Plastic package mold

Abstract

The invention relates to a plastic packaging mold, and belongs to the technical field of semiconductor packaging. The plastic packaging mold comprises a plastic packaging outer frame, guide frames are fixedly connected to the two sides of the plastic packaging outer frame, the guide frames penetrate into the plastic packaging outer frame, a connecting frame is fixedly connected to the upper end of the plastic packaging outer frame, and two electric-hydraulic push rods are fixedly connected to the lower end of the connecting frame; the plastic packaging mechanism is mounted at the lower end of the connecting frame, and the surface of the plastic packaging mechanism extends to the outside of the plastic packaging outer frame; the heating area of the sliding lower mold is subjected to auxiliary heating through the first hot air guide pipe, meanwhile, hot air is injected into the wall through cooperation with the second hot air guide pipe, heat loss caused by contact between outside normal-temperature air and an inner cavity of the mold is reduced, and contact between the device and outside normal-temperature air in the opening and closing process is reduced; and the high-temperature effect of the inner cavity of the mold is maintained, the heating time of the inner cavity of the mold is shortened, and the machining efficiency of the device is improved.

Description

Technical Field

[0001] The invention relates to the technical field of semiconductor packaging, and in particular to a plastic packaging mold. Background Art

[0002] The semiconductor plastic encapsulation process is a commonly used process in the semiconductor industry. Molten resin material is injected into a nearly closed mold cavity. The resin material flows to fill the entire mold cavity of the packaging mold to wrap the entire chip and part of the lead frame to form a semiconductor product. The purpose of the semiconductor plastic encapsulation process is to use resin material to wrap the entire chip to protect the sensitive structures such as chips, bonding wires, components, etc. inside the semiconductor product from being affected by the external environment, ensuring the overall insulation and reliability of the semiconductor product.

[0003] After searching the prior art for "a semiconductor plastic encapsulation device", the announcement number is "CN116682745B". This device heats and melts the plastic block through the plastic encapsulation body, and then performs plastic encapsulation processing on the semiconductor. However, during the heating operation, the two modules will be reciprocatedly separated and merged to perform plastic encapsulation processing on the semiconductor product. When separated, the inner cavity of the mold is exposed to the outside and heat loss occurs. The inner cavity of the mold needs time to be gradually heated again to maintain the melting temperature of the subsequent material, which will affect the work efficiency of the semiconductor plastic encapsulation processing. Summary of the invention

[0004] Based on this, it is necessary to provide a plastic encapsulation mold to address the problem that during the heating operation, the temperature of the mold cavity needs to be gradually heated to the melting temperature of the plastic block due to the separation of the two modules and contact with the outside normal temperature air, which will affect the work efficiency of the semiconductor plastic encapsulation processing.

[0005] A plastic packaging mold comprises: a plastic packaging outer frame, both sides of which are fixedly connected with guide frames, the guide frames penetrate into the interior of the plastic packaging outer frame, the upper end of the plastic packaging outer frame is fixedly connected with a connecting frame, and the lower end of the connecting frame is fixedly connected with two electro-hydraulic push rods; a plastic packaging mechanism, the plastic packaging mechanism is installed at the lower end of the connecting frame, and the surface of the plastic packaging mechanism extends to the outside of the plastic packaging outer frame; wherein the plastic packaging mechanism comprises a lower mold adjustment component installed on the inner bottom wall of the plastic packaging outer frame, the upper end of the lower mold adjustment component is installed with an upper mold drive component, and the upper mold drive component is arranged at the telescopic end of the connecting frame, a plastic packaging material extrusion head is arranged inside the lower mold adjustment component, and the lower end of the plastic packaging material extrusion head penetrates to the bottom of the plastic packaging outer frame, and a temperature auxiliary component is arranged below the lower mold adjustment component, and the temperature auxiliary component is installed on the surface of the plastic packaging outer frame.

[0006] In one embodiment, the lower mold adjustment assembly includes a middle guide bar fixedly connected to the inner bottom wall of the plastic packaging outer frame, the inner wall of the middle guide bar is fixedly connected to the surface of the plastic packaging material extrusion head, and the sides of the middle guide bar are provided with side guide bars fixedly connected to the inner wall of the plastic packaging outer frame, a sliding lower mold is slidably connected between the middle guide bar and the side guide bar, and two bottom sliding frames are fixedly connected between the middle guide bar and the side guide bar, and the sliding lower mold is slidably connected to the surface of the bottom sliding frame. The upper end of the sliding lower mold is provided with four lower mold grooves, and a heat-insulating material needs to be provided in the middle of the sliding lower mold. The heat-insulating material is appropriately adjusted according to the actual use situation, and two lower mold grooves are distributed on both sides of the heat-insulating material.

