Perfusion method and system for XOA2 packaging non-contact chip

Abstract

The invention discloses a perfusion method and system of an XOA2 packaging non-contact chip, and relates to the technical field of chip perfusion. Comprising the following steps: firstly, selecting a firmware program to be perfused in an upper computer, and issuing the firmware program to an MCU (Microprogrammed Control Unit) singlechip through a USB (Universal Serial Bus) interface; a firmware program is sliced and segmented in the MCU single-chip microcomputer, sliced data are sent to the radio frequency baseband modulation-demodulation circuit through an SPI interface, and data packaging is carried out in the radio frequency baseband modulation-demodulation circuit according to a protocol; after being modulated by ASK, the packaged data are sent to an EMC filter circuit through a radio frequency interface, and an electric signal subjected to filtering adjustment is matched with an XOA2 packaged non-contact chip to be filled through a matching circuit; and after matching, the filling clamp is directly connected with the XOA2 packaging non-contact chip to be filled. According to the invention, possible communication errors in a wireless perfusion state are avoided.

Description

Technical Field

[0001] The present invention relates to the technical field of chip filling, and more particularly to a filling method and system for a XOA2 packaged contactless chip. Background Art

[0002] When the contactless chip is embedded in the IC card in the form of XOA2 package, it can exchange data with the card reader device at close range, realizing the point-to-point communication function of the inductive card reader and the inductive card. The card with the embedded contactless chip can use the card reader terminal to realize contactless payment, electronic ticketing, access control, identity recognition, anti-counterfeiting and other applications.

[0003] The RFID system is based on radio frequency technology running at a frequency of 13.56MHz, which enables the reader and the IC card embedded with a contactless chip to identify each other and exchange data within a short distance, and establish a connection between the two.

[0004] In order to work properly, the firmware program needs to be injected into the contactless chip. Usually, the firmware program can be injected into the die in the wafer through a probe during the CP stage of the chip, or when the contactless chip is packaged into an IC card, the card reader uses the coil antenna to inject software and communicate with the contactless chip in a contactless manner. At this time, the chip needs to be packaged into the IC card first, and the chip is submitted to the user in the form of an IC card.

[0005] In the field of information security applications, there is a need to provide XOA2 packaged contactless chips that have been firmware-infused. At this time, it is necessary to design a dedicated firmware infusion tooling system to infuse firmware into the contactless chip and inspect the infusion results. After inspection, the successfully infused contactless chip will be provided to the user in need for antenna coil integration, IC card packaging and testing.

[0006] Therefore, it is an urgent problem for those skilled in the art to propose a method and system for injecting a non-contact chip in an XOA2 package to solve the difficulties in the prior art. Summary of the invention

[0007] In view of this, the present invention provides a method and system for filling a XOA2 packaged contactless chip, which are used to solve the technical problems existing in the prior art.

[0008] In order to achieve the above object, the present invention provides the following technical solutions:

[0009] A method for filling a XOA2 packaged contactless chip comprises the following steps:

[0010] First, select the firmware program to be injected in the host computer and send it to the MCU through the USB interface;

[0011] The firmware program is sliced ​​and divided in the MCU, and the sliced ​​data is sent to the RF baseband modulation and demodulation circuit through the SPI interface, and the data is packaged in the RF baseband modulation and demodulation circuit according to the protocol;

[0012] The packaged data is modulated by ASK and sent to the EMC filter circuit through the RF interface. The filtered and adjusted electrical signal is matched with the XOA2 packaged contactless chip to be injected through the matching circuit.

[0013] After matching, the non-contact chip of the XOA2 package to be poured is directly connected through the pouring fixture.

[0014] Optionally, it also includes: when receiving the perfusion result, the return signal of the XOA2 packaged contactless chip returns the response feedback signal of the XOA2 packaged contactless chip through the connecting line of the perfusion fixture, and is sent to the RF baseband modulation and demodulation circuit for protocol analysis through the matching circuit and the receiving circuit, and the analyzed feedback signal is sent to the MCU microcontroller through the SPI interface, and returned to the host computer to obtain the result of whether the firmware perfusion is successful.

