Display panel, preparation method thereof and display device

Abstract

The invention provides a display panel, a preparation method thereof and a display device, and solves the problem of signal crosstalk of the display panel in the prior art. The display panel comprises a substrate, an isolation structure layer, a light emitting device and a shielding layer, the isolation structure layer is located on one side of the substrate, and a light transmitting opening and a light emitting opening are defined by the isolation structure layer; the light-emitting device is located in the light outlet and comprises a first electrode, and the first electrode is in lap joint with the isolation structure layer; the shielding layer is located in the light transmitting opening and is in lap joint with the isolation structure layer.

Description

Technical Field

[0001] The present application relates to the field of display technology, and in particular to a display panel and a method for preparing the same, and a display device. Background Art

[0002] Organic Light Emitting Display (OLED) and flat-panel display devices based on technologies such as Light Emitting Diode (LED) have been widely used in various consumer electronic products such as mobile phones, televisions, laptops, desktop computers, etc. due to their advantages such as high image quality, power saving, thin body and wide application range, becoming the mainstream in display devices.

[0003] However, there is a problem of signal crosstalk in current display panels. Summary of the invention

[0004] In view of this, the embodiments of the present application provide a display panel and a method for manufacturing the same, and a display device, which solve the problem of signal crosstalk in the display panel in the prior art.

[0005] The first aspect of the present application provides a display panel, including a substrate, an isolation structure layer, a light-emitting device and a shielding layer, wherein the isolation structure layer is located on one side of the substrate, and the isolation structure layer encloses a light-transmitting port and a light-exiting port; the light-emitting device is located in the light-exiting port, and the light-emitting device includes a first electrode, and the first electrode overlaps with the isolation structure layer; the shielding layer is located in the light-transmitting port and overlaps with the isolation structure layer.

[0006] In combination with the first aspect, in some possible implementations, it also includes a first inorganic encapsulation layer, the orthographic projection of the first inorganic encapsulation layer on the substrate covers the orthographic projections of the light-emitting device, the shielding layer and the isolation structure layer on the substrate; preferably, the first inorganic encapsulation layer is continuously arranged on the entire surface.

[0007] In combination with the first aspect, in some possible implementations, an inorganic encapsulation portion is further included, located between the light-emitting device and the first inorganic encapsulation layer; preferably, the inorganic encapsulation portion is in contact with the first inorganic encapsulation layer.

[0008] In combination with the first aspect, in some possible implementations, the orthographic projection of the inorganic packaging part on the substrate covers a partial area of ​​the orthographic projection of the light-emitting device on the substrate and the orthographic projection of the isolation structure on the substrate, and the partial area surrounds the orthographic projection of the light-emitting device on the substrate; preferably, a plurality of inorganic packaging parts are arranged at intervals; preferably, a plurality of inorganic packaging parts correspond one-to-one to a plurality of light-emitting devices; preferably, the inorganic packaging part is located on a surface of a side of the first electrode away from the substrate, and extends to a side wall of the isolation structure; preferably, on a side of the isolation structure layer away from the substrate, there is a gap between the inorganic packaging part and the isolation structure layer, and the first inorganic packaging layer fills the gap; preferably, the inorganic packaging part has a recess on a side away from the substrate, and the first inorganic packaging layer fills the recess.

[0009] In combination with the first aspect, in some possible implementations, the difference between the thickness of the inorganic encapsulation part and the thickness of the first inorganic encapsulation layer is less than or equal to 0.5 microns; preferably, the thickness of the first inorganic encapsulation layer is greater than or equal to 0.5 microns and less than or equal to 1 micron.

[0010] In combination with the first aspect, in some possible implementations, the inorganic encapsulation part and the first inorganic encapsulation layer are made of the same material.

[0011] In combination with the first aspect, in some possible implementations, it also includes an organic encapsulation layer, which is located on the side of the first inorganic encapsulation layer away from the substrate, and the orthographic projection of the organic encapsulation layer on the substrate is located within the orthographic projection range of the first inorganic encapsulation layer on the substrate; preferably, the display panel also includes a second inorganic encapsulation layer, which is located on the side of the organic encapsulation layer away from the substrate, and the orthographic projection of the second inorganic encapsulation layer on the substrate covers the orthographic projection of the organic encapsulation layer on the substrate.

[0012] In combination with the first aspect, in some possible implementations, a touch layer is further included, which is located on the side of the first inorganic encapsulation layer away from the substrate; preferably, the substrate includes at least one of a data signal line and a scan signal line.

[0013] In combination with the first aspect, in some possible implementations, the isolation structure layer includes a first part and a second part stacked together, the first part is located on the side of the second part facing away from the substrate, and the orthographic projection of the first part on the substrate covers the orthographic projection of the second part on the substrate; preferably, the shielding layer and the second part overlap.

