Design and processing method of brazing filler metal for waveguide antenna

Abstract

The invention relates to a design and processing method of brazing filler metal for a waveguide antenna, belongs to the technical field of welding processes, and solves the problems of insufficient welding precision, overlarge welding seam thickness, overlarge using amount of the brazing filler metal and overproof size of a weldment in the prior art. The invention discloses a design method of brazing filler metal for a waveguide antenna. The overall structure of the brazing filler metal is optimized through the steps of overall size design, retention of the brazing filler metal at key positions, technological structure design, size design and the like. By using the brazing filler metal for welding, high-quality welding of a waveguide antenna, especially an aluminum alloy multilayer waveguide dual-frequency polarization composite antenna can be achieved, the welding precision is high, the thickness of a welding seam is small, the using amount of the brazing filler metal is remarkably reduced, the size of a final weldment can meet the design requirement, and the brazing filler metal can be widely applied to welding of various multilayer composite antennas.

Description

Technical Field

[0001] The invention relates to the technical field of welding technology, and in particular to a design and processing method of a solder for a waveguide antenna, and in particular to a design and processing method of a solder for vacuum brazing of an aluminum alloy multilayer waveguide dual-frequency polarization composite antenna. Background Art

[0002] In the field of aerospace, aluminum alloy multilayer waveguide dual-frequency polarization composite antennas are widely used. Compared with traditional waveguide antennas, aluminum alloy multilayer waveguide dual-frequency polarization composite antennas integrate more functions, the internal cavity structure increases dramatically and becomes more complex, the functional area becomes more compact, and they have new features such as many layers, thin parts, high precision, and complex and fine welds. The requirements for the number of welding layers and brazing precision are getting higher and higher. A certain type of aluminum alloy multilayer waveguide dual-frequency polarization composite antenna has 10 welding layers within the dimensions of φ260mm×24.5mm, the typical part thickness is 2mm, and the total length of the internal weld is 66799mm, which is 3 to 8 times that of traditional antennas. There are hundreds of dense welding boss structures with a width of 0.5mm±0.02mm, and the total thickness of the antenna is ±0.05mm.

[0003] Compared with traditional antennas, the number of layers of the aluminum alloy multi-layer waveguide dual-frequency polarization composite antenna has nearly doubled. The internal welds of the antenna are extremely complex and fine, and the total length of the inner cavity and the welds has increased significantly. The accuracy requirements after welding remain unchanged. At the same time, while the volume of the antenna does not change much, the significant increase in the number of welding layers has put forward higher requirements on the welding accuracy of each layer. When welding multi-layer antennas, the welding pressure and the flow of solder affect each other, and ensuring the weld morphology required by the design puts forward strict requirements on the control of welding process parameters and tooling.

[0004] The existing technology uses a whole piece of solder or simply hand-cut solder for vacuum brazing of this type of antenna, which has defects such as unreasonable solder distribution and excessive total amount of solder, resulting in insufficient antenna welding accuracy, too thick welds, poor welding morphology, and excessive volume increase after welding. Summary of the invention

[0005] In view of the above analysis, an embodiment of the present invention aims to provide a design and processing method for solder for waveguide antennas, so as to solve the defects of the existing solder such as unreasonable solder quantity distribution and excessive total solder quantity, and further solve one of the problems of insufficient precision of antenna after welding, too thick weld, poor welding morphology and excessive volume increase after welding.

[0006] The present invention discloses a method for designing a solder for a waveguide antenna, comprising the following steps:

[0007] S1: Set the maximum design size of a single solder, the distance between the solder and the edge of the part to be soldered, and the distance between the single solders;

[0008] S2: partitioning the entire solder into different shapes according to the size of the single solder piece, and setting a disconnection structure of the entire solder at the partition boundary;

[0009] S3: retain the solder body with appropriate width of the waveguide cavity and the outer edge of the part;

[0010] S4: Process the solder shape according to the process function;

[0011] S5: Set a solder body of appropriate width in a large area away from the waveguide cavity and the outer edge of the part;

[0012] S6: Determine the hole size corresponding to the brazing filler metal according to the diameter of the part hole or the frustum;

[0013] S7: Set the break line according to the shape of the waveguide cavity of the part;

[0014] S8: Complete the overall and single-piece design of the solder.

