Display panel, preparation method of display panel and electronic equipment

Abstract

The embodiment of the invention provides a display panel, a preparation method of the display panel and electronic equipment, and relates to the technical field of display, the display panel comprises a substrate, an isolation structure and a light emitting unit, the isolation structure is located on one side of the substrate, the isolation structure defines an isolation opening, the isolation structure comprises a first isolation part, and the first isolation part is located in the thickness direction of the substrate. The first isolation part comprises a first isolation sub-part and a second isolation sub-part which are arranged in a stacked mode, and the edge of the orthographic projection of the side, away from the substrate, of the first isolation sub-part on the substrate is located outside the orthographic projection of the second isolation sub-part on the substrate; at least part of the light-emitting units are located in the isolation openings, the light-emitting units comprise first electrodes, and the first electrodes are at least electrically connected with the first isolation sub-parts. The overlapping effect of the first electrode and the isolation structure can be improved, so that the display effect of the display panel can be improved.

Description

Technical Field

[0001] The present application relates to the field of display technology, and in particular, to a display panel, a method for preparing a display panel, and an electronic device. Background Art

[0002] Organic Light Emitting Diode (OLED) and flat panel display devices based on technologies such as Light Emitting Diode (LED) have been widely used in various consumer electronic products such as mobile phones, televisions, laptops, desktop computers, etc. due to their advantages such as high image quality, power saving, thin body and wide application range, becoming the mainstream in display panels.

[0003] However, there are still some problems with display panels that need to be solved urgently. Summary of the invention

[0004] In order to overcome the technical problems mentioned in the above technical background, an embodiment of the present application provides a display panel, wherein the display panel includes:

[0005] substrate;

[0006] an isolation structure, located on one side of the substrate, the isolation structure encloses an isolation opening, the isolation structure comprises a first isolation portion, and along the thickness direction of the substrate, the first isolation portion comprises a first isolation sub-portion and a second isolation sub-portion which are stacked, and an edge of an orthographic projection of a side of the first isolation sub-portion away from the substrate on the substrate is located outside the orthographic projection of the second isolation sub-portion on the substrate;

[0007] A light emitting unit is at least partially located in the isolation opening, and the light emitting unit includes a first electrode, and the first electrode is at least electrically connected to the first isolation sub-portion.

[0008] In some possible implementations, a distance between an edge of an orthographic projection of the second isolating sub-portion on the substrate and an edge of an orthographic projection of the first isolating sub-portion on the substrate is greater than or equal to 0.15 μm and less than or equal to 0.25 μm;

[0009] Preferably, the first isolating sub-portion is located on a side of the second isolating sub-portion close to the substrate.

[0010] In some possible implementations, along the thickness direction of the substrate, the thickness of the first isolating sub-portion is greater than or equal to and less than or equal to

[0011] Preferably, along the thickness direction of the substrate, the thickness of the second isolating sub-portion is greater than or equal to and less than or equal to

[0012] Preferably, along the thickness direction of the substrate, the thickness of the first spacer sub-portion is equal to the thickness of the second spacer sub-portion.

[0013] In some possible implementations, an orthographic projection of a side of the second isolating sub-portion away from the substrate on the substrate coincides with an orthographic projection of a side of the second isolating sub-portion close to the substrate on the substrate.

[0014] In some possible implementations, the isolation structure further includes a second isolation portion and a third isolation portion located on a side of the first isolation portion away from the substrate, and the second isolation portion is located between the first isolation portion and the third isolation portion;

[0015] Preferably, the orthographic projection of the side of the second isolation portion away from the substrate on the substrate is located within the orthographic projection of the third isolation portion on the substrate;

[0016] Preferably, the first electrode is also electrically connected to the second isolating sub-portion;

[0017] Preferably, the first electrode is also electrically connected to the second isolation portion;

[0018] Preferably, the material of the first isolation portion includes molybdenum; and / or the material of the second isolation portion includes aluminum; and / or the material of the third isolation portion includes titanium.

[0019] In some possible implementations, the following further includes:

[0020] A first encapsulation layer includes a plurality of encapsulation units arranged at intervals, wherein the encapsulation units extend at least from a side of the isolation structure toward the isolation opening to a side of the isolation structure away from the substrate;

[0021] Preferably, the packaging unit is spaced apart on a side of the isolation structure away from the substrate;

[0022] Preferably, a gap exists between the packaging unit located at a side of the isolation structure away from the substrate and a side of the isolation structure away from the substrate.

[0023] In some possible implementations, the following further includes:

[0024] a second packaging layer, located on a side of the first packaging layer away from the substrate;

[0025] a third packaging layer, located on a side of the second packaging layer away from the substrate;

[0026] Preferably, the materials of the first encapsulation layer and the third encapsulation layer both include inorganic materials;

[0027] Preferably, the material of the second encapsulation layer includes organic material.

[0028] In some possible implementations, the light-emitting unit further includes a second electrode and a light-emitting portion which are stacked and arranged on one side of the substrate in a direction away from the substrate, and the first electrode is located on a side of the light-emitting portion away from the substrate;

[0029] Preferably, it also includes:

[0030] A pixel defining layer, located between the isolation structure and the substrate, the pixel defining layer comprising a pixel opening, the pixel opening exposing a portion of the second electrode;

[0031] Preferably, the orthographic projection of the pixel opening on the substrate is located within the orthographic projection of the corresponding isolation opening on the substrate.

[0032] In some possible implementations, the present application provides another display panel, the display panel comprising:

[0033] substrate;

[0034] an isolation structure, located at one side of the substrate, the isolation structure encloses an isolation opening, the isolation structure comprises a first isolation portion, the first isolation portion comprises a third isolation sub-portion and a fourth isolation sub-portion surrounding at least a portion of the third isolation sub-portion, and along the thickness direction of the substrate, the thickness of the fourth isolation sub-portion is not equal to the thickness of the third isolation sub-portion;

[0035] A light emitting unit is at least partially located in the isolation opening, and the light emitting unit includes a first electrode, and the first electrode is electrically connected to at least the fourth isolation sub-portion.

[0036] In some possible implementations, a side of the fourth isolating sub-portion facing the substrate is coplanar with a side of the third isolating sub-portion facing the substrate;

[0037] Preferably, the fourth isolating sub-portion and the third isolating sub-portion are in contact with each other;

[0038] Preferably, a side of the fourth isolating sub-portion away from the substrate includes a plane;

[0039] Preferably, the orthographic projection of the fourth spacer sub-portion on the substrate surrounds the orthographic projection of the third spacer sub-portion on the substrate.

[0040] In some possible implementations, along the thickness direction of the substrate, the thickness of the fourth isolation sub-portion is less than the thickness of the third isolation sub-portion;

[0041] Preferably, along the thickness direction of the substrate, the thickness of the fourth isolating sub-portion is greater than or equal to and less than or equal to

[0042] Preferably, along the thickness direction of the substrate, the thickness of the third isolating sub-portion is greater than or equal to and less than or equal to

[0043] In some possible implementations, a distance between an outer edge of an orthographic projection of the fourth isolating sub-portion on the substrate and an outer edge of an orthographic projection of the third isolating sub-portion on the substrate is greater than or equal to 0.15 μm and less than or equal to 0.25 μm.

