High-performance image sensor packaging structure

Abstract

The invention provides a high-performance image sensor packaging structure, which belongs to the field of semiconductor packaging, and is characterized in that the upper surface of a substrate is coated with a high-reflection coating, so that light which is not captured by a photosensitive area can be reflected and reused, and the light utilization rate of the photosensitive area is improved; the substrate enclosing wall which is inclined inwards is arranged, so that light can be gathered to a photosensitive area to the maximum extent, and the photoelectric conversion efficiency is improved; the upper surface of the glass cover plate is arranged to be of a micro-convex structure, a certain lens effect is achieved, more light is gathered to a photosensitive area, and then the photoelectric conversion efficiency of the image sensor is improved; and the lower surface of the glass cover plate is coated with the anti-reflection coating, so that light loss caused by reflection can be reduced, and the photosensitive performance of the image sensor is further improved. According to the technical scheme, the photoelectric conversion efficiency of the image sensor is improved, and the use effect of the image sensor is enhanced.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor packaging, and in particular to a high-performance image sensor packaging structure. Background Art

[0002] Image sensors are based on the photoelectric effect, using photoelectric devices to convert the light image on the photosensitive surface into an electrical signal that is proportional to the light image. After the light enters through the lens, it hits the photosensitive unit on the photosensitive element, causing the electrons to be released and gathered at the output end of the chip, forming a voltage signal, which is then converted into a digital signal by the processing chip to generate an image. Among them, the CMOS image sensor is an active pixel sensor using CMOS semiconductors. There is a corresponding circuit near each photoelectric sensor to directly convert light energy into a voltage signal. It has the advantages of low cost, low power consumption, high integration, and fast data throughput, and has now become the mainstream in many fields.

[0003] However, when used in scenarios such as nighttime shooting and low-light environment monitoring, the weak external light often leads to low photoelectric conversion efficiency, which in turn makes it impossible to effectively use the image sensor, resulting in the inability to effectively obtain shooting or monitoring images at night or in low-light environments. Summary of the invention

[0004] In view of the above-mentioned problems, the present invention provides a high-performance image sensor packaging structure, which makes improvements on the packaging structure, thereby solving the problem in the prior art that the image sensor cannot be effectively used due to the low photoelectric conversion efficiency of the image sensor at night or in low-light environments, thereby improving the photoelectric conversion efficiency of the image sensor and enhancing the use effect of the image sensor.

[0005] To achieve the above object, the technical solution adopted by the present invention is:

[0006] A high-performance image sensor packaging structure, comprising:

[0007] A substrate, the substrate comprising an upper surface and a lower surface, the upper surface of the substrate being coated with a high-reflective coating;

[0008] An image sensor, the image sensor is fixed on the substrate and located on the upper surface of the substrate, the image sensor includes a photosensitive area, a side of the image sensor on which the photosensitive area is arranged is the upper surface, and a side opposite to the upper surface is the lower surface; the image sensor is electrically connected to the substrate through a lead wire;

[0009] A substrate enclosure, the substrate enclosure is arranged around the substrate and is inclined toward the image sensor;

[0010] A glass cover plate, wherein the upper surface of the glass cover plate is a slightly convex surface, the lower surface of the glass cover plate is coated with an anti-reflection coating, the glass cover plate is arranged on the substrate wall, and the lower surface of the glass cover plate is in contact with and fixed to the substrate wall.

[0011] In the above-mentioned high-performance image sensor packaging structure, the inner surface of the substrate wall is coated with a high-reflective coating.

[0012] In the above-mentioned high-performance image sensor packaging structure, a plurality of grooves are distributed around the top of the substrate wall, and a plurality of protrusions corresponding to the grooves are arranged around the lower surface of the glass cover, and the protrusions fit into the grooves.

[0013] In the above-mentioned high-performance image sensor packaging structure, the substrate wall is inclined at an angle of 10-15° toward the image sensor.

[0014] In the above-mentioned high-performance image sensor packaging structure, the upper surface of the glass cover is also coated with a nano self-cleaning film.

[0015] In the above-mentioned high-performance image sensor packaging structure, the upper surface of the photosensitive area of ​​the image sensor is coated with an anti-reflection coating.

