Centering support, driver unit and electronic equipment

Abstract

This invention discloses a centering support, a sound-generating unit, and an electronic device, relating to the technical field of electroacoustic equipment components. The centering support includes a body and pads disposed on the body. The pads are used for electrical connection with leads. Each pad includes a substrate and a cover film arranged sequentially along its thickness direction. The substrate includes a welding layer, a conductive layer, an insulating layer, and a reinforcing layer arranged sequentially along its thickness direction. The reinforcing layer is connected to the cover film. Through-holes are formed in the substrate, penetrating the welding layer, conductive layer, insulating layer, and reinforcing layer sequentially along its thickness direction. Each through-hole has a connecting layer on its wall that connects the conductive layer and the reinforcing layer. This invention uses the cooperation of the reinforcing layer and the connecting layer to connect and limit the conductive layer. The binding force of the connecting layer on the conductive layer prevents the conductive layer from warping and delaminating, thus making it less prone to delamination between the conductive layer and the cover film during welding, improving the welding yield and welding effect of the centering support's pads.

Description

Technical Field

[0001] This invention relates to the field of electroacoustic equipment components, and particularly to a centering support, a sound-generating unit, and an electronic device. Background Technology

[0002] Microspot welding is a precision welding technology widely used in electronic product manufacturing, especially suitable for high-precision connections of tiny components. Taking a speaker as an example, microspot welding is a key process when connecting leads and pads on the centering support. Microspot welding uses pulsed current or laser heating to rapidly heat the welding area to its melting point, completing the welding in a short time. In a speaker, the connection between the leads and the pads is crucial, and the stability of the solder joint directly affects the performance and long-term reliability of the speaker.

[0003] However, in the current micro-spot welding process, the instantaneous temperature generated by the welding head can reach 400+℃, which completely exceeds the combined temperature tolerance of the cover film and conductive layer of the solder pad. The probability of delamination of the conductive layer and cover film after spot welding is constantly increasing, resulting in problems such as delamination of the conductive layer and cover film after welding. Summary of the Invention

[0004] The main objective of this invention is to provide a centering support plate, a sound-generating unit, and an electronic device, aiming to solve the problem of delamination between the pads and the substrate that easily occurs when the pads of the centering support plate are micro-spot welded in the prior art.

[0005] To achieve the above objectives, the present invention proposes a centering support, comprising a body and a pad disposed on the body. The pad is used for electrical connection with a lead. The pad includes a substrate and a cover film arranged sequentially along its thickness direction. The substrate includes a solder layer, a conductive layer, an insulating layer and a reinforcing layer arranged sequentially along the thickness direction. The reinforcing layer is connected to the cover film. A through hole is formed on the substrate. The through hole sequentially penetrates the solder layer, the conductive layer, the insulating layer and the reinforcing layer along the thickness direction. The wall of each through hole is provided with a connecting layer connecting the conductive layer and the reinforcing layer.

[0006] In one embodiment, the conductive layer includes a first electroplated copper layer and a first rolled copper layer disposed sequentially along the thickness direction, and the reinforcing layer includes a second rolled copper layer and a second electroplated copper layer disposed sequentially along the thickness direction, wherein the first rolled copper layer and the second rolled copper layer are respectively located on both sides of the insulating layer along the thickness direction.

[0007] In one embodiment, the connecting layer is a copper plating layer electroplated on the wall of the through hole, and the copper plating layer is sequentially connected to the first electroplated copper layer, the first rolled copper layer, the second rolled copper layer and the second electroplated copper layer along the thickness direction.

[0008] In one embodiment, the substrate is polygonal, with one side serving as a connecting edge for connection with an external structure, and the other sides serving as non-connecting edges.

[0009] The through holes are provided at least two of the non-connecting edges; or,

[0010] The through holes are provided at at least two corners of the substrate.

[0011] In one embodiment, there are multiple through holes, which are spaced apart along the edge of the substrate.

[0012] In one embodiment, all of the through holes are annular non-closed through holes, and the through holes are opened at the edge of the substrate to form multiple notches at the edge of the substrate.