[0014] In combination with the first aspect, in some possible implementations, the isolation structure layer also includes a third part, which is located on the side of the second part close to the substrate, and the orthographic projection of the second part on the substrate is located within the orthographic projection range of the third part on the substrate; preferably, the shielding layer and the third part overlap.

[0015] In combination with the first aspect, in some possible implementations, the thickness of the shielding layer is greater than or equal to the thickness of the third portion; preferably, the thickness of the shielding layer is greater than or equal to 0.1 micrometers and less than or equal to 0.2 micrometers.

[0016] In combination with the first aspect, in some possible implementations, the material of the shielding layer includes a transparent conductive material; preferably, the material of the shielding layer includes indium tin oxide.

[0017] In combination with the first aspect, in some possible implementations, it also includes a pixel definition layer, which is located between the substrate and the isolation structure layer, and the shielding layer is in contact with the pixel definition layer; preferably, the pixel definition layer encloses a pixel opening, and the orthographic projection of the pixel opening on the substrate is located within the orthographic projection range of the light outlet on the substrate; preferably, the light-emitting device also includes a second electrode, which is located on the side of the first electrode close to the substrate, and at least a portion of the second electrode is exposed to the pixel opening; preferably, the material of the pixel definition layer includes an inorganic material.

[0018] The second aspect of the present application provides a method for preparing a display panel, including preparing a second electrode on one side of a substrate; preparing an isolation structure layer on the side of the second electrode facing away from the substrate, the isolation structure layer enclosing a light-transmitting port and a light-exiting port, the light-exiting port exposing at least a portion of the second electrode; sequentially preparing a light-emitting layer, a first electrode and an inorganic encapsulation portion in the light-exiting port; and preparing a shielding layer in the light-transmitting port.

[0019] In combination with the second aspect, in some possible implementations, the light-emitting layer, the first electrode and the inorganic encapsulation part are first prepared in sequence in the light-emitting port, and then the shielding layer is prepared in the light-transmitting port.

[0020] In combination with the second aspect, in some possible implementations, it also includes: preparing a first inorganic encapsulation layer on the side of the inorganic encapsulation part, the isolation structure and the shielding layer facing away from the substrate; preparing an organic encapsulation layer on the side of the first inorganic encapsulation layer facing away from the substrate, and the orthographic projection of the organic encapsulation layer on the substrate is within the range of the orthographic projection of the first inorganic encapsulation layer on the substrate; preparing a second inorganic encapsulation layer on the side of the organic encapsulation layer facing away from the substrate, and the orthographic projection of the second inorganic encapsulation layer on the substrate covers the orthographic projection of the organic encapsulation layer on the substrate.

[0021] A third aspect of the present application provides a display device, comprising the above-mentioned display panel.

[0022] The display panel, preparation method thereof, and display device provided in the embodiments of the present application play a role in shielding signals by adding a shielding layer in the light-transmitting opening, thereby achieving full shielding between the signal line of the substrate and the touch layer, and avoiding signal crosstalk between the signal line of the substrate and the touch layer due to the light-transmitting opening not being covered by the first electrode. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] By describing the embodiments of the present application in more detail in conjunction with the accompanying drawings, the above and other purposes, features and advantages of the present application will become more apparent. The accompanying drawings are used to provide a further understanding of the embodiments of the present application and constitute a part of the specification. Together with the embodiments of the present application, they are used to explain the present application and do not constitute a limitation of the present application. In the accompanying drawings, the same reference numerals generally represent the same components or steps.

[0024] Figure 1 A schematic diagram of the cross-sectional structure of a display panel provided in the first embodiment of the present application.

[0025] Figure 2 for Figure 1 A schematic diagram of a partial cross-sectional structure of a display panel is shown.

[0026] Figure 3 A schematic diagram of the cross-sectional structure of a display panel provided in the second embodiment of the present application.

[0027] Figure 4 for Figure 3 A schematic diagram of a partial cross-sectional structure of a display panel is shown.

[0028] Figure 5 A flow chart of a method for manufacturing a display panel provided in the first embodiment of the present application.

[0029] Figure 6a-6f A schematic structural diagram of an intermediate product obtained during the execution of the preparation method provided in the first embodiment of the present application.

[0030] Figure 7 A flow chart of a method for preparing a display panel provided in the second embodiment of the present application.

[0031] Figure 8 A schematic diagram of the structure of a display device provided in one embodiment of the present application. DETAILED DESCRIPTION

[0032] As mentioned in the background technology, organic light emitting diodes (OLED) and flat panel display devices based on light emitting diodes (LED) and other technologies have been widely used in various consumer electronic products such as mobile phones, televisions, laptops, desktop computers, etc. due to their advantages such as high image quality, power saving, thin body and wide application range, becoming the mainstream in display devices.

