Distributor structure and plate heat exchanger

Abstract

The distributor structure comprises a conduction area (21) and a distribution area (22), the conduction area (21) and the distribution area (22) are formed by sinking from the surface of a plate sheet (1), a through hole (211) is formed in the bottom of the conduction area (21), a distribution hole (221) is formed in the distribution area (22), the bottom of the conduction area (21) comprises a welding face, and the through hole (211) is communicated with the distribution hole (221). The distribution holes (221) are located in the periphery of the welding face, and overflow grooves (222) are formed between the distribution holes (221) and the welding face. The distributor structure can effectively prevent brazing flux from blocking the distribution holes, and then the pressure drop performance and the heat exchange performance of a product are guaranteed.

Description

Technical Field

[0001] The present invention relates to the technical field of heat exchangers, and in particular to a distributor structure. The present invention also relates to a plate heat exchanger provided with the distributor structure. Background Art

[0002] Plate heat exchangers are widely used in refrigeration and heating systems as evaporators, condensers, economizers, etc. due to their compact structure, high heat transfer coefficient, strong reliability, and small refrigerant charge.

[0003] Taking the brazed plate heat exchanger as an example, it is mainly composed of heat exchange plates, copper foil, distributors, end bottom plates, connecting pipes, etc. The distributor is one of the important components, which plays a role in improving refrigerant distribution and improving heat exchange performance.

[0004] The distributor is usually arranged with distribution holes beside its through hole. The through hole of the distributor is surrounded by an annular welding surface, and the distribution holes are usually designed on the plane or inclined surface around the annular welding surface, which is very close to the welding plane. During the brazing process, due to the capillary phenomenon, the distribution holes are prone to accumulation of brazing flux and cause blockage. After the distribution holes are blocked, the refrigerant is unevenly distributed at the inlet, and the pressure drop will increase, thereby affecting the pressure drop performance and heat exchange performance of the product. Summary of the invention

[0005] The object of the present invention is to provide a distributor structure which can effectively prevent the soldering agent from clogging the distribution hole.

[0006] Another object of the present invention is to provide a plate heat exchanger provided with the distributor structure.

[0007] To achieve the above-mentioned purpose, the present invention provides a distributor structure, including a conduction area and a distribution area formed by a surface depression of a plate, the bottom of the conduction area is provided with a through hole, the distribution area is provided with a distribution hole, the bottom of the conduction area includes a welding surface, the distribution hole is located at the periphery of the welding surface, and an overflow groove is provided between the distribution hole and the welding surface.

[0008] Optionally, the distribution area is located beside the conduction area and is interconnected with the conduction area, the periphery of the through hole is an annular connecting portion, the annular connecting portion has a first annular surface and a second annular surface, the second annular surface is a welding surface; the distribution area has a first surface and a second surface, the distribution hole passes through the first surface and the second surface of the distribution area, and the overflow groove is recessed from the first surface to the second surface.

[0009] Optionally, the overflow groove is located at an opening where the conduction area and the distribution area are connected.

[0010] Optionally, the overflow groove is in an arc shape with its center located on one side of the conduction area, or the overflow groove is in an inverse arc shape with its center located on one side of the distribution area.

[0011] Optionally, two ends of the overflow groove are connected to two sides of the opening, or two ends of the overflow groove are spaced apart from two sides of the opening.

[0012] Optionally, the overflow groove is an annular groove surrounding the dispensing hole.

[0013] Optionally, the first annular surface of the conducting area and the first surface of the distribution area are located in the same plane, and the second annular surface of the conducting area and the second surface of the distribution area are located in the same plane.

[0014] Optionally, the periphery of the annular connecting portion is a first side wall portion, the periphery of the bottom of the distribution area is a second side wall portion, the first side wall portion is an oblique side wall portion, and the open diameter of the conductive area is larger than the diameter of its bottom.

[0015] Optionally, the depth of the overflow groove is less than or equal to two-thirds of the depth of the conductive area.

[0016] To achieve the above another object, the present invention further provides a plate heat exchanger, comprising a plurality of plates, wherein the plates have any of the distributor structures described above.

[0017] Optionally, the distributor structure and the overflow groove are integrally stamped and formed with the plate.

[0018] The distributor structure provided by the present invention is provided with an overflow groove between the welding surface and the distribution hole to separate the two. When welding, the presence of the overflow groove can effectively block the capillary phenomenon of the brazing flux, and the excess brazing flux will flow into the overflow groove along the welding surface, increasing the distance and difficulty of the brazing flux flowing into the distribution hole, thereby preventing the brazing flux from clogging the distribution hole due to the capillary phenomenon, thereby ensuring the pressure drop performance and heat exchange performance of the product.

