Display panel, manufacturing method of display panel and electronic equipment

Abstract

The invention provides a display panel, a manufacturing method of the display panel and electronic equipment. The display panel comprises a substrate; the plurality of first electrodes are positioned on one side of the substrate and are arranged at intervals; the first planarization layer is positioned on one side, far away from the substrate, of the first electrode; the first planarization layer comprises a first opening, and at least part of the first electrode is exposed out of the first opening; the first insulating layer is located on the side, away from the substrate, of the first planarization layer and comprises a second opening; the isolation structure is located on the side, away from the substrate, of the first insulation layer and comprises a third opening. The first planarization layer is additionally arranged on the first electrode, and the first insulation layer and the isolation structure are arranged on the first planarization layer, so that the flatness of a film layer below the isolation structure is improved, the influence of the thickness of the first electrode on the arrangement position of the isolation structure is reduced, and the flexibility of the arrangement position of the isolation structure is improved; therefore, the pixel aperture ratio of the display panel can be improved.

Description

Technical Field

[0001] The present application relates to the field of display technology, and in particular, to a display panel, a method for manufacturing a display panel, and an electronic device. Background Art

[0002] Organic Light Emitting Diode (OLED) and flat panel display devices based on technologies such as Light Emitting Diode (LED) have been widely used in various consumer electronic products such as mobile phones, televisions, laptops, desktop computers, etc. due to their advantages such as high image quality, power saving, thin body and wide application range, becoming the mainstream in display devices.

[0003] However, the process performance of current OLED display products needs to be improved. Summary of the invention

[0004] In order to overcome the above-mentioned deficiencies in the prior art, the object of the present application is to provide a display panel, the display panel comprising:

[0005] substrate;

[0006] A plurality of first electrodes disposed on one side of the substrate and spaced apart from each other;

[0007] a first planarization layer located on a side of the first electrode away from the substrate; the first planarization layer comprises a first opening, and the first opening exposes at least a portion of the first electrode;

[0008] a first insulating layer located on a side of the first planarization layer away from the substrate, the first insulating layer comprising a second opening, an orthographic projection of the second opening on the substrate at least partially overlapping with an orthographic projection of the first opening on the substrate;

[0009] An isolation structure is located on a side of the first insulating layer away from the substrate, the isolation structure comprises a third opening, and an orthographic projection of the second opening on the substrate is located within an orthographic projection of the third opening on the substrate.

[0010] In some possible implementations, a maximum thickness of the first planarization layer in a direction away from the substrate is greater than a maximum thickness of the first electrode.

[0011] In some possible implementations, an edge of an orthographic projection of the first electrode on the substrate is located within an orthographic projection of the first planarization layer on the substrate.

[0012] In some possible implementations, the material of the first planarization layer includes an organic material.

[0013] In some possible implementations, the first insulating layer covers a side wall of the first planarization layer facing the first opening;

[0014] Preferably, the first insulating layer comprises a pixel defining layer;

[0015] Preferably, the material of the first insulating layer includes an inorganic material.

[0016] In some possible implementations, an orthographic projection of the isolation structure on the substrate is located within an orthographic projection of the first planarization layer on the substrate.

[0017] In some possible implementations, the display panel further includes an array wiring layer located on one side of the substrate and a second insulating layer located on a side of the array wiring layer away from the substrate;

[0018] The first electrode is located on a side of the second insulating layer away from the substrate. The first electrode is electrically connected to the wiring in the array wiring layer through a through hole penetrating the second insulating layer. The orthographic projection of the through hole on the substrate is located within the orthographic projection of the first planarization layer on the substrate.

[0019] In some possible implementations, a minimum width of the isolation structure between two adjacent third openings ranges from 2.8 micrometers to 3.2 micrometers.

[0020] In some possible implementations, the second opening and the third opening are connected to form a pixel opening, and the display panel further includes a light emitting unit and a second electrode at least partially located in the pixel opening and stacked in a direction away from the substrate;

[0021] Preferably, at least a portion of the isolation structure is conductive, and the second electrode is electrically connected to the isolation structure.

