Adhesive tape for electronic product and preparation method of adhesive tape

Abstract

The invention discloses an electronic adhesive tape and a preparation method thereof, the adhesive tape for electronic products comprises two release layers and a middle adhesive tape layer, and the release layers are PET organosilicon release films; the middle adhesive tape layer comprises a base body layer and two adhesive layers, the two surfaces of the base body layer are coated with the adhesive layers, and the adhesive layers are made of adhesives; the adhesive tape is rolled to form a roll shape and can be cut into different shapes in a fit cutting manner, and the shapes comprise sheet shapes; the adhesive provided by the invention has excellent temperature resistance and tensile strength, and can be used for continuous bonding of electronic product frames.

Description

Technical Field

[0001] The present invention relates to the technical field of electronic tapes, and in particular to an adhesive tape for electronic products and a preparation method thereof. Background Art

[0002] Electronic tape is a consumable material often used in the process of fixing and installing electronic components. With the development of science and technology, electronic products are constantly updated and the requirements for their use are getting higher and higher. The electronics industry is developing rapidly, and various tapes are used in electronic products such as computers and mobile phones for temporary or permanent fixation of internal components to replace the original mechanical fixation or welding fixation. Tapes for electronic component frames have always had a large market, especially in the bonding of frames of tablets, notebooks and monitors.

[0003] In addition to the role of strong bonding, the frame tape also needs to play other functional roles. The first is the vertical light-shielding property to prevent light leakage from the screen, and black is the best choice; the second is the cushioning property to reduce the damage caused by the electronic product falling or being placed at a distance during use; in order to pursue higher product quality and customer satisfaction, the waterproof requirement of electronic products is proposed, mainly to prevent the reliability of electronic products after long-term high humidity environment and short-term immersion in water.

[0004] Chinese invention patent CN200910197982 provides a one-component environmentally friendly silicone-acrylate electronic adhesive, which is composed of the following components: 50-100wt% environmentally friendly acrylic resin, 0-50wt% environmentally friendly solvent, 0-30wt% reinforcing agent, 0-20wt% auxiliary agent, wherein the environmentally friendly silicone-acrylate resin is obtained by copolymerization of acrylic monomers, olefinic silicone monomers, olefinic monomers, alkenyl aromatic compound monomers, and environmentally friendly solvents, using thermal initiators or redox initiators, and solution polymerization, with a solid content of 20-80wt%. The invention proposes a new type of one-component environmentally friendly silicone-acrylate electronic adhesive, which has the advantages of safety and non-toxicity, good elasticity, good weather resistance, convenient construction, good storage stability, and convenient glue coating; on the other hand, it has a wide range of applications and can be widely used in protective coatings, protective adhesives, packaging materials, etc. for electronic devices, integrated circuits, printed circuits, LED chips, etc.

[0005] Chinese invention patent CN201010178214 provides a UV-curable silicone-acrylic resin electronic adhesive, which is composed of the following components: 100 parts of acrylate monomers or prepolymers with double bonds, 5-500 parts of silicone resins with double bonds and a molecular weight of 1000-10000, 1-100 parts of inorganic nanoparticles modified by olefinic compounds, 1-50 parts of free radical UV initiators, 1-100 parts of organosilanes, 0-200 parts of inorganic reinforcing agents, and 0-50 parts of auxiliary agents. The UV-curable silicone-acrylic resin is obtained by UV curing with the above raw materials, and the solid content is 100wt%. The product obtained by the invention has excellent characteristics such as firm bonding with metal, glass, plastic substrates and electronic devices, good optical properties, good elasticity, good weather resistance, safety and non-toxicity, and convenient construction. It can replace traditional solvent-based electronic adhesives and is used for protective coatings, protective adhesives, packaging materials, etc. of electronic devices, integrated circuits, printed circuits, LED chips, etc.

[0006] A Chinese patent with publication number CN110157349A (published on August 23, 2019) discloses an acid-free waterproof tape, which uses modified acrylic resin and ethyl acetate to form a glue layer. The adhesive property on the substrate layer is very strong, making the tape itself difficult to be damaged, thereby achieving waterproofness. However, the acid-free waterproof tape has no light-shielding and buffering functions and cannot meet the requirements of being used as a frame tape for electronic products. Summary of the invention

[0007] In order to solve the problems mentioned in the above background technology, the present invention provides an adhesive tape for electronic products and a preparation method thereof.

[0008] In order to achieve the above object, the present invention adopts the following technical solutions:

[0009] An adhesive tape for electronic products, comprising two release layers and an intermediate tape layer, wherein the release layers are PET silicone release films; after the tape is rolled up, it can be cut into different shapes by lamination, so that the rolled material can be turned into a sheet-shaped material.