[0013] In one embodiment, the edge of the through hole on the substrate is open; and / or, in one embodiment, all of the notches are U-shaped notches.

[0014] In one embodiment, the plurality of through holes are all annular closed through holes, and the plurality of through holes are disposed close to the edge of the substrate.

[0015] In one embodiment, the connecting layer completely covers the wall of the through hole, and the wall thickness of the connecting layer is uniform.

[0016] And / or, the number of through holes is at least two, the through holes are round holes, and the diameter of each through hole is 0.1mm to 0.3mm;

[0017] And / or, the cover film includes a base layer and an adhesive layer, the base layer being connected to the reinforcing layer via the adhesive layer, the solder layer being a tin layer, and both the base layer and the insulating layer being polyimide layers.

[0018] In one embodiment, the body includes a first connecting portion, a second connecting portion, and an elastic portion located between the first connecting portion and the second connecting portion. The elastic portion is formed by the first connecting portion extending in a curved manner from the second connecting portion in different directions, and the pad is provided at the end of the first connecting portion away from the elastic portion.

[0019] In one embodiment, the elastic portion bends toward the second connecting portion near the first connecting portion to form an installation space, and the solder pad is located within the installation space.

[0020] The present invention also provides a sound-generating unit, the sound-generating unit comprising a vibration system, a magnetic circuit system and a housing, the vibration system comprising a voice coil and the aforementioned centering support, the end of the first connecting portion away from the elastic portion being connected to the voice coil, the end of the second connecting portion away from the elastic portion being connected to the housing, and the pads connecting the voice coil to an external circuit via the leads.

[0021] The present invention also provides an electronic device, the electronic device comprising a housing and the aforementioned sound-emitting unit, the sound-emitting unit being disposed within the housing.

[0022] The technical solution of this invention involves setting a conductive layer and a reinforcing layer on the substrate of the centering support pad, and creating through holes in the substrate. A connecting layer is then placed on the wall of the through holes, connecting the conductive layer and the reinforcing layer. The binding force of the connecting layer counteracts the force that causes the conductive layer to delaminate during welding, preventing delamination between the conductive layer and the insulating layer and the cover film due to high temperatures during welding. This prevents the conductive layer from lifting, thereby improving the welding yield and welding effect of the pads. This invention uses the cooperation of the reinforcing layer and the connecting layer to connect and limit the conductive layer, and the binding force of the connecting layer prevents the conductive layer from lifting and delaminating. This makes it less likely for the conductive layer and the cover film to delaminate during welding, improving the welding yield and welding effect of the centering support pad. Attached Figure Description

[0023] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on the structures shown in these drawings without creative effort.

[0024] Figure 1 A schematic diagram of the structure of the pad of the centering support is provided for one embodiment of the present invention;

[0025] Figure 2 A schematic cross-sectional view of the pad structure of a centering support piece according to an embodiment of the present invention;

[0026] Figure 3 This is a schematic diagram of the centering support provided in the first embodiment of the present invention;

[0027] Figure 4 This is a schematic diagram of the centering support provided in the second embodiment of the present invention;

[0028] Figure 5 This is a schematic diagram of the centering support provided in the third embodiment of the present invention;

[0029] Figure 6 This is a schematic diagram of the centering support provided in the fourth embodiment of the present invention;

[0030] Figure 7 This is a schematic diagram of the centering support provided in the fifth embodiment of the present invention;

[0031] Figure 8 This is a schematic diagram of the centering support provided in the sixth embodiment of the present invention.

[0032] Explanation of icon numbers:

[0033] 100. Pad; 1. Substrate; 11. Solder layer; 12. Conductive layer; 121. First electroplated copper layer; 122. First rolled copper layer; 13. Insulating layer; 14. Reinforcing layer; 141. Second rolled copper layer; 142. Second electroplated copper layer; 15. Through hole; 151. Notch; 16. Connecting edge; 17. Non-connecting edge; 18. Corner; 19. Connecting layer; 2. Cover film; 21. Base layer; 22. Adhesive layer; 3. Cover layer; 400. Centering support; 401. Body; 410. First connecting part; 420. Second connecting part; 430. Elastic part; 431. First end; 432. Second end; 433. Mounting space; 440. Conductive component.

