Electron beam image angle correction method and device, electronic equipment and storage medium

Abstract

The invention provides an electron beam image angle correction method and device, electronic equipment and a storage medium, and the method comprises the steps: placing a to-be-detected sample on a motion platform; acquiring a first electron beam image of the to-be-detected sample at the current position; a motion coordinate system is determined, the X axis and the Y axis of the motion coordinate system are parallel to the two adjacent rectangular edges of the electron beam image respectively, and the original point coincides with the center of the electron beam image; moving the to-be-detected sample for a preset distance along the X-axis direction of the motion coordinate system to obtain a second electron beam image of the to-be-detected sample; fourier transform is carried out on the first electron beam image and the second electron beam image to determine the offset between the first electron beam image and the second electron beam image; determining an angular deviation value between the first electron beam image and the second electron beam image according to the offset; and performing angle correction on the electron beam image according to the angle deviation value.

Description

Technical Field

[0001] The present disclosure relates to the technical field of scanning electron microscopes, and in particular to an electron beam image angle correction method, device, electronic equipment and storage medium. Background Art

[0002] Microscopes are the eyes of human beings to study the objective world. Among them, scanning transmission electron microscopy (STEM) is a widely used microscope with nanoscale characterization capabilities, which is often used in the fields of biology, semiconductors, and materials science. However, when observing the images generated by electron beam scanning, due to the inherent angle deviation between the electron beam detector and the motion platform, there is an inconsistency between the observation coordinate system and the actual motion coordinate system, which directly causes the observed image motion trajectory to deviate from the preset motion direction. Although this problem can be improved to a certain extent by manually adjusting the deflector angle, this process is not only cumbersome to operate, but also inefficient, and it is difficult to meet the needs of efficient and accurate image analysis. Summary of the invention

[0003] The present disclosure provides an electron beam image angle correction method, device, electronic device and storage medium to at least solve the above technical problems existing in the prior art.

[0004] According to a first aspect of the present disclosure, a method for correcting an electron beam image angle is provided, wherein the method comprises:

[0005] Place the sample to be tested on the motion platform;

[0006] Acquire a first electron beam image of the sample to be tested at a current position;

[0007] Determine a motion coordinate system, wherein the X axis and the Y axis of the motion coordinate system are respectively parallel to two adjacent rectangular sides of the electron beam image, and the origin coincides with the center of the electron beam image;

[0008] Moving the sample to be tested by a preset distance along the X-axis direction of the motion coordinate system to obtain a second electron beam image of the sample to be tested;

[0009] Performing Fourier transformation on the first electron beam image and the second electron beam image to determine an offset between the first electron beam image and the second electron beam image;

[0010] determining an angle deviation value between the first electron beam image and the second electron beam image according to the offset;

[0011] The electron beam image is angle-corrected according to the angle deviation value.

[0012] In one embodiment, Fourier transforming the first electron beam image and the second electron beam image to determine an offset between the first electron beam image and the second electron beam image includes:

[0013] The first electron beam image and the second electron beam image are subjected to Fourier transformation by the following formula (1) to obtain frequency domain images of the first electron beam image and the second electron beam image.

[0014]

[0015] Among them, F 1 (u,v) represents the frequency domain image of the first electron beam image, F 2 (u,v) represents the frequency domain image of the second electron beam image, u and v are variables in the frequency domain image, (x 0 ,y 0 ) represents the offset between the first electron beam image and the second electron beam image;

[0016] According to the frequency domain images of the first electron beam image and the second electron beam image, the pulse function of the offset is obtained by the following formula (2):

[0017]

[0018] Among them, H(u,v) represents the cross power spectrum, A 1 and A 2 Represents F 1 and F 2 The amplitude of δ(x 0 ,y 0 ) represents the impulse function, a pulse function representing the offset;

[0019] The offset is determined when the value of the impulse function is maximum.

