Method for manufacturing in-vehicle wiring board, and in-vehicle wiring board

Abstract

A method for manufacturing an in-vehicle wiring board uses a board part main body (10). A method for manufacturing an in-vehicle wiring board includes a selection step. And a selection step, whether the conductor part (50) is bonded to the plurality of pad parts (23) or not is determined in accordance with the type of vehicle on which the vehicle-mounted wiring board (e.g., the vehicle-mounted wiring board (92)) is mounted. The conductor part (50) is selected from at least one of the number of bonded pads (23) and the target of bonding to the pads (23) via the conductor part (50) among a plurality of second power paths insulated from the power path (25). A current path using the power path (25) is configured by applying the selection result of the selection step to the substrate part main body (10).

Description

Technical Field

[0001] The present disclosure relates to a method for manufacturing a vehicle-mounted wiring board and a vehicle-mounted wiring board. Background Art

[0002] Patent Document 1 discloses a structure in which a part of a current path is constituted by a connecting member mounted on a substrate.

[0003] Prior art literature

[0004] Patent Literature

[0005] Patent Document 1: Japanese Patent Application Publication No. 2010-28930 Summary of the invention

[0006] Problems to be solved by the invention

[0007] The current paths may differ depending on the vehicle model, grade, etc. If a substrate corresponding to each current path is prepared separately, the number of types of substrates may increase. In addition, it is desirable that the current paths have improved heat dissipation.

[0008] An object of the present disclosure is to provide a technology that can improve heat dissipation by using a common substrate on which a conductor portion can be mounted and can easily realize a current path that is suitable for the type of vehicle.

[0009] Means for solving problems

[0010] The method for manufacturing a vehicle-mounted wiring board disclosed in the present invention is a method for manufacturing a vehicle-mounted wiring board using a substrate portion main body, wherein: The substrate body comprises: a conductor layer having a wiring pattern; and an insulating layer having an insulating film covering a portion of the wiring pattern, A part of the wiring pattern is formed as a pad portion not covered by the insulating film. The wiring pattern has a power path formed with a plurality of the pad portions, The pad portion can be joined to a conductor portion having heat dissipation properties, The manufacturing method of the vehicle-mounted wiring board includes a selection step of selecting whether to perform bonding of the conductor portion to the plurality of pad portions, the number of bondings of the conductor portion to the plurality of pad portions, and at least any one of a target of bonding to the pad portion via the conductor portion in a plurality of second power paths insulated from the power path, in accordance with the type of the vehicle on which the vehicle-mounted wiring board is mounted, A current path using the power path is formed by applying the selection result based on the selection step to the substrate portion main body.

[0011] The vehicle-mounted wiring board disclosed in the present invention comprises: a substrate body; and The conductor part has heat dissipation properties. The substrate body comprises: a conductor layer having a wiring pattern; and an insulating layer having an insulating film covering a portion of the wiring pattern, A part of the wiring pattern is formed as a pad portion not covered by the insulating film. The wiring pattern has a power path formed with a plurality of the pad portions, The conductor portion satisfies at least one of the following conditions: being joined to the plurality of pad portions; and being joined to at least any one of a plurality of second power pathways and the pad portion, the plurality of second power pathways being insulated from the power pathway.

[0012] Effects of the Invention

[0013] The technology according to the present disclosure can improve heat dissipation by using a common substrate on which a conductor portion can be mounted, and can easily realize a current path according to the type of vehicle. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 It is a plan view of a part of the substrate body of the first embodiment.

[0015] Figure 2 It is a plan view of a part of the vehicle-mounted wiring board when the conductor portion is not connected.

[0016] Figure 3 It is a plan view of a part of the vehicle-mounted wiring board when a conductor portion is bonded to one row of pads.

[0017] Figure 4 It is a plan view of a part of the vehicle-mounted wiring board in the case where conductor portions are bonded to two pad rows.

[0018] Figure 5 yes Figure 3 AA line section view.

[0019] Figure 6 It is a plan view of a part of the substrate body according to the second embodiment.

[0020] Figure 7 It is a plan view of a part of the vehicle-mounted wiring board according to the second embodiment.

[0021] Figure 8 It is a plan view of a part of the substrate body according to the third embodiment.

[0022] Fig. 9 It is a plan view of a part of the vehicle-mounted wiring board according to the third embodiment.

[0023] Fig.10 It is an explanatory diagram showing an example in which the pad portion and the conductor portion are arranged side by side in the second direction.

[0024] Fig.11 This is an explanatory diagram showing an example in which a plurality of conductor portions arranged so as to be staggered in the second direction are densely arranged in the second direction. DETAILED DESCRIPTION

[0025] Hereinafter, embodiments of the present disclosure are listed and illustrated.

[0026] [1] A method for manufacturing a vehicle-mounted wiring board, using a board body, wherein: The substrate body comprises: a conductor layer having a wiring pattern; and an insulating layer having an insulating film covering a portion of the wiring pattern, A part of the wiring pattern is formed as a pad portion not covered by the insulating film. The wiring pattern has a power path formed with a plurality of the pad portions, The pad portion can be joined to a conductor portion having heat dissipation properties, The manufacturing method of the vehicle-mounted wiring board includes a selection step of selecting whether to perform bonding of the conductor portion to the plurality of pad portions, the number of bondings of the conductor portion to the plurality of pad portions, and at least any one of a target of bonding to the pad portion via the conductor portion in a plurality of second power paths insulated from the power path, in accordance with the type of the vehicle on which the vehicle-mounted wiring board is mounted, A current path using the power path is formed by applying the selection result based on the selection step to the substrate portion main body.

