Signal Integrity Testing Method, Electronic Device, Storage Medium and Product

Abstract

The present application discloses a signal integrity testing method, an electronic device, a storage medium, and a product, relating to the technical field of computer-aided engineering. The method includes obtaining power density distribution information of a printed circuit board assembly in the electronic device; inputting the power density distribution information into a heat dissipation model of the electronic device to obtain temperature field data of the printed circuit board assembly in the working state of the electronic device; determining material parameters in the printed circuit board assembly based on the temperature field data, and determining quality data of signals transmitted by the electronic device through the printed circuit board based on the material parameters, thereby solving the technical problem of inaccurate signal integrity testing caused by inaccurate temperature field data, and achieving the technical effect of improving the signal integrity testing accuracy of the printed circuit board assembly.

Description

Technical Field

[0001] This application relates to the field of computer-aided engineering technology, and particularly relates to a signal integrity testing method, an electronic device, a storage medium, and a product. Background Art

[0002] In related signal integrity testing solutions, an increase in temperature will cause an increase in signal loss transmitted on a printed circuit board assembly, thereby affecting the signal quality. However, in the working state of an electronic device, heat dissipation technologies such as fans and liquid cooling, as well as heat-generating components such as chips, will also affect the internal temperature of the electronic device, resulting in inaccurate temperature of the printed circuit board assembly in the electronic device, and further resulting in inaccurate signal integrity testing in the printed circuit board assembly. Summary of the Invention

[0003] This application provides a signal integrity testing method, an electronic device, a storage medium, and a product to at least solve the problem of inaccurate signal integrity testing in a printed circuit board assembly in related technologies.

[0004] This application provides a signal integrity testing method, including:

[0005] Obtaining power density distribution information of a printed circuit board assembly in an electronic device;

[0006] Inputting the power density distribution information into a heat dissipation model of the electronic device to obtain temperature field data of the printed circuit board assembly in the working state of the electronic device;

[0007] Based on the temperature field data, determining material parameters in the printed circuit board assembly, and based on the material parameters, determining quality data of signals transmitted by the electronic device through the printed circuit board.

[0008] This application also provides a signal integrity testing device, including:

[0009] A first obtaining unit, configured to obtain power density distribution information of a printed circuit board assembly in an electronic device;

[0010] A second obtaining unit, configured to input the power density distribution information into a heat dissipation model of the electronic device to obtain temperature field data of the printed circuit board assembly in the working state of the electronic device;

[0011] A determining unit, configured to determine material parameters in the printed circuit board assembly based on the temperature field data, and determine quality data of signals transmitted by the electronic device through the printed circuit board based on the material parameters.

[0012] This application also provides an electronic device, including: a memory, configured to store a computer program; a processor, configured to implement the steps of any one of the above signal integrity testing methods when executing the computer program.

[0013] The present application also provides a computer-readable storage medium, in which a computer program is stored. When the computer program is executed by a processor, the steps of any one of the above signal integrity testing methods are implemented.

[0014] The present application also provides a computer program product, including a computer program. When the computer program is executed by a processor, the steps of any one of the above signal integrity testing methods are implemented.

[0015] Through the present application, power density distribution information of a printed circuit board assembly in an electronic device is obtained; the power density distribution information is input into a heat dissipation model of the electronic device to obtain temperature field data of the printed circuit board assembly in the working state of the electronic device; based on the temperature field data, material parameters in the printed circuit board assembly are determined, and based on the material parameters, quality data of signals transmitted by the electronic device through the printed circuit board is determined. That is, by incorporating changes in material parameters of the printed circuit board assembly during evaluation and by including the effects of heat dissipation and other heat-generating components in the working state of the electronic device, the technical problem of inaccurate signal integrity testing caused by inaccurate temperature field data is solved, and the technical effect of improving the signal integrity testing accuracy of the printed circuit board assembly is achieved. Description of the Drawings

[0016] The drawings are used to better understand the solution and do not constitute a limitation to the present disclosure. Among them:

[0017] Figure 1 is a schematic flowchart of a signal integrity testing method provided by an embodiment of the present application;

[0018] Figure 2 is a schematic flowchart of a method for obtaining power density distribution information provided by an embodiment of the present application;

[0019] Figure 3 is a schematic structural diagram of a signal integrity testing device provided by an embodiment of the present application. Detailed Embodiments

[0020] Next, the technical solutions in the embodiments of the present application will be clearly and completely described in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative efforts belong to the protection scope of the present application.

[0021] It should be noted that in the description of this application, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements not only includes those elements, but also includes other elements not expressly listed, or also includes elements inherent to such process, method, article or device. The terms "first", "second", etc. in this application are used to distinguish similar objects, rather than to describe a specific order or sequence.

[0022] With the rapid development of electronic device technology, high-speed signal transmission technology is undergoing rapid iterative upgrades, and the signal integrity problems in printed circuit board assemblies in electronic devices have become increasingly complex. Among them, temperature is an important factor affecting the signal integrity of printed circuit board assemblies. The higher the temperature, the greater the signal loss in the printed circuit board assemblies. Therefore, temperature field data must be introduced in the signal integrity assessment of printed circuit board assemblies in high-power electronic devices.

[0023] If the possible local maximum temperature of the printed circuit board assembly is regarded as the global temperature, it will bring excessive signal transmission design redundancy; if the Joule heat of the high-power printed circuit board assembly itself is ignored, the degree of signal integrity loss may be underestimated. In addition, the heat dissipation technology and other heat-generating components such as chips in the whole machine state of the electronic device will also affect the temperature field data in the printed circuit board assembly.