[0044] In some possible implementations, the isolation structure further includes a second isolation portion and a third isolation portion located on a side of the first isolation portion away from the substrate, and the second isolation portion is located between the first isolation portion and the third isolation portion;

[0045] Preferably, the orthographic projection of a side of the third isolating sub-portion away from the substrate on the substrate coincides with the orthographic projection of a side of the second isolating sub-portion close to the substrate on the substrate;

[0046] Preferably, the first electrode is also electrically connected to the second isolation portion.

[0047] In some possible implementations, the present application provides a method for preparing a display panel, the method comprising:

[0048] providing a substrate;

[0049] An isolation structure is formed on one side of the substrate, the isolation structure encloses an isolation opening, the isolation structure includes a first isolation portion, and along the thickness direction of the substrate, the first isolation portion includes a first isolation sub-portion and a second isolation sub-portion that are stacked, and an edge of an orthographic projection of a side of the first isolation sub-portion away from the substrate on the substrate is located outside the orthographic projection of the second isolation sub-portion on the substrate;

[0050] At least a portion of a light emitting unit is formed in the isolation opening, wherein the light emitting unit includes a first electrode, and the first electrode is electrically connected to at least the first isolation sub-portion.

[0051] In some possible implementations, the isolation structure further includes a second isolation portion and a third isolation portion located on a side of the first isolation portion away from the substrate, and the second isolation portion is located between the first isolation portion and the third isolation portion; and the step of forming the isolation structure on one side of the substrate includes:

[0052] forming a first spacer material layer on one side of the substrate;

[0053] Patterning the first isolation sub-material layer to obtain a plurality of first isolation sub-portions arranged at intervals;

[0054] A second spacer material layer, a second spacer material layer and a third spacer material layer are sequentially formed in a stacked manner on a side of the first spacer portion away from the substrate;

[0055] sequentially patterning the third isolation material layer, the second isolation material layer and the second isolation sub-material layer to form the isolation structure;

[0056] Preferably, along the thickness direction of the substrate, the thickness of the first spacer material layer is greater than or equal to and less than or equal to

[0057] In some possible implementations, the step of sequentially patterning the third isolation material layer, the second isolation material layer, and the second isolation sub-material layer to form the isolation structure includes:

[0058] forming a patterned first photoresist layer on a side of the third isolation material layer away from the substrate;

[0059] Removing the third isolation material layer and a portion of the second isolation material layer not covered by the first photoresist layer by dry etching to expose a portion of the second isolation sub-material layer on a side away from the substrate, wherein after the dry etching step, an orthographic projection of the first isolation sub-portion on the substrate is located within an orthographic projection of the second isolation material layer on the substrate;

[0060] Removing the second isolation sub-material layer not covered by the first photoresist layer, removing part of the second isolation material layer and the second isolation sub-material layer exposed by the second isolation material layer, and removing the first photoresist layer by wet etching to form an isolation structure;

[0061] Preferably, along the thickness direction of the substrate, the thickness of the second spacer material layer is greater than or equal to and less than or equal to

[0062] Preferably, along the thickness direction of the substrate, the thickness of the first spacer material layer is equal to the thickness of the second spacer material layer.

[0063] In some possible implementations, the isolation structure further includes a second isolation portion and a third isolation portion located on a side of the first isolation portion away from the substrate, and the second isolation portion is located between the first isolation portion and the third isolation portion; and the step of forming the isolation structure on one side of the substrate includes:

[0064] forming a first isolation material layer on one side of the substrate;

[0065] Patterning the first isolation material layer to form a plurality of grooves disposed at intervals and recessed toward the substrate on a side of the first isolation material layer away from the substrate;

[0066] Sequentially forming a second isolation material layer and a third isolation material layer stacked on one side of the first isolation material layer away from the substrate;

[0067] sequentially patterning the third isolation material layer, the second isolation material layer, and the first isolation material layer to form the isolation structure;

[0068] Preferably, along the thickness direction of the substrate, before patterning the first isolation material layer, the thickness of the first isolation material layer is greater than or equal to and less than or equal to

[0069] Preferably, along the thickness direction of the substrate, the thickness of the first isolation material layer located at the groove is greater than or equal to and less than or equal to

[0070] Preferably, along the thickness direction of the substrate, after the first isolation material layer is patterned, the thickness of the first isolation material layer located outside the groove is twice the thickness of the first isolation material layer located in the groove.

[0071] In some possible implementations, the step of sequentially patterning the third isolation material layer, the second isolation material layer, and the first isolation material layer to form the isolation structure includes:

[0072] forming a patterned second photoresist layer on a side of the third isolation material layer away from the substrate;

[0073] Removing the third isolation material layer and a portion of the second isolation material layer not covered by the second photoresist layer by dry etching to expose a portion of the first isolation material layer located at the groove and away from the substrate;

[0074] The first isolation material layer not covered by the second photoresist layer is removed by wet etching, and part of the second isolation material layer and part of the first isolation material layer exposed by the second isolation material layer are removed, and the second photoresist layer is removed to form an isolation structure.

[0075] In some possible implementations, the step of patterning the first isolation material layer to form a plurality of spaced grooves recessed toward the substrate on a side of the first isolation material layer away from the substrate includes:

[0076] forming a patterned third photoresist layer on a side of the first isolation material layer away from the substrate, wherein an orthographic projection of the third photoresist layer on the substrate coincides with an orthographic projection of the first isolation sub-portion on the substrate;

[0077] A portion of the first isolation material layer not covered by the third photoresist layer is removed to form a plurality of spaced grooves recessed toward the substrate on a side of the first isolation material layer away from the substrate, and the third photoresist layer is removed.

[0078] In some possible implementations, the present application further provides an electronic device, which includes the display panel described in the present application, or includes a display panel prepared by the method for preparing the display panel described in the present application.

[0079] Compared with the prior art, this application has the following beneficial effects:

[0080] The present application provides a display panel, a method for preparing a display panel, and an electronic device. By setting the first isolation portion to include a stacked first isolation sub-portion and a second isolation sub-portion, and the edge of the orthographic projection of the first isolation sub-portion on the substrate away from the substrate is located outside the orthographic projection of the second isolation sub-portion on the substrate, the overlapping effect of the first electrode and the isolation structure can be improved, thereby improving the display effect of the display panel. BRIEF DESCRIPTION OF THE DRAWINGS

[0081] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for use in the embodiments will be briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present application and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without paying creative work.

