Display module, manufacturing method of display module and electronic equipment

Abstract

The embodiment of the invention provides a display module, a manufacturing method of the display module and electronic equipment, and relates to the technical field of display. In the display module, the isolation part is arranged between the adjacent light-emitting devices, so that light emitted by the adjacent light-emitting devices can be isolated, the light crosstalk phenomenon is prevented, and a better display effect is achieved.

Description

Technical Field

[0001] The present application relates to the field of display technology, and in particular to a display module, a method for manufacturing a display module, and an electronic device. Background Art

[0002] With the continuous development of electronic equipment technology, display screens have been widely used. In some self-luminous displays, light-emitting diodes are usually arranged in an array on a driving substrate for display. In Micro LED display technology, due to the dense arrangement of light-emitting diodes, the light emitted by the light-emitting diodes is easily affected by the side light of adjacent light-emitting diodes, resulting in light crosstalk, blurring the picture and affecting the display effect. Summary of the invention

[0003] In order to at least overcome the above-mentioned deficiencies in the prior art, the purpose of the present application is to provide a display module, a method for manufacturing a display module, and an electronic device.

[0004] In a first aspect, an embodiment of the present application provides a display module, the display module comprising:

[0005] Driver substrate;

[0006] Light-emitting devices, the light-emitting devices are distributed on the driving substrate;

[0007] an optical filling layer, the optical filling layer being filled between adjacent light emitting devices and covering a side of the light emitting device away from the driving substrate;

[0008] The isolating part is embedded in the optical filling layer and is used to isolate the light emitted by the adjacent light emitting devices.

[0009] In a possible implementation, the display module further includes a reflective layer, and the reflective layer is disposed on a surface of the isolation portion.

[0010] Preferably, the reflective layer is a metal plating layer. Preferably, the material of the reflective layer includes at least one of metal aluminum and metal silver.

[0011] In a possible implementation manner, the orthographic projection of the isolation portion on the driving substrate is at least located between the orthographic projections of two adjacent light-emitting devices on the driving substrate.

[0012] Preferably, the isolation portion and the light-emitting device are isolated from each other by the optical filling layer.

[0013] Preferably, the distance between the isolation parts located on two opposite sides of the same light-emitting device gradually increases along a direction approaching the driving substrate.

[0014] Preferably, in a direction perpendicular to the driving substrate, a minimum distance between the isolation portion and the driving substrate is smaller than a height of the light emitting device.

[0015] In one possible implementation, the minimum distance between the isolation parts located on opposite sides of the same light-emitting device is smaller than the size between the corresponding opposite sides of the light-emitting device, and the distance between the points closest to the driving substrate of the isolation parts located on opposite sides of the same light-emitting device is greater than the size between the corresponding opposite sides of the light-emitting device.

[0016] In a possible implementation, the cross-sectional shape of the isolation portion perpendicular to its extension direction includes an arc-shaped hemisphere or an inverted trapezoid.

[0017] In a possible implementation, the display module further comprises a transparent substrate, and the transparent substrate is connected to the isolation portion and the optical filling layer. Preferably, the optical filling layer is doped with scattering particles. Preferably, the scattering particles comprise silicon particles.

[0018] In a second aspect, an embodiment of the present application further provides a method for manufacturing a display module, the manufacturing method comprising:

[0019] Providing a driving substrate;

[0020] Arranging a light emitting device on the driving substrate;

[0021] Making an optical filling layer doped with scattering particles on the driving substrate on which the light-emitting devices are arranged, so that the optical filling layer is filled between adjacent light-emitting devices and covers a side of the light-emitting device away from the driving substrate;

[0022] An isolation portion embedded in the optical filling layer is manufactured to isolate the light emitted by two adjacent light emitting devices.