[0024] The following briefly introduces several solutions of signal integrity test methods in related technologies:

[0025] Solution A proposes a method for accelerating integrated circuit testing using a GPU, which relates to the technical field of electronic devices. It includes seamlessly converting from a design drawing to a simulation environment by importing computer-aided design (CAD) files of integrated circuit design into HFSS and Icepak, constructing simulation models of electromagnetic fields and thermal fields, reducing the cost and time of physical prototype production and testing, using Compute Unified Device Architecture (CUDA) technology to identify the parallelizable parts in the simulation tasks, decomposing and parallelly executing these tasks, accelerating the simulation calculation speed, deploying deep learning algorithms to automatically optimize simulation parameters, avoiding errors caused by human factors, creating a two-way coupled simulation project of electromagnetic fields and thermal fields, and parallelly executing the calculations of the two fields in real time, achieving a tight integration of electromagnetic and thermal effects at the simulation level.

[0026] Solution B proposes a PCB thermal design method, system and terminal based on electro-thermal coupling iterative simulation, belonging to the field of printed circuit board (PCB) thermal design. Through SIwave software, excitation conditions are loaded on the PCB traces for voltage drop IR-drop electrical simulation calculation to obtain the PCB power distribution. The PCB power distribution is imported into the simulation software ICEPAK for PCB board-level thermal simulation to obtain the PCB temperature distribution, completing one joint simulation. Then, the same method is used for multiple iterations, and by setting the iteration convergence condition, the temperature and power differences between the last two simulations are detected. If the current reaches the cut-off condition, the iterative optimization stops; if not, the iteration continues, which can improve the efficiency and accuracy of thermal simulation.

[0027] In the above solutions, there are the following defects:

[0028] Solution A only considers the influence of heat on the material properties related to signal transmission, and ignores the influence of temperature on electrical properties such as resistance value that can change the heat generation power.

[0029] Solution B only considers the heat caused by the DC voltage drop loss of the printed circuit board components, and ignores other heat generation factors such as electromagnetic loss.

[0030] Both Solution A and Solution B lack the complex influence of electronic device heat dissipation technology and other heat generating components, resulting in inaccurate temperature field data.

[0031] To solve the problems existing in the related solutions, the embodiment of the present application provides a signal integrity test method, including: obtaining the power density distribution information of the printed circuit board components in the electronic device; inputting the power density distribution information into the heat dissipation model of the electronic device to obtain the temperature field data of the printed circuit board components in the working state of the electronic device; based on the temperature field data, determining the material parameters in the printed circuit board components, and based on the material parameters, determining the quality data of the signal transmitted by the electronic device through the printed circuit board, that is, by incorporating the changes in the material parameters of the printed circuit board components during evaluation, and by including the heat dissipation of the electronic device in the working state and the influence of other heat generating components, the technical problem of inaccurate signal integrity test caused by inaccurate temperature field data is solved, and the technical effect of improving the signal integrity test accuracy of the printed circuit board components is achieved.

[0032] A signal integrity test method provided by an embodiment of the present disclosure can be applied to fields such as data centers, industrial automation, automotive electronics, and aerospace.

[0033] In order to enable those skilled in the art of this technology to better understand the solution of the present application, the present application will be further described in detail below with reference to the accompanying drawings and specific embodiments.

[0034] Figure 1 Schematic flow chart of a signal integrity testing method provided by an embodiment of the present disclosure.

[0035] As Figure 1 shown, the method includes the following steps:

[0036] Step 101, obtaining power density distribution information of a printed circuit board assembly in an electronic device;

[0037] In some embodiments, the electronic device may be a server, a mobile device, an industrial control device, etc. In this application, the electronic device is taken as an example of a server, and the server includes components such as a chassis, a processor, a storage device, a cooling system, a network interface, and a printed circuit board assembly. Among them, the storage device may include a hard disk drive and a solid-state drive, the cooling system includes a fan, a heat sink, a liquid cooling system, etc., and the network interface may include an Ethernet card, a Fibre Channel card, etc.

[0038] In some embodiments, the printed circuit board assembly is usually installed in the server chassis through a fixing device, and the printed circuit board assembly carries the main computing and storage functions of the server. For example, the central processing unit executes computing tasks and the memory stores data.

[0039] In some embodiments, the DC voltage drop of the printed circuit board assembly can be determined according to the design information of the printed circuit board assembly in the electronic device, and then the power density distribution information of the printed circuit board assembly can be determined according to the DC voltage drop of the printed circuit board assembly.

[0040] In some embodiments, the power density distribution information can be output in the form of a power density distribution data table, or in the form of a power density distribution diagram, and specifically can be output in the form of a heat map or a cloud map to intuitively display the power density distribution of each position on the printed circuit board assembly.

[0041] In some embodiments, the power density distribution information can be exported and saved according to a preset data format. For example, the preset data format can be the.obd data format or the.csv data format.

[0042] Step 102, inputting the power density distribution information into the heat dissipation model of the electronic device to obtain temperature field data of the printed circuit board assembly in the working state of the electronic device;

[0043] In some embodiments, the heat dissipation model of the electronic device may include geometric information such as the electronic device chassis, fan, radiator, air duct design, air flow path, etc., and may also include the material properties of each component in the electronic device, such as the thermal conductivity, fan performance curve, pressure and wind speed of the inlet and outlet, etc., and may also include power information of other heat-generating components such as chips and power modules.