[0010] The intermediate tape layer comprises a base layer and two adhesive layers, the base layer is coated with adhesive layers on both sides, and the adhesive layers are made of adhesive;

[0011] The base layer is a polyethylene film, and the polyethylene film is made of the following raw materials in parts by weight:

[0012] 55-90 parts of polyethylene, 10-30 parts of polyamide, 5-15 parts of modified hydroxyethyl cellulose, 5-10 parts of anti-ultraviolet additives, 0.5-5 parts of toughening agent;

[0013] The adhesive is made from the following raw materials in parts by weight:

[0014] 60-100 parts of carboxyl-terminated nitrile rubber, 20-30 parts of polyurethane acrylate, 3-10 parts of flame retardant, 5-15 parts of filler, 1-5 parts of antioxidant and 1-3 parts of methylphenyl silicone oil.

[0015] Preferably, the polyethylene film is prepared by melt blending polyethylene, polyamide, modified hydroxyethyl cellulose, anti-ultraviolet additive and toughening agent according to the weight parts, the temperature is controlled at 220-250°C, and the time is 30-60 minutes, so as to obtain the polyethylene film substrate layer.

[0016] Preferably, the preparation method of the adhesive comprises the following steps:

[0017] Add the carboxyl-terminated nitrile rubber, polyurethane acrylate and methylphenyl silicone oil into a high-speed mixer, stir evenly at a speed of 1200-1400 r / min and a temperature of 85-100°C, add flame retardant, filler and antioxidant, continue stirring for 30-50 minutes, and cool and extrude to obtain the adhesive.

[0018] Preferably, the release layer has a thickness of 50-100 μm.

[0019] Preferably, the anti-ultraviolet auxiliary agent is a compound of BASF 1130 ultraviolet light absorber and antioxidant 292 in a mass ratio of 1-5:1.2.

[0020] Preferably, the toughening agent is one or more of ethylene-butyl acrylate-glycidyl methacrylate copolymer, ethylene-methyl acrylate-glyceryl methacrylate copolymer or ethylene-butyl acrylate-glycidyl methacrylate grafted polyolefin elastomer.

[0021] Preferably, the preparation method of the modified hydroxyethyl cellulose comprises the following steps:

[0022] S1, grinding hydroxyethyl cellulose, graphene oxide and nano-titanium dioxide through a grinding device, and the average particle size is 10-50nm;

[0023] S2. The ground hydroxyethyl cellulose, graphene oxide and nano-titanium dioxide are fully mixed and put into a high-speed mixer, and polyvinyl alcohol and polyethylene glycol are added, and stirred at 60-80° C. and a rotation speed of 1500-3000 rpm for 30-60 minutes to obtain modified hydroxyethyl cellulose.

[0024] Graphene oxide has excellent mechanical properties, electrical conductivity, thermal conductivity, etc. Blending it with hydroxyethyl cellulose can improve the strength, toughness, electrical conductivity and thermal conductivity of the composite material, and give hydroxyethyl cellulose more functionality; and nano-titanium dioxide has good UV shielding properties and chemical stability. The combination of the three can produce a good synergistic effect. The high specific surface area of ​​graphene oxide and the viscosity of hydroxyethyl cellulose can effectively improve the adsorption performance. When constructing the microstructure of the polyethylene film material, the interaction optimizes the overall performance of the polyethylene film material.

[0025] There is also a certain synergistic effect between graphene oxide and nano-titanium dioxide. In the photocatalytic process, graphene oxide can serve as a channel for electron transfer, improve the separation efficiency of photogenerated carriers, and thus enhance the photocatalytic performance of nano-titanium dioxide. At the same time, the active oxygen species generated by nano-titanium dioxide under light excitation can regulate the redox of graphene oxide to a certain extent, change the state of its surface functional groups, and further optimize the performance of polyethylene film materials.

[0026] Preferably, the flame retardant is one or a combination of hexabromobenzene, decabromodiphenyl ether, tribromodiphenyl ether, polydibromodiphenyl ether, hexabromocyclododecane, octabromodiphenyl ether, and oligocarbonate.

[0027] Preferably, the filler is nano titanium dioxide with an average particle size of 10-25 nm; the antioxidant is alkylated diphenylamine or 4,4'-bis(a,a-dimethylbenzyl)diphenylamine.

[0028] A method for preparing an adhesive tape for electronic products further comprises the following steps:

[0029] S1. Place the substrate layer on the coating machine, pass through the unwinding shaft, pressure roller, and winding shaft and keep it in a horizontal state;

[0030] S2. Apply the prepared adhesive evenly on the upper and lower surfaces of the substrate layer through a coating roller, and the thickness of the adhesive layer is 0.15-0.25 mm;

[0031] S3, placing it in an oven for drying and curing to form an intermediate tape layer, the drying and curing temperature is 120-140° C., the time is 3-5 hours, and then attaching a PET silicone release film and rolling it up to obtain the adhesive tape for electronic products.