[0023] In a possible implementation, the step of making the isolation portion embedded in the optical filling layer includes:

[0024] Providing a transparent substrate;

[0025] A black isolation layer is formed on the transparent substrate, and the black isolation layer is patterned to obtain the isolation portion, or a black isolation layer is formed on the transparent substrate, and the isolation portion is obtained by a compression molding process;

[0026] The side of the transparent substrate having the isolation portion is pressed toward the optical filling layer, so that the isolation portion is embedded in the optical filling layer, and the orthographic projection of the isolation portion on the driving substrate is at least located between the orthographic projections of two adjacent light-emitting devices on the driving substrate.

[0027] In a possible implementation, before the step of laminating the transparent substrate with the side on which the isolation portion is formed facing the optical filling layer so that the isolation portion is embedded in the optical filling layer, the step further includes:

[0028] Using physical vapor deposition to form a metal layer on the isolation portion and a transparent substrate on one side of the isolation portion;

[0029] The metal layer on the transparent substrate is removed to obtain a reflective layer on the surface of the isolation portion.

[0030] In a second aspect, an embodiment of the present application further provides an electronic device, wherein the electronic device comprises the display module described in any one of the first aspect or the second aspect.

[0031] Based on any one of the above aspects, the display module, the method for manufacturing the display module and the electronic device provided in the embodiments of the present application can isolate the light emitted by adjacent light-emitting devices by setting an isolation portion between adjacent light-emitting devices, thereby preventing the occurrence of light crosstalk and improving the display effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required in the embodiments will be briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present application and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without creative work.

[0033] Figure 1 A possible structural diagram of a display module provided in an embodiment of the present application Figure 1 ;

[0034] Figure 2 A possible structural diagram of a display module provided in an embodiment of the present application Figure 2 ;

[0035] Figure 3 for Figure 2 A local enlarged view of P in FIG.

[0036] Figure 4 A possible structural diagram of a display module provided in an embodiment of the present application Figure 3 ;

[0037] Figure 5 A possible structural diagram of a display module provided in an embodiment of the present application Figure 4 ;

[0038] Figure 6 A schematic diagram of the process structure of a method for manufacturing a display module provided in an embodiment of the present application;

[0039] Figure 7 for Figure 6 Corresponding process diagram;

[0040] Figure 8 for Figure 6 Schematic diagram of the sub-step flow chart of step S14;

[0041] Fig. 9 for Figure 8 Corresponding process diagram. DETAILED DESCRIPTION

[0042] In order to make the purpose, technical solution and advantages of the embodiments of the present application clearer, the technical solution in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, rather than all the embodiments. The components of the embodiments of the present application described and shown in the drawings here can be arranged and designed in various different configurations.

[0043] Therefore, the following detailed description of the embodiments of the present application provided in the accompanying drawings is not intended to limit the scope of the present application for which protection is sought, but merely represents selected embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in the field without creative work are within the scope of protection of the present application.

[0044] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, further definition and explanation thereof is not required in subsequent drawings.

[0045] In the description of this application, it should be noted that the terms "upper", "lower", etc. indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship in which the product of the application is usually placed when in use, which is only for the convenience of describing this application and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on this application. In addition, the terms "first", "second", etc. are only used to distinguish the description, and cannot be understood as indicating or implying relative importance.

[0046] In the description of this application, it should also be noted that, unless otherwise clearly specified and limited, the terms "disposed", "connected", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal connection of two elements. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0047] It should be noted that, in the absence of conflict, different features in the embodiments of the present application may be combined with each other.

[0048] Please refer to Figure 1 The display module 10 includes a driving substrate 110 , a light emitting device 120 , an optical filling layer 130 and an isolation portion 140 .

[0049] The light emitting devices 120 are distributed on the driving substrate 110. Specifically, the light emitting devices 120 may be regularly arranged on the driving substrate 110 or irregularly arranged on the driving substrate 110. Preferably, the light emitting devices 120 are regularly arranged on the driving device. For example, the light emitting devices 120 may be Micro LEDs. The light emitting devices 120 may be transferred from the temporary substrate to the driving substrate 110 by mass transfer technology and bonded to the driving electrodes on the driving substrate 110.

