Heater block, apparatus for heating substrate

Abstract

The present disclosure relates to a heater block and an apparatus for heating a substrate having the same, and more particularly, to a heater block having excellent heat dissipation characteristics and capable of accurately controlling a heating temperature, and an apparatus for heating a substrate having the same. A heater block according to an exemplary embodiment includes: a cooling plate provided with a cooling channel through which cooling water flows; the light emitting modules are arranged on the first surface of the cooling plate so as to emit light to an object to be heated; the power supply modules are arranged on the second surface of the cooling plate and penetrate through the cooling plate to be electrically connected with the light-emitting modules to supply power.

Description

Technical Field

[0001] The present disclosure relates to a heater block and an apparatus for heating a substrate having the same, and more particularly, to a heater block having excellent heat dissipation characteristics and capable of accurately controlling a heating temperature, and an apparatus for heating a substrate having the same. Background Art

[0002] A semiconductor device is formed by repeating a plurality of unit processes of processing a substrate such as ion implantation, thin film deposition, and heat treatment. In the unit process, thermal energy needs to be provided to process the substrate at a specified process temperature. In particular, since a short-time heating process is performed by using light energy to heat the substrate to a predetermined process temperature, it has the advantage of minimizing the side effect of generating impurities, and thus is widely used.

[0003] In a typical substrate heating device, the substrate is heat-treated by a heater including a plurality of halogen lamps while the substrate is in a chamber, and the temperature of the substrate is measured in a non-contact manner by the heating device. A pyrometer can collect the radiant energy emitted from the substrate to measure the temperature of the substrate in a non-contact manner based on the black body radiation temperature relationship. The temperature measured by the temperature measuring device is fed back to the heater block through a heating controller, thereby controlling the temperature of the heater.

[0004] In the case of a silicon wafer, if a silicon wafer having translucent light transmittance at a temperature below about 600° C. and having a characteristic of transmitting light in a low temperature range due to the nature of the material is used as a substrate, a portion of light from a halogen lamp passes through the substrate at a substrate temperature below about 600° C., and a pyrometer having a measurement wavelength band of about 0.9 μm to about 1 μm measures a portion of light from the halogen lamp having a radiation wavelength of about 0.4 μm to about 6 μm that passes through the substrate. Therefore, it is not possible to measure the accurate temperature of only the substrate, and a temperature measurement error occurs.

[0005] In addition, since the halogen lamp is not divided into a plurality of control areas, it is not possible to more accurately control each control area. Therefore, a heater technology capable of controlling each control area, each of which has an area smaller than that of the halogen lamp, is required.

[0006] [Prior art documents]

[0007] [Patent Document]

[0008] (Patent Document 1) Korean Patent No. 10-0974013 Summary of the invention

[0009] The present disclosure provides a heater block having excellent heat dissipation characteristics by effectively removing heat generated from a plurality of light emitting modules, and an apparatus for heating a substrate having the heater block.

[0010] The present disclosure also provides a heater block capable of controlling a precise heating temperature and providing power to each of a plurality of control zones to improve temperature uniformity, and an apparatus for heating a substrate having the heater block.

[0011] According to an exemplary embodiment, the heater block includes: a cooling plate provided with a cooling channel through which cooling water flows; a plurality of light emitting modules provided on a first surface of the cooling plate for emitting light to an object to be heated; and a plurality of power supply modules provided on a second surface of the cooling plate and electrically connected to the plurality of light emitting modules through the cooling plate for supplying power.

[0012] Each of the multiple power supply modules may include: a terminal portion connected to an external power source to receive power; a main body portion configured to support the terminal portion; an electrode rod portion electrically connected to the terminal portion and extending from the bottom surface of the main body portion, wherein the electrode rod portion can be connected to the corresponding light-emitting module through a cooling plate.

[0013] Each of the multiple light-emitting modules may include a first light-emitting portion and a second light-emitting portion that emit light independently of each other, the terminal portion may include a first terminal portion and a second terminal portion that receive power supplied to the first light-emitting portion and the second light-emitting portion, respectively, and the electrode rod portion includes a first electrode rod portion and a second electrode rod portion, which are electrically connected to the first terminal portion and the second terminal portion, respectively.

[0014] The cooling plate may include: a first plate provided with a plurality of upper protrusions protruding from a top surface to define a side of the cooling channel; and a second plate provided on the first plate to be coupled to each other and configured to define a top surface of the cooling channel.

[0015] The cooling plate may further include a plurality of first through holes passing through an area provided by the plurality of upper protrusions, wherein some of the plurality of power supply modules may be inserted into the plurality of first through holes to be electrically connected to the plurality of corresponding light emitting modules.

[0016] The cooling plate may include: a plurality of second through holes passing through the area provided by the plurality of upper protrusions; and a plurality of fixing members at least partially inserted into the plurality of second through holes to fix the plurality of light emitting modules or the plurality of power supply modules.

[0017] The first plate may further include a lower protrusion protruding from the bottom surface to define a recess in which each of the plurality of light emitting modules is mounted.

[0018] Each of the plurality of light emitting modules and the plurality of power supply modules may have a polygonal shape.

[0019] The plurality of light emitting modules and the plurality of power supplier modules may be two-dimensionally arranged to provide an array shape having a honeycomb structure.

[0020] Each of the plurality of light emitting modules may include: a light emitting semiconductor component configured to emit light; a circuit wiring portion transmitting power supplied from the plurality of power supply modules to the light emitting semiconductor component; and a metal plate for supporting the circuit wiring portion, formed of a thermally conductive metal.

[0021] The light emitting semiconductor component may include a vertical cavity surface emitting laser component and be flip-chip bonded to the circuit wiring portion.

[0022] The metal plate may electrically short-circuit the light emitting semiconductor component and the circuit wiring portion.

[0023] The heater block may further include a heat dissipation pad having elasticity disposed between the cooling plate and the plurality of light emitting modules.

[0024] According to another exemplary embodiment, an apparatus for heating a substrate includes: a chamber configured to provide a heat treatment space; a substrate support for supporting a substrate disposed in the heat treatment space; and a heater block as described in any one of claims 1 to 13, which is configured to face the substrate support to emit light to a first surface of the substrate and heat the substrate.

[0025] The apparatus may further include a pyrometer disposed on a second surface of the substrate facing the first surface to measure a temperature of the substrate.

[0026] The apparatus may further include a heating controller configured to selectively control power supplied to each of the plurality of power supply modules based on the temperature measured by the pyrometer. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] The exemplary embodiments may be understood in more detail through the following description in conjunction with the accompanying drawings, in which:

[0028] Figure 1 is a cross-sectional view of a heater block according to an exemplary embodiment.