[0034] The realization of the objective, functional features and advantages of the present invention will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation

[0035] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of the present invention.

[0036] It should be noted that if the embodiments of the present invention involve directional indications (such as up, down, left, right, front, back, etc.), the directional indications are only used to explain the relative positional relationship and movement of the components in a specific posture. If the specific posture changes, the directional indications will also change accordingly.

[0037] Furthermore, if the embodiments of this invention involve descriptions such as "first" or "second," these descriptions are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined with "first" or "second" may explicitly or implicitly include at least one of those features. Additionally, the use of "and / or" or "and / or" throughout the text includes three parallel solutions. For example, "A and / or B" includes solution A, solution B, or a solution where both A and B are satisfied simultaneously. Furthermore, the technical solutions of the various embodiments can be combined with each other, but this must be based on the ability of those skilled in the art to implement them. When the combination of technical solutions is contradictory or impossible to implement, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection claimed by this invention.

[0038] Please combine Figures 1 to 4 This embodiment proposes a centering support 400, which includes a body 401 and a pad 100 disposed on the body 401. The pad 100 is used for electrical connection with the lead wire. The pad 100 includes a substrate 1 and a cover film 2 arranged sequentially along its thickness direction. The substrate 1 includes a welding layer 11, a conductive layer 12, an insulating layer 13 and a reinforcing layer 14 arranged sequentially along its thickness direction. The reinforcing layer 14 is connected to the cover film 2. A through hole 15 is provided on the substrate 1. The through hole 15 passes through the welding layer 11, the conductive layer 12, the insulating layer 13 and the reinforcing layer 14 sequentially along its thickness direction. The hole wall of each through hole 15 is provided with a connecting layer 19 connecting the conductive layer 12 and the reinforcing layer 14.

[0039] The technical solution of this invention involves providing a conductive layer 12 and a reinforcing layer 14 on the substrate 1 of the pad 100 of the centering support 400, and creating through holes 15 in the substrate 1. A connecting layer 19 is provided at the wall of the through hole 15, connecting the conductive layer 12 and the reinforcing layer 14. The binding force of the connecting layer 19 counteracts the force of delamination deformation of the conductive layer 12 during welding, preventing the conductive layer 12 from delaminating with the insulating layer 13 and the cover film 2 due to high temperature during welding. This prevents the conductive layer 12 from lifting, thereby improving the welding yield and welding effect of the pad 100. This invention uses the cooperation of the reinforcing layer 14 and the connecting layer 19 to connect and limit the conductive layer 12, and the binding force of the connecting layer 19 prevents the conductive layer 12 from lifting and delaminating. This makes it less likely for the conductive layer 12 to delaminate with the cover film 2 during welding, improving the welding yield and welding effect of the pad 100.

[0040] In one embodiment, the conductive layer 12 includes a first electroplated copper layer 121 and a first rolled copper layer 122 arranged sequentially along the thickness direction, and the reinforcing layer 14 includes a second rolled copper layer 141 and a second electroplated copper layer 142 arranged sequentially along the thickness direction, wherein the first rolled copper layer 122 and the second rolled copper layer 141 are located on both sides of the insulating layer 13 along the thickness direction.

[0041] The conductive layer 12 is formed by stacking a first electroplated copper layer 121 and a first rolled copper layer 122. The first rolled copper layer 122 serves as a base layer and is connected to the insulating layer 13. Then, the first electroplated copper layer 121 is formed by electroplating on the surface of the first rolled copper layer 122 to optimize conductivity and welding performance. Due to its smooth surface and excellent ductility, rolled copper is suitable as a base layer and can better bond with the insulating layer 13, thereby improving the connection effect with the insulating layer 13. Similarly, when the reinforcing layer 14 is formed by the second rolled copper layer 141 and the second electroplated copper layer 142, the second rolled copper layer 141 is also a layer connected to the insulating layer 13.