[0027] The manufacturing method of the vehicle-mounted wiring board can realize current paths corresponding to multiple types by selecting which one in the selection process. In addition, since the conductor part has heat dissipation, the heat dissipation is improved when the conductor part is connected to the pad part. Therefore, the manufacturing method of the vehicle-mounted wiring board can improve the heat dissipation by using a common substrate on which the conductor part can be mounted, and can easily realize the current path corresponding to the type of vehicle.

[0028] [2] The method for manufacturing a vehicle-mounted wiring board according to [1], wherein: In the selection step, at least one of whether to perform bonding of the conductor portion to the plurality of pad portions and the number of bonding of the conductor portion to the plurality of pad portions is selected in accordance with the type of vehicle on which the vehicle-mounted wiring board is mounted.

[0029] As the number of conductor parts connected increases, the cross-sectional area of ​​the current path increases, so the resistance value of the current path decreases, and the maximum current value (current allowable value) that can flow through the current path increases. In other words, the manufacturing method of the vehicle-mounted wiring board can easily realize a current path with a current allowable value corresponding to the type of vehicle.

[0030] [3] The method for manufacturing a vehicle-mounted wiring board according to [2], wherein: The power path is provided with a plurality of pad rows formed by arranging a plurality of the pad portions. In the selecting step, when selecting the number of the conductor portions to be joined to the plurality of pad portions, the number of the pad columns to which the conductor portions are joined is selected.

[0031] The vehicle-mounted wiring board manufactured by the above method can be distinguished by the number of pad rows to which the conductor portion is bonded. Therefore, the vehicle-mounted wiring board manufactured by the above method can be easily recognized visually to which category it corresponds.

[0032] [4] The method for manufacturing a vehicle-mounted wiring board according to [2] or [3], wherein: The plurality of pad portions are arranged in a row in the direction of current flow, When the conductor portion is selected to be joined to the pad portion in the selecting step, a joining step of joining the conductor portion to a plurality of the pad portions arranged in the direction in which the current flows is performed.

[0033] The conductor portion of the vehicle-mounted wiring board manufactured by the above method is arranged along the direction in which the current flows, so the current flowing in the power path easily flows through the conductor portion.

[0034] [5] The method for manufacturing a vehicle-mounted wiring board according to [1], wherein: In the selecting step, a target to be joined to the pad portion via the conductor portion is selected from among the plurality of second power paths.

[0035] The manufacturing method of the above-mentioned vehicle-mounted wiring board can select at least one of the power supply source for supplying power to the power path and the power supply target from the power path according to which second power path is selected. In other words, the manufacturing method of the above-mentioned vehicle-mounted wiring board can select at least one of the power supply source for supplying power to the power path and the power supply target from the power path according to the type of vehicle while seeking to improve the heat dissipation.

[0036] [6] The method for manufacturing a vehicle-mounted wiring board according to [5], wherein: A second pad portion is formed on each of the second power paths, The plurality of pad portions include pad portions individually provided corresponding to each of the second pad portions, In the selecting step, the pad portion and the second pad portion corresponding to the pad portion are selected, When the pad portion and the second pad portion corresponding to the pad portion are selected in the selecting step, a joining step of joining the conductor portion to the selected pad portion and the second pad portion is performed.

[0037] In the above-mentioned method for manufacturing a vehicle-mounted wiring board, the conductor portion is joined to the land portion and the second land portion corresponding to each other. Therefore, it is easy to join the land portion and the second land portion in a more appropriate positional relationship.

[0038] [7] The method for manufacturing a vehicle-mounted wiring board according to any one of [1] to [6], wherein: When the conductor portion is joined to the land portion, the conductor portion is surface-mounted on the substrate portion main body.

[0039] The vehicle-mounted wiring board manufactured by the above method can easily utilize the back surface of the board body effectively, compared with a structure in which the conductor portion is mounted by through-hole mounting.

[0040] [8] A vehicle-mounted wiring board, wherein: The vehicle-mounted wiring board comprises: a substrate body; and The conductor part has heat dissipation properties. The substrate body comprises: a conductor layer having a wiring pattern; and an insulating layer having an insulating film covering a portion of the wiring pattern, A part of the wiring pattern is formed as a pad portion not covered by the insulating film. The wiring pattern has a power path formed with a plurality of the pad portions, The conductor portion satisfies at least one of the following conditions: being joined to the plurality of pad portions; and being joined to at least any one of a plurality of second power pathways and the pad portion, the plurality of second power pathways being insulated from the power pathway.

[0041] In the structure in which the conductor part is joined to the plurality of pad parts, the cross-sectional area of ​​the current path is increased by the conductor part. As a result, the resistance value of the current path is reduced, and the allowable current value is increased. In addition, in the structure in which the conductor part is joined to at least one of the second power paths and the pad part, the vehicle-mounted wiring substrate forms a current path that connects the power path to at least one of the second power paths. Therefore, the vehicle-mounted wiring substrate utilizes a common substrate on which the conductor part can be mounted, thereby achieving improved heat dissipation and forming a current path corresponding to the type of vehicle.

[0042] [9] The vehicle-mounted wiring board according to [8], wherein: The conductor portion is joined to the plurality of pad portions.

[0043] The cross-sectional area of ​​the current path of the vehicle-mounted wiring board is increased by the conductor portion. As a result, the resistance value of the current path is reduced, and the allowable current value is increased.

[0044]

[10] The vehicle-mounted wiring board according to [8], wherein: A second pad portion is formed on each of the second power paths, Each of the second pad portions is arranged at a position corresponding to each of the pad portions, The conductor portion is joined to the land portion and the second land portion corresponding to each other.

[0045] The vehicle-mounted wiring board forms a current path that connects the power path to at least one of the second power paths by connecting the corresponding land portions to the second land portions.