[0022] In some possible implementations, the display panel further includes an encapsulation unit located on a side of the second electrode away from the substrate, and the encapsulation unit extends from within the pixel opening to a side of the isolation structure away from the substrate;

[0023] Preferably, there is a gap between at least two adjacent packaging units, and the gap is located on a side of the isolation structure away from the substrate.

[0024] In some possible implementations, the display panel further includes a first encapsulation layer and a second encapsulation layer located on a side of the encapsulation unit and the isolation structure away from the substrate;

[0025] Preferably, the material of the encapsulation unit and the second encapsulation layer includes an inorganic material; and / or the material of the first encapsulation layer includes an organic material.

[0026] In some possible implementations, the isolation structure includes a supporting portion and a shielding portion located on a side of the supporting portion away from the substrate, and an orthographic projection of the supporting portion on the substrate is located within an orthographic projection of the shielding portion on the substrate;

[0027] Preferably, the etching resistance of the supporting portion is weaker than that of the shielding portion;

[0028] Preferably, the material of the supporting portion includes aluminum, and / or the material of the shielding portion includes titanium.

[0029] In some possible implementations, the isolation structure further includes a receiving portion located between the support portion and the substrate;

[0030] Preferably, the orthographic projection of the supporting portion on the substrate is located within the orthographic projection of the receiving portion on the substrate;

[0031] Preferably, the orthographic projection of the receiving portion on the substrate is located within the orthographic projection of the shielding portion on the substrate;

[0032] Preferably, the material of the receiving portion includes molybdenum.

[0033] Another object of the present application is to provide a display panel, the display panel comprising:

[0034] substrate;

[0035] A plurality of first electrodes disposed on one side of the substrate and spaced apart from each other;

[0036] A first insulating layer is located on a side of the first electrode away from the substrate, the first insulating layer includes a second opening, and the second opening exposes at least a portion of the first electrode; the first insulating layer includes a first region and a second region, the orthographic projection of the first region on the substrate coincides with the orthographic projection of the first electrode on the substrate, and the orthographic projection of the second region on the substrate does not coincide with the orthographic projection of the first electrode on the substrate; a difference between a first distance from the side of the first region away from the substrate to the substrate and a second distance from the side of the second region away from the substrate to the substrate is less than 0.1 micrometers.

[0037] Another object of the present application is to provide a method for manufacturing a display panel, the method comprising:

[0038] providing a substrate;

[0039] forming a plurality of first electrodes spaced apart from each other on one side of the substrate;

[0040] forming a first planarization layer on a side of the first electrode away from the substrate, wherein the first planarization layer comprises a first opening, and the first opening exposes at least a portion of the first electrode;

[0041] A first insulating layer and an isolation structure are formed on a side of the first planarization layer away from the substrate and stacked in a direction away from the substrate, the first insulating layer includes a second opening, and the orthographic projection of the second opening on the substrate is located within the orthographic projection of the first opening on the substrate; the isolation structure includes a third opening, and the orthographic projection of the second opening on the substrate is located within the orthographic projection of the third opening on the substrate.

[0042] In some possible implementations, the step of forming a first insulating layer and an isolation structure stacked in a direction away from the substrate on a side of the first planarization layer away from the substrate includes:

[0043] Disposing a first insulating material covering the entire layer on a side of the first planarization layer away from the substrate;

[0044] forming an isolation material on a side of the first insulating material away from the substrate;

[0045] Etching the isolation material to form an isolation structure having the third opening; the third opening exposes at least a portion of the first insulating material;

[0046] The first insulating material exposed through the third opening is etched to form the first insulating layer having the second opening.

[0047] Another object of the present application is to provide an electronic device, which includes the display panel provided in the present application, or the electronic device includes a display panel manufactured by the manufacturing method of the display panel provided in the present application.

[0048] Compared with the prior art, this application has the following beneficial effects:

[0049] The present application provides a display panel, a method for manufacturing a display panel, and an electronic device. By adding a first planarization layer on a first electrode, a first insulating layer and an isolation structure are arranged on the first planarization layer, thereby improving the flatness of the film layer below the isolation structure, reducing the influence of the thickness of the first electrode on the setting position of the isolation structure, and improving the flexibility of the setting position of the isolation structure, thereby improving the pixel aperture ratio of the display panel. BRIEF DESCRIPTION OF THE DRAWINGS

[0050] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for use in the embodiments will be briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present application and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without paying creative work.

