Etching equipment production planning method, equipment, medium and product

Abstract

The embodiment of the invention relates to the technical field of semiconductor processing, and discloses an etching equipment production planning method, equipment, a medium and a product. The method comprises the following steps: extracting scheduling characteristics of etching equipment; dividing the etching equipment according to the scheduling characteristics to obtain the machine type of the etching equipment; the machine table types comprise a serial machine table, a parallel machine table and a serial-parallel mixed machine table; and according to the machine type, data of the etching equipment are unified, a corresponding mathematical model is constructed, and a production planning scheme is obtained. Through extraction and classification of etching equipment scheduling characteristics, scheduling strategies for different equipment types are constructed, and through data unification and mathematical model optimization, the production efficiency is improved. The problem of insufficient production scheduling of etching equipment can be at least solved.

Description

Technical Field

[0001] The present application relates to the field of semiconductor processing technology, and in particular to an etching equipment production planning method, equipment, medium and product. Background Art

[0002] Etching is a crucial process step in the semiconductor manufacturing process and is widely used in the fields of microelectronic integrated circuit (IC) manufacturing and micro-nano manufacturing. The main function of the etching process is to selectively remove unwanted materials from the surface of the silicon wafer by chemical or physical methods to accurately replicate the mask pattern on the coated silicon wafer. Usually, the etching process is closely combined with the photolithography process, where photolithography is used for patterning and etching removes materials other than the mask by corrosion or etching. In the semiconductor manufacturing process, the wafer needs to go through multiple etching steps, including but not limited to pre-cleaning, plate alignment, etching, post-cleaning and mask removal. In these steps, due to the rapid replacement of chip products and their wide variety, different products have different requirements for etching processes, resulting in a variety of types and configurations of etching equipment. To cope with this situation, semiconductor manufacturers usually use a variety of types of etching equipment and make different process settings according to product characteristics in actual production.

[0003] At present, the scheduling management of etching equipment mainly relies on the real-time dispatch (RTD) system. This system generates production instructions based on real-time production data based on pre-set rules. Although the RTD system can adapt to production needs to a certain extent, it mainly relies on established rules and does not fully consider the dynamic scheduling characteristics of the equipment, which can easily lead to problems such as low equipment utilization and waste of production capacity. In addition, with the increase in process complexity and the diversification of production needs, traditional scheduling methods are difficult to fully respond to the needs of different types of etching equipment, and lack comprehensive consideration of equipment characteristics and process characteristics. Summary of the invention

[0004] One purpose of the present application is to provide an etching equipment production planning method, equipment, medium and product, at least to solve the problem of insufficient etching equipment production scheduling.

[0005] To achieve the above objectives, some embodiments of the present application provide the following aspects:

[0006] In the first aspect, some embodiments of the present application also provide a method for production planning of etching equipment, comprising extracting scheduling characteristics of etching equipment; dividing the etching equipment according to the scheduling characteristics to obtain the machine type of the etching equipment; the machine type includes serial machines, parallel machines and serial-parallel mixed machines; according to the machine type, unifying the data of the etching equipment and constructing a corresponding mathematical model to obtain a production planning scheme.

[0007] In a second aspect, some embodiments of the present application further provide an electronic device, comprising: one or more processors; and a memory storing computer program instructions, wherein the computer program instructions, when executed, cause the processor to perform the steps of the method described above.

[0008] In a third aspect, some embodiments of the present application further provide a computer-readable medium having computer program instructions stored thereon, wherein the computer program instructions can be executed by a processor to implement the method as described above.

[0009] In a fourth aspect, some embodiments of the present application further provide a computer program product, comprising a computer program / instruction, which implements the steps of the method described above when executed by a processor.

[0010] Compared with the related art, the solution provided in the embodiment of the present application extracts and classifies the scheduling features of etching equipment, constructs scheduling strategies for different equipment types, and achieves improved production efficiency through data unification and mathematical model optimization. The present application not only provides significant improvements in equipment utilization and production efficiency, but also reduces production costs and improves the response speed and flexibility of the overall production system by optimizing scheduling management. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] One or more embodiments are exemplarily described by pictures in the corresponding drawings, and these exemplified descriptions do not constitute limitations on the embodiments. Elements with the same reference numerals in the drawings represent similar elements, and unless otherwise stated, the figures in the drawings do not constitute proportional limitations.