[0029] Figure 2 is a partial perspective view illustrating an assembled state of a heater block according to an exemplary embodiment.

[0030] Figure 3A , Figure 3B is a view illustrating a detailed inner structure of a cooling plate according to an exemplary embodiment.

[0031] Figure 4 It is a partial cross-sectional view showing a mounted state of a light emitting semiconductor element according to an embodiment.

[0032] and

[0033] Figure 5 is a view illustrating a configuration of an apparatus for heating a substrate according to another exemplary embodiment.

[0034] Explanation of symbols

[0035] 100: Light emitting module 110: Metal plate

[0036] 111a, 111b: Circuit wiring part 120: Light emitting semiconductor element

[0037] 200: cooling plate 210: first plate

[0038] 220: Second plate 230: Cooling water inlet

[0039] 240: cooling water outlet 250: first through hole

[0040] 260: second through hole 300: power supply module

[0041] 310: Main body 320: Terminal

[0042] 330: Electrode rod 1000: Heater block

[0043] 2000: Chamber 3000: Substrate support

[0044] 4000: Heating controller 4100: Pyrometer

[0045] 4200: Temperature setting unit 4300: Power determination unit

[0046] 4400: Power Supply DETAILED DESCRIPTION

[0047] Below, specific embodiments will be described in more detail with reference to the accompanying drawings. However, the present invention can be implemented in different forms and should not be construed as being limited to the embodiments set forth herein. On the contrary, these embodiments are provided so that the present disclosure will be thorough and complete, and the scope of the present invention will be fully conveyed to those skilled in the art. In the description, the same components are represented by the same reference numerals. In the accompanying drawings, the sizes of layers and regions are exaggerated for clarity of illustration. The same figure designations refer to the same components from beginning to end.

[0048] Figure 1 is a cross-sectional view of a heater block according to an exemplary embodiment, Figure 2 is a partial perspective view showing an assembled state of a heater block according to an exemplary embodiment, Figure 3A , Figure 3B is a view illustrating a detailed internal structure of a heater block according to an exemplary embodiment.

[0049] refer to Figures 1 to 4 According to an exemplary embodiment, the heater block 1000 may include a cooling plate 200 provided with a cooling channel 211 through which cooling water flows, a plurality of light emitting modules 100 provided on a first surface of the cooling plate 200 to emit light to an object to be heated (hereinafter referred to as a heated object), and a plurality of power supply modules 300 provided on a second surface of the cooling plate 200 and electrically connected to the plurality of light emitting modules 100 through the cooling plate 200 to supply power.

[0050] The heater block 1000 according to an exemplary embodiment may include a light source or a heat source that emits light as a unit for supplying thermal energy in various heat treatment apparatuses such as an apparatus for heating a substrate to provide light energy to a heated object.

[0051] The cooling plate 200 may be provided with a cooling channel 211 through which cooling water flows to absorb and remove heat energy generated in the plurality of light emitting modules 100 and / or the plurality of power supply modules 300 mounted on the cooling plate 200, or heat energy transferred from the light emitting modules 100, or heat energy transmitted by a heated object, thereby allowing the plurality of light emitting modules 100 and / or the plurality of power supply modules 300 to maintain a constant temperature.

[0052] The cooling plate 200 may include a cooling water inlet 230 and a cooling water outlet 240, the cooling water inlet 230 supplies cooling water flowing through the cooling channel, and the cooling water that performs heat exchange with the plurality of light emitting modules 100 and / or the plurality of power supply modules 300 is discharged through the cooling water outlet 240. The cooling plate 200 may further include: a circulation pipe connecting the cooling water inlet 230 to the cooling water outlet 240 to circulate the cooling water; a temperature controller connected to the circulation pipe to control the temperature of the cooling water; and a cooling water filter. In addition to process cooling water (PCW) or water, various refrigerants may also be used as cooling water.

[0053] The plurality of light emitting modules 100 may act as a light source or a heat source, which emits light to a heated object to heat the heated object, thereby performing a heat treatment. The plurality of light emitting modules 100 may be separated independently from each other and individually mounted to or removed from the cooling plate 200. The plurality of light emitting modules 100 may be disposed on a first surface of the cooling plate 200 and in contact with each other, so that the heat generated in the process of converting electrical energy into light energy by the plurality of light emitting modules 100 may be transferred to the cooling plate 200 and then removed by heat exchange with each other.

[0054] The plurality of power supply modules 300 may be electrically connected to the plurality of corresponding light emitting modules 100 to supply power, and the plurality of power supply modules 300 may individually supply power to the plurality of light emitting modules 100, or may supply power to a group of light emitting modules in which some of the plurality of light emitting modules 100 are grouped. The plurality of power supply modules 300 may be independently separated from each other and individually mounted to or separated from the cooling plate 200. The plurality of power supply modules 300 may be disposed on the second surface of the cooling plate 200 so as to contact each other, and thus, heat generated from the plurality of power supply modules 300 may be transferred to the cooling plate 200 and then removed through heat exchange.

[0055] The plurality of light emitting modules 100 and / or the plurality of power supply modules 300 can be separated independently from each other and individually mounted to or detached from the cooling plate 200, so when some of the light emitting modules 100 or the power supply modules 300 fail or performance deteriorates, the corresponding light emitting modules 100 or the power supply modules 300 can be replaced or individually repaired. Therefore, the heater block can be conveniently repaired and maintained to effectively manage heat.

[0056] In the present disclosure, the plurality of light emitting modules 100 and the plurality of power supply modules 300 may be configured to be mounted on a first surface and a second surface of the cooling plate 200, the first surface and the second surface facing each other relative to the cooling plate 200, so that the cooling plate 200 can stably support the plurality of light emitting modules 100 and the plurality of power supply modules 300. In addition, the cooling plate 200 can separate the plurality of light emitting modules 100 and the plurality of power supply modules 300 from each other on two surfaces to support the plurality of light emitting modules 100 and the plurality of power supply modules 300, thereby effectively removing the heat generated from the plurality of light emitting modules 100 and the plurality of power supply modules 300. The light emitting modules 100 and the plurality of power supply modules 300 do not accumulate heat. For example, if the plurality of light emitting modules 100 and the plurality of power supply modules 300 are mounted on one surface of the cooling plate 200, the heat generated by the modules of the plurality of light emitting modules 100 and the plurality of power supply modules 300 that are arranged away from the cooling plate 200 may not be guided out and accumulated. Additionally, heat may accumulate on contact surfaces of other modules, and thus, heat may accumulate without effective heat dissipation as a whole.