[0051] Figure 1 is a schematic diagram of a conventional display panel;

[0052] Figure 2 One of the schematic diagrams of the display panel provided in this embodiment;

[0053] Figure 3 A second schematic diagram of a display panel provided in this embodiment;

[0054] Figure 4 A third schematic diagram of a display panel provided in this embodiment;

[0055] Figure 5 A fourth schematic diagram of a display panel provided in this embodiment;

[0056] Figure 6 A fifth schematic diagram of a display panel provided in this embodiment;

[0057] Figure 7 A sixth schematic diagram of a display panel provided in this embodiment;

[0058] Figure 8 One of the schematic diagrams of the isolation structure provided in this embodiment;

[0059] Fig. 9 A second schematic diagram of the isolation structure provided in this embodiment;

[0060] Fig.10 A seventh schematic diagram of a display panel provided in this embodiment;

[0061] Fig.11 A schematic diagram of a method for manufacturing a display panel provided in this embodiment;

[0062] Fig.12 A schematic diagram of the manufacturing process of the display panel provided in this embodiment Figure 1 ;

[0063] Fig.13 A schematic diagram of the manufacturing process of the display panel provided in this embodiment Figure 2 ;

[0064] Fig.14 A schematic diagram of the manufacturing process of the display panel provided in this embodiment Figure 3 .

[0065] Icon: 111-substrate; 112-array functional layer; 120-first electrode; 131-first planarization layer; 132-first insulating layer; 140-isolation structure; 141-supporting part; 142-shielding part; 143-receiving part; 150-light-emitting unit; 160-second electrode; 170-packaging unit; 180-first packaging layer; 190-second packaging layer; 801-light-emitting device; 900-through hole; 1121-array routing layer; 1122-second insulating layer; 1320-first insulating material; 1400-isolation material. DETAILED DESCRIPTION

[0066] In order to make the purpose, technical solution and advantages of the embodiments of the present application clearer, the technical solution in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, rather than all the embodiments. The components of the embodiments of the present application described and shown in the drawings here can be arranged and designed in various different configurations.

[0067] Therefore, the following detailed description of the embodiments of the present application provided in the accompanying drawings is not intended to limit the scope of the present application for which protection is sought, but merely represents selected embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in the field without creative work are within the scope of protection of the present application.

[0068] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, further definition and explanation thereof is not required in subsequent drawings.

[0069] In the description of the present application, it should be noted that the terms "center", "upper", "lower", "vertical", "horizontal", "inner", "outer", etc. indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, or the positions or positional relationships in which the inventive product is usually placed when in use. They are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific position, be constructed and operated in a specific position, and therefore cannot be understood as a limitation on the present application. In addition, the terms "first", "second", "third", etc. are only used to distinguish the description, and cannot be understood as indicating or implying relative importance.

[0070] It should be noted that, in the absence of conflict, different features in the embodiments of the present application may be combined with each other.

[0071] In some display panels, an isolation structure is provided, and the organic light-emitting material between different pixel openings is disconnected by the isolation structure when the organic light-emitting material is evaporated. In this way, light-emitting devices of different colors can be formed in different pixel openings by patterned etching after the entire layer is evaporated. Among them, patent applications PCT / CN2023 / 134518, 202310759370.2, 202310740412.8, 202310707209.0, and 202311346196.5 record the relevant technical solutions of the isolation structure, and their contents are incorporated into this application by reference for reference.

[0072] In the process of implementing the present invention, the inventors found that the following problems exist in the related art: Figure 1 In such display panels, an insulating layer 132' (e.g., a pixel defining layer) is usually formed on the first electrode 120' (e.g., an anode), and then an isolation structure 140' is formed on the insulating layer 132'. In this case, since the first electrode 120' has a certain thickness, it will affect the flatness of the insulating layer 132', and further affect the flatness of the isolation structure 140', which may result in different overlap effects between the second electrode 160' (e.g., a cathode) formed by subsequent evaporation and the isolation structure 140' at different positions (e.g., Figure 1 (shown in the dotted circle box).

