Power Adaptive Control Method and System for Laser Metal Engraving

Abstract

The present invention discloses a power adaptive control method and system for laser metal engraving, which relates to the field of laser processing. The method includes: obtaining lithography requirements and lithography target characteristics, performing requirement dissection, and determining a lithography geometric map, wherein the lithography geometric map is marked with frequency modulation nodes, and the lithography requirements are 2D etching or 3D etching; obtaining the integrated grating structure of the lithography machine, and introducing a lithography regulator for two-stage adjustment decision based on the frequency modulation nodes for the lithography geometric map to determine a lithography strategy, wherein the two-stage adjustment includes first-order beam combination adjustment and second-order shaping adjustment; the lithography strategy responds to the lithography machine, assists the lithography coordinate system, and performs adaptive positioning and frequency modulation management on the laser engraving process of the lithography target. It solves the technical problems of insufficient accuracy and low efficiency existing in the existing power control for laser metal engraving, and achieves the technical effects of improving the power control accuracy and efficiency.

Description

Technical Field

[0001] This application relates to the field of laser processing, and particularly to a power adaptive control method and system for laser metal engraving. Background Art

[0002] Power control in laser metal engraving is crucial for achieving precise and efficient etching effects. Currently, the main method to solve the power control problem in laser metal engraving is to control through preset fixed parameters or simple manual adjustment. However, since this method cannot dynamically adjust in real time according to lithography requirements and target characteristics, under complex lithography geometric patterns, the engraving effect is often not ideal, with problems such as insufficient precision and low efficiency.

[0003] In the current related technologies, there are technical problems of insufficient precision and low efficiency in the power control for laser metal engraving. Summary of the Invention

[0004] This application provides a power adaptive control method and system for laser metal engraving. By acquiring and analyzing lithography requirements and target characteristics, determining the lithography geometric pattern and frequency modulation nodes, combining with the integrated grating structure of the lithography machine, making two-stage (first-stage beam combination and second-stage shaping) adjustment decisions through a lithography regulator, formulating a lithography strategy, and applying the lithography strategy to the lithography machine, technical means such as adaptive positioning and frequency modulation management of the lithography target are achieved, and the technical effects of improving power control precision and efficiency are achieved.

[0005] This application provides a power adaptive control method for laser metal engraving, including: acquiring lithography requirements and lithography target characteristics, performing requirement dissection, and determining the lithography geometric pattern, where the lithography geometric pattern is marked with frequency modulation nodes, and the lithography requirement is 2D etching or 3D etching; acquiring the integrated grating structure of the lithography machine, and introducing a lithography regulator for two-stage adjustment decision based on the frequency modulation nodes for the lithography geometric pattern to determine the lithography strategy, where the two-stage adjustment includes first-stage beam combination adjustment and second-stage shaping adjustment; the lithography strategy responds to the lithography machine, assists the lithography coordinate system, and performs adaptive positioning and frequency modulation management on the laser engraving process of the lithography target.

[0006] In a possible implementation, when performing requirement dissection and determining the lithography geometric pattern, the following processing is executed: identifying the lithography requirement, converting it into a sequence requirement based on the lithography trajectory in the entire lithography cycle, where the sequence requirement is marked with a lithography spatial angle and lithography energy efficiency; reading the lithography mode of the lithography machine, and determining the frequency modulation nodes for the sequence requirement with the lithography target characteristics as a constraint to generate the lithography geometric pattern, where the lithography target characteristics at least include metal material characteristics.

[0007] In a possible implementation, the following processing is performed: The lithography mode is a single-track lithography mode or a multi-track collaborative mode; identify the lithography track. If the lithography mode is a multi-track collaborative mode, perform lithography track splitting on the lithography track to determine the mode splitting result; for the mode splitting result, identify the sequence requirements, perform demand trend change positioning, and mark the frequency modulation nodes.

[0008] In a possible implementation, for demand trend change positioning and marking the frequency modulation nodes, the following processing is performed: Set a first demand variable threshold and a second demand variable threshold, where the first demand variable threshold is greater than the second demand variable threshold; through trajectory trend change identification, if it is greater than the first demand variable threshold, mark it as a first-class frequency modulation node; if it is greater than the second demand variable threshold and less than or equal to the first demand variable threshold, mark it as a second-class frequency modulation node; among them, the first-class frequency modulation node performs first-order beam combining adjustment and second-order shaping adjustment, and the second-class frequency modulation node performs second-order shaping adjustment.

[0009] In a possible implementation, construct a lithography regulator and perform the following processing: Identify the integrated grating structure and determine the spectral characteristics of each grating unit; use the spectral characteristics as an index to perform big data retrieval of lithography, retrieve the lithography record set; according to the spectral characteristics, mine the laser beam combining conditions of the combined grating array through the lithography record set, and integrate the lithography record set as sample data to drive the training of the lithography regulator, where the combined grating array is a combination of at least two grating units, and the lithography regulator includes a laser beam combining block and a laser shaping block.

[0010] In a possible implementation, for two-order adjustment decision based on the frequency modulation nodes to determine the lithography strategy, the following processing is performed: Import the lithography geometry map into the lithography regulator; identify the frequency modulation nodes. If it is the first-class frequency modulation node, perform a beam combining grating decision based on the laser beam combining block and parameter adjustment based on the laser shaping block to determine the first frequency modulation strategy; if it is the second-class frequency modulation node, perform parameter adjustment based on the laser shaping block to determine the second frequency modulation strategy; use the first frequency modulation strategy and the second frequency modulation strategy to establish a frequency modulation node mapping with the lithography geometry map as the lithography strategy.

[0011] In a possible implementation, the lithography strategy responds to the lithography machine and performs the following processing: Based on the lithography strategy, configure the numerical control center of the lithography machine; scan to determine the spatial placement position of the lithography target, convert it to the lithography coordinate system, and perform lithography positioning and frequency modulation control based on the lithography strategy, where the lithography coordinate system is the control coordinate system of the lithography machine.