[0015] Specifically, the shape of the single solder piece described in step S1 is designed to have a length of less than 280 mm, a width of less than 150 mm, a distance between the solder piece and the edge of the part ≥ 2 mm, and a distance between the solder pieces ≥ 2 mm.

[0016] Specifically, the disconnection structure described in step S2 is arranged at the entity and weight-reducing part, and shall not be arranged at the power branch nodes, narrow gaps and arcs of the waveguide cavity.

[0017] Specifically, the solid width of the solder in step S3 is 1 to 1.5 mm.

[0018] Specifically, the specific operation of step S4 is to complete the solder shape processing and realize the process function by using straight line connection and rounding.

[0019] Specifically, the solid width of the solder in step S5 is 2 to 3 mm.

[0020] Specifically, the hole size corresponding to the solder sheet in step S6 is 0.3-0.4 mm larger than the part hole or the frustum, and a solder entity with a width of 1.5-3 mm should be retained around the hole.

[0021] The present invention also discloses a method for processing the designed solder, comprising the following steps:

[0022] S21: cutting and leveling the strip solder;

[0023] S22: Prepare laser cutting program according to 2D design graphic file;

[0024] S23: placing the brazing material on a workbench and fixing it;

[0025] S24: After setting the laser process parameters, the equipment automatically completes the laser cutting;

[0026] S25: Remove the solder and clean and dry it.

[0027] Specifically, the laser process parameters in step S24 are: cutting speed 80 mm / s, Q frequency × Q release <1000 Hz·s, current 36-40 A, and cutting times 1-3 times.

[0028] Specifically, the specific operation of removing the solder in step S25 is to use light shaking, flipping and rotating operations to automatically separate the required part of the solder from the base part.

[0029] Compared with the prior art, the present invention can achieve at least one of the following beneficial effects:

[0030] 1. The welding effect is guaranteed under the condition of reducing the amount of solder. By only retaining a certain width of solder sheet on the waveguide cavity and the outer edge of the parts, and setting / reserving a certain width of solder entity in a large blank area, the welding strength is guaranteed and the amount of solder is reduced. And because the amount of solder is reduced, the situation of excessive solder flowing into the waveguide cavity of the waveguide antenna is avoided, and the welding yield and qualified rate of the multi-layer waveguide antenna are improved.

[0031] 2. Good welding morphology consistency and aesthetics. Through the overall and single-piece design of the brazing material, the reasonable amount and distribution of the brazing material, and the use of mature pressure brazing technology, the weld morphology and size (especially thickness) are consistent, which not only ensures the beauty of the weld, but also avoids the situation where the adjacent antenna parts are poorly parallel or have large distance deviations.

[0032] 3. The weld is thin, the size increase after welding is small, and the welding precision is high. By only retaining a certain width of solder sheet on the waveguide cavity and the outer edge of the parts, and setting / reserving a certain width of solder entity in a large blank area, the welding strength is guaranteed and the amount of solder is reduced. And because the amount of solder is reduced, the weld formed is more uniform and thinner, even if it is used for welding multi-layer antenna parts, the size increase after welding can still be guaranteed to be small. It not only improves the welding precision and ensures the welding strength, but also achieves the technical goal of antenna parts meeting the size standards after welding.

[0033] 4. Ultraviolet laser cutting and processing of solder sheets, with smooth edges and no burrs. The present invention uses laser cutting to process solder sheets, which is convenient to operate, fast in processing speed, and high in processing precision, greatly improving the edge surface quality and finished product precision of the solder sheets, which is beneficial to subsequent assembly and brazing operations.

[0034] In the present invention, the above-mentioned technical solutions can also be combined with each other to achieve more preferred combination solutions. Other features and advantages of the present invention will be described in the subsequent description, and some advantages can become obvious from the description, or can be understood by practicing the present invention. The purpose and other advantages of the present invention can be realized and obtained through the contents particularly pointed out in the description and the drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0035] The drawings are only for the purpose of illustrating particular embodiments and are not to be considered limiting of the present invention. Like reference symbols denote like components throughout the drawings.

