System and method for cooling system and power module for inverter for electric vehicle

Abstract

A subassembly for an electrical component comprises: a first plate comprising: a wall; a stepped wall extending from opposite sides of the wall; flange elements extending outwardly from the stepped wall, each flange element defining an engagement slot; a first heat sink, the first heat sink being positioned on the wall between the stepped walls; a second heat sink; the power module is arranged between the first heat sink and the second heat sink; and a second plate, the second plate comprising: a plate wall, the plate wall extending through the second heat sink; a transition wall extending from an opposite side of the panel wall; and a pin extending from the transition wall toward the first plate and substantially perpendicular to an inner surface of the plate wall in contact with the second heat sink, where the pin is aligned with and configured to engage the engagement slot.

Description

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0002] This application claims the benefit of priority to U.S. non-provisional patent application No. 18 / 160,378 filed on January 27, 2023, which claims the benefit of priority to U.S. Provisional Patent Application No. 63 / 377,486 filed on September 28, 2022, U.S. Provisional Patent Application No. 63 / 377,501 filed on September 28, 2022, U.S. Provisional Patent Application No. 63 / 377,512 filed on September 28, 2022, and U.S. Provisional Patent Application No. 63 / 378,601 filed on October 6, 2022, the entire contents of which are incorporated herein by reference. Technical Field

[0003] Various embodiments of the present disclosure are generally directed to systems and methods that enable different processes for assembling, testing, and securing electrical components. More particularly, various embodiments of the present disclosure are directed to systems and methods that enable different processes for assembling, testing, and securing power module assemblies that may be incorporated into inverters for electric vehicles. Background Art

[0004] Inverters (such as those used to drive motors in electric vehicles) are responsible for, for example, converting high voltage direct current (HVDC) into alternating current (AC) to drive the motor. Such inverters typically implement power modules (power switching components) that convert DC to AC power and vice versa. However, the operation of these power modules may tend to generate high levels of heat. A heat sink can provide an effective way to dissipate heat by conducting heat to a fluid medium, typically via the use of a thermal interface material (TIM). For example, automotive cooling systems typically use one or more heat sinks to dissipate heat from power modules (such as those used in electric vehicles). Improper assembly and / or installation of a cooling system may cause the cooling system and / or power module to be scrapped or failed. In addition to the problems associated with cooling, electrical components including multiple power modules and / or systems incorporating these electrical components may be very complex in both the assembly process and the final post-assembly configuration. The present disclosure is intended to overcome one or more of these above-mentioned challenges. Summary of the invention

[0005] In some aspects, the technology described herein relates to a subassembly for an electrical component, the subassembly comprising: a first plate, the first plate comprising: a wall; a stepped wall extending from opposite sides of the wall; flange elements extending outward from the stepped wall, each flange element defining an engagement slot; a first heat sink, the first heat sink positioned on the wall between the stepped walls; a second heat sink; a power module, the power module between the first heat sink and the second heat sink; and a second plate, the second plate comprising: a plate wall extending through the second heat sink; a transition wall extending from opposite sides of the plate wall; and a pin extending from the transition wall toward the first plate and substantially perpendicular to an inner surface of the plate wall in contact with the second heat sink, wherein the pin is aligned with the engagement slot and is configured to engage the engagement slot.

[0006] In some aspects, the technology described herein relates to a subassembly in which a power module includes a first power module and a second power module positioned between a first contact interface of a first heat sink and a second contact interface of a second heat sink.

[0007] In some aspects, the technology described herein relates to a subassembly that further includes a thermal interface material disposed between the power module and the first and second heat sinks.

[0008] In some aspects, the technology described herein relates to a subassembly in which each flange element defines a hole configured to receive a fastener.

[0009] In some aspects, the technology described herein relates to a subassembly, which further includes: a first support member, which is positioned between a first heat sink and a second heat sink; and a second support member, which is positioned between the first heat sink and the second heat sink, wherein a power module is positioned between the first support member and the second support member along a longitudinal axis of the subassembly.

[0010] In some aspects, the technology described herein relates to a subassembly in which a panel wall is configured to elastically deform in response to application of a force directed toward a first panel on a second panel.

[0011] In some aspects, the technology described herein relates to a subassembly wherein a panel wall of the second panel includes a rib extending between the transition walls.

[0012] In some aspects, the technology described herein relates to a subassembly in which each of the ribs defines a flexure configured to elastically deform against a second heat sink upon application of a force directed toward the first plate on the second plate.

[0013] In some aspects, the technology described herein relates to a subassembly wherein a lip extends outwardly from each of the stepped walls of a first plate along a first plane parallel to a second plane including the walls, and wherein a flange element extends outwardly from the lip along the first plane.

[0014] In some aspects, the technology described herein relates to a subassembly wherein the pins of the second board are second pins, and wherein the first board includes first pins extending from the lip perpendicular to the first plane and the second plane.

[0015] In some aspects, the technology described herein relates to a subassembly wherein a first heat sink defines a first active cooling system, the first active cooling system includes a first channel, and wherein the first channel is arranged to receive a coolant flowing into the first heat sink and direct the coolant through and out of the first heat sink.

[0016] In some aspects, the technology described herein relates to a subassembly wherein a first fitting and a second fitting of a first heat sink are positioned within first and second holes defined by a first plate, wherein a power module is positioned between the first fitting and the second fitting along a longitudinal axis of the subassembly, and wherein a coolant flows through the first fitting into the first heat sink, through the first channel, and out of the first heat sink through the second fitting.

[0017] In some aspects, the technology described herein relates to a subassembly wherein a second heat sink defines a second active cooling system, the second active cooling system includes a second channel, and wherein the second channel is arranged to receive coolant flowing from a first heat sink and direct the coolant through the second heat sink and back to the first heat sink.

[0018] In some aspects, the technology described herein relates to a plate system comprising: a first plate, the first plate comprising: a wall; a stepped wall extending from opposite sides of the wall and perpendicular to the plane of the wall; a flange element extending from the stepped wall and parallel to the plane of the wall; and a first pin extending from the stepped wall toward the wall; a second plate, the second plate comprising: a plate wall; a transition wall extending from opposite sides of the plate wall; and a second pin extending from the transition wall toward the first plate, wherein the second pin is aligned with an engagement slot defined by the flange element and is configured to move through and engage with the engagement slot, respectively, and wherein one or more of the holes defined by the flange element or the first pin is configured to secure the second plate to a substrate via the first plate.

[0019] In some aspects, the technology described herein relates to a panel system in which a wall of a first panel and a panel wall of a second panel define a frame configured to house one or more heat sinks and a plurality of power modules.

[0020] In some aspects, the technology described herein relates to a panel system wherein a lip extends outwardly from each of the stepped walls of a first panel along a plane parallel to the plane of the wall, and wherein a first prong extends from the lip toward the wall.

[0021] In some aspects, the technology described herein relates to a panel system in which a panel wall is configured to elastically deform in response to the application of a force on an inner surface of the panel wall.

[0022] In some aspects, the technology described herein relates to a panel system wherein a panel wall includes a rib extending between transition walls.

[0023] In some aspects, the technology described herein relates to a panel system in which each of the ribs defines a curved structure configured to elastically deform against a second panel in response to application of a force directed toward the first panel on the second panel.

[0024] In some aspects, the technology described herein relates to a module and cooling system subassembly, which includes: a cooling system; one or more pairs of power modules, which are integrated into the cooling system; a first plate, the first plate including: a wall extending through the cooling system; a stepped wall extending from opposite sides of the wall; and flange elements extending outward from the stepped wall, each flange element defining an engagement slot; a second plate, the second plate including: a plate wall extending through the cooling system; a transition wall extending from opposite sides of the plate wall; and a pin extending from the transition wall toward the first plate and substantially perpendicular to an inner surface of the plate wall in contact with the cooling system; and a thermal interface material, the thermal interface material being integrated into the cooling system, wherein the pin is aligned with the engagement slot and is configured to engage the engagement slot.

[0025] Other objects and advantages of the disclosed embodiments will be described in part in the following description, and in part will be obvious from the description, or can be understood by practicing the disclosed embodiments. The objects and advantages of the disclosed embodiments will be realized and achieved by means of the elements and combinations particularly pointed out in the appended claims.

[0026] It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the disclosed embodiments, as claimed. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate various exemplary embodiments and, together with the description, serve to explain the principles of the disclosed embodiments.

[0028] Figure 1An exemplary system infrastructure for a vehicle including an inverter is depicted according to one or more embodiments.

[0029] Figure 2 Depicted is a method for providing a point-of-use switching controller according to one or more embodiments. Figure 1 An exemplary system infrastructure for an inverter.

[0030] Figure 3A Depicted is an isometric view of an exemplary power module assembly according to one or more embodiments.

[0031] Figure 3B Depicted is a diagram of a method according to one or more embodiments Figure 3A An exploded view of an exemplary power module assembly.

[0032] Figure 3C Depicted is a diagram of a method according to one or more embodiments Figure 3A and Figure 3B Exploded bottom view of a module and cooling system (MCS) subassembly of an exemplary power module assembly.