[0032] Compared with the prior art, the present invention has the following beneficial effects:

[0033] 1. In the present invention, the base layer is a polyethylene film, which is the main material for the adhesive properties of the adhesive tape for electronic products and determines the chemical resistance, mechanical strength, thermal stability and aging resistance of the adhesive tape for electronic products. The present invention uses polyethylene and polyamide as the main materials and modified hydroxyethyl cellulose, anti-ultraviolet additives and toughening agents as auxiliary materials to prepare a modified polyethylene film, which can effectively improve the adsorption performance. When constructing the microstructure of the polyethylene film material, the interaction optimizes the chemical resistance, mechanical strength, thermal stability and aging resistance of the polyethylene film material.

[0034] 2. In the process of preparing the adhesive of the present invention, the two ends of the carboxyl-terminated nitrile rubber molecular chain carry carboxyl groups with high reactivity. Under high temperature and stirring conditions, the carboxyl groups react chemically with the active groups in the polyurethane acrylate, such as isocyanate groups or hydroxyl groups. This reaction can form a chemical bond, thereby enhancing the binding force between the two polymers and building an interpenetrating network structure, thereby improving the toughness and impact resistance of the adhesive. The nitrile rubber itself has good flexibility and oil resistance. Through chemical bonding in the system, it can effectively absorb and disperse stress, making the adhesive not easy to break when subjected to external force impact, broadening the application range of the adhesive, and having high social use value and application prospects.

[0035] 3. The adhesive tape for electronic products prepared by the present invention has high viscosity and no residual adhesive after peeling; it has excellent waterproof performance and can reach IPX8 waterproof level; it has excellent heat resistance and tensile strength and can be used for continuous bonding of electronic product frames. BRIEF DESCRIPTION OF THE DRAWINGS

[0036] Figure 1 It is a schematic diagram of the structure of adhesive tape for electronic products. DETAILED DESCRIPTION

[0037] The technical solution of the present invention will be clearly and completely described below in conjunction with the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0038] Unless otherwise specified, the raw materials used in the present invention are all conventional products purchased from the market.

[0039] Polyethylene, Suzhou Kesheng Adhesive Products Co., Ltd.;

[0040] Polyamide was purchased from Suzhou Jishao Engineering Plastics Co., Ltd., with the item number B3EG6;

[0041] Ethylene-butyl acrylate-glycidyl methacrylate copolymer purchases Nitto (China) New Materials Co., Ltd.;

[0042] Polyvinyl alcohol was purchased from Aladdin, with a CAS number of 9002-89-5;

[0043] Polyethylene glycol was purchased from Aladdin with a CAS number of 25322-68-3;

[0044] The carboxyl-terminated nitrile rubber was purchased from Kunshan Changle Electronic Technology Co., Ltd.

[0045] Polyurethane acrylate was purchased from Heyuan Dongfeng New Materials Technology Co., Ltd.;

[0046] Methylphenyl silicone oil was purchased from Wuhan Shuer Biotechnology Co., Ltd., model number XH2130VDVMES;

[0047] Alkylated diphenylamine was purchased from Aladdin with CAS number 68921-45-9.

[0048] Preparation Example 1

[0049] The polyethylene film is melt blended by blending 55 parts of polyethylene, 30 parts of polyamide, 10 parts of modified hydroxyethyl cellulose, 8 parts of anti-ultraviolet additives, and 1 part of toughening agent at a temperature of 220° C. for 30 minutes, thereby obtaining a polyethylene film substrate layer.

[0050] The anti-ultraviolet auxiliary agent is a compound of BASF 1130 ultraviolet light absorber and antioxidant 292 in a mass ratio of 1:1.2.

[0051] The toughening agent is ethylene-butyl acrylate-glycidyl methacrylate copolymer.

[0052] The preparation method of the modified hydroxyethyl cellulose comprises the following steps:

[0053] S1. Grind 50 g of hydroxyethyl cellulose, 5 g of graphene oxide and 5 g of nano-titanium dioxide through a grinding device to obtain an average particle size of 20 nm;

[0054] S2. The ground hydroxyethyl cellulose, graphene oxide and nano-titanium dioxide are fully mixed and put into a high-speed mixer, and 50 mL of a mixture of polyvinyl alcohol and 30 mL of polyethylene glycol are added, and stirred at 65° C. and a rotation speed of 2500 rpm for 60 minutes to obtain modified hydroxyethyl cellulose.