[0073] In order to ensure the uniformity of the overlap between the isolation structure 140' and the second electrode 160', it is necessary to make the orthographic projection of the isolation structure 140' on the substrate 111 cover the orthographic projection of the ends of the first electrodes 120' on both sides on the substrate 111, resulting in an increase in the width of the isolation structure 140', affecting the pixel aperture ratio of the display panel; or it is necessary to make the orthographic projection of the isolation structure 140' on the substrate 111' be located between the orthographic projections of two adjacent first electrodes 120' on the substrate 111', resulting in the width of the isolation structure 140' being too small, affecting the structural stability of the isolation structure 140'.

[0074] In view of this, this embodiment provides a solution that can improve the flexibility of setting the isolation structure, and the solution provided by this embodiment is described in detail.

[0075] See also Figure 2 , Figure 2 This is a schematic diagram of a display panel provided in this embodiment. The display panel may include a substrate 111 , a first electrode 120 , a first planarization layer 131 , a first insulating layer 132 and an isolation structure 140 .

[0076] In this embodiment, the material of the substrate 111 may include a rigid material, such as glass, or the material of the substrate 111 may include a flexible material, such as polyimide (Pi).

[0077] Optionally, in this embodiment, an array function layer 112 may be further provided on one side of the substrate 111, and the array function layer 112 may include multiple film layer structures, such as a buffer layer, an active layer, multiple conductive layers, multiple insulating layers, and a planarization layer, etc. The multiple film layer structures of the array function layer 112 may form multiple thin film transistors (TFTs) at different positions, and the thin film transistors may cooperate with each other to form multiple pixel driving units or driving circuits.

[0078] The plurality of first electrodes 120 are located on one side of the substrate 111 and are arranged at intervals. For example, the plurality of first electrodes 120 may be located on a side of the array functional layer 112 away from the substrate 111 .

[0079] The first planarization layer 131 is located at a side of the first electrode 120 away from the substrate 111 . The first planarization layer 131 includes a first opening. The first opening exposes at least a portion of the first electrode 120 .

[0080] The first insulating layer 132 is located on a side of the first planarization layer 131 away from the substrate 111 , and includes a second opening, the orthographic projection of the second opening on the substrate 111 at least partially overlaps with the orthographic projection of the first opening on the substrate 111 . That is, the second opening exposes at least a portion of the first electrode 120 .

[0081] The isolation structure 140 is located on a side of the first insulating layer 132 away from the substrate 111, and includes a third opening, and the orthographic projection of the second opening on the substrate 111 is located within the orthographic projection of the third opening on the substrate 111. That is, the second opening can be connected to the third opening to expose at least a portion of the first electrode 120 together.

[0082] Based on the above design, in the display panel provided in this embodiment, a first planarization layer 131 is added to the side of the first electrode 120 away from the substrate 111, and a first insulating layer 132 is arranged on the first planarization layer 131, so that the flatness of the first insulating layer 132 is improved. In this way, the influence of the thickness of the first electrode 120 on the setting position of the isolation structure 140 is reduced, and the flexibility of the setting position of the isolation structure 140 is improved, thereby improving the pixel aperture ratio of the display panel.

[0083] For some possible implementations, see again Figure 2, the solution provided in this embodiment can improve the flexibility of the location and width of the isolation structure 140. In this case, the minimum width of the isolation structure 140 between two adjacent third openings can range from 2.8 microns to 3.2 microns. Specifically, the minimum width of the isolation structure 140 between two adjacent third openings can be 2.8 microns, 2.9 microns, 3 microns, 3.1 microns or 3.2 microns.

[0084] For some possible implementations, see again Figure 2 , the maximum thickness H1 of the first planarization layer 131 (i.e., the portion of the first planarization layer 131 that does not cover the first electrode 120) in the direction away from the substrate 111 is greater than the maximum thickness H2 of the first electrode 120. In this way, after self-leveling, the first planarization layer 131 with a larger thickness has no step difference or only a small step difference between the position covering the first electrode 120 and the position not covering the first electrode 120, thereby ensuring the flatness of the side of the first planarization layer 131 away from the substrate 111.