[0033] Figure 4A and Figure 4B Depicted is a diagram of a method according to one or more embodiments Figure 3A Top view and side elevation views of an exemplary power module assembly.

[0034] FIG. 5A to FIG. 5C Depicted is a diagram of a method according to one or more embodiments Figure 3A The exemplary power module assembly is respectively Figure 4A A cross-sectional view of the plane corresponding to the lines 5A-5A, 5B-5B and 5C-5C.

[0035] Figure 5D Depicted are embodiments including Figure 3A A bonding between the power module and the base of the power module assembly Figure 3A An enlarged view of a portion of.

[0036] Fig. 6A Depicted is a diagram of a method according to one or more embodiments Figure 3A The end of an exemplary power module assembly is from Figure 4B A front elevation view of the plane corresponding to line 6A-6A in FIG.

[0037] FIG. 6B to FIG. 6D Depicted is a diagram of a method according to one or more embodiments Figure 3A The exemplary power module assembly is respectively Figure 4B Cross-sectional view of the plane corresponding to lines 6B-6B, 6C-6C and 6D-6D.

[0038] Fig. 7A Depicted is a diagram of a method according to one or more embodiments Figure 3A A front elevation view of the end of the power module assembly after the second plate is pressed.

[0039] Figure 7B Depicted is a diagram of a method according to one or more embodiments Figure 3A The first and second plates of the power module assembly are connected with Fig. 7A The states of the first and second plates shown correspond to a close-up of a joint.

[0040] Fig. 8A Depicted is an isometric view of an exemplary module and cooling system (MCS) subassembly according to one or more embodiments.

[0041] Figure 8B Depicted is an isometric view of an exemplary base for a power module assembly according to one or more embodiments.

[0042] Fig.9A and Fig. 9B Depicted is a diagram of a method according to one or more embodiments Fig. 8A Top and bottom views of the subassembly.

[0043] Fig. 10A and Fig. 10B Depicted is a diagram of a method according to one or more embodiments Figure 8B Top and bottom views of the subassembly.

[0044] Fig.11 Depicted is a top view of an exemplary power module according to one or more embodiments.

[0045] Figures 12 to 15 Depicted are isometric views of various panels according to one or more embodiments.

[0046] Fig.16A and Fig. 16B Depicted are isometric and front elevation views of a panel according to one or more embodiments. DETAILED DESCRIPTION

[0047] Both the foregoing general description and the following detailed description are exemplary and explanatory only and do not constrain the claimed features. As used herein, the terms "comprises," "comprising," "has," "having," "includes," "including," or other variations thereof are intended to encompass non-exclusive inclusions such that a process, method, article, or device that includes a series of elements includes not only those elements, but may also include other elements that are not explicitly listed or inherent to such process, method, article, or device. In the present disclosure, unless otherwise stated, relative terms (such as, for example, "about," "substantially," and "approximately") are used to indicate possible ±10% variations in the stated values. In the present disclosure, unless otherwise stated, any numerical value may include possible ±10% variations in the stated values.

[0048] The terms used below may be interpreted in their broadest reasonable manner, although they are being used in conjunction with a detailed description of certain specific examples of the present disclosure. Indeed, certain terms may even be emphasized below; however, any term intended to be interpreted in any constrained manner will be explicitly and specifically defined as such in this detailed description. For example, in the context of the present disclosure, a switching device may be described as a switching element or device, but may refer to any device for controlling power flow in a circuit. For example, a switching element may be, for example, a metal oxide semiconductor field effect transistor (MOSFET), a bipolar junction transistor (BJT), an insulated gate bipolar transistor (IGBT) or a relay, or any combination thereof, but is not limited thereto.

[0049] Various embodiments of the present disclosure relate generally to systems and methods for testing and securing electrical components, and more particularly to systems and methods for: (1) testing a power module used in a power module assembly (such as a power module assembly that may be incorporated into an inverter for an electric vehicle); and (2) securing the power module assembly to another electrical component, such as a substrate incorporated into an inverter for an electric vehicle.

[0050] Inverters (such as those used to drive motors in electric vehicles) are responsible for converting high voltage direct current (HVDC) into alternating current (AC) to drive the motor. A three-phase inverter may include a bridge having six power device switches (e.g., power transistors such as IGBTs or MOSFETs) that are controlled by pulse width modulation (PWM) signals generated by a controller. The inverter may include three half-H-bridge switches to control phase voltages, upper and lower gate drivers to control the switches, a PWM controller, and glue logic between the PWM controller and the gate driver. The PWM controller may generate signals to define the expected state of the system. The gate driver may send signals from the PWM controller to the half-H-bridge switches. The half-H-bridge switches may drive the phase voltages. The inverter may include an isolation barrier between a low voltage plane and a high voltage plane. The signal may be passed from the PWM controller to the half-H-bridge switch by passing through the isolation barrier, which may employ optical, converter-based, or capacitor-based isolation. The PWM signal may be distorted when passing through the glue logic, which may include resistive, capacitive, or other types of filtering. Due to the electrical isolation barrier and other delays within the gate driver, the PWM signal may be distorted when passing through the gate driver. The PWM signal may be distorted when the signal is processed by the half-H switching element via the gate driver output.

[0051] Gate drivers withstand common-mode transients that occur during field effect transistor (FET) switching and when one side of a floating high voltage terminal is shorted to ground or subjected to electrostatic discharge. These voltage transients can cause fast edges that can form common-mode current bursts through electrical isolation. Gate drivers may need to demonstrate common-mode transient immunity (CMTI) in order to be effective and safe.

[0052] The gate driver may have a high voltage domain in common with the voltage plane of the associated FET. Further, the high voltage plane may be supplied by a flyback converter, which may be isolated from the low voltage plane by a transformer. The high voltage domain power supply may be used to provide power to such a circuit that sources and sinks gate current to drive the FET and can detect FET faults, thereby acting on the faults and / or transmitting the faults to the low voltage domain. The gate driver may include an electrical channel dedicated to FET commands, and one or more bidirectional or unidirectional electrical channels dedicated to FET communications.

[0053] High current switching transients can form strong electromagnetic (EM) fields that can couple into nearby metal traces. The magnitude and frequency of the coupled current can depend on the layout of the FET packaging solution and the direction and length of the metal traces between the FET and the control integrated circuit (IC). For example, a typical value for the coupled current can be up to 1A at an AC frequency of up to 100MHz. Typically, within the circuit, the gate driver IC can be placed far enough away from the FET so that the high EM field is not directly coupled into the internal metal traces within the gate driver IC. The gate driver is placed at a distance from the EM field so that the induced current within the circuit is below the level that will cause the gate driver to malfunction, or a metal shield is placed between the gate driver and the source of the EM field to protect the gate driver circuit. The output terminals of the gate driver connected to the FET are exposed to the EM field at a point where the output terminals are no longer covered by the shield. The gate driver switches large currents (e.g., such as 5A to 15A) through these exposed terminals. The large currents switched are usually larger in magnitude than the EM induced current. The gate driver can overdrive the induced current to maintain control of the FET. The gate driver and the high side of the FET may share a common ground and gate control signal trace, both of which may be susceptible to coupled currents.

[0054] The gate driver can turn on low resistance switches to source and sink gate current. Sometimes a series resistor can be added to limit the gate current. The switched gate current can be greater than the coupling current in order to maintain control of their respective FETs.

[0055] The gate driver may be able to sense the FET operating voltage or current in order to provide feedback and react to faults. An overcurrent fault may typically be detected by sensing the FET drain to source voltage and comparing the sensed voltage to a reference value. The sensed voltage may be heavily filtered to reject coupled currents. Filtering may slow the response to a fault condition, causing a delay in response. For example, the rate of current increase due to a low resistance short may reach damaging levels before being detected by a heavily filtered drain to source voltage detection strategy. The resulting short may damage the FET or the vehicle before being detected and cut off.

[0056] According to one or more embodiments, a FET driver circuit may provide fast overcurrent detection by shunt current sensing, or by diverting a portion of the load current through a parallel FET that may have a current sensing circuit. Utilizing either strategy may require a "point of use IC" in which the sensing circuit is very close to the FET. Even if the point of use IC and the remote controller are resistant to EM fields, the communication between the point of use IC and the remote controller is still susceptible to induced currents. Point of use ICs have been implemented in low EM field applications, such as smart FETs for automotive applications. However, point of use ICs have not yet been used in high EM field applications. High EM fields can be fields that (i) induce a current within the IC that exceeds the operating current of the IC and causes a malfunction, or (ii) induce a differential voltage within the IC that exceeds the operating differential voltage and causes a malfunction. High EM fields can be, for example, fields greater than about 10A or about 100V.

[0057] A power module assembly for an inverter (such as those discussed above) may incorporate a cooling system that may include two active heat sinks on either side (e.g., opposite top and bottom sides) of one or more electrical components (such as a power module). An active heat sink may be a heat sink having a component (e.g., a fin or a compartment) through which a coolant material flows. For simplicity, the present disclosure refers to the electrical components as power modules, substrates, printed circuit boards (PCBs), and combinations thereof, but it will be understood that the techniques disclosed herein may be applicable to any electrical component (e.g., a power switch, a chip, a chip component, a controller, etc.) that can generate heat. According to one or more embodiments, the power module assembly may include two active heat sinks. These heat sinks may provide heat dissipation by drawing heat away from one or more die (also referred to as power switches) toward a surface area of ​​the power module, and further toward a portion of the active heat sink that is in direct or indirect contact with a cooling medium (e.g., a coolant or air) associated with the active heat sink.