[0033] The current display panel size is no longer limited by the fine metal mask. As one of the alternative technical means, an isolation structure is usually set in the display panel to isolate the film layer evaporated on the isolation structure, such as the organic light-emitting functional layer and cathode layer of the adjacent light-emitting device. However, in this case, the cathode layer except the light-emitting opening area is completely etched away, so there is a problem of signal crosstalk between the touch signal line at the ambient light hole position and the signal line of the substrate.

[0034] In view of this, the display panel, preparation method thereof and display device provided in the embodiments of the present application play a role in shielding signals by adding a shielding layer in the light-transmitting port, thereby achieving full shielding between the signal line of the substrate and the touch layer, and avoiding signal crosstalk between the signal line of the substrate and the touch layer due to the light-transmitting port not being covered by the first electrode.

[0035] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0036] In the accompanying drawings, the sizes of layers and regions may be exaggerated for clarity of illustration. It is understood that when a structure is referred to as being "on or under" another structure, the structure may be directly on or under the other structure, or there may be intermediate structures. The same reference numerals always indicate the same structure. The structures mentioned herein include any of a film layer, an element, a device, a component, and an assembly.

[0037] When a structure is referred to as being “connected” to another structure, the structure may be directly connected to the other structure or indirectly connected to the other structure with one or more intervening structures interposed therebetween.

[0038] Figure 1 FIG. 1 is a schematic diagram of a cross-sectional structure of a display panel provided in the first embodiment of the present application. Figure 1 As shown, the display panel includes a substrate 11, an isolation structure layer 12, a light emitting device 13 and a shielding layer 14. The isolation structure layer 12 is located on one side of the substrate 11, and the isolation structure layer 12 encloses a light transmission port 1201 and a light outlet 1202. The light emitting device 13 is located in the light outlet 1202, and the light emitting device 13 includes a first electrode 131, and the first electrode 131 overlaps the isolation structure layer 12. The shielding layer 14 is located in the light transmission port 1201 and overlaps the isolation structure layer 12.

[0039] Among them, the substrate 11 can be a substrate substrate. In some embodiments, the substrate substrate can be a glass-based substrate. In some embodiments, the substrate substrate can include an organic resin material such as epoxy resin, triazine, silicone resin or polyimide. For example, the substrate substrate can be an FR4 type printed circuit board (Printed circuit board, PCB), or it can be a flexible PCB that is easy to deform. In some embodiments, the substrate substrate can include a ceramic material such as silicon nitride, aluminum nitride or aluminum oxide, or include a metal or a metal compound. For example, the substrate substrate can be a metal core printed circuit board (Metal Core PCB, MCPCB) or a metal copper clad laminate (Metal Copper Clad Laminate, MCCL).

[0040] The substrate 11 further includes a plurality of signal lines. Exemplarily, the substrate 11 includes at least one of a data signal line and a scan signal line.

[0041] The light-emitting device 13 may be an organic light-emitting diode (OLED), a micro light-emitting diode (Micro LED), a quantum dot light-emitting diode (QLED), etc. The light-emitting device 13 may be a light-emitting device of various colors, such as a red light-emitting device R, a green light-emitting device G, a blue light-emitting device B, etc.

[0042] The light emitting device 13 includes a first electrode 131 and a second electrode 132, and at least one organic light emitting functional layer 133 located between the first electrode 131 and the second electrode 132. The second electrode 132 is located on the side of the first electrode 131 close to the substrate 11. The first electrode 131 may be a cathode, and the second electrode 132 may be an anode. The at least one organic light emitting functional layer 133 includes an emitting layer (EML), and may also include at least one of a hole injection layer (HIL), a hole transport layer (HTL), and an electron blocking layer (EBL) located between the anode and the emitting layer (EML), and at least one of an electron injection layer (EIL), an electron transport layer (ETL), and a hole blocking layer (HBL) located between the cathode and the emitting layer (EML).

[0043] The isolation structure layer 12 is used to electrically isolate the adjacent light-emitting devices 13, and specifically can isolate at least part of the organic light-emitting functional layer 133 and the first electrode 131 of the adjacent light-emitting devices 13. In one embodiment, the isolation structure layer 12 includes a stacked first portion 121 and a second portion 122, the first portion 121 is located on the side of the second portion 122 away from the substrate 11, and the orthographic projection of the first portion 121 on the substrate 11 covers the orthographic projection of the second portion 122 on the substrate 11. Exemplarily, the second portion 122 can be designed as an independent film layer, that is, there is no physical interface inside the second portion 122, and each part is composed of the same material, for example, the material of the second portion 122 is aluminum. Alternatively, the second portion 122 can be designed to be composed of at least two film layers stacked. For example, the second portion 122 is formed by stacking two conductive film layers. The materials of the two conductive film layers can be molybdenum and aluminum, respectively, and the conductive film layer composed of molybdenum is located between the substrate 11 and the conductive film layer composed of aluminum. Exemplarily, the second portion 122 includes a conductive sub-portion, or the second portion 122 itself is a conductive structure. The second portion 122 overlaps the first electrode 131 of the light emitting device 13, so that the first electrodes 131 of adjacent light emitting devices 13 are electrically connected to each other, thereby realizing a full-surface cathode. The material of the first portion 121 can be an organic material, an inorganic material, or a metal material. In the case where the first portion 121 is a metal material, the material of the first portion 121 can be titanium.