[0042] Specifically, the connecting layer 19 is a copper plating layer electroplated on the wall of the through hole 15. Along its thickness, the copper plating layer sequentially connects to the first electroplated copper layer 121, the first rolled copper layer 122, the second rolled copper layer 141, and the second electroplated copper layer 142. Since both the conductive layer 12 and the reinforcing layer 14 are copper layers, the connecting layer 19 is prepared by electroplating copper. Because materials of the same type have similar physical properties, it is easier to form strong metallic bonds, improving the connection stability between the connecting layer 19 and the conductive layer 12 and the reinforcing layer 14. Furthermore, the sequential connection of the copper plating layer to the first electroplated copper layer 121, the first rolled copper layer 122, the second rolled copper layer 141, and the second electroplated copper layer 142 ensures that each layer has a connection with the copper plating layer, increasing the connection area between the copper plating layer and the conductive layer 12 and the reinforcing layer 14, thereby improving the connection stability.

[0043] The substrate 1 is polygonal in shape, with one side of the substrate 1 being a connecting edge 16 for connection with an external structure, and the other sides of the substrate 1 being non-connecting edges 17.

[0044] Please combine Figure 3 , Figure 4 , Figure 6 and Figure 7 In one embodiment, at least two non-connecting edges 17 are provided with through holes 15;

[0045] Through holes 15 are provided at non-connecting edges 17, and at least two non-connecting edges 17 are provided with through holes 15, so that the connecting layer 19 can provide binding force to the conductive layer 12 from different directions of the substrate 1, making the force on the conductive layer 12 more uniform, further improving the stability of the conductive layer 12, avoiding the conductive layer 12 from lifting due to uneven force on one side during the welding process, and improving the welding yield and welding effect of the pad 100.

[0046] Please see Figure 8 In another embodiment, at least two corners 18 of the substrate 1 are provided with through holes 15.

[0047] Understandably, the substrate 1 is a polygon with multiple corners 18. The through holes 15 are provided at at least two different corners 18, which allows the connecting layer 19 to provide binding force to the conductive layer 12 from different directions of the substrate 1, making the force on the conductive layer 12 more uniform, further improving the stability of the conductive layer 12, and preventing the conductive layer 12 from lifting due to uneven force on one side during the soldering process, thereby improving the soldering yield and soldering effect of the pad 100.

[0048] Please see Figure 5 In another embodiment, each corner of the substrate 1 is provided with a through hole 15. Each corner of the substrate is connected to the conductive layer 12 and the reinforcing layer 14 through the connecting layer 19 on the hole wall of the through hole 15, so that the conductive layer 12 can be bound by the corner, thereby maximizing the stability of the conductive layer 12 and preventing the conductive layer 12 from lifting due to uneven force on one side during the welding process, thus improving the welding yield and welding effect of the solder pad 100.

[0049] In one embodiment, there are multiple through holes 15, which are distributed at intervals along the edge of the substrate 1.

[0050] The vias 15 are spaced along the edge of the substrate. The edge of the conductive layer 12 can be bound by the connecting layer 19 on the hole wall of the vias 15 to prevent the edge of the conductive layer 12 from lifting. On the one hand, the position of the middle part of the pad 100 can be reserved, which does not affect the soldering of the lead wire and has little impact on the original function of the pad 100 itself. On the other hand, the vias 15 located at the edge are easier to prepare, which improves the processing efficiency.

[0051] Please combine Figures 3 to 6 In one embodiment, the plurality of through holes 15 are all annular non-closed through holes 15, and the through holes 15 are opened at the edge of the substrate 1 so that the edge of the substrate 1 forms a plurality of notches 151.

[0052] The through hole 15 is located at the edge of the substrate 1 and is an annular non-closed through hole 15. This allows the electroplating equipment to be placed on the side of the substrate 1 and inserted into the notch 151 when electroplating to prepare the connecting layer 19. The substrate 1 is then prepared on the hole wall of the through hole 15, making the electroplating process more convenient and the preparation of the connecting layer 19 more convenient.

