Test adapter plate structure from BGA484 packaging to BGA441 packaging chip

Abstract

The invention discloses a BGA484 packaging to BGA441 packaging chip test adapter plate structure, which comprises a first layer adapter plate, a second layer adapter plate and a connector, the second layer adapter plate is connected with the first layer adapter plate through the connector, the first layer adapter plate is connected with a BGA484 test bottom plate, the second layer adapter plate is connected with a BGA441 packaging chip serving as a tested chip, and the tested chip is connected with the BGA441 packaging chip. And the conversion from the BGA484 packaging to the BGA441 packaging is completed. According to the invention, rapid testing of the tested chip after improvement and upgrading is realized, development of the test board can be rapidly realized, and secondary development time is saved; the design and development cost can be greatly reduced, and the development situation of throttling open sources is well met; the design after switching can meet multiple requirements of direct mounting or socket connection of the tested chip; the board-to-board connector between the two adapter boards is flexible in model selection, and the model and specification can be determined according to needs; and reference can be provided for design change of the same type of test board cards.

Description

Technical Field

[0001] The invention belongs to the technical field of chip testing, and relates to a test adapter board structure for a BGA484 packaged chip to a BGA441 packaged chip. Background Art

[0002] In the process of chip improvement and upgrading, changes in the packaging form or the number of packaging pins will inevitably occur, and the resulting chip dimensions and pin definitions will also change accordingly. In the process of chip function testing and reliability testing, a large number of test tooling designs and productions are faced, including function test boards, machine test boards, application verification boards, evaluation boards, ESD boards, flammability boards, etc. Many test tools face the need to change board designs during chip upgrades, which invisibly brings expensive capital and personnel investment, which is a waste of resources for completing chip testing. Instead of redesigning and producing various types of test tools, the present invention proposes a low-cost and high-efficiency adapter board design method, which reduces both time and cost while completing the same board design function.

[0003] The original design of a chip under test uses BGA484 packaging, such as Figure 1 As shown, the size of the chip under test is 23*23mm, the number of the pins of the chip under test is 484, that is, 22 rows and 22 columns, and all kinds of test tools for the chip under test are available. At present, in order to meet the application requirements, the number of pins of the chip under test is appropriately cut from 484 pins to 441 pins. At the same time, the size of the chip under test is also changed, updated to 18*18mm, and the chips under test are mass-produced, with hundreds or thousands of them, and the test of large quantities of chips needs to be completed with the help of a machine test board. The existing machine test board is suitable for the chip under test in the form of BGA484 packaging, and cannot be put into use directly. According to the usual thinking, it is necessary to redesign the production machine test board. The present invention abandons the previous design ideas, takes a different approach, and proposes a feasible adapter board design scheme. Summary of the invention

[0004] (I) Purpose of the invention

[0005] The purpose of the present invention is: based on the fact that the existing machine test board is adapted to the tested chip in the BGA484 packaging form and cannot be directly put into use, the present invention redesigns the production machine test board and proposes a feasible adapter board design solution.

[0006] (II) Technical solution

[0007] In order to solve the above technical problems, the present invention provides a test adapter board structure for BGA484 packaged to BGA441 packaged chip, the test adapter board structure for BGA484 packaged to BGA441 packaged chip, which includes: a first-layer adapter board, a second-layer adapter board and a connector, the second-layer adapter board and the first-layer adapter board are connected by a connector, the first-layer adapter board is connected to the BGA484 test baseboard, and the second-layer adapter board is connected to the BGA441 packaged chip as the chip under test, thereby completing the conversion from BGA484 package to BGA441 package.

[0008] Among them, the first-layer adapter board completes the conversion of all pins of the BGA484 test baseboard from the machine board to the connector, and the second-layer adapter board completes the conversion of all pins of the chip under test from the connector to the BGA441 package. After two steps of conversion, the BGA441 packaged chip under test completely covers the corresponding pins of the original BGA484 packaged chip under test.

[0009] Among them, the bottom surface of the first-layer adapter board is connected to the BGA484 test baseboard, and the top surface of the first-layer adapter board is connected to the second-layer adapter board through a board-to-board connector; the top surface of the first-layer adapter board is connected to four board-to-board connectors distributed around the top surface, and the board-to-board connectors are male sockets, each connector has 80 pins, and the total number of pins that can be transferred on the first-layer adapter board is 320. During the transfer process, the signal line is reduced from 441 pins to 320 pins, and the power and ground pins are merged.