[0007] In one embodiment, the upper mold driving assembly includes an upper mold fixedly connected to the telescopic end of the connecting frame, a cooling air channel is provided inside the upper mold, two heating blocks are embedded and installed in the middle of the upper end of the upper mold, both sides of the upper mold are fixedly connected to fixed sleeves, the middle of the side of the upper mold is fixedly connected to a fixed ring, the inner wall of the fixed ring is hinged with a hinge rod, and the other end of the hinge rod is hinged to the upper end of the adjacent sliding lower mold. The hinge rod drives the sliding lower mold to slide between the middle guide bar and the side guide bar through the fixed ring.

[0008] In one embodiment, the end of the hinged rod close to the upper mold is fixedly connected with a toggle block, and both sides of the guide frame are provided with a closed telescopic cylinder fixedly connected to the surface of the plastic-sealed outer frame, the telescopic end of the closed telescopic cylinder contacts the lower end of the toggle block, the telescopic end of the closed telescopic cylinder is sleeved with a spring, the lower end of the closed telescopic cylinder is connected with a liquid guide tube, and the end of the liquid guide tube away from the closed telescopic cylinder is connected with a closed embedded cylinder. When the hinged rod is deflected, the toggle block is driven to follow the deflection, and then hits the telescopic end of the closed telescopic cylinder, so that the liquid medium inside the closed telescopic cylinder is injected into the liquid guide tube, and at this time, the piston inside the closed embedded cylinder moves toward the fixed sleeve.

[0009] In one embodiment, the temperature auxiliary component includes a thermal insulation plate fixedly connected to the inner bottom wall of the plastic-encapsulated outer frame, the thermal insulation plate and the bottom sliding frame are combined to form a cooling chamber, and the opposite sides of the adjacent thermal insulation plate form a preheating chamber, the lower end of the thermal insulation plate is provided with a vortex tube fixedly connected to the lower end of the plastic-encapsulated outer frame, the cold air end of the vortex tube is connected to a first cold air duct, the end of the first cold air duct away from the vortex tube passes through the cooling chamber, the bottom wall of the cooling chamber is fixedly connected to a second cold air duct, and the other end of the second cold air duct is connected to the surface of the sealed embedded cylinder. The vortex tube injects high-speed gas so that the first cold air duct guides the cold air flow out, and the cooling chamber is cooled, wherein the cooling chamber cools the lower part of the sliding lower mold through the guide heat conduction plate, the corrugated heat conduction plate and the bottom sliding frame, and the low-temperature gas is introduced into the cooling airway through the second cold air duct, the sealed embedded cylinder and the fixed sleeve.

[0010] In one embodiment, the upper end of the middle guide strip is provided with a middle guide groove, the upper end of the sliding lower mold is provided with a lower mold guide groove, the middle guide groove is connected with the adjacent lower mold guide groove, and the lower end of the sliding lower mold is fixedly connected with a guide and heat conduction plate. The lower mold guide groove and the middle guide groove guide the mold cavity, and during the introduction process, since the upper end of the upper mold is provided with an air outlet and the plastic sealing material is continuously heated, the fluidity of the plastic sealing material is improved, so that the plastic sealing product can be quickly formed.

[0011] In one embodiment, a guide slot is provided at the upper end of the bottom sliding frame, the guide heat conducting plate is slidably connected to the inner wall of the guide slot, a corrugated heat conducting plate is provided between adjacent guide slots, and the corrugated heat conducting plate is slidably connected to the inner top wall of the bottom sliding frame. The sliding lower mold is driven to move horizontally by a hinge rod, and after the upper mold moves downward again, the other two lower mold slots of the sliding lower mold move to the bottom of the heating block under the action of inertia, and the surface of the corrugated heat conducting plate away from the bottom sliding frame is wavy, which can play an auxiliary guiding role for the airflow.

[0012] In one embodiment, the enclosed embedded cylinder is embedded and installed on the surface of the plastic-encapsulated outer frame, the inner wall of the enclosed embedded cylinder is slidably connected to a piston, the inner wall of the piston is fixedly connected to a valve core joint, and the valve core joint is connected to a telescopic bellows away from the end of the fixed sleeve. When the enclosed telescopic cylinder is squeezed, the valve core joint contacts the cylinder joint to form a tight fit effect, at which time the cylinder joint matches the valve core joint to form a connection effect, and the cold air flow is injected into the interior of the cooling airway through the fixed sleeve, and the adjacent plastic-encapsulated semiconductor is quickly cooled, thereby improving the molding effect of the semiconductor plastic seal.