[0015] Optionally, the MCU uses an STM32 microcontroller as the control core of the injection tooling.

[0016] Optionally, the radio frequency baseband modulation and demodulation circuit adopts the ST25R3911B chip.

[0017] Optionally, the protocol is ISO 14443A protocol.

[0018] Optionally, the perfusion fixture includes: a top plate, a bottom plate, and a spring pin; wherein the spring pin is fixed in the top plate and connected to the matching circuit of the circuit board through a 50Ω coaxial connecting line; the XOA2 packaged contactless chip is placed on the bottom plate, and during the perfusion operation, the top plate is pressed down and connected to the RF1 and RF2 pins of the XOA2 packaged contactless chip through the spring pin, thereby realizing direct signal connection between the XOA2 packaged contactless chip and the perfusion circuit board.

[0019] Optionally, from the antenna driver output pins RFO1 and RFO2 of the ST25R3911B chip, the TX signal is sent to the pogo pins of the potting fixture through an EMC filter circuit.

[0020] Optionally, the receiving circuit receives the RX signal from the potting fixture and guides it back to the receiver input pins RFI1 and RFI2 of the ST25R3911B chip through a capacitive voltage separator after passing through a matching circuit.

[0021] A XOA2 packaged contactless chip filling system, using any of the above XOA2 packaged contactless chip filling methods, including a firmware selection program module, a packaging module, a matching module, and a connection module connected in sequence; wherein,

[0022] Select the firmware program module: First, select the firmware program to be injected in the host computer and send it to the MCU through the USB interface;

[0023] Packaging module: Slice and divide the firmware program in the MCU, send the sliced ​​data to the RF baseband modulation and demodulation circuit through the SPI interface, and encapsulate the data in the RF baseband modulation and demodulation circuit according to the protocol;

[0024] Matching module: The encapsulated data is sent to the EMC filter circuit through the RF interface after ASK modulation. The electric signal after filtering and adjustment is matched with the non-contact chip to be injected with XOA2 package through the matching circuit;

[0025] Connection module: After matching, it is directly connected to the non-contact chip of XOA2 package to be poured through the pouring fixture.

[0026] It can be seen from the above technical solutions that, compared with the prior art, the present invention discloses a method and system for filling a XOA2 packaged contactless chip, which has the following beneficial effects:

[0027] 1) The wireless communication method is replaced by the wired contact communication method, which improves the success rate of firmware program injection, and the parallel injection method improves the production efficiency of firmware injection;

[0028] 2) The use of self-made tooling can meet the special needs of the information security field for batch or sporadic injection of XOA2 contactless chips in a secure environment. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on the provided drawings without paying creative work.

[0030] Figure 1 A flow chart of a method for filling a XOA2 packaged contactless chip provided by the present invention;

[0031] Figure 2 This is a structural diagram of the pouring fixture provided by the present invention.

[0032] Among them, 1-top plate, 2-bottom plate, 3-spring pin, 4-XOA2 package chip strip. DETAILED DESCRIPTION

[0033] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0034] See also Figure 1 As shown, the present invention discloses a method for filling a XOA2 packaged contactless chip, comprising the following steps:

[0035] First, select the firmware program to be injected in the host computer and send it to the MCU through the USB interface;

[0036] The firmware program is sliced ​​and divided in the MCU, and the sliced ​​data is sent to the RF baseband modulation and demodulation circuit through the SPI interface, and the data is packaged in the RF baseband modulation and demodulation circuit according to the protocol;

[0037] The packaged data is modulated by ASK and sent to the EMC filter circuit through the RF interface. The filtered and adjusted electrical signal is matched with the XOA2 packaged contactless chip to be injected through the matching circuit.

[0038] After matching, the non-contact chip of the XOA2 package to be poured is directly connected through the pouring fixture.

