Display panel, display device and preparation method of display panel
By forming a first protective layer in the transition area of the OLED display panel and covering the second organic part, the problem of erosion of water on the conductive layer in the wet process is solved, and the reliability and display effect of the display panel are improved.
Patent Information
- Application Number
- CN202411364631.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-09-27
- Publication Date
- 2025-04-29
AI Technical Summary
The reliability of the OLED display panel is low, especially in the wet process, the absorption of water by the second organic layer will lead to erosion of the conductive layer, affecting the display effect.
A first protective layer is formed in the transition zone of the display panel to cover the second organic part, reduce the absorption of water, and partially overlap between the conductive layer and the first protective layer to extend the erosion path of water.
By reducing the erosion of water on the conductive layer, the reliability and display effect of the display panel are improved, and the service life of the equipment is extended.
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Figure CN119907502A_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the field of display technology, and in particular to a display panel, a display device, and a method for manufacturing a display panel. Background Art
[0002] Organic Light Emitting Diode (OLED) display technology is regarded as the most promising new flat panel display technology of the next generation. Compared with liquid crystal display technology, OLED display technology has the advantages of low energy consumption, low cost, self-luminescence, wide viewing angle and fast response speed. However, the reliability of the display panel formed by the above display technology needs to be improved. Summary of the invention
[0003] Based on this, it is necessary to provide a display panel, a display device and a method for manufacturing a display panel that can improve the reliability of the display panel.
[0004] In a first aspect, an embodiment of the present application provides a display panel, the display panel having a display area and a non-display area arranged adjacent to each other, the non-display area including a transition area and a bending area, the transition area being located on a side of the bending area facing the display area; the display panel comprises:
[0005] substrate;
[0006] A conductive layer is disposed on one side of the substrate and is located in the transition region;
[0007] The first organic layer is disposed on a side of the conductive layer away from the substrate, the first organic layer includes a second organic portion, and the second organic portion is located in the transition region.
[0008] The first protective layer is arranged on a side of the second organic part facing away from the substrate. In the transition region, the orthographic projection of the first protective layer on the substrate at least partially overlaps with the orthographic projection of the conductive layer on the substrate.
[0009] The display panel provided in the embodiment of the present application forms a first protective layer on the side of the second organic part facing away from the substrate, so that the first protective layer can provide protection and waterproofing for the covered second organic part. In the subsequent wet process, the absorption of water by the second organic part can be reduced, thereby reducing the erosion of the conductive layer underneath by water, thereby improving the reliability of the conductive layer and the display panel, and improving the display effect of the display panel.
[0010] In one embodiment, the non-display area further includes a dam area and an opening area, the dam area is located on a side of the opening area facing the display area, and the opening area is located between the dam area and the transition area; the first organic layer further includes a first organic part, and the first organic part is located in the dam area;
[0011] Preferably, the transition zone includes a first sub-region, a second sub-region and a third sub-region arranged in sequence from the opening zone to the bending zone; a first opening is provided between the first organic portion and the second organic portion, the first opening is located in the opening zone, the side wall of the first opening includes a first side wall close to the bending zone, the thickness of at least a portion of the second organic portion at the first side wall is less than the thickness of the second organic portion located in other areas; the first side wall is located in the first sub-region.
[0012] In one of the embodiments, the first protective layer covers at least one of the first sub-region and the third sub-region;
[0013] Preferably, the first protective layer also covers at least a portion of the second sub-region;
[0014] Preferably, the first protective layer covers at least a portion of the second sub-region and the third sub-region;
[0015] Preferably, the conductive layer is also located in the dam area and / or the opening area;
[0016] Preferably, the first protective layer extends from the first sub-region to the dam region, and the first protective layer covers at least a portion of the dam region.
[0017] Preferably, the first protective layer also covers at least a portion of the bending area.
[0018] In one embodiment, the first protective layer is located in the second sub-region, the third sub-region and the bending zone, and the orthographic projection of the first protective layer on the substrate at least partially overlaps with the orthographic projection of the second sub-region on the substrate, the orthographic projection of the first protective layer on the substrate at least partially overlaps with the orthographic projection of the bending zone on the substrate, and the first protective layer located in the second sub-region and the first protective layer located in the bending zone are connected through the first protective layer located in the third sub-region.
[0019] In one embodiment, the first protective layer extends from the dam area to the third sub-area;
[0020] Preferably, the first protective layer is also located in the display area, and the first protective layer is reused as a pixel defining layer;
[0021] Preferably, the material of the first protective layer includes an inorganic material;
[0022] Preferably, the thickness of the first protective layer is in the range of 3000 angstroms to 5000 angstroms.
[0023] In one embodiment, the display panel further comprises a pixel defining layer, the pixel defining layer is located on a side of the first organic layer away from the substrate, and the pixel defining layer extends from the display area to at least the first sub-area; the first protective layer is located on a side of the pixel defining layer away from the substrate;
[0024] Preferably, the union of the orthographic projection of the first protective layer on the substrate and the orthographic projection of the pixel defining layer on the substrate covers the orthographic projection of the transition region on the substrate;
[0025] Preferably, the thickness of the pixel defining layer is greater than the thickness of the first protective layer;
[0026] Preferably, in the transition region, the orthographic projection of the pixel defining layer on the substrate is located within the orthographic projection of the first protective layer on the substrate;
[0027] Preferably, the pixel defining layer at least covers a portion of the first sub-region;
[0028] Preferably, the pixel defining layer covers the first sub-region and the second sub-region;
[0029] Preferably, the material of the pixel defining layer includes an inorganic material;
[0030] Preferably, the thickness of the pixel defining layer is in the range of 3000 angstroms to 5000 angstroms.
[0031] In one of the embodiments, the display panel further comprises a first isolation structure and a plurality of light-emitting units located in the display area, the first isolation structure and the light-emitting units are both located on a side of the first organic layer away from the substrate; the first isolation structure encloses a plurality of second openings and a plurality of third openings, the second openings are spaced apart from the third openings, the plurality of third openings are correspondingly disposed to the plurality of light-emitting units, and the light-emitting units are at least partially disposed in the corresponding third openings; a second isolation structure is disposed in the second opening, and the second isolation structure is spaced apart from the first isolation structure;
[0032] Preferably, the first isolation structure and the second isolation structure are arranged on the same layer;
[0033] Preferably, the second isolation structure is configured as a touch electrode;
[0034] Preferably, the light-emitting unit comprises a first electrode, a light-emitting functional part and a second electrode which are sequentially arranged in a direction away from the substrate;
[0035] Preferably, the material of the first isolation structure includes a conductive material, and the second electrode is electrically connected to the first isolation structure;
[0036] Preferably, the display panel also includes a pixel defining layer, which is located in the display area and the non-display area. In the display area, the pixel defining layer is located between the first organic layer and the first isolation structure. The pixel defining layer encloses a plurality of pixel openings, and the plurality of pixel openings are arranged corresponding to the plurality of third openings. The third openings are connected to the corresponding pixel openings, and the light-emitting unit is located at the corresponding pixel opening.
[0037] In one of the embodiments, in the display area, the display panel further includes a second protective layer, the second protective layer is located on a side of the second isolation structure away from the substrate, and the orthographic projection of the second isolation structure on the substrate is located within the orthographic projection of the second protective layer on the substrate;
[0038] Preferably, the second protective layer covers the sidewalls of the second isolation structure;
[0039] Preferably, the second protective layer is also located between the first isolation structure and the second isolation structure;
[0040] Preferably, the second protective layer is also located on a side of the first isolation structure adjacent to the second isolation structure that is away from the substrate, and the second protective layer at least partially covers the corresponding first isolation structure;
[0041] Preferably, the material of the second protective layer includes an inorganic material.
[0042] In one embodiment, the display panel further includes a plurality of packaging parts, the packaging parts are located in the corresponding third openings and on the side of the first isolation structure facing away from the substrate, the packaging part located on the side of the first isolation structure facing away from the substrate is a third extension part, the second protection layer is located on the side of the third extension part facing away from the substrate, and the orthographic projection of the third extension part on the substrate is located within the orthographic projection of the second protection layer on the substrate;
[0043] Preferably, the packaging portion further includes a fourth extension portion, the fourth extension portion is at least partially located on a sidewall of the third opening, the third extension portion and the fourth extension portion are connected, and the second protection layer is further located on a side of the fourth extension portion away from the first isolation structure.
[0044] In one embodiment, in the bending region, the first protective layer has a plurality of fourth openings arranged at intervals;
[0045] Preferably, the orthographic projection of the fourth opening on the substrate is outside the orthographic projection of the conductive layer on the substrate;
[0046] Preferably, the conductive layer includes a plurality of conductive traces located in the bending zone, the plurality of conductive traces all extend in a direction from the transition zone to the bending zone, and two adjacent conductive traces are arranged at intervals.
[0047] In one embodiment, the non-display area further includes a binding area, the binding area is located on a side of the bending area away from the display area, and the conductive layer and the first protective layer are also located in the binding area;
[0048] The conductive layer includes a pad located in the binding region, and the first protection layer has a fifth opening, wherein the fifth opening exposes the pad.