[0046] <First Embodiment>

[0047] The following description relates to a method for manufacturing a vehicle-mounted wiring board using the board portion main body 10 .

[0048] (Substrate body 10)

[0049] like Figure 1 and Figure 5As shown, the substrate body 10 includes a conductor layer 20 and an insulating layer 30. The conductor layer 20 is made of, for example, a metal foil (e.g., copper foil). The conductor layer 20 has a wiring pattern 21. The wiring pattern 21 is in a long strip shape. An electrical component 41 on the input side and an electrical component 42 on the output side are provided on the wiring pattern 21. The wiring pattern 21 functions as an electrical path for supplying power input through the electrical component 41 on the input side to the electrical component 42 on the output side. The electrical component 41 on the input side is not particularly limited and may be a connector, a switch, a fuse, or other electrical components. The electrical component 42 on the output side is not particularly limited and may be a connector, a switch, a fuse, or other electrical components.

[0050] like Figure 5 As shown, the insulating layer 30 includes a base portion 31 and an insulating film 32. The base portion 31 has insulating properties and is made of, for example, resin. The base portion 31 is plate-shaped. The thickness of the base portion 31 is greater than the thickness of the insulating film 32. The base portion 31 is arranged on one side of the thickness direction of the substrate body 10 relative to the conductor layer 20. Hereinafter, the "thickness direction of the substrate body 10" will also be referred to as the "thickness direction". The conductor layer 20 (more specifically, the wiring pattern 21) is provided on the surface on the other side of the thickness direction of the base portion 31. The insulating film 32 covers a portion of the surface on the other side of the thickness direction of the conductor layer 20 (more specifically, the wiring pattern 21). The insulating film 32 is configured as, for example, a solder resist. The insulating film 32 has insulating properties and is made of, for example, resin.

[0051] like Figure 5 As shown, a part of the area of ​​the wiring pattern 21 is constituted as a pad portion 23 that is not covered by the insulating film 32. The pad portion 23 can be joined to a conductor portion 50 having heat dissipation. The conductor portion 50 is a member joined to the pad portion 23 by a solder 55. The conductor portion 50 is a heat dissipation member. The conductor portion 50 is constituted not to be covered by resin. That is, the surface of the conductor portion 50 is a structure that is not covered by resin and is exposed. Therefore, the conductor portion 50 can improve the heat dissipation compared to the jumper wire constituted by the covered wire. The conductor portion 50 is constituted, for example, as a bus bar (more specifically, a chip bus bar). The conductor portion 50 is a rectangular parallelepiped in the present embodiment, but it can also be in other forms. For example, the conductor portion 50 can be a cube or a form including a curved surface. The conductor portion 50 is in the shape of a long strip. The conductor portion 50 has a relative surface 51 on one side in the thickness direction. The relative surface 51 is a flat surface. The relative surface 51 is arranged along the substrate body 10. The facing surface 51 is bonded to the land portion 23 via solder 55 .

[0052] like Figure 1As shown, the pad portion 23 is surrounded by an insulating film 32. The pad portion 23 is rectangular. The wiring pattern 21 has a power path 25 formed with a plurality of pad portions 23. The plurality of pad portions 23 are arranged in a first direction. The plurality of pad portions 23 are arranged in a straight line. The plurality of pad portions 23 are arranged in a direction in which the current flows. The direction in which the current flows is along the first direction.

[0053] like Figure 5 As shown, the power path 25 has a first connection portion 26 electrically connected to the electrical component 41 on the input side and a second connection portion 27 electrically connected to the electrical component 42 on the output side. Figure 5 In the example shown, the first connection portion 26 and the second connection portion 27 are configured as through holes. The first connection portion 26 and the second connection portion 27 may not be through holes, and may be pads, for example. A plurality of pad portions 23 are arranged between the first connection portion 26 and the second connection portion 27. The "direction of current flow" is the direction from the first connection portion 26 toward the second connection portion 27.

[0054] like Figure 1 and Figure 5 As shown, the plurality of pad portions 23 include pad pairs consisting of paired pad portions 23. The paired pad portions 23 are arranged at intervals from each other in the first direction. The paired pad portions 23 are arranged at intervals from each other in the first direction. The conductor portion 50 is joined to the paired pad portions 23. More specifically, one end side of the conductor portion 50 in the shape of a long strip in the longitudinal direction is joined to a pad portion 23A, and the other end side in the longitudinal direction is joined to another pad portion 23B. According to this structure, compared with a structure in which the opposing surface 51 of the conductor portion 50 is joined to the power path 25 as a whole by the solder 55, the amount of solder 55 used can be reduced.

[0055] like Figure 1 As shown, the plurality of pad portions 23 include a plurality of pad pairs. The power path 25 includes a structure in which the plurality of pad pairs are arranged in a row in the first direction. The power path 25 includes a structure in which the plurality of pad pairs are arranged staggered in the second direction.

[0056] like Figure 1 As shown in FIG. 1 , a plurality of pad columns formed by arranging a plurality of pad portions 23 are provided in the power path 25. The plurality of pad columns are arranged in a second direction perpendicular to the first direction and the thickness direction. Figure 1 In the example shown, two pad columns are provided. The number of pad portions 23 in each pad column is the same. Each pad column is composed of a plurality of pad pairs. The pad pairs in adjacent pad columns are arranged to be offset from each other in the first direction.

[0057] like Figure 3As shown, the interval GA between one pad portion 23A and the other pad portion 23B of the paired pad portions 23 is longer than the length of the pad portion 23 in the first direction, and longer than the length (width) of the pad portion 23 in the second direction. The length of the pad portion 23 in the first direction is shorter than the length (width) of the pad portion 23 in the second direction. The interval GB between the adjacent pad pairs in the first direction is shorter than the above-mentioned interval GA, shorter than the length of the pad portion 23 in the first direction, and shorter than the length (width) of the pad portion 23 in the second direction. The interval GB between adjacent pad pairs is the interval between the pad portion 23 on the opposite side of the other pad in one pad pair of adjacent pad pairs and the pad portion 23 on the opposite side of one pad in the other pad pair.