[0044] In some embodiments, the power density value corresponding to each position in the power density distribution information is mapped to the corresponding position in the heat dissipation model of the electronic device. Specifically, the power density distribution information can be mapped to the heat dissipation model of the electronic device through an interface.

[0045] In some embodiments, the whole machine model of the electronic device can be divided into grid cells to ensure that local temperature changes of components can be captured. In the printed circuit board assembly area, finer grid cells can be used to divide the printed circuit board assembly to improve the mapping of power density distribution information.

[0046] In some embodiments, the temperature field data of the printed circuit board assembly of the electronic device in the working state includes temperature data after considering the heat dissipation of the fan, liquid cooling pipe and the heat generation of components such as chips and power modules in the electronic device.

[0047] In some embodiments, by inputting the power density distribution information into the heat dissipation model of the electronic device, a more accurate temperature field distribution of the printed circuit board assembly of the electronic device in the working state can be obtained. This method can not only identify potential hot spot areas, but also improve the reliability of the system.

[0048] Step 103: Based on the temperature field data, determine the material parameters in the printed circuit board assembly, and based on the material parameters, determine the quality data of the signal transmitted by the electronic device through the printed circuit board.

[0049] In some embodiments, the material parameters in the printed circuit board assembly may include the material parameters of the board, the material parameters of the signal line, etc. Among them, the board is the basic material of the printed circuit board, and the signal line is the conductive path for transmitting electrical signals, usually made of copper.

[0050] In some embodiments, the material parameters in the printed circuit board assembly generally refer to the dielectric constant and loss factor of the board and the scattering parameters of the signal line. Among them, the dielectric constant of the board affects the characteristic impedance and signal propagation speed of the signal line, the loss factor of the board reflects the signal loss situation of the board under the action of the electric field, and the scattering S parameters of the signal line are used to characterize the transmission characteristics of the signal line.

[0051] In some embodiments, the change in temperature will affect the material properties of the aforementioned board and signal line, and the change in material properties will affect the signal transmission performance. Here, the transmission performance refers to the degree of signal loss.

[0052] In some embodiments, by considering the dielectric constant and loss factor of the board and the S parameters of the signal line, and making adjustments in combination with the actual temperature field data, the signal integrity of the printed circuit board assembly can be predicted more accurately.

[0053] Through this application, power density distribution information of a printed circuit board assembly in an electronic device is obtained; the power density distribution information is input into a heat dissipation model of the electronic device to obtain temperature field data of the printed circuit board assembly in the working state of the electronic device; based on the temperature field data, material parameters in the printed circuit board assembly are determined, and based on the material parameters, quality data of signals transmitted by the electronic device through the printed circuit board is determined. That is, by incorporating changes in the material parameters of the printed circuit board assembly during evaluation and by including the effects of heat dissipation and other heat-generating components in the working state of the electronic device, the technical problem of inaccurate signal integrity testing caused by inaccurate temperature field data is solved, and the technical effect of improving the signal integrity testing accuracy of the printed circuit board assembly is achieved.

[0054] In some embodiments, as Figure 2 shown, Figure 2 is a schematic flow chart of a method for obtaining power density distribution information provided by an embodiment of this application. Obtaining power density distribution information of a printed circuit board assembly in an electronic device includes:

[0055] Step 201, according to the design information of the printed circuit board assembly in the electronic device, divide the printed circuit board assembly into multiple grid cells;

[0056] In some embodiments, the design information of the printed circuit board assembly includes component information and layout information. Among them, the component information can be obtained from the data manual of the electronic device, and the layout information can be obtained from the printed circuit board layout file.

[0057] In some embodiments, according to the design information of the printed circuit board assembly in the electronic device, high-power-consuming components can be determined first, and based on the high-power-consuming components, the printed circuit board assembly can be divided into multiple grid cells.

[0058] In some embodiments, the printed circuit board assembly can be divided into multiple grid cells according to user requirements, component complexity, and calculation accuracy requirements. Specifically, the sizes of the multiple grid cells can be different. The high-power area can be divided into more refined grid cells. For example, the central processing unit can be divided into more refined grid cells, and the area with lower power consumption can be divided into coarser grid cells to reduce the amount of calculation.

[0059] In some embodiments, a power integrity analysis tool can also be used to divide the printed circuit board assembly into multiple grid cells. The power integrity analysis tool can be the Ansys SIwave tool.

[0060] Step 202, perform a DC voltage drop simulation calculation on the multiple grid cells to obtain the DC voltage drop of each grid cell on the printed circuit board assembly;

[0061] In some embodiments, the DC voltage drop is the DC voltage drop of the printed circuit board assembly in the working state calculated after considering the change in the influence of temperature on electrical parameters such as the resistance of the material.

[0062] In some embodiments, the aforementioned Ansys SIwave tool can be used to perform DC voltage drop simulation calculations on each of the aforementioned grid cells respectively to obtain the DC voltage drop of each grid cell of the power integrity analysis tool. Specifically, the resistance of each conductor segment can be calculated based on the copper foil thickness, trace width, and length, and then the DC voltage drop of each grid cell can be obtained.

[0063] Step 203: Based on the DC voltage drop of each grid cell on the printed circuit board assembly, determine the power density distribution information of the printed circuit board assembly in the electronic device.

