A double-layer substrate structure, an LED lamp bead, a display module, and a method for preparing the lamp bead

Abstract

The present invention relates to the technical field of LEDs, and particularly relates to a double-layer substrate structure, an LED lamp bead, a display module, and a method for preparing a lamp bead. The double-layer substrate structure includes: a bottom plate, on which there are at least one bottom plate positioning hole, and at least one pad is provided on the inner side of the bottom plate; a panel is used to be attached to the inner side surface of the bottom plate, and there are at least one panel positioning hole and at least one cup opening on the panel. The panel positioning hole and the cup opening correspond to the bottom plate positioning hole and the pad in number respectively, and when the center of the panel positioning hole is aligned with the center of the bottom plate positioning hole in the thickness direction of the double-layer substrate structure, the center of the cup opening is aligned with the center of the pad in the thickness direction of the double-layer substrate structure. In this application, bottom plate positioning holes and panel positioning holes that correspond one-to-one and are centered are provided on both the panel and the substrate. Furthermore, the offset amount of the center positions of the bottom plate positioning hole and the panel positioning hole can be identified by image, and based on this, the offset amount between the panel and the substrate can be checked and adjusted, which can greatly reduce the risk of alignment offset during the bonding of the double-layer board.

Description

Technical Field

[0001] The present invention relates to the technical field of LEDs, and particularly to a double-layer substrate structure, an LED lamp bead, a display module, and a method for manufacturing a lamp bead. Background Art

[0002] LED displays have the following advantages: high gray scale, wide viewing angle, rich colors, and customizable screen shapes. Therefore, LED displays are widely used in various fields such as industry, transportation, commercial advertising, information dissemination, and sports competitions. The pixel elements used in LED displays are LED lamp beads. As a common component material of LED lamp beads, the double-layer board substrate has a large market demand.

[0003] In the related art, the double-layer board substrate is composed of a bottom board and a panel. The double-layer board is bonded by an adhesive. The pads on the upper surface of the bottom board correspond to the cup positions of the panel one by one. The panel is generally dark in color to enhance the contrast and improve the display effect. The corresponding positions of the bottom board and the panel are confirmed by the positioning holes at the edge of the board. However, since the shapes of the pads are mostly irregular structures, when the machine identifies the shapes for alignment, misidentification is likely to occur, resulting in the position deviation after the double-layer board is bonded, and the problem that the panel covers the pad position. Once the positioning deviation is too large, the center position of the double-layer board is likely to shift. Moreover, since the pad positions are blocked by the panel, it will also cause too small a space for wire bonding and die bonding operations, resulting in a large number of process defects in the subsequent packaging process. Summary of the Invention

[0004] In the related art, the positioning of the bottom board and the panel in the double-layer board substrate depends on the image recognition device to recognize the shape of the pads on the bottom board. However, the shapes of the pads are mostly irregular structures, and the image recognition device is prone to misidentification when recognizing irregular structures. And misidentification during the recognition process will cause the position to shift after the bottom board and the panel are bonded, resulting in the phenomenon that the panel covers the pad position.

[0005] In a first aspect, an embodiment of the present application provides a double-layer substrate structure, which includes:

[0006] A bottom board, on which there is at least one bottom board positioning hole, and at least one pad is provided inside the bottom board;

[0007] A panel, which is used to be attached to the inner side surface of the bottom board. The panel is provided with at least one panel positioning hole and at least one cup, and the panel positioning hole and the cup respectively correspond to the bottom board positioning hole and the pad in number, and the panel is configured to:

[0008] When the center of the panel positioning hole is aligned with the center of the bottom board positioning hole in the thickness direction of the double-layer substrate structure, the center of the cup is aligned with the center of the pad in the thickness direction of the double-layer substrate structure.

[0009] In combination with the first aspect, in one embodiment, pins are provided on the outer side surface of the bottom plate, and the pins are electrically connected to the pads through the positioning holes of the bottom plate.