[0055] Preparation Example 2

[0056] The polyethylene film is melt blended by blending 70 parts of polyethylene, 15 parts of polyamide, 10 parts of modified hydroxyethyl cellulose, 10 parts of anti-ultraviolet additives, and 3 parts of toughening agents at a temperature of 230° C. for 60 minutes, thereby obtaining a polyethylene film substrate layer.

[0057] The anti-ultraviolet auxiliary agent is a compound of BASF 1130 ultraviolet light absorber and antioxidant 292 in a mass ratio of 3:1.2.

[0058] The toughening agent is ethylene-butyl acrylate-glycidyl methacrylate grafted polyolefin elastomer.

[0059] The preparation method of the modified hydroxyethyl cellulose comprises the following steps:

[0060] S1. Grind 50 g of hydroxyethyl cellulose, 5 g of graphene oxide and 5 g of nano-titanium dioxide through a grinding device to obtain an average particle size of 15 nm;

[0061] S2. The ground hydroxyethyl cellulose, graphene oxide and nano-titanium dioxide are fully mixed and put into a high-speed mixer, and 50 mL of a mixture of polyvinyl alcohol and 30 mL of polyethylene glycol are added, and stirred at 65° C. and a rotation speed of 2500 rpm for 60 minutes to obtain modified hydroxyethyl cellulose.

[0062] Preparation Example 3

[0063] The polyethylene film is melt blended by blending 90 parts of polyethylene, 10 parts of polyamide, 5 parts of modified hydroxyethyl cellulose, 5 parts of anti-ultraviolet additives, and 5 parts of toughening agents at a temperature of 235° C. for 60 minutes, thereby obtaining a polyethylene film substrate layer.

[0064] The anti-ultraviolet auxiliary agent is a compound of BASF 1130 ultraviolet light absorber and antioxidant 292 in a mass ratio of 5:1.2.

[0065] The toughening agent is ethylene-methyl acrylate-glyceryl methacrylate copolymer.

[0066] The preparation method of the modified hydroxyethyl cellulose comprises the following steps:

[0067] S1. Grind 50 g of hydroxyethyl cellulose, 5 g of graphene oxide and 5 g of nano-titanium dioxide through a grinding device to obtain an average particle size of 15 nm;

[0068] S2. The ground hydroxyethyl cellulose, graphene oxide and nano-titanium dioxide are fully mixed and put into a high-speed mixer, and 50 mL of a mixture of polyvinyl alcohol and 30 mL of polyethylene glycol are added, and stirred at 80° C. and a rotation speed of 3000 rpm for 60 minutes to obtain modified hydroxyethyl cellulose.

[0069] Preparation Example 4

[0070] The polyethylene film is melt blended by blending 55 parts of polyethylene, 30 parts of polyamide, 10 parts of modified hydroxyethyl cellulose, 8 parts of anti-ultraviolet additives, and 1 part of toughening agent at a temperature of 240° C. for 30 minutes to obtain a polyethylene film substrate layer.

[0071] The anti-ultraviolet auxiliary agent is a compound of BASF 1130 ultraviolet light absorber and antioxidant 292 in a mass ratio of 1:1.2.

[0072] The toughening agent is ethylene-butyl acrylate-glycidyl methacrylate copolymer.

[0073] The preparation method of the modified hydroxyethyl cellulose comprises the following steps:

[0074] S1. Grind 50 g of hydroxyethyl cellulose, 8 g of graphene oxide and 6 g of nano-titanium dioxide through a grinding device to obtain an average particle size of 35 nm;

[0075] S2. The ground hydroxyethyl cellulose, graphene oxide and nano-titanium dioxide are fully mixed and put into a high-speed mixer, and a mixture of 60 mL of polyvinyl alcohol and 40 mL of polyethylene glycol is added, and stirred at 80° C. and a rotation speed of 3000 rpm for 60 minutes to obtain modified hydroxyethyl cellulose.

[0076] Preparation Example 5

[0077] The polyethylene film is melt blended by blending 70 parts of polyethylene, 15 parts of polyamide, 10 parts of modified hydroxyethyl cellulose, 10 parts of anti-ultraviolet additives, and 3 parts of toughening agents at a temperature of 245° C. for 60 minutes, thereby obtaining a polyethylene film substrate layer.

[0078] The anti-ultraviolet auxiliary agent is a compound of BASF 1130 ultraviolet light absorber and antioxidant 292 in a mass ratio of 3:1.2.

[0079] The toughening agent is ethylene-butyl acrylate-glycidyl methacrylate grafted polyolefin elastomer.