[0039] Specifically, the injection fixture is directly connected to the XOA2 packaged contactless chip to avoid failure of injection firmware due to unstable wireless contactless communication.

[0040] Host computer: In the host computer, select the non-contact chip firmware that needs to be configured, count and analyze the results of the infusion, and form a statistical report of the infusion results as a production report.

[0041] Furthermore, it also includes: when receiving the injection result, the return signal of the XOA2 packaged contactless chip returns the response feedback signal of the XOA2 packaged contactless chip through the connecting line of the injection fixture, and is sent to the RF baseband modulation and demodulation circuit for protocol analysis through the matching circuit and the receiving circuit, and the analyzed feedback signal is sent to the MCU microcontroller through the SPI interface, and returned to the host computer to obtain the result of whether the firmware injection is successful.

[0042] Specifically, an LC matching circuit is used to achieve impedance matching between the input signal and the receiving pin of the ST25R3911B chip.

[0043] Furthermore, the MCU uses an STM32 microcontroller as the control core of the injection tooling.

[0044] Specifically, the MCU communicates with the host computer through the USB interface, obtains the injection program firmware data, and feeds back the contactless chip response information data. The MCU communicates with the ST25R3911B chip through the SPI interface, implements data slicing in the MCU, sends the sliced ​​data to the ST25R3911B chip, and reads and analyzes the return information of the received contactless chip.

[0045] Furthermore, the radio frequency baseband modulation and demodulation circuit adopts the ST25R3911B chip.

[0046] Specifically, the data framing / deframing system is highly integrated in the ST25R3911B chip, which can realize ISO 14443A and ISO 14443B reader / writer functions.

[0047] Furthermore, the protocol is the ISO 14443A protocol.

[0048] For further information, see Figure 2 As shown, the injection fixture includes: a top plate 1, a bottom plate 2, and a spring pin 3; wherein the spring pin 3 is fixed in the top plate 1 and connected to the matching circuit of the circuit board through a 50Ω coaxial connecting line; the XOA2 packaged contactless chip is placed on the bottom plate, and during the injection operation, the top plate 1 is pressed down and connected to the RF1 and RF2 pins of the XOA2 packaged contactless chip through the spring pin 3, thereby realizing a direct signal connection between the XOA2 packaged contactless chip and the injection circuit board.

[0049] Specifically, the injection fixture is pressed onto the RF pins of the XOA2 packaged contactless chip on the XOA2 packaged chip strip 4 through the spring pins 3 to achieve direct contact, and transmit the attenuated RF signal to the XOA2 packaged contactless chip.

[0050] Further, from the antenna driver output pins RFO1 and RFO2 of the ST25R3911B chip, the TX signal is sent to the spring pin 3 of the potting fixture through the EMC filter circuit.

[0051] Furthermore, the receiving circuit receives the RX signal of the potting fixture and guides it back to the receiver input pins RFI1 and RFI2 of the ST25R3911B chip through the capacitor voltage separator after passing through the matching circuit.

[0052] and Figure 1 Corresponding to the method described above, the present invention also provides a perfusion system for XOA2 packaged non-contact chips, for Figure 1The specific implementation of the method includes selecting a firmware program module, a packaging module, a matching module, and a connection module connected in sequence; wherein,

[0053] Select the firmware program module: First, select the firmware program to be injected in the host computer and send it to the MCU through the USB interface;

[0054] Packaging module: Slice and divide the firmware program in the MCU, send the sliced ​​data to the RF baseband modulation and demodulation circuit through the SPI interface, and encapsulate the data in the RF baseband modulation and demodulation circuit according to the protocol;

[0055] Matching module: The encapsulated data is sent to the EMC filter circuit through the RF interface after ASK modulation. The electric signal after filtering and adjustment is matched with the non-contact chip to be injected with XOA2 package through the matching circuit;

[0056] Connection module: After matching, it is directly connected to the non-contact chip of XOA2 package to be poured through the pouring fixture.

[0057] The various embodiments in this specification are described in a progressive manner, and each embodiment focuses on the differences from other embodiments. The same or similar parts between the various embodiments can be referenced to each other.