[0012] Figure 1 A schematic diagram of a process flow of an etching equipment production planning method provided according to an embodiment of the present application;

[0013] Figure 2 A schematic diagram of a workflow of a serial machine provided according to an embodiment of the present application;

[0014] Figure 3 A schematic diagram of a workflow of a parallel machine provided according to an embodiment of the present application;

[0015] Figure 4 A schematic diagram of a workflow of a hybrid machine provided according to an embodiment of the present application;

[0016] Figure 5 A schematic diagram of a workflow of another hybrid machine provided according to an embodiment of the present application;

[0017] Figure 6 A schematic diagram of a process flow of an etching equipment production planning method provided according to an embodiment of the present application;

[0018] Figure 7 The present invention is a schematic diagram of the structure of an electronic device provided according to an embodiment of the present application. DETAILED DESCRIPTION

[0019] In order to make the purpose, technical solution and advantages of the embodiments of the present application clearer, the technical solution in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0020] The following terms are used in this article.

[0021] 1) Etch: etching process;

[0022] 2) Chamber: chamber, processing unit in etching equipment;

[0023] 3) Buffer: The unit where the etching equipment stores the lot;

[0024] 4) Wafer: wafer;

[0025] 5) Lot: The unit where wafers are stored;

[0026] 6) PPID: It indicates the configuration parameters of the processing order and serial-parallel relationship of each chamber in the etching equipment;

[0027] 7) Wafer flow: The flow direction of wafer in each chamber when it is processed in the etching equipment;

[0028] 8)MES: manufacturing execution system.

[0029] First embodiment

[0030] The first embodiment of the present application relates to a method for production planning of etching equipment. Figure 1As shown, the method may include the following steps:

[0031] S101, extracting the scheduling features of the etching equipment.

[0032] By analyzing the operating behavior of etching equipment in the actual production process, its scheduling characteristics are extracted. These scheduling characteristics may include the equipment's processing speed, processing capacity, processing sequence, equipment occupancy time, chamber configuration, etc. These characteristics are the basis for formulating effective production plans; extracting and analyzing scheduling characteristics can provide a deeper understanding of the working characteristics of each etching equipment; after extracting scheduling characteristics, accurate scheduling strategies can be formulated for different types of equipment, thereby avoiding waste of resources, reducing equipment idle time, and improving the utilization rate of the overall production line; the extraction of scheduling characteristics provides the necessary basic information for equipment classification and data unification, ensuring that the implementation of subsequent steps has a practical basis.

[0033] S102, classifying the etching equipment according to the scheduling characteristics to obtain the machine type of the etching equipment; the machine type includes a serial machine, a parallel machine and a serial-parallel hybrid machine.

[0034] Through classification, we can identify which equipment is suitable for processing which type of production tasks. Serial machines are suitable for sequential processing tasks, parallel machines are suitable for processing multiple tasks at the same time, and serial-parallel hybrid machines are suitable for complex process flows. By allocating tasks reasonably, we can maximize the utilization of equipment. Through classification management, similar types of tasks can be concentrated on the corresponding equipment, reducing the time loss and resource waste caused by equipment switching, thereby improving production efficiency; by clarifying the equipment type, different types of equipment can be flexibly scheduled in the production plan to adapt to different production needs and emergencies, and improve the flexibility and response speed of the production system.

[0035] S103, unifying the data of the etching equipment and constructing a corresponding mathematical model according to the machine type to obtain a production planning solution.

[0036] By unifying the data, we can ensure that the data of different types of etching equipment can be seamlessly connected in the same system, avoiding compatibility issues caused by inconsistent data formats. This unified data processing method improves the data processing efficiency of the scheduling system; by constructing a mathematical model, we can formulate specific production planning plans for different types of etching equipment to ensure that the equipment operates in the optimal state, which not only maximizes capacity utilization, but also ensures the stability of product quality; the constructed mathematical model can handle complex production scenarios, including the collaborative work of different types of equipment. Through optimized calculations, it can achieve accurate scheduling of production tasks and support large-scale, complex and changeable production needs; the application of mathematical models can provide rigorous theoretical proof for production planning, ensuring that the scheduling plan is optimal under certain conditions. This scientific planning method greatly reduces the risk of relying on experience-based scheduling and improves the controllability and predictability of the entire production process.

[0037] It is not difficult to find that compared with the related art, in the solution provided by the embodiment of the present application, determining the production capacity and scheduling characteristics of different equipment helps to more accurately carry out production planning and demand forecasting. By allocating resources to the most needed processes, it can ensure the efficient operation of key processes and avoid bottlenecks; it helps to deepen the operator's understanding of the equipment and reasonably schedule equipment that is complex to operate or requires high skills, which can ensure that operators have enough time to operate and maintain, thereby improving work efficiency; and adopting an optimized scheduling strategy for a specific type of etching equipment can improve the efficiency and output of that type of etching process.