[0058] Heat sinks can provide an efficient way to dissipate heat by thermally conducting the heat into a fluid medium, typically through the use of a thermal interface material (TIM). For example, automotive cooling systems typically use one or more heat sinks to dissipate heat from power modules, such as those employed in electric vehicles. Although system performance demands requiring lower thermal resistance, such as those in the electric vehicle industry, continue to rise, the performance capabilities of various electrical components, such as power modules in general, power modules for inverters, and inverters in general, remain limited by the cooling capabilities of conventional heat dissipation components. In addition to cooling-related issues, securing heat dissipation components, such as active heat sinks, in place can be complicated, and current solutions provide poor force distribution onto the electrical components.

[0059] In some electrical components that include multiple power modules, clamps may be used to provide pressure to hold down the TIMs during the respective service lives of these components. However, these clamp configurations do not adequately consider the design complexity, material expense, and risk of coolant leakage involved in the use of heat sinks. In particular, the use of such clamps, which may be complex in configuration and implementation, may provide uneven loading at the sealing area where coolant passes from one heat sink to another. Such problems present the risk of causing electrical components having multiple power modules and those types of components electrically connected thereto to be inoperable or to operate improperly due to such problems or resulting damage to the electrical components.

[0060] In addition to the problems associated with cooling, electrical components including multiple power modules and / or systems incorporating these electrical components may be very complex in both the assembly process and the final post-assembly configuration. There may be a high cost to scrap components including multiple power modules. These processes, which are intended to reduce the situation where such electrical components or systems including these components have to be scrapped, may require significant testing before operation. However, methods for testing assemblies of multiple power modules before incorporating or installing them into a system or even a portion thereof, such as a substrate (e.g., a printed circuit board (PCB)), have not yet been developed. More specifically, known designs of electrical components including multiple power modules do not support testing the multiple power modules together as an assembly, and often result in high costs due to the need for additional die casting and / or additional assembly processes. For example, in some electrical components including multiple power modules and fixtures as described above, portions of the fixture may plastically deform the heat sink "sheet" during assembly or handling. This, in turn, may cause reduced force application, reduced thermal performance, and suboptimal overall operation on various subcomponents (e.g., heat sink, power module).

[0061] Other assembly processes for electrical components including multiple power modules may involve lead forms for signal pins, which may then be positioned and soldered to a PCB. The total pin count for such processes may be relatively high. Differences in lead length and flexibility between signal pins cause high differences in the conditions required to position and solder each signal pin during assembly. Furthermore, because positioning the signal pins to the PCB is typically performed manually and the leads for the signal pins are susceptible to deformation, the scrap rate for these high-value components may be significant.

[0062] Therefore, there is a need for a power module assembly component that enables the sub-processes for assembling, testing, and securing the power module assembly to another electrical component (such as a substrate incorporated into an electric vehicle) to be integrated and performed in a manner that reduces the scrap rates associated with the overall verification and installation processes of these types of electrical components and systems.

[0063] It may be desirable to improve the cooling system functionality in a power module assembly, for example, by using a combination of plates that uniformly apply a compressive force to the heat sink. In turn, a tightly held assembly between the heat sink and the power module can be maintained, and the active heat sinks can be reliably secured to each other and to a base that can be connected to the substrate. In one example, when the power module converts HVDC to AC and vice versa, the substrate can facilitate the operation of other electrical components (such as a motor in an electric vehicle) based on the electrical connection to the power module. Applying a uniformly distributed force on one or both active heat sinks can reduce the thermal resistance between the power module and the active heat sink. This in turn can facilitate greater heat dissipation and improved cooling of the power module, and potentially improve the operating performance of the power module (or the power module assembly as a whole) and / or extend the operating life of the power module.

[0064] Thus, according to one aspect of the present disclosure, the exemplary plate system described herein provides a solution involving uniformly applying force to a heat sink of a power module assembly within a heat transfer axis. More specifically, the exemplary configuration of a first plate and a second plate incorporated into a power module assembly described herein provides a low-complexity modular structure that is configured to apply a substantially uniformly distributed force on a heat sink included in a corresponding power module assembly. Thus, these heat sinks can be uniformly pressed against the power module, which in turn results in low thermal resistance and uniform distribution of thermal interface material (TIM) therebetween. The reduced thermal resistance can result in improved cooling of the power module during operation. In addition, the uniform distribution of the TIM between the heat sink and the power module can minimize the chance of hot spots forming between these components, which could otherwise result in less TIM persisting in some areas relative to other areas.

[0065] According to one aspect of the present disclosure, a power module assembly may require a series of tests before being put into use, for example, in an electric vehicle. According to one aspect of the present disclosure, the power module assembly may include a base subassembly mounted between a power module (and the leads of corresponding signal pins of the power module) and a substrate (such as a PCB). More specifically, a base as a subassembly of the power module assembly may be mounted between a power module and a PCB having independent soldering terminals or compliant pins that engage (e.g., insert) the PCB. With such a base installed, the signal pins of the power module may be laser welded to the terminals of the base to form an electrical connection with the PCB. The method allows testing of (sub)assemblies of multiple power modules before or after welding, and can greatly improve the manufacturing assembly process from the perspectives of success rate, time and material cost.

[0066] Figure 1 An exemplary system infrastructure for a vehicle including an inverter according to one or more embodiments is depicted. Figure 1 As shown, the electric vehicle 100 may include an inverter 110, a motor 190, and a battery 195. The inverter 110 may include a component for receiving electric power from an external source and outputting electric power to charge the battery 195 of the electric vehicle 100. For example, the inverter 110 may convert DC power from the battery 195 in the electric vehicle 100 into AC power to drive the motor 190 of the electric vehicle 100, but the embodiment is not limited thereto. For example, the inverter 110 may be bidirectional and may convert DC power into AC power, or convert AC power into DC power, such as during regenerative braking. The inverter 110 may be a three-phase inverter, a single-phase inverter, or a multi-phase inverter.

[0067] Figure 2 Depicted is a method for providing a point-of-use switching controller according to one or more embodiments. Figure 1 1. An exemplary system infrastructure of an inverter 110 of an electric vehicle 100. The electric vehicle 100 may include an inverter 110, a motor 190, and a battery 195. The inverter 110 may include an inverter controller 300 for controlling the inverter 110. The inverter 110 may include a low voltage upper phase controller 120 separated from a high voltage upper phase controller 130 by an electrical isolator 150, and an upper phase power module 140. The upper phase power module 140 may include a point-of-use upper phase controller 142 and an upper phase switching element 144. The inverter 110 may include a low voltage lower phase controller 125 separated from a high voltage lower phase controller 135 by an electrical isolator 150, and a lower phase power module 145. The lower phase power module 145 may include a point-of-use lower phase controller 146 and a lower phase switching element 148. The upper phase switching element 144 and the lower phase switching element 148 may be connected to the motor 190 and the battery 195. The electrical isolator 150 may be one or more of optical, transformer-based, or capacitance-based isolation. For example, the electrical isolator 150 may be one or more capacitors having a value from about 20 fF to about 100 fF, having a breakdown voltage from about 6 kV to about 12 kV. The electrical isolator 150 may include a pair of capacitors, wherein one capacitor in the pair carries an inverted data signal from the other capacitor in the pair to form a differential signal that is rejected for common mode noise. The electrical isolator 150 may include more than one capacitor in series. The electrical isolator 150 may include one capacitor located on a first IC, or may include a first capacitor located on a first IC and a second capacitor located on a second IC that communicates with the first IC.

[0068] The inverter 110 may include a low voltage region (e.g., where the voltage is typically less than 5V) and a high voltage region (e.g., where the voltage may exceed 500V). The low voltage region may be separated from the high voltage region by an electrical isolator 150. The inverter controller 300 may be in the low voltage region of the inverter 110, and may send a signal to and receive a signal from the low voltage upper phase controller 120. The low voltage upper phase controller 120 may be in the low voltage region of the inverter 110, and may send a signal to and receive a signal from the high voltage upper phase controller 130. The low voltage upper phase controller 120 may send a signal to and receive a signal from the low voltage lower phase controller 125. The high voltage upper phase controller 130 may be in the high voltage region of the inverter 110. Therefore, the signal between the low voltage upper phase controller 120 and the high voltage upper phase controller 130 passes through the electrical isolator 150. The high voltage upper phase controller 130 may send signals to and receive signals from a point-of-use upper phase controller 142 in the upper phase power module 140. The point-of-use upper phase controller 142 may send signals to and receive signals from an upper phase switch 144. The upper phase switch 144 may be connected to a motor 190 and a battery 195. For example, the upper phase switch 144 and the lower phase switch 148 may be used to transfer energy from the motor 190 to the battery 195, from the battery 195 to the motor 190, from an external source to the battery 195, or from the battery 195 to an external source. The lower phase system of the inverter 110 may be similar to the upper phase system described above.