[0044] In one embodiment, the isolation structure 12 further includes a third portion 123, which is located on the side of the second portion 122 close to the substrate 11, and the orthographic projection of the second portion 122 on the substrate 11 is located within the orthographic projection range of the third portion 123 on the substrate 11. Exemplarily, the second portion 122 is a conductive film layer composed of aluminum, and the third portion 123 is a conductive film layer composed of molybdenum. In this case, the cross-section of the isolation structure 12 is I-shaped.

[0045] The display panel further includes a pixel definition layer 15, which is located between the substrate 11 and the isolation structure layer 12. The pixel definition layer 15 encloses a pixel opening 151, and the orthographic projection of the pixel opening on the substrate 11 is located within the orthographic projection range of the light outlet 1202 on the substrate. At least part of the second electrode 132 is exposed in the pixel opening 1501. Exemplarily, the material of the pixel definition layer 15 includes an inorganic material.

[0046] Optionally, the pixel definition layer 15 may be made of a light-transmitting material so that the light of the light-emitting device 13 can better pass through the pixel definition layer. Optionally, the pixel definition layer 15 may be made of an opaque material, which can improve the light absorption of the pixel definition layer 15, reduce the reflectivity of the display panel, further reduce the optical crosstalk between adjacent light-emitting devices 13, and improve the display effect of the display panel.

[0047] The shielding layer 14 overlaps with the isolation structure layer 12 to shield the signal, realize full shielding between the signal line of the substrate 11 and the touch layer, and avoid signal crosstalk between the signal line of the substrate 11 and the touch layer due to the light-transmitting opening 1201 not being covered by the first electrode 131. Exemplarily, the shielding layer 14 can overlap with the second portion 122 of the isolation structure layer 12. Exemplarily, the shielding layer 14 can overlap with the third portion 123 of the isolation structure layer 12.

[0048] Figure 2 for Figure 1 The partial cross-sectional structure diagram of the display panel is shown in FIG. Figure 2 As shown, the thickness L1 of the shielding layer 14 is greater than or equal to the thickness L2 of the third portion 123. Exemplarily, the thickness L1 of the shielding layer 14 is greater than or equal to 0.1 micrometer and less than or equal to 0.2 micrometer, for example, the thickness L1 of the shielding layer 14 is 0.1 micrometer, 0.15 micrometer, 0.2 micrometer, etc.

[0049] The material of the shielding layer 14 includes a transparent conductive material, and the light transmittance of the shielding layer 14 is greater than or equal to 80%. Exemplarily, the material of the shielding layer 14 includes indium tin oxide. Exemplarily, the light transmittance of the shielding layer 14 is 90%. Compared with the non-light-transmitting metal layer, the shielding layer 14 can achieve signal shielding while also avoiding excessive light transmission loss of the light-transmitting port 1201.

[0050] Please refer again Figure 1 In one embodiment, the shielding layer 14 is in contact with the pixel definition layer 15 .

[0051] The display panel further includes an inorganic encapsulation part 17, which is located on the side of the light-emitting device 13 away from the substrate 11, and the orthographic projection of the inorganic encapsulation part 17 on the substrate 11 covers the orthographic projection of the light-emitting device 13 on the substrate 11 and a partial area of ​​the orthographic projection of the isolation structure 12 on the substrate 11, wherein the partial area surrounds the orthographic projection of the light-emitting device 13 on the substrate 11. Exemplarily, the material of the inorganic encapsulation part 17 is silicon oxide, silicon oxynitride or silicon nitride, etc. The inorganic encapsulation part 17 can be a single layer, a multi-layer, a composite layer, etc.

[0052] In one embodiment, there are multiple inorganic packaging parts 17 , and the multiple inorganic packaging parts 17 are arranged at intervals.

[0053] In one embodiment, the plurality of inorganic encapsulation parts 17 correspond one-to-one to the plurality of light emitting devices 13 .

[0054] In one embodiment, the non-polar encapsulation portion 17 is located on a surface of the first electrode 131 that is away from the substrate 11 , and extends to a side wall of the isolation structure 12 .