[0020] In one embodiment, determining an angle deviation value between the first electron beam image and the second electron beam image according to the offset includes:

[0021] The offset is converted into the angle deviation value by an inverse tangent function, wherein the inverse tangent function is shown in the following formula (3):

[0022] θ=arctan(y 0 / x 0 ) (3)

[0023] Where θ is the angle deviation value.

[0024] In one possible implementation manner, performing angle correction on the electron beam image according to the angle deviation value includes:

[0025] The angle deviation value is input into a deflector to perform angle correction on the electron beam image.

[0026] According to a second aspect of the present disclosure, there is provided an electron beam image angle correction device, wherein the device comprises:

[0027] A clamping unit, used to place the sample to be tested on the moving platform;

[0028] A first acquisition unit, used for acquiring a first electron beam image of the sample to be tested at a current position;

[0029] A first determining unit is used to determine a motion coordinate system, wherein an X axis and a Y axis of the motion coordinate system are respectively parallel to two adjacent rectangular sides of the electron beam image, and an origin coincides with a center of the electron beam image;

[0030] A second acquisition unit, used for moving the sample to be tested by a preset distance along the X-axis direction of the motion coordinate system to obtain a second electron beam image of the sample to be tested;

[0031] a second determining unit, configured to perform Fourier transform on the first electron beam image and the second electron beam image to determine an offset between the first electron beam image and the second electron beam image;

[0032] a third determining unit, configured to determine an angle deviation value between the first electron beam image and the second electron beam image according to the offset;

[0033] A correction unit is used to perform angle correction on the electron beam image according to the angle deviation value.

[0034] In one possible implementation manner, the second determining unit is specifically configured to: perform Fourier transform on the first electron beam image and the second electron beam image through the following formula (1) to obtain frequency domain images of the first electron beam image and the second electron beam image.

[0035]

[0036] Among them, F 1 (u,v) represents the frequency domain image of the first electron beam image, F 2 (u,v) represents the frequency domain image of the second electron beam image, u and v are variables in the frequency domain image, (x 0 ,y 0 ) represents the offset between the first electron beam image and the second electron beam image;

[0037] According to the frequency domain images of the first electron beam image and the second electron beam image, the pulse function of the offset is obtained by the following formula (2):

[0038]

[0039] Among them, H(u,v) represents the cross power spectrum, A 1 and A 2 Represents F 1 and F 2 The amplitude of δ(x 0 ,y 0 ) represents the impulse function, a pulse function representing the offset;

[0040] The offset is determined when the value of the impulse function is maximum.

[0041] In one possible implementation manner, the third determination unit is specifically configured to: convert the offset into the angle deviation value by using an inverse tangent function, wherein the inverse tangent function is as shown in the following formula (3):

[0042] θ=arctan(y 0 / x 0 ) (3)

[0043] Where θ is the angle deviation value.

[0044] In one possible implementation manner, the correction unit is specifically used to: input the angle deviation value into a deflector to perform angle correction on the electron beam image.

[0045] According to a third aspect of the present disclosure, there is provided an electronic device, including:

[0046] at least one processor; and

[0047] a memory communicatively connected to the at least one processor; wherein,

[0048] The memory stores instructions that can be executed by the at least one processor, and the instructions are executed by the at least one processor to enable the at least one processor to perform the method described in the present disclosure.

[0049] According to a fourth aspect of the present disclosure, a non-transitory computer-readable storage medium storing computer instructions is provided, wherein the computer instructions are used to cause the computer to execute the method described in the present disclosure.

[0050] The electron beam image angle correction method, device, electronic device and storage medium disclosed in the present invention first obtain a first electron beam image of the sample to be tested at the current position and a second electron beam image after moving a preset distance along the X-axis direction of the motion coordinate system, and then perform Fourier transformation on the first electron beam image and the second electron beam image to obtain the offset between the two images, and then obtain the angle deviation value, so as to perform angle correction on the electron beam image. The present invention follows the principle of high efficiency, and the overall process is simple and does not need to occupy a large amount of computing resources, ensuring that efficient data processing is achieved without affecting the smoothness of the overall operation process of the system; the present invention abandons the traditional manual adjustment method, which not only greatly simplifies the operation steps and reduces the complexity of the operation, but also ensures that the observation results of the electron beam image directly reflect the observer's expectations by accurately calculating and automatically adjusting the relevant parameters, thereby improving the accuracy of the correction, thereby bringing higher observation accuracy and reliability to the overall observation system, making the observation experience more in line with the observer's intuitive feelings.