[0050] The optical filling layer 130 is filled between adjacent light emitting devices 120 and covers a side of the light emitting device 120 away from the driving substrate 110 . The optical filling layer 130 may be made of colorless and transparent optical glue to improve the light transmission effect.

[0051] The isolation part 140 is embedded in the optical filling layer 130 . In this way, the isolation part 140 can isolate the light emitted by adjacent light emitting devices 120 , thereby avoiding light crosstalk and improving the display effect.

[0052] In the above structure, by providing the isolation part 140 between adjacent light emitting devices 120, it is possible to isolate the light emitted by the adjacent light emitting devices 120 and prevent the occurrence of optical crosstalk, thereby improving the display effect.

[0053] In a possible structure of this embodiment, the display module 10 may further include a reflective layer, which is disposed on the surface of the isolation portion 140. Meanwhile, considering the reflectivity of the material, the reflective layer may be a metal plating layer, and preferably, the reflective layer may be made of high-reflectivity metal aluminum or metal silver.

[0054] For details, please refer to Figure 2 and Figure 3 , Figure 3 for Figure 2 A partial enlarged view of the P in the figure. A reflective layer 150 is made on the surface of the isolation part 140. The reflective layer 150 can fully reflect at least part of the light emitted by the light-emitting device 120. After total reflection, part of the front light is collimated and emitted in the light-emitting direction (as indicated by the V1 direction in the figure), thereby improving the screen brightness of the display module 10; and part of the side light is emitted toward the driving substrate 110 (as indicated by the V2 direction in the figure) after total reflection, thereby avoiding the light crosstalk phenomenon between adjacent light-emitting devices 120.

[0055] Furthermore, the orthographic projection of the isolating portion 140 on the driving substrate 110 is at least located between the orthographic projections of the adjacent light-emitting devices 120 on the driving substrate 110, so that the side light of the light-emitting device 120 in all directions can be reflected by the reflective layer 150, thereby reducing the light crosstalk of the adjacent light-emitting devices 120. At the same time, in order to prevent the isolating portion 140 from squeezing the light-emitting device 120, the isolating portion 140 can be isolated from the light-emitting device 120 by the optical filling layer 130. While protecting the light-emitting device 120, the optical filling layer 130 can also make the light output of the display module 10 more uniform and the display effect better. In addition, the distance between the isolation portions 140 located on opposite sides of the same light-emitting device 120 can gradually increase along the direction approaching the driving substrate 110. By way of example, the cross-sectional shape of the isolation portion 140 perpendicular to its extension direction includes an arc-shaped hemisphere, an inverted trapezoid, an inverted triangle, etc. It is not difficult to understand that the isolation portion 140 with the above structure can further improve the total reflection effect of the reflective layer 150 on the side light, so that part of the light can be emitted toward the driving substrate without affecting the adjacent light-emitting device 120, and part of the front light can be collimated and emitted forward, effectively concentrating the light source and improving the brightness of the display module 10.

[0056] Please refer to Figure 4 In a direction perpendicular to the driving substrate 110 , the minimum distance H1 between the isolation portion 140 and the driving substrate 110 is smaller than the height H2 of the light-emitting device 120 , so that the isolation portion 140 can isolate the side light emitted by two adjacent light-emitting devices 120 as much as possible, thereby reducing the optical crosstalk of adjacent light-emitting devices 120 .