[0012] In a possible implementation, the following processing is performed: the integrated grating structure is a redundant structure; if there is a faulty grating unit, a standby unit based on the redundant structure is triggered to perform laser beam combining control.

[0013] In a possible implementation, after the adaptive positioning and frequency modulation management of the laser engraving process of the lithography target, the following processing is also performed: synchronously performing lithography monitoring and tracking to determine the real-time lithography energy efficiency; according to the position mapping, calibrating the real-time lithography energy efficiency and the spectral lithography requirements to locate the resumption node, where the resumption node is marked with an energy efficiency difference; assisting the lithography regulator to determine a resumption frequency modulation strategy based on the resumption node and transmitting it to the numerical control center of the lithography machine.

[0014] This application also provides a power adaptive control system for laser metal engraving, including: a lithography geometric pattern determination module, configured to obtain lithography requirements and lithography target characteristics, perform requirement dissection, and determine a lithography geometric pattern, where the lithography geometric pattern is marked with frequency modulation nodes, and the lithography requirements are 2D etching or 3D etching; a lithography strategy determination module, configured to obtain the integrated grating structure of the lithography machine, and introduce a lithography regulator to perform a two-stage adjustment decision based on the frequency modulation nodes for the lithography geometric pattern to determine a lithography strategy, where the two-stage adjustment includes a first-stage beam combining adjustment and a second-stage shaping adjustment; an adaptive control module, configured to respond to the lithography machine for the lithography strategy, assist the lithography coordinate system, and perform adaptive positioning and frequency modulation management on the laser engraving process of the lithography target.

[0015] It is intended to first obtain lithography requirements and lithography target characteristics through the power adaptive control method and system for laser metal engraving proposed in this application, perform requirement dissection, and determine a lithography geometric pattern, where the lithography geometric pattern is marked with frequency modulation nodes, and the lithography requirements are 2D etching or 3D etching, then obtain the integrated grating structure of the lithography machine, introduce a lithography regulator to perform a two-stage adjustment decision based on the frequency modulation nodes for the lithography geometric pattern to determine a lithography strategy, where the two-stage adjustment includes a first-stage beam combining adjustment and a second-stage shaping adjustment, and finally the lithography strategy responds to the lithography machine, assists the lithography coordinate system, and performs adaptive positioning and frequency modulation management on the laser engraving process of the lithography target. The technical effect of improving the power control accuracy and efficiency is achieved. Description of the Drawings

[0016] To more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings of the embodiments of the present invention will be briefly introduced below. Flowcharts are used in this application to illustrate the operations performed by the systems according to the embodiments of the present application. It should be understood that the operations described above or below do not necessarily need to be executed precisely in sequence. On the contrary, as needed, various steps can be executed in reverse order or simultaneously. At the same time, other operations can also be added to these processes, or one or several steps can be removed from these processes.

[0017] Figure 1 It is a schematic flowchart of the power adaptive control method for laser metal engraving provided by the embodiments of the present application.

[0018] Figure 2 It is a schematic structural diagram of the power adaptive control system for laser metal engraving provided by the embodiments of the present application.

[0019] Explanation of reference numerals: Lithography geometry map determination module 10, lithography strategy determination module 20, adaptive control module 30. Detailed implementation manners

[0020] The above description is only an overview of the technical solutions of the present application. In order to be able to understand the technical means of the present application more clearly, it can be implemented according to the content of the specification. And in order to make the above and other purposes, features and advantages of the present application more obvious and understandable, the following specifically gives the detailed implementation manners of the present application.

[0021] In order to make the purpose, technical solutions and advantages of the present application clearer, the present application will be further described in detail below in conjunction with the accompanying drawings. The described embodiments should not be regarded as limitations of the present application. All other embodiments obtained by those of ordinary skill in the art without creative efforts fall within the scope of protection of the present application.

[0022] In the following description, "some embodiments" are involved, which describe a subset of all possible embodiments. However, it can be understood that "some embodiments" can be the same subset or different subsets of all possible embodiments, and can be combined with each other without conflict. The terms "first\second" involved are only used to distinguish similar objects and do not represent a specific order for the objects. The terms "including" and "having" and any variations thereof are intended to cover non-exclusive inclusion. For example, a process, method, system, product or server including a series of steps or units does not necessarily have to be limited to those steps or units clearly listed, but may include other steps or modules not clearly listed or inherent to these processes, methods, products or devices. Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those skilled in the technical field to which the present application belongs. The terms used herein are only for the purpose of describing the embodiments of the present application.

[0023] The embodiments of the present application provide a power adaptive control method for laser metal engraving, as Figure 1 shown, the method includes:

[0024] Step S100, obtaining the lithography requirements and lithography target characteristics, performing requirement dissection, and determining the lithography geometry map, wherein the lithography geometry map is marked with frequency modulation nodes, and the lithography requirement is 2D etching or 3D etching.

[0025] Specifically, through means such as communicating with customers, analyzing design documents, or experimental testing, clarify the specific lithography requirements. For example, for a complex 3D etching pattern, it is necessary to determine the contours, depths, and angles of its various parts. Analyze the characteristics of the lithography target material (such as metal), including its optical properties, thermal properties, mechanical properties, etc., for selecting appropriate laser parameters and lithography strategies. Decompose the lithography requirements into multiple subtasks, such as pattern segmentation, hierarchical division, frequency modulation node identification, etc. Use computer-aided design (CAD) software or specialized lithography design software to convert the lithography pattern into a processable digital format. According to the dissected requirements, generate a lithography geometry map, which is a graphical representation method. The map includes the geometric shape, size, position of the lithography pattern, and the identification of frequency modulation nodes. The frequency modulation nodes refer to the key positions where the laser power needs to be adjusted during the lithography process, located at the edges, corners, or details of the pattern.