[0038] Second embodiment

[0039] The second embodiment of the present application relates to a method for production planning of etching equipment. The second implementation is an improvement made on the basis of the first embodiment, and the specific improvements are:

[0040] The scheduling features of the serial machine include: the chambers of the machine are connected in series, and one lot is allowed to be processed at the same time; each chamber has two wafers being processed, and there is no limit on the number of buffers; each wafer must be processed by all chambers in all PPIDs in turn; after one lot is processed, the next lot must wait until all chambers are released before it can continue processing.

[0041] like Figure 2As shown, the serial machine includes multiple chambers configured in series, chamber_01, chamber_02, chamber_03 and chamber_04. These chambers are arranged in a fixed order, and the output of each chamber is connected to the input of the next chamber, so that the wafer can pass through each chamber in sequence during the entire etching process.

[0042] During the operation of a serial machine, only one lot is allowed to be processed on the machine at the same time. A lot (such as LP_01) starts from chamber_01, passes through chamber_02, chamber_03, and finally chamber_04. After processing the wafer in the current lot, each chamber will pass it to the next chamber, thus ensuring that no two lots will use resources alternately in the same time period in the entire production line. This scheduling strategy can effectively avoid interference between different lots and ensure that each lot can be processed in the predetermined process sequence.

[0043] Two wafers can be processed in each chamber at the same time (configurable according to actual conditions). This setting improves the output efficiency of each processing cycle, but does not introduce an additional buffer area to temporarily store the wafers to be processed. Specifically, when chamber_01 processes two wafers, these wafers are immediately transferred to chamber_02 once the current processing steps are completed, without stopping or temporarily storing them at any intermediate location.

[0044] After all wafers in a lot (e.g. LP_01) have completed processing from chamber_01 to chamber_04, the chamber resources on the entire machine can be released. Only then is the next lot (e.g. LP_02) allowed to enter chamber_01 to start processing. This scheduling strategy ensures a clear distinction between lots, prevents cross contamination between lots, and maintains the continuity and controllability of the production process.

[0045] The scheduling features of the parallel machine include: each chamber of the machine is independent of each other, and multiple lots are allowed to be processed simultaneously in each chamber at the same time; each chamber has a wafer being processed, and there is no limit on the number of buffers; each wafer enters a chamber for processing and is completed; after the chamber occupied by a lot is released, the next lot enters the chamber for processing.

[0046] like Figure 3As shown in the figure, the parallel machine consists of four chambers, namely chamber_01, chamber_02, chamber_03 and chamber_04, which are all connected to a load port. Since there is no direct connection or dependency between the chambers, each chamber can execute its process independently. This allows multiple lots to be processed in different chambers at the same time, effectively improving the overall processing capacity of the production line.

[0047] In the operation of parallel machines, each chamber can only process one wafer at any time. Each chamber does not have a buffer area to temporarily store the wafers to be processed, which simplifies the process management process. Each wafer only needs to enter one chamber and go through one processing process to complete. The wafer enters any idle chamber from the load port, such as chamber_01, and is directly output after the processing is completed.

[0048] When a wafer of a certain lot is processed in a certain chamber, the chamber is released, allowing the wafer of the next lot to enter and start processing immediately. This scheduling method of parallel machines does not need to wait for all chambers to be released or a specific chamber to be released before starting the processing of the next lot. As long as there is a free chamber, a new lot can enter at any time.

[0049] To ensure fair scheduling, parallel machines follow the "first come, first served" rule. When a chamber is released, the wafers in the lot that arrives at the chamber first have priority for processing. For example, when chamber_02 is released, if the wafers in lot_02 arrive at the chamber first, they will have priority to enter chamber_02 for processing. This scheduling rule not only ensures the fairness of the production process, but also optimizes the overall operating efficiency of the machine.

[0050] It is not difficult to find that in the embodiment of the present application, by applying the production planning method of the etching equipment to the serial machine and the parallel machine, the advantages of different machine types are complementary. The serial machine ensures the consistency of the process and the quality of the product, and the parallel machine improves the production efficiency and equipment utilization. The coordinated use of the two types of machines can be flexibly adjusted according to production needs, meet the process requirements of different products, and optimize the overall production line. This method not only improves production efficiency, but also ensures the high quality of the product, and provides an effective solution for the semiconductor manufacturing industry.

[0051] Third embodiment

[0052] The third embodiment of the present application relates to a method for production planning of etching equipment. The third implementation mode is an improvement made on the basis of the first embodiment, and the specific improvement is:

[0053] The serial-parallel hybrid machine includes a parallel-first then serial machine and a serial-first then parallel machine. The scheduling feature of the parallel-first then serial machine includes that multiple lots are processed in different chambers at the same time, and after the multiple chambers are processed in parallel, they are processed in the serial chamber once; the scheduling feature of the serial-first then parallel machine includes that the lot is first processed in the serial chamber once, and then processed in parallel in different chambers.