[0036] Figure 1 Schematic diagram of typical solder design (a);

[0037] Figure 2 Schematic diagram of typical solder design (b);

[0038] Figure 3 Schematic diagram of typical solder design (c);

[0039] Figure 4 Schematic diagram of typical solder design (d);

[0040] Figure 5 The antenna parts design diagram of the first embodiment;

[0041] Figure 6 This is the solder design diagram of Example 1.

[0042] Reference numerals:

[0043] 1- waveguide cavity; 2- weight reduction part (disconnection structure); 3- narrow slit; 4- power branch; 5- entity; 6- chamfered corner; 7- straight line connection; 8- hole (truncated cone); 9- hole; 10- disconnection line DETAILED DESCRIPTION

[0044] The preferred embodiments of the present invention are described in detail below in conjunction with the accompanying drawings, wherein the accompanying drawings constitute a part of this application and are used together with the embodiments of the present invention to illustrate the principles of the present invention, but are not used to limit the scope of the present invention.

[0045] The present invention discloses a method for designing a solder for a waveguide antenna, comprising the following steps:

[0046] S1: Set the maximum design size of a single solder, the distance between the solder and the edge of the part to be soldered, and the distance between the single solders;

[0047] S2: partitioning the entire solder into different shapes according to the size of the single solder piece, and setting a disconnection structure 2 of the entire solder at the partition boundary;

[0048] S3: retaining the solder body 5 of appropriate width on the waveguide cavity 1 and the outer edge of the part;

[0049] S4: Process the solder shape according to the process function;

[0050] S5: a solder body 5 of appropriate width is arranged in a large area far away from the waveguide cavity 1 and the outer edge of the component;

[0051] S6: Determine the size of the hole 9 corresponding to the solder according to the diameter of the part hole 9 or the frustum 8;

[0052] S7: Setting the break line 10 according to the shape of the waveguide cavity of the component;

[0053] S8: Complete the overall and single-piece design of the solder.

[0054] The antenna structure is complex, and the area where the solder needs to be arranged is relatively large. It is necessary to deal with the gaps, steps and other parts in the antenna parts that are not related to the weld, so that the solder as a whole matches the area / weld to be welded. And due to the size limitation of the raw material of the single piece of solder, it is impossible to use a single piece of solder to complete the overall design of the solder. The solder needs to be divided into areas according to the specific size relationship between the part to be welded (antenna) and the single piece of solder, such as Figure 5 The antenna part shown in the figure has a size that exceeds the size of a single piece of solder, so two pieces of solder are needed to complete the overall design of the solder.

[0055] In the solder design process, the principle of minimizing the process structure is to increase the process structure, and the principle of simplification is to increase the process structure. According to the specific structure of the antenna parts, in accordance with the order and requirements of the above steps, the overall structure of the solder is retained and set, and the unnecessary parts of the gaps, steps and other areas in other corresponding parts are removed. Ultimately, the amount of solder is reduced as much as possible while ensuring the structural strength and welding performance of the solder.

[0056] Specifically, the maximum design size of the single-piece solder described in step S1 is less than 280mm in length and less than 150mm in width; the distance between the solder sheet and the edge of the part is ≥2mm and the size of the solder sheet is slightly smaller than the size of the part to ensure that the edge of the solder is flat and easy to position; the distance between the multiple single-piece solders after shape partitioning is ≥2mm to avoid structural interference. In order to prevent the solder sheet from having insufficient structural strength, deformation, fracture, etc., the size of the single-piece solder sheet should not be too large. And due to the size of the raw materials, the shape design length of the single-piece solder is less than 280mm and the width is less than 150mm.

[0057] Specifically, the integral disconnect structure 2 of the solder described in step S2 is arranged on the entity 5 and the weight-reducing part 2 (generally a large blank plane of the corresponding part) of the corresponding part, and shall not be arranged on the power branch node 4, the narrow gap 3 and the arc of the waveguide cavity 1.

[0058] For example, Figure 1 As shown, when the overall shape of each layer of aluminum waveguide product parts is divided by solder, it should be disconnected at the entity and weight-reducing part 2. In the figure, the disconnection structure 2 is set at the weight-reducing part 2 (corresponding to the large blank plane of the part). If it is necessary to disconnect at the waveguide cavity 1, it should not be disconnected at the power branch 4, the narrow gap 3 and the arc, but should be disconnected at the straight line section to facilitate the subsequent operations such as splicing and repairing between the partitions.