[0026] In a possible implementation, requirement dissection is performed to determine the lithography geometry map. Step S100 further includes step S110 of identifying the lithography requirements and converting them into sequence requirements based on the lithography trajectory in the entire lithography cycle. Among them, the sequence requirements are marked with lithography spatial angles and lithography energy efficiency. Specifically, according to the lithography requirements, path planning algorithms (such as A* algorithm, Dijkstra algorithm, etc.) are used to plan the lithography trajectory. These algorithms can generate the optimal path from the starting point to the ending point according to the geometry and size of the lithography pattern, including the movement path, speed of the laser beam, and the residence time at different positions. The lithography trajectory includes straight lines, curves, or complex geometric shapes, depending on the design of the lithography pattern. The lithography trajectory is decomposed into a series of discrete points or segments, and each point or segment corresponds to specific lithography parameters, such as the laser incident angle (especially in three-dimensional processing), lithography depth, width, etc. These parameters are arranged in the order of the lithography trajectory to form sequence requirements. Each element in the sequence requirements is marked with the corresponding lithography spatial angle (i.e., the laser incident angle) and lithography energy efficiency (i.e., the utilization efficiency of laser energy in the lithography process, reflecting the ability of laser energy to be converted into lithography effects). Among them, according to the lithography requirements and material properties, the lithography energy efficiency of each sequence requirement is evaluated. For example, for materials with high reflectivity, higher laser power is required to achieve the same engraving depth, so its energy efficiency is lower.

[0027] Step S120: Read the lithography mode of the lithography machine. With the lithography target characteristics as a constraint, determine the frequency modulation nodes for the sequence requirements, and generate the lithography geometry map. Among them, the lithography target characteristics at least include metal material characteristics. Specifically, check the configuration or settings of the lithography machine to determine the supported lithography mode, such as the single-track lithography mode. According to the lithography mode of the lithography machine, determine the control method and parameter setting range of the laser beam. With the lithography target characteristics as a constraint, that is, consider the characteristics of the lithography target material, such as the reflectivity, thermal conductivity, melting point, etc. of the metal material. These characteristics will affect the interaction between the laser beam and the lithography target, thereby affecting the lithography effect. Therefore, when determining the frequency modulation nodes, it is necessary to fully consider the requirements and limitations of the lithography target characteristics on the laser parameters. For example, for a metal material with high reflectivity, it is necessary to increase the laser power to overcome the reflection loss; for a material with low thermal conductivity, it is necessary to reduce the laser power to avoid excessive thermal damage. When determining the frequency modulation nodes, use the material characteristics as a constraint condition. For example, if the melting point of the material is low, the laser power needs to be reduced in the area close to the melting point. Analyze each element in the sequence requirements to determine at which positions or conditions the laser parameters (such as power, frequency, focus position, etc.) need to be adjusted. These positions or conditions are the frequency modulation nodes. For example, the edges, corners or details of the lithography pattern, or the positions where the laser parameters need to be changed during the movement of the laser beam. According to the positions of the frequency modulation nodes and the parameter adjustment requirements, generate the lithography geometry map. The lithography geometry map includes the geometric shape, size, position of the lithography pattern, as well as the identification and parameter setting information of the frequency modulation nodes. This implementation method provides an important basis for formulating the lithography strategy by refining the lithography requirements and considering the lithography target characteristics.

[0028] In a possible implementation, step S120 further includes step S121, and the lithography mode is a single-track lithography mode or a multi-track collaborative mode. Specifically, the lithography mode is divided into a single-track lithography mode and a multi-track collaborative mode. The single-track mode means that the lithography machine uses a single laser beam or a single track for engraving; the multi-track collaborative mode means that the lithography machine can use multiple laser beams or tracks for collaborative engraving at the same time to improve the engraving efficiency or process more complex patterns.

[0029] Step S122: Identify the lithography track. If the lithography mode is the multi-track collaborative mode, perform lithography track splitting on the lithography track to determine the mode splitting result. Specifically, when the lithography mode is the multi-track collaborative mode, determine the multi-track collaborative capabilities of the lithography machine, including the number of supported laser beams, the power range of each laser beam, the collaborative method, etc. Use the track decomposition algorithm to decompose the lithography track into multiple sub-tracks. Each sub-track is responsible for by a different laser beam or track. The algorithm needs to consider the interference between laser beams, engraving efficiency, and the complexity of the lithography pattern, and optimize the allocation of sub-tracks to ensure the workload balance of each laser beam and avoid mutual interference. Finally, determine the mode splitting result, that is, the specific sub-track responsible for each laser beam or track. An example of the mode splitting result is shown in Table 1.

[0030] Table 1: Example of mode splitting result:

[0031] ;

[0032] Step S123: For the mode splitting result, identify the frequency modulation nodes by identifying the sequence requirements and performing demand trend change positioning. Specifically, the sequence requirements identify the laser incident angle, lithography depth, width, etc. at each position based on the lithography track in the entire lithography cycle. Analyze the mode splitting result to determine at which positions or conditions the lithography requirements (such as laser incident angle, lithography depth, etc.) will change. Mark these change points on the lithography geometric map as frequency modulation nodes. The frequency modulation nodes are the key positions for subsequent laser parameter adjustment (such as power, frequency, focus position, etc.). This implementation method ensures that the subsequent lithography strategy and parameter adjustment can adapt to the configuration and capabilities of the lithography machine by identifying the lithography mode (single-track or multi-track collaborative). In the multi-track collaborative mode, the allocation of laser beams or tracks is optimized through lithography track splitting, improving the engraving efficiency and the ability to process complex patterns. Through demand trend change positioning, the key positions or conditions (frequency modulation nodes) for adjusting laser parameters during the lithography process are accurately marked, providing a clear basis for subsequent laser parameter adjustment and lithography strategy formulation.

[0033] In a possible implementation, for demand trend variation positioning and identifying the frequency modulation nodes, step S123 further includes step S1231 of setting a first demand variable threshold and a second demand variable threshold, where the first demand variable threshold is greater than the second demand variable threshold. Specifically, according to lithography requirements, lithography target characteristics (such as metal material characteristics), and the performance parameters of the lithography machine, two demand variable thresholds are preset in advance: the first demand variable threshold and the second demand variable threshold. The first demand variable threshold is set to a higher value for identifying the frequency modulation nodes that need to perform more complex adjustments (i.e., first-order beam combining adjustment and second-order shaping adjustment). The second demand variable threshold is set to a lower value for identifying the frequency modulation nodes that only need to perform simpler adjustments (i.e., second-order shaping adjustment). Here, the demand variable refers to the parameters that may change during the lithography process, such as the laser incident angle, lithography depth, width, etc. The changes in these parameters will affect the lithography quality and efficiency.