[0049] In one embodiment, the display panel includes a second organic layer, the second organic layer is located between the substrate and the conductive layer;
[0050] The second organic layer includes a third organic portion and a fourth organic portion, the third organic portion is located in the dam region, the fourth organic portion is located in the transition region, a sixth opening is provided between the third organic portion and the fourth organic portion, the sixth opening is located in the opening region, and the sixth opening has a second sidewall close to the bending region;
[0051] At least a portion of the second organic portion at the first side wall is located on a side of the second side wall facing away from the substrate;
[0052] Preferably, the first organic part includes at least one first sub-dam, and the third organic part includes at least one second sub-dam, the first sub-dam and the second sub-dam both extend along the second direction, the first sub-dam and the second sub-dam are arranged correspondingly, the first sub-dam is located on the side of the corresponding second sub-dam away from the substrate, the first sub-dam and the corresponding second sub-dam jointly form a dam structure, and the second direction is different from the direction from the transition zone to the bending zone, and is perpendicular to the thickness direction of the substrate.
[0053] In a second aspect, an embodiment of the present application provides a display panel, the display panel having a display area and a non-display area arranged adjacent to each other, the non-display area including a dam area, an opening area, a transition area and a bending area arranged in sequence along a first direction, the dam area being located between the display area and the opening area; the display panel comprising:
[0054] substrate;
[0055] A conductive layer is disposed on one side of the substrate;
[0056] A first organic layer is disposed on a side of the conductive layer facing away from the substrate, the first organic layer includes a first organic part and a second organic part, the first organic part is located in the dam area, the second organic part is located in the transition area, a first opening is provided between the first organic part and the second organic part, the first opening is located in the opening area, a sidewall of the first opening includes a first sidewall close to the bending area, a thickness of at least a portion of the second organic part at the first sidewall is less than a thickness of the second organic part in other areas, and an orthographic projection of the first sidewall on the substrate partially overlaps with an orthographic projection of the conductive layer on the substrate;
[0057] The inorganic waterproof layer is arranged on the side of the first side wall away from the substrate, the orthographic projection of the first side wall on the substrate is located within the orthographic projection of the inorganic waterproof layer on the substrate, and the first direction is perpendicular to the thickness direction of the substrate.
[0058] The display panel provided in the embodiment of the present application forms an inorganic waterproof layer on the side of the first side wall facing away from the substrate, so that the inorganic waterproof layer can provide protection and waterproofing for the covered second organic part. In the subsequent wet process, the absorption of water by the second organic part can be reduced, thereby reducing the erosion of the conductive layer underneath by water, thereby improving the reliability of the conductive layer and the display panel, and improving the display effect of the display panel.
[0059] In a third aspect, an embodiment of the present application provides a display device, comprising the display panel of the first aspect or the second aspect.
[0060] In a fourth aspect, an embodiment of the present application provides a method for manufacturing a display panel, wherein the display panel has a display area and a non-display area that are adjacent to each other, wherein the non-display area includes a transition area and a bending area, and the transition area is located on a side of the bending area facing the display area; the method for manufacturing the display panel includes:
[0061] providing a substrate;
[0062] A conductive layer is formed on one side of the substrate; the conductive layer is located in the transition region;
[0063] forming a first organic layer on a side of the conductive layer facing away from the substrate; the first organic layer comprises a second organic portion, and the second organic portion is located in the transition region;
[0064] A first protective layer is formed on a side of the second organic part facing away from the substrate; in the transition region, an orthographic projection of the first protective layer on the substrate at least partially overlaps with an orthographic projection of the conductive layer on the substrate.
[0065] The method for preparing a display panel provided in an embodiment of the present application forms a first protective layer on the side of the second organic part facing away from the substrate, so that the first protective layer can provide protection and waterproofing for the covered second organic part. In the subsequent wet process, the absorption of water by the second organic part can be reduced, thereby reducing the erosion of the conductive layer below by water, thereby improving the reliability of the conductive layer and the display panel, and improving the display effect of the display panel.
[0066] In one embodiment, after forming a first protective layer on a side of the second organic part away from the substrate, the method includes: forming a light-emitting device material layer on a side of the first protective layer away from the substrate, wherein the light-emitting device material layer is located in the display area and the non-display area;
[0067] The light emitting device material layer is patterned to remove the light emitting device material layer located in the non-display area and part of the light emitting device material layer located in the display area, and the remaining light emitting device material layer forms a light emitting functional part and a second electrode packaging part.
[0068] In one embodiment, after forming the first organic layer on the side of the conductive layer facing away from the substrate, and before forming the first protective layer on the side of the second organic layer facing away from the substrate, the method includes:
[0069] A pixel defining layer is formed on a side of the first organic layer facing away from the substrate; in the display area, the pixel defining layer encloses a plurality of pixel openings;
[0070] Preferably, the method for preparing a display panel further includes:
[0071] A first isolation structure and a second isolation structure are formed and arranged at intervals on a side of the pixel defining layer away from the substrate; the first isolation structure and the second isolation structure are both located in the display area, the first isolation structure encloses a plurality of second openings and a plurality of third openings, the second openings are arranged at intervals from the third openings, the plurality of third openings are arranged corresponding to the plurality of pixel openings, the third openings are connected to the corresponding pixel openings, and the second isolation structure is located in the second openings;
[0072] After the light emitting device material layer is patterned, the method includes:
[0073] A second protection layer is formed on a side of the second isolation structure facing away from the substrate; and an orthographic projection of the second isolation structure on the substrate is located within the second protection layer. BRIEF DESCRIPTION OF THE DRAWINGS
[0074] In order to more clearly illustrate the technical solutions in the embodiments or exemplary embodiments of the present application, the drawings required for use in the description of the embodiments or exemplary embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.
[0075] Figure 1 A top view of a display panel provided in an embodiment of the present application.
[0076] Figure 2 A cross-sectional view of a non-display display panel provided in an embodiment of the present application.
[0077] Figure 3 Another cross-sectional view of a non-display display panel provided in an embodiment of the present application.
[0078] Figure 4 Another cross-sectional view of a non-display display panel provided in an embodiment of the present application.
[0079] Figure 5 Another cross-sectional view of a non-display display panel provided in an embodiment of the present application.
[0080] Figure 6 Another cross-sectional view of a non-display display panel provided in an embodiment of the present application.
[0081] Figure 7 Another cross-sectional view of a non-display display panel provided in an embodiment of the present application.
[0082] Figure 8 A cross-sectional view of a display panel provided in an embodiment of the present application.
[0083] Fig. 9 A schematic flow chart of a method for preparing a display panel provided in an embodiment of the present application.
[0084] Description of reference numerals:
[0085] 100, display panel; 100a, display area; 100b, non-display area; 100b1, dam area; 100b2, opening area; 100b3, transition area; 100b4, binding area; 100b5, bending area; 101, substrate; 102, conductive layer; 103, insulating layer; 110, first protective layer; 111, first extension part; 112, second extension part; 120, second protective layer; 130, light-emitting unit; 131, first electrode; 132, second electrode; 133, light-emitting functional part; 134, packaging part; 1343, third extension part; 1344, fourth extension part; 140, first isolation structure; 141, first isolation part; 142, second isolation part ; 143, third isolation portion; 150, second isolation structure; 154, fourth isolation portion; 155, fifth isolation portion; 156, sixth isolation portion; 161, first organic layer; 1611, first organic portion; 1612, second organic portion; 162, second organic layer; 1623, third organic portion; 1624, fourth organic portion; 163, dam structure; 1631, first sub-dam; 1632, second sub-dam; 1641, first side wall; 1642, second side wall; 170, pixel defining layer; 171, pixel opening; 181, first opening; 182, second opening; 183, third opening; 184, fourth opening; 185, fifth opening; 186, sixth opening. DETAILED DESCRIPTION
[0086] In order to facilitate the understanding of the present application, the present application will be described more fully below with reference to the relevant drawings. The preferred embodiments of the present application are provided in the drawings. However, the present application can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the understanding of the disclosure of the present application more thorough and comprehensive.
[0087] It should be understood that although the terms "first", "second", etc. may be used herein to describe various elements, they do not represent any order, quantity or importance, but are only used to distinguish different components. These terms are only used to distinguish one element from another element. For example, without departing from the scope of the present application, the first element may be referred to as the second element, and similarly, the second element may be referred to as the first element. "Including" or "comprising" and similar words mean that the elements or objects appearing before the word cover the elements or objects listed after the word and their equivalents, without excluding other elements or objects.
[0088] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art to which this application belongs. The terms used herein in the specification of this application are only for the purpose of describing specific embodiments and are not intended to limit this application. The term "and / or" used herein includes any and all combinations of one or more of the related listed items.
[0089] Organic Light Emitting Diode (OLED) display technology is regarded as the most promising new flat panel display technology of the next generation. Compared with liquid crystal display technology, OLED display technology has the advantages of low energy consumption, low cost, self-luminescence, wide viewing angle and fast response speed.
[0090] In the process of realizing the present application, the inventors found the following problems in the related art: the display panel may have a dam area, a transition area and a bending area, and the display panel includes a substrate, a first planarization layer, a metal layer, a second planarization layer and a pixel defining layer arranged in sequence in a direction away from the substrate. The first planarization layer and the second planarization layer are both organic materials, and the pixel defining layer is an inorganic material. The second planarization layer is located in the transition area, and the pixel defining layer exposes the second planarization layer in the transition area.
[0091] However, since the second planarization layer is an organic material and is easily absorbed by water, and the second planarization layer located in the transition area is exposed outside the pixel defining layer, in the wet process after the pixel defining layer is formed, the water absorbed by the second planarization layer located in the transition area is easy to corrode the metal layer below, thereby affecting the reliability of the metal layer and the display panel, resulting in poor display.