[0057] If the heat generated by the plurality of light emitting modules 100 and the plurality of light emitting modules 100 is not effectively dissipated, the operation of the plurality of power supply modules 300 and / or the plurality of light emitting modules 100 may be affected by the accumulated heat to cause unstable power supply or deterioration of emission output. In addition, the plurality of power supply modules 300 may pass through the cooling plate 200 to supply power to the plurality of light emitting modules 100, but the electrical connection for supplying power may be partially short-circuited due to the accumulated heat, resulting in a limitation in durability.

[0058] However, in the present disclosure, the cooling plate 200 can be disposed between the plurality of light emitting modules 100 and the plurality of power supply modules 300, and thus, the cooling plate 200 can be in contact with each of the plurality of light emitting modules 100 and the plurality of power supply modules 300 to effectively dissipate heat generated by the plurality of light emitting modules 100 and the plurality of power supply modules 300.

[0059] In order to improve the temperature uniformity of a heated object such as a substrate, a plurality of light emitting modules 100 and a plurality of power supply modules 300 may be arranged two-dimensionally and selectively controlled for each region. In this case, heat may accumulate in the central region of the plurality of light emitting modules 100 and the plurality of power supply modules 300 arranged two-dimensionally, but the cooling plate 200 may suppress the heat accumulation by directly exchanging heat with the plurality of light emitting modules 100 and the plurality of power supply modules 300, thereby effectively dissipating the heat, so that the heating temperature and power of each region may be precisely controlled, thereby improving the temperature uniformity of the heated object.

[0060] Each of the plurality of power supply modules 300 detachably and independently disposed on the second surface of the cooling plate 200 may include a terminal portion 320 connected to an external power source to receive power, a main body portion 310 supporting the terminal portion 320, and an electrode rod portion 330 electrically connected to the terminal portion 320 to extend from the bottom surface of the main body portion 310. In addition, the electrode rod portion 330 may be connected to the corresponding light emitting module 100 by passing through the cooling plate 200.

[0061] The terminal part 320 may be connected to a power line extending from an external power source to receive power required to generate light from the corresponding light emitting module 100. The terminal part 320 may be provided with a connection portion into which a socket terminal of the power line is inserted and connected.

[0062] The main body 310 may support the terminal part 320 disposed on the top surface, and may provide a switch part for transmitting power supplied to the terminal part 320 to the wiring part of the electrode rod part 330, and selectively short-circuiting the supplied power. The main body 310 may also have a fixing hole, into which a fixing member for fixing the power supply module 300 to the cooling plate 200 is inserted.

[0063] The electrode rod portion 330 electrically connected to the terminal portion 320 to extend downward from the bottom surface of the main body portion 310 may pass through the cooling plate 200 in the thickness direction and be connected to the electrode terminal portions 111a and 111b of the corresponding light emitting module 100 powered by the power supply module 300. Since the cooling plate 200 is made of a conductive material (e.g., a metal such as copper or stainless steel) so that heat is smoothly transferred, the electrode rod portion 330 may include a metal rod portion that transmits power supplied from the terminal portion 320 and a layer of an insulating coating covering the side surface of the metal rod portion except the end portion so that the electrode rod portion 330 is not electrically short-circuited with the cooling plate 200.

[0064] In the present specification, the plurality of light emitting modules 100 and the plurality of power supply modules 300 may be used to independently or selectively control the light emitting states of the plurality of light emitting modules 100 in each region, thereby improving heating uniformity or temperature uniformity of the light emitting modules 100 .

[0065] In order to further subdivide the control area, each of the plurality of light emitting modules 100 may include a first light emitting portion and a second light emitting portion that emit light independently of each other. The first light emitting portion and the second light emitting portion may be set to equally divide the emission surface of the light emitting module into two surfaces, or may be set to divide the emission surface at different ratios. Each of the first light emitting portion and the second light emitting portion may include a plurality of light emitting semiconductor components that provide light energy. The plurality of light emitting semiconductor components may be provided by installing a plurality of chips, or a plurality of chips may be provided in the form of a single component.

[0066] In order to make the first light emitting portion and the second light emitting portion emit light independently of each other, the terminal portion 320 may include a first terminal portion 321 and a second terminal portion 322 that receive power supplied to the first and second light emitting portions, respectively, and the electrode rod portion 330 may include a first electrode rod portion 331 and a second electrode rod portion 332 that are electrically connected to the first terminal portion 321 and the second terminal portion 322. Each of the first electrode rod portion 331 and the second electrode rod portion 332 may be set as a pair of positive and negative electrodes, and power supplied to the first terminal portion 321 and the second terminal portion 322 through the cooling plate 200 may be transmitted to the corresponding first and second light emitting portions.

[0067] The cooling plate 200 may include a first plate 210 and a second plate 220, the first plate 210 having a plurality of upper protrusions 212 protruding from a top surface to define a side of a cooling channel 211, and the second plate 220 being disposed on the first plate 210 to be connected to each other and configured to define the top surface of the cooling channel. That is, the cooling channel 211 may be sufficient as long as the cooling water flows to be surrounded by the top surface of the first plate 210, the upper protrusions 212, and the bottom surface of the second plate. The structure or formation position of the upper protrusions 212, etc. (e.g., the bottom surface of the second plate 220, etc.) for defining the cooling channel 211 may vary.

[0068] In the case where the cooling channel 211 is a linear channel of a straight or curved shape formed by a pipe or a borehole inserted between the cooling water inlet 230 and the cooling water outlet 240, the cooling water can flow quickly along the linear channel from the cooling water inlet 230 and the cooling water outlet 240. Therefore, the cooling water may not have enough time to exchange heat with the first plate and / or the second plate, and it is inevitable to have a temperature gradient (or temperature difference) from the cooling water inlet 230 to the cooling water outlet 240. On the other hand, if the cooling water flows through a wide space defined in the central portion between the first plate and the second plate, and the first plate and the second plate are coupled to each other at the edge or boundary of the cooling plate 200, the contact area of ​​the area of ​​the flowing cooling water in contact with the first plate and / or the second plate may not be large, and therefore, heat exchange may not occur well.

[0069] If the cooling water does not flow along the shortest path (or a path close to the shortest path) between the cooling water inlet 230 on one side of the cooling plate 200 and the cooling water outlet 240 on the other side of the cooling plate 200 and passes through the cooling plate 200, but flows in a detour continuously, the cooling area of ​​the cooling water heat exchange can be maximized, thereby improving the heat dissipation effect of the cooling plate 200.