[0010] Among them, the bottom surface of the first-layer adapter board contains 484 solder balls, which are connected to the 484 solder points on the BGA484 test baseboard. The size and spacing of the solder balls are consistent with the chip under test. The arrangement of the solder balls is the same as that of the chip under test, and the connection method to the test baseboard is welding.

[0011] Among them, the top surface of the second-layer adapter board is connected to the BGA441 package chip, and the bottom surface of the second-layer adapter board is connected to the first-layer adapter board through a board-to-board connector.

[0012] Among them, the top surface of the second-layer adapter board contains BGA441 mounting solder joints, the BGA441 chip under test is soldered in the middle of the top surface, and the four circular holes around the BGA441 chip under test are the mounting and fixing holes of the chip under test socket, which are used to install the socket to test the chip under test.

[0013] Among them, the top surface of the second-layer adapter board contains 441 mounting solder joints, which meet the mounting requirements of the chip under test in the BGA441 packaging form.

[0014] Among them, the board-to-board connector on the bottom of the second-layer adapter board is a female socket, each connector has 80 pins, and the second-layer adapter board can transfer a total of 320 pins. The 320 pins reduced by the first-layer adapter board are connected one-to-one to the second-layer adapter board, and then the internal PCB routing design of the second-layer adapter board is used to split the electrical and ground signals, expanding the 320 pins to 441 pins.

[0015] Among them, the board-to-board connector adopts an 80-PIN board-to-board connector, which supports the transfer of 320 PIN pins in total.

[0016] Among them, after the first layer of adapter board is welded, glue reinforcement treatment is applied around it to prevent the insertion and removal of the second layer of adapter board from affecting the firmness of the first layer of adapter board.

[0017] (III) Beneficial effects

[0018] The test adapter structure of the BGA484 package to the BGA441 package chip provided by the above technical solution realizes the rapid test of the chip under test after improvement and upgrading, and the beneficial effects are specifically embodied in:

[0019] (1) The circuit design is simple and reliable;

[0020] (2) The test board can be developed quickly, eliminating the need for secondary development;

[0021] (3) It can significantly reduce the design and development costs, which is very consistent with the development trend of cost-saving and open source;

[0022] (4) The transferred design can meet the multiple requirements of direct mounting of the chip under test or connection through a socket;

[0023] (5) The board-to-board connector between the two adapter boards is flexible in selection, and the model and specifications can be determined according to needs;

[0024] (6) It can provide reference for design changes of the same type of test boards. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 It is a schematic diagram of a BGA484 machine test board in the prior art.

[0026] Figure 2 This is the design plan for the BGA484 package to BGA441 package adapter board.

[0027] Figure 3 This is the BGA484 test baseboard diagram.

[0028] Figure 4 Figures a and b are the top and bottom surfaces of the first-layer adapter board, respectively.

[0029] Figure 5 Figures a and b in the middle are the top and bottom surfaces of the second-layer adapter board, respectively. DETAILED DESCRIPTION

[0030] In order to make the purpose, content and advantages of the present invention more clear, the specific implementation methods of the present invention are further described in detail below in conjunction with the drawings and examples.

[0031] Reference Figure 2 As shown, the test adapter board structure for converting BGA484 package to BGA441 package chip in this embodiment includes a first-layer adapter board, a second-layer adapter board and a connector. The second-layer adapter board and the first-layer adapter board are connected by a connector. The first-layer adapter board is connected to the BGA484 test baseboard, and the second-layer adapter board is connected to the BGA441 package chip, thereby completing the conversion from BGA484 package to BGA441 package.

[0032] Among them, there are 4 connectors, the BGA484 test base is the original machine test board, and for other test fixtures, it can be other test boards. The first layer of adapter board completes the conversion of all pins of the BGA484 test base from the machine board to the connector, and the second layer of adapter board completes the conversion of all pins of the chip under test from the connector to the BGA441 package. After two steps of conversion, the BGA441 packaged chip under test can completely cover the corresponding pins of the original BGA484 packaged chip under test.