[0054] like Figure 4 As shown in the figure, the layout of the parallel-first and serial-later type machine includes four chambers (chamber_01, chamber_02, chamber_03 and chamber_04), two buffers (Buffer01 and Buffer02), and four load ports (LP_01, LP_02, LP_03 and LP_04). In the first half of the system, the chambers are arranged in pairs and run in parallel, forming two parallel processing sections: chamber_01 and chamber_02 constitute one parallel section, and chamber_03 and chamber_04 constitute another parallel section.

[0055] In the parallel segment, each chamber can independently process wafers from different load ports. For example, chamber_01 and chamber_02 can process wafers from LP_01 and LP_02 respectively, while chamber_03 and chamber_04 can process wafers from LP_03 and LP_04 respectively. This parallel configuration improves the processing capacity of the equipment and allows multiple wafers to be processed in different chambers at the same time.

[0056] After each parallel section, there is a buffer area for storing wafers that have completed the first stage of processing. Buffer01 and Buffer02 are connected to the two parallel processing sections mentioned above. When the wafer is processed in the previous chamber, it will be transferred to the corresponding buffer for temporary storage. The existence of the buffer not only plays a temporary storage role, but also can adjust the production rhythm to a certain extent and avoid idleness or blockage of the downstream chamber.

[0057] For example, when chamber_01 or chamber_02 completes processing of a wafer, the wafer will be transferred to Buffer01 for temporary storage. Similarly, when chamber_03 or chamber_04 completes processing, the wafer will be transferred to Buffer02. The setting of the buffer area allows the downstream processing section to receive the processed wafers in a more orderly manner, thereby optimizing the operating efficiency of the overall equipment.

[0058] After the processing of the parallel segment is completed, the serial processing stage begins. At this time, the wafers in the buffer will be sent to the serial chambers in order for further processing. In this embodiment, the operation rule of the serial segment is: each wafer needs to be processed by all chambers in turn to complete all the predetermined process flows. This means that all wafers in a lot must pass through all chambers of the serial segment in turn, and only when all chambers are in an idle state can the next lot start processing.

[0059] For example, when the wafer in Buffer01 is sent to chamber_02 for processing, the wafer in Buffer02 is sent to chamber_03 for processing at the same time, until all chambers complete their corresponding process flows. This method ensures that each wafer can receive consistent processing before leaving, ensuring uniform processing quality.

[0060] Scheduling rules are very important in this production planning of parallel-first and serial-later. Wafers are scheduled according to the first-in-first-out principle to ensure that each wafer can be processed according to the predetermined process flow. At the same time, an intelligent scheduling algorithm is also used to adjust the processing order and the timing of introducing lots in real time according to the current status of each chamber and buffer. This intelligent scheduling can not only optimize the utilization of chambers, but also minimize the waiting time between lots, thereby improving the throughput of the entire production line.

[0061] like Figure 5As shown in the figure, the layout of the serial-before-parallel machine includes four chambers (chamber_01, chamber_02, chamber_03 and chamber_04), two buffer areas (Buffer01 and Buffer02) and four load ports (LP_01, LP_02, LP_03 and LP_04). In the first half of the system, the chambers are connected in series to form a serial processing section. In the serial section, each wafer is processed in multiple chambers in turn, ensuring that each wafer undergoes a completely consistent process flow.

[0062] For example, chamber_01, chamber_03, and chamber_04 form a serial processing section. After entering the system, the wafer first passes through chamber_01 for the first stage of processing, and then enters chamber_03 and chamber_04 for further processing. At this time, since the chambers are connected in series, each wafer must pass through each chamber in turn, which can ensure the consistency of each wafer processing and improve the uniformity and quality of the product.

[0063] After the serial processing section, the wafer is transferred to the buffer area. Buffer01 and Buffer02 are connected to different chambers to temporarily store the wafers that have completed serial processing. The buffer area plays a role in balancing and adjusting the production rhythm, so that the subsequent parallel processing section can receive the wafer in a more optimized order and rhythm, preventing the occurrence of production bottlenecks.

[0064] When chamber_01 completes processing of the wafer, the wafer will be transferred to Buffer01 for temporary storage, and then further processed by chamber_03 before entering Buffer02. The existence of the buffer area ensures efficient connection between chambers and avoids the situation where the chambers may idle or jam without buffers.