[0034] Step S1232: By performing trajectory trend variation identification, if it is greater than the first demand variable threshold, it is identified as a type-I frequency modulation node; if it is greater than the second demand variable threshold and less than or equal to the first demand variable threshold, it is identified as a type-II frequency modulation node. Among them, the type-I frequency modulation nodes perform first-order beam combining adjustment and second-order shaping adjustment, and the type-II frequency modulation nodes perform second-order shaping adjustment. Specifically, analyze the lithography trajectory to identify the change points or trend change regions of the lithography requirements on the trajectory. For example, the edges, corners, or depth change points of the pattern. Use the difference method or the differential method to calculate the demand variable values of these change points or regions, such as the change amount of the laser incident angle, the change amount of the lithography depth, etc. Compare the demand variable values with the set thresholds. If the demand variable value is greater than the first demand variable threshold, then this change point or region is identified as a type-I frequency modulation node, indicating that first-order beam combining adjustment and second-order shaping adjustment need to be performed. If the demand variable value is greater than the second demand variable threshold and less than or equal to the first demand variable threshold, then this change point or region is identified as a type-II frequency modulation node, indicating that only second-order shaping adjustment needs to be performed. This implementation method divides the frequency modulation nodes into type-I and type-II by setting different demand variable thresholds, realizing the refined adjustment of different change degrees in the lithography process. The type-I frequency modulation nodes perform more complex adjustments to cope with larger demand changes; the type-II frequency modulation nodes perform simpler adjustments to cope with smaller demand changes. Through refined adjustment, the lithography requirements can be more accurately met, and the lithography quality and precision can be improved. Especially when processing complex patterns or three-dimensional etching, this refined adjustment can significantly reduce errors and defects. Selecting the appropriate adjustment method according to the size of the demand change can avoid unnecessary complex adjustments, thereby improving the lithography efficiency. For smaller demand changes, only simple adjustments need to be performed; for larger demand changes, more complex adjustments need to be performed to ensure the lithography quality.

[0035] Step S200: Obtain the integrated grating structure of the lithography machine. For the lithography geometric pattern map, introduce a lithography regulator to make a two-stage adjustment decision based on the frequency modulation nodes to determine the lithography strategy, where the two-stage adjustment includes a first-stage beam combination adjustment and a second-stage shaping adjustment.

[0036] Specifically, use tools such as optical microscopes, electron microscopes, or spectrometers to measure the grating array structure of the lithography machine, and record parameters such as the number of gratings, arrangement pattern, and focal length. Among them, the integrated grating structure refers to the combined structure of multiple grating units used to regulate the laser beam in the lithography machine. Analyze the spectral characteristics of the grating units, such as transmittance, reflectance, diffraction efficiency, etc. These characteristics determine the regulation ability of the grating on the laser beam. According to the focal length and arrangement pattern of the grating, analyze its focusing effect on the laser beam. For example, gratings with a smaller focal length can achieve a more compact focus. Analyze the shaping effect of the grating on the laser beam, such as changing the shape and intensity distribution of the beam. For example, gratings arranged in a rectangular pattern can shape a circular beam into a rectangular beam. Analyze the beam splitting ability of the grating, that is, a grating can split a laser beam into multiple sub-beams for multi-track collaborative engraving. An example of the integrated grating structure is shown in Table 2. Select or design a suitable lithography regulator that can perform adaptive power adjustment on the laser engraving process according to the requirements of the lithography geometric pattern map and the frequency modulation nodes. Integrate the lithography regulator with the lithography machine to ensure that the regulator can respond in real time to the operating state of the lithography machine and the lithography requirements. According to the position of the frequency modulation nodes in the lithography geometric pattern map, determine the lithography strategy, that is, the specific parameters of the first-stage beam combination adjustment and the second-stage shaping adjustment, including the setting and adjustment methods of parameters such as laser power, frequency, focusing position, and shaping method. Among them, the first-stage beam combination adjustment is mainly used to adjust the focusing position and power distribution of the laser beam to ensure that the laser beam can accurately irradiate the lithography target. The second-stage shaping adjustment is used to perform fine shaping on the laser beam to meet the detail requirements of the lithography pattern.

[0037] Table 2: Example of integrated grating structure:

[0038] ;

[0039] In a possible implementation, a lithography regulator is constructed, and step S200 further includes step S210 of identifying the integrated grating structure and determining the spectral characteristics of each grating unit. Specifically, tools such as an optical microscope, an electron microscope, or a spectral analyzer are used to physically observe or spectroscopically analyze the integrated grating structure of the lithography machine. Each grating unit in the integrated grating structure is identified, including their geometric features such as position, shape, and size. Through spectral analysis, the transmittance, reflectance, or diffraction efficiency of each grating unit for light of different wavelengths is measured. These data are recorded and analyzed to obtain the spectral characteristic curves or data tables of each grating unit. Here, a grating unit refers to a single grating in the integrated grating structure, which has a specific geometric shape and spectral characteristics.

[0040] Step S220 is to perform a large - data search for lithography with the spectral characteristics as the index and retrieve a lithography record set. Specifically, the spectral characteristics of each grating unit are used as search keywords or indices to access a large database containing a large amount of lithography data and records. The large database is searched for lithography records that match specific spectral characteristics. The search results include parameter settings, effect evaluations, etc. when lithography was previously performed using grating units with similar spectral characteristics. Relevant lithography records are extracted and sorted from the search results to form a lithography record set. The lithography record set contains successful or failed lithography cases, as well as their detailed parameters and effect descriptions.