[0013] In one embodiment, the inner wall of the fixed sleeve is slidably connected to a sliding tube, the other end of the sliding tube is fixedly connected to a cylinder joint, and a spring is fixedly connected between the fixed sleeve and the cylinder joint. When the closed telescopic cylinder is not squeezed, the fixed sleeve drives the cylinder joint through the sliding tube to approach the end of the closed embedded cylinder away from the second cold air duct, at which time the piston and the valve core joint are located inside the closed embedded cylinder, and the valve core joint does not contact the cylinder joint.

[0014] In one embodiment, the hot air end of the vortex tube is connected to a first hot air conduit, the first hot air conduit penetrates into the interior of the preheating chamber, the inner bottom wall of the preheating chamber is fixedly connected to a second hot air conduit, the other end of the second hot air conduit penetrates the side of the plastic package outer frame and extends to the interior of the plastic package outer frame. The first hot air conduit is used to introduce hot air flow into the preheating chamber to assist the preheating operation of the sliding lower mold above the preheating chamber, thereby improving the molding efficiency of semiconductor plastic packaging. The hot gas inside the preheating chamber is preheated to the adjacent lower mold groove above the sliding lower mold through the second hot air conduit.

[0015] The above-mentioned plastic sealing mold maintains the melting heat of the middle part of the upper mold by arranging a heating block in the plastic sealing mechanism, reduces the heat loss in the reciprocating motion of the upper mold, and performs auxiliary heating on the heating area of ​​the sliding lower mold through the first hot air duct, and simultaneously cooperates with the second hot air duct to inject hot air into the wall, thereby reducing the heat loss caused by the contact between the external normal temperature gas and the mold cavity, so that the contact with the external normal temperature air during the opening and closing process of the device is reduced, and the high temperature effect of the mold cavity is assisted to maintain, thereby shortening the heating time of the mold cavity and improving the processing efficiency of the device;

[0016] The device can guide the low-temperature airflow to the inside of the cooling chamber through the first cold air duct during the plastic sealing process by means of the upper mold driving component and the temperature auxiliary component, so as to assist in cooling the lower part of the sliding lower mold in the low-temperature area, and assist in rapid cooling of the lower part after the semiconductor is plastic-sealed. The low-temperature gas in the cooling chamber is introduced into the upper mold through the closed embedded cylinder and the fixed sleeve, so as to cool the upper part of the semiconductor after plastic sealing, thereby shortening the cooling and shaping time of the semiconductor after plastic sealing, and improving the processing efficiency of the device. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to more clearly illustrate the technical solutions in the present invention or the prior art, a brief introduction will be given below to the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0018] Figure 1 It is a structural schematic diagram of the present invention;

[0019] Figure 2 It is a structural schematic diagram of the plastic sealing mechanism of the present invention;

[0020] Figure 3 It is a schematic diagram of the explosion structure of the plastic sealing mechanism of the present invention;

[0021] Figure 4 It is a schematic diagram of a partial explosion structure of a lower die adjustment assembly of the present invention;

[0022] Figure 5 A schematic diagram of the lower die guide groove of the present invention;

[0023] Figure 6 A schematic diagram of the cooling airway of the present invention;

[0024] Figure 7 A schematic diagram of the guide notch of the present invention;

[0025] Figure 8 It is a schematic diagram of the structure of the corrugated heat transfer plate of the present invention;

[0026] Fig. 9 It is a schematic diagram of the partial structure of the temperature auxiliary component of the present invention;

[0027] Fig.10 It is a schematic diagram of the connection between the enclosed telescopic cylinder and the liquid guiding tube of the present invention;

[0028] Fig.11 It is a schematic diagram of the distribution of the shrapnel of the present invention;

[0029] Fig.12 It is a schematic diagram of the explosion structure inside the closed embedded cylinder of the present invention.