[0058] like Figure 3 As shown, the length of the conductor portion 50 in the longitudinal direction (first direction) is longer than the length of the pad portion 23 in the first direction, and is longer than the length (width) of the pad portion 23 in the second direction. The length of the conductor portion 50 in the short side direction (second direction) is longer than the length of the pad portion 23 in the first direction, and is shorter than the length (width) of the pad portion 23 in the second direction.

[0059] When the conductor portion 50 is bonded to the plurality of pad portions 23, the conductor portion 50 also becomes a part of the current path formed by the power path 25. Therefore, the cross-sectional area of ​​the current path formed by the power path 25 becomes larger. If the cross-sectional area of ​​the current path becomes larger, the resistance value of the current path decreases, and the maximum current value (allowable current value) that can flow through the current path increases.

[0060] In addition, a plurality of pad pairs are provided in the power path 25. As the number of conductors 50 joined to the power path 25 increases, the cross-sectional area of ​​the current path increases, the resistance value of the current path decreases, and the allowable current value increases.

[0061] For example, in a structure where the conductor portion 50 is not joined to the pad portion 23, the allowable current value is 30 A. In a structure where the conductor portion 50 is joined to the pad column "1" (specifically, joined to each pad pair included in the pad column "1"), the allowable current value is 60 A. In a structure where the conductor portion 50 is joined to the pad column "2" (specifically, joined to each pad pair included in the pad column "2"), the allowable current value is 100 A.

[0062] In this way, the substrate main body 10 sets the allowable current value according to the number of connected conductors 50. In addition, since the conductors 50 have heat dissipation properties, the heat dissipation properties can also be improved by connecting the conductors 50.

[0063] (Method for manufacturing automotive wiring board)

[0064] The method for manufacturing a vehicle-mounted wiring board includes a preparation step and a selection step.

[0065] In the preparation step, the substrate body 10 is prepared. In the preparation step, the conductor part 50 is prepared as needed.

[0066] In the selection process, the number of connections of the conductor portion 50 to the plurality of pad portions 23 is selected in accordance with the type of vehicle on which the vehicle-mounted wiring board is mounted. "Selecting the number of connections of the conductor portion 50 to the plurality of pad portions 23" is synonymous with "selecting the number of pad pairs connecting the conductor portion 50" in the present embodiment.

[0067] The "vehicle category" is a category classified according to the vehicle type, grade, delivery location, options, etc. More specifically, the "vehicle category" is a category in which the allowable current value in the power path 25 is different depending on the vehicle model, grade, delivery location, options, etc. The "allowable current value in the power path 25" is the maximum current value that can flow through the power path 25. In the present embodiment, the "vehicle category" includes category A, category B, and category C. Category A vehicles are vehicles that require an allowable current value of 30A. Category B vehicles are vehicles that require an allowable current value of 60A. Category C vehicles are vehicles that require an allowable current value of 100A.

[0068] "The number of connections of the conductor portion 50 to the plurality of pad portions 23" also includes "0". In the present embodiment, "the number of connections of the conductor portion 50 to the plurality of pad portions 23" is any one of "0", "3", and "6". In the selection process, when selecting the number of connections of the conductor portion 50 to the plurality of pad portions 23, the number of pad columns of the joined conductor portion 50 is selected. "The number of pad columns of the joined conductor portion 50" also includes "0". In the present embodiment, "the number of pad columns of the joined conductor portion 50" is any one of "0", "1", and "2".

[0069] In the selection process, when the vehicle type is type A, "0" is selected as the "number of pad columns to which the conductor portion 50 is joined". That is, when the vehicle type is type A, "0" is selected as the "number of pad columns to which the conductor portion 50 is joined to the plurality of pad portions 23". In this case, Figure 2 As shown, the conductor portion 50 is not bonded to any of the land portions 23. Thus, a vehicle-mounted wiring board 91 including a current path having an allowable current value of 30A is manufactured.

[0070] Furthermore, in the selection process, when the vehicle category is category B, "1" is selected as the "number of pad columns to which the conductor portion 50 is joined". That is, when the vehicle category is category B, "3" is selected as the "number of conductor portions 50 joined to the plurality of pad portions 23". Thus, when the conductor portion 50 is joined to the pad portion 23 through the selection process, the joining process of joining the conductor portion 50 to the plurality of pad portions 23 is performed. In the joining process, as shown in FIG. Figure 3 As shown, the conductor portion 50 is joined to the pad row "1". Specifically, in the joining step, the conductor portion 50 is joined to each pad pair included in the pad row "1". Thus, a vehicle-mounted wiring board 92 including a current path with an allowable current value of 60A is manufactured.

[0071] Furthermore, in the selection process, when the vehicle category is category C, "2" is selected as the "number of pad columns to which the conductor portion 50 is joined". That is, when the vehicle category is category C, "6" is selected as the "number of conductor portions 50 joined to the plurality of pad portions 23". Thus, when the conductor portion 50 is joined to the pad portion 23 in the selection process, the joining process of joining the conductor portion 50 to the plurality of pad portions 23 is performed. In the joining process, as shown in FIG. Figure 4 As shown, the conductor portion 50 is joined to the pad row "2". Specifically, in the joining step, the conductor portion 50 is joined to each pad pair included in the pad row "2". Thus, a vehicle-mounted wiring board 93 including a current path with an allowable current value of 100A is manufactured.