[0041] Step S230 is to mine the laser beam combination conditions of the combined grating array according to the spectral characteristics, and integrate the lithography record set as sample data to drive the training of the lithography regulator. The combined grating array is a combination of at least two grating units, and the lithography regulator includes a laser beam combination block and a laser shaping block. Specifically, successful cases in the lithography record set are analyzed to find the optimal conditions for laser beam combination. These conditions include the wavelength, power, incident angle of the laser, as well as the arrangement pattern and spacing of the grating units, etc. According to the analysis results, the parameter settings of the grating array are optimized to achieve the best laser beam combination effect. The data in the lithography record set is organized into a format suitable for machine learning or deep learning. The sample data includes input features (such as spectral characteristics, laser parameters, etc.) and output labels (such as beam combination effect, engraving quality, etc.). The integrated sample data is used to train the lithography regulator. The lithography regulator includes a laser beam combination block and a laser shaping block, and learns through training how to adjust laser parameters according to input features to achieve the best beam combination and shaping effects. Among them, the combined grating array is a combination of at least two grating units, which is used to achieve specific laser beam combination or shaping effects. This implementation method can, through large - data search for lithography and retrieval of the lithography record set, mine the optimal parameter settings and effect evaluations when lithography was previously performed using grating units with similar spectral characteristics. This information can be used to optimize the current lithography process and improve engraving quality and efficiency.

[0042] In a possible implementation, a two-stage adjustment decision based on the frequency modulation nodes is made to determine the lithography strategy. Step S200 further includes step S240 of importing the lithography geometry map into the lithography regulator. Specifically, the generated lithography geometry map data is imported into the lithography regulator using a data interface or file transfer method.

[0043] Step S250: Identify the frequency modulation nodes. If they are the first type of frequency modulation nodes, perform the beam combining grating decision based on the laser beam combining block and the parameter adjustment based on the laser shaping block to determine the first frequency modulation strategy. If they are the second type of frequency modulation nodes, perform the parameter adjustment based on the laser shaping block to determine the second frequency modulation strategy. Specifically, the lithography regulator scans the lithography geometry map to identify all the marked frequency modulation nodes. According to the type of the frequency modulation nodes (the first type or the second type), decide which frequency modulation strategy to adopt. For the first type of frequency modulation nodes, the lithography regulator first performs the beam combining grating decision based on the laser beam combining block, selects the grating combination suitable for the current lithography requirements to optimize the beam combining effect of the laser. Then, it performs the parameter adjustment based on the laser shaping block to adjust the parameters of the laser (such as power, frequency, phase, etc.) to meet the specific requirements in the lithography geometry map. The first frequency modulation strategy is the combination of the results of the beam combining grating decision and the parameter adjustment of the laser shaping block.

[0044] For the second type of frequency modulation nodes, the lithography regulator mainly performs the parameter adjustment based on the laser shaping block, and also adjusts the parameters of the laser, but does not need to change the grating combination because the requirements of the second type of frequency modulation nodes change relatively little. The second frequency modulation strategy is the result of the parameter adjustment based on the laser shaping block.

[0045] Step S260: Establish a frequency modulation node mapping with the lithography geometry map using the first frequency modulation strategy and the second frequency modulation strategy as the lithography strategy. Specifically, establish mapping relationships between the first frequency modulation strategy and the second frequency modulation strategy and the first type of frequency modulation nodes and the second type of frequency modulation nodes in the lithography geometry map respectively. Ensure that each frequency modulation node corresponds to a specific frequency modulation strategy for accurate execution during the lithography process. Combine the frequency modulation node mapping with the lithography geometry map to form a complete lithography strategy. The lithography strategy contains all the adjustment information and parameter settings required during the lithography process and is used to guide the operation of the lithography machine. This implementation method combines the frequency modulation strategy with the lithography geometry map by establishing a frequency modulation node mapping to form a complete lithography strategy, which helps to guide the operation of the lithography machine, ensures that the lithography process can proceed smoothly according to the predetermined plan, and thus improves the quality and efficiency of laser metal engraving.

[0046] In a possible implementation, step S200 further includes step S270. The integrated grating structure is a redundant structure. If there is a faulty grating unit, the standby unit based on the redundant structure is triggered to perform laser beam combining control and management.

[0047] Specifically, when designing the integrated grating structure, extra grating units are reserved as standby units to form a redundant structure. These standby units do not participate in the work under normal circumstances, but can quickly take over when the main unit fails. Through real-time monitoring or a fault detection system, the faulty grating unit in the integrated grating structure is identified. The faults are manifested as the grating unit being unable to work properly, the output light intensity being unstable, the spectral characteristics deviating from the expected values, etc. Once a faulty grating unit is detected, the redundancy mechanism is immediately triggered. The control system automatically switches to the standby grating unit to ensure that it can quickly take over the work of the faulty unit. The standby grating unit is used to participate in the laser beam combining process to ensure the stability and accuracy of laser beam combining. The parameters of the standby grating unit (such as angle, position, etc.) are adjusted to match the working state of the original grating unit. For example, the angle of the standby grating is adjusted to maintain the same focusing effect as the original grating. It is verified whether the adjusted standby grating unit can work properly and ensure that the beam combining effect is not affected. The adjustment example is shown in Table 3. This implementation method ensures that when a grating unit fails, it can quickly switch to the standby unit by introducing a redundant structure, avoiding system interruption or performance degradation, which helps to improve the continuity and stability of the laser metal engraving process and reduce the downtime and production losses caused by faults.

[0048] Table 3: Example of parameter adjustment of the standby grating unit:

[0049] ;

[0050] Step S300, the lithography strategy responds to the lithography machine and the auxiliary lithography coordinate system to perform adaptive positioning and frequency modulation management on the laser engraving process of the lithography target.