[0051] It should be understood that the content described in this section is not intended to identify the key or important features of the embodiments of the present disclosure, nor is it intended to limit the scope of the present disclosure. Other features of the present disclosure will become easily understood through the following description. BRIEF DESCRIPTION OF THE DRAWINGS

[0052] The above and other purposes, features and advantages of the exemplary embodiments of the present disclosure will become readily understood by reading the detailed description below with reference to the accompanying drawings. In the accompanying drawings, several embodiments of the present disclosure are shown in an exemplary and non-limiting manner, in which:

[0053] In the drawings, the same or corresponding reference numerals represent the same or corresponding parts.

[0054] Figure 1 A flow chart of an electron beam image angle correction method provided by an embodiment of the present disclosure;

[0055] Figure 2 Schematic diagram of the electron beam image of the sample to be tested;

[0056] Figure 3 It is a schematic diagram of the relative position of the sample to be tested before and after it moves;

[0057] Figure 4 A schematic diagram of the structure of an electron beam image angle correction device provided in an embodiment of the present disclosure;

[0058] Figure 5 A schematic diagram of the structure of an electronic device according to an embodiment of the present disclosure is shown. DETAILED DESCRIPTION

[0059] In order to make the purpose, features, and advantages of the present disclosure more obvious and easy to understand, the technical solutions in the embodiments of the present disclosure will be clearly and completely described below in conjunction with the drawings in the embodiments of the present disclosure. Obviously, the described embodiments are only part of the embodiments of the present disclosure, not all of the embodiments. Based on the embodiments in the present disclosure, all other embodiments obtained by those skilled in the art without creative work are within the scope of protection of the present disclosure.

[0060] The present disclosure provides a method for correcting the angle of an electron beam image. Figure 1 A flowchart of the electron beam image angle correction method provided by the embodiment of the present disclosure, such as Figure 1 As shown, the method includes:

[0061] Step 101, placing a sample to be tested on a moving platform.

[0062] Figure 2 Figure 1 is a schematic diagram of the electron beam image of the sample to be tested. Figure 2 As shown in the figure, the XY coordinate system is the motion coordinate system of the motion platform, the X-axis and Y-axis of the motion coordinate system are respectively parallel to the two adjacent rectangular sides of the electron beam image, and the origin coincides with the center of the electron beam image. The X'Y' coordinate system is the user coordinate system, and the sample to be tested includes a plurality of grids arranged in an array along a first direction and a second direction, the first direction is perpendicular to the second direction, the X-axis of the user coordinate system is parallel to the first direction, the Y-axis is parallel to the second direction, and the origin coincides with the center of the sample to be tested. The user coordinate system is also the coordinate system that is ultimately desired to be transformed. It can be seen from observation that there is an angular deviation between the motion coordinate system and the user coordinate system, which needs to be corrected.

[0063] Step 102, obtaining a first electron beam image of the sample to be tested at the current position.

[0064] Figure 3 It is a schematic diagram of the relative position of the sample before and after it is moved. It should be explained that for ease of understanding, Figure 3 The position of the sample to be tested in the electron beam image before it is moved and the position of the sample to be tested in the electron beam image after it is moved are integrated into a schematic diagram.

[0065] like Figure 3 As shown, before the sample 10 to be tested is moved (ie, the current position), the center point is located at O1.

[0066] Step 103, determining a motion coordinate system, wherein the X axis and the Y axis of the motion coordinate system are respectively parallel to two adjacent rectangular sides of the electron beam image, and the origin coincides with the center of the electron beam image.

[0067] like Figure 3 As shown, the XY coordinate system in the figure is the motion coordinate system.