[0092] In view of at least one of the above problems, embodiments of the present application provide a display panel, a display device, and a method for manufacturing a display panel, which can improve the reliability of the display panel.
[0093] The following will be combined Figure 1-Figure 9 The display device provided in the embodiment of the present application is described.
[0094] The embodiment of the present application provides a display device, which may include a display panel 100. The display device may be an electronic paper, a mobile phone, a tablet computer, a television, a display, a laptop computer, a digital photo frame, a smart bracelet, a smart watch, a super personal computer, a navigator, a wireless device, a personal digital assistant (PDA), a handheld or portable computer, a GPS receiver / navigator, a camera, an MP4 video player, a camcorder, a game console, a clock, a calculator, a television monitor, a computer monitor, a car display (e.g., an odometer display, etc.), a cockpit controller and / or display, a display of a camera view (e.g., a display of a rear-view camera in a vehicle), an electronic billboard or sign, a projector, or other mobile or fixed terminals.
[0095] Exemplarily, the display panel 100 may be an organic light-emitting diode (OLED) display panel, a micro organic light-emitting diode (Micro OLED) display panel, a light emitting diode (LED) display panel, a quantum dot light emitting diode (QLED) display panel, a mini light emitting diode (Mini LED) display panel, a micro light emitting diode (Micro LED) display panel, or a liquid crystal (LCD) display panel, etc. The embodiment of the present application is described by taking an OLED display panel as an example.
[0096] The display panel 100 provided in the embodiment of the present application is described below.
[0097] See also Figure 1 and Figure 2, the display panel 100 may have a first direction X, a second direction Y and a third direction Z, and the first direction X, the second direction Y and the third direction Z are all different. The first direction X and the second direction Y may be any two different directions parallel to the display panel 100, and the third direction Z may be any direction intersecting with a plane parallel to the display panel 100. For example, the first direction X, the second direction Y and the third direction Z may be perpendicular to each other. Exemplarily, the first direction X may be the width direction of the display panel 100, the second direction Y may be the length direction of the display panel 100, and the third direction Z may be the thickness direction of the display panel 100. The length, width and thickness in the embodiments of the present application are merely for the convenience of description and do not imply any limitation on the size. For example, the width may be greater than, equal to or less than the length. The direction of the display panel 100 may be consistent with the direction of the film layer such as the substrate 101.
[0098] See also Figure 1 and Figure 2 In some embodiments, the display panel 100 has a display area 100a and a non-display area 100b. The display area 100a can be used to display images, and the non-display area 100b and the display area 100a can be arranged adjacent to each other. The non-display area 100b can be located on at least one side of the display area 100a. For example, the non-display area 100b can be arranged around the periphery of the display area 100a, and the non-display area 100b can form a "black border" surrounding the periphery of the display area 100a.
[0099] For example, see Figure 1 and Figure 2 The non-display area 100b includes a dam area 100b1, an opening area 100b2, and a transition area 100b3 sequentially arranged along the first direction X. The dam area 100b1 is located between the display area 100a and the opening area 100b2. The dam area 100b1, the opening area 100b2, and the transition area 100b3 can all be located on one side of the display area 100a along the first direction X.
[0100] Exemplarily, the non-display area 100b further includes a bending area 100b5, and the bending area 100b5 is located on a side of the transition area 100b3 away from the display area 100a.
[0101] Exemplarily, the non-display area 100b further includes a binding area 100b4, and the binding area 100b4 is located on a side of the bending area 100b5 away from the display area 100a.
[0102] For example, see Figure 2At least one dam structure 163 may be provided in the dam area 100b1. When there are multiple dam structures 163, the multiple dam structures 163 may be arranged at intervals along the first direction X, and the multiple dam structures 163 all extend along the second direction Y. The dam structure 163 may be used to prevent part of the organic film layer (such as the organic encapsulation layer) in the display area 100a from spreading to the non-display area 100b, and may effectively reduce the difference between the thickness of the organic film layer located at the edge area of the display area 100a and the thickness located at the center area of the display area 100a, so as to improve the display effect.
[0103] Exemplarily, the display panel 100 in the binding area 100b4 can be used to bind a flexible circuit board, a chip, etc. By bending the display panel 100 in the bending area 100b5, the display panel 100 in the binding area 100b4 can be bent to the backlight surface of the display panel 100, so that the frame width of the display device can be reduced.
[0104] In some embodiments, see Figure 2 The display panel 100 may include a substrate 101. The substrate 101 may provide support for the remaining film layers that are subsequently disposed.
[0105] In some embodiments, see Figure 2 The display panel 100 may include a conductive layer 102 , which is disposed on one side of the substrate 101 , and the conductive layer 102 may be located in the transition region 100 b 3 .
[0106] Exemplarily, the conductive layer 102 includes a plurality of conductive traces located in the bending area 100b5, the plurality of conductive traces all extend along the first direction X, and the plurality of conductive traces are arranged along the second direction Y at intervals.
[0107] Exemplarily, the conductive layer 102 may also be located in at least one of the display area 100 a , the dam area 100 b 1 , the opening area 100 b 2 , and the binding area 100 b 4 .
[0108] Exemplarily, the conductive layer 102 includes a pad located in the binding area 100b4, and the pad can be used to be bound and connected to a flexible circuit board, a chip, etc.
[0109] In some embodiments, see Figure 2The display panel 100 includes a first organic layer 161, which is disposed on a side of the conductive layer 102 away from the substrate 101. The first organic layer 161 includes a first organic portion 1611 and a second organic portion 1612. The first organic portion 1611 is located in the dam area 100b1, and the second organic portion 1612 is located in the transition area 100b3. A first opening 181 is provided between the first organic portion 1611 and the second organic portion 1612, and the first opening 181 is located in the opening area 100b2. The sidewall of the first opening 181 includes a first sidewall 1641 close to the bending area 100b5. The thickness of at least a portion of the second organic portion 1612 at the first sidewall 1641 is less than the thickness of the remaining portion of the second organic portion 1612, that is, the thickness of at least a portion of the second organic portion 1612 at the first sidewall 1641 is relatively thin, and the orthographic projection of the first sidewall 1641 on the substrate 101 partially overlaps with the orthographic projection of the conductive layer 102 on the substrate 101. Among them, since the second organic part 1612 is an organic material and is easy to absorb water, if the at least part of the second organic part 1612 with a relatively thin thickness is exposed to a subsequent wet process, the water absorbed by the at least part of the second organic part 1612 with a relatively thin thickness is more likely to pass through the at least part of the second organic part 1612 with a relatively thin thickness and corrode the conductive layer 102 below, thereby more easily affecting the reliability of the conductive layer 102 and the display panel 100, resulting in poor display.
[0110] In some embodiments, see Figure 2 The display panel 100 includes a second organic layer 162, and the second organic layer 162 is located between the substrate 101 and the conductive layer 102. The second organic layer 162 includes a third organic portion 1623 and a fourth organic portion 1624, the third organic portion 1623 is located in the dam area 100b1, the fourth organic portion 1624 is located in the transition area 100b3, a sixth opening 186 is provided between the third organic portion 1623 and the fourth organic portion 1624, the sixth opening 186 is at least partially located in the opening area 100b2, the sixth opening 186 has a second sidewall 1642 close to the bending area 100b5, and at least a portion of the second organic portion 1612 at the first sidewall 1641 is located on the side of the second sidewall 1642 away from the substrate 101. Among them, since the fourth flat portion at the second side wall 1642 forms a step and has a large step difference, the thickness of the second organic portion 1612 covering the side of the second side wall 1642 away from the substrate 101 is thinner, so that the thickness of at least part of the second organic portion 1612 at the first side wall 1641 is thinner.
[0111] Exemplarily, at least one of the first organic layer 161 and the second organic layer 162 is a planarization layer.
[0112] For example, see Figure 2The first organic portion 1611 includes at least one first sub-bank 1631, and the third organic portion 1623 includes at least one second sub-bank 1632. The first sub-bank 1631 and the second sub-bank 1632 both extend in the second direction Y. The first sub-bank 1631 and the second sub-bank 1632 are arranged correspondingly. The first sub-bank 1631 is located on a side of the corresponding second sub-bank 1632 away from the substrate 101. The first sub-bank 1631 and the corresponding second sub-bank 1632 together form a dam structure 163. When there are multiple first sub-banks 1631 and second sub-banks 1632, the dam structure 163 can be multiple.
[0113] In the embodiment of the present application, the corresponding arrangement of A and B may refer to: one A is correspondingly arranged with at least one B, or one B is correspondingly arranged with at least one A. The embodiment of the present application is described by taking the corresponding arrangement of one A and one B as an example.
[0114] The first protective layer 110 provided in the embodiment of the present application is described below.
[0115] In some embodiments, see Figure 2 and Figure 7 The display panel 100 includes a first protective layer 110, which is disposed on the side of the second organic part 1612 away from the substrate 101, so that the first protective layer 110 can protect and waterproof the covered second organic part 1612. In the subsequent wet process, the absorption of water by the second organic part 1612 can be reduced, thereby reducing the erosion of the conductive layer 102 below by water, so as to improve the reliability of the conductive layer 102 and the display panel 100, and improve the display effect of the display panel 100. In the transition area 100b3, the orthographic projection of the first protective layer 110 on the substrate 101 and the orthographic projection of the conductive layer 102 on the substrate 101 at least partially overlap. Since the path of water eroding the conductive layer 102 along the thickness direction of the substrate 101 is shorter, shielding the first protective layer 110 directly above the conductive layer 102 can help to extend the length of the water erosion path, which is conducive to reducing the erosion of the conductive layer 102 by water.