[0069] Figure 3A An isometric view of an exemplary power module assembly 600 according to one or more embodiments is depicted. The power module assembly 600 may include a power module 612 integrated into an exemplary cooling system 620. The cooling system 620 may include first and second heat sinks 624, 630 held in position relative to the power module 612 (e.g., above and below the power module 612, or otherwise on opposite sides of the power module) by first and second plates 640, 650. As shown, the first and second plates 640, 650 may be configured to attach the power module 612 and the cooling system 620 to a base 670. The first and second plates 640, 650 may secure the power module 612 to the base 670 in such a manner that the signal pins 613 of the power module 612 (which provide electrical leads and extend outside the cooling system 620) may be connected to the signal pin terminals mounted in the base 670, and thereby provide an electrical connection between the power module 612 and the base 670.

[0070] The exemplary configuration of the first and second plates 640, 650 in the power module assembly 600 provides a low-complexity modular structure that defines a frame that can effectively accommodate the power module 612 and the first and second heat sinks 624, 630. In addition, the first and second plates 640, 650 provide a modular structure that can apply a substantially uniformly distributed force on the first and second heat sinks 624, 630 and particularly along the longitudinal axis of the power module assembly 600. The first and second heat sinks 624, 630 can be uniformly pressed against the power module 612, which in turn causes a low thermal resistance therebetween. Therefore, the first and second plates 640, 650 uniformly apply force to the first and second heat sinks 624, 630 within the axis or plane of heat transfer (i.e., the axis or plane perpendicular to the longitudinal axis of the power module assembly 600).

[0071] Those skilled in the art will recognize that Figure 3A The cooling system 620 shown including two actively cooled heat sinks is an exemplary cooling system. According to the present disclosure, the cooling system described herein that can be incorporated into the exemplary power module assembly can include one heat sink, two heat sinks, can use one-sided active or passive cooling, dual-sided active cooling, dual-sided passive cooling, or dual-sided cooling provided by one active cooling component and one passive cooling component.

[0072] Figure 3B Depicted Figure 3A 602B. The base 670 includes a body 672 defining an outer edge 674 that surrounds a recessed wall 676 that defines first and second holes 602A, 602B in opposite ends of the body 672 of the base 670. Along the longitudinal axis of the base 670, the recessed wall 676 includes a first rib 678 that defines a third hole 602C between the first and second holes 602A, 602B.

[0073] like Figure 3B As shown, the body 672 of the base 670 may also: (1) define a pin slot 682 within the outer edge 674; and (2) have a raised edge 689 integrated therein, which is disposed above the hole 684 defined by the body 672. The pin slots 682 can facilitate electrical connection between the power module assembly 600 and another electrical component (such as a substrate incorporated into an electric vehicle). In one embodiment, each pin slot 682 can receive one or more electrical connectors 830, which include one or more vertically extending connection pins 835 and horizontally extending signal pin terminals 850, such as Figure 5A and Figure 8B In one example, each connection pin 835 can be configured to extend from the bottom surface 805 of the base 670, such as FIG. 4B to FIG. 5C As shown, and is inserted into another electric component (e.g., substrate, inverter, inverter housing) incorporated into the electric vehicle.

[0074] The base 670 may be disposed between the signal pins 613 of the power module 612 and a substrate (e.g., a PCB). In addition, the base 670 may be connected to the substrate via vertically extending connection pins 835, which may be composed of compliant pins that can be attached to the substrate. In an embodiment, the base 670 may include independent solder terminals for connecting to the substrate. The signal pins 613 of the power module 612 may be laser welded to corresponding signal pin terminals 850 (see FIG. 1 ) installed in the base 670. Figure 5A and Figure 8B ) to provide a connection between the base 670 and the power module 612.

[0075] Thus, by incorporating the base 670, the signal pins 613 for the power module may not be directly soldered to the substrate. In one embodiment, the signal pins 613 are not directly soldered to the substrate. Fig. 8A As described in more detail, the configuration provided with the base 670 allows for module testing before or after welding and can greatly improve the manufacturing assembly process, resulting in fewer power module assemblies being lost or scrapped due to welding and other assembly problems.

[0076] On each side of the first plate 640 extending along its longitudinal axis, the first prongs 644 extend downwardly from a lip 643 of the first plate 640 toward the base 670. Each lip 643 extends outwardly from the top of a corresponding stepped wall 646 and defines an edge along the longitudinal axis from which a flange member 648 also extends outwardly relative to the corresponding stepped wall 646. Walls 647 extend between the stepped walls 646 and define fourth and fifth holes 602D, 602E on opposite ends of the first plate 640. In one embodiment, the body 672 of the base 670 defines a plurality of first engagement slots 680 configured to engage and retain the first prongs 644 extending from the first plate 640. The first pins 644 of the first plate 640 and the first engagement slots 680 of the base 670 together define a first inter-subassembly connection between the base 670 and a module and cooling system subassembly 610 ("MCS 610") that includes the first plate 640 and is hereinafter referred to as Figure 3C Discuss in more detail.

[0077] Similar to the recessed wall 676 of the base 670, the wall 647 of the first plate 640 defines a sixth hole 602F defined by the second rib 649. The second rib 649 and the fourth to sixth holes 602D, 602E, 602F correspond to the first rib 678 and the first to third holes 602A, 602B, 602C of the base 670, respectively. In addition, the stepped wall 646 may correspond to the side wall of the recessed wall 676 of the base 670 so that the first plate 640 may be fitted into the recessed wall 676. In addition, the seventh hole 602G in the flange element 648 of the first plate 640 may correspond to the hole 684 formed in the base 670. Figure 3A As shown, each combination of the seventh hole 602G and the aperture 684 can receive a fastener 690 that secures / attaches the first plate 640 to the base 670 .

[0078] Figure 3C Depicted Figure 3A and Figure 3B FIG. 6 is a bottom exploded view of a module and cooling system subassembly 610 of an exemplary power module assembly 600. In one embodiment, first and second apertures 602A, 602B define access to a cooling system inlet and outlet, respectively. In particular, the first aperture 602A can be configured to accommodate fluid communication between a first port 626 of a first heat sink 624 of the cooling system 620 and a coolant (or other fluid) carrying conduit (not shown). Thus, the first aperture 602A can facilitate the flow of coolant (or other fluid) into the cooling system 620 of the power module assembly 600. The coolant flow can be provided by a connection between a conduit and a first fitting 627A disposed on the underside of the first heat sink 624.

[0079] Similar to the first hole 602A, the second hole 602B can be configured to accommodate fluid communication between the second port 628 of the first heat sink 624 of the cooling system 620 and another coolant (or other fluid) carrying conduit (not shown). Thus, the second hole 602B can facilitate the flow of coolant (or other fluid) from the cooling system 620 of the power module assembly 600. In one example, this can be provided by a connection between another conduit and a second fitting 627B disposed on the underside of the first heat sink 624. The first and second holes 602A, 602B can be configured to receive the first and second fittings 627A, 627B.

[0080] like Figure 3C As shown, the first and second heat sinks 624, 630 and the integrated power module 612 are positioned between the first plate 640 and the second plate 650. As described above, the first heat sink 624 and the second heat sink 630 are Fig. 6A602A and 602B are positioned between the first and second heat sinks 624, 630 and on an end of the power module assembly 600 corresponding to a cooling system inlet defined by the first hole 602A of the base 670. Similarly, a second gasket 621B and a second support 622B are positioned between the first and second heat sinks 624, 630 and on an end of the power module assembly 600 corresponding to a cooling system outlet defined by the second hole 602B of the base 670. Figure 3B As shown, the first heat sink 624 includes a first contact interface 625 positioned below the power module 612. Figure 3C , the second heat sink 630 includes a second contact interface 632 positioned above the power module 612 .

[0081] Figure 3C (as well as Figure 3B ) depicts the location of three pairs of power modules 612 relative to components of the cooling system 620. Each power module 612 may include a module subassembly 618 defined by a combination of a substrate 614 and a lead frame 615 disposed on opposite sides of the substrate 614. In one example, a die and various metallization and ceramic layers may be incorporated between the substrate 614 and the lead frame 615 of each module subassembly 618. In one embodiment, the die may include a silicon carbide (SiC)-based die that provides, for example, relatively high power density and efficiency required to extend battery range and performance in, for example, electric vehicles. Signal pins 613 and module terminals 617 extend outwardly from each module subassembly 618 relative to the longitudinal axis of the power module assembly 600. Each power module 612 may include one or more module terminals 617. In addition, each power module 612 may include a metallization layer (e.g., a copper layer) positioned above and below the corresponding module subassembly 618.

[0082] Each pair of power modules 612 positioned between first and second supports 622A, 622B along the longitudinal axis provides a phase power module 612 such as Figure 2 The upper phase power module 140 or the lower phase power module 145 shown and discussed above. Figure 3A , Figure 3B and Figure 3C The illustrated power module assembly 600 includes first, second, and third phase power modules 612A, 612B, 612C, which must be effectively cooled by a cooling system 620 in order to operate continuously as part of an inverter such as may be included in, for example, an electric vehicle.