[0082] Figure 1 A schematic cross-sectional view of a display panel provided in an embodiment of the present application;

[0083] Figure 2The display panel provided in the embodiment of the present application includes a cross-sectional schematic diagram of a first encapsulation layer;

[0084] Figure 3a A cross-sectional schematic diagram of a display panel provided in an embodiment of the present application including a second encapsulation layer and a third encapsulation layer;

[0085] Figure 3b A schematic cross-sectional view of another display panel provided in an embodiment of the present application;

[0086] Figure 4 A schematic diagram of a process for preparing a display panel provided in an embodiment of the present application;

[0087] Figure 5 A cross-sectional schematic diagram of forming a first spacer material layer on one side of a substrate provided in an embodiment of the present application;

[0088] Figure 6 A schematic cross-sectional view of a plurality of first isolation sub-portions spaced apart from each other obtained by patterning the first isolation sub-material layer provided in an embodiment of the present application;

[0089] Figure 7 A cross-sectional schematic diagram of a second spacer material layer, a second spacer material layer, and a third spacer material layer stacked in sequence on a side of the first spacer portion away from the substrate provided in an embodiment of the present application;

[0090] Figure 8 A schematic cross-sectional view of a first photoresist layer patterned on a side of a third isolation material layer away from a substrate provided in an embodiment of the present application;

[0091] Fig. 9 A schematic cross-sectional view of the embodiment of the present application after removing the third isolation material layer and a portion of the second isolation material layer not covered by the first photoresist layer by dry etching;

[0092] Fig.10 A schematic cross-sectional view of a second spacer material layer not covered by the first photoresist layer after being removed by wet etching according to an embodiment of the present application;

[0093] Fig.11 A cross-sectional schematic diagram of forming a first isolation material layer on one side of a substrate provided in an embodiment of the present application;

[0094] Fig.12 A schematic cross-sectional view of a third photoresist layer patterned on a side of a first isolation material layer away from a substrate provided in an embodiment of the present application;

[0095] Fig.13 A schematic cross-sectional view of a first isolation material layer after a portion not covered by a third photoresist layer is removed according to an embodiment of the present application;

[0096] Fig.14 A cross-sectional view of a second isolation material layer and a third isolation material layer stacked in sequence on one side of a first isolation material layer provided in an embodiment of the present application;

[0097] Fig.15 A cross-sectional view of a second photoresist layer patterned on a side of a third isolation material layer away from a substrate provided in an embodiment of the present application;

[0098] Fig.16 The embodiment of the present application provides a cross-sectional view after removing the third isolation material layer and a portion of the second isolation material layer not covered by the second photoresist layer by dry etching.

[0099] Figure numerals: 1, substrate; 2, pixel defining layer; 21, pixel opening; 3, isolation structure; 31, first isolation part; 311, first isolation sub-part; 312, second isolation sub-part; 313, third isolation sub-part; 314, fourth isolation sub-part; 32, second isolation part; 33, third isolation part; 4, second electrode; 5, light-emitting part; 6, first electrode; 7, light-emitting unit; 8, isolation opening; 9, first encapsulation layer; 91, encapsulation unit; 10, second encapsulation layer; 11, third encapsulation layer; 12, pixel defining material layer; 13, first isolation sub-material layer; 14, second isolation sub-material layer; 15, second isolation material layer; 16, third isolation material layer; 17, first photoresist layer; 18, first isolation material layer; 181, groove; 19, third photoresist layer; 20, second photoresist layer. DETAILED DESCRIPTION

[0100] In order to make the purpose, technical solution and advantages of the embodiments of the present application clearer, the technical solution in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, rather than all the embodiments. The components of the embodiments of the present application described and shown in the drawings here can be arranged and designed in various different configurations.

[0101] Therefore, the following detailed description of the embodiments of the present application provided in the accompanying drawings is not intended to limit the scope of the present application for which protection is sought, but merely represents selected embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in the field without creative work are within the scope of protection of the present application.

[0102] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, further definition and explanation thereof is not required in subsequent drawings.

[0103] In the description of the present application, it should be noted that the terms "center", "upper", "lower", "vertical", "horizontal", "inner", "outer", etc. indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, or the positions or positional relationships in which the inventive product is usually placed when in use. They are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific position, be constructed and operated in a specific position, and therefore cannot be understood as a limitation on the present application. In addition, the terms "first", "second", "third", etc. are only used to distinguish the description, and cannot be understood as indicating or implying relative importance.

[0104] It should be noted that, in the absence of conflict, different features in the embodiments of the present application may be combined with each other.

[0105] Improving the density of the light-emitting units in the display panel (i.e., pixel density) is an important way to improve the display effect. However, the display panels currently made using the fine metal mask (FMM) technology cannot further increase the density of the light-emitting units due to technical limitations. The inventors have found through long-term research that in order to solve the technical problem that the density of the light-emitting units cannot be further improved, an isolation structure is set in some display panels. When the light-emitting functional layer and the electrode are evaporated in the entire layer, the light-emitting functional layer and the electrode can be disconnected at the isolation structure. Through multiple evaporation and multiple etching processes (i.e., light-emitting unit patterning), light-emitting units of different colors can be formed in different isolation openings. The display panel in the related art includes a substrate, an isolation structure located on one side of the substrate, and a light-emitting unit located in an isolation opening formed by the isolation structure. The cathode of the light-emitting unit overlaps with the isolation structure to transmit the cathode signal through the isolation structure. However, the overlap effect of the cathode of the display panel and the isolation structure in the related art is not good.

[0106] Among them, patents CN118251982A, 202410864269.8, PCT / CN2024 / 098407, PCT / CN2024 / 102783, PCT / CN2024 / 098217, PCT / CN2024 / 099419, PCT / CN2024 / 099072, CN117979755A, CN1179 98900A, CN117062489A, CN117580403A, CN116583155A, CN116669477A, ​​CN117396039A, CN116669480A, CN116600606A, and CN117500332A record relevant technical solutions of isolation structures, and their contents are incorporated into this application by reference for reference.

[0107] In order to solve the above-mentioned technical problems, the inventor innovatively designed the following technical solutions, and the specific implementation solutions of the present application will be described in detail below in conjunction with the accompanying drawings. It should be noted that the defects existing in the solutions in the above-mentioned prior art are the results obtained by the inventor after practice and careful research. Therefore, the discovery process of the above-mentioned technical problems and the solutions proposed in this embodiment below for the above-mentioned problems should all be the contributions made by the inventor to the present application in the process of invention and creation, and should not be understood as the technical content known to those skilled in the art.

[0108] See also Figure 1 This embodiment provides a display panel, which includes a substrate 1, an isolation structure 3 and a light-emitting unit 7.

[0109] The substrate 1 may include a substrate and a plurality of drive units located on one side of the substrate, and each drive unit may include one or more semiconductor switch devices. The semiconductor switch device may be formed by the cooperation of a plurality of film layers in the substrate 1, for example, the semiconductor switch device may be a thin film transistor formed by the cooperation of a plurality of film layers.

[0110] The isolation structure 3 is located on one side of the substrate 1. The isolation structure 3 encloses an isolation opening 8. The isolation structure 3 includes a first isolation portion 31. Along the thickness direction Z of the substrate 1, the first isolation portion 31 includes a first isolation sub-portion 311 and a second isolation sub-portion 312 that are stacked. The edge of the orthographic projection of the first isolation sub-portion 311 on the side away from the substrate 1 on the substrate 1 is located outside the orthographic projection of the second isolation sub-portion 312 on the substrate 1.

[0111] At least part of the light emitting unit 7 is located in the isolation opening 8 . The light emitting unit 7 includes a first electrode 6 . The first electrode 6 is electrically connected to at least the first isolation sub-portion 311 .