[0055] According to the display panel provided by the embodiment of the present application, a shielding layer is added in the light-transmitting opening to shield the signal, thereby achieving full shielding between the signal line of the substrate and the touch layer, thereby avoiding signal crosstalk between the signal line of the substrate and the touch layer due to the light-transmitting opening not being covered by the first electrode. Furthermore, the material of the shielding layer includes a transparent conductive material, and compared with the non-light-transmitting metal layer, the shielding layer can achieve signal shielding while also avoiding excessive light transmission loss at the light-transmitting opening.

[0056] Figure 3 This is a schematic diagram of the cross-sectional structure of a display panel provided in the second embodiment of the present application. Figure 3 and Figure 1 The display panel shown in the figure is different in that, in this embodiment, the display panel further includes a first inorganic encapsulation layer 18 .

[0057] In one embodiment, the first inorganic encapsulation layer 18 is disposed continuously over the entire surface.

[0058] The inorganic encapsulation part 17 is located between the light emitting device 13 and the first inorganic encapsulation layer 18, and the inorganic encapsulation part 17 is in contact with the first inorganic encapsulation layer 18. The orthographic projection of the first inorganic encapsulation layer 18 on the substrate 11 covers the orthographic projections of the light emitting device 13, the shielding layer 14 and the isolation structure layer 12 on the substrate 11, respectively, and can protect the shielding layer 14, and can also protect the overlapping position of the shielding layer 14 and the isolation structure layer 12 from being affected by water vapor.

[0059] Figure 4 for Figure 3 The partial cross-sectional structure diagram of the display panel is shown in FIG. Figure 4 As shown, the difference between the thickness L3 of the inorganic packaging part 17 and the thickness L4 of the first inorganic packaging layer 18 is less than or equal to 0.5 microns. For example, the difference between the thickness L3 of the inorganic packaging part 17 and the thickness L4 of the first inorganic packaging layer 18 is 0.5 microns, 0.4 microns, 0.3 microns, etc., so that the process parameters of the inorganic packaging part 17 and the first inorganic packaging layer 18 are similar, which facilitates the preparation of the inorganic packaging part 17 and the first inorganic packaging layer 18.

[0060] In one embodiment, the thickness L4 of the first inorganic encapsulation layer 18 is greater than or equal to 0.5 micrometers and less than or equal to 1 micrometer. For example, the thickness L4 of the first inorganic encapsulation layer 18 may be 0.5 micrometers, 0.7 micrometers, 1 micrometer, etc.

[0061] The first inorganic encapsulation layer 18 is made of the same material as the inorganic encapsulation portion 17. For example, the first inorganic encapsulation layer 18 is made of silicon oxide, silicon oxynitride or silicon nitride. The first inorganic encapsulation layer 18 may be a single layer, a multi-layer, a composite layer or the like.

[0062] Since the inorganic encapsulation part 17 may be damaged to varying degrees during the preparation process, a gap 171 is provided between the inorganic encapsulation part 17 and the isolation structure layer 12 on the side of the isolation structure layer 12 away from the substrate 11 , which affects the encapsulation effect of the display panel.

[0063] In one embodiment, the first inorganic encapsulation layer 18 fills the gap 171 to compensate for the encapsulation defects of the inorganic encapsulation part 17 and improve the encapsulation effect of the display panel.

[0064] In one embodiment, the inorganic encapsulation part 17 has a recess 172 on one side away from the substrate 11, and the first inorganic encapsulation layer 18 fills the recess 172, which improves the flatness of the film layer and can also improve the encapsulation effect of the display panel. Exemplarily, the orthographic projection of the recess 72 on the substrate 11 and the orthographic projection of the isolation structure 12 on the substrate 11 at least partially overlap.

[0065] Please refer again Figure 3 The display panel further includes a touch layer 16 , which is located on a side of the first inorganic encapsulation layer 18 away from the substrate 11 .

[0066] The display panel further includes an organic encapsulation layer 19, which is located on the side of the first inorganic encapsulation layer 18 away from the substrate 11, and the orthographic projection of the organic encapsulation layer 18 on the substrate 11 is located within the orthographic projection range of the first inorganic encapsulation layer 18 on the substrate 11. Exemplarily, the material of the organic encapsulation layer 19 is a fiber material, a resin material, or a material for a laminated multilayer board, etc. The organic encapsulation layer 19 can be a single layer, a multilayer, a composite layer, etc.

[0067] The display panel further includes a second inorganic encapsulation layer 20, which is located on the side of the organic encapsulation layer 19 away from the substrate 11, and the orthographic projection of the second inorganic encapsulation layer 20 on the substrate 11 covers the orthographic projection of the organic encapsulation layer 19 on the substrate. Exemplarily, the material of the second inorganic encapsulation layer 20 is silicon oxide, silicon oxynitride or silicon nitride, etc. The second inorganic encapsulation layer 20 can be a single layer, a multi-layer, a composite layer, etc.