[0033] Reference Figure 3 As shown, the BGA484 test baseboard is Figure 1 The DUT_1 marked area in the figure. In the figure, the middle part is the original BGA484 chip under test mounting position, including 484 BGA mounting solder joints, the upper left corner is the A1 foot of the chip under test, 22 rows / columns horizontally and vertically, and the six screw holes around are the installation and fixing holes of the BGA484 chip under test socket. The entire socket covers a square area of ​​45mm*45mm. In order to facilitate the design of the adapter board, the coverage area is now expanded to 60mm*45mm. In the present invention, the area in the figure is mainly targeted, and the changes are minimized as much as possible without changing the structure and function of other areas of the machine test board.

[0034] Reference Figure 4 As shown, the bottom surface of the first-layer adapter board is connected to the BGA484 test base board, and the top surface of the first-layer adapter board is connected to the second-layer adapter board through a board-to-board connector.

[0035] The top surface of the first-layer adapter board is observed from the top-level perspective, and contains four board-to-board connectors distributed around the top surface. The board-to-board connectors on the top surface of the first-layer adapter board are male sockets, and each connector has 80 pins. The number of pins that can be transferred on the first-layer adapter board is a total of 320. The model and number of pins of the connector can be changed according to actual needs. In view of the fact that there are many power and ground pins on the chip under test on the machine test board, the signal line is reduced from 441 pins to 320 pins during the transfer process. Therefore, to ensure the complete transfer of functional signals, the power and ground pins can be merged during the transfer process. For example, 5 groups of power can be transferred using 1 pin of the connector.

[0036] The bottom surface of the first-layer adapter board is observed from the bottom-layer perspective. It can be connected to the BGA484 test base after mirroring. The bottom surface of the first-layer adapter board contains 484 solder balls, which are connected to the 484 solder joints on the test base. The size and spacing of the solder balls are consistent with the chip under test. The arrangement of the solder balls is the same as that of the chip under test, and the connection method to the test base is welding.

[0037] The size of the first-layer adapter board is consistent with the modified area of ​​the BGA484 test base board, which is 60mm*45mm. The PCB design follows the conventional design method without special requirements.

[0038] Reference Figure 5 As shown, the top surface of the second-layer adapter board is connected to the chip under test, and a mounting and fixing hole for the socket of the chip under test is reserved. The bottom surface of the second-layer adapter board is connected to the first-layer adapter board through a board-to-board connector.

[0039] The top surface of the second-layer adapter board is a picture observed from the top-layer perspective, which contains BGA441 mounting solder joints, with the A1 foot in the upper left corner, which can directly weld the chip under test in the middle of the top surface, and the four circular holes around are the mounting and fixing holes of the socket of the chip under test, which can be installed to test the chip under test. The top surface of the second-layer adapter board designed by the present invention contains 441 mounting solder joints, which can meet the mounting of the chip under test in the BGA441 package form, and the size and spacing of the solder balls are consistent with the improved and upgraded chip under test, and the arrangement of the solder balls is the same as the improved and upgraded chip under test, and the connection method with the improved chip under test is welding or connection through a socket.

[0040] The bottom surface of the second-layer adapter board is a picture observed from the bottom perspective. It can be connected to the first-layer adapter board after mirroring, and the connection method is through a board-to-board connector. The present invention designs the board-to-board connector on the bottom surface of the second-layer adapter board as a female socket. The number of pins of each connector is 80, and the number of pins that can be transferred on the second-layer adapter board is a total of 320. The model and number of pins of the connector can be changed according to actual needs. The 320 pins reduced by the first-layer adapter board are connected one-to-one to the second-layer adapter board, and then the 320 pins are expanded to 441 pins through the internal PCB routing design of the second-layer adapter board, where the electrical and ground signals are mainly split. For example, 5 groups of electricity are transferred by 1 pin of the connector on the first-layer adapter board. After passing through the second-layer adapter board, 4 or 5 groups of electricity are expanded from 1 pin.

[0041] The size of the second-layer adapter board is consistent with the modified area of ​​the BGA484 test base board, which is 60mm*45mm. The PCB design follows the conventional design method without special requirements.

[0042] The present invention also involves the following points in the packaging conversion process:

[0043] (1) During the design process of the first-layer adapter board and the second-layer adapter board, the model and number of PIN pins of the board-to-board connector can be changed according to actual needs. The present invention adopts an 80-PIN board-to-board connector to support the connection of a total of 320 PIN pins. This is based on the actual position size on the board, and the rated current of the PIN pins on the connector meets the current sum of the combined pins, and the combined pins are all power or ground, and are pins with the same name.