[0112] In the related art, the distance that the first isolation portion 31 extends relative to the second isolation portion 32 is too short, so that the overlapping length between the first electrode 6 and the first isolation portion 31 is relatively short, and the first electrode 6 cannot even overlap with the first isolation portion 31, ultimately causing the light-emitting unit 7 of the display panel to fail and forming abnormal conditions such as dark spots.

[0113] In this embodiment, the first isolation portion 31 is configured to include a stacked first isolation sub-portion 311 and a second isolation sub-portion 312, that is, the first isolation sub-portion 311 is located on a side of the second isolation sub-portion 312 close to the substrate 1, and the first isolation sub-portion 311 extends relative to the second isolation sub-portion 312, thereby improving the overlapping effect between the first electrode 6 and the first isolation sub-portion 311, making it less likely for the light-emitting unit 7 to fail, thereby improving the display effect of the display panel.

[0114] Based on the above design, in this embodiment, by setting the first isolation portion 31 to include a stacked first isolation sub-portion 311 and a second isolation sub-portion 312, and the edge of the orthographic projection of the first isolation sub-portion 311 on the side away from the substrate 1 on the substrate 1 is located outside the orthographic projection of the second isolation sub-portion 312 on the substrate 1, the overlapping effect between the first isolation sub-portion 311 and the isolation structure 3 can be improved, thereby improving the display effect of the display panel.

[0115] For some possible implementations, see again Figure 1 The isolation structure 3 further includes a second isolation portion 32 and a third isolation portion 33 located on a side of the first isolation portion 31 away from the substrate 1 , and the second isolation portion 32 is located between the first isolation portion 31 and the third isolation portion 33 .

[0116] For some possible implementations, see again Figure 1 The light-emitting unit 7 also includes a second electrode 4 and a light-emitting portion 5 which are stacked on one side of the substrate 1 in a direction away from the substrate 1. The first electrode 6 is located on a side of the light-emitting portion 5 away from the substrate 1. The display panel also includes a pixel defining layer 2, which is located between the isolation structure 3 and the substrate 1. The pixel defining layer 2 includes a pixel opening 21, which exposes a portion of the second electrode 4. The orthographic projection of the pixel opening 21 on the substrate 1 is located within the orthographic projection of the corresponding isolation opening 8 on the substrate 1.

[0117] The setting of the isolation structure 3 enables the display panel to form film layers of light-emitting units 7 of different colors in different isolation openings 8 without the need for a fine mask plate. When forming a light-emitting material layer, the light-emitting material layer will be separated by the isolation structure 3 to form a plurality of light-emitting portions 5 arranged at intervals. When forming a first electrode material layer, the first electrode material layer will be separated by the isolation structure 3 to form a plurality of first electrodes 6 arranged at intervals. The isolation structure 3 includes a conductive material. The first electrode 6 is electrically connected to the isolation structure 3. One first electrode 6, one light-emitting portion 5 and one second electrode 4 form one light-emitting unit 7. Among them, the first electrode 6 can be a cathode, and the second electrode 4 can be an anode.

[0118] In this way, different light-emitting units 7 can be made independent of each other, thereby improving the crosstalk between adjacent light-emitting units 7 and improving the display effect of the display panel. At the same time, due to the presence of the isolation structure 3, the light-emitting material layer and the first electrode material layer in the light-emitting unit 7 of each color in the display panel can be first prepared on the entire surface and then patterned, thereby eliminating the need for a fine mask plate, thereby saving the manufacturing cost of the display panel.

[0119] For some possible implementations, see again Figure 1The distance W between the edge of the orthographic projection of the second isolating sub-portion 312 on the substrate 1 and the edge of the orthographic projection of the first isolating sub-portion 311 on the substrate 1 is greater than or equal to 0.15μm and less than or equal to 0.25μm. For example, the distance W can be 0.15μm, 0.17μm, 0.2μm, 0.22μm, 0.24μm or 0.25μm, etc. The distance W is reasonably set, that is, the length of the first isolating sub-portion 311 extending relative to the second isolating sub-portion 312 is reasonably set, so as to ensure the overlapping length of the first electrode 6 and the first isolating sub-portion 311, and further improve the overlapping effect of the first electrode 6 and the isolation structure 3.

[0120] For some possible implementations, see again Figure 1 , along the thickness direction Z of the substrate 1, the thickness H1 of the first isolating sub-portion 311 is greater than or equal to and less than or equal to For example, the thickness H1 can be or If the thickness H1 is set too large, the thickness of the display panel will increase. If the thickness H1 is set too small, the overlap effect between the first electrode 6 and the isolation structure 3 may be affected. Therefore, by reasonably setting the thickness H1, the overlap effect between the first electrode 6 and the isolation structure 3 can be improved without increasing the thickness of the display panel too much.

[0121] Preferably, see again Figure 1 , along the thickness direction Z of the substrate 1, the thickness H2 of the second isolating sub-portion 312 is greater than or equal to and less than or equal to For example, the thickness H2 can be or If the thickness H2 is set too large, the thickness of the display panel will increase. If the thickness H2 is set too small, the overlap resistance between the first electrode 6 and the isolation structure 3 will increase. Therefore, by reasonably setting the thickness H2, the overlap resistance between the first electrode 6 and the isolation structure 3 can be reduced without increasing the thickness of the display panel too much.

[0122] Preferably, see again Figure 1 , along the thickness direction Z of the substrate 1 , the thickness H1 of the first isolating sub-portion 311 is equal to the thickness H2 of the second isolating sub-portion 312 . In this way, the overlapping effect between the first electrode 6 and the isolation structure 3 can be further improved.

[0123] For some possible implementations, see again Figure 1, the orthographic projection of the side of the second isolating sub-portion 312 away from the substrate 1 on the substrate 1 coincides with the orthographic projection of the side of the second isolating sub-portion 32 close to the substrate 1 on the substrate 1. In this way, the first isolating sub-portion 311 can be extended more easily relative to the second isolating sub-portion 312, so that the first electrode 6 can be overlapped with the first isolating sub-portion 311 more easily.

[0124] For some possible implementations, see again Figure 1 , the orthographic projection of the side of the second isolation portion 32 away from the substrate 1 on the substrate 1 is located within the orthographic projection of the third isolation portion 33 on the substrate 1 .

[0125] Since the third isolation portion 33 is located on the side of the second isolation portion 32 away from the substrate 1, and the lateral width of the third isolation portion 33 is greater than the lateral width of the second isolation portion 32 in the plane parallel to the substrate 1, the third isolation portion 33 disconnects the light-emitting material layer and the first electrode material layer at the isolation structure 3. In this way, the isolation structure 3 formed by the first isolation portion 31, the second isolation portion 32 and the third isolation portion 33 can make it easier to independently package each light-emitting unit 7, thereby improving the packaging yield of the display panel.

[0126] Preferably, the first electrode 6 is also electrically connected to the second isolation sub-portion 312. In this way, the overlapping effect between the first electrode 6 and the isolation structure 32 can be further improved.

[0127] Optionally, the first electrode 6 is also electrically connected to the second isolation portion 32. In this way, the overlapping effect between the first electrode 6 and the isolation structure 32 can be further improved.