[0010] In combination with the first aspect, in one embodiment, at least a part of the radial cross-section of the panel positioning hole coincides with the projection plane of the radial cross-section of the bottom plate positioning hole in the thickness direction of the double-layer substrate structure, and the projected area of the radial cross-section of the panel positioning hole is not equal to the projected area of the radial cross-section of the bottom plate positioning hole.

[0011] In combination with the first aspect, in one embodiment, the projected area of the radial cross-section of the panel positioning hole is larger than the projected area of the radial cross-section of the bottom plate positioning hole.

[0012] In combination with the first aspect, in one embodiment, both the bottom plate positioning hole and the panel positioning hole are circular holes.

[0013] In the second aspect, an embodiment of the present application provides a method for manufacturing a lamp bead using the above double-layer substrate structure, which includes:

[0014] Align the center of the bottom plate positioning hole of the bottom plate with the center of the panel positioning hole of the panel one by one;

[0015] Bond the aligned bottom plate and the panel to form a loading unit;

[0016] Package the chip on the loading unit, and then cut the loading unit packaged with the chip to obtain LED lamp beads.

[0017] In combination with the second aspect, in one embodiment, cutting the double-layer substrate structure packaged with the chip to obtain LED lamp beads includes:

[0018] Cut the double-layer substrate structure packaged with the chip to form the LED lamp beads. The LED lamp beads include an upper surface for emitting light and a lower surface provided with pins. The projected areas of the upper surface and the lower surface partially coincide in the thickness direction of the LED lamp bead, and the projected area of the upper surface of the LED lamp bead is larger than the projected area of its lower surface.

[0019] In the third aspect, an embodiment of the present application provides an LED lamp bead, which includes: the LED lamp bead prepared by using the LED lamp bead manufacturing method described in the second aspect above.

[0020] In the fourth aspect, the present application provides a display module, which includes: the LED lamp bead as described in the third aspect above.

[0021] In combination with the fourth aspect, in one embodiment, it further includes: a circuit board, on the inner side surface of which the LED lamp beads are mounted, and at least one through hole is provided on the inner side surface of the circuit board.

[0022] The beneficial effects brought by the technical solutions provided in the embodiments of the present application at least include:

[0023] In the present application, bottom plate positioning holes and panel positioning holes that correspond one by one and are centered and aligned are provided on both the panel and the substrate. Furthermore, the offset amount of the center positions of the bottom plate positioning holes and the panel positioning holes can be identified by image recognition, and based on this, the offset amount between the panel and the substrate can be verified and adjusted, which can greatly reduce the risk of alignment offset during the bonding of double-layer boards. Description of the Drawings

[0024] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following will briefly introduce the drawings required for the description of the embodiments. Obviously, the drawings in the following description are only some embodiments of the present application. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings.

[0025] Figure 1 It is a top view of the double-layer substrate structure in the embodiment of the present application;

[0026] Figure 2 It is a front view cross-sectional view of the double-layer substrate structure in the embodiment of the present application;

[0027] Figure 3 It is a top view of the bottom plate in the embodiment of the present application;

[0028] Figure 4 It is a front view cross-sectional view of the bottom plate in the embodiment of the present application;

[0029] Figure 5 It is a top view of the panel in the embodiment of the present application;

[0030] Figure 6 It is a cross-sectional view of the panel in the embodiment of the present application;

[0031] Figure 7 It is a top view of the double-layer substrate structure in the packaged state in the embodiment of the present application;

[0032] Figure 8 It is a front view cross-sectional view of the double-layer substrate structure in the packaged state in the embodiment of the present application;

[0033] Figure 9 It is a front view cross-sectional view of the double-layer substrate structure in the cutting process in the embodiment of the present application;

[0034] Figure 10 It is a front view cross-sectional view of the lamp bead device in the embodiment of the present application;

[0035] Figure 11 It is a top view of the lamp bead device in the embodiment of the present application;

[0036] Figure 12 It is a schematic diagram of the circuit board in the embodiment of the present application;

[0037] Figure 13 It is a schematic diagram of the arrangement of multiple lamp beads in the embodiment of the present application;

[0038] Figure 14 It is a cross-sectional view of the display module in the embodiment of the present application;

[0039] In the figure: 1, bottom plate; 11, bottom plate positioning hole; 111, copper layer; 112, pore passage; 12, pad; 13, pin; 2, panel; 21, panel positioning hole; 22, cup mouth; 3, circuit board; 31, through hole; 4, chip; 5, metal wire; 6, cutting line; 7, blade; 8, copper pin; 9, lamp bead. Specific embodiments

[0040] In order to enable those skilled in the art to better understand the solution of the present application, the technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present application.