[0053] Specifically, Figure 3 The accompanying drawings for the first embodiment of this application show that there are three annular non-closed through holes 15 on the pad, and the three annular non-closed through holes 15 are respectively disposed at three non-connection edges 17. Figure 4 The accompanying drawings for the second embodiment of this application show that there are two annular non-closed through holes 15 on the pad, and the two annular non-closed through holes 15 are respectively disposed at two non-connecting edges 17. Figure 5 The accompanying drawings for the third embodiment of this application show that there are four annular non-closed through holes 15 on the pad, and the four annular non-closed through holes 15 are respectively disposed at the four corners of the pad 100. Figure 6 The accompanying drawings for the fourth embodiment of this application show that there are four annular non-closed through holes 15 on the pad, and the four annular non-closed through holes 15 are respectively disposed at three non-connection edges 17, and two through holes 15 are disposed at one of the non-connection edges 17.

[0054] Furthermore, the edge of the through hole 15 on the substrate 1 is open.

[0055] It should be noted that the outer surface of the substrate 1 may be provided with a covering film 2 or other structures. When there is a shielding structure outside the edge of the substrate 1, due to the shielding of the covering film 2 or other structures, it is not possible to directly open an annular non-closed through hole 15 on the edge of the substrate 1. Therefore, the outer surface of the edge where the through hole 15 is opened is open.

[0056] In one embodiment, the plurality of through holes 15 are all arc-shaped through holes 15, and the plurality of notches 151 are all U-shaped notches 151.

[0057] When the through hole 15 is an arc-shaped through hole 15 and the notch 151 is a U-shaped notch 151, the hole wall of the through hole 15 is flat and smooth everywhere. When the connecting layer 19 is electroplated on the hole wall, the connecting layer 19 is flatter and more continuous, and there will be no stress concentration at the corner 18, which makes the stability of the connecting layer 19 better and extends the service life of the connecting layer 19.

[0058] Please combine Figure 7 and Figure 8 In one embodiment, the plurality of through holes 15 are all annular closed through holes 15, and the plurality of through holes 15 are disposed close to the edge of the substrate 1.

[0059] Understandably, when the outer side of the substrate 1 is blocked, it is inconvenient to drill holes at the edge of the substrate 1. Therefore, the through holes 15 can only be set inside the substrate 1. Thus, the through holes 15 are annular closed through holes 15. Multiple through holes 15 are close to the edge of the substrate 1, leaving the middle part for soldering the pads 100 and the leads, so as to avoid the through holes 15 occupying too much space of the pads 100 and affecting the soldering effect of the pads 100.

[0060] Specifically, Figure 7 The accompanying drawings for the fifth embodiment of this application show that the pad 100 has three annular closed through holes 15, and the three annular closed through holes 15 are respectively provided for three non-connecting edges 17. Figure 8 The accompanying drawings for the sixth embodiment of this application show that the pad 100 has two annular closed through holes 15, which are respectively provided for two non-connecting edges 17, and the two through holes 15 are arranged diagonally.

[0061] In one embodiment, the edge of the substrate 1 is covered with a covering layer 3 along its extending direction, so that the edge of the substrate 1 is closed.

[0062] When the substrate 1 is covered with a cover layer 3, so that the edge of the substrate 1 is closed, only annular closed through holes 15 opened inside the substrate 1 can be selected to avoid interference from the cover layer 3 when opening the through holes 15, which would affect the opening effect of the through holes 15.

[0063] Furthermore, the connecting layer 19 completely covers the wall of the through hole 15, and the wall thickness of the connecting layer 19 is uniform. The complete coverage of the hole wall by the connecting layer 19 maximizes the connection area between the connecting layer 19 and the conductive layer 12 and the reinforcing layer 14, thereby maximizing the connection stability of the connecting layer 19 to the conductive layer 12 and improving the soldering effect of the pad 100.

[0064] In one embodiment, the number of through holes 15 is at least two, and the through holes 15 are round holes with a diameter of 0.1 mm to 0.3 mm.

[0065] It should be noted that the size of the pad 100 is usually small. Therefore, the diameter of the via 15 is 0.1mm to 0.3mm and there are at least two of them. Only when there are at least two connection layers 19 from different directions can the connection effect of the connection layer 19 on the conductive layer 12 be satisfied, the conductive layer 12 be prevented from lifting to the greatest extent, and the stability of the conductive layer 12 and the soldering effect of the pad 100 be improved.