[0080] The preparation method of the modified hydroxyethyl cellulose comprises the following steps:

[0081] S1, grinding 50g hydroxyethyl cellulose, 8g graphene oxide and 6g nano-titanium dioxide through a grinding device, and the average particle size is 40nm;

[0082] S2. The ground hydroxyethyl cellulose, graphene oxide and nano-titanium dioxide are fully mixed and put into a high-speed mixer, and 50 mL of a mixture of polyvinyl alcohol and 30 mL of polyethylene glycol are added, and stirred at 80° C. and a rotation speed of 3000 rpm for 60 minutes to obtain modified hydroxyethyl cellulose.

[0083] Preparation Example 6

[0084] The polyethylene film is melt blended by blending 90 parts of polyethylene, 10 parts of polyamide, 5 parts of modified hydroxyethyl cellulose, 5 parts of anti-ultraviolet additives, and 5 parts of toughening agents at a temperature of 250° C. for 60 minutes, thereby obtaining a polyethylene film substrate layer.

[0085] The anti-ultraviolet auxiliary agent is a compound of BASF 1130 ultraviolet light absorber and antioxidant 292 in a mass ratio of 5:1.2.

[0086] The toughening agent is ethylene-methyl acrylate-glyceryl methacrylate copolymer.

[0087] The preparation method of the modified hydroxyethyl cellulose comprises the following steps:

[0088] S1. Grind 50 g of hydroxyethyl cellulose, 8 g of graphene oxide and 6 g of nano-titanium dioxide through a grinding device to obtain an average particle size of 15 nm;

[0089] S2. The ground hydroxyethyl cellulose, graphene oxide and nano-titanium dioxide are fully mixed and put into a high-speed mixer, and a mixture of 60 mL of polyvinyl alcohol and 40 mL of polyethylene glycol is added, and stirred at 80° C. and a rotation speed of 3000 rpm for 60 minutes to obtain modified hydroxyethyl cellulose.

[0090] Comparative Preparation Example 1

[0091] The difference between this comparative preparation example and preparation example 1 is that no polyamide is added.

[0092] Comparative Preparation Example 2

[0093] The difference between this comparative preparation example and preparation example 1 is that the modified hydroxyethyl cellulose is replaced by ordinary commercially available hydroxyethyl cellulose purchased from Renqiu Shuangcheng Chemical Products Factory with a CAS number of 9004-62-0.

[0094] Comparative Preparation Example 3

[0095] The difference between this comparative preparation example and preparation example 1 is that the anti-ultraviolet auxiliary agent is BASF 1130 ultraviolet light absorber.

[0096] Comparative Preparation Example 4

[0097] The difference between this comparative preparation example and preparation example 1 is that the anti-ultraviolet auxiliary agent is BASF antioxidant 292.

[0098] Preparation Example 7

[0099] The preparation method of the adhesive comprises the following steps:

[0100] Add 60 parts of terminal carboxyl nitrile rubber, 30 parts of polyurethane acrylate and 3 parts of methylphenyl silicone oil into a high-speed mixer, stir evenly at a speed of 1200r / min and a temperature of 85°C, add 10 parts of flame retardant, 10 parts of filler and 3 parts of antioxidant, continue stirring for 30 minutes, and cool and extrude to obtain the adhesive.

[0101] The flame retardant is hexabromobenzene; the filler is nano titanium dioxide with an average particle size of 10 nm; and the antioxidant is alkylated diphenylamine.

[0102] Preparation Example 8

[0103] The preparation method of the adhesive comprises the following steps:

[0104] Add 80 parts of terminal carboxyl nitrile rubber, 25 parts of polyurethane acrylate and 2 parts of methylphenyl silicone oil into a high-speed mixer, stir evenly at a speed of 1200r / min and a temperature of 85°C, add 10 parts of flame retardant, 10 parts of filler and 3 parts of antioxidant, continue stirring for 45 minutes, and cool and extrude to obtain the adhesive.

[0105] The flame retardant is polydibrominated diphenyl ether; the filler is nano titanium dioxide with an average particle size of 15nm; and the antioxidant is 4,4'-bis(a,a-dimethylbenzyl)diphenylamine.

[0106] Preparation Example 9

[0107] The preparation method of the adhesive comprises the following steps:

[0108] Add 100 parts of terminal carboxyl nitrile rubber, 20 parts of polyurethane acrylate and 1 part of methylphenyl silicone oil into a high-speed mixer, stir evenly at a speed of 1200r / min and a temperature of 85°C, add 3 parts of flame retardant, 5 parts of filler and 1 part of antioxidant, continue stirring for 45 minutes, and cool and extrude to obtain the adhesive.

[0109] The flame retardant is oligomeric carbonate; the filler is nano titanium dioxide with an average particle size of 25nm; and the antioxidant is 4,4'-bis(a,a-dimethylbenzyl)diphenylamine.