[0128] Optionally, the material of the first isolation portion 31 includes molybdenum; and / or, the material of the second isolation portion 32 includes aluminum; and / or, the material of the third isolation portion 33 includes titanium.

[0129] Optionally, the orthographic projection of the light emitting portion 5 on the substrate 1 is outside the orthographic projection of the first isolating sub-portion 311 on the substrate 1. In this way, the light emitting portion 5 does not overlap with the isolating structure 3, thereby effectively improving the crosstalk problem between the light emitting units 7.

[0130] For some possible implementations, see Figure 2 The display panel further includes a first encapsulation layer 9 , which includes a plurality of encapsulation units 91 arranged at intervals, and the encapsulation units 91 extend at least from the side of the isolation structure 3 toward the isolation opening 8 to the side of the isolation structure 3 away from the substrate 1 .

[0131] Optionally, the packaging units 91 are arranged at intervals on a side of the isolation structure 3 away from the substrate 1 .

[0132] Optionally, a gap exists between the packaging unit 91 located on the side of the isolation structure 3 away from the substrate 1 and the side of the isolation structure 3 away from the substrate 1 .

[0133] During the patterning process of the light-emitting unit 7 , the first packaging material layer is disconnected at the isolation structure 3 to form a packaging unit 91 . The packaging unit 91 can completely and independently package the corresponding light-emitting unit 7 , thereby improving the display characteristics of the display panel.

[0134] For some possible implementations, see Figure 3a The display panel further includes a second encapsulation layer 10 and a third encapsulation layer 11. The second encapsulation layer 10 is located on a side of the first encapsulation layer 9 away from the substrate, and the third encapsulation layer 11 is located on a side of the second encapsulation layer 10 away from the substrate.

[0135] Optionally, the materials of the first encapsulation layer 9 and the third encapsulation layer 11 both include inorganic materials, and the material of the second encapsulation layer 10 includes organic materials.

[0136] For example, the first encapsulation layer 9 and the third encapsulation layer 11 can be formed by chemical vapor deposition (CVD), and the second encapsulation layer 10 can be formed by inkjet printing (IJP). The second encapsulation layer 10 and the third encapsulation layer 11 can provide a better encapsulation effect on the light-emitting unit 7, thereby further improving the encapsulation quality of the display panel.

[0137] For some possible implementations, see Figure 3b The present application provides another display panel, which includes a substrate 1, an isolation structure 3 and a light-emitting unit 7.

[0138] The isolation structure 3 is located on one side of the substrate 1. The isolation structure 3 encloses an isolation opening 8. The isolation structure 3 includes a first isolation portion 31. The first isolation portion 31 includes a third isolation sub-portion 313 and a fourth isolation sub-portion 314 surrounding at least part of the third isolation sub-portion 313. Along the thickness direction Z of the substrate 1, the thickness H4 of the fourth isolation sub-portion 314 is not equal to the thickness H3 of the third isolation sub-portion.

[0139] At least a portion of the light emitting unit 7 is located in the isolation opening 8 . The light emitting unit 7 includes a first electrode 6 . The first electrode 6 is electrically connected to at least the fourth isolation sub-portion 314 .

[0140] In the related art, the overlap length between the first electrode 6 and the first isolation portion 31 is relatively short, and the first electrode 6 may even fail to overlap the first isolation portion 31 , which eventually causes the light-emitting unit 7 of the display panel to fail and forms abnormal conditions such as dark spots.

[0141] In this embodiment, the first isolation portion 31 is configured to include a third isolation sub-portion 313 and a fourth isolation sub-portion 314 surrounding at least part of the third isolation sub-portion 313, and the thickness H4 of the fourth isolation sub-portion 314 is not equal to the thickness H3 of the third isolation sub-portion, thereby improving the overlapping effect between the first electrode 6 and the fourth isolation sub-portion 314, and further improving the overlapping effect between the first electrode 6 and the first isolation portion 31, so that the light-emitting unit 7 is not easy to fail, and further improving the display effect of the display panel.

[0142] For some possible implementations, see again Figure 3b The isolation structure 3 further includes a second isolation portion 32 and a third isolation portion 33 located on a side of the first isolation portion 31 away from the substrate 1 , and the second isolation portion 32 is located between the first isolation portion 31 and the third isolation portion 33 .

[0143] For some possible implementations, see again Figure 3b The side of the fourth isolating sub-portion 314 facing the substrate 1 is coplanar with the side of the third isolating sub-portion 313 facing the substrate 1 .

[0144] Optionally, the fourth isolating sub-portion 314 and the third isolating sub-portion 313 are in contact with each other.

[0145] Optionally, a side of the fourth spacer portion 314 away from the substrate 1 includes a plane.

[0146] Optionally, the orthographic projection of the fourth spacer sub-portion 314 on the substrate 1 surrounds the orthographic projection of the third spacer sub-portion 313 on the substrate 1 .

[0147] Optionally, an orthographic projection of a side of the third isolating portion 313 away from the substrate 1 on the substrate 1 coincides with an orthographic projection of a side of the second isolating portion 32 close to the substrate 1 on the substrate 1 .

[0148] Optionally, the fourth isolating sub-portion 314 and the third isolating sub-portion 313 are integrally formed, and a distance from the side of the fourth isolating sub-portion 314 away from the substrate 1 to the substrate 1 is smaller than a distance from the side of the third isolating sub-portion 313 away from the substrate 1 to the substrate 1, that is, the fourth isolating sub-portion 314 extends in the direction of the isolation opening 8 relative to the third isolating sub-portion 313, thereby making it easier for the first electrode 6 to overlap with the fourth isolating sub-portion 314.

[0149] For some possible implementations, see again Figure 3b , along the thickness direction Z of the substrate, the thickness H4 of the fourth isolation sub-portion 314 is less than the thickness H3 of the third isolation sub-portion 313 .

[0150] Optionally, along the thickness direction Z of the substrate, the thickness H4 of the fourth spacer portion 314 is greater than or equal to and less than or equal to For example, the thickness H4 can be or wait.

[0151] Optionally, along the thickness direction Z of the substrate 1, the thickness H3 of the third spacer portion is greater than or equal to and less than or equal to For example, the thickness H3 can be or wait.

[0152] By properly setting the thickness H4 and the thickness H3, the overlapping effect between the first electrode 6 and the isolation structure 3 can be further improved without increasing the thickness of the display panel too much.

[0153] For some possible implementations, see again Figure 3b , a minimum distance W1 between an outer edge of an orthographic projection of the fourth isolating sub-portion 314 on the substrate 1 and an outer edge of an orthographic projection of the third isolating sub-portion 313 on the substrate 1 is greater than or equal to 0.15 μm and less than or equal to 0.25 μm.

[0154] For example, the distance W1 can be 0.15μm, 0.17μm, 0.2μm, 0.22μm, 0.24μm or 0.25μm, etc. The distance W1 can be reasonably set, that is, the length of the fourth isolating sub-portion 314 extending relative to the third isolating sub-portion 313 can be reasonably set, so as to ensure the overlapping length of the first electrode 6 and the fourth isolating sub-portion 314, and further improve the overlapping effect of the first electrode 6 and the isolation structure 3.