[0041] In related technologies, the positioning of the bottom plate and the panel in the double-layer board substrate depends on the image recognition device to recognize the shape of the pads on the bottom plate. However, the shapes of the pads are mostly special-shaped structures, and the image recognition device is prone to misrecognition when recognizing special-shaped structures. After misrecognition, it will cause the position to shift after the bottom plate and the panel are bonded, and the panel covers the position of the pads. Further, it will cause a large number of process defects in the subsequent packaging process.

[0042] In the first aspect, as Figure 1 and Figure 2 shown, the embodiment of the present application provides a double-layer substrate structure of an LED, which includes: a bottom plate 1 and a panel 2; wherein,

[0043] The bottom plate 1 is provided with at least one bottom plate positioning hole 11, and at least one pad 12 is provided inside the bottom plate 1; the panel 2 is used for detachably fitting with the inner side surface of the bottom plate 1, and at least one panel positioning hole 21 and at least one cup mouth 22 are provided on the panel 2. The panel positioning hole 21 and the cup mouth 22 correspond to the bottom plate positioning hole 11 and the pad 12 in number respectively, and the panel 2 is configured as:

[0044] When the center of the panel positioning hole 21 is aligned with the center of the bottom plate positioning hole 11 in the thickness direction of the double-layer substrate structure, the center of the cup mouth 22 is aligned with the center of the pad 12 in the thickness direction of the double-layer substrate structure.

[0045] Further, as Figure 2 shown, the bottom plate 1 and the panel 2 are bonded through an adhesive material (usually epoxy resin) to form a double-layer substrate. And the center position of the cup mouth 22 corresponds to the center position of the pad 12 on the bottom plate 1, and the panel positioning holes 21 and the bottom plate positioning holes 11 are in one-to-one correspondence. After the panel 2 and the bottom plate 1 are bonded, a plurality of cavities are formed at the positions of the pads 12 and the cup mouths 22, and this position is the process space for subsequent packaging processes.

[0046] It should be noted that in the above embodiment, the bottom plate 1 and the panel 2 are aligned through the bottom plate positioning holes 11 and the panel positioning holes 21 thereon. Since the image recognition device only needs to identify and confirm the center positions of each pair of bottom plate positioning holes 11 and panel positioning holes 21, the recognition accuracy is improved, and the possibility of misrecognition is greatly reduced.

[0047] In some optional embodiments, the main body of the bottom plate 1 can be made of an insulating material. The pads 12 installed on the inner side of the bottom plate 1 (i.e., Figure 3 the upper surface shown) and the pins 13 installed on the outer side of the bottom plate 1 are both made of metal materials. Preferably, the pads 12 and the pins 13 are both made of copper or iron. The bottom plate 1 is made of a resin insulating material.

[0048] It should be noted that copper or iron as the manufacturing material has a lower cost and higher stability. The resin insulating material has excellent electrical insulation performance and good bonding performance, and can well adapt to subsequent packaging.

[0049] Further, the pins 13 on the outer side surface of the bottom plate 1 are electrically connected to the pads 12 through the bottom plate positioning holes 11. Preferably, as Figure 4 shown, the surface of the bottom plate positioning hole 11 is plated with a copper layer 111, and the copper layer 111 is electrically connected to the pins 13 and the pads 12. The thickness of the copper layer 111 can be taken as 0.1 mm.

[0050] It can be understood that by plating the copper layer 111 on the surface of the bottom plate positioning hole 11, the bottom plate positioning hole 11 not only has the function of positioning in the bonding process, but also serves as a circuit connecting both sides of the bottom plate 1 to form a conduction line.