[0030] Reference numerals:

[0031] 100, plastic packaging frame; 110, guide frame; 200, connecting frame; 210, electro-hydraulic push rod; 300, plastic packaging mechanism; 310, lower mold adjustment assembly; 311, middle guide strip; 3111, middle guide groove; 312, sliding lower mold; 3121, lower mold guide groove; 3122, guide heat conduction plate; 313, side guide strip; 314, bottom sliding frame; 3141, guide notch; 3142, corrugated heat conduction plate; 320, upper mold drive assembly; 321, upper mold; 3211, cooling airway; 322, heating block; 323, fixed sleeve; 3231, sliding tube; 3232, Cylinder joint; 3233, spring; 324, fixing ring; 3241, hinged rod; 3242, toggle block; 325, closed telescopic cylinder; 3251, spring; 326, liquid guide tube; 327, closed embedded cylinder; 3271, telescopic bellows; 3272, valve core joint; 3273, piston; 330, temperature auxiliary component; 331, vortex tube; 332, first hot air duct; 3321, second hot air duct; 333, first cold air duct; 3331, second cold air duct; 334, insulation board; 335, cooling chamber; 3351, preheating chamber; 340, plastic encapsulation compound extruder. DETAILED DESCRIPTION

[0032] In order to make the purpose, technical solution and advantages of the embodiments of the present invention clearer, the technical solution in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0033] It should be noted that when a component is referred to as being "fixed to" or "disposed on" another component, it may be directly on the other component or there may be a central component. When a component is considered to be "connected to" another component, it may be directly connected to the other component or there may be a central component at the same time. The terms "vertical", "horizontal", "upper", "lower", "left", "right" and similar expressions used in the specification of the present invention are for illustrative purposes only and do not represent the only implementation method.

[0034] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In the description of the present invention, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0035] In the present invention, unless otherwise clearly specified and limited, a first feature being “above” or “below” a second feature may mean that the first feature is directly in contact with the second feature, or the first feature and the second feature are indirectly in contact through an intermediate medium. Moreover, a first feature being “above”, “above” or “above” a second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. A first feature being “below”, “below” or “below” a second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

[0036] Unless otherwise defined, all technical and scientific terms used in the specification of the present invention have the same meaning as those commonly understood by those skilled in the art of the present invention. The terms used in the specification of the present invention are only for the purpose of describing specific embodiments and are not intended to limit the present invention. The term "and / or" used in the specification of the present invention includes any and all combinations of one or more related listed items.

[0037] Combine the following Figure 1-Figure 12 The plastic encapsulation mold of the present invention comprises: a plastic encapsulation outer frame 100, both sides of the plastic encapsulation outer frame 100 are fixedly connected with guide frames 110, the guide frames 110 penetrate into the interior of the plastic encapsulation outer frame 100, the upper end of the plastic encapsulation outer frame 100 is fixedly connected with a connecting frame 200, and the lower end of the connecting frame 200 is fixedly connected with two electro-hydraulic push rods 210; a plastic encapsulation mechanism 300, the plastic encapsulation mechanism 300 is installed at the lower end of the connecting frame 200, and the surface of the plastic encapsulation mechanism 300 extends to the outside of the plastic encapsulation outer frame 100; wherein the plastic encapsulation mechanism 300 The lower mold adjusting assembly 310 is installed on the inner bottom wall of the plastic packaging frame 100, the upper mold driving assembly 320 is installed on the upper end of the lower mold adjusting assembly 310, and the upper mold driving assembly 320 is arranged at the telescopic end of the connecting frame 200. The lower mold adjusting assembly 310 is provided with a plastic packaging material extrusion head 340, and the lower end of the plastic packaging material extrusion head 340 penetrates to the bottom of the plastic packaging frame 100. A temperature auxiliary assembly 330 is arranged below the lower mold adjusting assembly 310, and the temperature auxiliary assembly 330 is installed on the surface of the plastic packaging frame 100;

[0038] like Figure 1 , Figure 2 , Figure 3 , Figure 4 , Figure 5 , Figure 6 , Figure 7 , Figure 8 , Fig.10 , Fig.11 , Fig.12As shown, the lower mold adjustment assembly 310 includes a middle guide bar 311 fixedly connected to the inner bottom wall of the plastic packaging outer frame 100, the inner wall of the middle guide bar 311 is fixedly connected to the surface of the plastic packaging material extrusion head 340, and both sides of the middle guide bar 311 are provided with side guide bars 313 fixedly connected to the inner wall of the plastic packaging outer frame 100, a sliding lower mold 312 is slidably connected between the middle guide bar 311 and the side guide bar 313, two bottom sliding frames 314 are fixedly connected between the middle guide bar 311 and the side guide bar 313, and the sliding lower mold 312 is slidably connected to the surface of the bottom sliding frame 314. A middle guide groove 3111 is provided at the upper end of the middle guide bar 311, a lower mold guide groove 3121 is provided at the upper end of the sliding lower mold 312, the middle guide groove 3111 is connected to the adjacent lower mold guide groove 3121, and a guide and heat conduction plate 3122 is fixedly connected to the lower end of the sliding lower mold 312. A guide slot 3141 is provided at the upper end of the bottom sliding frame 314, and a guide heat conducting plate 3122 is slidably connected to the inner wall of the guide slot 3141. A corrugated heat conducting plate 3142 is provided between adjacent guide slots 3141, and the corrugated heat conducting plate 3142 is slidably connected to the inner top wall of the bottom sliding frame 314.