[0019] The plate heat exchanger provided by the present invention is provided with the distributor structure. Since the distributor structure has the above-mentioned technical effects, the plate heat exchanger provided with the distributor structure should also have corresponding technical effects. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 A schematic diagram of a distributor structure provided by an embodiment of the present invention being arranged on a plate of a plate heat exchanger;

[0021] Figure 2 for Figure 1 A partial enlarged view of the distributor structure;

[0022] Figure 3 for Figure 2 AA view;

[0023] Figure 4 A schematic diagram of a second distributor structure provided by an embodiment of the present invention;

[0024] Figure 5 A schematic diagram of a third distributor structure provided by an embodiment of the present invention;

[0025] Figure 6 A schematic diagram of a fourth distributor structure provided by an embodiment of the present invention;

[0026] Figure 7 for Figure 2 A schematic cross-sectional view of the distributor structure shown being welded to adjacent plates.

[0027] In the figure:

[0028] 1. Plate; 2. Distributor structure; 21. Conducting area; 22. Distribution area; 211. Through hole; 212. Annular connecting portion; 213. First side wall portion; 221. Distribution hole; 222. Overflow groove; 223. Second side wall portion; 224. Protruding ridge; 225. Step; a. First annular surface; b. Second annular surface; c. First surface; d. Second surface. DETAILED DESCRIPTION

[0029] In order to enable those skilled in the art to better understand the solution of the present invention, the present invention is further described in detail below in conjunction with the accompanying drawings and specific implementation methods.

[0030] In this article, the terms "upper, lower, inside, outside" and the like are established based on the positional relationships shown in the drawings. The corresponding positional relationships may also change depending on the drawings, and therefore cannot be understood as absolute limitations on the scope of protection; moreover, relational terms such as "first" and "second" and the like are merely used to distinguish one component from another with the same name, and do not necessarily require or imply any actual relationship or order between these components.

[0031] The plate heat exchanger is mainly composed of multiple plates, and through the opening and closing of the corner holes, two independent channels are formed where the hot side fluid and the refrigerant fluid intersect, that is, the hot side-refrigerant side-hot side-refrigerant side...-hot side arrangement. When the plate heat exchanger is used in the evaporator, a distributor is usually designed on the refrigerant inlet side, and distribution holes are arranged on the distributor. The refrigerant enters the refrigerant side channel through the distribution holes on the distributor.

[0032] During welding, the brazing flux is placed on the welding plane, and the flux melts to connect the plates. Due to the capillary phenomenon of the brazing flux, the brazing flux will flow into the gap area along the plate. Since the plane where the distribution hole is located is very close to the welding plane, most of the excess brazing flux will flow into the distribution hole, causing the distribution hole to be blocked. Since multi-layer plates are usually welded at one time, the distributor is located inside the heat exchanger after welding. Therefore, the problem of distribution hole blockage is somewhat hidden.

[0033] Please refer to Figures 1 to 3 , Figure 1 A schematic diagram of a distributor structure provided by an embodiment of the present invention being arranged on a plate of a plate heat exchanger; Figure 2 for Figure 1 A partial enlarged view of the distributor structure; Figure 3 for Figure 2 AA view of the .

[0034] As shown in the figure, in a specific embodiment, the distributor structure 2 provided by the present invention is integrally formed with the corresponding plate 1, and can be formed by one-time processing of the plate, and the wall thickness is basically uniform. Structurally speaking, this distributor structure 2 has a conduction area 21 and a distribution area 22 located next to the conduction area.

[0035] The conducting area 21 and the distribution area 22 are in a mutually connected concave shape. A through hole 211 is provided at the center of the bottom of the conducting area 21. The periphery of the through hole 211 is an annular connecting portion 212. The periphery of the annular connecting portion 212 is a first side wall portion 213. The annular connecting portion 212 has a first annular surface a and a second annular surface b, wherein the second annular surface b is a welding surface for welding and connecting with another adjacent plate 1.

[0036] The area of ​​the distribution area 22 is smaller than that of the conduction area 21, and a distribution hole 221 is provided at the bottom thereof, which passes through the first surface c and the second surface d. The bottom periphery of the distribution area 22 is a second side wall portion 223. The first side wall portion 213 of the conduction area 21 is connected to the second side wall portion 223 of the distribution area 22 to form a side wall that is continuous and closed in the circumferential direction. The first side wall portion 213 is an oblique side wall portion, and the open diameter of the conduction area 21 is larger than the diameter of its bottom. Similarly, the second side wall portion 223 is also an oblique side wall portion, and the open size of the distribution area 22 is larger than the size of its bottom.