[0051] In some optional embodiments, the panel 2 is a single-layer insulating resin structure and is mainly made of a resin insulating material, as Figure 5, there are multiple cup openings 22 on the panel 2, and the number of cup openings 22 corresponds to the number of pads 12. There are several panel positioning holes 21 opened between the cup openings 22. As Figure 6 shown, the cup opening 22 vertically penetrates the upper and lower surfaces of the panel 2.

[0052] In some specific embodiments, at least part of the radial cross-section of the panel positioning hole 21 coincides with the projection plane of the radial cross-section of the bottom plate positioning hole 11 in the thickness direction of the double-layer substrate structure, and the projected area of the radial cross-section of the panel positioning hole 21 is not equal to the projected area of the radial cross-section of the bottom plate positioning hole 11.

[0053] It should be noted that for the double-layer substrate using the above preferred embodiment, since the radial cross-sectional areas of the panel positioning hole 21 and the bottom plate positioning hole 11 are not equal. After the panel 2 and the bottom plate 1 are bonded, the positioning holes on the other side can still be seen from one side. Furthermore, it is convenient to use an image recognition device to identify the center positions of the panel positioning hole 21 and the bottom plate positioning hole 11. By recognizing the position offset of the concentric holes through imaging, the risk of alignment offset during the bonding of the double-layer board can be greatly reduced. Specifically, when implementing, it can be set that when the center offset is less than a preset threshold (such as 0.05 mm), it is qualified.

[0054] Based on the above specific embodiments, preferably, the projected area of the radial cross-section of the panel positioning hole 21 is larger than the projected area of the radial cross-section of the bottom plate positioning hole 11.

[0055] It can be understood that for the double-layer substrate using the above preferred embodiment, after the panel 2 and the bottom plate 1 are bonded, the bottom plate positioning hole 11 can still be seen from the panel positioning hole 21 on the panel 2 side. The radial cross-section of the bottom plate positioning hole 11 is smaller, so that the amount of copper layer 111 in the bottom plate positioning hole 11 is less, saving material input and improving the preparation speed of the bottom plate 1.

[0056] In some specific embodiments, both the bottom plate positioning hole 11 and the panel positioning hole 21 are round holes.

[0057] It can be understood that round holes are opened on the bottom plate 1 or the panel 2. On the one hand, the process of opening round holes is relatively simple and easy to manufacture. On the other hand, it is more convenient to electroplate the copper layer 111 on the round holes, which is beneficial to improving the preparation efficiency. However, in this application, the bottom plate positioning hole 11 and the panel positioning hole 21 are not limited to the round hole structure, and square holes or holes of other shapes can also be applicable to the bottom plate positioning hole 11 and the panel positioning hole 21 in this application.

[0058] Preferably, both the bottom plate positioning hole 11 and the panel positioning hole 21 are round holes, and the diameter of the bottom plate positioning hole 11 is smaller than the diameter of the panel positioning hole 21.

[0059] It should be noted that, as described above, the diameter of the bottom plate positioning hole 11 is smaller than that of the panel positioning hole 21, so that the amount of copper layer 111 in the bottom plate positioning hole 11 is less.

[0060] Furthermore, the sizes of the positioning holes of the bottom plate 1 and the panel 2 need to be determined according to the actual size of the lamp beads and the material cost. In a specific embodiment of the present application, when applied to LED lamp bead products between P1.0 - 3.0:

[0061] The radius of the bottom plate positioning hole 11 generally takes 0.2 - 0.4 mm. In this embodiment, the radius of the bottom plate positioning hole 11 of the product structure is set to 0.3 mm, and a copper layer 111 with a thickness of 0.1 mm is plated on the surface of the bottom plate positioning hole 11 without additional hole filling treatment. At this time, the bottom plate 1 forms a number of bottom plate positioning holes 11 with an outer diameter of 0.3 mm and an inner diameter of 0.2 mm. The pad 12 and the pin 13 are electrically connected to the upper and lower circuits through the copper layer 111 attached to the bottom plate positioning hole 11 to achieve the effect of circuit connection. The radius of the panel positioning hole 21 of the panel 2 needs to be greater than 0.2 mm to facilitate image recognition positioning during subsequent bonding of the double-layer board.