[0070] like Figure 3A As shown, Figure 3A 2 is a plan view showing the top surface of the first plate 210, which may be provided with a plurality of upper protrusions 212 defining the sides of the cooling channel 211. The plurality of upper protrusions 212 may be spaced apart from each other and provided on the top surface of the first plate 210, such that the empty spaces between the plurality of upper protrusions 212 define the cooling channel 211. When cooling water is introduced into the top of the first plate 210 through the cooling water inlet 230 provided on one side of the cooling plate 200, the cooling water flowing to the cooling water outlet 240 provided on the other side of the cooling plate 200 may have no choice but to bypass and unfold while continuously colliding with the plurality of upper protrusions 212, effectively increasing the contact area or cooling area between the cooling water and the first plate 210.

[0071] The first plate 210 and the second plate 220 defining the cooling plate 200 may be combined with each other to be integrated with each other. Since the first plate 210 and the second plate 220 are not only coupled at the edges but also supported by the upper protrusions 212 therein, the cooling plate 200 may be more stable in structure.

[0072] The bottom surface of the second plate 220 constituting the cooling plate 200 by being connected to the first plate 210 may define the top surface of the cooling channel, and the bottom surface of the second plate 220 may be in direct contact with the plurality of upper protrusions 212, so that the heat of the second plate 220 may be quickly transferred to the upper protrusions 212. That is, the cooling water may directly exchange heat while being in contact with the first plate 210, the top surface of the upper protrusions 212, and the bottom surface of the second plate 220, and the first plate 210 and the second plate 220 may be thermally connected to each other through the upper protrusions 212 to provide the cooling plate 200 having an integral structure capable of maintaining a uniform temperature. Each of the first plate 210 and the second plate 220 may be made of a metal having high thermal conductivity, and the first plate 210 and the second plate 220 may be combined with each other by soldering or welding, and therefore, the first plate 210 and the second plate 220 may be completely combined with each other so that heat transfer between the first plate 210 and the second plate 220 occurs faster.

[0073] Since the light emitting module 100 used as a heat source in the heater block 1000 generates more heat than the power supply module 300, it is necessary to dissipate the heat emitted from the light emitting module 100 more quickly. Therefore, a plurality of light emitting modules 100 may be disposed on the first plate 210 and the upper protrusion 212 that allow faster heat dissipation by contact with cooling water on the top surface, and a plurality of power supply modules 300 may be disposed on the second plate 220.

[0074] The first plate 210 and the second plate 220 may be made of the same material or different materials. The first plate 210 requiring relatively excellent heat dissipation characteristics may be made of copper, which is a metal with good thermal conductivity. The second plate 220 capable of enhancing the mechanical stability of the cooling plate 200 may be made of stainless steel, which is a metal with excellent mechanical strength and chemical stability.

[0075] The cooling plate 200 may further include a plurality of first through holes 250 passing through a region on which the plurality of upper protrusions 212 are disposed, and a portion of the plurality of power supplier modules 300 may be inserted into the plurality of first through holes 250 and electrically connected to the corresponding plurality of light emitting modules 100 .

[0076] In order to allow the plurality of power supply modules 300 to pass through the cooling plate 200, thereby supplying power to the plurality of light-emitting modules 100, a portion of the plurality of power supply modules 300 (e.g., the electrode rod portion 330) must pass through the first plate 210 and the second plate 220. If the electrode rod portion 330 passes through the region of the cooling channel 211, an electrical short circuit may occur between the electrode rod portion 330 and the cooling water, or water leakage may occur at the position where the electrode rod portion 330 is inserted. To address this limitation, in the present disclosure, a plurality of first through holes 250 may be defined to pass through the first plate 210 and the second plate 220 on the region where the upper protrusion 212 is set, and the electrode rod portion 330 in the plurality of power supply modules 300 may be inserted into the plurality of first through holes 250 to be electrically connected to the plurality of corresponding light-emitting modules 100. In order to define the first through holes 250, lower first through holes 250a may be defined by the upper protrusions 212 of the first plate 210 to correspond to the position and number of the electrode rod parts 330, and upper first through holes 250b may be defined in the region of the second plate 220 combined with the upper protrusions 212. After combining the first plate 210 to the second plate 220, the first through holes 250 may be defined by drilling holes in the region where the plurality of upper protrusions 212 are provided.

[0077] Since the electrode rod portion 330 is inserted into the first through hole 250 through the plurality of upper protrusions 212 as the portion where the first plate 210 and the second plate 220 are coupled to each other, not only will the electrode rod portion 330 not be in direct contact with the cooling water, but the first through hole 250 will not be exposed to the cooling water, thereby eliminating the possibility of cooling water leakage.

[0078] The cooling plate 200 may further include a plurality of second through holes 260 passing through a region where the plurality of upper protrusions 212 are provided, and a plurality of fixing members at least partially inserted into the plurality of second through holes 260 to fix the plurality of light emitting modules 100 or the light emitting modules 100 .

[0079] The plurality of light emitting modules 100 and the plurality of power supply modules 300 may be configured to be arranged two-dimensionally facing each other on the first and second surfaces of the cooling plate 200. In order to keep the plurality of light emitting modules 100 and the plurality of power supply modules 300 corresponding to each other in an electrically connected state, the plurality of light emitting modules 100 and the plurality of power supply modules 300 may need to be stably fixed on the first and second surfaces of the cooling plate 200, respectively.

[0080] To prevent cooling water leakage, the second through holes 260 may pass through the region provided with the upper protrusions 212. The second through holes 260 may completely or partially pass through the cooling plate 200 depending on a method of fixing the light emitting modules 100 and / or the power supply modules 300 by at least partially inserting a fixing member.

[0081] In order to define the plurality of second through holes 260, lower second through holes 260a passing through the upper protrusions 212 of the first plate 210 may be defined, and upper second through holes 250b may be defined in a region of the second plate 220 engaged with the upper protrusions 212. After the first plate 210 is coupled to the second plate 220, the second through holes 260 may be defined by drilling holes in a region where the plurality of upper protrusions 212 are provided.

[0082] A plurality of fixing members may be at least partially inserted into the plurality of second through holes 260, and one end of each of the plurality of fixing members may be inserted and fixed into a fixing groove defined in each of the plurality of light emitting assemblies or the plurality of power supply modules 300, so as to fix the plurality of light emitting modules 100 or the plurality of power supply modules 300 to the cooling plate 200. The fixing member may be a nut having threads on an outer surface, and threads corresponding to the threads on the outer surface of the fixing member may be provided on the inner surface of the second through hole 260 or the fixing groove.

[0083] like Figure 3B As shown, the first board 210 may further include a lower protrusion 213 protruding from the bottom surface of the first board 210 to define a groove 214 in which the plurality of light emitting modules 100 are mounted.