[0066] In one embodiment, the cover film 2 includes a base layer 21 and an adhesive layer 22. The base layer 21 is connected to the reinforcing layer 14 via the adhesive layer 22. The solder layer 11 is a tin layer. Both the base layer 21 and the insulating layer 13 are polyimide layers. The base layer 21 is connected to the reinforcing layer 14 via the adhesive layer 22. Understandably, since the base layer 21 is a polyimide layer and the reinforcing layer 14 is a metal layer, a direct connection between the two is not stable. Therefore, the adhesive layer 22 bonds the base layer 21 and the reinforcing layer 14 together, preventing detachment or lifting, further improving the stability of the solder pad 100. The base layer 21 and the insulating layer 13 are both polyimide layers. Polyimide has excellent heat resistance and mechanical stability, making it suitable as a base or connecting layer 19. It is unaffected at high temperatures and has better stability. The solder layer 11 is a tin layer. Tin, as a commonly used solder, has excellent solderability and wettability, improving soldering quality. It is also readily available and has a low cost.

[0067] In one embodiment, the body 401 includes a first connecting portion 410, a second connecting portion 420, and an elastic portion 430 located between the first connecting portion 410 and the second connecting portion 420. The elastic portion 430 is formed by the first connecting portion 410 extending in a curved manner in different directions to the second connecting portion 420. A pad 100 is provided at one end of the first connecting portion 410 away from the elastic portion 430.

[0068] The first connecting part 410 and the second connecting part 420 of the centering support 400 are connected by an elastic part 430. The elastic part 430 enables the movement of the voice coil to be precisely controlled within a reasonable range, avoiding excessive vibration or offset, ensuring that the voice coil vibrates uniformly along the axial direction under the action of the driving signal. The elastic part 430 also acts like a spring, providing appropriate restoring force to help the voice coil quickly return to its initial position after vibration, ensuring efficient movement of the sound-producing unit and preventing the voice coil from deviating from the center.

[0069] In one embodiment, the elastic portion 430 is bent toward the second connecting portion 420 near the first connecting portion 410 to form an installation space 433, and the solder pad 100 is located within the installation space 433.

[0070] The centering support 400 is bent at the elastic part 430 to form an installation space 433, and the solder pad 100 is placed in the installation space 433. This eliminates the need for the solder pad 100 to occupy additional space, reducing the overall volume of the centering support 400 and optimizing the spatial layout of the centering support 400.

[0071] It should be noted that the main body 401 is also provided with a conductive element 440. The conductive element 440 is connected and conductive to the pad 100. The conductive element 440 extends sequentially along the first connecting part 410, the elastic part 430 and the second connecting part 420 until it is electrically connected to the voice coil outside the second connecting part 420, thereby supplying power to the voice coil.

[0072] The present invention also provides a sound-generating unit, which includes a vibration system, a magnetic circuit system, and a housing. The vibration system includes a voice coil and the aforementioned centering support 400. The end of the first connecting portion 410 away from the elastic portion 430 is connected to the voice coil, and the end of the second connecting portion 420 away from the elastic portion 430 is connected to the housing. The pad 100 connects the voice coil to an external circuit via a lead wire. The first connecting portion 410 of the centering support 400 is connected to the voice coil, and the second connecting portion 420 is connected to the housing, so that the centering support 400 can fix the voice coil in the middle of the sound-generating unit, ensuring that the voice coil can vibrate uniformly along the axial direction when driven.

[0073] The specific structure of the centering support 400 is as described in the above embodiments. Since this sound-generating unit adopts all the technical solutions of all the above embodiments, it has at least all the beneficial effects brought about by the technical solutions of the above embodiments, which will not be described in detail here.

[0074] This invention also proposes an electronic device, which includes a housing and the aforementioned sound-emitting unit, the sound-emitting unit being disposed within the housing. The specific structure of the sound-emitting unit is as described in the above embodiments. Since this electronic device employs all the technical solutions of all the above embodiments, it possesses at least all the beneficial effects brought about by the technical solutions of the above embodiments, which will not be elaborated upon here. The electronic device can be a terminal device, an in-vehicle device, or various smart mobile terminals, such as mobile phones and computers.