[0039] The upper mold driving assembly 320 includes an upper mold 321 fixedly connected to the telescopic end of the connecting frame 200, a cooling air duct 3211 is provided inside the upper mold 321, two heating blocks 322 are embedded and installed in the middle of the upper end of the upper mold 321, both sides of the upper mold 321 are fixedly connected with fixed sleeves 323, and the middle part of the side of the upper mold 321 is fixedly connected with a fixed ring 324, and the inner wall of the fixed ring 324 is hinged with a hinge rod 3241, and the other end of the hinge rod 3241 is hinged to the upper end of the adjacent sliding lower mold 312; when the device is in use, the upper mold 321 is driven by the connecting frame 200 to move up and down, and when the upper mold 321 moves downward, The fixing ring 324 enables the hinge rod 3241 to drive the sliding lower mold 312 to slide between the middle guide strip 311 and the side guide strip 313. When the upper mold 321 moves downward, the sliding lower mold 312 moves toward the end of the plastic packaging outer frame 100. At this time, the two lower mold grooves above the sliding lower mold 312 near one end are located directly below the heating block 322, thereby driving the plastic packaging material extruder 340 to introduce the molten plastic packaging material into the mold cavity through the lower mold guide groove 3121 and the middle guide groove 3111. During the introduction process, since the upper end of the upper mold 321 is provided with an air outlet and the plastic packaging material is continuously heated, the fluidity of the plastic packaging material is improved, so that the plastic packaging product can be quickly formed;

[0040] The upper end of the sliding lower mold 312 is provided with four lower mold grooves, and a heat-insulating material needs to be set in the middle of the sliding lower mold 312. The heat-insulating material is appropriately adjusted according to the actual use situation. Two lower mold grooves are distributed on each side of the heat-insulating material, and a guide slot 3141 and a guide heat-conducting plate 3122 are provided on the upper end of the bottom sliding frame 314 to play an auxiliary guiding role for the sliding lower mold 312. Eight suction holes are set on the upper end of the upper mold 321, and four suction holes are set on each side of the two heating blocks 322. The suction holes can be connected to an external suction device. When the plastic sealing material under the heating block 322 is formed, the heating of the heating block 322 is stopped. At this time, the driving connecting frame 200 drives the upper mold 321 to move upward, and then the fixing ring 324 moves upward with the hinge rod 3 241 drives the sliding lower mold 312 to move horizontally. After the upper mold 321 moves downward again, the other two lower mold grooves of the sliding lower mold 312 move to the bottom of the heating block 322 under the action of inertia. The previously molded and plastic-encapsulated semiconductor under the heating block 322 can be adsorbed by the suction holes. When the upper mold 321 is lifted again, it moves with the upper mold groove of the upper mold 321 under the action of suction. When the upper mold 321 performs another longitudinal reciprocating movement, the suction holes above the semiconductor can stop suctioning. At this time, the molded semiconductor located in the upper mold groove falls on the top of the bottom sliding frame 314. When the upper mold 321 reciprocates again, the end of the sliding lower mold 312 will push the plastic-encapsulated semiconductor that falls on the bottom sliding frame 314 out of the plastic-encapsulated outer frame 100.

[0041] like Figure 1 , Figure 2 , Figure 3 , Figure 4 , Figure 5 , Figure 6 , Fig.10 , Fig.11 , Fig.12 As shown, the end of the hinge rod 3241 close to the upper mold 321 is fixedly connected with a toggle block 3242, and both sides of the guide frame 110 are provided with a closed telescopic cylinder 325 fixedly connected to the surface of the plastic packaging outer frame 100, the telescopic end of the closed telescopic cylinder 325 contacts the lower end of the toggle block 3242, and the telescopic end of the closed telescopic cylinder 325 is sleeved with a spring 3251, and the lower end of the closed telescopic cylinder 325 is connected with a liquid guide tube 326, and the end of the liquid guide tube 326 away from the closed telescopic cylinder 325 is connected with a closed embedded cylinder 327. The closed embedded cylinder 327 is embedded and installed on the surface of the plastic packaging outer frame 100, and the inner wall of the closed embedded cylinder 327 is slidably connected with a piston 3273, and the inner wall of the piston 3273 is fixedly connected with a valve core joint 3272, and the end of the valve core joint 3272 away from the fixed sleeve 323 is connected with a telescopic bellows 3271. The inner wall of the fixed sleeve 323 is slidably connected with a sliding tube 3231, the other end of the sliding tube 3231 is fixedly connected with a gas cylinder joint 3232, and a spring piece 3233 is fixedly connected between the fixed sleeve 323 and the gas cylinder joint 3232;