[0072] In the bonding step, the conductor portion 50 is bonded to the land portion 23 by the solder 55 . Soldering is, for example, reflow soldering. The conductor portion 50 is surface mounted on the substrate body 10 .

[0073] In addition, if Figure 2~Figure 5 As shown, the first connection portion 26 of the vehicle-mounted wiring substrates 91, 92, 93 is connected to the input-side electric component 41 by soldering or the like. The second connection portion 27 of the vehicle-mounted wiring substrates 91, 92, 93 is connected to the output-side electric component 42 by soldering or the like.

[0074] (Example of the effect)

[0075] The manufacturing method of the vehicle-mounted wiring substrate of the first embodiment can realize current paths of allowable current values ​​corresponding to multiple categories by selecting the number of conductor parts 50 to be connected to multiple pad parts 23 in the selection process. In addition, since the conductor part 50 has heat dissipation, the heat dissipation is improved when the conductor part 50 is connected to the pad part 23. More specifically, since the conductor part 50 is not covered with resin, the heat dissipation is improved compared to the structure of connecting a jumper wire composed of a covered wire. Therefore, the manufacturing method of the vehicle-mounted wiring substrate can seek to improve the heat dissipation by using a common substrate on which the conductor part 50 can be installed, and can simply realize the current path corresponding to the category of the vehicle.

[0076] The method for manufacturing a vehicle-mounted wiring substrate of the first embodiment joins the conductor portion 50 to a selected number of pad columns. The vehicle-mounted wiring substrate manufactured by the above method can be distinguished according to the number of pad columns joined by the conductor portion 50. Therefore, the vehicle-mounted wiring substrate manufactured by the above method can be easily identified by visual inspection to which category it corresponds.

[0077] In addition, in the vehicle-mounted wiring board manufactured by the above method, the conductor portion 50 is arranged along the direction in which the current flows. Therefore, the current flowing in the power path 25 easily flows through the conductor portion 50 .

[0078] Furthermore, the vehicle-mounted wiring board manufactured by the above method has a structure in which the conductor portion 50 is surface-mounted on the substrate body 10 , and therefore, it is easier to effectively utilize the back surface of the substrate body 10 than in a structure in which the conductor portion is through-hole mounted.

[0079] in addition, Figure 3 and Figure 4 The vehicle-mounted wiring substrates 92 and 93 shown in the drawings increase the cross-sectional area of ​​the current path formed by the power path 25 by joining the conductor portion 50 to the plurality of pad portions 23. As a result, the resistance value of the current path is reduced, and the allowable current value is increased. Therefore, the vehicle-mounted wiring substrate 92 utilizes a common substrate on which the conductor portion 50 can be mounted, thereby achieving improved heat dissipation and forming a current path corresponding to the type of vehicle.

[0080] <Second Embodiment>

[0081] In the second embodiment, a structure in which a conductor portion is joined to a land portion of an electric power path and at least any one of a plurality of second electric power paths arranged on the input side will be described.

[0082] The following description relates to a method for manufacturing a vehicle-mounted wiring board according to the second embodiment using the board portion main body 210 .

[0083] (Substrate part main body 210)

[0084] like Figure 6 As shown, the substrate body 210 includes a conductor layer 220 and an insulating layer 230. The conductor layer 220 is made of, for example, a metal foil (for example, a copper foil). The conductor layer 220 has a wiring pattern 221. The insulating layer 230 has the base portion 31 described in the first embodiment (see Figure 5 ) and an insulating film 232. The insulating film 232 is formed of, for example, a solder resist. The insulating film 232 has insulating properties and is formed of, for example, a resin.

[0085] The wiring pattern 221 includes a first power path 270 and a plurality of second power paths 280 and 281. The first power path 270 is arranged at intervals from each of the second power paths 280 and 281. The first power path 270 is insulated from each of the second power paths 280 and 281 when the conductor portion 50 is not connected. Each of the second power paths 280 and 281 is arranged at intervals from each other. Each of the second power paths 280 and 281 is insulated from each other.

[0086] Part of the wiring pattern 221 is formed as first land portions 271 and 272 that are not covered by the insulating film 232. A plurality of first land portions 271 and 272 are formed in the first power path 270. The first land portions 271 and 272 are arranged at intervals from each other.

[0087] A partial region of the wiring pattern 221 is configured as a second land portion 280A that is not covered by the insulating film 232. The second power path 280 is provided with a second land portion 280A.

[0088] A partial region of the wiring pattern 221 is configured as a second land portion 281A which is not covered by the insulating film 232. The second land portion 281A is formed in the second power path 281. That is, a second land portion is formed in each second power path.

[0089] The plurality of first pad portions 271 and 272 include first pad portions that are individually provided corresponding to each second pad portion. Specifically, the first pad portion 271 is arranged at a position corresponding to the second power path 280 (specifically, the second pad portion 280A). The first pad portion 271 can be joined to the second power path 280 (specifically, the second pad portion 280A) via the conductor portion 50. The first pad portion 272 is arranged at a position corresponding to the second power path 281 (specifically, the second pad portion 281A). The first pad portion 272 can be joined to the second power path 281 (specifically, the second pad portion 281A) via the conductor portion 50. That is, the second power paths 280 and 281 (specifically, the second pad portions 280A and 281A) are equivalent to the option of "a target joined to the first pad portions 271 and 272 via the conductor portion 50".

[0090] Different electric powers are supplied to the second electric power paths 280 and 281. The different electric powers may be electric powers supplied from different storage batteries, or electric powers obtained by making electric powers from a common storage battery different by voltage conversion or the like.