[0116] For example, see Figure 2 The transition region 100b3 includes a first sub-region C1, a second sub-region C2 and a third sub-region C3 arranged in sequence from the dam region 100b1 to the transition region 100b3, and the first side wall 1641 is located in the first sub-region C1.
[0117] In some embodiments, the first protection layer 110 may be located in at least one of the first sub-region C1 , the second sub-region C2 , and the third sub-region C3 .
[0118] Exemplarily, the first protective layer 110 covers at least one of the first sub-region C1 and the third sub-region C3, thereby providing protection and waterproofing for the second organic part 1612 of at least one of the first sub-region C1 and the third sub-region C3, thereby reducing the erosion of the conductive layer 102 in the region by subsequent wet processes, thereby improving the reliability of the conductive layer 102 and the display panel 100, and improving the display effect of the display panel 100.
[0119] In an embodiment where the first protective layer 110 covers the first sub-region C1, the orthographic projection of the first side wall 1641 on the substrate 101 is located within the orthographic projection of the first protective layer 110 on the substrate 101, so that the first protective layer 110 can provide protection and waterproofing for the second organic portion 1612 at the first side wall 1641. In the subsequent wet process, the absorption of water by the second organic portion 1612 at the first side wall 1641 can be reduced, thereby reducing the erosion of the conductive layer 102 below by water, thereby improving the reliability of the conductive layer 102 and the display panel 100, and improving the display effect of the display panel 100.
[0120] Exemplarily, the first protective layer 110 also covers at least a portion of the second sub-region C2, thereby providing protection and waterproofing for the second organic portion 1612 of the second sub-region C2, thereby reducing the erosion of the conductive layer 102 in the region by subsequent wet processes, thereby improving the reliability of the conductive layer 102 and the display panel 100, and improving the display effect of the display panel 100.
[0121] Exemplarily, the first protective layer 110 covers at least a portion of the second sub-region C2 and the third sub-region C3, thereby providing protection and waterproofing for the second organic part 1612 of the second sub-region C2 and the third sub-region C3, thereby reducing the erosion of the conductive layer 102 in the region by subsequent wet processes, thereby improving the reliability of the conductive layer 102 and the display panel 100, and improving the display effect of the display panel 100.
[0122] Exemplarily, the first protective layer 110 extends from the first sub-region C1 to the dam area 100b1, and the first protective layer 110 covers at least a portion of the dam area 100B1, thereby protecting the first organic layer 161 and the conductive layer 102 located in the dam area 100b1 and the opening area 100b2 to improve the reliability of the conductive layer 102 and the display panel 100.
[0123] In some embodiments, the first protective layer 110 also covers at least part of the bending area 100b5, and the first organic layer 161 and the conductive layer 102 can both be located in the bending area 100b5, thereby protecting the first organic layer 161 and the conductive layer 102 located in the bending area 100b5 to improve the reliability of the conductive layer 102 and the display panel 100.
[0124] Exemplarily, the first protective layer 110 may also be located in the second sub-region C2, the third sub-region C3 and the bending area 100b5, and the orthographic projection of the first protective layer 110 on the substrate 101 at least partially overlaps with the orthographic projection of the second sub-region C2 on the substrate 101, and the orthographic projection of the first protective layer 110 on the substrate 101 at least partially overlaps with the orthographic projection of the bending area 100b5 on the substrate 101. The first protective layer 110 located in the second sub-region C2 and the first protective layer 110 located in the bending area 100b5 are connected through the first protective layer 110 located in the third sub-region C3, thereby improving the connection stability between the first protective layer 110 and the second organic part 1612, and can also protect the first organic layer 161 and the conductive layer 102 in this area to improve the reliability of the conductive layer 102 and the display panel 100.
[0125] For example, see Figure 7 The first protective layer 110 extends from the dam area 100b1 to the third sub-area C3, so that the first protective layer 110 can protect and waterproof the first organic part 1611 and the second organic part 1612, and can better protect the first organic layer 161 and the conductive layer 102 in this area, so as to improve the reliability of the conductive layer 102 and the display panel 100.
[0126] In some embodiments, see Figure 2 In the bending zone 100b5, the first protective layer 110 can cover at least part of the bending zone 100b5, and the first protective layer 110 has a fourth opening 184. There can be multiple fourth openings 184, and the multiple fourth openings 184 can be arranged at intervals. By setting the fourth openings 184, the influence of the first protective layer 110 on the bending performance of the bending zone 100b5 can be reduced, and the bending stress of the display panel 100 in the bending zone 100b5 can be reduced.
[0127] Illustratively, in the bending area 100b5, the orthographic projection of the fourth opening on the substrate 101 is located outside the orthographic projection of the conductive layer 102 on the substrate 101, that is, the fourth opening and the conductive layer 102 do not overlap along the thickness direction of the substrate 101, thereby alleviating the erosion of the conductive layer 102 by water absorbed by the second organic part 1612 exposed at the fourth opening.
[0128] In some embodiments, the first protective layer 110 is also located in the binding area 100b4, so as to protect and waterproof the first organic layer 161 and the conductive layer 102 located in the binding area 100b4, thereby improving the reliability of the conductive layer 102 and the display panel 100. Figure 2In an embodiment where the conductive layer 102 includes a pad located in the binding area 100b4, the first protective layer 110 has a fifth opening 185, which exposes the pad, thereby preventing the first protective layer 110 from affecting the binding of the pad to the flexible circuit board, chip, etc.
[0129] Exemplarily, the material of the first protective layer 110 includes an inorganic material, which has a good water blocking effect and can also reduce the preparation cost of the first protective layer 110. In this case, the first protective layer 110 is an inorganic waterproof layer.
[0130] Exemplarily, the material of the first protective layer 110 includes an inorganic material. The inorganic material has a good water blocking effect and can also reduce the preparation cost of the first protective layer 110 .
[0131] Exemplarily, the thickness of the first protective layer 110 ranges from 3000 Å to 5000 Å, so that the thickness of the first protective layer 110 can be prevented from being too small, which is beneficial to improving the protection and waterproof effect of the first protective layer 110. In addition, the thickness of the first protective layer 110 can be prevented from being too large, which is beneficial to making the display panel 100 thinner and lighter, and reducing the influence of the first protective layer 110 on the bending performance of the bending area 100b5. For example, the thickness of the first protective layer 110 can be 3000 Å, 3500 Å, 4000 Å, 4500 Å, 5000 Å, or any value between 3000 Å and 5000 Å.
[0132] In some embodiments, see Figure 7 The first protective layer 110 is also located in the display area ( Figure 8 ), the first protective layer 110 is reused as the pixel defining layer 170, thereby enriching the function of the first protective layer 110, and there is no need to set up the pixel defining layer 170 separately, which is beneficial to simplify the preparation process of the display panel 100 and reduce the preparation cost.
[0133] In some embodiments, see Figure 3 and Figure 4The display panel 100 further includes a pixel defining layer 170, which is located on the side of the first organic layer 161 away from the substrate 101, and the pixel defining layer 170 extends from the display area 100a to at least the first sub-area C1, and the pixel defining layer 170 can cover at least a portion of the first side wall 1641. The first protective layer 110 is located on the side of the pixel defining layer 170 away from the substrate 101. By simultaneously providing the first protective layer 110 and the pixel defining layer 170 to waterproof and protect the first organic layer 161, the protection and waterproof effect of the first organic layer 161 can be improved. In addition, the pixel defining layer 170 extends from the first side wall 1641 to the dam area 100b1, so that the pixel defining layer 170 has a better covering effect on the opening area 100b2 and the dam area 100b1, and the pixel defining layer 170 has a better protection and waterproof effect on the first organic layer 161 and the conductive layer 102 in the opening area 100b2 and the dam area 100b1.
[0134] For example, see Figure 4 The pixel defining layer 170 includes a first extending portion 111 , which is located on a side of the first sidewall 1641 away from the substrate 101 . The first extending portion 111 can protect and waterproof the first organic layer 161 at the first sidewall 1641 .
[0135] See also Figure 5 The pixel defining layer 170 includes a first extension portion 111, which is located on the side of the first side wall 1641 away from the substrate 101. The pixel defining layer 170 is also located in the second sub-region C2. The pixel defining layer 170 located in the second sub-region C2 is connected to the first extension portion 111, so that the pixel defining layer 170 has a better protection and waterproof effect on the second organic portion 1612 at the first side wall 1641.
[0136] In some embodiments, the union of the orthographic projection of the first protective layer 110 on the substrate 101 and the orthographic projection of the pixel defining layer 170 on the substrate 101 covers the orthographic projection of the transition zone 100b3 on the substrate, and the sum of the areas of the orthographic projections of the first protective layer 110 and the pixel defining layer 170 on the substrate 101 is greater than or equal to the area of the orthographic projection of the transition zone 100b3 on the substrate. The first protective layer 110 and the pixel defining layer 170 together can completely cover the transition zone 100b3, thereby better waterproofing and protecting the first organic layer 161 of the transition zone 100b3.
[0137] Exemplarily, the material of the pixel defining layer 170 includes an inorganic material. The inorganic material has a good water blocking effect and can also reduce the preparation cost of the pixel defining layer 170 .