[0068] In one embodiment, the touch layer 18 is located on a side of the second inorganic encapsulation layer 20 facing away from the substrate 11 .

[0069] According to the display panel provided by the embodiment of the present application, by adding a shielding layer in the light-transmitting opening, the function of shielding the signal is achieved, and the signal line of the substrate and the touch layer are fully shielded, so as to avoid signal crosstalk between the signal line of the substrate and the touch layer due to the light-transmitting opening not being covered by the first electrode. Furthermore, by arranging a whole layer of the first inorganic encapsulation layer on the side of the inorganic encapsulation part away from the substrate, that is, the orthographic projection of the first inorganic encapsulation layer on the substrate covers the orthographic projections of the light-emitting device, the shielding layer and the isolation structure layer on the substrate, the shielding layer can be protected, and the overlapping position of the shielding layer and the isolation structure layer can be protected from being affected by water vapor.

[0070] The embodiment of the present application also provides a method for preparing a display panel. Figure 5 This is a flow chart of a method for preparing a display panel provided in the first embodiment of the present application. The preparation method is used to prepare a display panel provided in any of the above embodiments. Figure 5 As shown, the preparation method comprises:

[0071] Step S510, preparing a second electrode on one side of the substrate.

[0072] Step S520: preparing an isolation structure layer on the side of the second electrode facing away from the substrate, the isolation structure layer enclosing a light-transmitting port and a light-emitting port, and the light-emitting port exposes at least a portion of the second electrode.

[0073] Step S530, preparing a light-emitting layer, a first electrode and an inorganic packaging part in sequence in the light outlet.

[0074] Step S540, preparing a shielding layer in the light-transmitting opening.

[0075] Figure 6a-6f This is a schematic diagram of the structure of an intermediate product obtained during the execution of the preparation method provided in the first embodiment of the present application. The preparation method specifically includes:

[0076] According to step S510, refer to Figure 6a , a second electrode 132 is prepared on one side of the substrate 11.

[0077] According to step S520, refer to Figure 6b , an isolation structure layer 12 is prepared on the side of the second electrode 132 facing away from the substrate 11 .

[0078] The isolation material layer is prepared by film forming process, and then the isolation material layer is patterned to obtain the isolation structure layer 12. For example, a groove can be formed on the isolation material layer by dry etching process, and then the sidewall of the groove can be further etched by wet etching process to form an undercut structure.

[0079] The isolation mechanism layer 12 encloses a light-transmitting opening 1201 and a light-exiting opening 1202 , and the light-exiting opening 1202 exposes at least a portion of the second electrode 132 .

[0080] According to step S530, first, refer to Figure 6c A light-emitting layer and a first electrode layer are sequentially prepared on the side of the isolation structure layer 12 facing away from the substrate 11. The light-emitting layer and the first electrode layer are disconnected at the isolation structure layer 12 to obtain a light-emitting unit 1301 and a first electrode 132 respectively, wherein the light-emitting unit 1301 and the first electrode 132 are located in the light outlet 1202.

[0081] The light-emitting layer and the first electrode layer can be formed by an evaporation process.

[0082] Second, see Figure 6d , an inorganic packaging material layer 160 is prepared on the side of the first electrode 132 away from the substrate 11, wherein the inorganic packaging material layer 160 can be formed by a thin film deposition process.

[0083] Finally, see Figure 6e , the inorganic packaging material layer 170 is patterned and etched to obtain the inorganic packaging part 17.

[0084] According to step S540, refer to Figure 6f A shielding material layer is prepared on the side of the isolation mechanism layer 12 facing away from the substrate 11 , and then the shielding material layer is patterned to obtain a shielding layer 14 .

[0085] The shielding material layer can be formed by a sputtering process.

[0086] In the above embodiment, the light-emitting layer, the first electrode 132 and the inorganic packaging part 16 are first prepared in sequence in the light outlet 1202, and then the shielding layer 14 is prepared in the light-transmitting port 1201. The process is simple, and the inorganic packaging part 16 can provide protection for the display panel to avoid damage to the display panel when the shielding layer 14 is prepared in the light-transmitting port 1201.

[0087] It should be understood that, in some embodiments, the shielding layer 14 may be first prepared in the light-transmitting port 1201 , and then the light-emitting layer, the first electrode 132 and the inorganic encapsulation portion 16 may be sequentially prepared in the light-emitting port 1202 .

[0088] According to the method for preparing a display panel provided in an embodiment of the present application, a shielding layer is added in the light-transmitting port to shield the signal, thereby achieving full shielding between the signal line of the substrate and the touch layer, thereby avoiding signal crosstalk between the signal line of the substrate and the touch layer due to the light-transmitting port not being covered by the first electrode.