[0057] Further, please refer again to Figure 4 , the minimum distance d between the isolation portions 140 located on opposite sides of the same light emitting device 120 min is smaller than the dimension L between the two opposite sides of the corresponding light emitting device 120, and the distance d between the closest points of the isolation parts 140 located on the two opposite sides of the same light emitting device 120 and the driving substrate 110 is maxThe distance L between the two opposite sides of the corresponding light-emitting device 120 is greater than the dimension L between the two opposite sides of the corresponding light-emitting device 120, wherein the point closest to the driving substrate 110 of the isolation portion 140 is the point on the isolation portion 140 where the light emitted by the light-emitting device 120 can be incident on the driving substrate 110, that is, the light emitted by the light-emitting device 120 cannot directly pass through the area between the isolation portion 140 and the driving substrate 110 to be incident on the area where the adjacent light-emitting device is located. With such a design, the light-emitting device 120 can be embedded between two adjacent isolation portions 140, and at least part of the light of the light-emitting device 120 can be reflected by the reflective layer 150. On the one hand, part of the side light can be reflected onto the driving substrate 110 to avoid light crosstalk between adjacent light-emitting devices 120, and on the other hand, part of the front light can be collimated and gathered toward the light-emitting direction to improve the brightness of the display module 10.

[0058] Please refer to Figure 5 The display module 10 further includes a transparent substrate 160, which is connected to the isolation portion 140 and the optical filling layer 130. Preferably, the transparent substrate 160 may be a glass substrate. In addition, in order to make the light output of the display module 10 more uniform, scattering particles may be doped in the optical filling layer 130. Preferably, the scattering particles may be silicon particles.

[0059] Based on the same inventive concept, this embodiment also provides a method for manufacturing the display module 10. Figure 6 and Figure 7 , Figure 6 The flowchart of the method for manufacturing a display module provided in this embodiment is illustrated. Figure 7 Example Figure 6 The corresponding process diagram is combined with the following Figure 6 and Figure 7 , each step of the method for manufacturing the display module 10 is described in detail.

[0060] Step S11 : providing a driving substrate 110 .

[0061] In this step, the driving substrate 110 includes an integrated driving circuit.

[0062] Step S12 : disposing the light emitting device 120 on the driving substrate 110 .

[0063] In this step, the light emitting device 120 may be a Micro LED. The light emitting device 120 may be transferred from the temporary substrate to the driving substrate 110 by mass transfer technology, and bonded to the driving electrodes on the driving substrate 110 .

[0064] Step S13 : manufacturing an optical filling layer 130 on the driving substrate 110 on which the light emitting devices 120 are arranged, so that the optical filling layer 130 is filled between adjacent light emitting devices 120 and covers the side of the light emitting device 120 away from the driving substrate 110 .

[0065] In this step, a transparent optical glue can be firstly applied on the driving substrate 110 on which the light emitting device 120 is arranged by a photolithography coating process as an optical filling layer 130. The thickness of the optical filling layer 130 needs to be greater than the height of the optical device so that it can completely cover the light emitting device 120. However, it should be noted that after the glue is applied, step S14 needs to be completed before high temperature or UV curing. It should be noted that in order to further improve the light uniformity of the display module 10, scattering particles can be doped in the optical filling layer 130. Preferably, the scattering particles can be silicon particles.

[0066] Step S14: making an isolation portion 140 embedded in the optical filling layer 130 to isolate the light emitted by two adjacent light emitting devices 120 .

[0067] In this step, black optical glue can be used to make the isolation part 140, and the height of the isolation part 140 in the direction perpendicular to the driving substrate 110 can be slightly higher than the thickness of the optical filling layer 130. In the process of embedding the isolation part 140 into the optical filling layer 130, the optical filling layer 130 is squeezed to fill the excess colloid into the gap between the isolation part 140 and the light-emitting device 120, thereby protecting the light-emitting device 120 from being squeezed and damaged by the isolation part 140.

[0068] In this embodiment, by making an optical filling layer 130 doped with scattering particles, the light output of the display module 10 can be made more uniform, achieving a better display effect. At the same time, an isolation portion 140 embedded in the optical filling layer 130 is made to isolate the side light of two adjacent light-emitting devices 120 in various directions, prevent the occurrence of light crosstalk, and improve the display effect.

[0069] For further information, please refer to Figure 8 and Fig. 9 , step S14 can be implemented by the following method.