[0138] Exemplarily, the thickness of the pixel defining layer 170 ranges from 3000 angstroms to 5000 angstroms, thereby preventing the pixel defining layer 170 from being too thin, which is beneficial to improving the protection and waterproofing effect of the pixel defining layer 170. In addition, the pixel defining layer 170 can be prevented from being too thick, which is beneficial to making the display panel 100 thinner and lighter. For example, the thickness of the pixel defining layer 170 can be 3000 angstroms, 3500 angstroms, 4000 angstroms, 4500 angstroms, 5000 angstroms, or any value between 3000 angstroms and 5000 angstroms.
[0139] Exemplarily, the thickness of the pixel defining layer 170 is greater than the thickness of the first protective layer 110, so that the thickness of the pixel defining layer 170 is larger and the thickness of the first protective layer 110 is smaller, that is, the adverse effect of the pixel defining layer 170 on the bending performance is greater than the adverse effect of the first protective layer 110 on the bending performance, and the first protective layer 110 can be arranged in the bending area 100b5, and the pixel defining layer 170 is arranged outside the bending area 100b5. Such an arrangement is conducive to reducing the influence of the first protective layer 110 on the bending performance of the display panel 100 in the bending area 100b5. Among them, the thickness of the pixel defining layer 170 is greater than that of the first protective layer 110. Therefore, in the bending area 100b5, reducing the arrangement of the pixel defining layer 170 is conducive to reducing the adverse effect of the pixel defining layer 170 on the bending performance. The thickness of the first protective layer 110 is smaller than that of the pixel defining layer 170 , which can increase the setting range of the first protective layer 110 in the bending area 100b5 to improve the protection and waterproof effect of the first protective layer 110 on the first organic layer 161 in the bending area 100b5 .
[0140] Illustratively, in the transition region 100b3, the orthographic projection of the pixel defining layer 170 on the substrate 101 is located within the orthographic projection of the first protective layer 110 on the substrate 101, so that the first protective layer 110 has a wider coverage range, which is beneficial to improving the protection and waterproof effects of the first protective layer 110.
[0141] Exemplarily, in an embodiment where a pixel defining layer 170 and a first protective layer 110 are provided at the same time, the first protective layer 110 is located outside the display area 100a, thereby avoiding the adverse effect of the first protective layer 110 on the thickness of the display panel 100 in the display area 100a, which is beneficial to making the display panel 100 lighter and thinner.
[0142] For example, see Figure 4 and Figure 5The first protective layer 110 includes a second extension portion 112, and the pixel defining layer 170 includes a first extension portion 111. The second extension portion 112 is located on the side of the first extension portion 111 away from the second organic portion 1612. The second extension portion 112 and the first side wall 1641 are connected through the first extension portion 111. The first extension portion 111 and the second extension portion 112 both have good coverage on the first side wall 1641, which is beneficial to improving the protection and waterproof effect of the first protective layer 161 on the second organic portion 1612 at the first side wall 1641, so as to improve the reliability of the conductive layer 102 and the display panel 100.
[0143] In some embodiments, see Figure 8 The display panel 100 further includes a first isolation structure 140 and a plurality of light-emitting units 130 located in the display area 100a. The first isolation structure 140 and the light-emitting units 130 are both located on the side of the first organic layer 161 away from the substrate 101. The first isolation structure 140 encloses a plurality of second openings 182 and a plurality of third openings 183. The second openings 182 and the third openings 183 are arranged at intervals. The plurality of third openings 183 are arranged corresponding to the plurality of light-emitting units 130. The light-emitting units 130 are at least partially arranged in the corresponding third openings 183.
[0144] Exemplarily, a second isolation structure 150 is disposed in the second opening 182, and the second isolation structure 150 is spaced apart from the first isolation structure 140. By disposing the second isolation structure 150 in the second opening 182 of the first isolation structure 140, it is beneficial to reduce the total thickness of the display panel 100 occupied by the first isolation structure 140 and the second isolation structure 150, thereby facilitating the thinning and lightness of the display panel 100.
[0145] Exemplarily, the second isolation structure 150 is configured as a touch electrode, thereby advantageously improving the touch performance of the display panel 100 .
[0146] Exemplarily, the first isolation structure 140 and the second isolation structure 150 are arranged in the same layer, so as to facilitate the simultaneous preparation of the first isolation structure 140 and the second isolation structure 150, which is beneficial to simplify the preparation process of the first isolation structure 140 and the second isolation structure 150 and reduce the preparation cost.
[0147] In the display area 100a, the display panel 100 also includes a second protective layer 120, which is located on the side of the second isolation structure 150 away from the substrate 101, and the orthographic projection of the second isolation structure 150 on the substrate 101 is located within the orthographic projection of the second protective layer 120 on the substrate 101. The second protective layer 120 can protect the second isolation structure 150. The second protective layer 120 includes insulating material, which is beneficial to the electrical isolation between the touch electrode and other conductive film layers.
[0148] Exemplarily, the material of the second protective layer 120 includes an inorganic material, which is beneficial to improving the protective and waterproof effects of the second protective layer 120 .
[0149] Exemplarily, the second protection layer 120 covers the sidewalls of the second isolation structure 150 , thereby improving the electrical isolation effect between the touch electrodes and other conductive film layers and reducing interference between other conductive structures and the touch electrodes.
[0150] Exemplarily, the second protection layer 120 is also located between the first isolation structure 140 and the second isolation structure 150 , which is beneficial to expanding the coverage area of the second protection layer 120 , thereby expanding the protection range of the second protection layer 120 .
[0151] Exemplarily, the second protective layer 120 is also located on the side of the first isolation structure 140 adjacent to the second isolation structure 150 that is away from the substrate 101, and the second protective layer 120 at least partially covers the corresponding first isolation structure 140, thereby facilitating the expansion of the coverage area of the second protective layer 120 and providing protection and waterproofing for the first isolation structure 140.
[0152] In some embodiments, see Figure 8 The display panel 100 also includes a plurality of packaging parts 134, which are arranged on the side of the corresponding second electrode 132 away from the substrate 101, and the packaging parts 134 are also located on the side wall of the corresponding third opening 183, and the packaging parts 134 extend to the side of the first isolation structure 140 away from the substrate 101, so as to achieve a better packaging effect for the light-emitting unit 130. That is, the packaging part 134 is located in the corresponding third opening 183 and on the side of the first isolation structure 140 away from the substrate 101, the packaging part 134 includes a third extension part 1343, the third extension part 1343 is located on the side of the first isolation structure 140 away from the substrate 101, the second protective layer 120 is located on the side of the third extension part 1343 away from the substrate 101, and the orthographic projection of the third extension part 1343 on the substrate 101 is located within the orthographic projection of the second protective layer 120 on the substrate 101. In this way, the second protective layer 120 can protect and waterproof the third extension part 1343. The second protective layer 120 is also beneficial to prevent peeling between the third extension part 1343 and the first isolation structure 140, thereby improving the packaging effect of the packaging part 134.
[0153] For example, see Figure 8The packaging part 134 also includes a fourth extension part 1344, and the fourth extension part 1344 is at least partially located on the side wall of the third opening 183. The third extension part 1343 and the fourth extension part 1344 are connected. The second protective layer 120 is also located on the side of the fourth extension part 1344 away from the first isolation structure 140, which can increase the coverage of the second protective layer 120, which is beneficial to improve the protection and waterproof effect of the second protective layer 120, and improve the packaging effect of the packaging part 134.
[0154] Exemplarily, the packaging portion 134 also includes a fifth extension portion (not shown in the figure), the fifth extension portion is located on the side of the fourth extension portion away from the third extension portion 1343, and the fifth extension portion is located on the side of the second electrode 132 away from the substrate 101, and the second protective layer 120 is also located on the side of the fifth extension portion away from the substrate 101, which can increase the coverage of the second protective layer 120, which is beneficial to improving the protective effect of the second protective layer 120 and improving the packaging effect of the packaging portion 134.
[0155] The pixel defining layer 170 provided in the embodiment of the present application is further described below.
[0156] In some embodiments, see Figure 2 and Figure 8 , the pixel defining layer 170 is located in the display area 100a and the non-display area 100b. In the display area 100a, the pixel defining layer 170 is located between the first organic layer 161 and the first isolation structure 140, and the pixel defining layer 170 encloses and forms a plurality of pixel openings 171, and the plurality of pixel openings 171 are arranged correspondingly to the plurality of third openings 183, and the third openings 183 are connected to the corresponding pixel openings 171, and the light-emitting unit 130 is located in the corresponding pixel openings 171. The pixel defining layer 170 is located on the side of the first electrode 131 away from the substrate 101, and the pixel opening 171 exposes the corresponding first electrode 131. In this way, by providing the pixel defining layer 170, it is convenient to provide the light-emitting unit 130 on the substrate 101.
[0157] The first isolation structure 140 provided in the embodiment of the present application is further described below.
[0158] In some embodiments, see Figure 8 In the display area 100a, the display panel 100 further includes a first isolation structure 140, which is located on a side of the pixel defining layer 170 away from the substrate 101, and the first isolation structure 140 encloses a plurality of third openings 183, which may be arranged at intervals.
[0159] Exemplarily, the orthographic projection of the pixel opening 171 on the substrate 101 may be located within the orthographic projection of the third opening 183 on the substrate 101 .
[0160] Exemplarily, the first isolation structure 140 may refer to an undercut structure that is larger on top and smaller on the bottom and can isolate adjacent light-emitting functional components 133. The first isolation structure 140 may be a structure formed by a single film layer or a structure formed by stacking multiple film layers.
