissipation element having a first planar surface and a second planar surface; as well as An active heat dissipation element, the active heat dissipation element is in contact with and faces the second surface of the one or more power switching components, wherein the active heat dissipation element is positioned opposite to and in thermal contact with the passive heat dissipation element relative to the one or more power switching components. 2 . The power module of claim 1 , wherein the passive heat dissipation element is formed without a closure. 3 . The power module of claim 1 , wherein each surface of the passive heat dissipation element terminates in free space. 4 . The power module of claim 1 , wherein the one or more power switches are mechanically connected to at least one of the active heat dissipation element or the passive heat dissipation element via a clamping force. 5 . The power module of claim 1 , wherein the passive heat dissipation element comprises a thermally conductive plate. 6 . The power module of claim 1 , wherein the passive heat dissipation element comprises a first end and a second end, and wherein the first end and the second end are in thermal contact with the active heat dissipation element.

7. The power module of claim 1, wherein the passive heat dissipation element comprises a third planar surface on the same plane as the first planar surface, wherein the second planar surface is on a different plane than the first planar surface and connects the first planar surface to the third planar surface. 8 . The power module of claim 7 , further comprising a first curved surface connecting the first planar surface to the second planar surface and a second curved surface connecting the third planar surface to the second planar surface.

9. The power module of claim 7, wherein the second planar surface is in direct contact with the active heat dissipation element. 10 . The power module of claim 7 , wherein the second planar surface is between a first power switch of the one or more power switches and a second power switch of the one or more power switches.

11. The power module of claim 1 further comprising an inlet and an outlet, wherein the active heat dissipation element comprises a closure shaped for a fluid passage, the closure further shaped to receive fluid from the inlet and discharge fluid through the outlet.

12. The power module of claim 1, wherein the power module is configured for fluid flow only through the active heat dissipation element.

13. A method for dissipating heat, the method comprising: generating heat at the power switching element; dissipating at least a portion of the heat generated at the power switch to a passive heat dissipation element in contact with and facing a first surface of the power switch, wherein each surface of the passive heat dissipation element terminates in free space; as well as At least a portion of the heat dissipated to the passive heat dissipation element is dissipated to the active heat dissipation element via thermal contact between the passive heat dissipation element and an active heat dissipation element in contact with and facing the second surface of the power switching element, wherein the active heat dissipation element includes a fluid passage.

14. The method of claim 13, wherein the passive heat dissipation element is formed without a closure.

15. The method according to claim 13, further comprising: At least a portion of the heat dissipated to the active heat dissipation element is dissipated to a fluid in the fluid passageway.

16. The method of claim 13, wherein the at least a portion of the heat dissipated from the passive heat dissipation element to the active heat dissipation element is dissipated via one or more contact points thermally connecting the passive heat dissipation element and the active heat dissipation element.

17. A power module, comprising: Heat generating electrical components; as well as a passive heat dissipation element, the passive heat dissipation element being in contact with and facing the first surface of the heat generating electrical component, the passive heat dissipation element comprising: Clamping structure; Contact interface; a planar surface, the planar surface facing the heat generating electrical component; a first curved surface connecting the planar surface to the clamping structure; and A second curved surface connects the planar surface to the contact interface, wherein at least one of the clamping structure or the contact interface is in direct contact with an active heat dissipating element.

18. The power module of claim 17, wherein the passive heat dissipation element is formed without a closure.

19. The power module of claim 17, wherein the active heat dissipation element is an active heat sink having a fluid passage.

20. The power module of claim 17, wherein each surface of the passive heat dissipation element terminates in free space.

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