[0068] Step 104 , moving the sample to be tested by a preset distance along the X-axis direction of the motion coordinate system to obtain a second electron beam image of the sample to be tested.

[0069] Specifically, for example, the software sends instructions to control the motion platform to move in the negative direction of the X-axis of the motion coordinate system, driving the sample to be tested to move in the negative direction of the X-axis, so that the electron beam image moves in the positive direction of the X-axis, and captures the electron beam image after the movement is completed.

[0070] In another embodiment, the motion platform may also be controlled to move toward the positive direction of the X-axis, so that the electron beam image moves toward the negative direction of the X-axis.

[0071] In the embodiment of the present disclosure, the moving of the sample to be tested in the negative direction of the X-axis is taken as an example for explanation. Figure 3 As shown, the center point of the sample 10 to be tested is located at O2 after the movement.

[0072] Step 105: Perform Fourier transform on the first electron beam image and the second electron beam image to determine the offset between the first electron beam image and the second electron beam image.

[0073] In one embodiment, performing Fourier transformation on the first electron beam image and the second electron beam image to determine the offset between the first electron beam image and the second electron beam image includes:

[0074] The first electron beam image and the second electron beam image are Fourier transformed by the following formula (1) to obtain the frequency domain images of the first electron beam image and the second electron beam image:

[0075]

[0076] Among them, F 1 (u,v) represents the frequency domain image of the first electron beam image, F 2 (u,v) represents the frequency domain image of the second electron beam image, u and v are variables in the frequency domain image, (x 0 ,y 0 ) represents the offset between the first electron beam image and the second electron beam image;

[0077] According to the frequency domain images of the first electron beam image and the second electron beam image, the pulse function of the offset is obtained by the following formula (2):

[0078]

[0079] Among them, H(u,v) represents the cross power spectrum, A 1 and A 2 Represents F 1 and F 2 The amplitude of δ(x 0,y 0 ) represents the impulse function, a pulse function representing the offset;

[0080] When the value of the impulse function is maximum, the offset is determined.

[0081] Specifically, let f 1 (x,y) and f 2 (x, y) are two electron beam images taken before and after the sample is moved, namely the first electron beam image and the second electron beam image. x and y represent the pixel coordinate values ​​in the X-axis and Y-axis directions, respectively, and can be any pixel coordinate value within the image range. The translation relationship satisfies formula (4). The offset is set to (x 0 ,y 0 ),like Figure 3 As shown, x 0 is the offset along the X-axis of the user coordinate system, y 0 is the offset along the Y axis of the user coordinate system. It needs to be explained that Figure 3 The user coordinate system is not shown in the Figure 2 , you can set the horizontal direction to the X-axis direction of the user coordinate system, and the vertical direction to the Y-axis direction of the user coordinate system.

[0082] f 2 (x,y)=f 1 (x+x 0 ,y+y 0 ) (4)

[0083] Next, the first electron beam image and the second electron beam image are Fourier transformed and converted to the frequency domain to obtain the above formula (1):

[0084]

[0085] Divide both sides of formula (1) by F 1 (u,v), and the cross power spectrum is obtained, as shown in formula (2):

[0086]

[0087] in, That is the offset (x 0 ,y 0 ) is the pulse function of .

[0088] According to the properties of the pulse function: δ(x 0 ,y 0 ) in x 0 With y 0 The value is the largest at the point where the impulse function has the largest value. By traversing all the coordinate points in the image, we can determine the x at which the impulse function has the largest value. 0 With y0 , thereby determining the offset.

[0089] Step 106: determining an angle deviation value between the first electron beam image and the second electron beam image according to the offset.

[0090] In one embodiment, determining the angle deviation value between the first electron beam image and the second electron beam image according to the offset includes:

[0091] The offset is converted into an angle deviation value by an inverse tangent function, wherein the inverse tangent function is shown in the following formula (3):

[0092] θ=arctan(y 0 / x 0 ) (3)

[0093] Where θ is the angle deviation value.