[0042] When the hinge rod 3241 is deflected, the toggle block 3242 is driven to follow the deflection, thereby contacting the telescopic end of the closed telescopic cylinder 325, so that the liquid medium inside the closed telescopic cylinder 325 is injected into the liquid guide tube 326. At this time, the piston 3273 inside the closed embedded cylinder 327 moves toward the fixed sleeve 323, so that the valve core joint 3272 moves out of the closed embedded cylinder 327. When the closed telescopic cylinder 325 is not squeezed, the fixed sleeve 323 drives the cylinder joint 3232 to move away from the second cold air duct 33 to the closed embedded cylinder 327 through the sliding tube 3231. The ends of the piston 3273 and the valve core joint 3272 are close to each other, at this time, the piston 3273 and the valve core joint 3272 are located inside the closed embedded cylinder 327, the valve core joint 3272 does not contact the cylinder joint 3232, when the closed telescopic cylinder 325 is squeezed, the valve core joint 3272 contacts the cylinder joint 3232 to form a close fit effect, at this time, the cylinder joint 3232 matches the valve core joint 3272 to form a connection effect, the cold air flow is injected into the cooling airway 3211 through the fixed sleeve 323, and the adjacent plastic-sealed semiconductor is quickly cooled, thereby improving the molding effect of the semiconductor plastic seal;

[0043] like Figure 1 , Figure 2 , Figure 3 , Figure 4 , Figure 7 , Fig. 9 , Fig.10 , Fig.11 , Fig.12As shown, the temperature auxiliary component 330 includes a thermal insulation plate 334 fixedly connected to the inner bottom wall of the plastic-sealed outer frame 100, the thermal insulation plate 334 and the bottom sliding frame 314 are combined to form a cooling chamber 335, and the opposite sides of the adjacent thermal insulation plates 334 form a preheating chamber 3351, and the lower end of the thermal insulation plate 334 is provided with a vortex tube 331 fixedly connected to the lower end of the plastic-sealed outer frame 100, and the cold air end of the vortex tube 331 is connected to the first cold air duct 333, and the end of the first cold air duct 333 away from the vortex tube 331 passes through the cooling chamber 335, and the bottom wall of the cooling chamber 335 is fixedly connected to the second cold air duct 3331, and the other end of the second cold air duct 3331 is connected to the surface of the sealed embedded cylinder 327. The hot air end of the vortex tube 331 is connected to the first hot air conduit 332, which passes through the interior of the preheating chamber 3351. The inner bottom wall of the preheating chamber 3351 is fixedly connected to the second hot air conduit 3321, and the other end of the second hot air conduit 3321 passes through the side of the plastic-sealed outer frame 100 and extends to the interior of the plastic-sealed outer frame 100. High-speed gas is injected through the vortex tube 331 so that the first cold air duct 333 guides the cold air flow out, and the cooling chamber 335 is cooled, wherein the interior of the cooling chamber 335 cools the lower portion of the sliding lower mold 312 through the guide heat conducting plate 3122, the corrugated heat conducting plate 3142 and the bottom sliding frame 314, and the low-temperature gas is introduced into the cooling airway 3211 through the second cold air duct 3331, the sealed embedded cylinder 327 and the fixed sleeve 323, and auxiliary cooling is performed on the two lower mold grooves near the end of the plastic packaging outer frame 100, and hot air flow is introduced into the preheating chamber 3351 through the first hot air duct 332 to assist in preheating the sliding lower mold 312 above the preheating chamber 3351, thereby improving the molding efficiency of semiconductor plastic packaging, and the hot gas inside the preheating chamber 3351 is preheated to the adjacent lower mold groove above the sliding lower mold 312 through the second hot air duct 3321, thereby improving the molding efficiency of semiconductor plastic packaging.