[0110] Example 1

[0111] A method for preparing an adhesive tape for electronic products comprises the following steps:

[0112] S1. Place the base layer on the coating machine, pass through the unwinding shaft, the pressure roller, the winding shaft and keep it in a horizontal state; the base layer is the polyethylene film prepared in Preparation Example 1;

[0113] S2, the adhesive prepared in Preparation Example 7 is evenly applied to the upper and lower surfaces of the substrate layer by a coating roller, and the thickness of the adhesive layer is 0.15 mm;

[0114] S3, placing it in an oven for drying and curing to form an intermediate tape layer, the drying and curing temperature is 120° C., the time is 3 hours, and then a PET silicone release film with a thickness of 100 μm is attached and rolled up to obtain the adhesive tape for electronic products.

[0115] Example 2

[0116] A method for preparing an adhesive tape for electronic products comprises the following steps:

[0117] S1. Place the base layer on the coating machine, pass through the unwinding shaft, the pressure roller, the winding shaft and keep it in a horizontal state; the base layer is the polyethylene film prepared in Preparation Example 2;

[0118] S2, the adhesive prepared in Preparation Example 7 is evenly applied to the upper and lower surfaces of the substrate layer by a coating roller, and the thickness of the adhesive layer is 0.20 mm;

[0119] S3, placing it in an oven for drying and curing to form an intermediate tape layer, the drying and curing temperature is 120° C., the time is 3 hours, and then attaching a PET silicone release film with a thickness of 80 μm and winding it up to obtain the adhesive tape for electronic products.

[0120] Example 3

[0121] A method for preparing an adhesive tape for electronic products comprises the following steps:

[0122] S1. Place the base layer on the coating machine, pass through the unwinding shaft, the pressure roller, the winding shaft and keep it in a horizontal state; the base layer is the polyethylene film prepared in Preparation Example 3;

[0123] S2, the adhesive prepared in Preparation Example 7 is evenly applied to the upper and lower surfaces of the substrate layer by a coating roller, and the thickness of the adhesive layer is 0.20 mm;

[0124] S3, placing it in an oven for drying and curing to form an intermediate tape layer, the drying and curing temperature is 120° C., the time is 3 hours, and then attaching a PET silicone release film with a thickness of 50 μm and winding it up to obtain the adhesive tape for electronic products.

[0125] Example 4

[0126] A method for preparing an adhesive tape for electronic products comprises the following steps:

[0127] S1. Place the base layer on the coating machine, pass through the unwinding shaft, the pressure roller, and the winding shaft and keep it in a horizontal state; the base layer is the polyethylene film prepared in Preparation Example 4;

[0128] S2, the adhesive prepared in Preparation Example 8 is evenly applied to the upper and lower surfaces of the substrate layer by a coating roller, and the thickness of the adhesive layer is 0.20 mm;

[0129] S3, placing it in an oven for drying and curing to form an intermediate tape layer, the drying and curing temperature is 130° C., the time is 4 hours, and then a PET silicone release film with a thickness of 50 μm is attached and rolled up to obtain the adhesive tape for electronic products.

[0130] Example 5

[0131] A method for preparing an adhesive tape for electronic products comprises the following steps:

[0132] S1. Place the base layer on the coating machine, pass through the unwinding shaft, the pressure roller, and the winding shaft and keep it in a horizontal state; the base layer is the polyethylene film prepared in Preparation Example 5;

[0133] S2, the adhesive prepared in Preparation Example 8 is evenly applied to the upper and lower surfaces of the substrate layer by a coating roller, and the thickness of the adhesive layer is 0.20 mm;

[0134] S3, placing it in an oven for drying and curing to form an intermediate tape layer, the drying and curing temperature is 130° C., the time is 4 hours, and then a PET silicone release film with a thickness of 50 μm is attached and rolled up to obtain the adhesive tape for electronic products.

[0135] Example 6

[0136] A method for preparing an adhesive tape for electronic products comprises the following steps:

[0137] S1. Place the base layer on the coating machine, pass through the unwinding shaft, the pressure roller, the winding shaft and keep it in a horizontal state; the base layer is the polyethylene film prepared in Preparation Example 6;

[0138] S2, the adhesive prepared in Preparation Example 8 is evenly applied to the upper and lower surfaces of the substrate layer by a coating roller, and the thickness of the adhesive layer is 0.20 mm;

[0139] S3, placing it in an oven for drying and curing to form an intermediate tape layer, the drying and curing temperature is 140° C., the time is 5 hours, and then attaching a PET silicone release film with a thickness of 80 μm and winding it up to obtain the adhesive tape for electronic products.