[0083] The first and second heat sinks 624, 630 of the cooling system 620 provide active cooling on the top and bottom sides of the power module 612. That is, coolant can pass from the first end to the second end of the power module assembly 600 through both the first and second heat sinks 624, 630. Figure 3B and Figure 3C As shown, at least the first port 626 of the first radiator 624, the first gasket 621A, the first support 622A, and the first port 634 of the second radiator 630 define an inlet flow path for the cooling system 620. On the other hand, at least the second port 636 of the second radiator 630, the second support 622B, the second gasket 621B, and the second port 628 of the first radiator 624 define an outlet flow path for the cooling system 620.

[0084] The first port 626 of the first heat sink 624 serves as both: (1) an inlet for coolant to enter and flow longitudinally through the first heat sink 624, and (2) an outlet or first pass-through port for coolant to flow vertically through the first heat sink 624 and onto the second heat sink 630. Similarly, the second port 628 of the first heat sink 624 provides both: (1) an outlet for coolant to flow longitudinally through the first heat sink 624, and (2) an inlet or second pass-through port for coolant from the second port 636 of the second heat sink 630. The coolant flows out of the second heat sink 630 after passing through a plurality of channels extending within the second heat sink 630 along the longitudinal axis of the power module assembly 600.

[0085] like Figure 3B and Figure 3C As shown, the second plate 650 is positioned above the second heat sink 630. The second plate 650 may include a plate wall 652 extending along the longitudinal axis of the power module assembly 600, and a series of legs 654 extending downward from each side of the plate wall 652 at a substantially right angle relative to a plane corresponding to the plate wall 652. Each of the legs 654 may include a second pin 656 at an end of the leg 654. Each second pin 656 may include two spring halves configured to be received by the second plate 650 and secure the second plate to a corresponding second engagement slot 642 provided in the first plate 640.

[0086] The advantages of the combination of the first and second plates 640, 650 will now be discussed in more detail with respect to design considerations that accompany the use of a double-sided active cooling system and providing a thermal interface material (TIM) between the first and second contact interfaces 625, 632. However, one of ordinary skill in the art will recognize that the first and second plates 640, 650 can be used in implementations that include multiple power module assemblies and the following: (1) double-sided cooling using passive and active cooling components (e.g., a first passive heat sink includes fins exposed to the ambient environment and a second active heat sink includes channels through which a coolant flows); (2) single-sided active cooling; (3) single-sided passive cooling; and (4) double-sided passive cooling.

[0087] In practice, Fig. 7A and Figure 7B As shown, the first and second plates 640, 650 may provide a snap feature at each second engagement slot 642, which engages / is engaged by the two spring halves of the second pin 656, thereby locking the second pin 656 in place. Thus, the first and second plates 640, 650 may provide a two-piece snap system that provides a distributed clamping load to both sides of the cooling system 620 and, therefore, to the power modules 612 of the power module assembly 600. In addition, the configuration of each plate and the interaction between the second engagement slot 642 of the first plate and the second pin 656 of the second plate 650 provide a design that allows modular assembly and testing of a subassembly including all of the power modules in the power module 612.

[0088] The combination of the first and second plates 640, 650 evenly distributes the force along the longitudinal axis of the power module assembly 600 where the pressure is most critical. More specifically, once the force is applied to the second plate 650 so that the second pin 656 of the second plate 650 engages and is fixed to the second engagement groove 642 of the first plate 640, the second plate 650 can be placed in a tensioned state relative to the first plate 640 and exerts a force on the second heat sink 630. Therefore, the plate wall 652 of the second plate 650 exerts pressure on the upper surface of the second heat sink 630. Due to the configuration (e.g., arrangement, spacing, size, etc.) of the third ribs 658 provided to the second plate 650, the distribution of the force applied by the second plate 650 to the second heat sink 630 is substantially uniform along its respective length and width. As a further result of the uniform distribution of the force on the second heat sink 630 by the second plate 650, the force applied by the second heat sink 630 to the power module 612 and the TIM disposed between the first and second heat sinks 624, 630 is also substantially uniform.

[0089] In addition to the advantages discussed above with respect to force distribution, the plate system including the first and second plates 640, 650 also provides vibration robustness when the plate system is directly mounted to the base 670. The first and second heat sinks 624, 630 are also electrically grounded via the first and second plates 604, 650. This is a result of the direct contact between: (1) the surface of the housing of the first heat sink 624 and the recessed wall 676 of the first plate 640; and (2) the surface of the housing of the second heat sink 630 and at least the third rib 658 of the plate wall 652 of the second plate 650. The combination of the first and second plates 640, 650 also allows the die 619 of the power module 612 to be sintered or soldered to either of the first and second heat sinks 624, 630.

[0090] Figure 4A and Figure 4B Depicted Figure 3A 600. As described above, Figure 3B and Figure 3C The illustrated first pins 644 of the first plate 640 and the first engagement slots 680 of the base 670 define a first inter-subassembly connection between the base 670 and the MCS 610 . Figure 4A and Figure 4B A second, third, and fourth inter-subassembly connection between the base 670 and the MCS 610 are depicted.

[0091] More specifically, the second connection is defined by a physical connection between the MCS 610 and the base 670, which is provided with: (1) (a) a seventh hole 602G defined by the flange element 648 of the first plate 640 (see Figure 3B ) with (b) the alignment of the apertures 684 defined by the body 672 of the base 670; and (2) the incorporation of fasteners 690 that secure the flange member 648 (and the first plate 640) to the base. In contrast to the second inter-subassembly connection, both the third and fourth connections provide physical and electrical connections between the subassemblies defined by the base 670 and the MCS 610. In particular, the signal pins 613 of the power module 612 are laser welded to the signal pin terminals 850 (as shown in reference 640) that are secured to the base 670. Figure 5A and Figure 5B689 and the hole 684. In some exemplary assembly processes, the module terminal 617 may be electrically connected to a bus bar (not shown). In addition, one or more of the holes 684 may accommodate a nut or threaded insert under the corresponding raised edge 689 to help attach the module terminal 617 to the base 670 with a screw. Thus, the raised edge 689 and the portion of the base 670 defining the hole 684 may provide support and a mechanical nut for receiving a screw. In an example, the module terminal 617 may be welded (laser welded) to the bus bar (not shown), and the raised edge 689 and the hole 684 will not receive the screw, but provide support for the module terminal 617 and the bus bar for the assembly process. In the above-described assembly process involving module terminals 617, attachment of module terminals 617 to base 670 via holes 684 and raised rims 689 or use of the module terminals as supports may occur after MCS 610 has been tested for operational integrity.

[0092] Figure 4A The locations of the longitudinal cross-section of the power module assembly 600 where key components including the first and second plates 640, 650 are located are identified. More specifically, lines 5A-5A, 5B-5B, and 5C-5C correspond to planes from which components responsible for securing the first and second plates 640, 650 to each other and the base 670 can be seen.

[0093] Figure 4B The positions of the cross-sections of the power module assembly 600 that are orthogonal to the longitudinal axis and in which the force distribution capabilities of the board system are demonstrated are identified. More specifically, lines 6A-6A, 6B-6B, 6C-6C, and 6D-6D correspond to planes from which components responsible for ensuring that the distribution of forces applied to the second heat sink 630 and the TIM between the first and second heat sinks 624, 630 are substantially uniform along the longitudinal axis of the power module assembly 600.

[0094] FIG. 5A to FIG. 5C Depicted Figure 3A The exemplary power module assembly is respectively Figure 4A A cross-sectional view of the plane corresponding to the lines 5A-5A, 5B-5B and 5C-5C. Figure 5A The junction between the signal pin 613 and the signal pin terminal 850 is depicted. Figure 5D (It depicts Figure 5A An enlarged view of a portion of the engagement between one of the power modules 612 and the base 670 of the power module assembly 600 is included to aid in the description of the embodiment of the present invention. Figure 5ADiscussion of the features shown.

[0095] Prior to providing these jointed assembly processes defining the third inter-subassembly connection between the base 670 and the MCS 610, the signal pin terminals 850 of each electrical connector 830 may be inserted into a corresponding pin slot 682 defined by the body 672 of the base 670. In one embodiment, the electrical connector 830 may be inserted into the corresponding pin slot 682 from above the base 670 such that the signal pin terminals 850 are aligned with respect to the base 670. Figure 5D Once the electrical connector 830 has been inserted through the pin slots 682 so that the tabs 845 have moved past the bottom surface 805 of the base 670, the electrical connector 830 can be rotated to fit into the pin recesses 860 formed on the upper surface 855 of the base 670 and corresponding to the corresponding pin slots 682.

[0096] In one embodiment, the electrical connector 830 can be provided in a flat configuration such that the corresponding signal pin terminals 850 are not disposed at a right angle relative to the connecting pins 835 of the electrical connector 830. More generally, the electrical connector 830 is straight, rather than having a 90° bend. After insertion, the signal pin terminals 850 can be manipulated to extend horizontally or otherwise be substantially parallel to a portion of the upper surface 855 of the base 670 and be fitted into the pin recess 860 defined by the protrusion 865 extending from the upper surface 855, as shown in FIG. Figure 5D Each pin recess 860 is capable of accommodating a signal pin terminal 850 and a signal pin 613 from a power module 612 .