[0070] Sub-step S141: providing a transparent substrate 160 .

[0071] In this step, the transparent substrate 160 may be a glass substrate.

[0072] Sub-step S142: a black isolation layer is formed on the transparent substrate 160 and patterned to obtain the isolation portion 140 , or a black isolation layer is formed on the transparent substrate 160 and patterned to obtain the isolation portion 140 .

[0073] In this step, a black optical adhesive may be coated on the transparent substrate 160 to form a black isolation layer, and then the black isolation layer is patterned by a photolithography process to obtain an isolation portion 140 protruding relative to the transparent substrate 160. Alternatively, a black optical adhesive may be coated on the transparent substrate 160 to form a black isolation layer composed of a plurality of black matrices, and then the transparent substrate 160 with the black isolation layer is placed in a specially designed mold, and the black photoresist is pressed into shape to obtain an isolation portion 140 protruding relative to the transparent substrate 160.

[0074] In addition, the distance between the isolation parts 140 located on opposite sides of the same light emitting device 120 can be gradually increased along the direction close to the driving substrate 110. For example, the cross-sectional shape of the isolation part 140 perpendicular to its extension direction includes an arc hemisphere, an inverted trapezoid, an inverted triangle, etc. Specifically, it can be understood that the minimum distance d between the isolation parts 140 located on opposite sides of the same light emitting device 120 is min is smaller than the dimension L between the two opposite sides of the corresponding light emitting device 120, and the maximum distance d between the isolation portions 140 located on the two opposite sides of the same light emitting device 120 is max The minimum distance H1 between the isolating portion 140 and the driving substrate 110 in the direction perpendicular to the driving substrate 110 is smaller than the height H2 of the light emitting device 120, so that the isolating portion 140 can isolate the side light emitted by two adjacent light emitting devices 120 as much as possible, thereby reducing the optical crosstalk of the adjacent light emitting devices 120.

[0075] Sub-step S143: Press the side of the transparent substrate 160 with the isolation part 140 facing the optical filling layer 130, so that the isolation part 140 is embedded in the optical filling layer 130, and the orthographic projection of the isolation part 140 on the driving substrate 110 is at least located between the orthographic projections of two adjacent light-emitting devices 120 on the driving substrate 110.

[0076] In this step, the orthographic projection of the isolation portion 140 on the driving substrate 110 is at least located between the orthographic projections of adjacent light-emitting devices 120 on the driving substrate 110, that is, the isolation portion 140 can be embedded between two adjacent light-emitting devices 120. The isolation portion 140 can separate the light of adjacent light-emitting devices 120, thereby avoiding light crosstalk between adjacent light-emitting devices 120 and improving the display effect.

[0077] Furthermore, please refer to the following method before sub-step S143.

[0078] First, a metal layer is formed on the isolation portion 140 and the transparent substrate 160 on one side of the isolation portion 140 by physical vapor deposition, and then the metal layer on the transparent substrate 160 is removed to obtain the reflective layer 150 on the surface of the isolation portion 140 .

[0079] In this embodiment, by forming a reflective layer 150 on the surface of the isolation portion 140, the reflective layer 150 can fully reflect at least part of the light emitted by the light emitting device 120, and part of the front light after total reflection is collimated and emitted in the light emitting direction, thereby improving the screen brightness of the display module 10; part of the side light after total reflection is emitted toward the driving substrate 110, thereby avoiding light crosstalk between adjacent light emitting devices 120. At the same time, considering the reflectivity of the material, the material of the reflective layer 150 can be high-reflectivity metal aluminum or metal silver.

[0080] Based on the same inventive concept, this embodiment also provides an electronic device, which may include the display module 10 described above. The display module 10 described above can avoid image blurring caused by light crosstalk between adjacent light-emitting devices 120, improve image display effects, and thus improve user experience of the electronic device and increase market competitiveness of the electronic device.