[0089] Figure 7 This is a flow chart of a method for manufacturing a display panel provided in the second embodiment of the present application. Figure 7 As shown, the preparation method also includes:

[0090] Step S550 , preparing a first inorganic encapsulation layer on the side of the inorganic encapsulation part, the isolation structure and the shielding layer facing away from the substrate.

[0091] Among them, the orthographic projection of the first inorganic packaging layer 18 on the substrate 11 covers the orthographic projections of the light-emitting device 13, the shielding layer 14 and the isolation structure layer 12 on the substrate 11, which can protect the shielding layer 14 and the overlapping position of the shielding layer 14 and the isolation structure layer 12 from being affected by water vapor.

[0092] Step S560 , preparing an organic encapsulation layer on the side of the first inorganic encapsulation layer facing away from the substrate, wherein the orthographic projection of the organic encapsulation layer on the substrate is within the range of the orthographic projection of the first inorganic encapsulation layer on the substrate.

[0093] Step S570 , preparing a second inorganic encapsulation layer on the side of the organic encapsulation layer facing away from the substrate, the orthographic projection of the second inorganic encapsulation layer on the substrate covering the orthographic projection of the organic encapsulation layer on the substrate.

[0094] According to the method for preparing a display panel provided in an embodiment of the present application, a first inorganic packaging layer is arranged as a whole on the side of the inorganic packaging part facing away from the substrate, that is, the orthographic projection of the first inorganic packaging layer on the substrate covers the orthographic projections of the light-emitting device, the shielding layer and the isolation structure layer on the substrate, thereby protecting the shielding layer and the overlapping position of the shielding layer and the isolation structure layer from being affected by water vapor.

[0095] Figure 8 This is a schematic diagram of the structure of a display device provided in one embodiment of the present application. Figure 8 As shown, the display device is a product with an image display function. For example, the display device can be used to display static images, such as pictures or photos. The display device can also be used to display dynamic images, such as videos.

[0096] The display device can be a laptop computer, a mobile phone, a handheld or portable computer, a camera, a camcorder, a vehicle-mounted intelligent central control screen, a calculator, a smart watch, a GPS navigator, an electronic photo, an electronic billboard or sign, a projector, etc.

[0097] The display device includes the display panel 80 provided by any of the above embodiments. The display panel 80 may be an organic light emitting diode display substrate or a quantum dot electroluminescent display substrate.

[0098] In addition, the display device may also have functions such as taking photos, recording videos, fingerprint recognition, and face recognition. Accordingly, the display device also includes at least one functional module for realizing the above functions, such as an under-screen camera, an under-screen fingerprint recognition sensor, and the like.

[0099] The basic principles of the present application are described above in conjunction with specific embodiments. However, it should be noted that the advantages, strengths, effects, etc. mentioned in the present application are only examples and not limitations, and it cannot be considered that these advantages, strengths, effects, etc. are required by each embodiment of the present application. In addition, the specific details disclosed above are only for the purpose of illustration and ease of understanding, not for limitation, and the above details do not limit the present application to being implemented by adopting the above specific details.

[0100] The above description has been given for the purpose of illustration and description. In addition, this description is not intended to limit the embodiments of the present application to the forms disclosed herein. Although multiple example aspects and embodiments have been discussed above, those skilled in the art will recognize certain variations, modifications, changes, additions and sub-combinations thereof.

Claims

1. A display panel, characterized in that: include: substrate; An isolation structure layer, located on one side of the substrate, the isolation structure layer encloses the light transmission port and the light output port; A light emitting device is located in the light outlet, the light emitting device comprises a first electrode, and the first electrode overlaps the isolation structure layer; as well as The shielding layer is located in the light-transmitting opening and overlaps with the isolation structure layer.

2. The display panel according to claim 1, characterized in that: It also includes a first inorganic encapsulation layer, wherein the orthographic projection of the first inorganic encapsulation layer on the substrate covers the orthographic projections of the light-emitting device, the shielding layer and the isolation structure layer on the substrate; Preferably, the first inorganic encapsulation layer is continuously disposed over the entire surface.

3. The display panel according to claim 2, characterized in that: It also includes an inorganic encapsulation part, which is located between the light-emitting device and the first inorganic encapsulation layer; Preferably, the inorganic encapsulation part is in contact with the first inorganic encapsulation layer.