[0097] like Figure 5A As shown, each electrical connector 830 includes a tab 845 extending between a corresponding signal pin terminal 850 and a connecting pin 835. Each tab 845 can interface with the bottom surface 805 of the base 670 to limit the extent to which the electrical connector 830 can be inserted through the corresponding pin slot 682 from the bottom surface 805, or otherwise limit the movement of the electrical connector 830 toward the upper surface 855 of the base 670. In one embodiment, the pin slot 682 can be narrower in a portion configured to receive the tab 845 so that the tab 845 is friction fit into the pin slot 682.

[0098] Figure 5B The engagement between the first pin 644 of the first plate 640 and the first engagement slot 680 of the base 670 is depicted, which defines a first inter-subassembly connection between the base 670 and the MCS 610. In one example, the first engagement slot 680 can be defined by the body 672 of the base 670 to have a profile (not shown) that can include slight protrusions. These protrusions can extend inwardly toward the center of the corresponding first engagement slot 680 sufficient to engage with the edge of the corresponding first pin 644. The edge can have a shape such as Figure 3C The protrusions shown may be curved or otherwise configured to facilitate engagement with the first engagement slot 680 .

[0099] The engagement between these structures may sufficiently secure the MCS 610 to the base 670 to the extent that other assembly and testing processes may be performed without having to secure the MCS 610 to the base 670 using the fasteners 690. For example, it may be possible to test electrical connections through the electrical connectors 830 and between electrical components and the signal pins 613 for one, more than one, or all of the power modules 612 without first fastening the MCS 610 to the base 670 using the fasteners 690. In turn, significant time may be saved in assembling and installing a fully functional power module assembly 600.

[0100] As an example, it may be the case that testing of the power module assembly 600 reveals that one or more of the power modules 612 are not operating properly. With the first pins 644 providing the primary physical connection between the base 670 and the MCS 610, the removal and installation of another MCS 610 or a modified / repaired version of the MCS 610 that failed the test, the removal and addition of the fasteners 690 to the power module assembly 600 may be skipped entirely.

[0101] Figure 5C The engagement between the second prongs 656 of the second plate 650 and the second engagement slots 642 of the first plate 640 is depicted. As shown, the distal end 880 of each spring half 875 of each second prong 656 protrudes through the corresponding second engagement slot 642 and at least partially enters the third engagement slot 890 defined by the body 672 of the base 670. In addition, each second prong 656 defines one or more notches 885 on one side of each spring half 875.

[0102] In one embodiment, the distal end 880 of the second pin 656 protrudes slightly through the second engagement slot 642 and into the corresponding third engagement slot 890 (eg, Figure 6C 640) can be used to align the MCS 610 onto the base 670. In one embodiment, when the second prong 656 passes or is pressed through the corresponding second engagement slot 642 in the first plate 640 (e.g., when the second plate 650 is pressed toward the base 670), the spring halves 875 can retract toward each other until the corresponding notches 885 receive the inner edges of the corresponding second engagement slot 642 of the first plate 640.

[0103] The spring half 875 may be sized to be longer and / or have more than one notch 885 formed on an edge thereof. In one or more embodiments, the distal end 880 of the second pin 656 may extend to different depths into the base 670, depending on the corresponding lengths and sizes (e.g., thickness) of the various components of the MCS 610. Depending on the size (e.g., thickness) of the heat sink, substrate or lead frame for the power module, TIM, gasket, or support between heat sinks, a specific implementation of the second plate 650 may include pressing the second plate 650 so that the notch 885 of each of the second pins 656 engages with the inner edge of the corresponding second engagement groove 642, and the second plate 650 applies a downward force on the component of the MCS 610 on which the second plate 650 is disposed. Fig. 7A and Figure 7B An example result of pressing the second plate 650 is depicted in FIG.

[0104] Now refer to FIG. 6A to FIG. 6D as well as FIG. 7A to FIG. 7B Additional advantages of the exemplary plate system including first and second plates 640 , 650 are discussed.

[0105] Fig. 6A Depicted Figure 3A The end of an exemplary power module assembly is from Figure 4B A front elevation view of the plane corresponding to line 6A-6A in FIG. FIG. 6B to FIG. 6D Depicted Figure 3A The exemplary power module assembly is respectively Figure 4B Cross-sectional view of the plane corresponding to lines 6B-6B, 6C-6C and 6D-6D. Fig. 7A 6. A front elevation view of the end of the power module assembly 600 is depicted, wherein the second plate 640 has been pressed so that the third rib 658 is pressed so that the second pin 656 is positioned relative to the second engagement slot 642, as shown in FIG. Figure 7B shown.

[0106] like Fig. 6A As shown, the second plate 650 includes a third rib 658 of concave shape, which extends between the two transition walls 905 and bends downward so that the inner surface 915 of the valley 910 defined by the third rib 658 facing the heat sink contacts the upper surface of the second heat sink 630 .

[0107] According to one embodiment, the second plate 650 may be formed of a metallic material and configured to apply a downward force to a surface or body positioned below the inner surface (e.g., utilizing a downwardly directed material bias). More specifically, the third rib 658 of the second plate 650 may exhibit a shape memory material bias and thereby be configured to elastically deform, wherein: the second plate 650 is positioned on another structure (such as a heat sink) with the inner surface 915 facing the structure, and a force is applied to a surface of the second plate 650 that is opposite the inner surface 915 and the structure. Such a force may cause the transition wall 905 to move in a direction toward the structure and the plate wall 652 to flatten against the structure. In an example, an external force may be applied to the inner surface 915 of the plate wall 652 (the inner surface of the third rib 658), and the plate wall 652 may be deformed from the inner surface 915 of the plate wall 652. FIG. 6A to FIG. 6D The curved shape shown deforms elastically (eg, like a leaf spring).

[0108] also, Fig. 6A A view of the first support member 622A is provided from which the significant functions of this component can be understood. That is, the first support member 622A (and the second support member 622B) ensure that there is a structure that maintains some space between the first and second heat sinks 624, 630 and prevents damage to various components if excessive or prolonged force is applied to the second plate 650. Fig. 7A and Figure 7B The power module assembly 600 is depicted after the second plate 650 has been pressed so that the spring half 875 of the second pin 656 contracts, the distal end 880 of the second pin 656 passes through the second engagement slot 642, the spring half 875 extends, and the notch 885 engages the inner wall of the first plate 640 that defines the second engagement slot 642. In the absence of the first and second support members 622A, 622B, a force in excess of the force that causes the second plate 650 to be pressed is applied. Figure 7B The forces required for the illustrated engagement may cause the second heat sink 630 to compress, crush, or otherwise damage one or more of the power modules 612 .

[0109] Figure 6B The electrical connector 830 disposed in the pin slot 682 of the base 670 is particularly depicted. Figure 6C The first prong 644 of the first plate 640 is depicted engaged with the first engagement slot 680 of the base 670 . Fig.6D In particular, the distal end 880 of the second prong 656 of the second plate 650 is depicted extending just past the second engagement slot 642 of the first plate 640 and into an uppermost portion of a third engagement slot 890 defined in the body 672 of the base 670 .

[0110] Fig. 7A6. Depicted is a front elevation view of the end of the power module assembly 600 after the second plate 650 has been pressed and the second pin 656 for the second plate 650 is positioned in the second engagement slot 642, as shown in FIG. Figure 7B The second pin 656 of the second plate 650 extends from the leg 654, which extends from the transition wall 905 connected by the plate wall 652, which spans the channel containing at least a portion of the second heat sink 630. As described above and as Figure 7B As shown, the recess 885 of the extended spring half 875 engages the inner wall of the first plate 640 defining the second engagement slot 642. This engagement secures the second plate 650 to the first plate 640 in a position where the spring half 875 is extended. Fig. 7A Position shown.

[0111] With Fig. 6A Unlike the second plate 650 shown, a majority of the inner surface 915 of the third rib 658 contacts the exposed surface of the second heat sink 630. Fig. 7A As shown, the transition wall 905 is FIG. 6A to FIG. 6D Their rounded shape as shown defines more right angle corners. This may provide a compact assembly with advantageous vibration resistance, in addition to the other advantages discussed herein.

[0112] from FIG. 6B to FIG. 6D It can be understood that the second plate 650 provides a plurality of third ribs 658, when the second plate 650 is pressed into Fig. 7A When configured as shown, the plurality of third ribs can combine to apply an evenly distributed force on the second heat sink 630 along the longitudinal axis of the power module assembly 600. This force application has several purposes, including but not limited to: eliminating the need for heat sink fins; facilitating favorable (e.g., even) distribution of the TIM; and improved sealing between components.