[0065] After completing serial processing and buffer storage, the wafer enters chamber_02 and chamber_04 in the parallel processing section. In the parallel section, each chamber can independently process the wafer from the buffer, allowing multiple lots to be processed in different chambers at the same time, improving the parallelism and throughput of the overall production.

[0066] For example, the wafers in Buffer01 can be sent to chamber_02 for processing, while the wafers in Buffer02 can be sent to chamber_03. This parallel processing method greatly improves the flexibility of the system, allowing different batches of wafers to be sent to different chambers for processing as needed, thereby effectively reducing waiting time and processing cycle.

[0067] In the layout of serial first and parallel later, the scheduling rules are also crucial. Usually, the scheduling is carried out according to the first-in-first-out principle, that is, the wafer that arrives at the buffer area first has priority to enter the chamber for processing. At the same time, in order to further optimize the utilization of the equipment, an intelligent scheduling algorithm can be used to dynamically adjust the processing order according to the idle state of the chamber and the inventory in the buffer. This intelligent scheduling strategy can minimize the idle time of the chamber and improve the overall equipment utilization efficiency.

[0068] It should be noted that the third embodiment of the present application may also be an improvement based on the second embodiment.

[0069] It is not difficult to find that in the embodiment of the present application, a production planning method for a serial-parallel hybrid machine is proposed by combining serial and parallel scheduling. This method can fully utilize the high efficiency of parallel processing, ensure product quality consistency through serial processing, and optimize the resource utilization and scheduling flexibility of the production line through the setting of the buffer area and the intelligent scheduling strategy, achieving the comprehensive goals of improving production efficiency, ensuring product quality and optimizing resource utilization.

[0070] Fourth embodiment

[0071] The fourth embodiment of the present application relates to a method for production planning of etching equipment. The fourth embodiment is an improvement made on the basis of the first embodiment, and the specific improvements are:

[0072] Unifying the data of the etching equipment includes: unifying the PPID fields of the etching equipment, and determining the sequence of processes and the serial-parallel relationship of chambers.

[0073] The data models of different types of etching equipment are roughly the same. The difference mainly lies in describing the chamber flow of the wafer in the etching equipment. This feature is represented by the PPID field. By unifying the PPID field, the scheduling of multiple etching equipment can be unified at the data level. Silicon wafers go through multiple processes in the etching equipment, and each process is carried out sequentially. If a process has multiple chambers to process, the process is called multi-chamber parallel. PPID must represent two pieces of information: the order of the processes; the serial and parallel relationship of the chambers. Semicolons are used to represent serial, that is, the front-to-back order relationship, and commas are used to represent the parallel relationship of chambers, such as Figure 6 As shown:

[0074] The production mode of the serial machine is to process through multiple chambers in sequence. There is a sequential relationship between each chamber, that is, all silicon wafers pass through each chamber in turn. This mode ensures that each wafer can receive consistent treatment and is suitable for process flows with high requirements for processing accuracy and quality. Wafer flow path: A->B->C->D. In this mode, the wafer is processed in sequence through Chambers A, B, C, and D, and the PPID is expressed as A; B; C; D. The semicolon ";" is used here to indicate the serial processing order. The order separated by semicolons indicates the order of processing of each chamber, ensuring the consistency of wafer flow and the controllability of the process.

[0075] The parallel machine allows multiple chambers to process different wafers at the same time, thereby improving equipment utilization and production efficiency. It is suitable for products with short production cycles and large batches. Wafer flow path: (A, B, C, D) In ​​this mode, wafers can enter Chambers A, B, C and D for processing at the same time. Each Chamber runs independently without interfering with each other. PPID represents A, B, C, D and uses a comma "," to indicate a parallel relationship. This representation method shows that each Chamber can be processed at the same time without a fixed order. This design improves the parallelism and flexibility of the equipment.

[0076] The serial-parallel hybrid machine combines the advantages of both serial and parallel modes, and is suitable for complex processing flows that require multi-stage different processes. The mode of serial first and then parallel or parallel first and then serial can be flexibly adjusted according to actual needs. Wafer flow path: A->(1,2)->(3,4)->D. In this mode, the wafer first passes through Chamber A, then enters the parallel section, is processed simultaneously in Chamber 1 and 2, then enters the next serial section, is processed in parallel in Chamber 3 and 4, and finally enters Chamber D to complete the final processing. PPID stands for A; 1,2; 3,4; D. This PPID representation method combines semicolons and commas, with semicolons representing serial order and commas representing parallel relationships. This design allows production planning to simultaneously utilize the accuracy of serial and the efficiency of parallel, thereby meeting the consistency requirements of production efficiency and quality for different process flows.