[0064] In some embodiments, based on the DC voltage drop of each grid cell on the printed circuit board assembly and the current distribution on the printed circuit board assembly, determine the power of each grid cell on the printed circuit board assembly. Then, based on the power of each grid cell on the printed circuit board assembly and the area of each grid cell, obtain the power density of the printed circuit board assembly. Finally, map the power density of the printed circuit board assembly to the physical coordinates of the printed circuit board assembly to obtain the power density distribution information of the printed circuit board assembly in the electronic device.

[0065] In some embodiments, by determining the power density distribution information of the printed circuit board assembly based on the DC voltage drop of each grid cell on the printed circuit board assembly, high-power consumption areas on the printed circuit board assembly can be intuitively identified, such as the area where the Central Processing Unit (CPU) is located and the area where the Graphics Processing Unit (GPU) is located.

[0066] In some embodiments, determining the power density distribution information of the printed circuit board assembly in the electronic device based on the DC voltage drop of each grid cell on the printed circuit board assembly includes:

[0067] Based on the DC voltage drop of each grid cell and the current corresponding to each grid cell, determine the heating power of each grid cell;

[0068] In some embodiments, the current corresponding to each grid cell can be obtained from the simulation results of the DC voltage drop.

[0069] In some embodiments, multiplying the DC voltage drop of each grid cell by the current corresponding to each grid cell can obtain the heating power of each grid cell.

[0070] Determine the power density distribution information of the printed circuit board assembly in the electronic device based on the heating power of each grid cell.

[0071] In some embodiments, based on the heating power of each grid cell and the area of each grid cell, determine the power density of each grid cell, and map the power density of each grid cell to the physical coordinates of the printed circuit board assembly, so as to obtain the power density distribution information of the printed circuit board assembly in the electronic device.

[0072] In some embodiments, dividing the printed circuit board assembly into a plurality of grid cells according to the design information of the printed circuit board assembly in the electronic device includes:

[0073] According to the design information of the printed circuit board assembly in the electronic device, determine the devices to be simulated and the networks to be simulated in the printed circuit board assembly. The devices to be simulated are physical components installed in the printed circuit board assembly, and the networks to be simulated are electrical connection paths in the printed circuit board assembly;

[0074] In some embodiments, the devices to be simulated may be devices such as high-power devices and key signal devices. Among them, the high-power devices may be processors and power management modules, and the key signal devices may be clock devices.

[0075] In some embodiments, the network to be simulated may be a power network, and the power network may be a collector circuit voltage network and a ground network.

[0076] Based on the devices to be simulated and the networks to be simulated, divide the printed circuit board assembly into a plurality of grid cells.

[0077] In some embodiments, based on the devices to be simulated and the networks to be simulated, divide the printed circuit board assembly into a plurality of grid cells, where the sizes of the grid cells corresponding to each device to be simulated and network to be simulated may be the same or different. For example, taking the device to be simulated as a GPU and the network to be simulated as a power network, the GPU can be divided into grid cells of 0.5mm x 0.5mm, and the power network can be divided into grid cells of 1mm x 1mm.

[0078] In some embodiments, determining the power density distribution information of the printed circuit board assembly in the electronic device based on the heating power of each grid cell includes:

[0079] In response to the heating power of each grid cell meeting the first preset condition, determine the power density distribution information of the printed circuit board assembly in the electronic device based on the heating power of each grid cell.

[0080] In some embodiments, the first preset condition refers to that the voltage drop, current, etc. are all within the allowable range of the design, and the heating power corresponding to each grid cell.

[0081] In some embodiments, when the heat generation power of each grid cell does not meet the first preset condition, design optimization is required, such as adjusting the layout of the printed circuit board assembly, adding decoupling capacitors, optimizing the heat dissipation design, etc., and then re-performing simulation verification.

[0082] In some embodiments, by responding to the heat generation power of each grid cell meeting the first preset condition and determining the power density distribution information of the printed circuit board assembly based on the heat generation power of each grid cell, the power distribution of the printed circuit board assembly can be evaluated more accurately.

[0083] In some embodiments, the design information of the printed circuit board assembly includes at least one of the electrical information and physical information of the printed circuit board assembly. The electrical information includes voltage source information, current source information, and intermediate link information, and the physical information includes stack-up information, trace layout information, and material property information.

[0084] In some embodiments, the design information of the printed circuit board assembly can be a three-dimensional model of board design information such as voltage source information, current source information, intermediate link information, stack-up information, trace layout information, and material property information. Specifically, the voltage source information includes the power network and decoupling capacitors; the current source information can include static current, dynamic current, and current density; the intermediate link information includes signal paths, impedance matching, etc.; the stack-up information includes the number of layers, dielectric thickness, etc.; the trace layout information includes trace width, trace spacing, etc.; the material property information includes copper foil thickness, substrate material, and thermal conductivity, etc.

[0085] Furthermore, the power density distribution information is the heat generation power information of each point in the three-dimensional space of the printed circuit board assembly obtained by converting the calculated DC voltage drop, designed stack-up information, and trace layout on each grid cell of the printed circuit board assembly.

[0086] In some embodiments, the heat dissipation model of the electronic device includes at least one of the following attribute information when the electronic device is in the working state: component space dimension information, heat generating component power information, fan pressure-flow characteristic curve heat dissipation information, and material thermophysical parameter attribute information.