[0094] like Figure 3 As shown in the figure, the angle deviation value θ is the angle between the moving direction of the sample 10 to be tested and the X-axis of the user coordinate system.

[0095] Step 107: performing angle correction on the electron beam image according to the angle deviation value.

[0096] In one embodiment, performing angle correction on the electron beam image according to the angle deviation value includes:

[0097] The angle deviation value is input into the deflector to perform angle correction on the electron beam image.

[0098] It should be explained that the deflector hardware is generally set at an angle of 0-90 degrees to achieve a rotation of the electron beam image between 0 and 90 degrees. If the angle deviation value exceeds 90 degrees, the part exceeding 90 degrees can be achieved through image software post-processing. For example, for a deflection angle of 100 degrees, a parameter of 10 degrees is set for the deflector, and the obtained image is rotated another 90 degrees to finally achieve image rotation.

[0099] In the embodiment of the present disclosure, by first obtaining a first electron beam image of the sample to be tested at the current position and a second electron beam image after moving a preset distance along the X-axis direction of the motion coordinate system, and then performing Fourier transformation on the first electron beam image and the second electron beam image, the offset between the two images is obtained, and then the angle deviation value is obtained, so as to perform angle correction on the electron beam image. The present disclosure follows the principle of high efficiency, and the overall process is simple and does not require a large amount of computing resources, ensuring that efficient data processing is achieved without affecting the smoothness of the overall operation process of the system; the present disclosure abandons the traditional manual adjustment method, which not only greatly simplifies the operation steps and reduces the complexity of the operation, but also ensures that the observation results of the electron beam image directly reflect the observer's expectations through accurate calculation and automatic adjustment of relevant parameters, thereby improving the accuracy of the correction, thereby bringing higher observation accuracy and reliability to the overall observation system, making the observation experience more in line with the observer's intuitive feelings.

[0100] The embodiment of the present disclosure also provides an electron beam image angle correction device, Figure 4 A schematic diagram of the structure of the electron beam image angle correction device provided in an embodiment of the present disclosure, such as Figure 4 As shown, the device comprises:

[0101] The clamping unit 401 is used to place the sample to be tested on the moving platform;

[0102] A first acquisition unit 402 is used to acquire a first electron beam image of the sample to be tested at a current position;

[0103] A first determining unit 403 is used to determine a motion coordinate system, wherein the X axis and the Y axis of the motion coordinate system are parallel to two adjacent rectangular sides of the electron beam image, respectively, and the origin coincides with the center of the electron beam image;

[0104] A second acquisition unit 404 is used to move the sample to be tested by a preset distance along the X-axis direction of the motion coordinate system to obtain a second electron beam image of the sample to be tested;

[0105] A second determining unit 405 is used to perform Fourier transform on the first electron beam image and the second electron beam image to determine an offset between the first electron beam image and the second electron beam image;

[0106] A third determining unit 406 is used to determine an angle deviation value between the first electron beam image and the second electron beam image according to the offset;

[0107] The correction unit 407 is used to perform angle correction on the electron beam image according to the angle deviation value.

[0108] In one embodiment, the second determining unit 405 is specifically used to: perform Fourier transform on the first electron beam image and the second electron beam image through the following formula (1) to obtain frequency domain images of the first electron beam image and the second electron beam image.

[0109]

[0110] Among them, F 1 (u,v) represents the frequency domain image of the first electron beam image, F 2 (u,v) represents the frequency domain image of the second electron beam image, u and v are variables in the frequency domain image, (x 0 ,y 0 ) represents the offset between the first electron beam image and the second electron beam image;

[0111] According to the frequency domain images of the first electron beam image and the second electron beam image, the pulse function of the offset is obtained by the following formula (2):

[0112]

[0113] Among them, H(u,v) represents the cross power spectrum, A 1 and A 2 Represents F 1 and F 2 The amplitude of δ(x 0 ,y 0 ) represents the impulse function, a pulse function representing the offset;

[0114] When the value of the impulse function is maximum, the offset is determined.