[0059] Specifically, the width of the solder body 5 of the waveguide cavity 1 and the outer edge of the part described in step S3 is 1 to 1.5 mm. Retaining the solder of this width can not only ensure high-quality welding and the overall structural strength of the solder sheet, but also reduce the amount of solder used.

[0060] Specifically, the specific operation of step S4 is to complete the solder shape processing and realize the process function by using straight line connection 7 and rounded corner 6. Figure 2 As shown, the principle is to minimize the increase of process structure, and the principle is to simplify the process structure as much as possible. Straight line connection 7 and chamfer 6 are preferably used to complete the shape processing of the solder and realize the process function.

[0061] Specifically, Figure 2 As shown, the width of the solder entity 5 in the large area away from the waveguide cavity 1 and the outer edge of the parts described in step S5 is 2 to 3 mm, which is used to ensure the structural strength of a single solder sheet and avoid the appearance of a large area without solder joints between adjacent antenna parts, which helps to improve the welding strength of the entire welding surface during the welding process. However, the width of the solder entity 5 should not be too wide or too narrow, so as not to waste the solder or affect the welding strength.

[0062] For some new millimeter-wave waveguide antennas, there are large blank areas around the entire welding surface waveguide cavity 1. If these areas are all filled with solder, the excess solder will easily flow into the waveguide cavity 1 during the welding process, thus affecting the electrical performance of the antenna. The previous method was to manually cut off the excess parts. This method can only cut off part of the solder according to a more regular shape, and the consistency is poor. The new process can be fully considered in the solder process drawing design stage. Taking the power splitter-receiving board as an example, the solder part with a width of more than 5mm is removed by the translation of the line around the waveguide cavity, and only the solder entity 5 of 2 to 3mm is retained, which effectively improves the welding processability.

[0063] Specifically, Figure 3 As shown, the size of the corresponding hole 9 of the solder sheet in step S6 is 0.3-0.4 mm larger than the size of the component hole 9 or the truncated cone 8, and a solder entity 5 with a width of 1.5-3 mm should be reserved around the hole 9. While ensuring the welding strength, it is convenient to assemble the antenna component and the solder sheet.

[0064] Specifically, in step S7, Figure 4 As shown, a break line 10 should be designed in the middle of the complex waveguide cavity with continuous turns on the solder sheet to ensure that the solder sheet will not be deformed when this part of the solder is removed after cutting.

[0065] The present invention also discloses a method for processing the solder designed by the above-mentioned design method, comprising the following steps:

[0066] S21: cutting and leveling the strip solder;

[0067] S22: Prepare laser cutting program according to two-dimensional design graphic files;

[0068] S23: placing the brazing material on a workbench and fixing it;

[0069] S24: After setting the laser process parameters, the equipment automatically completes the laser cutting;

[0070] S25: Remove the solder and clean and dry it.

[0071] Specifically, the specific operation of step S21 is to cut the strip solder into sheets 5 mm wider than the solder design drawing according to the size required by the process documents, and use a stainless steel plate to naturally level the aluminum solder sheet. Hot leveling is not allowed to avoid defects such as deformation or uneven thickness of the solder.

[0072] Specifically, the method can be implemented using common laser cutting equipment. When the maximum outer dimension of the solder is smaller than the single-frame dimension of the lens, the ordinary processing mode is used; when the maximum outer dimension of the solder is larger than the single-frame dimension of the lens, the workbench moving processing mode should be used.

[0073] Specifically, the laser process parameters described in step S24 are: cutting speed 80mm / s, Q frequency × Q release <1000Hz·s, current 36~40A, and cutting times 1~3 times. The specific process parameters can be adjusted according to the actual cutting effect. For example, the laser cutting process parameters can be set according to reference Table 1. Q frequency (KHz): Q frequency refers to the number of pulses output by the laser per second. Q release (ms): Q release refers to controlling the output of the laser by controlling the Q switch in the laser marking machine. The opening and closing of the Q switch will cause the pulse output of the laser, thereby realizing laser marking. The laser cutting equipment used in this method is essentially a modified laser marking machine, so the setting of the relevant parameters is similar to that of the laser marking machine.