[0044] When using this device:

[0045] The driving connecting frame 200 drives the upper mold 321 to move longitudinally, and the hinge rod 3241 drives the sliding lower mold 312 to slide between the middle guide strip 311 and the side guide strip 313 through the fixing ring 324. When the upper mold 321 moves downward, the sliding lower mold 312 moves toward the end of the plastic packaging outer frame 100, and drives the plastic packaging material extruder 340 to introduce the molten plastic packaging material. The lower mold guide groove 3121 and the middle guide groove 3111 guide into the mold cavity. The upper end of the sliding lower mold 312 is provided with four lower mold grooves, and the bottom sliding frame 3 The guide slot 3141 and the guide heat conducting plate 3122 are provided at the upper end of the sliding lower mold 312 to play an auxiliary guiding role for the sliding lower mold 312. When the plastic sealing material under the heating block 322 is formed, the heating of the heating block 322 is stopped, and the connecting frame 200 is driven to drive the upper mold 321 to move upward, and the fixing ring 324 moves upward accordingly. The hinge rod 3241 drives the sliding lower mold 312 to move horizontally. After the upper mold 321 moves downward again, under the action of inertia, the other two lower mold slots of the sliding lower mold 312 move to the bottom of the heating block 322;

[0046] When the hinge rod 3241 deviates, the toggle block 3242 is driven to follow the deviation and hit the telescopic end of the closed telescopic cylinder 325. The liquid medium inside the closed telescopic cylinder 325 is injected into the liquid guide tube 326. The piston 3273 inside the closed embedded cylinder 327 moves toward the fixed sleeve 323. The valve core joint 3272 moves out of the closed embedded cylinder 327. The valve core joint 3272 hits the cylinder joint 3232 to form a tight fit. The cylinder joint 3232 matches the valve core joint 3272 to form a connection effect. The cold air flow is injected into the interior of the cooling airway 3211 through the fixed sleeve 323. The vortex tube 331 transfers the high-speed air The body is injected into the first cold air duct 333 to guide the cold air flow to cool the cooling chamber 335. The inside of the cooling chamber 335 is cooled by the guide heat conduction plate 3122, the corrugated heat conduction plate 3142 and the bottom sliding frame 314 to cool the lower sliding lower mold 312. The second cold air duct 3331, the sealed embedded cylinder 327 and the fixed sleeve 323 guide the low-temperature gas into the cooling airway 3211, and assist the two lower mold grooves near the end of the plastic packaging outer frame 100 to assist in cooling. The first hot air duct 332 guides the hot air flow into the preheating chamber 3351, and assists the preheating operation of the sliding lower mold 312 above the preheating chamber 3351, thereby improving the molding efficiency of semiconductor plastic packaging.

[0047] The technical features of the above-described embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0048] The above-described embodiments only express several implementation methods of the present invention, and the description thereof is relatively specific and detailed, but it cannot be understood as limiting the scope of the present invention. It should be pointed out that, for a person of ordinary skill in the art, several modifications and improvements can be made without departing from the concept of the present invention, and these all belong to the protection scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the attached claims.

Claims

1. A plastic encapsulation mold, characterized in that: include: A plastic-encapsulated outer frame (100), wherein both sides of the plastic-encapsulated outer frame (100) are fixedly connected to guide frames (110), the guide frames (110) penetrate into the interior of the plastic-encapsulated outer frame (100), the upper end of the plastic-encapsulated outer frame (100) is fixedly connected to a connecting frame (200), and the lower end of the connecting frame (200) is fixedly connected to two electro-hydraulic push rods (210); A plastic sealing mechanism (300), the plastic sealing mechanism (300) being installed at the lower end of the connecting frame (200), and the surface of the plastic sealing mechanism (300) extending to the outside of the plastic sealing outer frame (100); The plastic packaging mechanism (300) comprises a lower mold adjustment component (310) installed on the inner bottom wall of the plastic packaging outer frame (100); an upper mold drive component (320) is installed on the upper end of the lower mold adjustment component (310); the upper mold drive component (320) is arranged on the telescopic end of the connecting frame (200); a plastic packaging material extrusion head (340) is arranged inside the lower mold adjustment component (310); the lower end of the plastic packaging material extrusion head (340) passes through the bottom of the plastic packaging outer frame (100); a temperature auxiliary component (330) is arranged below the lower mold adjustment component (310); and the temperature auxiliary component (330) is installed on the surface of the plastic packaging outer frame (100).

2. The plastic encapsulation mold according to claim 1, characterized in that: The lower mold adjustment assembly (310) comprises a middle guide bar (311) fixedly connected to the inner bottom wall of the plastic packaging outer frame (100); the inner wall of the middle guide bar (311) is fixedly connected to the surface of the plastic packaging material extrusion head (340); side guide bars (313) fixedly connected to the inner wall of the plastic packaging outer frame (100) are arranged on both sides of the middle guide bar (311); a sliding lower mold (312) is slidably connected between the middle guide bar (311) and the side guide bars (313); two bottom sliding frames (314) are fixedly connected between the middle guide bar (311) and the side guide bars (313); and the sliding lower mold (312) is slidably connected to the surface of the bottom sliding frame (314).