[0115] In one embodiment, the third determination unit 406 is specifically configured to: convert the offset into an angle deviation value by using an inverse tangent function, wherein the inverse tangent function is shown in the following formula (3):

[0116] θ=arctan(y 0 / x 0 ) (3)

[0117] Where θ is the angle deviation value.

[0118] In one embodiment, the correction unit 407 is specifically configured to input the angle deviation value into the deflector to perform angle correction on the electron beam image.

[0119] According to an embodiment of the present disclosure, the present disclosure also provides an electronic device and a readable storage medium.

[0120] Figure 5A schematic block diagram of an example electronic device 500 that can be used to implement an embodiment of the present disclosure is shown. The electronic device is intended to represent various forms of digital computers, such as laptop computers, desktop computers, workstations, personal digital assistants, servers, blade servers, mainframe computers, and other suitable computers. The electronic device can also represent various forms of mobile devices, such as personal digital processing, cellular phones, smart phones, wearable devices, and other similar computing devices. The components shown herein, their connections and relationships, and their functions are merely examples and are not intended to limit the implementation of the present disclosure described and / or required herein.

[0121] like Figure 5 As shown, the device 500 includes a computing unit 501, which can perform various appropriate actions and processes according to a computer program stored in a read-only memory (ROM) 502 or a computer program loaded from a storage unit 508 into a random access memory (RAM) 503. In the RAM 503, various programs and data required for the operation of the device 500 can also be stored. The computing unit 501, the ROM 502, and the RAM 503 are connected to each other via a bus 504. An input / output (I / O) interface 505 is also connected to the bus 504.

[0122] A number of components in the device 500 are connected to the I / O interface 505, including: an input unit 506, such as a keyboard, a mouse, etc.; an output unit 507, such as various types of displays, speakers, etc.; a storage unit 508, such as a disk, an optical disk, etc.; and a communication unit 509, such as a network card, a modem, a wireless communication transceiver, etc. The communication unit 509 allows the device 500 to exchange information / data with other devices through a computer network such as the Internet and / or various telecommunication networks.

[0123] The computing unit 501 may be a variety of general and / or special processing components with processing and computing capabilities. Some examples of the computing unit 501 include, but are not limited to, a central processing unit (CPU), a graphics processing unit (GPU), various dedicated artificial intelligence (AI) computing chips, various computing units running machine learning model algorithms, digital signal processors (DSPs), and any appropriate processors, controllers, microcontrollers, etc. The computing unit 501 performs the various methods and processes described above, such as the electron beam image angle correction method. For example, in some embodiments, the electron beam image angle correction method may be implemented as a computer software program, which is tangibly contained in a machine-readable medium, such as a storage unit 508. In some embodiments, part or all of the computer program may be loaded and / or installed on the device 500 via ROM 502 and / or communication unit 509. When the computer program is loaded into RAM 503 and executed by the computing unit 501, one or more steps of the electron beam image angle correction method described above may be performed. Alternatively, in other embodiments, the computing unit 501 may be configured to perform the electron beam image angle correction method in any other appropriate manner (e.g., by means of firmware).

[0124] Various implementations of the systems and techniques described above herein can be implemented in digital electronic circuit systems, integrated circuit systems, field programmable gate arrays (FPGAs), application specific integrated circuits (ASICs), application specific standard products (ASSPs), systems on chips (SOCs), complex programmable logic devices (CPLDs), computer hardware, firmware, software, and / or combinations thereof. These various implementations can include: being implemented in one or more computer programs that can be executed and / or interpreted on a programmable system including at least one programmable processor, which can be a special purpose or general purpose programmable processor that can receive data and instructions from a storage system, at least one input device, and at least one output device, and transmit data and instructions to the storage system, the at least one input device, and the at least one output device.