[0087] In some embodiments, the component space dimension information refers to the specific dimensions of each component in the electronic device, such as the CPU, GPU, memory module, hard disk, etc., and the specific layout information of each component in the chassis. The heat generating components refer to components such as chips. The fan pressure-flow characteristic curve is used to describe the relationship between the pressure and flow rate of the fan at different speeds. The material thermophysical parameter attribute information refers to the thermal conductivity, thermal expansion coefficient, etc. of the material, which are used to measure the relationship between the material and temperature.

[0088] In some embodiments, inputting power density distribution information into a heat dissipation model of an electronic device to obtain temperature field data of a printed circuit board assembly in the operating state of the electronic device includes:

[0089] Determining the average heat generation power value within each grid cell corresponding to the power density distribution information;

[0090] In some embodiments, multiple heat generation power values corresponding to each grid cell corresponding to the power density distribution information may be accumulated to obtain the total heat generation power value within each grid cell corresponding to the power density distribution information, and the average heat generation power value within each grid cell corresponding to the power density distribution information is obtained by using the total heat generation power value within each grid cell and the area or volume of each grid cell.

[0091] Determining the power value within the corresponding grid cell in the heat dissipation model of the electronic device as the average heat generation power value within each grid cell;

[0092] In some embodiments, by determining the average heat generation power value within each grid cell as the power value within the corresponding grid cell in the heat dissipation model of the electronic device, the power density distribution information of the printed circuit board assembly can be combined with the overall heat dissipation model of the electronic device, thereby providing accurate data for subsequent thermal simulation and heat dissipation design.

[0093] Based on the power value within the corresponding grid cell in the heat dissipation model of the electronic device, determining the temperature field data of the printed circuit board assembly in the operating state of the electronic device.

[0094] In some embodiments, the temperature field data of the printed circuit board assembly may be saved as a text file in three-dimensional coordinate form.

[0095] In some embodiments, based on the power value within the corresponding grid cell in the heat dissipation model of the electronic device, combining parameters such as power distribution, material properties, and boundary conditions, the temperature field data of the printed circuit board assembly in the operating state of the electronic device is determined by using thermal simulation, where the material properties refer to thermal conductivity, specific heat capacity, and density, etc., and the boundary conditions refer to environmental temperature, air flow velocity, and fan configuration, etc.

[0096] In some embodiments, based on the temperature field data, determining the material parameters in the printed circuit board assembly includes:

[0097] Based on the temperature field data of the printed circuit board assembly, determining the temperature field data of a first preset region;

[0098] In some embodiments, the first preset region may be the entire region of the printed circuit board assembly or a partial region of the printed circuit board assembly, and the partial region refers to the user - concerned region, and the concerned region is determined by the user's needs and may specifically be a high - power region.

[0099] In some embodiments, by determining the temperature field data of the first preset region based on the temperature field data of the printed circuit board assembly, the temperature distribution of the first preset region can be evaluated.

[0100] Establish a two-way coupling simulation model of electromagnetic signal and heat dissipation and determine the grid cells corresponding to the two-way coupling simulation model;

[0101] In some embodiments, the two-way coupling simulation model refers to a simulation model that simultaneously considers electromagnetic signals and heat dissipation.

[0102] In some embodiments, signal transmission can cause local heating, such as wire resistance loss, dielectric loss, etc. The signals here usually refer to high-speed signals. Temperature changes will affect the electrical properties of materials, such as the conductivity of metals decreasing with increasing temperature.

[0103] Assign the temperature field data of the first preset region to the grid cells corresponding to the two-way coupling simulation model to obtain the temperature field data in each grid cell;

[0104] In some embodiments, by assigning the temperature field data of the first preset region to the grid cells corresponding to the two-way coupling simulation model to obtain the temperature field data in each grid cell, the effects of both electromagnetic signals and thermal signals on the temperature in each grid cell of the printed circuit board assembly can be considered simultaneously, and the performance of the printed circuit board assembly under actual working conditions can be reflected more accurately.

[0105] Based on the temperature field data of each grid cell, determine the material parameters in the printed circuit board assembly corresponding to the temperature field data of each grid cell from the preset temperature change mapping relationship.

[0106] Based on the temperature field data of each grid cell, determining the material parameters in the printed circuit board assembly corresponding to the temperature field data of each grid cell from the preset temperature change mapping relationship includes:

[0107] Based on the temperature field data of each grid cell, determine the change value of the material parameters in the printed circuit board assembly corresponding to the temperature field data of each grid cell from the preset temperature change mapping relationship;

[0108] In some embodiments, the preset temperature change mapping relationship can be presented in the form of a chart, such as a three-dimensional graph or a two-dimensional table.

[0109] In some embodiments, the preset temperature change mapping relationship can also be presented in the form of a function expression.

[0110] In some embodiments, the preset temperature change mapping relationship can be obtained through multiple experiments or from research on the relationship between relevant temperature and material changes.

[0111] Determine the material parameters in a printed circuit board assembly based on the change values of the material parameters in the printed circuit board assembly.

[0112] In some embodiments, the change values of the material parameters in the printed circuit board assembly can be put into one-to-one correspondence with the grid cells corresponding to the bidirectional coupling simulation model to obtain the material parameters in the printed circuit board assembly.

[0113] In some embodiments, determining the quality data of signals transmitted by an electronic device through a printed circuit board based on the material parameters includes:

[0114] In response to the material parameters in the printed circuit board assembly meeting the second preset condition, determine the quality data of signals transmitted by the electronic device through the printed circuit board based on the material parameters.