[0051] Specifically, the formulated lithography strategy is input into the lithography machine to ensure that the lithography machine can perform laser engraving operations according to the strategy. A lithography coordinate system is established, which is consistent with the coordinate systems of the lithography pattern and the lithography machine. According to the information of the lithography strategy and the lithography coordinate system, the focusing position and power distribution of the laser beam are adjusted in real time. When encountering a frequency modulation node, the laser power or frequency is automatically adjusted to meet the detailed requirements of the lithography pattern. During the lithography process, the operating state of the lithography machine and the laser engraving effect are monitored in real time to timely adjust the lithography strategy. The embodiment of the present application adopts technical means such as obtaining and analyzing lithography requirements and target characteristics, determining the lithography geometric map and frequency modulation nodes, combining with the integrated grating structure of the lithography machine, making two-stage (first-stage beam combination and second-stage shaping) adjustment decisions through a lithography regulator, formulating a lithography strategy, and applying the lithography strategy to the lithography machine to achieve the technical effects of improving the power control accuracy and efficiency.

[0052] In a possible implementation manner, the lithography strategy responds to the lithography machine, and step S300 further includes step S310 of configuring the numerical control center of the lithography machine based on the lithography strategy. Specifically, the determined lithography strategy is read, and this strategy contains all the adjustment information and parameter settings required during the lithography process. The parameters and settings in the lithography strategy are input into the numerical control center (CNC, Computer Numerical Control, the core control system of the lithography machine, which is responsible for controlling the laser engraving process according to the input instructions and parameters) of the lithography machine. The configuration includes laser power, frequency, phase, grating selection, engraving path, engraving speed, etc.

[0053] Step S320: Scan to determine the spatial placement position of the lithography target, convert it to the lithography coordinate system, and perform lithography positioning and frequency modulation control based on the lithography strategy, where the lithography coordinate system is the control coordinate system of the lithography machine. Specifically, use the sensors or scanning devices on the lithography machine to perform a spatial scan of the lithography target (the metal material or component to be laser engraved), determine the accurate position of the lithography target in the physical space, including its shape, size, and relative position. Convert the position information of the lithography target obtained by scanning into the control coordinate system of the lithography machine (i.e., the lithography coordinate system). The lithography coordinate system is the reference coordinate system used by the lithography machine for positioning and control, and all engraving operations are based on this coordinate system. According to the positioning and frequency modulation information in the lithography strategy, control the lithography machine to accurately position the lithography target. During the engraving process, according to the settings and strategies of the frequency modulation nodes, adjust the parameters of the laser (such as power, frequency, etc.) in real time to meet the specific requirements in the lithography geometric pattern. This implementation method configures through the numerical control center, inputs the parameters and settings in the lithography strategy into the lithography machine, ensures that it can operate in a predetermined manner, determines the spatial placement position of the lithography target through scanning, and converts it into the lithography coordinate system, achieving accurate positioning. These operations ensure that the lithography process can proceed smoothly according to the predetermined strategy, achieve the expected engraving effect, and meet various lithography requirements.

[0054] In a possible implementation, after the adaptive positioning and frequency modulation management of the laser engraving process of the lithography target, the method further includes: synchronously performing lithography monitoring and tracking to determine the real-time lithography energy efficiency; according to the position mapping, proofread the real-time lithography energy efficiency and the lithography requirements in the pattern to locate the resumption node, where the resumption node is marked with an energy efficiency difference; assist the lithography regulator to determine the resumption frequency modulation strategy based on the resumption node and transmit it to the numerical control center of the lithography machine.

[0055] Specifically, during the laser engraving process, a sensor or monitoring device is used to collect the engraving data of the lithography target in real time, including laser power, engraving speed, engraving depth, etc. According to the collected engraving data, the real-time lithography energy efficiency is calculated, that is, the utilization efficiency of laser energy during the lithography process, which reflects the ability of laser energy to be converted into lithography effects. The energy efficiency can be defined by the ratio of the actual engraving depth to the laser energy, or by the ratio of the actual engraving depth to the expected engraving depth. For example, if the actual engraving depth is 0.4 mm and the expected engraving depth is 0.5 mm, then the real-time lithography energy efficiency = 0.4 / 0.5 = 0.8; or if the laser power is 100 W, the real-time lithography energy efficiency = 0.4 / 100 = 0.004 mm / W. The real-time lithography energy efficiency is compared with the requirements in the pre-determined lithography geometric map. Through position mapping, the real-time lithography energy efficiency is corresponding to the specific position in the map, and the positions with differences or non-conformities to the expectations are found. During the verification process, the positions that need to resume work or be adjusted are identified, that is, the resumption nodes. For each resumption node, the energy efficiency difference is calculated and identified, that is, the difference value between the actual energy efficiency and the expected energy efficiency. According to the energy efficiency difference of the resumption node, the lithography regulator is used to make strategy adjustments. The lithography regulator formulates corresponding resumption frequency modulation strategies according to the magnitude and nature of the energy efficiency difference, such as adjusting the laser power, engraving speed, or engraving depth, etc. The determined resumption frequency modulation strategy is transmitted to the numerical control center of the lithography machine through a communication interface or a data line. The numerical control center makes corresponding adjustments and controls to the lithography machine according to the received strategy instructions to make the engraving effect of the resumption node meet the expectations. This implementation method can timely discover and locate the resumption nodes with large energy efficiency differences through real-time monitoring and tracking of the lithography process. By formulating and implementing the resumption frequency modulation strategy, the engraving effect can be improved, and the engraving quality and efficiency can be enhanced.

[0056] In the above text, reference is made to Figure 1 A power adaptive control method for laser metal engraving according to an embodiment of the present invention is described in detail. Next, reference will be made to Figure 2 Describe a power adaptive control system for laser metal engraving according to an embodiment of the present invention.

[0057] The power adaptive control system for laser metal engraving according to an embodiment of the present invention is used to solve the technical problems of insufficient power control accuracy and low efficiency existing in the prior art, and achieve the technical effects of improving power control accuracy and efficiency. The power adaptive control system for laser metal engraving includes: a lithography geometric map determination module 10, a lithography strategy determination module 20, and an adaptive control module 30.