[0125] The program code for implementing the method of the present disclosure may be written in any combination of one or more programming languages. These program codes may be provided to a processor or controller of a general-purpose computer, a special-purpose computer, or other programmable data processing device, so that the program code, when executed by the processor or controller, enables the functions / operations specified in the flow chart and / or block diagram to be implemented. The program code may be executed entirely on the machine, partially on the machine, partially on the machine and partially on a remote machine as a stand-alone software package, or entirely on a remote machine or server.

[0126] In the context of the present disclosure, a machine-readable medium may be a tangible medium that may contain or store a program for use by or in conjunction with an instruction execution system, device, or equipment. A machine-readable medium may be a machine-readable signal medium or a machine-readable storage medium. A machine-readable medium may include, but is not limited to, an electronic, magnetic, optical, electromagnetic, infrared, or semiconductor system, device, or equipment, or any suitable combination of the foregoing. A more specific example of a machine-readable storage medium may include an electrical connection based on one or more lines, a portable computer disk, a hard disk, a random access memory (RAM), a read-only memory (ROM), an erasable programmable read-only memory (EPROM or flash memory), an optical fiber, a portable compact disk read-only memory (CD-ROM), an optical storage device, a magnetic storage device, or any suitable combination of the foregoing.

[0127] To provide interaction with a user, the systems and techniques described herein can be implemented on a computer having: a display device (e.g., a CRT (cathode ray tube) or LCD (liquid crystal display) monitor) for displaying information to the user; and a keyboard and pointing device (e.g., a mouse or trackball) through which the user can provide input to the computer. Other types of devices can also be used to provide interaction with the user; for example, the feedback provided to the user can be any form of sensory feedback (e.g., visual feedback, auditory feedback, or tactile feedback); and input from the user can be received in any form (including acoustic input, voice input, or tactile input).

[0128] The systems and techniques described herein may be implemented in a computing system that includes back-end components (e.g., as a data server), or a computing system that includes middleware components (e.g., an application server), or a computing system that includes front-end components (e.g., a user computer with a graphical user interface or a web browser through which a user can interact with implementations of the systems and techniques described herein), or a computing system that includes any combination of such back-end components, middleware components, or front-end components. The components of the system may be interconnected by any form or medium of digital data communication (e.g., a communication network). Examples of communication networks include: a local area network (LAN), a wide area network (WAN), and the Internet.

[0129] A computer system may include a client and a server. The client and the server are generally remote from each other and usually interact through a communication network. The relationship of client and server is generated by computer programs running on respective computers and having a client-server relationship with each other. The server may be a cloud server, a server of a distributed system, or a server combined with a blockchain.

[0130] It should be understood that the various forms of processes shown above can be used to reorder, add or delete steps. For example, the steps recorded in this disclosure can be executed in parallel, sequentially or in different orders, as long as the desired results of the technical solutions disclosed in this disclosure can be achieved, and this document does not limit this.

[0131] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of the features. In the description of the present disclosure, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0132] The above is only a specific embodiment of the present disclosure, but the protection scope of the present disclosure is not limited thereto. Any person skilled in the art who is familiar with the technical field can easily think of changes or substitutions within the technical scope disclosed in the present disclosure, which should be included in the protection scope of the present disclosure. Therefore, the protection scope of the present disclosure should be based on the protection scope of the claims.

Claims

1. A method for correcting the angle of an electron beam image, characterized in that: The method comprises: Place the sample to be tested on the motion platform; Acquire a first electron beam image of the sample to be tested at a current position; Determine a motion coordinate system, wherein the X axis and the Y axis of the motion coordinate system are respectively parallel to two adjacent rectangular sides of the electron beam image, and the origin coincides with the center of the electron beam image; Moving the sample to be tested by a preset distance along the X-axis direction of the motion coordinate system to obtain a second electron beam image of the sample to be tested; Performing Fourier transformation on the first electron beam image and the second electron beam image to determine an offset between the first electron beam image and the second electron beam image; determining an angle deviation value between the first electron beam image and the second electron beam image according to the offset; The electron beam image is angle-corrected according to the angle deviation value.