[0155] Preferably, the first electrode 6 is also electrically connected to the second isolation portion 32. In this way, the overlapping effect between the first electrode 6 and the isolation structure 3 can be further improved.

[0156] For some possible implementations, see Figure 4 The present application provides a method for preparing a display panel, the method comprising:

[0157] S10: providing a substrate 1.

[0158] S11: An isolation structure 3 is formed on one side of the substrate 1, and the isolation structure 3 encloses an isolation opening 8. The isolation structure 3 includes a first isolation portion 31. Along the thickness direction of the substrate 1, the first isolation portion 31 includes a first isolation sub-portion 311 and a second isolation sub-portion 312 that are stacked. The edge of the orthographic projection of the first isolation sub-portion 311 on a side away from the substrate 1 is located outside the orthographic projection of the second isolation sub-portion 312 on the substrate 1.

[0159] S12 : forming at least a portion of the light emitting unit 7 in the isolation opening 8 , wherein the light emitting unit 7 includes a first electrode 6 , and the first electrode 6 is electrically connected to at least the first isolation sub-portion 311 .

[0160] In the display panel formed by the above method, the first isolation portion 31 is set to include a stacked first isolation sub-portion 311 and a second isolation sub-portion 312, and the first isolation sub-portion 311 extends relative to the second isolation sub-portion 312, thereby improving the overlapping effect between the first electrode 6 and the first isolation sub-portion 311, making it less likely for the light-emitting unit 7 to fail, thereby improving the display effect of the display panel.

[0161] Two specific embodiments of forming the isolation structure 3 in the present application are introduced below.

[0162] In some possible implementations, the isolation structure 3 further includes a second isolation portion 32 and a third isolation portion 33 located on a side of the first isolation portion 31 away from the substrate 1 , and the second isolation portion 32 is located between the first isolation portion 31 and the third isolation portion 33 .

[0163] In some possible implementations, the step of forming the isolation structure 3 on one side of the substrate 1 includes:

[0164] See also Figure 5 , a first spacer material layer 13 is formed on one side of the substrate 1 .

[0165] First, a pixel defining material layer 12 is formed on one side of the substrate 1 , and then a first spacer material layer 13 is formed on a side of the pixel defining material layer 12 away from the substrate 1 .

[0166] Preferably, along the thickness direction Z of the substrate 1, the thickness D1 of the first spacer material layer 13 is greater than or equal to and less than or equal to For example, the thickness D1 can be or wait.

[0167] See also Figure 6 , patterning the first isolation sub-material layer 13 to obtain a plurality of first isolation sub-portions 311 that are spaced apart.

[0168] See also Figure 7 A second spacer material layer 14 , a second spacer material layer 15 and a third spacer material layer 16 are sequentially stacked on one side of the first spacer portion 311 away from the substrate 1 .

[0169] Preferably, along the thickness direction Z of the substrate 1, the thickness D2 of the second spacer material layer 14 is greater than or equal to and less than or equal to For example, the thickness D2 can be or wait.

[0170] The third isolation material layer 16 , the second isolation material layer 15 and the second isolation sub-material layer 14 are patterned in sequence to form an isolation structure 3 .

[0171] Specifically, see Figure 8 , a patterned first photoresist layer 17 is formed on a side of the third isolation material layer 16 away from the substrate 1 .

[0172] See also Fig. 9 By dry etching, the third isolation material layer 16 and part of the second isolation material layer 15 not covered by the first photoresist layer 17 are removed to expose part of the second isolation sub-material layer 14 away from the side of the substrate 1. After the dry etching step, the orthographic projection of the first isolation sub-portion 311 on the substrate 1 is located within the orthographic projection of the second isolation material layer 15 on the substrate 1.

[0173] See also Fig.10 , by wet etching, the second isolation sub-material layer 14 not covered by the first photoresist layer 17 is removed, and at the same time, part of the second isolation material layer 15 and the second isolation sub-material layer 14 exposed by the second isolation material layer 15 are removed, and the first photoresist layer 17 is removed to form an isolation structure 3.

[0174] The second isolation sub-material layer 14 covers the first isolation sub-portion 311. After dry etching of the third isolation material layer 16 and part of the second isolation material layer 15, part of the second isolation sub-material layer 14 will be exposed. During the wet etching of the second isolation sub-material layer 14, the side wall of the second isolation material layer 15 will also be gradually etched. After the second isolation material layer 15 is further etched, part of the second isolation sub-material layer 14 located on the side of the first isolation sub-portion 311 away from the substrate 1 will be exposed, and the exposed second isolation sub-material layer 14 will also be etched away together.

[0175] After the second isolation sub-portion 14 on the side of the first isolation sub-portion 311 away from the substrate 1 is etched, the first isolation sub-portion 311 will be exposed. Since the exposed first isolation sub-portion 311 will not be completely removed during the wet etching of the first isolation sub-portion 13, in the finally formed isolation structure 3, the first isolation sub-portion 311 will extend relative to the second isolation sub-portion 312. In the process of forming the light-emitting unit 7, the overlap effect between the first electrode 6 of the light-emitting unit 7 and the first isolation sub-portion 311 is better.

[0176] Preferably, along the thickness direction Z of the substrate 1, the thickness D1 of the first spacer material layer 13 is equal to the thickness D2 of the second spacer material layer 14. In this way, after removing the second spacer material layer 14 not covered by the first photoresist layer 17, the first spacer portion 311 is just exposed, and the exposed first spacer portion 311 will not be etched.

[0177] In some other possible implementations, the step of forming the isolation structure 3 on one side of the substrate 1 includes:

[0178] See also Fig.11 , a first isolation material layer 18 is formed on one side of the substrate 1 .

[0179] Preferably, along the thickness direction Z of the substrate 1, before patterning the first isolation material layer 18, the thickness D3 of the first isolation material layer 18 is greater than or equal to and less than or equal to For example, the thickness D3 can be or wait.

[0180] The first isolation material layer 18 is patterned to form a plurality of grooves 181 spaced apart from each other and recessed toward the substrate 1 on a side of the first isolation material layer 18 away from the substrate 1 .

[0181] Specifically, see Fig.12 A patterned third photoresist layer 19 is formed on a side of the first isolation material layer 18 away from the substrate 1 , and the orthographic projection of the third photoresist layer 19 on the substrate 1 coincides with the orthographic projection of the first isolation sub-portion 311 on the substrate 1 .

[0182] See also Fig.13 , remove the portion of the first isolation material layer 18 not covered by the third photoresist layer 19 to form a plurality of spaced grooves 181 recessed toward the substrate 1 on the side of the first isolation material layer 18 away from the substrate 1, and remove the third photoresist layer 19.

[0183] Preferably, along the thickness direction Z of the substrate 1, the thickness D4 of the first isolation material layer 18 located at the groove 181 is greater than or equal to and less than or equal to For example, the thickness D4 can be or wait.

[0184] See also Fig.14 A second isolation material layer 15 and a third isolation material layer 16 are stacked and formed in sequence on one side of the first isolation material layer 18 .