[0075] The above are merely optional embodiments of the present invention and do not limit the patent scope of the present invention. All equivalent structural transformations made under the concept of the present invention using the contents of the specification and drawings of the present invention, or direct / indirect applications in other related technical fields, are included within the patent protection scope of the present invention.

Claims

1. A centering support, characterized in that, The device includes a body and pads disposed on the body. The pads are used for electrical connection with leads. The pads include a substrate and a cover film arranged sequentially along their thickness direction. The substrate includes a solder layer, a conductive layer, an insulating layer and a reinforcing layer arranged sequentially along the thickness direction. The reinforcing layer is connected to the cover film. The substrate has through holes that sequentially penetrate the solder layer, the conductive layer, the insulating layer and the reinforcing layer along the thickness direction. The wall of each through hole is provided with a connecting layer that connects the conductive layer and the reinforcing layer. The conductive layer includes a first electroplated copper layer and a first rolled copper layer arranged sequentially along the thickness direction, and the reinforcing layer includes a second rolled copper layer and a second electroplated copper layer arranged sequentially along the thickness direction, wherein the first rolled copper layer and the second rolled copper layer are located on both sides of the insulating layer along the thickness direction. The connecting layer is a copper plating layer electroplated on the hole wall of the through hole, and the copper plating layer is sequentially connected to the first electroplated copper layer, the first rolled copper layer, the second rolled copper layer and the second electroplated copper layer along the thickness direction.

2. The centering support as described in claim 1, characterized in that, The substrate is polygonal in shape, with one side serving as a connecting edge for connection with an external structure, and the other sides serving as non-connecting edges. The through holes are provided at least two of the non-connecting edges; or, The through holes are provided at at least two corners of the substrate.

3. The centering support as described in claim 1, characterized in that, The through holes are multiple, and the multiple through holes are distributed at intervals along the edge of the substrate.

4. The centering support as described in claim 3, characterized in that, All of the aforementioned through holes are annular non-closed through holes, and the through holes are opened at the edge of the substrate, so that the edge of the substrate forms multiple notches.

5. The centering support as described in claim 4, characterized in that, The substrate having the through hole has an open outer edge; And / or, all of the aforementioned notches are U-shaped notches.

6. The centering support as described in claim 3, characterized in that, All of the through holes are annular closed through holes, and the through holes are located close to the edge of the substrate.

7. The centering support as described in any one of claims 1 to 6, characterized in that, The connecting layer completely covers the wall of the through hole, and the wall thickness of the connecting layer is uniform. And / or, the number of through holes is at least two, the through holes are round holes, and the diameter of each through hole is 0.1mm to 0.3mm; And / or, the cover film includes a base layer and an adhesive layer, the base layer being connected to the reinforcing layer via the adhesive layer, the solder layer being a tin layer, and both the base layer and the insulating layer being polyimide layers.

8. The centering support piece as described in any one of claims 1 to 6, characterized in that, The body includes a first connecting portion, a second connecting portion, and an elastic portion located between the first connecting portion and the second connecting portion. The elastic portion is formed by the first connecting portion extending in a curved manner along different directions to the second connecting portion. The pad is provided at the end of the first connecting portion away from the elastic portion.

9. The centering support as described in claim 8, characterized in that, The elastic portion bends toward the second connecting portion near the first connecting portion to form an installation space, and the solder pad is located within the installation space.

10. A sound-generating monomer, characterized in that, The sound-generating unit includes a vibration system, a magnetic circuit system, and a housing. The vibration system includes a voice coil and a centering support as described in any one of claims 8 or 9. The end of the first connecting portion away from the elastic portion is connected to the voice coil, and the end of the second connecting portion away from the elastic portion is connected to the housing. The pad connects the voice coil to an external circuit via the lead wire.

11. An electronic device, characterized in that, The electronic device includes a housing and a sound-emitting unit as described in claim 10, the sound-emitting unit being disposed within the housing.

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