[0062] In a second aspect, the present application provides a method for manufacturing lamp beads using the double-layer substrate structure in the above embodiment, which includes the following steps:

[0063] Step S1: Align the centers of the bottom plate positioning holes 11 of the bottom plate 1 with the centers of one of the panel positioning holes 21 of the panel 2 one by one.

[0064] Specifically, an image recognition device can be used to identify the center positions of the bottom plate positioning hole 11 and the panel positioning hole 21, and measure the offset of the center positions of the two. Then, according to the offset of the center positions, the relative positions of the bottom plate 1 and the panel 2 are adjusted until the offset of the center positions is qualified. Specifically, when implementing, it can be set that when the center offset is less than a preset threshold (such as 0.05 mm), it is qualified.

[0065] Step S2: Bond the aligned bottom plate 1 and the panel 2 to form a loading unit.

[0066] Specifically, as Figure 2 shown, after the bottom plate 1 and the panel 2 are bonded, a number of cavities are formed at the positions of the pad 12 and the cup mouth 22, which is the process space for subsequent encapsulation processes.

[0067] Step S3: Package the chip 4 on the loading unit.

[0068] Specifically, as Figure 8As shown, the chip 4 is fixed on the pad 12 of the loading unit, and the electrodes of the chip 4 are electrically connected to the pad 12 by wire bonding with the metal wire 5. Then, the transparent encapsulant is dispensed at the position of the cup mouth 22 by dispensing. Through high-temperature hardening, the liquid glue is transformed into solid glue, which plays a role in protecting the light-emitting chip; the double-layer board plays a role in supporting and protecting the chip; at this time, a structure is formed mainly composed of the double-layer board forming the loading unit, the chip 4 and the encapsulant.

[0069] Step S4: Cut the loading unit encapsulated with the chip 4 to obtain the LED lamp beads 9.

[0070] Specifically, the loading unit is cut into multiple independent LED lamp beads 9 as shown in Figure 11 . The cutting position is the connection line between the centers of the positioning holes between the lamp beads (i.e., the cutting line 6 in Figure 7 ).

[0071] In the first embodiment of the present application, a vertical structure blade is used for cutting, and after cutting, independent LED lamp beads 9 with a vertical structure are formed.

[0072] In the second embodiment of the present application, the double-layer substrate structure encapsulated with the chip 4 is cut to form the LED lamp beads 9. The LED lamp beads 9 include an upper surface for emitting light and a lower surface provided with pins 13. The projection planes of the upper surface and the lower surface in the thickness direction of the LED lamp beads 9 partially overlap, and the projection plane area of the upper surface of the LED lamp beads 9 is larger than the projection plane area of its lower surface.

[0073] It should be noted that for the case where larger-sized LED lamp beads 9 are applied to a smaller pitch (such as when a 1.5*1.5mm lamp bead is applied to a P1.56 pitch display screen), the distance between the lamp beads in the display module is relatively close. Therefore, the pins 13 on the lower surfaces of adjacent lamp beads extending to the copper pins 8 on the side are likely to contact each other and cause a short circuit abnormality.

[0074] Furthermore, in the present application, by cutting the lamp beads into a "larger upper and smaller lower" structure, the projection plane of the upper surface of the lamp beads as the light-emitting surface covers the projection plane of the lower surface provided with the pins 13 in the thickness direction. Thus, without affecting the light-emitting area, the gap between the copper pins 8 of adjacent lamp beads is made larger, and the short circuit risk is minimized.

[0075] Combined with the above second embodiment, a preferred implementation manner of step S4 in the present application includes: using a V-shaped blade 7 to perform back cutting along the cutting line 6. That is, as shown in Figure 9 , the pins 13 of the encapsulated loading unit are fixed facing down in the cutting machine, and the blade 7 cuts the loading unit placed on the reverse side. Multiple trapezoidal LED lamp beads 9 are formed by cutting.