[0115] In some embodiments, the quality data of the transmitted signal may include signal integrity, that is, the loss and distortion conditions of the signal during transmission.

[0116] In some embodiments, the second preset condition refers to the condition of meeting the design requirements, industry standards or previous empirical data. Taking the board material in the printed circuit board assembly as the FR-4 substrate as an example, if the material parameter is the dielectric constant, the dielectric constant should be ensured not to be higher than 4.4.

[0117] In some embodiments, by responding to the material parameters in the printed circuit board assembly meeting the second preset condition and determining the quality data of signals transmitted by the electronic device through the printed circuit board based on these parameters, the design performance of the printed circuit board assembly can be effectively evaluated and optimized to determine whether it is necessary to adjust the materials in the printed circuit board assembly.

[0118] In some embodiments, determining the quality data of signals transmitted by an electronic device through a printed circuit board based on the material parameters includes:

[0119] Based on the material parameters, determine the performance loss of the material parameters, and the performance loss is at least one of insertion loss, return loss or crosstalk loss;

[0120] In some embodiments, insertion loss refers to the reduction of power when a signal is transmitted through a signal line, and insertion loss includes conductor loss and dielectric loss.

[0121] In some embodiments, return loss refers to the signal loss caused by partial signal reflection back to the source end due to impedance mismatch.

[0122] In some embodiments, crosstalk loss refers to the interference caused by the signal on the signal transmission path to the adjacent signal path, and may include near-end crosstalk and far-end crosstalk.

[0123] Determine the quality data of signals transmitted by an electronic device through a printed circuit board based on the performance loss of material parameters.

[0124] In some embodiments, the quality data of the transmitted signal includes that the signal is not interfered by noise, does not distort, does not lose on the transmission path of the printed circuit board assembly, and ensures the accuracy of signal transmission.

[0125] In some embodiments, the evaluation indicators of the quality data of the transmitted signal include the transmission loss of the signal, including the loss of signal lines on the printed circuit board assembly. Specifically, the loss of signal lines depends on the characteristics of the transmission medium, that is, the material of the printed circuit board assembly.

[0126] Through the description of the above embodiments, those skilled in the art can clearly understand that the method according to the above embodiments can be implemented by means of software plus a necessary general hardware platform. Of course, it can also be implemented by hardware, but in many cases, the former is a better implementation method.

[0127] An embodiment of the present application also provides a signal integrity test device 300, Figure 3 which is a schematic structural diagram of a signal integrity test device provided by an embodiment of the present disclosure, as Figure 3 shown, including:

[0128] A first acquisition unit 301, configured to acquire the power density distribution information of a printed circuit board assembly in an electronic device;

[0129] A second acquisition unit 302, configured to input the power density distribution information into a heat dissipation model of the electronic device to acquire the temperature field data of the printed circuit board assembly in the working state of the electronic device;

[0130] A determination unit 303, configured to determine the material parameters in the printed circuit board assembly based on the temperature field data, and determine the quality data of signals transmitted by the electronic device through the printed circuit board based on the material parameters.

[0131] Acquire the power density distribution information of the printed circuit board assembly in the electronic device; input the power density distribution information into the heat dissipation model of the electronic device to acquire the temperature field data of the printed circuit board assembly in the working state of the electronic device; determine the material parameters in the printed circuit board assembly based on the temperature field data, and determine the quality data of signals transmitted by the electronic device through the printed circuit board, that is, by incorporating the changes in the material parameters of the printed circuit board assembly during evaluation, and by including the influence of heat dissipation and other heating components in the working state of the electronic device, the technical problem of inaccurate signal integrity testing caused by inaccurate temperature field data is solved, and the technical effect of improving the signal integrity testing accuracy of the printed circuit board assembly is achieved.

[0132] Further, in a possible implementation manner of the embodiments of the present disclosure, the first obtaining unit 301 is configured to:

[0133] Divide the printed circuit board assembly into a plurality of grid units according to the design information of the printed circuit board assembly in the electronic device;

[0134] Perform a DC voltage drop simulation calculation on the plurality of grid units to obtain the DC voltage drop of each grid unit on the printed circuit board assembly;

[0135] Based on the DC voltage drop of each grid unit on the printed circuit board assembly, determine the power density distribution information of the printed circuit board assembly in the electronic device.

[0136] Further, in a possible implementation manner of the embodiments of the present disclosure, the first obtaining unit 301 is configured to:

[0137] Based on the DC voltage drop of each grid unit and the current corresponding to each grid unit, determine the heat generation power of each grid unit in the electronic device;

[0138] Based on the heat generation power of each grid unit, determine the power density distribution information of the printed circuit board assembly.

[0139] Further, in a possible implementation manner of the embodiments of the present disclosure, the first obtaining unit 301 is configured to:

[0140] According to the design information of the printed circuit board assembly in the electronic device, determine the devices to be simulated and the networks to be simulated in the printed circuit board assembly, where the devices to be simulated are physical components installed in the printed circuit board assembly, and the networks to be simulated are electrical connection paths in the printed circuit board assembly;

[0141] Based on the devices to be simulated and the networks to be simulated, divide the printed circuit board assembly into a plurality of grid units.

[0142] Further, in a possible implementation manner of the embodiments of the present disclosure, the first obtaining unit 301 is configured to:

[0143] In response to the heat generation power of each grid unit meeting a first preset condition, based on the heat generation power of each grid unit, determine the power density distribution information of the printed circuit board assembly in the electronic device.