[0185] The third isolation material layer 16 , the second isolation material layer 15 and the first isolation material layer 18 are patterned in sequence to form an isolation structure 3 .

[0186] Specifically, see Fig.15 A patterned second photoresist layer 20 is formed on a side of the third isolation material layer 16 away from the substrate 1 .

[0187] See also Fig.16 The third isolation material layer 16 and a portion of the second isolation material layer 15 not covered by the second photoresist layer 20 are removed by dry etching to expose a portion of the first isolation material layer 18 located at the groove 181 away from the substrate 1 .

[0188] Please see again Fig.10 , by wet etching, the first isolation material layer 18 not covered by the second photoresist layer 20 is removed, and at the same time, part of the second isolation material layer 15 and part of the first isolation material layer 18 exposed by the second isolation material layer 15 are removed, and the second photoresist layer 20 is removed to form an isolation structure 3.

[0189] After dry etching of the third isolation material layer 16 and part of the second isolation material layer 15, part of the first isolation material layer 18 located in the groove 181 will be exposed. During the wet etching of the first isolation material layer 18 located in the groove 181, the side wall of the second isolation material layer 15 will also be gradually etched. After the second isolation material layer 15 is further etched, part of the first isolation material layer 18 will be further exposed, and part of the exposed first isolation material layer 18 will also be etched away.

[0190] Since the thickness of the first isolation material layer 18 at the groove 181 is less than the thickness of the first isolation material layer 18 at the rest of the groove 181, after etching away the first isolation material layer 18 at the groove 181, the exposed first isolation material layer 18 will not be completely removed, and the exposed portion of the first isolation sub-material layer 13 that is not completely etched away forms the first isolation sub-portion 311. Therefore, in the isolation structure 3 finally formed, the first isolation sub-portion 311 will extend relative to the second isolation sub-portion 312, and in the process of forming the light-emitting unit 7, the first electrode 6 of the light-emitting unit 7 and the first isolation sub-portion 311 will have a better overlap effect.

[0191] Preferably, along the thickness direction Z of the substrate 1, after the first isolation material layer 18 is patterned, the thickness D3 of the first isolation material layer 18 at the non-groove 181 is twice the thickness D4 of the first isolation material layer 18 at the groove 181. In this way, the thickness D4 of the first isolation material layer 18 at the groove 181 is exactly equal to the thickness of the first isolation sub-portion 311, and after the first isolation material layer 18 at the groove 181 is removed, the first isolation sub-portion 311 is just formed.

[0192] In some possible implementations, the present application further provides an electronic device, the electronic device comprising the display panel of the present application, or comprising a display panel prepared by the method for preparing a display panel of the present application. The electronic device may include a device with image processing capabilities, such as a server, a personal computer, a laptop computer, etc. Since the electronic device comprises the display panel of the present application, the display effect of the electronic device is better.

[0193] The technical features of the above embodiments may be combined arbitrarily. To make the description concise, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0194] The above-mentioned embodiments only express several implementation methods of the present invention, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the invention patent. It should be pointed out that, for ordinary technicians in this field, several variations and improvements can be made without departing from the concept of the present invention, and these all belong to the protection scope of the present invention. Therefore, the protection scope of the patent of the present invention shall be subject to the attached claims.

Claims

1. A display panel, characterized in that: The display panel comprises: substrate; an isolation structure, located on one side of the substrate, the isolation structure encloses an isolation opening, the isolation structure comprises a first isolation portion, and along the thickness direction of the substrate, the first isolation portion comprises a first isolation sub-portion and a second isolation sub-portion which are stacked, and an edge of an orthographic projection of a side of the first isolation sub-portion away from the substrate on the substrate is located outside the orthographic projection of the second isolation sub-portion on the substrate; A light emitting unit is at least partially located in the isolation opening, and the light emitting unit includes a first electrode, and the first electrode is at least electrically connected to the first isolation sub-portion.

2. The display panel according to claim 1, characterized in that: A distance between an edge of an orthographic projection of the second isolating sub-portion on the substrate and an edge of an orthographic projection of the first isolating sub-portion on the substrate is greater than or equal to 0.15 μm and less than or equal to 0.25 μm; Preferably, the first isolating sub-portion is located on a side of the second isolating sub-portion close to the substrate.

3. The display panel according to claim 1, characterized in that: Along the thickness direction of the substrate, the thickness of the first isolating sub-portion is greater than or equal to and less than or equal to Preferably, along the thickness direction of the substrate, the thickness of the second isolating sub-portion is greater than or equal to and less than or equal to Preferably, along the thickness direction of the substrate, the thickness of the first spacer sub-portion is equal to the thickness of the second spacer sub-portion.

4. The display panel according to claim 1, characterized in that: The orthographic projection of a side of the second isolating portion away from the substrate on the substrate coincides with the orthographic projection of a side of the second isolating portion close to the substrate on the substrate.

5. The display panel according to claim 1, characterized in that: The isolation structure further includes a second isolation portion and a third isolation portion located at a side of the first isolation portion away from the substrate, wherein the second isolation portion is located between the first isolation portion and the third isolation portion; Preferably, the orthographic projection of the side of the second isolation portion away from the substrate on the substrate is located within the orthographic projection of the third isolation portion on the substrate; Preferably, the first electrode is also electrically connected to the second isolating sub-portion; Preferably, the first electrode is also electrically connected to the second isolation portion; Preferably, the material of the first isolation portion includes molybdenum; and / or the material of the second isolation portion includes aluminum; and / or the material of the third isolation portion includes titanium.

6. The display panel according to any one of claims 1 to 5, characterized in that: Also includes: A first encapsulation layer includes a plurality of encapsulation units arranged at intervals, wherein the encapsulation units extend at least from a side of the isolation structure toward the isolation opening to a side of the isolation structure away from the substrate; Preferably, the packaging unit is spaced apart on a side of the isolation structure away from the substrate; Preferably, a gap exists between the packaging unit located at a side of the isolation structure away from the substrate and a side of the isolation structure away from the substrate.

7. The display panel according to claim 6, characterized in that: Also includes: a second packaging layer, located on a side of the first packaging layer away from the substrate; a third packaging layer, located on a side of the second packaging layer away from the substrate; Preferably, the materials of the first encapsulation layer and the third encapsulation layer both include inorganic materials; Preferably, the material of the second encapsulation layer includes organic material.

8. The display panel according to any one of claims 1 to 5, characterized in that: The light-emitting unit further comprises a second electrode and a light-emitting portion which are stacked and arranged in a direction away from the substrate and located on one side of the substrate, wherein the first electrode is located on a side of the light-emitting portion away from the substrate; Preferably, it also includes: A pixel defining layer, located between the isolation structure and the substrate, the pixel defining layer comprising a pixel opening, the pixel opening exposing a portion of the second electrode; Preferably, the orthographic projection of the pixel opening on the substrate is located within the orthographic projection of the corresponding isolation opening on the substrate.