2. The method according to claim 1, characterized in that Performing Fourier transformation on the first electron beam image and the second electron beam image to determine an offset between the first electron beam image and the second electron beam image, comprising: The first electron beam image and the second electron beam image are subjected to Fourier transformation by the following formula (1) to obtain frequency domain images of the first electron beam image and the second electron beam image. Wherein, F1(u,v) represents the frequency domain image of the first electron beam image, F2(u,v) represents the frequency domain image of the second electron beam image, u and v are variables in the frequency domain image, and (x0,y0) represents the offset between the first electron beam image and the second electron beam image; According to the frequency domain images of the first electron beam image and the second electron beam image, the pulse function of the offset is obtained by the following formula (2): Among them, H(u,v) represents the cross power spectrum, A1 and A2 represent the amplitudes of F1 and F2 respectively, δ(x0,y0) represents the impulse function, a pulse function representing the offset; The offset is determined when the value of the impulse function is maximum.

3. The method according to claim 1, characterized in that Determining an angle deviation value between the first electron beam image and the second electron beam image according to the offset includes: The offset is converted into the angle deviation value by an inverse tangent function, wherein the inverse tangent function is shown in the following formula (3): θ=arctan(y 0 / x0) (3) where θ is the angle deviation value.

4. The method according to claim 1, characterized in that: The step of performing angle correction on the electron beam image according to the angle deviation value comprises: The angle deviation value is input into a deflector to perform angle correction on the electron beam image.

5. An electron beam image angle correction device, characterized in that: The device comprises: A clamping unit, used to place the sample to be tested on the moving platform; A first acquisition unit, used for acquiring a first electron beam image of the sample to be tested at a current position; A first determining unit is used to determine a motion coordinate system, wherein an X axis and a Y axis of the motion coordinate system are respectively parallel to two adjacent rectangular sides of the electron beam image, and an origin coincides with a center of the electron beam image; A second acquisition unit, used for moving the sample to be tested by a preset distance along the X-axis direction of the motion coordinate system to obtain a second electron beam image of the sample to be tested; a second determining unit, configured to perform Fourier transform on the first electron beam image and the second electron beam image to determine an offset between the first electron beam image and the second electron beam image; a third determining unit, configured to determine an angle deviation value between the first electron beam image and the second electron beam image according to the offset; A correction unit is used to perform angle correction on the electron beam image according to the angle deviation value.

6. The device according to claim 5, characterized in that The second determination unit is specifically used to: perform Fourier transformation on the first electron beam image and the second electron beam image through the following formula (1) to obtain frequency domain images of the first electron beam image and the second electron beam image, Wherein, F1(u,v) represents the frequency domain image of the first electron beam image, F2(u,v) represents the frequency domain image of the second electron beam image, u and v are variables in the frequency domain image, and (x0,y0) represents the offset between the first electron beam image and the second electron beam image; According to the frequency domain images of the first electron beam image and the second electron beam image, the pulse function of the offset is obtained by the following formula (2): Among them, H(u,v) represents the cross power spectrum, A1 and A2 represent the amplitudes of F1 and F2 respectively, δ(x0,y0) represents the impulse function, a pulse function representing the offset; The offset is determined when the value of the impulse function is maximum.

7. The device according to claim 5, characterized in that The third determination unit is specifically configured to convert the offset into the angle deviation value by using an inverse tangent function, wherein the inverse tangent function is as shown in the following formula (3): θ=arctan(y 0 / x0) (3) where θ is the angle deviation value.

8. The device according to claim 5, characterized in that The correction unit is specifically used to: input the angle deviation value into the deflector to perform angle correction on the electron beam image.

9. An electronic device, characterized in that: include: at least one processor; as well as a memory communicatively connected to the at least one processor; wherein, The memory stores instructions that can be executed by the at least one processor, and the instructions are executed by the at least one processor to enable the at least one processor to perform the method according to any one of claims 1 to 4.

10. A non-transitory computer-readable storage medium storing computer instructions, characterized in that: The computer instructions are used to make a computer execute the method according to any one of claims 1-4.

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