3. The plastic encapsulation mold according to claim 2, characterized in that: The upper mold driving assembly (320) includes an upper mold (321) fixedly connected to the telescopic end of the connecting frame (200), a cooling air duct (3211) is provided inside the upper mold (321), two heating blocks (322) are embedded and installed in the middle of the upper end of the upper mold (321), both sides of the upper mold (321) are fixedly connected with fixed sleeves (323), the middle part of the side of the upper mold (321) is fixedly connected with a fixed ring (324), the inner wall of the fixed ring (324) is hinged with a hinge rod (3241), and the other end of the hinge rod (3241) is hinged to the upper end of the adjacent sliding lower mold (312).

4. The plastic encapsulation mold according to claim 3, characterized in that: The end of the hinged rod (3241) close to the upper mold (321) is fixedly connected to a toggle block (3242), and both sides of the guide frame (110) are provided with a closed telescopic cylinder (325) fixedly connected to the surface of the plastic packaging outer frame (100), the telescopic end of the closed telescopic cylinder (325) contacts the lower end of the toggle block (3242), the telescopic end of the closed telescopic cylinder (325) is sleeved with a spring (3251), the lower end of the closed telescopic cylinder (325) is connected to a liquid guide tube (326), and the end of the liquid guide tube (326) away from the closed telescopic cylinder (325) is connected to a closed embedded cylinder (327).

5. The plastic encapsulation mold according to claim 2, characterized in that: The temperature auxiliary component (330) includes a thermal insulation plate (334) fixedly connected to the inner bottom wall of the plastic-sealed outer frame (100), the thermal insulation plate (334) and the bottom sliding frame (314) are combined to form a cooling chamber (335), and the opposite side of the adjacent thermal insulation plate (334) forms a preheating chamber (3351), the lower end of the thermal insulation plate (334) is provided with a vortex tube (331) fixedly connected to the lower end of the plastic-sealed outer frame (100), the cold air end of the vortex tube (331) is connected to a first cold air duct (333), the end of the first cold air duct (333) away from the vortex tube (331) passes through the cooling chamber (335), the bottom wall of the cooling chamber (335) is fixedly connected to a second cold air duct (3331), and the other end of the second cold air duct (3331) is connected to the surface of the sealed embedded cylinder (327).

6. The plastic encapsulation mold according to claim 2, characterized in that: The upper end of the middle guide strip (311) is provided with a middle guide groove (3111), the upper end of the sliding lower die (312) is provided with a lower die guide groove (3121), the middle guide groove (3111) is connected with the adjacent lower die guide groove (3121), and the lower end of the sliding lower die (312) is fixedly connected with a guide heat conduction plate (3122).

7. The plastic encapsulation mold according to claim 6, characterized in that: A guide slot (3141) is provided at the upper end of the bottom sliding frame (314), and the guide heat conduction plate (3122) is slidably connected to the inner wall of the guide slot (3141). A corrugated heat conduction plate (3142) is provided between adjacent guide slots (3141), and the corrugated heat conduction plate (3142) is slidably connected to the inner top wall of the bottom sliding frame (314).

8. The plastic encapsulation mold according to claim 4, characterized in that: The sealed embedded cylinder (327) is embedded and installed on the surface of the plastic-sealed outer frame (100); the inner wall of the sealed embedded cylinder (327) is slidably connected to a piston (3273); the inner wall of the piston (3273) is fixedly connected to a valve core joint (3272); and the end of the valve core joint (3272) away from the fixed sleeve (323) is connected to a telescopic bellows (3271).

9. The plastic encapsulation mold according to claim 8, characterized in that: The inner wall of the fixed sleeve (323) is slidably connected to a sliding tube (3231), the other end of the sliding tube (3231) is fixedly connected to a gas cylinder joint (3232), and a spring piece (3233) is fixedly connected between the fixed sleeve (323) and the gas cylinder joint (3232).

10. The plastic encapsulation mold according to claim 5, characterized in that: The hot air end of the vortex tube (331) is connected to a first hot air conduit (332), the first hot air conduit (332) penetrates into the interior of the preheating chamber (3351), the inner bottom wall of the preheating chamber (3351) is fixedly connected to a second hot air conduit (3321), the other end of the second hot air conduit (3321) penetrates the side of the plastic-encapsulated outer frame (100) and extends to the interior of the plastic-encapsulated outer frame (100).

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