[0144] Further, in a possible implementation manner of the embodiments of the present disclosure, the design information of the printed circuit board assembly includes at least one of the electrical information and physical information of the printed circuit board assembly. The electrical information includes voltage source information, current source information, and intermediate link information, and the physical information includes stack-up information, trace layout information, and material property information.

[0145] Further, in a possible implementation manner of the embodiments of the present disclosure, the heat dissipation model of the electronic device includes at least one of the following attribute information of the electronic device in the working state: component space dimension information, heating component power information, fan pressure-flow characteristic curve heat dissipation information, and material thermodynamics parameter attribute information.

[0146] Further, in a possible implementation manner of the embodiments of the present disclosure, the second obtaining unit 302 is configured to:

[0147] Determine the average heating power value in each grid cell corresponding to the power density distribution information;

[0148] Determine the power value in the corresponding grid cell in the heat dissipation model of the electronic device as the average heating power value in each grid cell;

[0149] Based on the power value in the corresponding grid cell in the heat dissipation model of the electronic device, determine the temperature field data of the printed circuit board assembly of the electronic device in the working state.

[0150] Further, in a possible implementation manner of the embodiments of the present disclosure, the determining unit 303 is configured to:

[0151] Based on the temperature field data, determine the temperature field data of the first preset area;

[0152] Establish a bidirectional coupling simulation model of electromagnetic signal and heat dissipation and determine the grid cells corresponding to the bidirectional coupling simulation model;

[0153] Allocate the temperature field data of the first preset area to the grid cells corresponding to the bidirectional coupling simulation model to obtain the temperature field data in each grid cell;

[0154] Based on the temperature field data of each grid cell, determine the material parameters in the printed circuit board assembly corresponding to the temperature field data of each grid cell from the preset temperature change mapping relationship.

[0155] Further, in a possible implementation manner of the embodiments of the present disclosure, the determining unit 303 is configured to:

[0156] Based on the temperature field data of each grid cell, determine the change value of the material parameters in the printed circuit board assembly corresponding to the temperature field data of each grid cell from the preset temperature change mapping relationship;

[0157] Based on the change value of the material parameters in the printed circuit board assembly, determine the material parameters in the printed circuit board assembly.

[0158] Further, in a possible implementation manner of the embodiments of the present disclosure, the determining unit 303 is configured to:

[0159] In response to the material parameters in the printed circuit board assembly meeting the second preset condition, based on the material parameters, determine the quality data of the signal transmitted by the electronic device through the printed circuit board.

[0160] Further, in a possible implementation manner of the embodiments of the present disclosure, the determining unit 303 is configured to:

[0161] Based on the material parameters, determine the performance loss of the material parameters, where the performance loss is at least one of insertion loss, return loss, or crosstalk loss;

[0162] Based on the performance loss of the material parameters, determine the quality data of the signal transmitted by the electronic device through the printed circuit board.

[0163] For the description of the features in the corresponding embodiments of the signal integrity test device, reference can be made to the relevant descriptions in the corresponding embodiments of the signal integrity test method, which will not be elaborated here one by one.

[0164] The embodiments of the present application further provide an electronic device, including a memory and a processor. A computer program is stored in the memory, and the processor is configured to run the computer program to execute the steps in any of the above-mentioned embodiments of the signal integrity test method.

[0165] The embodiments of the present application further provide a computer-readable storage medium, in which a computer program is stored. The computer program is configured to execute the steps in any of the above-mentioned embodiments of the signal integrity test method when running.

[0166] In an exemplary embodiment, the above-mentioned computer-readable storage medium may include, but is not limited to: USB flash drive, read-only memory (ROM for short), random access memory (RAM for short), mobile hard disk, magnetic disk, or optical disc, etc., various media that can store computer programs.

[0167] The embodiments of the present application further provide a computer program product. The above-mentioned computer program product includes a computer program, and the computer program realizes the steps in any of the above-mentioned embodiments of the signal integrity test method when executed by a processor.

[0168] The embodiments of the present application further provide another computer program product, including a non-volatile computer-readable storage medium. The non-volatile computer-readable storage medium stores a computer program, and the computer program realizes the steps in any of the above-mentioned embodiments of the signal integrity test method when executed by a processor.

[0169] Those skilled in the art may further realize that the units and algorithm steps of each example described in combination with the embodiments disclosed herein can be implemented by electronic hardware, computer software, or a combination of both. To clearly illustrate the interchangeability of hardware and software, the composition and steps of each example have been generally described according to functions in the above description. Whether these functions are executed in a hardware or software manner depends on the specific application and design constraints of the technical solution. Those skilled in the art can use different methods to implement the described functions for each specific application, but such implementation should not be considered to exceed the scope of this application.

[0170] The above has introduced in detail a signal integrity testing method, an electronic device, a storage medium, and a product provided by this application. Specific examples are used herein to elaborate on the principle and implementation manner of this application. The description of the above embodiments is only used to help understand the method and its core idea of this application. It should be noted that for those of ordinary skill in the art in this technical field, without departing from the principle of this application, several improvements and modifications can be made to this application, and these improvements and modifications also fall within the protection scope of the claims of this application.