[0084] A plurality of light emitting modules 100 may be set on the first surface of the cooling plate 200 facing the heated object to emit light to the heated object. In order to uniformly heat the heated object such as a substrate, the plurality of light emitting modules 100 must be uniformly arranged two-dimensionally on the first surface of the cooling plate 200 (or the bottom surface of the first plate 210). Therefore, in the present disclosure, in order to determine the correct position at which the plurality of light emitting modules 100 are to be installed, the plurality of light emitting modules 100 may be inserted and installed in a plurality of grooves 214 defined between the lower protrusions 213 protruding from the bottom surface of the light emitting module 100. The first plate 210 enables the plurality of light emitting modules 100 to be uniformly arranged at predetermined positions on the bottom surface of the first plate 210. When the light emitting module 100 is inserted into the groove 214, the heat generated from the light emitting module 100 can be quickly dissipated to the side of the light emitting module 100 of the cooling plate 200 not only through the bottom surface of the first plate 210 in contact with the bottom surface, but also through the lower protrusion 213 in contact with or close to the side of the light emitting module 100.

[0085] Similar to the recess 214 for accommodating the plurality of light emitting modules 100, the second plate 220 may include a top recess 221 defined in the top surface of the second plate 220 to accommodate the plurality of power supply modules 300. The top recess 221 may be set as a plurality of top recesses 221 to individually accommodate the plurality of power supply modules 300, or may be set as a single top recess 221 to integrally accommodate the plurality of power supply modules 300. The second plate 220 may further include a cover (not shown) covering the top recess 221 to protect the plurality of power supply modules 300 accommodated in the top recess 221.

[0086] Each of the plurality of light emitting modules 100 and each of the plurality of power supplier modules 300 may have a polygonal shape.

[0087] In order to uniformly heat a heated object such as a substrate, not only a plurality of light emitting modules 100 uniformly arranged two-dimensionally are required, but also a plurality of power supply modules 300 that supply power to the corresponding plurality of light emitting modules 100 through the cooling plate 200 may be uniformly arranged two-dimensionally. Not only the plurality of light emitting modules 100 and the plurality of power supply modules 300 need to be uniformly distributed two-dimensionally, but also the gaps between the plurality of light emitting modules 100 and the gaps between the plurality of power supply modules 300 need to be constant two-dimensionally. If the gaps between the light emitting modules 100 differ according to directions and positions, light emission may not occur in the gap regions between the light emitting modules 100, and therefore, light emission on the entire emission surface of the heater block 1000 may not be uniform.

[0088] In the case where the plane shape (the outermost shape when viewed from above) of the light emitting module 100 and the power supply module 300 is not a polygon but a circle, etc., the gap between the light emitting module 100 and the power supply module 300 and the corresponding power supply modules 300 adjacent to each other can be changed according to the direction to achieve uniform light emission. For example, in the horizontal and vertical directions, the gap between adjacent light emitting modules 100 can be the smallest, and in the direction inclined at about 45 degrees, the gap between adjacent light emitting modules 100 can be the largest.

[0089] When the planar shapes of the light emitting modules 100 and the corresponding power supply modules 300 have the same polygonal shape, not only are the plurality of light emitting modules 100 and the plurality of power supply modules 300 evenly distributed on both surfaces of the cooling plate 200, but also the gaps between the plurality of light emitting modules 100 and the plurality of power supply modules 300 are evenly distributed. Due to this arrangement structure, the heater block 1000 can provide uniform heat or light energy to the heated object.

[0090] refer to Figure 2 and Figure 3B, each of the plurality of light emitting modules 100 and the plurality of power supply modules 300 may have a hexagonal shape. When each of the plurality of light emitting modules 100 and the plurality of light emitting module power supply modules 300 has a hexagonal outermost shape, not only can two-dimensional expansion be easily achieved, but also the overall arrangement of the plurality of light emitting modules 100 or the plurality of light emitting module power supply modules 300 becomes easy.

[0091] The plurality of light emitting modules 100 and the plurality of power supplier modules 300 may be two-dimensionally arranged to provide an array shape having a honeycomb structure.

[0092] In a honeycomb structure array in which a plurality of light emitting modules 100 and a plurality of power supply modules 300 having a hexagonal planar shape are two-dimensionally arranged, the entire circumference of the light emitting module 100 can be surrounded by a minimum number (6) of light emitting modules 100. The number of light emitting modules 100 is equal to the number of corners in the hexagonal shape. Therefore, the average density and luminous efficiency (or heating efficiency) of the light emitting modules 100 per unit area can be increased.

[0093] If each of the plurality of light emitting modules 100 has a polygonal (eg, hexagonal) shape, the recesses 214 defined by the lower protrusions 213 may also be two-dimensionally arranged in a polygonal (eg, hexagonal) shape.

[0094] Each of the plurality of light emitting modules 100 may include a light emitting semiconductor component 120 that emits light, circuit wiring portions 111a and 111b that transmit power supplied from the plurality of power supply modules 300 to the light emitting semiconductor component 120, and a metal plate 110 that supports the circuit wiring portions 111a and 111b and is made of a thermally conductive metal.

[0095] The light emitting semiconductor component 120 may be a semiconductor component that emits light when electrons provided by an n-type semiconductor layer and holes provided by a p-type semiconductor layer are coupled to each other, and may include a light emitting diode (LED) or a laser diode (LD). In order to be used as a heat source or light source that uniformly provides energy to a large area of ​​a heated object in the heater block 1000, it must have the form of a large area of ​​a surface light source. To this end, the light emitting module 100 may need to be provided with a light emitting semiconductor component 120 manufactured in a two-dimensional array shape.

[0096] A window 130 that allows light emitted from the light emitting semiconductor component 120 to pass therethrough and protects the light emitting semiconductor component 120 may be disposed on an emission surface of the light emitting semiconductor component 120 .

[0097] The circuit wiring parts 111a and 111b may be provided with a circuit wiring layer made of a conductive metal for transmitting power, an insulating layer provided above or below the circuit wiring layer, and an insulating substrate supporting the circuit wiring layer and the insulating layer. The power provided by the electrode rod parts 330 in the plurality of power supply modules 300 is transmitted to the light emitting semiconductor component 120.

[0098] The light emitting semiconductor component 120 may include an n-type electrode 121b connected to the n-type semiconductor layer and a p-type electrode 121a connected to the p-type semiconductor layer. The n-type electrode 121b may be electrically connected to the n-type circuit wiring portion 111b and the n-type electrode rod portion 331b to be in a low potential state, and the p-type electrode 121a may be electrically connected to the p-type circuit wiring portion 111a and the p-type electrode rod portion 331a to be in a high potential state.