[0077] Constructing the corresponding mathematical model includes: determining the decision variables of the etching equipment at the decision level; for the serial machine, determining the decision variables at the lot level and the equipment level; for the parallel machine, determining the decision variables at the wafer level and the chamber level.

[0078] Different etching equipment has different structures, and the factors considered when scheduling are also different. These differences will be reflected in the mathematical model. The fundamental difference between serial and parallel equipment in the mathematical model is reflected in the decision-making level. After the lot enters the serial device, the wafer will complete the processing in sequence according to the established path, and no more decisions need to be made. Therefore, the decision variables of the model only need to reach the lot and the equipment; for parallel equipment, the wafer path is optional. When there is an idle chamber, wafers belonging to other lots can be processed, thus forming a situation of overlapping and staggered processing between lots. Therefore, the decision variables of the model need to be refined at the wafer and chamber levels.

[0079] It is not difficult to find that compared with the related art, in the solution provided in the embodiment of the present application, by improving the production planning method of the etching equipment, the unification of the data model and the optimization of the scheduling are achieved, the production efficiency and flexibility are significantly improved, and the production cost can be effectively reduced. This improvement has broad application prospects and significant economic benefits in actual production.

[0080] The step division of the above methods is only for the purpose of clear description. When implemented, they can be combined into one step or some steps can be split and decomposed into multiple steps. As long as they include the same logical relationship, they are all within the scope of protection of this patent; adding insignificant modifications to the algorithm or process or introducing insignificant designs without changing the core design of the algorithm and process are all within the scope of protection of this patent.

[0081] In addition, some embodiments of the present application also provide an electronic device. The electronic device may be a digital computer in various forms, such as a laptop computer, a desktop computer, a workbench, a personal digital assistant, a server, a blade server, a mainframe computer, etc. The electronic device may also be a mobile device in various forms, such as a personal digital processing, a cellular phone, a smart phone, a wearable device, and other similar computing devices.

[0082] The electronic device includes: one or more processors; and a memory storing computer program instructions, wherein when the computer program instructions are executed, the processor executes the steps of the method provided in any one or more of the above embodiments. Figure 7 An exemplary structural diagram of the electronic device is disclosed. Figure 7 As shown, the electronic device includes: one or more processors 1101, memory 1102, and interfaces for connecting various components, including high-speed interfaces and low-speed interfaces. The various components are connected to each other using different buses and can be installed on a common mainboard or installed in other ways as needed. The processor can process instructions executed in the electronic device, including instructions stored in or on the memory to display graphical information of the GUI on an external input / output device (such as a display device coupled to the interface). In some other embodiments, if necessary, multiple processors and / or multiple buses can be used together with multiple memories and multiple memories. Similarly, multiple electronic devices can be connected, and each device provides some necessary operations (for example, as a server array, a group of blade servers, or a multi-processor system). Among them, the components shown in this article, their connections and relationships, and their functions are only used as examples, and are not intended to limit the implementation of the present application described and / or required herein.

[0083] The electronic device may further include: an input device 1103 and an output device 1104. The processor 1101, the memory 1102, the input device 1103 and the output device 1104 may be connected via a bus or other means. Figure 7 The example of connecting through bus is taken in the following.

[0084] The input device 1103 can receive input digital or character information, and generate key signal input related to the user settings and function control of the electronic device, such as a touch screen, a keypad, a mouse, a track pad, a touch pad, an indicator bar, one or more mouse buttons, a trackball, a joystick and other input devices. The output device 1104 may include a display device, an auxiliary lighting device (e.g., an LED) and a tactile feedback device (e.g., a vibration motor), etc. The display device may include, but is not limited to, a liquid crystal display (LCD), a light emitting diode (LED) display and a plasma display. In some embodiments, the display device may be a touch screen.

[0085] To provide interaction with a user, the electronic device may be a computer. The computer has: a display device (e.g., a CRT (cathode ray tube) or LCD (liquid crystal display) monitor) for displaying information to the user; and a keyboard and a pointing device (e.g., a mouse or a trackball), through which the user can provide input to the computer. Other types of devices may also be used to provide interaction with the user; for example, the feedback provided to the user may be any form of sensory feedback (e.g., visual feedback, auditory feedback, or tactile feedback); and input from the user may be received in any form (including acoustic input, voice input, or tactile input).

[0086] In the embodiments of the present application, a computer program / instruction is stored on a computer-readable medium, and when the computer program / instruction is executed by a processor, the steps of the method provided by any one or more of the above embodiments are implemented. The computer-readable medium may be included in the electronic device described in the above embodiments; or it may exist independently without being assembled into the device. The above computer-readable medium carries one or more computer-readable instructions.