Claims

1. A signal integrity testing method, characterized in that Including: Obtaining power density distribution information of a printed circuit board assembly in an electronic device; Inputting the power density distribution information into a heat dissipation model of the electronic device to obtain temperature field data of the printed circuit board assembly of the electronic device in an operating state; Based on the temperature field data, determining temperature field data of a first preset area; Establishing a two-way coupled simulation model of electromagnetic signal and heat dissipation and determining grid cells corresponding to the two-way coupled simulation model; wherein, the two-way coupled simulation model refers to a simulation model that simultaneously considers electromagnetic signals and heat dissipation; Allocating the temperature field data of the first preset area to the grid cells corresponding to the two-way coupled simulation model to obtain temperature field data in each grid cell; Based on the temperature field data of each grid cell, determining material parameters in the printed circuit board assembly corresponding to the temperature field data of each grid cell from a preset temperature change mapping relationship, and based on performance losses of the material parameters, determining quality data of signals transmitted by the electronic device through the printed circuit board.

2. The signal integrity testing method according to claim 1, wherein The obtaining power density distribution information of a printed circuit board assembly in an electronic device includes: According to design information of the printed circuit board assembly in the electronic device, dividing the printed circuit board assembly into a plurality of grid cells; Performing a direct current voltage drop simulation calculation on the plurality of grid cells to obtain a direct current voltage drop of each grid cell on the printed circuit board assembly; Based on the direct current voltage drop of each grid cell on the printed circuit board assembly, determining power density distribution information of the printed circuit board assembly in the electronic device.

3. The signal integrity test method according to claim 2, wherein The determining power density distribution information of the printed circuit board assembly in the electronic device based on the direct current voltage drop of each grid cell on the printed circuit board assembly includes: Based on the direct current voltage drop of each grid cell and the current corresponding to each grid cell, determining the heat generation power of each grid cell; Based on the heat generation power of each grid cell, determining power density distribution information of the printed circuit board assembly in the electronic device.

4. The signal integrity testing method according to claim 3, characterized in that, The dividing the printed circuit board assembly into a plurality of grid cells according to design information of the printed circuit board assembly in the electronic device includes: According to design information of the printed circuit board assembly in the electronic device, determining devices to be simulated and networks to be simulated in the printed circuit board assembly, where the devices to be simulated are physical components installed in the printed circuit board assembly, and the networks to be simulated are electrical connection paths in the printed circuit board assembly; Based on the devices to be simulated and the networks to be simulated, dividing the printed circuit board assembly into a plurality of grid cells.

5. The signal integrity testing method according to claim 3, wherein The determining power density distribution information of the printed circuit board assembly in the electronic device based on the heat generation power of each grid cell includes: In response to the heat generation power of each grid cell meeting a first preset condition, based on the heat generation power of each grid cell, determining power density distribution information of the printed circuit board assembly in the electronic device.

6. The signal integrity testing method according to claim 2, characterized in that The design information of the printed circuit board assembly includes at least one of the electrical information and physical information of the printed circuit board assembly. The electrical information includes voltage source information, current source information, and intermediate link information. The physical information includes stack-up information, trace layout information, and material property information.

7. The signal integrity test method according to claim 1, characterized in that The heat dissipation model of the electronic device includes at least one of the following property information when the electronic device is in the working state: component space dimension information, power information of heat-generating components, heat dissipation information of the fan pressure-flow characteristic curve, and material thermophysical parameter property information.

8. The signal integrity testing method according to claim 7, wherein Inputting the power density distribution information into the heat dissipation model of the electronic device to obtain the temperature field data of the printed circuit board assembly when the electronic device is in the working state includes: Determining the average heat generation power value in each grid unit corresponding to the power density distribution information; Determining the power value in the corresponding grid unit in the heat dissipation model of the electronic device as the average heat generation power value in each grid unit; Based on the power value in the corresponding grid unit in the heat dissipation model of the electronic device, determining the temperature field data of the printed circuit board assembly when the electronic device is in the working state.

9. The signal integrity test method according to claim 1, characterized in that, Based on the temperature field data of each grid unit, determining the material parameters in the printed circuit board assembly corresponding to the temperature field data of each grid unit from the preset temperature change mapping relationship includes: Based on the temperature field data of each grid unit, determining the change value of the material parameters in the printed circuit board assembly corresponding to the temperature field data of each grid unit from the preset temperature change mapping relationship; Based on the change value of the material parameters in the printed circuit board assembly, determining the material parameters in the printed circuit board assembly.

10. The signal integrity testing method according to claim 9, wherein Based on the material parameters, determining the signal quality data of the electronic device transmitted through the printed circuit board includes: In response to the material parameters in the printed circuit board assembly meeting the second preset condition, based on the material parameters, determining the signal quality data of the electronic device transmitted through the printed circuit board.

11. The signal integrity test method according to claim 10, characterized in that, Based on the material parameters, determining the signal quality data of the electronic device transmitted through the printed circuit board includes: Based on the material parameters, determining the performance loss of the material parameters, where the performance loss is at least one of insertion loss, return loss, or crosstalk loss; Based on the performance loss of the material parameters, determining the signal quality data of the electronic device transmitted through the printed circuit board.

12. An electronic device, characterized in that, Including: A memory for storing a computer program; A processor for implementing the steps of the signal integrity test method according to any one of claims 1 to 11 when executing the computer program.

13. A computer-readable storage medium, characterized in that, A computer program is stored in the computer-readable storage medium, wherein the computer program implements the steps of the signal integrity test method according to any one of claims 1 to 11 when executed by a processor.

14. A computer program product, comprising a computer program, characterized in that, The computer program implements the steps of the signal integrity test method according to any one of claims 1 to 11 when executed by a processor.

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