[0044] (2) The bottom surface of the first-layer adapter board is connected to the BGA484 test base board by welding.

[0045] (3) After the first layer of adapter board is welded, glue reinforcement treatment is applied around it to prevent the insertion and removal of the second layer of adapter board from affecting the firmness of the first layer of adapter board.

[0046] The above is only a preferred embodiment of the present invention. It should be pointed out that for ordinary technicians in this technical field, several improvements and modifications can be made without departing from the technical principles of the present invention. These improvements and modifications should also be regarded as the scope of protection of the present invention.

Claims

1. A test adapter structure for BGA484 packaged to BGA441 packaged chips, characterized in that: include: The first-layer adapter board, the second-layer adapter board and the connector, the second-layer adapter board and the first-layer adapter board are connected by a connector, the first-layer adapter board is connected to the BGA484 test baseboard, and the second-layer adapter board is connected to the BGA441 packaged chip as the chip under test, completing the conversion from BGA484 package to BGA441 package.

2. The test adapter structure of the BGA484 package to the BGA441 package chip as claimed in claim 1, characterized in that: The first-layer adapter board completes the conversion of all pins of the BGA484 test baseboard from the machine board to the connector, and the second-layer adapter board completes the conversion of all pins of the chip under test from the connector to the BGA441 package. After two steps of conversion, the BGA441 packaged chip under test completely covers the corresponding pins of the original BGA484 packaged chip under test.

3. The test adapter structure of the BGA484 package to the BGA441 package chip as claimed in claim 2, characterized in that: The bottom surface of the first-layer adapter board is connected to the BGA484 test baseboard, and the top surface of the first-layer adapter board is connected to the second-layer adapter board through a board-to-board connector; the top surface of the first-layer adapter board is connected to four board-to-board connectors distributed around the top surface. The board-to-board connectors are male sockets, and the number of pins of each connector is 80. The total number of pins that can be transferred on the first-layer adapter board is 320. During the transfer process, the signal line is reduced from 441 pins to 320 pins, and the power and ground pins are merged.

4. The test adapter structure of the BGA484 package to the BGA441 package chip as claimed in claim 3, characterized in that: The bottom surface of the first-layer adapter board contains 484 solder balls, which are connected to the 484 solder points on the BGA484 test base board. The size and spacing of the solder balls are consistent with the chip under test. The arrangement of the solder balls is the same as that of the chip under test, and the connection method to the test base board is welding.

5. The test adapter structure of the BGA484 package to the BGA441 package chip as claimed in claim 4, characterized in that: The top surface of the second-layer adapter board is connected to the BGA441 package chip, and the bottom surface of the second-layer adapter board is connected to the first-layer adapter board through a board-to-board connector.

6. The test adapter structure of the BGA484 package to the BGA441 package chip as claimed in claim 5, characterized in that: The top surface of the second-layer adapter board includes BGA441 mounting solder joints. The BGA441 chip under test is soldered in the middle of the top surface. The four circular holes around the BGA441 chip under test are the mounting and fixing holes of the chip under test socket, which are used to install the socket to test the chip under test.

7. The test adapter structure of the BGA484 package to the BGA441 package chip as claimed in claim 6, characterized in that: The top surface of the second-layer adapter board contains 441 mounting solder joints, which meet the mounting requirements of the chip under test in the BGA441 package format.

8. The test adapter structure of the BGA484 package to the BGA441 package chip as claimed in claim 7, characterized in that: The board-to-board connector on the bottom of the second-layer adapter board is a female socket. Each connector has 80 pins. The second-layer adapter board can transfer a total of 320 pins. The 320 pins reduced by the first-layer adapter board are connected one-to-one to the second-layer adapter board, and then the internal PCB routing design of the second-layer adapter board is used to split the electrical and ground signals, expanding the 320 pins to 441 pins.

9. The test adapter structure of the BGA484 package to the BGA441 package chip as claimed in claim 8, characterized in that: The board-to-board connector uses an 80-pin board-to-board connector, which supports the transfer of 320 PIN pins in total.

10. The test adapter structure for BGA484 packaged to BGA441 packaged chips as claimed in claim 9, characterized in that: After the first layer of adapter board is welded, glue reinforcement treatment is applied around it to prevent the insertion and removal of the second layer of adapter board from affecting the firmness of the first layer of adapter board.

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