[0058] The lithography geometry map determination module 10 is used to obtain lithography requirements and lithography target characteristics, perform requirement dissection, and determine the lithography geometry map. Among them, the lithography geometry map is marked with frequency modulation nodes, and the lithography requirement is 2D etching or 3D etching; the lithography strategy determination module 20 is used to obtain the integrated grating structure of the lithography machine, introduce a lithography regulator for two-stage adjustment decision-making based on the frequency modulation nodes for the lithography geometry map, and determine the lithography strategy. Among them, the two-stage adjustment includes first-order beam combination adjustment and second-order shaping adjustment; the adaptive control module 30 is used to respond to the lithography machine with the lithography strategy, assist the lithography coordinate system, and perform adaptive positioning and frequency modulation management on the laser engraving process of the lithography target.

[0059] Next, the specific configuration of the lithography geometry map determination module 10 will be described in detail. As described above, perform requirement dissection and determine the lithography geometry map. The lithography geometry map determination module 10 may further include: a sequence requirement conversion unit for identifying the lithography requirements and converting them into sequence requirements based on the lithography trajectory in the entire lithography cycle. Among them, the sequence requirements are marked with lithography spatial angles and lithography energy efficiency; a frequency modulation node determination unit for reading the lithography mode of the lithography machine and determining the frequency modulation nodes for the sequence requirements with the lithography target characteristics as a constraint, generating the lithography geometry map. Among them, the lithography target characteristics at least include metal material characteristics.

[0060] Among them, the frequency modulation node determination unit may further include: a lithography mode acquisition subunit for acquiring the lithography mode, and the lithography mode is a single-track lithography mode or a multi-track collaborative mode; a lithography track splitting subunit for identifying the lithography trajectory. If the lithography mode is a multi-track collaborative mode, perform lithography track splitting on the lithography trajectory to determine the mode splitting result; a requirement trend change positioning subunit for performing requirement trend change positioning by identifying the sequence requirements for the mode splitting result and marking the frequency modulation nodes.

[0061] Among them, when performing requirement trend change positioning and marking the frequency modulation nodes, the requirement trend change positioning subunit may further include: a requirement variable threshold setting component for setting a first requirement variable threshold and a second requirement variable threshold, where the first requirement variable threshold is greater than the second requirement variable threshold; a frequency modulation node marking component for performing trajectory trend change identification. If it is greater than the first requirement variable threshold, it is marked as a first-class frequency modulation node. If it is greater than the second requirement variable threshold and less than or equal to the first requirement variable threshold, it is marked as a second-class frequency modulation node. Among them, the first-class frequency modulation nodes perform first-order beam combination adjustment and second-order shaping adjustment, and the second-class frequency modulation nodes perform second-order shaping adjustment.

[0062] Next, the specific configuration of the lithography strategy determination module 20 will be described in detail. As described above, when constructing the lithography regulator, the lithography strategy determination module 20 may further include: a spectral characteristic determination unit for identifying the integrated grating structure and determining the spectral characteristics of each grating unit; a lithography big data retrieval unit for performing lithography big data retrieval with the spectral characteristics as an index and retrieving a lithography record set; and a lithography regulator training unit for mining the laser beam combination conditions of the combined grating array according to the spectral characteristics, integrating the lithography record set as sample data, and driving the training of the lithography regulator, where the combined grating array is a combination of at least two grating units, and the lithography regulator includes a laser beam combination block and a laser shaping block.

[0063] Among them, for making a two-stage adjustment decision based on the frequency modulation nodes to determine the lithography strategy, the lithography strategy determination module 20 may further include: a lithography geometry map import unit for importing the lithography geometry map into the lithography regulator; a frequency modulation strategy determination unit for identifying the frequency modulation nodes, if it is the first type of frequency modulation node, performing a combined grating decision based on the laser beam combination block and adjusting the parameters based on the laser shaping block to determine the first frequency modulation strategy, if it is the second type of frequency modulation node, performing parameter adjustment based on the laser shaping block to determine the second frequency modulation strategy; and a frequency modulation node mapping establishment unit for establishing a frequency modulation node mapping with the lithography geometry map using the first frequency modulation strategy and the second frequency modulation strategy as the lithography strategy.

[0064] Next, the specific configuration of the adaptive control module 30 will be described in detail. As described above, the lithography strategy responds to the lithography machine. The adaptive control module 30 may further include: a numerical control center configuration unit for configuring the numerical control center of the lithography machine based on the lithography strategy; and a lithography positioning and frequency modulation control unit for scanning and determining the spatial placement position of the lithography target, converting it to the lithography coordinate system, and performing lithography positioning and frequency modulation control based on the lithography strategy, where the lithography coordinate system is the control coordinate system of the lithography machine.

[0065] Among them, the lithography strategy determination module 20 may further include: an integrated grating structure acquisition unit for acquiring an integrated grating structure, where the integrated grating structure is a redundant structure; and a spare unit trigger unit for triggering a spare unit based on the redundant structure to perform laser beam combination control if there is a faulty grating unit.

[0066] Among them, after the adaptive positioning and frequency modulation management of the laser engraving process of the lithography target, the system may further include: a real-time lithography energy efficiency determination module for synchronously monitoring and tracking lithography to determine the real-time lithography energy efficiency; a resumption node positioning module for calibrating the real-time lithography energy efficiency and the lithography requirements of the pattern according to the position mapping to locate the resumption node, where the resumption node is marked with an energy efficiency difference; a resumption frequency modulation strategy determination module for assisting the lithography regulator to determine a resumption frequency modulation strategy based on the resumption node and transmit it to the numerical control center of the lithography machine.

[0067] The power adaptive control system for laser metal engraving provided by the embodiments of the present invention can execute the power adaptive control method for laser metal engraving provided by any embodiment of the present invention, and has the corresponding functional modules and beneficial effects for executing the method.

[0068] Although the present application makes various references to certain modules in the system according to the embodiments of the present application, however, any number of different modules can be used and run on the user terminal and / or the server. The various units and modules included are only divided according to functional logic, but are not limited to the above division, as long as the corresponding functions can be achieved; in addition, the specific names of the functional units are only for the convenience of mutual distinction and do not limit the protection scope of the present invention.