9. A display panel, characterized in that: The display panel comprises: substrate; an isolation structure, located at one side of the substrate, the isolation structure encloses an isolation opening, the isolation structure comprises a first isolation portion, the first isolation portion comprises a third isolation sub-portion and a fourth isolation sub-portion surrounding at least a portion of the third isolation sub-portion, and along the thickness direction of the substrate, the thickness of the fourth isolation sub-portion is not equal to the thickness of the third isolation sub-portion; A light emitting unit is at least partially located in the isolation opening, and the light emitting unit includes a first electrode, and the first electrode is electrically connected to at least the fourth isolation sub-portion.

10. The display panel according to claim 9, characterized in that: A side of the fourth isolating sub-portion facing the substrate is coplanar with a side of the third isolating sub-portion facing the substrate; Preferably, the fourth isolating sub-portion and the third isolating sub-portion are in contact with each other; Preferably, a side of the fourth isolating sub-portion away from the substrate includes a plane; Preferably, the orthographic projection of the fourth spacer sub-portion on the substrate surrounds the orthographic projection of the third spacer sub-portion on the substrate.

11. The display panel according to claim 9, characterized in that: Along the thickness direction of the substrate, the thickness of the fourth isolating sub-portion is smaller than the thickness of the third isolating sub-portion; Preferably, along the thickness direction of the substrate, the thickness of the fourth isolating sub-portion is greater than or equal to and less than or equal to Preferably, along the thickness direction of the substrate, the thickness of the third isolating sub-portion is greater than or equal to and less than or equal to 12. The display panel according to claim 9, characterized in that: A distance between an outer edge of an orthographic projection of the fourth spacer sub-portion on the substrate and an outer edge of an orthographic projection of the third spacer sub-portion on the substrate is greater than or equal to 0.15 μm and less than or equal to 0.25 μm.

13. The display panel according to claim 9, characterized in that: The isolation structure further includes a second isolation portion and a third isolation portion located at a side of the first isolation portion away from the substrate, wherein the second isolation portion is located between the first isolation portion and the third isolation portion; Preferably, the orthographic projection of a side of the third isolating sub-portion away from the substrate on the substrate coincides with the orthographic projection of a side of the second isolating sub-portion close to the substrate on the substrate; Preferably, the first electrode is also electrically connected to the second isolation portion.

14. A method for preparing a display panel, characterized in that: The method comprises: providing a substrate; An isolation structure is formed on one side of the substrate, the isolation structure encloses an isolation opening, the isolation structure includes a first isolation portion, and along the thickness direction of the substrate, the first isolation portion includes a first isolation sub-portion and a second isolation sub-portion that are stacked, and an edge of an orthographic projection of a side of the first isolation sub-portion away from the substrate on the substrate is located outside the orthographic projection of the second isolation sub-portion on the substrate; At least a portion of a light emitting unit is formed in the isolation opening, wherein the light emitting unit includes a first electrode, and the first electrode is electrically connected to at least the first isolation sub-portion.

15. The method for preparing a display panel according to claim 14, characterized in that: The isolation structure further includes a second isolation portion and a third isolation portion located on a side of the first isolation portion away from the substrate, and the second isolation portion is located between the first isolation portion and the third isolation portion; the step of forming the isolation structure on one side of the substrate includes: forming a first spacer material layer on one side of the substrate; Patterning the first isolation sub-material layer to obtain a plurality of first isolation sub-portions arranged at intervals; A second spacer material layer, a second spacer material layer and a third spacer material layer are sequentially formed in a stacked manner on a side of the first spacer portion away from the substrate; sequentially patterning the third isolation material layer, the second isolation material layer and the second isolation sub-material layer to form the isolation structure; Preferably, along the thickness direction of the substrate, the thickness of the first spacer material layer is greater than or equal to and less than or equal to 16. The method for preparing a display panel according to claim 15, characterized in that: The step of sequentially patterning the third isolation material layer, the second isolation material layer and the second isolation sub-material layer to form the isolation structure includes: forming a patterned first photoresist layer on a side of the third isolation material layer away from the substrate; Removing the third isolation material layer and a portion of the second isolation material layer not covered by the first photoresist layer by dry etching to expose a portion of the second isolation sub-material layer on a side away from the substrate, wherein after the dry etching step, an orthographic projection of the first isolation sub-portion on the substrate is located within an orthographic projection of the second isolation material layer on the substrate; Removing the second isolation sub-material layer not covered by the first photoresist layer, removing part of the second isolation material layer and the second isolation sub-material layer exposed by the second isolation material layer, and removing the first photoresist layer by wet etching to form an isolation structure; Preferably, along the thickness direction of the substrate, the thickness of the second spacer material layer is greater than or equal to and less than or equal to Preferably, along the thickness direction of the substrate, the thickness of the first spacer material layer is equal to the thickness of the second spacer material layer.

17. The method for preparing a display panel according to claim 14, characterized in that: The isolation structure further includes a second isolation portion and a third isolation portion located on a side of the first isolation portion away from the substrate, and the second isolation portion is located between the first isolation portion and the third isolation portion; the step of forming the isolation structure on one side of the substrate includes: forming a first isolation material layer on one side of the substrate; Patterning the first isolation material layer to form a plurality of grooves disposed at intervals and recessed toward the substrate on a side of the first isolation material layer away from the substrate; Sequentially forming a second isolation material layer and a third isolation material layer stacked on one side of the first isolation material layer away from the substrate; sequentially patterning the third isolation material layer, the second isolation material layer, and the first isolation material layer to form the isolation structure; Preferably, along the thickness direction of the substrate, before patterning the first isolation material layer, the thickness of the first isolation material layer is greater than or equal to and less than or equal to Preferably, along the thickness direction of the substrate, the thickness of the first isolation material layer located at the groove is greater than or equal to and less than or equal to Preferably, along the thickness direction of the substrate, after the first isolation material layer is patterned, the thickness of the first isolation material layer located outside the groove is twice the thickness of the first isolation material layer located in the groove.

18. The method for preparing a display panel according to claim 17, characterized in that: The step of sequentially patterning the third isolation material layer, the second isolation material layer and the first isolation material layer to form the isolation structure includes: forming a patterned second photoresist layer on a side of the third isolation material layer away from the substrate; Removing the third isolation material layer and a portion of the second isolation material layer not covered by the second photoresist layer by dry etching to expose a portion of the first isolation material layer located at the groove and away from the substrate; The first isolation material layer not covered by the second photoresist layer is removed by wet etching, and part of the second isolation material layer and part of the first isolation material layer exposed by the second isolation material layer are removed, and the second photoresist layer is removed to form an isolation structure.

19. The method for preparing a display panel according to claim 17, wherein: The step of patterning the first isolation material layer to form a plurality of grooves spaced apart and recessed toward the substrate on a side of the first isolation material layer away from the substrate comprises: forming a patterned third photoresist layer on a side of the first isolation material layer away from the substrate, wherein an orthographic projection of the third photoresist layer on the substrate coincides with an orthographic projection of the first isolation sub-portion on the substrate; A portion of the first isolation material layer not covered by the third photoresist layer is removed to form a plurality of spaced grooves recessed toward the substrate on a side of the first isolation material layer away from the substrate, and the third photoresist layer is removed.

20. An electronic device, characterized in that: The electronic device comprises the display panel described in any one of claims 1 to 13, or comprises a display panel prepared by the method for preparing a display panel described in any one of claims 14 to 19.

Images