[0099] The light emitting module 100 may be disposed on the bottom surface of the first board 210, but since the light emitting semiconductor components 120 and the circuit wiring portions 111a and 111b do not have a heat conductive material distributed over the entire surface, the light emitting semiconductor components 120 and the circuit wiring portions 111a and 111b may not be able to quickly transfer heat to the bottom surface of the first board 210. However, in the present disclosure, the metal plate 110 may be configured to integrally support the circuit wiring portions 111a and 111b and the light emitting semiconductor components 120 connected thereto, and the metal plate 110 may be made of a heat conductive metal, so that the heat generated by the light emitting semiconductor components 120 may be quickly transferred to the first board 210 to be dissipated to the outside. If the surface facing the bottom surface of the first board 210 is an exposed metal surface, the stacked structure of the circuit wiring portions 111a and 111b and the metal plate 110 may be configured in the form of a metal printed circuit board (PCB).

[0100] For rapid heat exchange, the joint surfaces of the light emitting module 100 and the first plate 210 that contact each other may be made of metal on each of the two surfaces. Since the surface structure of the metal surface has roughness, when the metal surfaces may contact each other, a gap may be generated at the interface between the metal surfaces due to the surface roughness. The air filled in the gap generated at the interface between the light emitting module 100 and the first plate 210 may have a low thermal conductivity, and therefore, the thermal conductivity between the light emitting module 100 and the first plate 210 may be reduced. Specifically, when the heater block 1000 is set in a processing space maintained in a vacuum state and used, such as a device for heating a substrate, the gap generated at the interface between the light emitting module 100 and the first plate 210 may be in a vacuum state to significantly reduce the heat exchange between the light emitting module 100 and the first plate 210, which may be a serious problem. In order to solve this limitation, an elastic heat dissipation pad may be provided between the cooling plate 200 and the plurality of light emitting modules 100.

[0101] When a heat dissipation pad having elasticity (e.g., a silicone heat dissipation pad) is provided between the light emitting module 100 and the first plate 210, the heat dissipation pad can be filled into the gap caused by the surface roughness of the light. The heat dissipation pad is elastically deformed at the same time to increase the thermal contact area between the light emitting module 100 and the first plate 210, thereby effectively improving the heat exchange efficiency. In addition, sliding may occur between the metal plate 110 and the first plate 210, causing the electrical connection to deviate from the correct position. If an elastic heat dissipation pad is provided between the light emitting module 100 and the first plate 210, sliding can be prevented and the correct position can be maintained.

[0102] like Figure 3B As shown, when a plurality of light emitting modules 100 are inserted and mounted in a plurality of recesses 216 having a polygonal shape, the heat dissipation pad may be set to the same polygonal shape as the plurality of light emitting module recesses 216. and inserted into the plurality of recesses 216. Here, the light emitting pad may have a through hole corresponding to each of the first through hole 250 and the second through hole 260 for electrical connection and fixation of the plurality of light emitting modules 100.

[0103] The light emitting semiconductor component 120 may include a vertical cavity surface emitting laser component, and may be flip-chip bonded to the circuit wiring portions 111 a and 111 b .

[0104] Unlike the side-emitting semiconductor component 120, the vertical-cavity surface-emitting laser (VCSEL) component used as the light-emitting semiconductor component 120 may have a structure that emits a laser beam in a direction perpendicular to the heated object (e.g., substrate), which is different from a side-emitting laser such as a distributed feedback laser diode (DFBLD) or a Fabry-Perot laser diode (FPLD). Since the laser beam is emitted in a direction perpendicular to the heated object, it may have a circularly symmetrical distribution, and therefore, light uniformity may be better than that of a side-emitting laser, and wafer-level processing and manufacturing using a single silicon wafer (or circular substrate) may be achieved. In addition, since the resonance distance becomes very short, the critical current may be reduced, and the total output may be reduced.

[0105] In particular, in order to be used as a heating light source in a device for heating a substrate, a surface light source having a large area must be formed. To this end, the light emitting semiconductor component 120 may need to be manufactured as a two-dimensional array type parallel light source. In the case of a side-emitting laser, since the laser emits light through the side of the structure laminated on the substrate, it may be difficult to manufacture a two-dimensional array type parallel light source. On the other hand, a vertical cavity surface emitting laser (VCSEL) can be easily manufactured as a two-dimensional array type parallel light source of a desired shape because the structure laminated on the substrate is formed into a desired structure.

[0106] In addition, the vertical cavity surface emitting laser (VCSEL) can have a light source irradiation angle of about 20° to about 25° relative to the vertical direction of the emitting surface, which is much narrower than the irradiation angle of about 30° to about 40° of the LED. Therefore, the light can have good straightness. This enables the two-dimensional array type parallel light source to emit high-power and high-precision light to the heated object, and can emit uniform light.

[0107] Since the light emitting module 100 disposed on the first surface (or bottom surface) of the cooling plate 200 emits light in a direction opposite to the first surface (or downward direction), the light emitting semiconductor component 120 may have an emission surface facing downward.

[0108] In the case of wire bonding as a method of electrically connecting the light-emitting semiconductor component to the circuit wiring portion, bonding can generally be performed in the lateral direction of the light-emitting semiconductor component, and therefore, the area may inevitably increase two-dimensionally, resulting in a low component density within the light-emitting module. In addition, since the wires are exposed to the outside, it may be difficult to use the wires in a vacuum state like the device for heating the substrate due to reasons such as arcing and because a plurality of wire bonds have been performed. This limitation can be solved by connecting the light-emitting semiconductor component 120 to the circuit wiring portions 111a and 111b using flip-chip bonding, in which solder bumps are provided on the surface electrodes of the semiconductor chip, while the semiconductor chip is flipped, and then directly connected to the wiring electrodes through a heat treatment process.

[0109] When the light emitting semiconductor component 120 is flip-chip bonded to the terminal portions 111a and 111b of the circuit wiring portion that is powered by the electrode rod portion 330 connected to the rear surface of the light emitting module 100, an electrical connection portion such as a solder bump can be provided on the front surface (the surface opposite to the emission surface) of the light emitting semiconductor component 120, and thus, the component density within the light emitting module 100 can be increased. In addition, since the electrical connection such as the solder bump is not exposed to the outside, the heater block 1000 can be applied to a vacuum process and is easy to handle and has excellent reliability and life. In addition, the shortest thermal path from the light emitting semiconductor component 120 to the cooling plate 200 can be formed by the flip-chip bonding structure, and thus, the light emitting semiconductor component 120 or the light emitting module 100 can have low thermal resistance characteristics and excellent heat dissipation characteristics to improve the reliability of high temperature performance.