[0058] The above description of the disclosed embodiments enables one skilled in the art to implement or use the present invention. Various modifications to these embodiments will be apparent to one skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present invention. Therefore, the present invention will not be limited to the embodiments shown herein, but rather to the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A method for filling a XOA2 packaged contactless chip, characterized in that: The following steps are involved: First, select the firmware program to be injected in the host computer and send it to the MCU through the USB interface; The firmware program is sliced ​​and divided in the MCU, and the sliced ​​data is sent to the RF baseband modulation and demodulation circuit through the SPI interface, and the data is packaged in the RF baseband modulation and demodulation circuit according to the protocol; The packaged data is modulated by ASK and sent to the EMC filter circuit through the RF interface. The filtered and adjusted electrical signal is matched with the XOA2 packaged contactless chip to be injected through the matching circuit. After matching, the non-contact chip of the XOA2 package to be poured is directly connected through the pouring fixture.

2. A method for filling a XOA2 packaged contactless chip according to claim 1, characterized in that: Also includes: When receiving the injection result, the return signal of the XOA2 packaged contactless chip returns the response feedback signal of the XOA2 packaged contactless chip through the connecting line of the injection fixture, and is sent to the RF baseband modulation and demodulation circuit for protocol analysis through the matching circuit and the receiving circuit. The analyzed feedback signal is sent to the MCU microcontroller through the SPI interface and returned to the host computer to obtain the result of whether the firmware injection is successful.

3. The method for filling a XOA2 packaged contactless chip according to claim 1, characterized in that: The MCU uses STM32 microcontroller as the control core of the perfusion tooling.

4. The method for filling a XOA2 packaged contactless chip according to claim 1, characterized in that: The RF baseband modulation and demodulation circuit uses the ST25R3911B chip.

5. The method for filling a XOA2 packaged contactless chip according to claim 1, characterized in that: The protocol is ISO 14443A.

6. A method for filling a XOA2 packaged contactless chip according to claim 1, characterized in that: The injection fixture includes: a top plate, a bottom plate, and a spring pin; the spring pin is fixed in the top plate and connected to the matching circuit of the circuit board through a 50Ω coaxial connecting line; the XOA2 packaged contactless chip is placed on the bottom plate. During the injection, the top plate is pressed down and connected to the RF1 and RF2 pins of the XOA2 packaged contactless chip through the spring pin, thereby realizing direct signal connection between the XOA2 packaged contactless chip and the injection circuit board.

7. A method for filling a XOA2 packaged contactless chip according to claim 4 or 6, characterized in that: From the antenna driver output pins RFO1 and RFO2 of the ST25R3911B chip, the TX signal is sent to the pogo pins of the potting fixture through the EMC filtering circuit.

8. A method for filling a XOA2 packaged contactless chip according to claim 2 or 4, characterized in that: The receiving circuit receives the RX signal from the potting fixture, passes through the matching circuit, and then guides it back to the receiver input pins RFI1 and RFI2 of the ST25R3911B chip through the capacitor voltage separator.

9. A perfusion system for XOA2 packaged contactless chips, characterized in that A method for filling a XOA2 packaged contactless chip according to any one of claims 1 to 8, comprising a selection firmware program module, a packaging module, a matching module, and a connection module connected in sequence; wherein: Select the firmware program module: First, select the firmware program to be injected in the host computer and send it to the MCU through the USB interface; Packaging module: Slice and divide the firmware program in the MCU, send the sliced ​​data to the RF baseband modulation and demodulation circuit through the SPI interface, and encapsulate the data in the RF baseband modulation and demodulation circuit according to the protocol; Matching module: The encapsulated data is sent to the EMC filter circuit through the RF interface after ASK modulation. The electric signal after filtering and adjustment is matched with the non-contact chip to be injected with XOA2 package through the matching circuit; Connection module: After matching, it is directly connected to the non-contact chip of XOA2 package to be poured through the pouring fixture.

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