[0161] Exemplarily, the cross-sectional shape of the first isolation structure 140 may be an inverted trapezoid, a T-shape, an I-shape, or the like, which is “large at the top and small at the bottom”.
[0162] In some embodiments, see Figure 8 The first isolation structure 140 may include a first isolation portion 141 and a second isolation portion 142. The second isolation portion 142 is located on the side of the first isolation portion 141 facing the substrate 101. The orthographic projection of the second isolation portion 142 on the substrate 101 is located within the orthographic projection of the first isolation portion 141 on the substrate 101, so that the first isolation structure 140 forms an undercut structure with a "large top and small bottom", that is, the first isolation structure 140 has an "eaves". In this way, in the process of forming the light-emitting functional component 133, the first isolation structure 140 can separate two adjacent light-emitting functional components 133.
[0163] In some embodiments, see Figure 8 , the first isolation structure 140 may include a third isolation portion 143, the third isolation portion 143 may be located on a side of the second isolation portion 142 away from the first isolation portion 141, and the orthographic projection of the second isolation portion 142 on the substrate 101 may be located within the orthographic projection of the third isolation portion 143 on the substrate 101. Thus, in the embodiment where the material of the first isolation structure 140 is a conductive material, the first isolation structure 140 may reduce the resistance of the first isolation structure 140 by providing the stacked first isolation portion 141, the second isolation portion 142 and the third isolation portion 143, thereby reducing the power consumption of the display panel 100.
[0164] Exemplarily, at least one of the first isolation portion 141, the second isolation portion 142, and the third isolation portion 143 may be made of a conductive material, and the conductive material may include metals such as titanium, silver, copper, aluminum, and molybdenum, or alloys, or conductive oxides, such as indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnO), aluminum zinc oxide (AZO), zinc gallium oxide, titanium tantalum oxide, tin oxide, cadmium oxide, and indium oxide. In other examples, at least one of the second isolation portion 142, the third isolation portion 143, and the first isolation portion 141 may be made of an insulating material, which is not limited in the embodiments of the present application.
[0165] For example, the material of the first isolation portion 141 may include at least one of titanium and molybdenum.
[0166] For example, the material of the second isolation portion 142 may include at least one of aluminum, copper, and silver.
[0167] For example, the material of the third isolation portion 143 may include at least one of titanium and molybdenum.
[0168] In an embodiment where at least one of the first isolation portion 141, the second isolation portion 142, and the third isolation portion 143 is made of a conductive material, the second electrode 132 may be electrically connected to the first isolation structure 140. In this way, the second electrodes 132 located in each third opening 183 may be connected as a whole through the first isolation structure 140, so that the second electrode 132 may be electrically connected to the second power line through the first isolation structure 140, so as to apply a power supply voltage to the second electrode 132, thereby optimizing the wiring arrangement of the display panel 100.
[0169] In an embodiment where the material of the second isolation portion 142 is a conductive material, the second electrode 132 may be electrically connected to the second isolation portion 142 .
[0170] In an embodiment where the material of the third isolation portion 143 is a conductive material, the second electrode 132 may be electrically connected to the third isolation portion 143 .
[0171] In an embodiment where the materials of the second isolation portion 142 and the third isolation portion 143 are both conductive materials, the second electrode 132 can be electrically connected to at least one of the second isolation portion 142 and the third isolation portion 143. For example, the second electrode 132 is connected to both the second isolation portion 142 and the third isolation portion 143, thereby improving the connection stability between the second electrode 132 and the first isolation structure 140.
[0172] The composition, preparation, etc. of the first isolation structure 140 mentioned in the embodiments of the present application are described in patents CN118251982A, 202410864269.8, PCT / CN2024 / 098407, PCT / CN2024 / 102783, PCT / CN2024 / 098217, PCT / CN2024 / 099419, PCT / CN2024 / 09 There are relevant descriptions in 9072, CN117979755A, CN117998900A, CN117062489A, CN117580403A, CN116583155A, CN116669477A, CN117396039A, CN116669480A, CN116600606A, and CN117500332A for reference.
[0173] The second isolation structure 150 provided in the embodiment of the present application is further described below.
[0174] In some embodiments, see Figure 8 The second isolation structure 150 includes a sixth isolation portion 156, a fifth isolation portion 155 and a fourth isolation portion 154 arranged in sequence along a direction away from the substrate 101, the orthographic projection of the fifth isolation portion 155 on the substrate 101 is located within the orthographic projection of the fourth isolation portion 154 on the substrate 101, and the orthographic projection of the fifth isolation portion 155 on the substrate 101 is located within the orthographic projection of the sixth isolation portion 156 on the substrate 101.
[0175] Exemplarily, the fourth isolation portion 154 is arranged on the same layer as the first isolation portion 141, and / or the fifth isolation portion 155 is arranged on the same layer as the second isolation portion 142, and / or the sixth isolation portion 156 is arranged on the same layer as the third isolation portion 143, thereby simplifying the preparation process of the display panel 100 and reducing the preparation cost.
[0176] Exemplarily, a material of at least one of the fourth isolation portion 154 , the fifth isolation portion 155 , and the sixth isolation portion 156 includes a conductive material and is configured as a touch electrode.
[0177] The light emitting unit 130 provided in the embodiment of the present application is described below.
[0178] In some embodiments, see Figure 8 There may be a plurality of light emitting units 130, and the plurality of light emitting units 130 are arranged at intervals, for example, the plurality of light emitting units 130 may be arranged in an array.
[0179] Exemplarily, the light emitting unit 130 includes a first electrode 131 , a light emitting functional component 133 , and a second electrode 132 which are sequentially arranged in a direction away from the substrate 101 .
[0180] Exemplarily, a portion of the light emitting functional component 133 is disposed in the corresponding pixel opening 171 and extends from the corresponding pixel opening 171 to the corresponding third opening 183 .
[0181] For example, the second electrode 132 may be at least partially located in the corresponding third opening 183 .
[0182] For example, one of the first electrode 131 and the second electrode 132 may be an anode, and the other of the first electrode 131 and the second electrode 132 may be a cathode. The present embodiment is described by taking the first electrode 131 as an anode and the second electrode 132 as a cathode as an example.
[0183] For example, the first electrode 131 may be electrically connected to a pixel driving circuit, the pixel driving circuit may be electrically connected to a first power line, and the second electrode 132 may be electrically connected to a second power line.
[0184] Exemplarily, one of the first power line and the second power line is used to transmit a low voltage, and the other is used to transmit a high voltage. For example, the first power line is used to transmit a high voltage, and the second power line is used to transmit a low voltage.
[0185] Exemplarily, the light-emitting functional part 133 may include a light-emitting layer (Emission layer, EML). In addition, the light-emitting functional part 133 may also include at least one of a hole injection layer (HIL), a hole transport layer (HTL), an electron injection layer (EIL), an electron transport layer (ETL), a hole blocking layer (HBL) and an electron blocking layer (EBL).
[0186] Exemplarily, the plurality of light emitting units 130 include but are not limited to a first light emitting unit, a second light emitting unit, and a third light emitting unit having different light emitting colors. For example, the first light emitting unit, the second light emitting unit, and the third light emitting unit may be a red light emitting unit, a green light emitting unit, and a blue light emitting unit, respectively. In other examples, the plurality of light emitting units 130 may also include a white light emitting unit.
[0187] In some embodiments, an insulating layer 103 may be disposed between the substrate 101 and the second organic layer 162 .
[0188] The following is a description of a method for manufacturing the display panel 100 provided in an embodiment of the present application.
[0189] The method for preparing the display panel 100 provided in the embodiment of the present application can be used to prepare the display panel 100 in the above embodiment, see Figure 1 and Figure 2 The display panel 100 has a display area 100a and a non-display area 100b that are adjacent to each other. The non-display area 100b includes a dam area 100b1, an opening area 100b2 and a transition area 100b3 that are sequentially arranged along a first direction X. The dam area 100b1 is located between the display area 100a and the opening area 100b2. Fig. 9 , the method for preparing the display panel 100 may include the following steps:
[0190] S100: providing a substrate.
[0191] See also Figure 2 and Figure 8First, a substrate 101 is provided, and the substrate 101 can provide support for the remaining film layers that are subsequently arranged.
[0192] See also Figure 2 and Figure 8 After providing the substrate 101 , the method may include forming an insulating layer 103 on one side of the substrate 101 . The insulating layer 103 may be located in the display area 100 a and the non-display area 100 b .
[0193] See also Figure 2 and Figure 8 After forming the insulating layer 103, the method may include forming a second organic layer 162 on the side of the insulating layer 103 facing away from the substrate 101, wherein the second organic layer 162 is located in the display area 100a and the non-display area 100b. The second organic layer 162 includes a third organic portion 1623 and a fourth organic portion 1624, wherein the third organic portion 1623 is located in the dam area 100b1, and the fourth organic portion 1624 is located in the transition area 100b3. A sixth opening 186 is provided between the third organic portion 1623 and the fourth organic portion 1624, wherein the sixth opening 186 is at least partially located in the opening area 100b2, and the sixth opening 186 has a second sidewall 1642 close to the bending area 100b5.
[0194] S200: forming a conductive layer on one side of the substrate 101; the conductive layer is located in the transition region.