[0087] The memory 1102 can be used as a non-transient computer-readable storage medium, which can be used to store non-transient software programs, non-transient computer executable programs and modules. The processor 1101 executes various functional applications and data processing of the server by running the non-transient software programs, instructions and modules stored in the memory 1102, so as to implement the program instructions / modules corresponding to the method provided by any one or more embodiments in the embodiments of the present application.

[0088] The memory 1102 may include a program storage area and a data storage area, wherein the program storage area may store an operating system, an application required for at least one function; the data storage area may store data created according to the use of the electronic device, etc. In addition, the memory 1102 may include a high-speed random access memory, and may also include a non-transient memory, such as at least one disk storage device, a flash memory device, or other non-transient solid-state storage device. In some embodiments, the memory 1102 may optionally include a memory remotely arranged relative to the processor 1101, and these remote memories may be connected to the electronic device via a network. Examples of the above-mentioned network include, but are not limited to, the Internet, an intranet, a local area network, a mobile communication network, and combinations thereof.

[0089] It should be noted that the computer-readable medium described in the present application may be a computer-readable signal medium or a computer-readable storage medium or any combination of the above two. The computer-readable medium may be, for example, but not limited to, an electrical, magnetic, optical, electromagnetic, infrared or semiconductor system, device or device, or any combination of the above. More specific examples of computer-readable storage media may include, but are not limited to: an electrical connection with one or more wires, a portable computer disk, a hard disk, a random access memory (RAM), a read-only memory (ROM), an erasable programmable read-only memory (EPROM or flash memory), an optical fiber, a portable compact disk read-only memory (CD-ROM), an optical storage device, a magnetic storage device, or any suitable combination of the above. In the present application, a computer-readable medium may be any tangible medium containing or storing a program that can be used by or in combination with an instruction execution system, device or device.

[0090] Computer readable media include permanent and non-permanent, removable and non-removable media, and can be implemented by any method or technology to store information. Information can be computer readable instructions, data structures, modules of programs or other data. Examples of computer storage media include, but are not limited to, phase change memory (PRAM), static random access memory (SRAM), dynamic random access memory (DRAM), other types of random access memory (RAM), read-only memory (ROM), electrically erasable programmable read-only memory (EEPROM), flash memory or other memory technology, read-only compact disk (CD-ROM), digital versatile disk (DVD) or other optical storage, magnetic cassettes, magnetic tape disk storage or other magnetic storage devices or any other non-transmission medium that can be used to store information that can be accessed by a computing device.

[0091] Computer program code for performing the operations of the present application may be written in one or more programming languages ​​or a combination thereof, including object-oriented programming languages, such as Java, Smalltalk, C++, and conventional procedural programming languages, such as "C" or similar programming languages. The program code may be executed entirely on the user's computer, partially on the user's computer, as a separate software package, partially on the user's computer and partially on a remote computer, or entirely on a remote computer or server. In cases involving a remote computer, the remote computer may be connected to the user's computer via any type of network, including a local area network (LAN) or a wide area network (WAN), or may be connected to an external computer (e.g., via the Internet using an Internet service provider).

[0092] In the above-described embodiments, it can be implemented in whole or in part by software, hardware, firmware or any combination thereof. For example, it can be implemented by using an application specific integrated circuit (ASIC), a general-purpose computer or any other similar hardware device. In certain embodiments, the software program of the present application can be executed by a processor to implement the above steps or functions. Similarly, the software program of the present application (including relevant data structures) can be stored in a computer-readable recording medium, for example, a RAM memory, a magnetic or optical drive or a floppy disk and similar devices. In addition, some steps or functions of the present application can be implemented by hardware, for example, as a circuit that cooperates with a processor to perform each step or function.

[0093] The computer program product provided in the embodiment of the present application includes one or more computer programs / instructions, and when the computer program / instructions are executed by the processor, the process or function described in the embodiment of the present application is generated in whole or in part. The computer may be a general-purpose computer, a special-purpose computer, a computer network, or other programmable devices. The computer instructions may be stored in a computer-readable storage medium, or transmitted from a computer-readable storage medium to another computer-readable storage medium, for example, the computer instructions may be transmitted from a website site, a computer, a server or a data center by wired (e.g., coaxial cable, optical fiber, digital subscriber line (DSL)) or wireless (e.g., infrared, wireless, microwave, etc.) mode to another website site, computer, server or data center. The computer-readable storage medium may be any available medium that a computer can access or a data storage device such as a server or a data center that includes one or more available media integrations. The available medium may be a magnetic medium, (e.g., a floppy disk, a hard disk, a tape), an optical medium (e.g., a DVD), or a semiconductor medium (e.g., a solid state disk (SSD)), etc.