[0037] The conducting area 21 and the distribution area 22 have the same depth, a first annular surface a of the conducting area 21 and a first surface c of the distribution area 22 are located in the same plane, and a second annular surface b of the conducting area 21 and a second surface d of the distribution area 22 are located in the same plane.

[0038] In order to prevent the solder from clogging the distribution hole 221, the second surface d (i.e. Figure 3 An overflow groove 222 is provided on the lower surface of the welding surface 221 to block the welding surface and the distribution hole 221.

[0039] Specifically, the overflow groove 222 is located at the opening connecting the conducting area 21 and the distribution area 22, that is, located on the non-welding area outside the welding surface, between the welding area and the distribution hole 221, and is recessed from the first surface c to the second surface d.

[0040] The overflow groove 222 in this embodiment is an arc-shaped groove formed near the welding surface, with its center located on one side of the conductive area 21 and coincident with the center of the first side wall portion 213. Its two ends are connected to the first side wall portion 213, and the groove faces downward, that is, in the direction of the welding surface.

[0041] The overflow groove 222 can be formed by one-time stamping process, and the back of the overflow groove 222 forms a ridge 224 higher than the first surface c at the first surface c of the distribution area 22 .

[0042] To ensure that the refrigerant can flow smoothly into the distribution hole 221 after welding, the depth of the overflow groove 22 does not exceed 2 / 3 of the depth of the conduction area 21, so that after welding, the ridge 224 formed by the overflow groove 22 can form a gap channel with the adjacent plate through which the refrigerant can flow, avoiding blocking the distribution channel due to being too high. Within this range, a higher ridge height can play a role similar to secondary throttling, which is beneficial to refrigerant distribution.

[0043] When welding (see Figure 7 ), the excess solder will flow into the overflow groove 222 along the welding surface, blocking the solder from flowing into the distribution hole 221, thereby preventing the solder from clogging the distribution hole 221 due to capillary phenomenon, thereby ensuring the pressure drop performance and heat exchange performance of the product.

[0044] In this embodiment, the edge of the overflow groove 222 is greater than 1 mm away from the edge of the distribution hole 221. The larger spacing can ensure that the distribution hole 221 does not deform during processing. If the spacing is too small, there is a risk of deformation of the distribution hole 221 and overflow of the brazing flux in the overflow groove 222 to block the distribution hole 221.

[0045] Please refer to Figure 4 , Figure 4 This is a schematic diagram of a second distributor structure provided in an embodiment of the present invention.

[0046] As shown in the figure, compared with the first embodiment, the difference of the second embodiment is that the projection shape of the overflow groove 222 is an inverted arc shape, and its center is located on one side of the distribution area 22.

[0047] Compared with the first embodiment, the reverse arc design of this embodiment can guide the flux to flow toward the two ends of the overflow groove 222 when the flux overflow is relatively large, thereby further away from the distribution hole, making the distribution hole 221 less likely to be blocked.

[0048] In this embodiment, the same parts as those in the second embodiment are given the same figure marks, and the same text descriptions are omitted.

[0049] Please refer to Figure 5 , Figure 5 This is a schematic diagram of a third distributor structure provided in an embodiment of the present invention.

[0050] As shown in the figure, compared with the first embodiment, the difference of the third embodiment is that the projection shape of the overflow groove 222 is an inverted arc, and its center is located on one side of the distribution area 22, and the two ends of the overflow groove 222 are at a certain distance from the two sides of the opening of the distribution area 22, that is, the two ends of the overflow groove 222 are not connected to the first side wall portion 213 of the conductive area 21 or the second side wall portion 223 of the distribution area 22.

[0051] Compared with the first embodiment, the reverse arc design of this embodiment can guide the flux to flow toward the two ends of the overflow groove 222 when the flux overflow is relatively large, thereby further away from the distribution hole, making the distribution hole 221 less likely to be blocked, and at the same time, the flux will not overflow to the outer areas at both ends.

[0052] In this embodiment, the same parts as those in the first embodiment are given the same figure marks, and the same text descriptions are omitted.

[0053] Please refer to Figure 6 , Figure 6 This is a schematic diagram of a fourth distributor structure provided in an embodiment of the present invention.