[0091] like Figure 7 As shown, for example, a first voltage (+B1 voltage) is applied to the second power path 280. For example, a second voltage (+B2 voltage) is applied to the second power path 281. When the first pad portion 271 is connected to the second power path 280 (specifically, the second pad portion 280A) via the conductor portion 50, power is supplied from the second power path 280 to the first power path 270. That is, the first voltage (+B1 voltage) is applied to the first power path 270. When the first pad portion 272 is connected to the second power path 281 (specifically, the second pad portion 281A) via the conductor portion 50, power is supplied from the second power path 281 to the first power path 270. That is, the second voltage (+B2 voltage) is applied to the first power path 270. The first power path 270 supplies the power supplied from the second power path to the load 275 side. The type of the load is not particularly limited.

[0092] (Method for manufacturing automotive wiring board)

[0093] The method for manufacturing a vehicle-mounted wiring board includes a preparation step and a selection step.

[0094] In the preparation step, the substrate body 210 and the conductor portion 50 are prepared.

[0095] In the selection process, the target to be joined to the first pad portion 271, 272 via the conductor portion 50 is selected from among the plurality of second power paths 280, 281 in accordance with the type of vehicle on which the vehicle-mounted wiring substrate is mounted. As described above, each first pad portion is arranged at a position corresponding to each second pad portion. Therefore, in the selection process, any one of the plurality of first pad portions 271, 272 and the second pad portion corresponding to the first pad portion are selected.

[0096] When the first land portion and the second land portion corresponding to the first land portion are selected in the selection step, a joining step of joining the conductor portion 50 to the selected first land portion and the second land portion is performed.

[0097] For example, when the first land portion 271 and the second land portion 280A are selected in the selection process, the conductor portion 50 is joined to the first land portion 271 and the second land portion 280A. In this case, a vehicle-mounted wiring substrate 291 (see FIG. 1 ) in which the second power path 280 is connected to the first power path 270 is manufactured. Figure 7 ).

[0098] When the first land portion 272 and the second land portion 281A are selected in the selection step, the conductor portion 50 is joined to the first land portion 272 and the second land portion 281A. In this case, a vehicle-mounted wiring board (not shown) in which the second power path 281 is connected to the first power path 270 is manufactured.

[0099] (Example of the effect)

[0100] The manufacturing method of the vehicle-mounted wiring board of the second embodiment can select the power supply source that supplies power to the first power path 270 by selecting which second power path is selected in the selection process. In addition, since the conductor part 50 has heat dissipation, the heat dissipation is improved. Therefore, the manufacturing method of the vehicle-mounted wiring board of the second embodiment can improve the heat dissipation by using a common substrate on which the conductor part 50 can be mounted, and can easily realize a current path corresponding to the type of vehicle.

[0101] In addition, the plurality of first pad portions 271, 272 include first pad portions that are individually provided corresponding to the respective second power paths 280, 281 (specifically, second pad portions 280A, 281A). Then, in the joining process, the conductor portion 50 is joined to the first pad portion and the second pad portion corresponding to the first pad portion. Therefore, in the manufacturing method of the vehicle-mounted wiring board of the second embodiment, the conductor portion 50 is joined to the first pad portion and the second pad portion that are arranged at positions corresponding to each other. Therefore, it is easy to join the pad portion and the second pad portion in a more appropriate positional relationship.

[0102] in addition, Figure 7 The illustrated vehicle-mounted wiring board 291 forms a current path that connects the first power path 270 and any one of the second power paths by connecting the first land portions and the second land portions that are arranged in a corresponding positional relationship to each other.

[0103] <Third Embodiment>

[0104] In the third embodiment, a structure in which a conductor portion is joined to a land portion of an electric power path and at least any one of a plurality of second electric power paths arranged on the output side will be described.

[0105] The following description relates to a method for manufacturing a vehicle-mounted wiring board according to the third embodiment using the board portion main body 310 .

[0106] (Substrate part main body 310)

[0107] like Figure 8 As shown, the substrate body 310 includes a conductor layer 320 and an insulating layer 330. The conductor layer 320 is made of, for example, a metal foil (for example, a copper foil). The conductor layer 320 has a wiring pattern 321. The insulating layer 330 has the base portion 31 described in the first embodiment (see Figure 5 ) and an insulating film 332. The insulating film 332 is formed of, for example, a solder resist. The insulating film 332 has insulating properties and is formed of, for example, a resin.

[0108] The wiring pattern 321 includes a first power path 370 and a plurality of second power paths 380 and 381. The first power path 370 is arranged at intervals from each of the second power paths 380 and 381. The first power path 370 is insulated from each of the second power paths 380 and 381 when the conductor portion 50 is not connected. Each of the second power paths 380 and 381 is arranged at intervals from each other. Each of the second power paths 380 and 381 is insulated from each other.

[0109] A partial region of the wiring pattern 321 is configured as first land portions 371 and 372 that are not covered by the insulating film 332. A plurality of first land portions 371 and 372 are formed in the first power path 370. The first land portions 371 and 372 are arranged at intervals from each other.

[0110] A partial region of the wiring pattern 321 is configured as a second land portion 380A which is not covered by the insulating film 332. The second power path 380 is provided with a second land portion 380A.

[0111] A partial region of the wiring pattern 321 is configured as a second land portion 381A which is not covered by the insulating film 332. The second land portion 381A is formed in the second power path 381. That is, a second land portion is formed in each second power path.

[0112] The plurality of first pad portions 371 and 372 include first pad portions that are individually provided corresponding to each second pad portion. Specifically, the first pad portion 371 is arranged at a position corresponding to the second power path 380 (specifically, the second pad portion 380A). The first pad portion 371 can be joined to the second power path 380 (specifically, the second pad portion 380A) via the conductor portion 50. The first pad portion 372 is arranged at a position corresponding to the second power path 381 (specifically, the second pad portion 381A). The first pad portion 372 can be joined to the second power path 381 (specifically, the second pad portion 381A) via the conductor portion 50.