[0195] See also Figure 2 and Figure 8 After forming the second organic layer 162, the process may include: forming a conductive layer 102 on the side of the second organic layer 162 away from the substrate 101, and the conductive layer 102 may be located in the transition area 100b3. Of course, the conductive layer 102 may also be located in at least one of the display area 100a (not shown in the figure), the dam area 100b1, the opening area 100b2, the bending area 100b5 and the binding area 100b4.
[0196] S300: forming a first organic layer on a side of the conductive layer facing away from the substrate; the first organic layer includes a second organic portion, and the second organic portion is located in the transition region.
[0197] See also Figure 2 and Figure 8After forming the conductive layer 102, the method may include forming a first organic layer 161 on a side of the conductive layer 102 facing away from the substrate 101. The first organic layer 161 includes a first organic portion 1611 and a second organic portion 1612, wherein the first organic portion 1611 is located in the dam area 100b1, and the second organic portion 1612 is located in the transition area 100b3. A first opening 181 is provided between the first organic portion 1611 and the second organic portion 1612, and the first opening 181 is located in the opening area 100b2. The sidewall of the first opening 181 includes a first sidewall 1641 close to the bending area 100b5, and the thickness of at least a portion of the second organic portion 1612 at the first sidewall 1641 is less than the thickness of the remaining portion of the second organic portion 1612.
[0198] See also Figure 2 and Figure 8 After forming the first organic layer 161 , the method may include forming a plurality of first electrodes 131 on a side of the first organic layer 161 away from the substrate 101 , wherein the plurality of first electrodes 131 are located in the display area 100 a .
[0199] S400: forming a first protective layer on a side of the second organic part facing away from the substrate; in the transition region, an orthographic projection of the first protective layer on the substrate at least partially overlaps an orthographic projection of the conductive layer on the substrate.
[0200] See also Figure 2 and Figure 8 After forming the first electrode 131, the first protective layer 110 may be formed on the side of the second organic part 1612 away from the substrate 101, so that the first protective layer 110 can protect and waterproof the covered second organic part 1612. In the subsequent wet process, the absorption of water by the second organic part 1612 can be reduced, thereby reducing the erosion of the conductive layer 102 below by water, so as to improve the reliability of the conductive layer 102 and the display panel 100, and improve the display effect of the display panel 100. In the transition area 100b3, the orthographic projection of the first protective layer 110 on the substrate 101 at least partially overlaps with the orthographic projection of the conductive layer 102 on the substrate 101. Since the path of water eroding the conductive layer 102 along the thickness direction of the substrate 101 is shorter, shielding the first protective layer 110 directly above the conductive layer 102 can help to extend the length of the water erosion path, which is conducive to reducing the erosion of the conductive layer 102 by water.
[0201] After forming the first organic layer 161 on the side of the conductive layer 102 facing away from the substrate 101, and before forming the first protective layer 110 on the side of the second organic part 1612 facing away from the substrate 101, a pixel defining layer 170 may be formed on the side of the first organic layer 161 facing away from the substrate 101, and in the display area 100a, the pixel defining layer 170 encloses a plurality of pixel openings 171. In this way, by providing the pixel defining layer 170 and the first protective layer 110 at the same time, the protection and waterproof effect of the first organic layer 162 can be improved.
[0202] Alternatively, the first protection layer 110 may not be reused as the pixel defining layer 170 , and the pixel defining layer 170 may not be provided separately, thereby simplifying the manufacturing process of the display panel 100 and reducing the manufacturing cost.
[0203] After forming the first protective layer 110 on the side of the first organic layer 161 away from the substrate 101, the process may include forming a light-emitting device material layer and an encapsulation material layer on the side of the first protective layer 110 away from the substrate 101; the light-emitting device material layer is located in the display area 100a and the non-display area 100b, and the encapsulation material layer is located on the side of the light-emitting device material layer away from the substrate 101. The light-emitting device material layer and the encapsulation material layer are patterned to remove the light-emitting device material layer and the encapsulation material layer located in the non-display area 100b and part of the light-emitting device material layer and the encapsulation material layer located in the display area 100a, and the light-emitting device material layer is retained to form the light-emitting functional part 133, the second electrode 132 and the encapsulation part 134. In this way, the first protective layer 110 is formed before the light-emitting device material layer is patterned. During the patterning process of the light-emitting device material layer, the first protective layer 110 can protect and waterproof the first organic layer 161, reduce the corrosion damage of the etching agent to the first organic layer 161 and the conductive layer 102, and thus improve the reliability of the conductive layer 102.
[0204] Exemplarily, the light-emitting device material layer and the packaging material layer corresponding to the light-emitting units 130 of different colors can be prepared in steps. For example, the light-emitting device material layer and the packaging material layer corresponding to the first light-emitting unit can be prepared first, and the light-emitting device material layer and the packaging material layer corresponding to the first light-emitting unit can be patterned. Then, the light-emitting device material layer and the packaging material layer corresponding to the second light-emitting unit can be prepared, and the light-emitting device material layer and the packaging material layer corresponding to the second light-emitting unit can be patterned. Then, the light-emitting device material layer and the packaging material layer corresponding to the third light-emitting unit can be prepared, and the light-emitting device material layer and the packaging material layer corresponding to the third light-emitting unit can be patterned. In this way, the first protective layer 110 is formed before the patterning of different light-emitting device material layers and packaging material layers. In the process of patterning different light-emitting device material layers and packaging material layers, the first protective layer 110 can protect and waterproof the first organic layer 161, reduce the corrosion damage of the etching agent to the first organic layer 161 and the conductive layer 102, thereby improving the reliability of the conductive layer 102.
[0205] For example, the patterning process may be implemented by dry etching and / or wet etching.
[0206] Exemplarily, the method for preparing the display panel 100 further includes forming a first isolation structure 140 and a second isolation structure 150 spaced apart on a side of the pixel defining layer 170 facing away from the substrate 101. The first isolation structure 140 and the second isolation structure 150 are located in the display area 100a, the first isolation structure 140 encloses a plurality of second openings 182 and a plurality of third openings 183, the second openings 182 and the third openings 183 are spaced apart, the plurality of third openings 183 are correspondingly arranged with the plurality of pixel openings 171, the third openings 183 are connected with the corresponding pixel openings 171, and the second isolation structure 150 is located in the second opening 182.
[0207] Exemplarily, after the light-emitting device material layer is patterned, a second protective layer 120 may be formed on the side of the second isolation structure 150 facing away from the substrate 101, and the orthographic projection of the second isolation structure 150 on the substrate 101 is located in the second protective layer 120, thereby providing protection and waterproofing for the second isolation structure 150.
[0208] Illustratively, the process of forming the second protection layer 120 on the side of the second isolation structure 150 facing away from the substrate 101 may also include forming the second protection layer 120 on the side of the first isolation structure 140 and / or the encapsulation portion 134 facing away from the substrate 101 .
[0209] In the case of using “including”, “having”, and “comprising” described herein, another component may be added unless a clear limiting term such as “only”, “consisting of”, etc. is used. Unless mentioned otherwise, a term in the singular form may include a plural form and should not be understood as being one in number.
[0210] The technical features of the above-described embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.
[0211] The above-described embodiments only express several implementation methods of the present application, and the descriptions thereof are relatively specific and detailed, but they cannot be construed as limiting the scope of the patent application. It should be pointed out that, for a person of ordinary skill in the art, several variations and improvements can be made without departing from the concept of the present application, and these all belong to the protection scope of the present application. Therefore, the protection scope of the patent application shall be subject to the attached claims.
Claims
1. A display panel, characterized in that: The display panel has a display area and a non-display area arranged adjacent to each other, the non-display area includes a transition area and a bending area, and the transition area is located on a side of the bending area facing the display area; the display panel includes: substrate; A conductive layer, disposed on one side of the substrate and located in the transition region; a first organic layer, disposed on a side of the conductive layer away from the substrate, the first organic layer comprising a second organic portion, the second organic portion being located in the transition region, The first protective layer is disposed on a side of the second organic part facing away from the substrate. In the transition region, an orthographic projection of the first protective layer on the substrate at least partially overlaps with an orthographic projection of the conductive layer on the substrate.
2. The display panel according to claim 1, characterized in that: The non-display area further includes an area along a dam and an opening area, the dam area is located on a side of the opening area facing the display area, and the opening area is located between the dam area and the transition area; the first organic layer further includes a first organic part, and the first organic part is located in the dam area; Preferably, the transition zone includes a first sub-region, a second sub-region and a third sub-region arranged in sequence from the opening zone to the bending zone; there is a first opening between the first organic part and the second organic part, the first opening is located in the opening zone, the side wall of the first opening includes a first side wall close to the bending zone, the thickness of at least a portion of the second organic part at the first side wall is less than the thickness of the second organic part located in other areas; the first side wall is located in the first sub-region.
3. The display panel according to claim 2, characterized in that: The first protective layer covers at least one of the first sub-region and the third sub-region; Preferably, the first protective layer also covers at least a portion of the second sub-region; Preferably, the first protective layer covers at least a portion of the second sub-region and the third sub-region; Preferably, the conductive layer is also located in the dam area and / or the opening area; Preferably, the first protective layer extends from the first sub-region to the dam region, and the first protective layer covers at least a portion of the dam region; Preferably, the first protective layer also covers at least a portion of the bending area.
4. The display panel according to claim 2, characterized in that: The first protective layer is located in the second sub-region, the third sub-region and the bending zone, and the orthographic projection of the first protective layer on the substrate at least partially overlaps with the orthographic projection of the second sub-region on the substrate, the orthographic projection of the first protective layer on the substrate at least partially overlaps with the orthographic projection of the bending zone on the substrate, and the first protective layer located in the second sub-region and the first protective layer located in the bending zone are connected through the first protective layer located in the third sub-region.