[0110] The metal plate 110 may be electrically short-circuited with the light emitting semiconductor component 120 and the circuit wiring portions 111a and 111b. For heat dissipation of the light emitting semiconductor component 120, the metal plate 110 must be in thermal contact with the bottom surface of the first board 210, and must be separated and short-circuited from the electrical connection path that powers the light emitting semiconductor component 120. However, the metal plate 111 and the circuit wiring portions 111a and 111b may be electrically short-circuited due to the insulating substrate of the circuit wiring portions.

[0111] The metal plate 110 may be provided with through holes corresponding to the first through holes 250 and the second through holes 260 for electrical connection and fixation of the plurality of light emitting modules 100, and thus the electrode rod portion 330 and the fixing member may be inserted. The inner surfaces of the through holes defined in the metal plate 110 and the electrode rod portion 330 may be insulated by an insulating coating, and the exposed ends of the metal rod portions may be connected to the circuit wiring portions 111a and 111b.

[0112] Figure 5 is a view illustrating a configuration of an apparatus for heating a substrate according to another exemplary embodiment.

[0113] In describing an apparatus for heating a substrate according to another exemplary embodiment, details overlapping those previously described with respect to the apparatus for heating a substrate according to the exemplary embodiment will be omitted.

[0114] refer to Figure 5 According to another exemplary embodiment, an apparatus for heating a substrate may include a chamber 2000 providing a heat treatment space, a substrate support 3000 disposed in the heat treatment space to support a substrate S, and a heater block 1000 according to an exemplary embodiment, which is disposed facing the substrate support 3000 to emit light onto a first surface of the substrate S, thereby heating the substrate S.

[0115] The apparatus for heating a substrate may heat the substrate S for various processes by heat-treating the substrate S or forming a thin film on the substrate S. For example, the apparatus for heating a substrate may be a rapid thermal process (RTP) apparatus that generates high-temperature heat to rapidly heat-treat the substrate S.

[0116] The chamber 2000 may provide a heat treatment space isolated from the outside and may be controlled with various gas pressures. To prevent contamination of the substrate S, the heat treatment space may be maintained in a vacuum state, or an inert gas or the like may be introduced to maintain an inert environment.

[0117] The substrate support 3000 may support the substrate S during the heat treatment process. The substrate support 3000 may be configured to support the edge of the lower portion of the substrate S, and thus, a portion (or region) of the bottom surface of the substrate S that is not in contact with the substrate support 3000 may be exposed. For example, the substrate support 3000 may be configured to have a hollow shape with an open center, and thus, when the substrate S is seated on the substrate support 3000, an edge portion of the bottom surface of the substrate S may be in contact with the substrate support 3000, and the remaining portion may be in contact with the substrate support 3000.

[0118] The heater block 1000 may be a heater block according to an exemplary embodiment, and thus may be disposed facing the substrate support 3000, and may heat the substrate S by emitting light onto a first surface (e.g., a top surface) of the substrate S. Here, the heater block 1000 may be used to provide heat energy to the substrate S, and a plurality of light emitting modules 100 may emit light toward the first surface of the substrate S and be disposed to be spaced apart from each other on the upper side of the substrate S. The light energy generated by the light emitting module 100 may be provided through the first surface of the substrate S mounted on the substrate support 3000 to heat the substrate S.

[0119] The apparatus for heating a substrate may further include a pyrometer 4100 disposed on a second surface of the substrate S opposite to the first surface to measure a temperature of the substrate S.

[0120] The pyrometer 4100 may be a pyrometer disposed on a second surface (e.g., bottom surface) opposite to the first surface of the substrate S and configured to measure the temperature of the substrate S, and may detect light incident from the substrate S to measure the temperature. For example, the pyrometer 4100 may receive incident radiation light from the substrate S to measure the radiation energy (or light amount) of the radiation light. A plurality of pyrometers 4110, 4120, and 4130 may be arranged on the lower side of the substrate S mounted on the substrate support 3000, so that the radiation energy and reflectivity at the facing portion may be obtained, and the temperature of the substrate S at each position (or for each region) may be measured at the corresponding positions of the pyrometers 4110, 4120, and 4130.

[0121] The apparatus for heating a substrate may further include a heating controller 4000 that selectively controls power supplied to each of the plurality of power supplier modules 300 based on the temperature measured by the pyrometer 4100 .

[0122] The heating controller 4000 may control the power supplied to the plurality of light emitting modules 100 corresponding to the temperature measurement positions based on the temperatures respectively measured by the plurality of pyrometers 4100. Here, the plurality of pyrometers 4100 may measure the amount of light incident from the substrate S to calculate the temperature, and the heating controller 4000 may control the power input to the plurality of corresponding light emitting modules 100 using the calculated temperature.

[0123] The heating controller 4000 may include a temperature setting part 4200 that sets a target temperature of the substrate S and a power determination part 4300 that compares the target temperature set in the temperature setting part 4200 with the temperature measured by the pyrometer 4100 to determine a power supply value. The temperature setting part 4200 may set the target temperature of the substrate S, and may also set the temperature of the substrate S to be reached by heating of the heater block 1000.

[0124] The power determination part 4300 may determine the power supply value by comparing the target temperature set in the temperature setting part 4200 with the temperature measured by the pyrometer 4100, and the determined power may be supplied from the power supplier 4400. The power supplier 4400 may include a first power supplier 4410 and a second power supplier 4420 that independently or selectively supplies power to a first light emitting part and a second light emitting part that are provided in the light emitting module 100 and emit light independently of each other. Therefore, the determined power may be supplied to the light emitting module 100 provided on an area of ​​the heater block 1000 corresponding to (or opposite to) a portion of the substrate S measured by the pyrometers 4110 to 4130, thereby controlling the heating temperature area and compensating for the temperature of the portion of the substrate S measured by the pyrometers 4110 to 4130.

[0125] The heating controller 4000 may simultaneously control the entire plurality of light emitting modules 100 according to the measured temperature or may divide the plurality of light emitting modules 100 into a plurality of groups (e.g., a center area group and an edge area group, etc.) to independently control the operation and power supply of each group according to the temperature of each portion of the substrate S corresponding to the position provided by each of the plurality of pyrometers 4110 to 4130. Likewise, the first and second light emitting portions provided in the light emitting module 100 may be simultaneously controlled as a whole or may be controlled for each group after grouping.

[0126] As described above, in the apparatus for heating a substrate according to an exemplary embodiment, the temperature measured by the pyrometer can be used to control the heating temperature of a plurality of light-emitting modules arranged two-dimensionally to improve the temperature uniformity of the substrate during the heating process. Here, the pyrometer can be provided in plurality so as to be provided for each region, and the plurality of light-emitting modules can be more accurately controlled for each subdivided region based on the temperature measured by each of the plurality of pyrometers to improve process characteristics, such as excellent temperature uniformity of the substrate.