[0081] In summary, the embodiments of the present application provide a display module, a method for manufacturing a display module, and an electronic device. In a display module, by providing an isolation portion between adjacent light-emitting devices, not only can the light emitted by adjacent light-emitting devices be isolated to prevent the occurrence of light crosstalk, but also the light source can be effectively concentrated to improve the brightness of the display module.

[0082] The above description is only the preferred embodiment of the present application and is not intended to limit the present application. For those skilled in the art, the present application may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. A display module, characterized in that: The display module comprises: Driver substrate; Light-emitting devices, the light-emitting devices are distributed on the driving substrate; an optical filling layer, the optical filling layer being filled between adjacent light emitting devices and covering a side of the light emitting device away from the driving substrate; The isolating part is embedded in the optical filling layer and is used to isolate the light emitted by the adjacent light emitting devices.

2. The display module according to claim 1, wherein: The display module also includes a reflective layer; The reflective layer is arranged on the surface of the isolation portion; Preferably, the reflective layer is a metal coating; Preferably, the material of the reflective layer includes at least one of metal aluminum and metal silver.

3. The display module according to claim 2, wherein: The orthographic projection of the isolation portion on the driving substrate is at least located between the orthographic projections of two adjacent light-emitting devices on the driving substrate; Preferably, the isolation portion and the light emitting device are isolated by the optical filling layer; Preferably, the distance between the isolation parts located on opposite sides of the same light-emitting device gradually increases along the direction approaching the driving substrate; Preferably, in a direction perpendicular to the driving substrate, a minimum distance between the isolation portion and the driving substrate is smaller than a height of the light emitting device.

4. The display module according to claim 3, wherein: The minimum distance between the isolation parts located on the opposite sides of the same light-emitting device is smaller than the size between the corresponding opposite sides of the light-emitting device, and the distance between the points closest to the driving substrate of the isolation parts located on the opposite sides of the same light-emitting device is greater than the size between the corresponding opposite sides of the light-emitting device.

5. The display module according to any one of claims 1 to 4, characterized in that: The cross-sectional shape of the isolation portion perpendicular to its extending direction includes an arc-shaped hemisphere and an inverted trapezoid.

6. The display module according to claim 5, characterized in that: The display module further includes a transparent substrate, and the transparent substrate is connected to the isolation portion and the optical filling layer; Preferably, the optical filling layer is doped with scattering particles; Preferably, the scattering particles include silicon particles.

7. A method for manufacturing a display module, characterized in that: The production method comprises: Providing a driving substrate; Arranging a light emitting device on the driving substrate; Making an optical filling layer on the driving substrate on which the light-emitting devices are arranged, so that the optical filling layer is filled between adjacent light-emitting devices and covers a side of the light-emitting device away from the driving substrate; An isolation portion embedded in the optical filling layer is manufactured to isolate the light emitted by two adjacent light emitting devices.

8. The method for manufacturing a display module according to claim 7, characterized in that: The step of making a spacer embedded in the optical filling layer comprises: Providing a transparent substrate; A black isolation layer is formed on the transparent substrate, and the black isolation layer is patterned to obtain the isolation portion, or a black isolation layer is formed on the transparent substrate, and the isolation portion is obtained by a compression molding process; The side of the transparent substrate having the isolation portion is pressed toward the optical filling layer, so that the isolation portion is embedded in the optical filling layer, and the orthographic projection of the isolation portion on the driving substrate is at least located between the orthographic projections of two adjacent light-emitting devices on the driving substrate.

9. The method for manufacturing a display module according to claim 8, characterized in that: Before the step of pressing the side of the transparent substrate on which the isolation portion is made toward the optical filling layer to embed the isolation portion into the optical filling layer, the method further includes: Using physical vapor deposition to form a metal layer on the isolation portion and a transparent substrate on one side of the isolation portion; The metal layer on the transparent substrate is removed to obtain a reflective layer on the surface of the isolation portion.

10. An electronic device, characterized in that: The electronic device comprises the display module according to any one of claims 1-9.

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