[0016] The above technical solution has the following advantages or beneficial effects:

[0017] The high-performance image sensor packaging structure provided by the present invention can reflect the light that is not captured by the photosensitive area for reuse by coating a high-reflective coating on the upper surface of the substrate, thereby improving the light utilization rate of the photosensitive area; by setting an inwardly inclined substrate wall, it is ensured that the light can be gathered to the photosensitive area to the greatest extent, thereby improving the photoelectric conversion efficiency; by setting the upper surface of the glass cover plate as a micro-convex structure, it plays a certain lens role, gathers more light to the photosensitive area, thereby improving the photoelectric conversion efficiency of the image sensor; and by coating a layer of anti-reflective coating on the lower surface of the glass cover plate, it can reduce the light loss caused by reflection, thereby further improving the photosensitivity of the image sensor. The high-performance image sensor packaging structure provided by the present invention is improved in terms of the packaging structure, thereby solving the problem in the prior art that the image sensor cannot be effectively used due to the low photoelectric conversion efficiency of the image sensor at night or in a weak light environment, thereby improving the photoelectric conversion efficiency of the image sensor and enhancing the use effect of the image sensor. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] The present invention and its features, configurations and advantages will become more apparent by reading the detailed description of non-limiting embodiments with reference to the following drawings. The same reference numerals indicate the same parts throughout the drawings. The drawings are not drawn to scale, but rather to illustrate the subject matter of the present invention.

[0019] Figure 1 It is a cross-sectional view of the high-performance image sensor packaging structure provided by Embodiment 1 of the present invention. DETAILED DESCRIPTION

[0020] The present invention will be further described below in conjunction with the accompanying drawings and specific embodiments, but they are not intended to limit the present invention.

[0021] Embodiment 1:

[0022] like Figure 1 As shown, the high-performance image sensor packaging structure provided by Embodiment 1 of the present invention includes: a substrate 1, the substrate 1 includes an upper surface and a lower surface, and the upper surface of the substrate 1 is coated with a high-reflection coating 1.1; the high-reflection coating 1.1 is an aluminum oxide or silver coating;

[0023] The image sensor 2 is fixed on the substrate 1 and is located on the upper surface of the substrate 1. The image sensor 2 includes a photosensitive area 3. The photosensitive area 3 is provided on the image sensor 2 on one side as the upper surface, and the side opposite to the upper surface as the lower surface. The image sensor 2 is electrically connected to the substrate 1 through a lead 4.

[0024] A substrate enclosure 5, the substrate enclosure 5 is arranged around the substrate 1, and the substrate enclosure 5 is inclined toward the image sensor 2;

[0025] The glass cover plate 6 has a slightly convex upper surface and an anti-reflection coating 6.1 coated on the lower surface of the glass cover plate 6. The glass cover plate 6 is disposed on the substrate enclosure 5, and the lower surface of the glass cover plate 6 is in contact with and fixed to the substrate enclosure 5. The anti-reflection coating is, for example, a silicate coating, i.e., a SiO2 coating, or a magnesium fluoride coating, i.e., a MgF2 coating.

[0026] In the high-performance image sensor packaging structure provided in Example 1 of the present invention, the inner surface of the substrate wall 5 is coated with a high-reflection coating 5.1. The high-reflection coating 5.1 is an aluminum oxide or silver coating. The setting of the high-reflection coating 5.1 enables the light reflected by the substrate 1 to be reflected again to the photosensitive area 3 of the image sensor 2, ensuring that the light can be gathered to the photosensitive area to the maximum extent, thereby enhancing the photosensitivity of the image sensor and improving the photoelectric conversion efficiency.

[0027] In the high-performance image sensor packaging structure provided by Embodiment 1 of the present invention, a plurality of grooves 7 are distributed around the top of the substrate wall 5, and a plurality of protrusions 8 corresponding to the grooves 7 are arranged around the lower surface of the glass cover plate 6, and the protrusions 8 fit in the grooves 7. The fitting arrangement of the grooves 7 and the protrusions 8 makes the glass cover plate 6 and the substrate wall 5 more firmly fixed, thereby enhancing the structural strength of the packaged image sensor.

[0028] In the high-performance image sensor packaging structure provided in Example 1 of the present invention, the substrate wall 5 is inclined at an angle of 13° toward the image sensor. The limitation of the inclination angle enables the substrate wall 5 to reflect light into the corresponding photosensitive area 3, thereby ensuring that the light is gathered into the photosensitive area to the greatest extent, thereby enhancing the photosensitivity of the image sensor and improving the photoelectric conversion efficiency.