[0140] Example 7

[0141] A method for preparing an adhesive tape for electronic products comprises the following steps:

[0142] S1. Place the base layer on the coating machine, pass through the unwinding shaft, the pressure roller, and the winding shaft and keep it in a horizontal state; the base layer is the polyethylene film prepared in Preparation Example 7;

[0143] S2, the adhesive prepared in Preparation Example 9 is evenly applied to the upper and lower surfaces of the substrate layer by a coating roller, and the thickness of the adhesive layer is 0.20 mm;

[0144] S3, placing it in an oven for drying and curing to form an intermediate tape layer, the drying and curing temperature is 140° C., the time is 5 hours, and then attaching a PET silicone release film with a thickness of 80 μm and winding it up to obtain the adhesive tape for electronic products.

[0145] Example 8

[0146] A method for preparing an adhesive tape for electronic products comprises the following steps:

[0147] S1. Place the base layer on the coating machine, pass through the unwinding shaft, the pressure roller, and the winding shaft and keep it in a horizontal state; the base layer is the polyethylene film prepared in Preparation Example 8;

[0148] S2, the adhesive prepared in Preparation Example 9 is evenly applied to the upper and lower surfaces of the substrate layer by a coating roller, and the thickness of the adhesive layer is 0.20 mm;

[0149] S3, placing it in an oven for drying and curing to form an intermediate tape layer, the drying and curing temperature is 140° C., the time is 5 hours, and then attaching a PET silicone release film with a thickness of 80 μm and winding it up to obtain the adhesive tape for electronic products.

[0150] Example 9

[0151] A method for preparing an adhesive tape for electronic products comprises the following steps:

[0152] S1. Place the base layer on the coating machine, pass through the unwinding shaft, the pressure roller, and the winding shaft and keep it in a horizontal state; the base layer is the polyethylene film prepared in Preparation Example 9;

[0153] S2, the adhesive prepared in Preparation Example 9 is evenly applied to the upper and lower surfaces of the substrate layer by a coating roller, and the thickness of the adhesive layer is 0.20 mm;

[0154] S3, placing it in an oven for drying and curing to form an intermediate tape layer, the drying and curing temperature is 130° C., the time is 5 hours, and then a PET silicone release film with a thickness of 100 μm is attached and rolled up to obtain the adhesive tape for electronic products.

[0155] Comparative Example 1

[0156] The difference between this comparative example and Example 1 is that the polyethylene film prepared in Preparation Example 1 is replaced by a common commercially available polyethylene film purchased from Changzhou Peitong New Materials Co., Ltd.

[0157] Comparative Example 2

[0158] The difference between this comparative example and Example 1 is that the adhesive prepared in Preparation Example 7 is replaced by a common commercially available methyl acrylate adhesive purchased from Shandong Chuangying Chemical Co., Ltd.

[0159] Comparative Example 3

[0160] The difference between this comparative example and Example 1 is that in the process of preparing the polyethylene film in Preparation Example 1, no modified hydroxyethyl cellulose is added.

[0161] Comparative Example 4

[0162] The difference between this comparative example and Example 1 is that the polyethylene film substrate layer prepared in Preparation Example 1 is replaced by the polyethylene film substrate layer in Comparative Preparation Example 1.

[0163] Comparative Example 5

[0164] The difference between this comparative example and Example 1 is that the polyethylene film substrate layer prepared in Preparation Example 1 is replaced by the polyethylene film substrate layer in Comparative Preparation Example 2.

[0165] Comparative Example 6

[0166] The difference between this comparative example and Example 1 is that the polyethylene film substrate layer prepared in Preparation Example 1 is replaced by the polyethylene film substrate layer in Comparative Preparation Example 3.

[0167] Comparative Example 7

[0168] The difference between this comparative example and Example 1 is that the polyethylene film substrate layer prepared in Preparation Example 1 is replaced by the polyethylene film substrate layer in Comparative Preparation Example 4.

[0169] Performance test: The adhesive tape products for electronic products obtained in the above Examples 1-9 and Comparative Examples 1-7 were subjected to performance tests under exactly the same conditions. The results are shown in Table 1 below:

[0170] Table 1: Test results

[0171]

[0172]

[0173] In summary, the adhesive tape for electronic products prepared in Examples 1-9 of the present invention has excellent adhesive force and excellent waterproof performance, which can reach IPX8 waterproof level. In addition, the tape has good temperature resistance, and there is no warping in the 70°C warping test. At the same time, the tensile strength can reach up to 5.1MPa. The adhesive tape for electronic products prepared by the present invention has high viscosity, no residual adhesive after peeling, excellent waterproof performance, which can reach IPX8 waterproof level, excellent temperature resistance and tensile strength, and can be used for continuous bonding of electronic product frames.