[0113] like Fig. 9As shown, different loads can be connected to each of the second power paths 380 and 381. For example, a first load 385 can be connected to the second power path 380, and a second load 386 can be connected to the second power path 381. The types of the first load 385 and the second load 386 are not particularly limited.

[0114] like Fig. 9 As shown, +B voltage is applied to the first power path 370. When the first land portion 371 is connected to the second power path 380 (specifically, the second land portion 380A) via the conductor portion 50, power is supplied from the first power path 370 to the second power path 380. In other words, +B voltage is applied to the second power path 380. When the first land portion 372 is connected to the second power path 381 (specifically, the second land portion 381A) via the conductor portion 50, power is supplied from the first power path 370 to the second power path 381. In other words, a predetermined voltage (for example, +B voltage) is applied to the second power path 381.

[0115] (Method for manufacturing automotive wiring board)

[0116] The method for manufacturing a vehicle-mounted wiring board includes a preparation step and a selection step.

[0117] In the preparation step, the substrate body 310 and the conductor portion 50 are prepared.

[0118] In the selection process, the target to be connected to the first land portions 371 and 372 via the conductor portion 50 among the plurality of second power paths 380 and 381 is selected in accordance with the type of the vehicle on which the vehicle-mounted wiring board is mounted. In the present embodiment, as options for the "target to be connected to the first land portions 371 and 372", "only the second power path 380" and "both the second power paths 380 and 381" are prepared.

[0119] When "only the second power path 380" is selected in the selection step, a step of joining the conductor portion 50 to the second land portion 380A of the second power path 380 and the first land portion 371 is performed. In this case, a vehicle-mounted wiring board (see Fig. 9 ).

[0120] When "both the second power paths 380 and 381" are selected in the selection step, a joining step is performed to join the conductor portion 50 to the second land portion 380A and the first land portion 371 of the second power path 380, and to join the conductor portion 50 to the second land portion 381A and the first land portion 372 of the second power path 381. In this case, a vehicle-mounted wiring board (not shown) is manufactured in which the first power path 370 is connected to the plurality of second power paths 380 and 381, respectively.

[0121] (Example of the effect)

[0122] The manufacturing method of the vehicle-mounted wiring board of the third embodiment can select the power supply target to be supplied from the first power path 370 by selecting which second power path is selected in the selection process. Moreover, since the conductor part 50 has heat dissipation, the heat dissipation is improved. Therefore, the manufacturing method of the vehicle-mounted wiring board of the second embodiment can improve the heat dissipation by using the common substrate on which the conductor part 50 can be mounted, and can easily realize the current path corresponding to the type of vehicle.

[0123] In addition, the plurality of first pad portions 371, 372 include first pad portions that are individually provided corresponding to the respective second power paths 380, 381 (specifically, second pad portions 380A, 381A). Then, in the joining process, the conductor portion 50 is joined to the first pad portion and the second pad portion corresponding to the first pad portion. Therefore, in the method for manufacturing a vehicle-mounted wiring board of the third embodiment, the conductor portion 50 is joined to the first pad portion and the second pad portion that are arranged at positions corresponding to each other. Therefore, it is easy to join the pad portion to the second pad portion in a more appropriate positional relationship.

[0124] in addition, Fig. 9 The illustrated vehicle-mounted wiring board 391 forms a current path that connects the first power path 370 to a desired second power path by connecting the first land portion and the second land portion that are arranged in a corresponding positional relationship to each other.

[0125] <Other Implementation Methods>

[0126] The present disclosure is not limited to the embodiments described above and illustrated in the drawings. For example, the features of the embodiments described above or later can be combined in all ways within the scope of non-contradiction. In addition, any feature of the embodiments described above or later can be omitted if it is not explicitly stated as a necessary feature. Furthermore, the embodiments described above can also be changed as follows.

[0127] In the above-mentioned embodiments, the conductor portion is structured to be surface-mounted on the substrate portion main body, but may be structured to be through-hole mounted.

[0128] In the first embodiment, the number of the conductor portions to be joined to the plurality of pad portions is selected in the selection step. However, the selection step may select whether or not to join the conductor portions to the plurality of pad portions.

[0129] In the first embodiment, the paired pad portions are arranged along the direction of current flow, but are not limited to this structure. For example, the straight line connecting the paired pad portions may be inclined relative to the direction of current flow. From the viewpoint of making it easy for current to flow through the conductor portion joined to the paired pad portions, the inclination angle relative to the direction of current flow is preferably within 45°.

[0130] In the first embodiment described above, the pads are arranged in two rows, but may be arranged in one row, or may be arranged in three or more rows.

[0131] In the first embodiment, the number of connections of the conductor part is selected in units of pad columns, but other structures may be used. For example, the number of connections of the conductor part may be selected regardless of pad columns.

[0132] In the first embodiment described above, the conductor portion is configured to be bonded to two land portions. However, the conductor portion may be bonded to three or more land portions.

[0133] In the first embodiment, the plurality of pad portions and conductor portions arranged staggered in the second direction are staggered in the first direction, but may be different structures. Fig.10 As shown, a structure in which a plurality of pad portions 423 and conductor portions 50 are arranged side by side in the second direction may be adopted.

[0134] In the first embodiment described above, the positional relationship between the conductor portion and the pad portion may be set to Fig.11 That is, the two conductor parts 50 may be arranged at positions overlapping each other in the second direction and staggered in the first direction, and the pad part 523 joined to one conductor part 50 and the pad part 523 joined to the other conductor part 50 may be arranged at positions overlapping each other in the first direction. According to this structure, it is easy to reduce the interval between the conductor parts 50 in the second direction.