[0085] For some possible implementations, see again Figure 2 , the edge of the orthographic projection of the first electrode 120 on the substrate 111 is located within the orthographic projection of the first planarization layer 131 on the substrate 111. In this way, it can be ensured that the first planarization layer 131 can effectively fill the step formed by the edge of the first electrode 120.

[0086] In some possible implementations, the material of the first planarization layer 131 includes an organic material. For example, the first planarization layer 131 can be made of an organic material having a certain fluidity during the manufacturing process, so that the first planarization layer 131 can be planarized by self-leveling during the manufacturing process.

[0087] In some possible implementations, the first insulating layer 132 covers the sidewall of the first planarization layer 131 facing the first opening.

[0088] Optionally, the first insulating layer 132 may include a pixel defining layer. Optionally, the material of the first insulating layer 132 includes an inorganic material. In this way, the first insulating layer 132 may cover the exposed position of the first planarization layer 131, improve the water and oxygen isolation effect, and prevent water and oxygen from invading the first planarization layer 131 formed of organic materials.

[0089] For some possible implementations, see Figure 3 , the orthographic projection of the isolation structure 140 on the substrate 111 is located within the orthographic projection of the first planarization layer 131 on the substrate 111. In this way, the flatness of the film layer below the isolation structure 140 can be ensured, thereby ensuring the flatness of the isolation structure 140 itself, and improving the uniformity of the subsequent overlap effect between the second electrode 160 and the isolation structure 140.

[0090] For some possible implementations, see Figure 4 The array function layer 112 of the display panel includes an array wiring layer 1121 located on one side of the substrate 111 and a second insulating layer 1122 located on a side of the array wiring layer 1121 away from the substrate 111. Optionally, the second insulating layer 1122 may include a second planarization layer.

[0091] The first electrode 120 is located on a side of the second insulating layer 1122 away from the substrate 111, and the first electrode 120 is electrically connected to the wiring in the array wiring layer 1121 through a through hole 900 penetrating the second insulating layer 1122. The orthographic projection of the through hole 900 on the substrate 111 is located within the orthographic projection of the first planarization layer 131 on the substrate 111.

[0092] In this way, the uneven area formed by the first electrode 120 extending to the through hole 900 can also be filled by the first planarization layer 131, thereby avoiding the influence of the setting position of the through hole 900 on the setting position of the isolation structure 140 and improving the flexibility of the setting position of the isolation structure 140.

[0093] For some possible implementations, see Figure 5 The second opening and the third opening are connected to form a pixel opening. The display panel also includes a light emitting unit 150 and a second electrode 160 which are at least partially located in the pixel opening and are stacked in a direction away from the substrate 111.

[0094] Optionally, at least a portion of the isolation structure 140 is conductive, and the second electrode 160 is electrically connected to the isolation structure 140 .

[0095] The first electrode 120 can be connected to the pixel driving circuit in the array substrate, and the second electrode 160 can be connected to the common voltage providing circuit through the isolation structure 140. When there is a potential difference between the first electrode 120 and the second electrode 160, the light-emitting unit 150 located between the first electrode 120 and the second electrode 160 is driven to emit light.

[0096] For some possible implementations, see Figure 6 The display panel further includes an encapsulation unit 170 located on a side of the second electrode 160 away from the substrate 111 . The encapsulation unit 170 extends from the pixel opening to a side of the isolation structure 140 away from the substrate 111 .

[0097] Optionally, there is a gap between at least two adjacent packaging units 170 , and the gap is located on a side of the isolation structure 140 away from the substrate 111 .

[0098] For some possible implementations, see Figure 7The display panel further includes a first encapsulation layer 180 and a second encapsulation layer 190 located on a side of the encapsulation unit 170 and the isolation structure 140 away from the substrate 111 .

[0099] Optionally, the materials of the encapsulation unit 170 and the second encapsulation layer 190 include inorganic materials, and / or the material of the first encapsulation layer 180 includes organic materials. For example, the encapsulation unit 170 and the second encapsulation layer 190 can be formed by chemical vapor deposition (CVD), and the first encapsulation layer 180 can be formed by inkjet printing (IJP).