[0113] With respect to heat sink tabs, these features can be used to secure the heat sink to other components. However, eliminating the need for tabs also eliminates the possibility that they will deform during assembly or handling (which can result in improved thermal performance of the heat sink). With respect to TIM distribution, in some electrical components that include multiple power modules and incorporate TIMs between surfaces, some application areas may receive or otherwise hold more TIM relative to other areas. As a result, thermal performance between these areas may differ and result in the formation of hot spots within the electrical component.

[0114] However, in one example, the first and second plates 640, 650 may be assembled to the first and second heat sinks 624, 630 and the power module integrated therein before or immediately after the TIM is injected, dispersed, provided, or otherwise introduced between the first and second heat sinks 624, 630. Applying force on the second plate 650 may help provide a uniform distribution of the TIM between the first and second heat sinks 624, 630 and between the first and second heat sinks 624, 630 and the power module 612. More specifically, with the distributed force applied to the remainder of the MCS 610 along the longitudinal axis by the second plate 650, the TIM may be more evenly distributed between the first and second heat sinks 624, 630 along the longitudinal axis and across the width of the heat sink. Thus, the first and second plates 640, 650 may minimize the chances of the TIM being concentrated in some areas and sparsely disposed in other areas, and reduce the chances of hot spots forming within the power module assembly 600 due to uneven spreading of the TIM. Removing the second plate 650 from the Fig. 6A The state shown is pressed to, for example Fig. 7A The illustrated condition may enhance the sealing action between the components and their respective interfaces, which may minimize the chance of leakage.

[0115] Those of ordinary skill in the art will understand that FIG. 6B to FIG. 6D The first and second passages 920, 925 shown may provide a coolant path. More specifically, the first port 626 (see FIG. 1 ) of the first radiator 624 may be provided to provide a coolant path. Figure 3B ) and does not flow into the first port 634 of the second radiator 630 (see Figure 3C ) can be transmitted through the first heat sink 624 through the first channel 920. When the coolant passes through the first channel 920, the heat from the power module 612 can be dissipated through the first heat sink 624 (particularly, by utilizing the first channel 920 and the Figure 3B The coolant in the first channel 920 is transferred to the coolant in the first contact interface 625 shown in the figure.

[0116] FIG. 6B to FIG. 6DAlso depicted is how at least a portion of the first heat sink 624 is disposed between the sides of the recessed wall 676 of the base 670 below the upper surface 855. Thus, at least a portion of the first heat sink 624 is disposed within the base 670. One of ordinary skill in the art will recognize that the recessed wall 676 is configured such that the first heat sink 624 can be received in / on the recessed wall 676 without the first plate 840. In one or more embodiments, the base 670, the cooling system 620, and the power module 612 can be disposed without the first and second plates 640, 650. In this example, electrical connections between the power module 612 and the substrate can still be provided through connections between the signal pins 613 and the electrical connector 830 within the base.

[0117] The remaining coolant that enters the first port 626 of the first radiator 624 and enters the first port 634 of the second radiator 630 may enter and be routed through FIG. 6B to FIG. 6D Similar to the coolant in the first heat sink 624, when the coolant passes through the second channel 925, the heat from the power module 612 can be dissipated through the second heat sink 630 (particularly, by utilizing the second channel 925 and the Figure 3C The coolant in the second channel 925 is transferred to the coolant in the second contact interface 632 shown in the figure.

[0118] The above discussion provides a description of exemplary functionality of the cooling system 620 for the power module assembly 600 that may be referred to as dual-sided active cooling of the power module 612. Regardless of the nomenclature, it will be noted that circulating coolant above and below the power module 612 may be more effective in cooling the power module 612 than, for example, passive cooling solutions, single-sided active cooling solutions, or a combination of these solutions. However, it will be noted that the exemplary plate system including first and second plates as described herein may be incorporated into implementations utilizing other types of electrical component cooling solutions.

[0119] Generally speaking, a double-sided cooling solution adds a number of design considerations that, if not addressed, may cause problems when operating an electrical component that includes multiple power modules. For example, relative to a single-sided cooling solution, a double-sided cooling solution may have a larger volume of fluid flowing near: (1) critical subcomponents of an electrical component that includes one or more power modules; and (2) joints, connections, and interfaces between the subcomponents. As a result, the chances of leaks in an electrical component that includes multiple power modules and a double-sided cooling solution may increase. As described below with reference to FIG. 6A to FIG. 6D as well as FIG. 10A to FIG. 10B As discussed, an exemplary power module assembly according to the present disclosure includes a panel system that may address design considerations associated with leakage.

[0120] However, the power module assembly 600 benefits from a compact construction, particularly when the second plate 650 is pressed into Fig. 7A configuration as shown. The enhanced tightness / compactness of the component arrangement provided by pressing the second plate 650 as discussed can minimize gaps between components in a static environment or due to forces applied to various surfaces by the coolant as the coolant flows through the first and second heat sinks 624, 630. The combination of the first and second plates 640, 650 and the uniform distribution of forces applied thereby provide an exemplary solution for enhancing sealing, for example, between: the first and second gaskets 621A, 621B and the first and second heat sinks 624, 630; the first and second supports 622A, 622B and the first and second heat sinks 624, 630; and between the MCS 610 and a substrate (such as a PCB incorporated into an electric vehicle).

[0121] Now refer to FIG. 8A to FIG. 8B Further advantages of exemplary power module assemblies according to various aspects of the present disclosure as respective combinations of MCS and base subassemblies are discussed. Fig. 8A Depicted is an isometric view of an exemplary module and cooling system subassembly 1110 ("MCS 1110") according to one or more embodiments. Figure 8B Depicted is an isometric view of an exemplary base 1170 for a power module assembly according to one or more embodiments. Fig.9A and Fig. 9B Depicted Fig. 8A Top and bottom views of the MCS1010. Fig.9A and Fig. 9B Depicted Figure 8B Top and bottom views of the subassembly.

[0122] All advantages of the exemplary power module assemblies described herein apply to FIG. 8A to FIG. 13 B respectively shows the MCS1110 and base 1170 subassemblies, and vice versa. In general, the exemplary configuration of the board (such as Fig. 8A , Fig.9A and Fig. 9BThe first and second plates 1140, 1150 of the illustrated MCS 1110 provide a low complexity modular structure that is configured to apply a substantially evenly distributed force on the heat sink. In addition, the MCS and base subassembly according to the present disclosure can facilitate three different assembly and testing methods. Each of the following methods potentially has the advantage of minimizing the likelihood of power module scrapping during production, depending on the available tools, time and materials, and / or other conditions that persist when assembling the power module assembly, MCS subassembly and / or base. However, each method is facilitated at least in part by the flexibility provided by: (1) the first and second plates 1140, 1150, and (2) the base 1170, which is as shown in FIG. Figure 8B , Fig. 10A and Fig. 10B shown.

[0123] The first and second plates 1140, 1150 do not require multiple fixtures to provide a testable intermediate assembly. With multiple fixtures, four or more separate fixtures may need to be attached one at a time around a stack of components that may include multiple heat sinks and power modules. Thus, each fixture represents an opportunity for some portion of the entire assembly to become disassembled before, during, or after testing. In contrast, with the first and second plates 1140, 1150, the heat sink and power module components may be positioned on top of the first plate 1140, and the second plate 1150 may be placed on the combination of components and pressed into engagement with the first plate 1140. Thus, the exemplary power module assembly described herein may use two plates added to the combination of components at a time, rather than having to incorporate four or more clips before the assembly can be electrically tested to confirm that effective thermal contact has been achieved.

[0124] On the other hand, the base 1170 does not have to be assembled to the MCS 1110 before being mounted on the substrate. Instead, the base 1170 provides an intermediate support structure that can be mounted on the MCS 1110 before the substrate is mounted, or mounted on the substrate before the MCS 1110 is attached. This is because, as described above with reference to Figure 5D As discussed, rather than aligning signal pins from MCS 1110 to connect to the substrate, base 1170 can provide an intermediate portion of the electrical connection between MCS 1110 and the substrate. In addition, connecting pins extending from base 1170 can be more easily positioned on the substrate than, for example, signal pins from a component extending through another component.

[0125] In one example, the MCS 1110 (first and second heat sinks 1124, 1130, power module 1112, and first and second boards 1140, 1150) can be built and tested. Assuming the testing is satisfactory, the MCS 1110 can be assembled to the base 1170. Laser welding can be used to connect the signal pins 1113 of the power module 1112 to the signal pin terminals 1172 of the base 1170. After the MCS 1110 is assembled to the base 1170, the combination of subassemblies defining an exemplary power module assembly according to the present disclosure can be mounted to a substrate (such as a PCB incorporated into an electric vehicle). In one example, the mounting can be performed by a compliant pin (e.g., pin press) method or a soldering method using an electrical connector and its connecting pins.

[0126] In one example, the MCS 1110 (first and second heat sinks 1124, 1130, power module 1112, and first and second plates 1140, 1150) may be constructed and assembled to a base 1170. Laser welding may be used to connect the signal pins 1113 of the power module 1112 to the signal pin terminals 1172 of the base 1170. After the MCS 1110 is assembled to the base 1170, the power module assembly thus defined may be tested. Assuming the testing reveals a successful assembly, the satisfactory power module assembly may be mounted into a substrate using the connection pins 1174 of the base and the compliance pins or a soldering method.