[0094] The flow chart or block diagram in the accompanying drawings shows the possible architecture, function and operation of the equipment, method and computer program product according to various embodiments of the present application. In this regard, each box in the flow chart or block diagram can represent a module, a program segment or a part of a code, and the module, the program segment or a part of the code contains one or more executable instructions for realizing the specified logical function. It should also be noted that in some alternative implementations, the functions marked in the box can also occur in a different order from the order marked in the accompanying drawings. For example, two boxes represented in succession can actually be executed substantially in parallel, and they can sometimes be executed in the opposite order, depending on the functions involved. It should also be noted that each box in the block diagram and / or flow chart, and the combination of the boxes in the block diagram and / or flow chart can be implemented with a dedicated system for hardware that performs a specified function or operation, or can be implemented with a combination of dedicated hardware and computer instructions.

[0095] The scope of the present application is defined by the appended claims rather than the above description, and it is intended that all changes that fall within the meaning and scope of the equivalent elements of the claims are included in the present application. Any figure mark in the claims should not be regarded as limiting the claims involved. In addition, it is clear that the word "comprising" does not exclude other units or steps, and the singular does not exclude the plural. Multiple units or devices stated in the device claim may also be implemented by one unit or device through software or hardware. The words "first", "second", etc. are only used to distinguish the description, and do not indicate any particular order, nor can they be understood as indicating or implying relative importance.

[0096] The above is only a specific implementation of the present application, but the protection scope of the present application is not limited thereto. Any person skilled in the art can easily mention changes or substitutions within the technical scope disclosed in the present application, which should be included in the protection scope of the present application. Therefore, the protection scope of the present application should be based on the protection scope of the claims, and the above embodiments should be regarded as exemplary and non-restrictive.

Claims

1. A method for production planning of etching equipment, characterized in that: The method comprises: Extracting the scheduling features of etching equipment; Classifying the etching equipment according to the scheduling characteristics to obtain the machine type of the etching equipment; the machine type includes a serial machine, a parallel machine and a serial-parallel hybrid machine; According to the machine type, the data of the etching equipment is unified and a corresponding mathematical model is constructed to obtain a production planning solution.

2. The method according to claim 1, characterized in that The scheduling features of the serial machine include: The chambers of the machine are connected in series, allowing one lot to be processed at the same time; Each chamber has two wafers for processing, and there is no limit on the number of buffers; Each wafer needs to be processed by all chambers in all PP IDs in sequence; After one lot is processed, the next lot can only be processed after all chambers are released.

3. The method according to claim 1, characterized in that The scheduling features of the parallel machine include: Each chamber of the machine is independent of each other, allowing multiple parts to be processed simultaneously in each chamber at the same time; Each chamber has one wafer to process, and there is no limit on the number of buffers; Each wafer is processed in a chamber and then completed; After the Chamber occupied by a lot is released, the next lot enters the Chamber for processing.

4. The method according to claim 1, characterized in that: The serial-parallel hybrid machine includes a parallel-first then serial machine and a serial-first then parallel machine.

5. The method according to claim 4, characterized in that The scheduling features of the parallel-first-then-serial type machine include that multiple l ots are processed in different chambers at the same time, and after being processed in parallel in multiple chambers, they are processed in a serial chamber at one time; The scheduling feature of the serial-before-parallel type machine includes that the lot is first processed once in a serial chamber and then processed in parallel in different chambers.

6. The method according to any one of claims 1 to 5, characterized in that: The unifying the data of the etching equipment includes: unifying the PP ID field of the etching equipment, and determining the sequence of processes and the serial-parallel relationship of chambers.

7. The method according to any one of claims 1 to 5, characterized in that: The construction of the corresponding mathematical model includes: determining the decision variables of the etching equipment at the decision level; for the serial machine, determining the decision variables at the log level and the equipment level; for the parallel machine, determining the decision variables at the wafer level and the chamber level.

8. An electronic device, characterized in that: The electronic device comprises: one or more processors; and A memory storing computer program instructions, which, when executed, cause the processor to perform the steps of the method as claimed in any one of claims 1 to 7.

9. A computer readable medium having a computer program / instructions stored thereon, characterized in that: When the computer program / instructions are executed by a processor, the steps of the method according to any one of claims 1 to 7 are implemented.

10. A computer program product comprising a computer program / instructions, characterized in that When the computer program / instructions are executed by a processor, the steps of the method according to any one of claims 1 to 7 are implemented.

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