[0100] For some possible implementations, see Figure 8 The isolation structure 140 includes a supporting portion 141 and a shielding portion 142 located on a side of the supporting portion 141 away from the substrate 111 , and an orthographic projection of the supporting portion 141 on the substrate 111 is located within an orthographic projection of the shielding portion 142 on the substrate 111 .

[0101] Optionally, the etching resistance of the support portion 141 is weaker than that of the shielding portion 142. For example, the etching rate of the support portion 141 by the same etching liquid or etching gas is greater than that by the shielding portion 142.

[0102] Optionally, the material of the support portion 141 includes aluminum, and / or the material of the shielding portion 142 includes titanium.

[0103] For some possible implementations, see Fig. 9 The isolation structure 140 further includes a receiving portion 143 located between the supporting portion 141 and the substrate 111 .

[0104] Optionally, the orthographic projection of the supporting portion 141 on the substrate 111 is located within the orthographic projection of the receiving portion 143 on the substrate 111 .

[0105] Optionally, the orthographic projection of the receiving portion 143 on the substrate 111 is located within the orthographic projection of the shielding portion 142 on the substrate 111 .

[0106] Optionally, the material of the receiving portion 143 includes molybdenum.

[0107] This application also provides a display panel, see Fig.10 The display panel may include a substrate 111 , a first electrode 120 and a first insulating layer 132 .

[0108] The plurality of first electrodes 120 are located on one side of the substrate 111 and are arranged at intervals. For example, the plurality of first electrodes 120 may be located on a side of the array functional layer 112 away from the substrate 111 .

[0109] The first insulating layer 132 is located at a side of the first electrode 120 away from the substrate 111 . The first insulating layer 132 includes a second opening. The second opening exposes at least a portion of the first electrode 120 .

[0110] The first insulating layer 132 includes a first region and a second region, wherein the orthographic projection of the first region on the substrate 111 coincides with the orthographic projection of the first electrode 120 on the substrate 111 , and the orthographic projection of the second region on the substrate 111 does not coincide with the orthographic projection of the first electrode 120 on the substrate 111 .

[0111] The difference between the first distance H3 from the side of the first region away from the substrate 111 to the substrate 111 and the second distance H4 from the side of the second region away from the substrate 111 to the substrate 111 is less than 0.1 micrometer. Specifically, the difference between the first distance H3 from the side of the first region away from the substrate 111 to the substrate 111 and the second distance H4 from the side of the second region away from the substrate 111 to the substrate 111 may be 0.02 micrometers, 0.05 micrometers, or 0.08 micrometers. Preferably, the difference between the first distance H3 from the side of the first region away from the substrate 111 to the substrate 111 and the second distance H4 from the side of the second region away from the substrate 111 to the substrate 111 is 0.

[0112] That is, there is no step difference or only a small step difference between the position where the first insulating layer 132 covers the first electrode 120 and the position where the first insulating layer 132 does not cover the first electrode 120 , thereby ensuring the flatness of the side of the first insulating layer 132 away from the substrate 111 .

[0113] In this way, the flatness of other film layers formed on the side of the first insulating layer 132 away from the substrate 111 can be improved.

[0114] Optionally, in some possible implementations, the display panel may further include a first planarization layer 131 located between the first insulating layer 132 and the substrate 111. That is, by adding the first planarization layer 132, the flatness of the first insulating layer 132 away from the substrate 111 may be improved.

[0115] In some possible implementations, the display panel provided in this embodiment may also include an optical film (e.g., a polarizer) located on the side of the second encapsulation layer 190 away from the substrate 100, a touch functional film layer, a transparent adhesive layer (e.g., an optical adhesive layer), a cover plate, and other film layer structures, which are not described one by one in this embodiment.

[0116] See also Fig.11 This embodiment also provides a method for manufacturing a display panel, which may include the following steps.

[0117] Step S110 , providing a substrate 111 .

[0118] In step S120 , a plurality of first electrodes 120 are formed on one side of the substrate 111 and are arranged at intervals.

[0119] In step S130 , a first planarization layer 131 is formed on a side of the first electrode 120 away from the substrate 111 . The first planarization layer 131 includes a first opening, and the first opening exposes at least a portion of the first electrode 120 .