[0069] The above specific embodiments do not constitute a limitation to the protection scope of the present application. Those skilled in the art should understand that various modifications, combinations and substitutions can be made according to design requirements and other factors. Any modifications, equivalent substitutions and improvements made within the spirit and principle of the present application shall be included within the protection scope of the present application. In some cases, the actions or steps recorded in the present application can be executed in a different order from that in the embodiments and still achieve the desired results. Additionally, the processes depicted in the drawings do not necessarily require the specific order or continuous order shown to achieve the desired results. In certain embodiments, multitasking and parallel processing are also possible or may be advantageous.

Claims

1. A power adaptive control method for laser metal engraving, characterized in that: The method comprises: Obtaining lithography requirements and lithography target characteristics, performing requirement analysis, and determining a lithography geometric map, wherein the lithography geometric map is marked with a frequency modulation node, and the lithography requirement is 2D etching or 3D etching; The integrated grating structure of the lithography machine is obtained, and according to the lithography geometric map, a lithography controller is introduced to make a two-order adjustment decision based on the frequency modulation node to determine the lithography strategy, wherein the two-order adjustment includes a first-order beam combining adjustment and a second-order shaping adjustment; The lithography strategy responds to the lithography machine and assists the lithography coordinate system to perform adaptive positioning and frequency modulation management on the laser engraving process of the lithography target; The requirement analysis and determination of the lithography geometry map include: Identify the lithography requirements and convert them into sequence requirements based on lithography tracks in the full lithography cycle, wherein the sequence requirements are identified by lithography space angle and lithography energy efficiency; Reading the lithography mode of the lithography machine, taking the lithography target characteristics as constraints, determining the frequency modulation nodes of the sequence requirements, and generating the lithography geometric map, wherein the lithography target characteristics at least include metal material characteristics; The lithography mode is a single-track lithography mode or a multi-track collaborative mode; Identify the lithography track, and if the lithography mode is a multi-track collaborative mode, perform lithography track division on the lithography track, and determine a mode track division result; According to the pattern track division result, by identifying the sequence demand, positioning the demand trend change, and identifying the frequency modulation node; The step of locating the demand trend change and identifying the frequency modulation node includes: Setting a first demand variable threshold and a second demand variable threshold, wherein the first demand variable threshold is greater than the second demand variable threshold; By performing trajectory trend change identification, if it is greater than the first demand variable threshold, it is marked as a type of frequency modulation node; If it is greater than the second demand variable threshold and less than or equal to the first demand variable threshold, it is identified as a second-class frequency modulation node; The first type of frequency modulation node performs first-order beam combining regulation and second-order shaping regulation, and the second type of frequency modulation node performs second-order shaping regulation.

2. The power adaptive control method for laser metal engraving according to claim 1, characterized in that: Build a lithography controller, including: Identifying the integrated grating structure and determining the spectral characteristics of each grating unit; Using the spectral characteristics as an index, performing lithography big data retrieval to retrieve a lithography record set; According to the spectral characteristics, the laser beam combining conditions of the combined grating array are mined through the lithography record set, and the lithography record set is integrated as sample data to drive the training of the lithography controller, wherein the combined grating array is a combination of at least two grating units, and the lithography controller includes a laser beam combining block and a laser shaping block.

3. The power adaptive control method for laser metal engraving according to claim 2, characterized in that: Make two-stage modulation decisions based on the frequency modulation node to determine the lithography strategy, including: importing the lithography geometry map into the lithography controller; Identify the frequency modulation node, and if it is the first type of frequency modulation node, execute the beam combining grating decision based on the laser beam combining block and the parameter adjustment based on the laser shaping block to determine the first frequency modulation strategy; If it is the second type of frequency modulation node, perform parameter adjustment based on the laser shaping block to determine a second frequency modulation strategy; The first frequency modulation strategy and the second frequency modulation strategy are used to establish a frequency modulation node mapping with the lithography geometric map as the lithography strategy.

4. The power adaptive control method for laser metal engraving according to claim 1, characterized in that: The lithography strategy is responsive to a lithography machine and includes: Based on the lithography strategy, perform numerical control center configuration on the lithography machine; The spatial placement position of the lithography target is determined by scanning, converted to the lithography coordinate system, and lithography positioning and frequency modulation control based on the lithography strategy is performed, wherein the lithography coordinate system is a control coordinate system of the lithography machine.

5. The power adaptive control method for laser metal engraving according to claim 1, characterized in that: The integrated grating structure is a redundant structure; If there is a faulty grating unit, a backup unit based on the redundant structure is triggered to perform laser beam combining control.

6. The power adaptive control method for laser metal engraving according to claim 1, characterized in that: After adaptive positioning and frequency modulation management of the laser engraving process of the lithography target, including: Simultaneous lithography monitoring and tracking to determine real-time lithography energy efficiency; According to the position mapping, the real-time lithography energy efficiency and the atlas lithography requirement are checked to locate the work resumption node, wherein the work resumption node is marked with an energy efficiency difference; Assist the lithography controller to determine the resumption frequency modulation strategy based on the resumption node and transmit it to the CNC center of the lithography machine.

7. Power adaptive control system for laser metal engraving, characterized in that: The system is used to implement the power adaptive control method for laser metal engraving according to any one of claims 1 to 6, and the system comprises: A lithography geometry map determination module is used to obtain lithography requirements and lithography target characteristics, perform requirement analysis, and determine a lithography geometry map, wherein the lithography geometry map is marked with a frequency modulation node, and the lithography requirement is 2D etching or 3D etching; A lithography strategy determination module is used to obtain the integrated grating structure of the lithography machine, introduce a lithography controller to make a two-order adjustment decision based on the frequency modulation node according to the lithography geometric map, and determine the lithography strategy, wherein the two-order adjustment includes a first-order beam combining adjustment and a second-order shaping adjustment; The adaptive control module is used for the lithography strategy to respond to the lithography machine, assist the lithography coordinate system, and perform adaptive positioning and frequency modulation management on the laser engraving process of the lithography target.

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