[0076] It can be understood that in the above preferred embodiment, the lamp bead structure is an inverted trapezoidal structure, the light-emitting position on the upper surface of the lamp bead is the long side, and the pin position on the lower surface is the short side, which can minimize the short-circuit risk without affecting the light-emitting area. Under the same lamp bead size, the inverted trapezoidal structure can be applied to a display screen with a smaller dot pitch, reducing the short-circuit risk and having a wider application range; after cutting, it becomes a single lamp bead, and each lamp bead uses a group of RGB light-emitting chips as pixel units; the structure of the cut independent lamp bead is as Figure 10 and Figure 11 shown.

[0077] In a third aspect, the present application provides an LED lamp bead, which is prepared by any one of the above-mentioned LED lamp bead preparation methods.

[0078] Preferably, as Figure 10 shown, the LED lamp bead 9 is in an inverted trapezoidal structure.

[0079] It should be noted that, as described above, the inverted trapezoidal structure of the LED lamp bead 9 can be applied to a display screen with a smaller dot pitch, reducing the risk of the copper pins 8 on the sides of adjacent LED lamp beads 9 coming into contact with each other and causing a short circuit.

[0080] In a fourth aspect, the present application provides a display module, including: the LED lamp bead 9 in any one of the above embodiments and a circuit board 3, wherein the LED lamp bead 9 is fixed on the circuit board 3 by soldering.

[0081] In some alternative embodiments, as Figure 12 shown, at least one through hole 31 is provided on the inner side surface of the circuit board 3.

[0082] It should be noted that the through hole 31 is beneficial for sound to be transmitted from the outer side surface of the circuit board 3 to the inner side surface where the LED lamp beads 9 are provided, and then through the pore channels 112 formed by the multiple LED lamp beads 9, the sound is conducted to the surface of the LED display screen, improving the sound effect and the consistency of the main picture of the LED display screen. At the same time, it can also improve the heat dissipation performance of the LED display screen. It should be noted that, as Figure 13 shown, the pore channels 112 are formed by enclosing each part of the bottom plate positioning holes 11 of the original double-layer substrate structure.

[0083] Preferably, the radial cross-sectional area of the through hole 31 is 0.5 times to 1.5 times the radial cross-sectional area of the bottom plate positioning hole 11.

[0084] It can be understood that if the size of the through hole 31 is too large, the space for placing the integrated circuit will be reduced, and if the through hole is too small, the sound transmission effect will be poor. Therefore, the size of the through hole 31 should be based on the bottom plate positioning hole 11.

[0085] In some alternative embodiments, to improve the sound transmission and heat dissipation efficiency, as Figure 14As shown, the through holes 31 on the circuit board 3 correspond to the positions at the holes 112.

[0086] In summary, in this application, bottom plate positioning holes and panel positioning holes that correspond one by one and are centered and aligned are provided on both the panel and the substrate. Furthermore, the offset amounts of the centers of the bottom plate positioning holes and the panel positioning holes can be identified by image recognition, and based on this, the offset amount between the panel and the substrate can be checked and adjusted, which can greatly reduce the risk of misalignment during the bonding of double-layer boards. Further, in this application, a special cutting method is used to cut the substrate into an inverted trapezoidal structure, so that the lamp beads can be applied to displays with smaller dot pitches, reducing the risk of short circuits. In this application, through holes are arranged on the circuit board to cooperate with the holes between the lamp beads to improve the consistency between the sound effect and the main picture of the LED display, and at the same time, improve the heat dissipation performance of the LED display.