4. The display panel according to claim 3, characterized in that: The orthographic projection of the inorganic encapsulation part on the substrate covers the orthographic projection of the light-emitting device on the substrate and a partial area of ​​the orthographic projection of the isolation structure on the substrate, and the partial area surrounds the orthographic projection of the light-emitting device on the substrate; Preferably, a plurality of the inorganic packaging parts are arranged at intervals; Preferably, the plurality of inorganic encapsulation parts correspond one-to-one to the plurality of light-emitting devices; Preferably, the inorganic encapsulation portion is located on a surface of the first electrode that is away from the substrate, and extends to a side wall of the isolation structure; Preferably, on a side of the isolation structure layer facing away from the substrate, there is a gap between the inorganic encapsulation part and the isolation structure layer, and the first inorganic encapsulation layer fills the gap; Preferably, the inorganic encapsulation part has a recess on a side away from the substrate, and the first inorganic encapsulation layer fills the recess.

5. The display panel according to claim 3, characterized in that: The difference between the thickness of the inorganic encapsulation portion and the thickness of the first inorganic encapsulation layer is less than or equal to 0.5 micrometer; Preferably, the thickness of the first inorganic encapsulation layer is greater than or equal to 0.5 micrometer and less than or equal to 1 micrometer.

6. The display panel according to claim 3, characterized in that: The inorganic encapsulation part and the first inorganic encapsulation layer are made of the same material.

7. The display panel according to claim 2, characterized in that: It also includes an organic encapsulation layer, which is located on the side of the first inorganic encapsulation layer away from the substrate, and the orthographic projection of the organic encapsulation layer on the substrate is located within the orthographic projection range of the first inorganic encapsulation layer on the substrate; Preferably, the display panel further comprises a second inorganic encapsulation layer located on a side of the organic encapsulation layer away from the substrate, and an orthographic projection of the second inorganic encapsulation layer on the substrate covers an orthographic projection of the organic encapsulation layer on the substrate.

8. The display panel according to claim 2, characterized in that: It also includes a touch layer located on a side of the first inorganic encapsulation layer away from the substrate; Preferably, the substrate includes at least one of a data signal line and a scan signal line.

9. The display panel according to claim 1, characterized in that: The isolation structure layer comprises a first portion and a second portion stacked together, the first portion is located on a side of the second portion away from the substrate, and an orthographic projection of the first portion on the substrate covers an orthographic projection of the second portion on the substrate; Preferably, the shielding layer and the second portion are overlapped.

10. The display panel according to claim 9, characterized in that: The isolation structure layer further includes a third portion, which is located on a side of the second portion close to the substrate, and an orthographic projection of the second portion on the substrate is located within the orthographic projection range of the third portion on the substrate; Preferably, the shielding layer and the third part are overlapped.

11. The display panel according to claim 10, characterized in that: The thickness of the shielding layer is greater than or equal to the thickness of the third portion; Preferably, the thickness of the shielding layer is greater than or equal to 0.1 micrometer and less than or equal to 0.2 micrometer.

12. The display panel according to claim 1, characterized in that: The material of the shielding layer includes a transparent conductive material; Preferably, the material of the shielding layer includes indium tin oxide.

13. The display panel according to claim 1, characterized in that: It also includes a pixel definition layer, which is located between the substrate and the isolation structure layer, and the shielding layer is in contact with the pixel definition layer; Preferably, the pixel definition layer encloses a pixel opening, and the orthographic projection of the pixel opening on the substrate is located within the orthographic projection range of the light outlet on the substrate; Preferably, the light emitting device further comprises a second electrode, which is located on a side of the first electrode close to the substrate, and at least a portion of the second electrode is exposed to the pixel opening; Preferably, the material of the pixel definition layer includes an inorganic material.

14. A method for preparing a display panel, characterized in that: include: Prepare a second electrode on one side of the substrate; An isolation structure layer is prepared on a side of the second electrode facing away from the substrate, the isolation structure layer encloses a light transmission port and a light outlet, and the light outlet exposes at least a portion of the second electrode; Sequentially preparing a light-emitting layer, a first electrode and an inorganic encapsulation part in the light outlet; A shielding layer is prepared in the light-transmitting opening.

15. The preparation method according to claim 14, characterized in that: First, the light-emitting layer, the first electrode and the inorganic encapsulation part are sequentially prepared in the light-exiting port, and then the shielding layer is prepared in the light-transmitting port.

16. The preparation method according to claim 14, characterized in that: Also includes: Prepare a first inorganic encapsulation layer on the side of the inorganic encapsulation part, the isolation structure and the shielding layer away from the substrate; An organic encapsulation layer is prepared on a side of the first inorganic encapsulation layer facing away from the substrate, wherein the orthographic projection of the organic encapsulation layer on the substrate is within the range of the orthographic projection of the first inorganic encapsulation layer on the substrate; A second inorganic encapsulation layer is prepared on a side of the organic encapsulation layer facing away from the substrate, and the orthographic projection of the second inorganic encapsulation layer on the substrate covers the orthographic projection of the organic encapsulation layer on the substrate.

17. A display device, characterized in that: A display panel comprising any one of claims 1-13.

Images