5. The display panel according to claim 2, characterized in that: The first protective layer extends from the dam area to the third sub-area; Preferably, the first protective layer is also located in the display area, and the first protective layer is reused as a pixel defining layer; Preferably, the material of the first protective layer includes an inorganic material; Preferably, the thickness of the first protective layer is in the range of 3000 angstroms to 5000 angstroms.
6. The display panel according to claim 3 or 4, characterized in that: The display panel further includes a pixel defining layer, the pixel defining layer is located on a side of the first organic layer away from the substrate, and the pixel defining layer extends from the display area to at least the first sub-area; the first protective layer is located on a side of the pixel defining layer away from the substrate; Preferably, the union of the orthographic projection of the first protective layer on the substrate and the orthographic projection of the pixel defining layer on the substrate covers the orthographic projection of the transition region on the substrate; Preferably, the thickness of the pixel defining layer is greater than the thickness of the first protective layer; Preferably, in the transition region, the orthographic projection of the pixel defining layer on the substrate is located within the orthographic projection of the first protective layer on the substrate; Preferably, the pixel defining layer at least covers a portion of the first sub-region; Preferably, the pixel defining layer covers the first sub-region and the second sub-region; Preferably, the material of the pixel defining layer includes an inorganic material; Preferably, the thickness of the pixel defining layer is in the range of 3000 angstroms to 5000 angstroms.
7. The display panel according to claim 1, characterized in that: The display panel further comprises a first isolation structure and a plurality of light-emitting units located in the display area, wherein the first isolation structure and the light-emitting units are both located on a side of the first organic layer away from the substrate; the first isolation structure encloses a plurality of second openings and a plurality of third openings, wherein the second openings are spaced apart from the third openings, the plurality of third openings are arranged corresponding to the plurality of light-emitting units, and the light-emitting units are at least partially arranged in the corresponding third openings; A second isolation structure is disposed in the second opening, and the second isolation structure is spaced apart from the first isolation structure; Preferably, the first isolation structure and the second isolation structure are arranged in the same layer; Preferably, the second isolation structure is configured as a touch electrode; Preferably, the light-emitting unit comprises a first electrode, a light-emitting functional part and a second electrode which are sequentially arranged in a direction away from the substrate; Preferably, the material of the first isolation structure includes a conductive material, and the second electrode is electrically connected to the first isolation structure; Preferably, the display panel also includes a pixel defining layer, which is located in the display area and the non-display area. In the display area, the pixel defining layer is located between the first organic layer and the first isolation structure. The pixel defining layer encloses a plurality of pixel openings, and the plurality of pixel openings are arranged corresponding to the plurality of third openings. The third openings are connected to the corresponding pixel openings, and the light-emitting unit is located at the corresponding pixel opening.
8. The display panel according to claim 7, characterized in that: In the display area, the display panel further includes a second protective layer, the second protective layer is located on a side of the second isolation structure away from the substrate, and an orthographic projection of the second isolation structure on the substrate is located within an orthographic projection of the second protective layer on the substrate; Preferably, the second protective layer covers the sidewalls of the second isolation structure; Preferably, the second protective layer is also located between the first isolation structure and the second isolation structure; Preferably, the second protective layer is also located on a side of the first isolation structure adjacent to the second isolation structure that is away from the substrate, and the second protective layer at least partially covers the corresponding first isolation structure; Preferably, the material of the second protective layer includes inorganic material.
9. The display panel according to claim 8, characterized in that: The display panel further includes a plurality of packaging parts, wherein the packaging parts are located in the corresponding third openings and on a side of the first isolation structure away from the substrate, the packaging part located on a side of the first isolation structure away from the substrate is a third extension part, the second protection layer is located on a side of the third extension part away from the substrate, and an orthographic projection of the third extension part on the substrate is located within an orthographic projection of the second protection layer on the substrate; Preferably, the packaging portion further includes a fourth extension portion, the fourth extension portion is at least partially located on a side wall of the third opening, the third extension portion is connected to the fourth extension portion, and the second protective layer is also located on a side of the fourth extension portion away from the first isolation structure.
10. The display panel according to claim 3 or 4, characterized in that: In the bending area, the first protective layer has a plurality of fourth openings arranged at intervals; Preferably, the orthographic projection of the fourth opening on the substrate is located outside the orthographic projection of the conductive layer on the substrate; Preferably, the conductive layer includes a plurality of conductive traces located in the bending zone, the plurality of conductive traces all extend in a direction from the transition zone to the bending zone, and two adjacent conductive traces are arranged at intervals.
11. The display panel according to any one of claims 1, characterized in that: The non-display area further includes a binding area, the binding area is located at a side of the bending area away from the display area, and the conductive layer and the first protective layer are also located in the binding area; The conductive layer includes a pad located in the binding region, and the first protection layer has a fifth opening, wherein the fifth opening exposes the pad.
12. The display panel according to any one of claim 2, characterized in that: The display panel includes a second organic layer, wherein the second organic layer is located between the substrate and the conductive layer; The second organic layer includes a third organic portion and a fourth organic portion, the third organic portion is located in the dam region, the fourth organic portion is located in the transition region, a sixth opening is provided between the third organic portion and the fourth organic portion, the sixth opening is located in the opening region, and the sixth opening has a second sidewall close to the bending region; At least a portion of the second organic portion at the first sidewall is located on a side of the second sidewall facing away from the substrate; Preferably, the first organic part includes at least one first sub-dam, and the third organic part includes at least one second sub-dam, the first sub-dam and the second sub-dam both extend along a second direction, the first sub-dam and the second sub-dam are arranged correspondingly, the first sub-dam is located on the side of the corresponding second sub-dam away from the substrate, the first sub-dam and the corresponding second sub-dam together form a dam structure, and the second direction is different from the direction from the transition zone to the bending zone, and is perpendicular to the thickness direction of the substrate.
13. A display panel, characterized in that: The display panel comprises a display area and a non-display area which are adjacent to each other, wherein the non-display area comprises a dam area, an opening area, a transition area and a bending area which are sequentially arranged along a first direction, and the dam area is located between the display area and the opening area; the display panel comprises: substrate; A conductive layer is disposed on one side of the substrate; a first organic layer, disposed on a side of the conductive layer away from the substrate, the first organic layer comprising a first organic portion and a second organic portion, the first organic portion being located in the dam region, the second organic portion being located in the transition region, a first opening being provided between the first organic portion and the second organic portion, the first opening being located in the opening region, a sidewall of the first opening comprising a first sidewall close to the bending region, a thickness of at least a portion of the second organic portion at the first sidewall being smaller than a thickness of the second organic portion at other regions, and an orthographic projection of the first sidewall on the substrate partially overlaps an orthographic projection of the conductive layer on the substrate; The inorganic waterproof layer is arranged on the side of the first side wall away from the substrate, the orthographic projection of the first side wall on the substrate is located within the orthographic projection of the inorganic waterproof layer on the substrate, and the first direction is perpendicular to the thickness direction of the substrate.
14. A display device, characterized in that: A display panel comprising any one of claims 1 to 13.
15. A method for preparing a display panel, characterized in that: The display panel comprises a display area and a non-display area which are adjacent to each other, the non-display area comprises a transition area and a bending area, the transition area is located on a side of the bending area facing the display area; the manufacturing method of the display panel comprises: providing a substrate; forming a conductive layer on one side of the substrate; the conductive layer is located in the transition region; forming a first organic layer on a side of the conductive layer away from the substrate; the first organic layer comprises a second organic portion, and the second organic portion is located in the transition region; A first protective layer is formed on a side of the second organic part facing away from the substrate; in the transition region, an orthographic projection of the first protective layer on the substrate at least partially overlaps with an orthographic projection of the conductive layer on the substrate.
16. The method for preparing a display panel according to claim 15, characterized in that: After forming the first protective layer on the side of the second organic part away from the substrate, the method further comprises: forming a light-emitting device material layer on the side of the first protective layer away from the substrate, wherein the light-emitting device material layer is located in the display area and the non-display area; The light emitting device material layer is patterned to remove the light emitting device material layer located in the non-display area and part of the light emitting device material layer located in the display area, and the remaining light emitting device material layer forms a light emitting functional part and a second electrode.
17. The method for manufacturing a display panel according to claim 16, characterized in that: After forming the first organic layer on the side of the conductive layer away from the substrate, and before forming the first protective layer on the side of the second organic layer away from the substrate, the method comprises: A pixel defining layer is formed on a side of the first organic layer facing away from the substrate; in the display area, the pixel defining layer encloses a plurality of pixel openings; Preferably, the method for preparing the display panel further includes: A first isolation structure and a second isolation structure are formed on a side of the pixel defining layer away from the substrate; the first isolation structure and the second isolation structure are both located in the display area, the first isolation structure encloses a plurality of second openings and a plurality of third openings, the second openings are spaced apart from the third openings, the plurality of third openings are correspondingly arranged with the plurality of pixel openings, the third openings are connected with the corresponding pixel openings, and the second isolation structure is located in the second opening; After the light emitting device material layer is patterned, the method further comprises: A second protection layer is formed on a side of the second isolation structure facing away from the substrate; and an orthographic projection of the second isolation structure on the substrate is located within the second protection layer.
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