[0120] Step S140, forming a first insulating layer 132 and an isolation structure 140 stacked in a direction away from the substrate 111 on a side of the first planarization layer 131 away from the substrate 111, wherein the first insulating layer 132 includes a second opening, and the orthographic projection of the second opening on the substrate 111 is located within the orthographic projection of the first opening on the substrate 111. The isolation structure 140 includes a third opening, and the orthographic projection of the second opening on the substrate 111 is located within the orthographic projection of the third opening on the substrate 111.

[0121] Specifically, in step S130, a whole layer of planarization material is first provided, and then the planarization material is etched to form a first planarization layer 131 having a first opening, such as Fig.12 shown.

[0122] In step S140, a first insulating material 1320 that covers the entire surface may be provided on a side of the first planarization layer 131 away from the substrate 111, and then an isolation material 1400 may be formed on a side of the first insulating material 1320 away from the substrate 111. Fig.13 shown.

[0123] Then, the isolation material 1400 is etched to form an isolation structure 140 having a third opening. The third opening exposes at least a portion of the first insulating material 1320. Fig.14 shown.

[0124] Then, the first insulating material 1320 exposed through the third opening is etched to form a first insulating layer 132 having a second opening. Figure 2 Specifically, the first insulating material 1320 may be a pixel defining material.

[0125] The present application also provides an electronic device, which includes the display panel provided in the present application, or includes a display panel manufactured by the method for manufacturing a display panel provided in the present application. The electronic device may include a mobile phone, a tablet computer, a smart wearable device, a television, a laptop computer, a monitor, and other devices with a display function.

[0126] In summary, the present application provides a display panel, a method for manufacturing a display panel, and an electronic device. By adding a first planarization layer on the first electrode, a first insulating layer and an isolation structure are arranged on the first planarization layer, thereby improving the flatness of the film layer below the isolation structure, reducing the influence of the thickness of the first electrode on the setting position of the isolation structure, and improving the flexibility of the setting position of the isolation structure, thereby improving the pixel aperture ratio of the display panel.

[0127] The technical features of the above-described embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0128] The above-mentioned embodiments only express several implementation methods of the present invention, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the invention patent. It should be pointed out that, for ordinary technicians in this field, several variations and improvements can be made without departing from the concept of the present invention, and these all belong to the protection scope of the present invention. Therefore, the protection scope of the patent of the present invention shall be subject to the attached claims.

Claims

1. A display panel, characterized in that: The display panel comprises: substrate; A plurality of first electrodes disposed on one side of the substrate and spaced apart from each other; a first planarization layer located on a side of the first electrode away from the substrate; the first planarization layer comprises a first opening, and the first opening exposes at least a portion of the first electrode; a first insulating layer located on a side of the first planarization layer away from the substrate, the first insulating layer comprising a second opening, an orthographic projection of the second opening on the substrate at least partially overlapping with an orthographic projection of the first opening on the substrate; An isolation structure is located on a side of the first insulating layer away from the substrate, the isolation structure comprises a third opening, and an orthographic projection of the second opening on the substrate is located within an orthographic projection of the third opening on the substrate.

2. The display panel according to claim 1, characterized in that: A maximum thickness of the first planarization layer in a direction away from the substrate is greater than a maximum thickness of the first electrode.

3. The display panel according to claim 1, characterized in that: An edge of an orthographic projection of the first electrode on the substrate is located within an orthographic projection of the first planarization layer on the substrate.

4. The display panel according to claim 1, characterized in that: The material of the first planarization layer includes an organic material; Preferably, the first insulating layer covers the sidewall of the first planarization layer facing the first opening; Preferably, the first insulating layer comprises a pixel defining layer; Preferably, the material of the first insulating layer includes an inorganic material.

5. The display panel according to claim 1, characterized in that: The orthographic projection of the isolation structure on the substrate is located within the orthographic projection of the first planarization layer on the substrate.

6. The display panel according to claim 1, characterized in that: The display panel further comprises an array wiring layer located at one side of the substrate and a second insulating layer located at a side of the array wiring layer away from the substrate; The first electrode is located on a side of the second insulating layer away from the substrate. The first electrode is electrically connected to the wiring in the array wiring layer through a through hole penetrating the second insulating layer. The orthographic projection of the through hole on the substrate is located within the orthographic projection of the first planarization layer on the substrate.