[0135] The embodiments disclosed herein are to be considered in all respects as illustrative and non-restrictive. The scope of the present invention is not limited to the embodiments disclosed herein, but is intended to include all modifications within the scope of the claims or within the scope equivalent to the claims.

[0136] Description of symbols

[0137] 10...Substrate body

[0138] 20…Conductor layer

[0139] 21…Wiring pattern

[0140] 23…Pad

[0141] 23A…Pad

[0142] 23B…Pad

[0143] 25…Power access

[0144] 26…First connection portion

[0145] 27…Second connection part

[0146] 30…Insulation layer

[0147] 31…base

[0148] 32…Insulation film

[0149] 41…Electrical components on the input side

[0150] 42…Electrical components on the output side

[0151] 50…Conductor

[0152] 51…Opposite side

[0153] 55…Solder

[0154] 91…Automotive wiring board

[0155] 92…Automotive wiring boards

[0156] 93…Automotive wiring boards

[0157] 210…Substrate body

[0158] 220…Conductor layer

[0159] 221…Wiring pattern

[0160] 230…Insulation layer

[0161] 232…Insulation film

[0162] 270…First power path (power path)

[0163] 271…first pad portion (pad portion)

[0164] 272…first pad portion (pad portion)

[0165] 275…Load

[0166] 280…Second power path

[0167] 280A…Second pad

[0168] 281…Second power path

[0169] 281A…Second pad portion

[0170] 291…Automotive wiring board

[0171] 310…Substrate body

[0172] 320…Conductor layer

[0173] 321…Wiring pattern

[0174] 330…Insulation layer

[0175] 332…Insulation film

[0176] 370…First power path (power path)

[0177] 371…first pad portion (pad portion)

[0178] 372…first pad portion (pad portion)

[0179] 380…Second power path

[0180] 380A…Second pad

[0181] 381…Second power path

[0182] 381A…Second pad portion

[0183] 385…First load

[0184] 386…Second load

[0185] 391…Automotive wiring board

[0186] 423…Pad

[0187] 523…Pad

Claims

1. A method for manufacturing a vehicle-mounted wiring board, using a board body, wherein: The substrate body comprises: a conductor layer having a wiring pattern; and an insulating layer having an insulating film covering a portion of the wiring pattern, A part of the wiring pattern is formed as a pad portion not covered by the insulating film. The wiring pattern has a power path formed with a plurality of the pad portions, The pad portion can be joined to a conductor portion having heat dissipation properties, The manufacturing method of the vehicle-mounted wiring board includes a selection step of selecting whether to perform bonding of the conductor portion to the plurality of pad portions, the number of bondings of the conductor portion to the plurality of pad portions, and at least any one of a target of bonding to the pad portion via the conductor portion in a plurality of second power paths insulated from the power path, in accordance with the type of the vehicle on which the vehicle-mounted wiring board is mounted, A current path using the power path is formed by applying the selection result based on the selection step to the substrate portion main body.

2. The method for manufacturing a vehicle-mounted wiring board according to claim 1, wherein: In the selection step, at least one of whether to perform bonding of the conductor portion to the plurality of pad portions and the number of bonding of the conductor portion to the plurality of pad portions is selected in accordance with the type of vehicle on which the vehicle-mounted wiring board is mounted.

3. The method for manufacturing a vehicle-mounted wiring board according to claim 2, wherein: The power path is provided with a plurality of pad rows formed by arranging a plurality of the pad portions. In the selecting step, when selecting the number of the conductor portion to be joined to the plurality of pad portions, the number of the pad columns to which the conductor portion is joined is selected.

4. The method for manufacturing a vehicle-mounted wiring board according to claim 2 or 3, wherein: The plurality of pad portions are arranged in a row in the direction of current flow, When the conductor portion is selected to be joined to the pad portion in the selecting step, a joining step of joining the conductor portion to a plurality of the pad portions arranged in the direction in which the current flows is performed.

5. The method for manufacturing a vehicle-mounted wiring board according to claim 1, wherein: In the selecting step, a target to be joined to the pad portion via the conductor portion is selected from among the plurality of second power paths.

6. The method for manufacturing a vehicle-mounted wiring board according to claim 5, wherein: A second pad portion is formed in each of the second power paths, The plurality of pad portions include pad portions individually provided corresponding to each of the second pad portions, In the selecting step, the pad portion and the second pad portion corresponding to the pad portion are selected, When the pad portion and the second pad portion corresponding to the pad portion are selected in the selecting step, a joining step of joining the conductor portion to the selected pad portion and the second pad portion is performed.

7. The method for manufacturing a vehicle-mounted wiring board according to any one of claims 1 to 3, wherein: When the conductor portion is joined to the land portion, the conductor portion is surface-mounted on the substrate portion main body.

8. A vehicle-mounted wiring board, wherein: The vehicle-mounted wiring board comprises: a substrate body; and The conductor part has heat dissipation properties. The substrate body comprises: a conductor layer having a wiring pattern; and an insulating layer having an insulating film covering a portion of the wiring pattern, A part of the wiring pattern is formed as a pad portion not covered by the insulating film. The wiring pattern has a power path formed with a plurality of the pad portions, The conductor portion satisfies at least one of the following conditions: being joined to the plurality of pad portions; and being joined to at least any one of a plurality of second power pathways and the pad portion, the plurality of second power pathways being insulated from the power pathway.

9. The vehicle-mounted wiring board according to claim 8, wherein: The conductor portion is joined to the plurality of pad portions.

10. The vehicle-mounted wiring board according to claim 8, wherein A second pad portion is formed in each of the second power paths, Each of the second pad portions is arranged at a position corresponding to each of the pad portions, The conductor portion is joined to the pad portion and the second pad portion corresponding to each other.

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