[0127] In an example, the MCS 1110 (first and second heat sinks 1124, 1130, power module 1112, and first and second boards 1140, 1150) may be built and tested. The base 1170 may be installed into a substrate without the MCS 1110 before, during, or after the MCS 1110 is built and tested. The base 1170 may be installed into a substrate using compliant pins or soldering methods. Whenever the MCS 1110 is built and tested, the final process in the method may include assembling the MCS 1110 to the base 1170 already installed in the substrate.

[0128] Fig.11 A top view of an exemplary power module 1412 according to one or more embodiments is depicted. As shown, the power module 1412 may include a substrate 1414, a ceramic layer 1425 to which a lead frame (not shown) may be attached or otherwise provided, and a number of terminals 1417 extending from the substrate 1414 and the ceramic layer 1425. A metallization layer 1419 may be attached to the ceramic layer 1425. In one embodiment, instead of soldering or welding individual pins to the power module 1412, a flexible connector 1426 may be provided for signal routing of a power switch (e.g., a die, not shown).

[0129] Each flexible connector 1426 may include: a first end 1426A, which may be welded or soldered to an exposed portion of the substrate 1414; a second end 1426B, which may be attached to a base (such as the exemplary base described herein) or directly attached to a substrate (e.g., a PCB); and a flexible connector 1426C connecting the first end 1426A and the second end 1426B. The flexible connector 1426C may be provided by a flexible material or wire. Each flexible connector may be welded, soldered, or inserted into a base or substrate.

[0130] For power modules including flexible connectors (such as Fig.11 Such a configuration of power module 1412 (shown with flexible connector 1426) can greatly increase installation flexibility. This may be true for processes involving installation or replacement of power modules within a cooling system (such as cooling system 620 of power module assembly 600) or a module and cooling system (such as MCS 610 and MCS 1110). In addition, including Fig.11 Installation of the entire power module assembly of the illustrated exemplary power module 1412 onto a base, such as base 670 or base 1170, or directly onto a substrate may be simpler, faster, and less labor intensive than installation of a power module assembly that does not employ a flexible connector attached to the power module.

[0131] Furthermore, the configuration of a system including, for example, the exemplary power module assemblies and substrates described herein can be changed with little complexity. For example, an MCS including power modules 1412 for respective power modules can transition from a system in which the MCS is attached to a base to another substrate or portion of a system in which the MCS is inserted directly into the substrate.

[0132] Figures 12 to 15 Depicted is an isometric view of a panel according to one or more embodiments. Fig.16A and Fig. 16B Depicted are isometric and front elevation views of a panel according to one or more embodiments.

[0133] like Fig.12 As shown, the plate 1500 may include holes 1505 disposed in a flange member extending from the bottom edge of the stepped wall 1510 connected by the plate wall 1515. In one embodiment, the first surface 1520 of the plate wall 1515 includes a series of protrusions 1530 extending perpendicular to the longitudinal axis of the plate 1500. The second surface (not shown) of the plate 1500 may be flat or include corresponding protrusions. Alternatively, as shown Fig.13 As shown, the plate 1600 may include a protrusion 1630 extending along and parallel to the longitudinal axis of the plate 1600. In an embodiment, such as Fig.14The plate 1700, the protrusions 1730 may be arranged in a cross pattern. In an embodiment, a plate (such as Fig.15 Plate 1800 or Fig.16A The plate 1900 may not include a protrusion. Fig. 16B As shown, the panel walls 1915 may bend between corresponding stepped walls 1910 .

[0134] The exemplary first and / or second plates described herein may incorporate Figures 12 to 16B Certain features of the first and second panels described herein may be incorporated into Figures 12 to 16B Any of the plates shown. For example, Figures 12 to 16B Any of the illustrated boards may be formed with a first prong, a second engagement slot, or a leg and a second prong, as described herein. In one or more embodiments, Figures 12 to 16B One of the illustrated plates may be substituted for the first plate or the second plate of one or more of the exemplary power module assemblies according to the present disclosure.

[0135] Other embodiments of the disclosure will be apparent to those skilled in the art from consideration of the specification and practice of the invention disclosed herein. It is intended that the specification and examples be considered exemplary only, with the true scope and spirit of the invention being indicated by the following claims.

Claims

1. A subassembly for an electrical component, the subassembly comprising: A first plate, the first plate comprising: wall, a stepped wall extending from opposite sides of the wall, and flange elements extending outwardly from the stepped wall, each flange element defining an engagement slot; a first heat sink positioned on the wall between the stepped walls; Second radiator; a power module, the power module being between the first heat sink and the second heat sink; and A second plate, the second plate comprising: a plate wall extending through the second heat sink, transition walls extending from opposite sides of the panel wall, and a pin extending from the transition wall toward the first plate and substantially perpendicular to an inner surface of the plate wall in contact with the second heat sink, The pins are aligned with the engagement slots and are configured to engage the engagement slots. 2 . The subassembly of claim 1 , wherein the power module comprises a first power module and a second power module, the first power module and the second power module being positioned between a first contact interface of the first heat sink and a second contact interface of the second heat sink.

3. The subassembly of claim 1, further comprising: A thermal interface material is disposed between the power module and the first heat sink and the second heat sink. The subassembly of claim 1 , wherein each flange element defines a hole configured to receive a fastener.

5. The subassembly of claim 1, further comprising: a first support member positioned between the first heat sink and the second heat sink; as well as a second support member, the second support member being positioned between the first heat sink and the second heat sink, Wherein the power module is positioned between the first support and the second support along the longitudinal axis of the subassembly.

6. The subassembly of claim 1, wherein the panel walls are configured to elastically deform in response to application of a force directed toward the first panel on the second panel.

7. The subassembly of claim 1 wherein said panel wall of said second panel includes ribs extending between said transition walls.

8. The subassembly of claim 7, wherein each of the ribs defines a flexure configured to elastically deform against the second heat sink in response to application of a force directed toward the first plate on the second plate.

9. The subassembly of claim 1 wherein a lip extends outwardly from each of the stepped walls of the first plate along a first plane parallel to a second plane including the walls, and wherein the flange element extends outwardly from the lip along the first plane.

10. The subassembly of claim 9, wherein the prongs of the second plate are second prongs, and wherein the first plate includes first prongs extending from the lip perpendicular to the first plane and the second plane.

11. The subassembly of claim 1 , wherein the first heat sink defines a first active cooling system, the first active cooling system comprising a first channel, and The first passage is arranged to receive coolant flowing into the first radiator and guide the coolant through and out of the first radiator.

12. The subassembly of claim 11, wherein the first and second fittings of the first heat sink are positioned within first and second holes defined by the first plate, wherein the power module is positioned between the first fitting and the second fitting along the longitudinal axis of the subassembly, and The coolant flows through the first fitting to enter the first radiator, passes through the first channel, and flows out of the first radiator through the second fitting.

13. The subassembly of claim 11, wherein the second heat sink defines a second active cooling system, the second active cooling system includes a second channel, and wherein the second channel is arranged to receive coolant flowing from the first heat sink and direct the coolant through the second heat sink and back to the first heat sink.

14. A panel system comprising: A first plate, the first plate comprising: wall, a stepped wall extending from opposite sides of the wall and perpendicular to the plane of the wall, a flange element extending from the stepped wall and parallel to the plane of the wall, and a first prong extending from the stepped wall toward the wall; A second plate, the second plate comprising: siding, transition walls extending from opposite sides of the panel wall, and a second pin extending from the transition wall toward the first plate, wherein the second pins are aligned with engagement slots defined by the flange element and are configured to move through and engage with the engagement slots, respectively, and One or more of the holes defined by the flange element or the first pins are configured to secure the second plate to a substrate via the first plate.

15. The panel system of claim 14, wherein the wall of the first panel and the panel wall of the second panel define a frame configured to house one or more heat sinks and a plurality of power modules.

16. The panel system of claim 14, wherein a lip extends outwardly from each of the stepped walls of the first panel in a plane parallel to a plane of the walls, and wherein the first prongs extend from the lip toward the walls.

17. The panel system of claim 14, wherein the panel wall is configured to elastically deform in response to application of a force on an inner surface of the panel wall.

18. The panel system of claim 14, wherein the panel walls include ribs extending between the transition walls.

19. The panel system of claim 18, wherein each of the ribs defines a flexure configured to elastically deform against the second panel in response to application of a force directed toward the first panel on the second panel.

20. A module and cooling system subassembly comprising: Cooling system; one or more pairs of power modules, wherein the one or more pairs of power modules are integrated into the cooling system; A first plate, the first plate comprising: a wall extending through the cooling system, a stepped wall extending from opposite sides of the wall, and flange elements extending outwardly from the stepped wall, each flange element defining an engagement slot; A second plate, the second plate comprising: a panel wall extending through the cooling system, transition walls extending from opposite sides of the panel wall, and a pin extending from the transition wall toward the first plate and substantially perpendicular to an inner surface of the plate wall in contact with the cooling system; and a thermal interface material, the thermal interface material being integrated into the cooling system, The pins are aligned with the engagement slots and are configured to engage the engagement slots.

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