7. The display panel according to claim 1, characterized in that The minimum width of the isolation structure between two adjacent third openings is in a range of 2.8 micrometers to 3.2 micrometers.

8. The display panel according to claim 1, characterized in that: The second opening and the third opening are connected to form a pixel opening, and the display panel further comprises a light emitting unit and a second electrode which are at least partially located in the pixel opening and are stacked in a direction away from the substrate; Preferably, at least a portion of the isolation structure is conductive, and the second electrode is electrically connected to the isolation structure.

9. The display panel according to claim 8, characterized in that: The display panel further comprises an encapsulation unit located at a side of the second electrode away from the substrate, wherein the encapsulation unit extends from the pixel opening to a side of the isolation structure away from the substrate; Preferably, there is a gap between at least two adjacent packaging units, and the gap is located on a side of the isolation structure away from the substrate.

10. The display panel according to claim 9, characterized in that: The display panel further comprises a first encapsulation layer and a second encapsulation layer located on a side of the encapsulation unit and the isolation structure away from the substrate; Preferably, the material of the encapsulation unit and the second encapsulation layer includes an inorganic material; and / or the material of the first encapsulation layer includes an organic material.

11. The display panel according to claim 1, characterized in that: The isolation structure comprises a supporting portion and a shielding portion located at a side of the supporting portion away from the substrate, wherein an orthographic projection of the supporting portion on the substrate is located within an orthographic projection of the shielding portion on the substrate; Preferably, the etching resistance of the supporting portion is weaker than that of the shielding portion; Preferably, the material of the support portion includes aluminum, and / or the material of the shielding portion includes titanium; Preferably, the isolation structure further comprises a receiving portion located between the supporting portion and the substrate; Preferably, the orthographic projection of the supporting portion on the substrate is located within the orthographic projection of the receiving portion on the substrate; Preferably, the orthographic projection of the receiving portion on the substrate is located within the orthographic projection of the shielding portion on the substrate; Preferably, the material of the receiving portion includes molybdenum.

12. A display panel, characterized in that: The display panel comprises: substrate; A plurality of first electrodes disposed on one side of the substrate and spaced apart from each other; A first insulating layer is located on a side of the first electrode away from the substrate, the first insulating layer includes a second opening, and the second opening exposes at least a portion of the first electrode; the first insulating layer includes a first region and a second region, the orthographic projection of the first region on the substrate coincides with the orthographic projection of the first electrode on the substrate, and the orthographic projection of the second region on the substrate does not coincide with the orthographic projection of the first electrode on the substrate; a difference between a first distance from the side of the first region away from the substrate to the substrate and a second distance from the side of the second region away from the substrate to the substrate is less than 0.1 micrometers.

13. A method for manufacturing a display panel, characterized in that: The method comprises: providing a substrate; forming a plurality of first electrodes spaced apart from each other on one side of the substrate; forming a first planarization layer on a side of the first electrode away from the substrate, wherein the first planarization layer comprises a first opening, and the first opening exposes at least a portion of the first electrode; A first insulating layer and an isolation structure are formed on a side of the first planarization layer away from the substrate and stacked in a direction away from the substrate, the first insulating layer includes a second opening, and the orthographic projection of the second opening on the substrate is located within the orthographic projection of the first opening on the substrate; the isolation structure includes a third opening, and the orthographic projection of the second opening on the substrate is located within the orthographic projection of the third opening on the substrate.

14. The method according to claim 13, characterized in that The step of forming a first insulating layer and an isolation structure stacked in a direction away from the substrate on a side of the first planarization layer away from the substrate comprises: Disposing a first insulating material covering the entire layer on a side of the first planarization layer away from the substrate; forming an isolation material on a side of the first insulating material away from the substrate; Etching the isolation material to form an isolation structure having the third opening; the third opening exposes at least a portion of the first insulating material; The first insulating material exposed through the third opening is etched to form the first insulating layer having the second opening.

15. An electronic device, characterized in that: The electronic device comprises the display panel according to any one of claims 1 to 12, or the electronic device comprises a display panel manufactured by the method for manufacturing a display panel according to any one of claims 13 to 14.

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