[0174] The above description is only a preferred specific implementation manner of the present invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can make equivalent replacements or changes according to the technical scheme and inventive concept of the present invention within the technical scope disclosed by the present invention, which should be covered by the protection scope of the present invention.

Claims

1. An adhesive tape for electronic products, characterized in that: The adhesive tape for electronic products comprises two release layers and an intermediate tape layer, wherein the release layer is a PET silicone release film; The intermediate tape layer comprises a base layer and two adhesive layers, the base layer is coated with adhesive layers on both sides, and the adhesive layers are made of adhesive; The adhesive tape is rolled up to form a roll, and can be cut into different shapes by a fitting cutting method, including a sheet shape.

2. The adhesive tape for electronic products according to claim 1, characterized in that: The base layer is a polyethylene film, and the polyethylene film is made of the following raw materials in parts by weight: 55-90 parts of polyethylene, 10-30 parts of polyamide, 5-15 parts of modified hydroxyethyl cellulose, 5-10 parts of anti-ultraviolet additives, 0.5-5 parts of toughening agent; The adhesive is made from the following raw materials in parts by weight: 60-100 parts of carboxyl-terminated nitrile rubber, 20-30 parts of polyurethane acrylate, 3-10 parts of flame retardant, 5-15 parts of filler, 1-5 parts of antioxidant and 1-3 parts of methylphenyl silicone oil.

3. The adhesive tape for electronic products according to claim 1, characterized in that: The polyethylene film is melt blended by blending polyethylene, polyamide, modified hydroxyethyl cellulose, anti-ultraviolet additive and toughening agent according to the weight parts, and the temperature is controlled at 220-250° C. for 30-60 minutes to obtain a polyethylene film substrate layer.

4. The adhesive tape for electronic products according to claim 1, characterized in that: The preparation method of the adhesive comprises the following steps: Add carboxyl-terminated nitrile rubber, polyurethane acrylate and methylphenyl silicone oil into a high-speed mixer, stir evenly at a speed of 1200-1400 r / min and a temperature of 85-100°C, add flame retardant, filler and antioxidant, continue stirring for 30-50 minutes, and cool and extrude to obtain the adhesive.

5. The adhesive tape for electronic products according to claim 1, characterized in that: The anti-ultraviolet auxiliary agent is a compound of BASF 1130 ultraviolet light absorber and antioxidant 292 in a mass ratio of 1-5:1.

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6. The adhesive tape for electronic products according to claim 1, characterized in that: The toughening agent is one or more of ethylene-butyl acrylate-glycidyl methacrylate copolymer, ethylene-methyl acrylate-glyceryl methacrylate copolymer or ethylene-butyl acrylate-glycidyl methacrylate grafted polyolefin elastomer.

7. The adhesive tape for electronic products according to claim 1, characterized in that: The preparation method of the modified hydroxyethyl cellulose comprises the following steps: S1, grinding hydroxyethyl cellulose, graphene oxide and nano-titanium dioxide through a grinding device, and the average particle size is 10-50nm; S2. The ground hydroxyethyl cellulose, graphene oxide and nano-titanium dioxide are fully mixed and put into a high-speed mixer, and polyvinyl alcohol and polyethylene glycol are added, and stirred at 60-80° C. and a rotation speed of 1500-3000 rpm for 30-60 minutes to obtain modified hydroxyethyl cellulose.

8. The adhesive tape for electronic products according to claim 1, characterized in that: The flame retardant is one or a combination of hexabromobenzene, decabromodiphenyl ether, tribromodiphenyl ether, polydibromodiphenyl ether, hexabromocyclododecane, octabromodiphenyl ether and oligomeric carbonate.

9. The adhesive tape for electronic products according to claim 1, characterized in that: The filler is nano titanium dioxide with an average particle size of 10-25 nm; the antioxidant is alkylated diphenylamine or 4,4'-bis(a,a-dimethylbenzyl)diphenylamine.

10. A method for preparing an adhesive tape for electronic products, comprising preparing the adhesive tape for electronic products as claimed in any one of claims 1 to 9, characterized in that: The following steps are also included: S1. Place the substrate layer on the coating machine, pass through the unwinding shaft, pressure roller, and winding shaft and keep it in a horizontal state; S2. Apply the prepared adhesive evenly on the upper and lower surfaces of the substrate layer through a coating roller, and the thickness of the adhesive layer is 0.15-0.25 mm; S3, placing it in an oven for drying and curing to form an intermediate tape layer, the drying and curing temperature is 120-140° C., the time is 3-5 hours, and then attaching a PET silicone release film and rolling it up to obtain the adhesive tape for electronic products.

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