[0029] In the high-performance image sensor packaging structure provided in Example 1 of the present invention, the upper surface of the glass cover plate 6 is also coated with a nano self-cleaning film 6.2. The coating of the nano self-cleaning film makes it easier for dust, liquid, etc. to slide off the surface of the glass cover plate, reducing pollution accumulation and enhancing the use effect and service life of the image sensor. The nano self-cleaning film is a special film made using nanotechnology. The material of the film is, for example, silicon dioxide (SiO2). Silicon dioxide is often used as the main component of the nano self-cleaning film. It can be processed by nanotechnology to form a super-hydrophobic surface, which can make water droplets form a contact angle greater than 150 degrees on the surface, achieving the functions of waterproofing and anti-fouling.

[0030] In the high-performance image sensor packaging structure provided in Embodiment 1 of the present invention, an anti-reflection coating 3.1 is coated on the upper surface of the photosensitive area 3 of the image sensor. The anti-reflection coating 3.1 is provided so that the light passing through the photosensitive area 3 can be concentrated to the maximum extent by the image sensor inside the photosensitive area 3, thereby improving the photoelectric conversion efficiency and thus improving the quality and capability of the image sensor.

[0031] In summary, the high-performance image sensor packaging structure provided by the embodiment of the present invention can reflect the light that is not captured by the photosensitive area for reuse by coating a high-reflective coating on the upper surface of the substrate, thereby improving the light utilization rate of the photosensitive area; by setting an inwardly inclined substrate wall, it is ensured that the light can be gathered to the photosensitive area to the greatest extent, thereby improving the photoelectric conversion efficiency; by setting the upper surface of the glass cover plate as a micro-convex structure, it plays a certain lens role, gathers more light to the photosensitive area, thereby improving the photoelectric conversion efficiency of the image sensor; and by coating a layer of anti-reflective coating on the lower surface of the glass cover plate, it can reduce the light loss caused by reflection, thereby further improving the photosensitivity of the image sensor. The high-performance image sensor packaging structure provided by the present invention is improved in terms of the packaging structure, thereby solving the problem in the prior art that the image sensor cannot be effectively used due to the low photoelectric conversion efficiency of the image sensor at night or in a weak light environment, thereby improving the photoelectric conversion efficiency of the image sensor and enhancing the use effect of the image sensor.

[0032] Those skilled in the art should understand that those skilled in the art can implement the above-mentioned variations by combining the prior art and the above-mentioned embodiments, which will not be described in detail here. Such variations do not affect the essential content of the present invention, and will not be described in detail here.

[0033] The preferred embodiments of the present invention are described above. It should be understood that the present invention is not limited to the above-mentioned specific embodiments, and the structures not described in detail should be understood to be implemented in a common manner in the art; any technician familiar with the art can make many possible changes and modifications without departing from the technical solution of the present invention, or modify them into equivalent embodiments with equivalent changes, which does not affect the essential content of the present invention. Therefore, any simple modification, equivalent change and modification made to the above embodiments according to the technical essence of the present invention without departing from the content of the technical solution of the present invention still falls within the scope of protection of the technical solution of the present invention.

Claims

1. A high-performance image sensor packaging structure, characterized in that: include: A substrate, the substrate comprising an upper surface and a lower surface, the upper surface of the substrate being coated with a high-reflective coating; An image sensor, the image sensor is fixed on the substrate and located on the upper surface of the substrate, the image sensor includes a photosensitive area, a side of the image sensor on which the photosensitive area is arranged is the upper surface, and a side opposite to the upper surface is the lower surface; the image sensor is electrically connected to the substrate through a lead wire; A substrate enclosure, the substrate enclosure is arranged around the substrate and is inclined toward the image sensor; A glass cover plate, wherein the upper surface of the glass cover plate is a slightly convex surface, the lower surface of the glass cover plate is coated with an anti-reflection coating, the glass cover plate is arranged on the substrate wall, and the lower surface of the glass cover plate is in contact with and fixed to the substrate wall.

2. The high performance image sensor packaging structure according to claim 1, characterized in that: The inner surface of the substrate wall is coated with a high-reflection coating.

3. The high performance image sensor packaging structure according to claim 1, wherein: A plurality of grooves are distributed around the top of the base plate surrounding wall, and a plurality of protrusions corresponding to the grooves are arranged around the lower surface of the glass cover plate, and the protrusions fit into the grooves.

4. The high performance image sensor packaging structure according to claim 1, wherein: The substrate wall is inclined at an angle of 10-15° toward the image sensor.

5. The high performance image sensor packaging structure according to claim 1, characterized in that: The upper surface of the glass cover is also coated with a nano self-cleaning film.

6. The high performance image sensor packaging structure according to claim 1, characterized in that: The upper surface of the photosensitive area of ​​the image sensor is coated with an anti-reflection coating.

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