[0087] In the description of this application, it should be noted that the orientation or positional relationship indicated by terms such as "upper" and "lower" is based on the orientation or positional relationship shown in the drawings. This is only for the convenience of describing this application and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application. Unless otherwise clearly specified and defined, the terms "installed", "connected", and "connected" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected, or indirectly connected through an intermediate medium, and it can be the communication inside two elements. For those of ordinary skill in the art, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0088] It should be noted that in this application, relational terms such as "first" and "second" are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variant thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements not only includes those elements, but also includes other elements not expressly listed, or also includes elements inherent to such process, method, article or device. Without further limitation, an element defined by the phrase "including a..." does not exclude the existence of additional identical elements in the process, method, article or device including the said element.

[0089] The above are only specific embodiments of the present application, enabling those skilled in the art to understand or implement the present application. Various modifications to these embodiments will be obvious to those skilled in the art. The general principles defined herein can be implemented in other embodiments without departing from the spirit or scope of the present application. Therefore, the present application will not be limited to these embodiments shown herein, but rather will be accorded the widest scope consistent with the principles and novel features claimed herein.

Claims

1. A double-layer substrate structure, characterized in that, Comprising: A bottom plate (1) provided with at least one bottom plate positioning hole (11) thereon, and at least one pad (12) is provided on the inner side of the bottom plate (1); A panel (2) which is used to be attached to the inner side surface of the bottom plate (1), at least one panel positioning hole (21) and at least one cup mouth (22) are provided on the panel (2), the panel positioning hole (21) and the cup mouth (22) correspond to the bottom plate positioning hole (11) and the pad (12) in number respectively, at least part of the radial cross-section of the panel positioning hole (21) coincides with the projection plane of the radial cross-section of the bottom plate positioning hole (11) in the thickness direction of the double-layer substrate structure, and the projection plane area of the radial cross-section of the panel positioning hole (21) is not equal to the projection plane area of the radial cross-section of the bottom plate positioning hole (11), and the panel (2) is configured as: When the center of the panel positioning hole (21) is aligned with the center of the bottom plate positioning hole (11) in the thickness direction of the double-layer substrate structure, the center of the cup mouth (22) is aligned with the center of the pad (12) in the thickness direction of the double-layer substrate structure.

2. The double-layer substrate structure according to claim 1, wherein: Leads (13) are provided on the outer side surface of the bottom plate (1), and the leads (13) are electrically connected to the pads (12) through the bottom plate positioning holes (11).

3. The double-layer substrate structure according to claim 1, wherein: The projection plane area of the radial cross-section of the panel positioning hole (21) is larger than the projection plane area of the radial cross-section of the bottom plate positioning hole (11).

4. The double-layer substrate structure according to claim 1, wherein: Both the bottom plate positioning hole (11) and the panel positioning hole (21) are round holes.

5. A method for manufacturing a lamp bead using the double-layer substrate structure as described in claim 1, characterized in that, Comprising: Aligning the centers of the bottom plate positioning holes (11) of the bottom plate (1) with the centers of the panel positioning holes (21) of the panel (2) one by one; Bonding the aligned bottom plate (1) and the panel (2) to form a loading unit; Encapsulating a chip (4) on the loading unit, and then cutting the loading unit encapsulated with the chip (4) to obtain an LED lamp bead (9).

6. The method for preparing a lamp bead according to claim 5, wherein, The cutting the double-layer substrate structure encapsulated with a chip to obtain an LED lamp bead (9) includes: Cutting the double-layer substrate structure encapsulated with a chip to form the LED lamp bead (9), the LED lamp bead (9) includes an upper surface for emitting light and a lower surface provided with leads (13), the projection planes of the upper surface and the lower surface of the LED lamp bead (9) partially coincide in the thickness direction of the LED lamp bead (9), and the projection plane area of the upper surface of the LED lamp bead (9) is larger than the projection plane area of its lower surface.

7. An LED lamp bead, characterized in that, Comprising: An LED lamp bead (9) prepared by using the method for preparing an LED lamp bead according to claim 5 or 6.

8. A display module, characterized in that, Comprising: An LED lamp bead (9) according to claim 7.

9. The display module according to claim 8, wherein, Further comprising: A circuit board (3) with the LED lamp bead (9) mounted on its inner side surface, and at least one through hole (31) is provided on the inner side surface of the circuit board (3).

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