[0127] In the heater block and the device for heating a substrate having the heater block according to the exemplary embodiment, due to the simple assembly structure of the plurality of light emitting modules, the heat generated from the plurality of light emitting modules and the plurality of power supply modules can be effectively removed. In this way, the problem of reduced power of the light emitting module and unstable power supply caused by insufficient heat dissipation can be solved.

[0128] In addition, the plurality of power supply modules can independently supply power to each of the plurality of corresponding light-emitting modules to selectively control the plurality of light-emitting modules, and thus the heating temperature can be adjusted by distinguishing the positions of the plurality of light-emitting modules. The uniformity of heating of a heated object such as a substrate is improved. In addition, at least one of the first light-emitting portion or the second light-emitting portion constituting each of the plurality of light-emitting modules to independently emit light can be divided into a plurality of control areas to be independently controlled, so that the control areas can be subdivided to further improve the uniformity of heating of the heated object.

[0129] In addition, the light-emitting semiconductor component that serves as a heat source or light source of the heater block can be directly flip-chip bonded to the terminal portion of the circuit wiring portion to respond to a vacuum process that is impossible in typical wiring. In addition, the output can be easily increased, and damage to the circuit wiring (including wires) used for power supply can also be prevented. In particular, when a vertical-cavity surface-emitting laser (VCSEL) of a light-emitting semiconductor component is used, power consumption can be reduced to effectively control optical characteristics compared to a typical halogen lamp or a general light-emitting diode (LED) due to the linearity of light and easy emission of a specific wavelength.

[0130] In an apparatus for heating a substrate according to an exemplary embodiment, the temperature measured by the pyrometer can be used to control the heating temperature of a plurality of light-emitting modules arranged two-dimensionally to improve the temperature uniformity of the substrate during processing. Here, the pyrometer can be provided in plurality so as to be provided for each region, and the plurality of light-emitting modules can be accurately controlled for each subdivided control region based on the temperature measured by each of the plurality of pyrometers to improve process characteristics, such as excellent temperature uniformity of the substrate.

[0131] The term "up to" used in the above description includes direct contact and indirect contact at a position relative to the upper part and the lower part. Not only the entire top surface or the entire bottom surface can be positioned, but also part of the top surface or the bottom surface can be positioned and used in a manner relative to or in direct contact with the top surface or the bottom surface. In addition, terms such as "top", "bottom", "front end", "rear end", "up", "down", "upper end", "lower end", etc. used in the above description are defined according to the accompanying drawings for convenience. The shape and position of each component are not limited by the term.

[0132] Although the embodiments have been described with reference to several illustrative embodiments thereof, the embodiments are not limited to the foregoing embodiments, and therefore, it should be understood that many other modifications and embodiments may be designed by those skilled in the art, which will fall within the hands of those skilled in the art. Therefore, the true scope of protection of the present invention should be determined by the technical scope of the appended claims.

Claims

1. A heater block, characterized in that: include: A cooling plate provided with a cooling channel through which cooling water flows; A plurality of light emitting modules are disposed on the first surface of the cooling plate to emit light to the object to be heated; and A plurality of power supply modules are arranged on the second surface of the cooling plate and are electrically connected to the plurality of light emitting modules through the cooling plate to supply power.

2. The heater block according to claim 1, characterized in that Each of the plurality of power supply modules comprises: A terminal part, connected to an external power source to receive power; a main body portion configured to support the terminal portion; and An electrode rod portion is electrically connected to the terminal portion and extends from the bottom surface of the main body portion, The electrode rod portion passes through the cooling plate and is connected to the corresponding light emitting module.

3. The heater block according to claim 2, characterized in that Each of the plurality of light-emitting modules includes a first light-emitting portion and a second light-emitting portion that emit light independently of each other. The terminal unit includes a first terminal unit and a second terminal unit, which respectively receive power supplied to the first light emitting unit and the second light emitting unit, and The electrode rod portion includes a first electrode rod portion and a second electrode rod portion, and the first electrode rod portion and the second electrode rod portion are electrically connected to the first terminal portion and the second terminal portion, respectively.

4. The heater block according to claim 1, characterized in that The cooling plate comprises: A first plate having a plurality of upper protrusions protruding from a top surface to define sides of the cooling channel; and A second plate is provided on the first plate to be connected to each other and is configured to define a top surface of the cooling channel.

5. The heater block according to claim 4, characterized in that wherein the cooling plate further comprises a plurality of first through holes passing through the area provided by the plurality of upper protrusions, Some of the plurality of power supply modules are inserted into the plurality of first through holes to be electrically connected to the plurality of corresponding light emitting modules.

6. The heater block according to claim 4, characterized in that The cooling plate comprises: a plurality of second through holes passing through an area provided by the plurality of upper protrusions; and A plurality of fixing members are at least partially inserted into the plurality of second through holes to fix the plurality of light emitting modules or the plurality of power supply modules.

7. The heater block according to claim 4, characterized in that The first plate further includes a lower protrusion protruding from the bottom surface to define a recess for mounting each of the plurality of light emitting modules.

8. The heater block according to claim 1, wherein: Each of the plurality of light emitting modules and the plurality of power supply modules has a polygonal shape.

9. The heater block according to claim 1, characterized in that The plurality of light emitting modules and the plurality of power supply modules are two-dimensionally arranged to provide an array shape having a honeycomb structure.

10. The heater block according to claim 1, wherein: Each of the plurality of light emitting modules comprises: a light emitting semiconductor component configured to emit light; a circuit wiring portion for transmitting power supplied from the plurality of power supply modules to the light emitting semiconductor components; and The metal plate is configured to support the circuit wiring portion and is made of a thermally conductive metal.

11. The heater block according to claim 10, characterized in that The light emitting semiconductor component comprises a vertical cavity surface emitting laser component and is flip-chip bonded to the circuit wiring portion.

12. The heater block according to claim 10, characterized in that The metal plate is electrically short-circuited with the light-emitting semiconductor component and the circuit wiring portion.

13. The heater block according to claim 1, wherein: It also includes an elastic heat dissipation pad arranged between the cooling plate and the plurality of light emitting modules.

14. A device for heating a substrate, characterized in that: include: a chamber configured to provide a heat treatment space; a substrate support configured to support the substrate disposed in the heat treatment space; and The heater block according to any one of claims 1 to 13, which is arranged to face the substrate support so as to emit light toward the first surface of the substrate and heat the substrate.

15. The device according to claim 14, characterized in that Also included is a pyrometer disposed on a second surface of the substrate facing the first surface to measure a temperature of the substrate.

16. The device according to claim 15, characterized in that Also included is a heating controller configured to selectively control power supplied to each of the plurality of power supply modules based on the temperature measured by the pyrometer.

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