[0054] As shown in the figure, compared with the first embodiment, the fourth embodiment is different in that the overflow groove 222 is an annular groove surrounding the distribution hole 221 , and the distribution hole 221 is located on the central plane of the overflow groove 222 .

[0055] Compared with the first embodiment, the annular overflow groove 222 of this embodiment can isolate the distribution hole 221 in all directions, and can prevent the brazing agent from crossing the overflow groove 222 from all directions to block the distribution hole 221 when the amount of brazing agent overflow is relatively large. At the same time, the annular overflow groove 222 has a large capacity and can accommodate more brazing agent, thereby preventing the brazing agent from overflowing to other areas.

[0056] In this embodiment, the same parts as those in the first embodiment are given the same figure marks, and the same text descriptions are omitted.

[0057] The above embodiments are only preferred solutions of the present invention and are not limited thereto. On this basis, targeted adjustments can be made according to actual needs to obtain different implementation methods. For example, the overflow groove 222 surrounds the distribution hole 221 in other forms, etc. Since there are many possible implementation methods, they will not be described one by one here.

[0058] To achieve the above-mentioned other purpose, the present invention further provides a plate heat exchanger, which is provided with a plurality of plates 1, the plates 1 have the distributor structure described above, and the distributor structure is integrally stamped from the surface of the plate 1. For the remaining structure of the plate heat exchanger, please refer to the prior art, which will not be repeated herein.

[0059] The above is a detailed introduction to the distributor structure and plate heat exchanger provided by the present invention. This article uses specific examples to illustrate the principles and implementation methods of the present invention. The description of the above embodiments is only used to help understand the core idea of ​​the present invention. It should be pointed out that for ordinary technicians in this technical field, without departing from the principle of the present invention, the present invention can also be improved and modified in a number of ways, and these improvements and modifications also fall within the scope of protection of the claims of the present invention.

Claims

1. A distributor structure, characterized in that: The invention comprises a conduction area (21) and a distribution area (22) formed by a surface depression of a plate (1); a through hole (211) is provided at the bottom of the conduction area (21); a distribution hole (221) is provided at the distribution area (22); the bottom of the conduction area (21) comprises a welding surface; the distribution hole (221) is located at the periphery of the welding surface; and an overflow groove (222) is provided between the distribution hole (221) and the welding surface.

2. The distributor structure according to claim 1, characterized in that: The distribution area (22) is located beside the conduction area (21) and is interconnected with the conduction area (21); the periphery of the through hole (211) is an annular connection portion (212); the annular connection portion (212) has a first annular surface (a) and a second annular surface (b); the second annular surface (b) is a welding surface; the distribution area (22) has a first surface (c) and a second surface (d); the distribution hole (221) passes through the first surface (c) and the second surface (d) of the distribution area (22); and the overflow groove (222) is recessed from the first surface (c) to the second surface (d).

3. The distributor structure according to claim 1, characterized in that: The overflow groove (222) is located at the opening where the conduction area (21) and the distribution area (22) are connected.

4. The distributor structure according to claim 3, characterized in that: The overflow groove (22) is in the shape of an arc with its center located on one side of the conduction area (21), or the overflow groove (22) is in the shape of an inverse arc with its center located on one side of the distribution area (22).

5. The distributor structure according to claim 4, characterized in that: The two ends of the overflow groove (22) are connected to the two sides of the opening, or the two ends of the overflow groove (22) are spaced apart from the two sides of the opening.

6. The distributor structure according to claim 1, characterized in that: The overflow groove (22) is an annular groove surrounding the distribution hole (221).

7. The distributor structure according to claim 2, characterized in that: The first annular surface (a) of the conducting area (21) and the first surface (c) of the distribution area (22) are located in the same plane, and the second annular surface (b) of the conducting area (21) and the second surface (d) of the distribution area (22) are located in the same plane.

8. The distributor structure according to claim 7, characterized in that: The periphery of the annular connecting portion (212) is a first side wall portion (213), the periphery of the bottom of the distribution area (22) is a second side wall portion (223), the first side wall portion (213) is an oblique side wall portion, and the open diameter of the conductive area (21) is larger than the diameter of its bottom.

9. The distributor structure according to claim 9, characterized in that: The depth of the overflow groove (22) is less than or equal to two thirds of the depth of the conduction area (21).

10. A plate heat exchanger, comprising a plurality of plates (1), characterized in that: The plate (1) has a distributor structure as claimed in any one of claims 1 to 9.

11. The plate heat exchanger according to claim 10, characterized in that: The distributor structure is integrally stamped from the surface of the plate (1).

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