[0074] Table 1 Recommended laser cutting process parameters

[0075]

[0076] Specifically, the specific operation of step S23 is to place the prepared aluminum solder on the working platform, set the laser focus position, and start the vacuum adsorption system to fix the solder to make it flat.

[0077] Specifically, before officially starting automatic welding, the red light preview mode should be turned on and the placement of the aluminum solder should be adjusted so that the maximum size of the cutting shape falls within its shape range to avoid failure to complete the cutting process and resulting in material waste.

[0078] Specifically, the specific operation of removing the solder in step S25 is to use light shaking, flipping and rotating operations to automatically separate the required part of the solder from the base part to avoid deformation of the solder caused by violent separation.

[0079] Specifically, the cleaning operation described in step S25 is: place the solder in a stainless steel box filled with about 1 / 3 volume of distilled water, float it in an ultrasonic cleaning machine for cleaning, the cleaning time should be controlled within 2 minutes, the number of cleanings should be 2 to 5 times, the water should be changed after each cleaning, and the distilled water should be cleaned until it is not turbid; the solder after cleaning must not be touched by hand, and should be placed on the screen using special tools.

[0080] Specifically, the drying operation described in step S25 is: drying in a drying oven, the heating temperature is 100° C., and the insulation time should be less than 10 minutes to prevent the solder from becoming soft.

[0081] Specifically, during the laser cutting process, no tooling can be placed on the upper surface of the solder foil to block the laser and it can only be fixed at the edge.

[0082] Preferably, in order to avoid the warping and precision problems of the complex and special-shaped foil solder after separation from the substrate during laser etching, a solution of adding 0.1mm breakpoints to the edges of the foil solder to achieve self-positioning can be adopted. Breakpoints are set at intervals of about 30mm. The breakpoints play a positioning role during laser etching to ensure that the required part is not separated from the substrate. When the etching is completed and removed, it is automatically separated due to low connection strength. The purpose of setting breakpoints in the waveguide cavity is to avoid deformation of the connected long strip structure when it is separated from the required part.

[0083] Embodiment and comparative example:

[0084] Embodiment 1: For Figure 5 The antenna parts shown are implemented as follows:

[0085] (1) Solder design process:

[0086] S1: Set the design width of the single solder shape to 145mm and the distance between the solder and the edge of the part to 2.5mm;

[0087] S2: The solder is partitioned into different shapes according to the size of the single solder piece, and a disconnection structure 2 is provided at the solid (weight-reducing) part of the center line in the horizontal direction to divide the solder into two parts, the upper and the lower parts;

[0088] S3: retain the solder entity 5 with a width of 1mm around the waveguide cavity and a width of 1.5mm on the outer edge of the part;

[0089] S4: According to the process function, a straight line connection is used to realize the connection between the middle waveguide retaining strip solder entity 5 and the hole, and a rounded corner 6 is used to realize the connection between the outer edge of the part and the middle waveguide retaining strip solder entity and the connecting solder entity, such as Figure 2 As shown;

[0090] S5: A 2 mm wide solder body 5 is set in the area away from the waveguide cavity, such as Figure 2 As shown;

[0091] S6: Determine the corresponding hole size of the solder sheet φ2.3 according to the two φ2 holes in the part, and retain a solder entity with a width of 1.5mm around hole 9;

[0092] S7: Complete the overall and single-piece design of the solder and export the 2D design graphic file ( Figure 6 ).

[0093] (2) Solder preparation process:

[0094] S21: Cut the strip brazing material into 150 mm pieces and use a stainless steel plate to naturally level the aluminum brazing material sheet;

[0095] S22: Prepare laser cutting program according to 2D design graphic file, and use workbench moving processing mode;

[0096] S23: placing the solder on the workbench and fixing it, setting the laser focus position to 36, and starting the vacuum adsorption system to fix the solder to make it flat;

[0097] S24: Set the laser process parameters: cutting speed 80mm / s, Q frequency 60kHz, Q release 15ms, current 38A, cutting times 1 time, and then the equipment automatically completes the laser cutting;

[0098] S25: Remove the solder by light shaking, turning and rotating, and place it in a stainless steel box filled with about 1 / 3 volume of distilled water. Float it in an ultrasonic cleaner for cleaning. The cleaning time is 2 minutes and the number of cleaning times is 3. The water should be changed after each cleaning. Clean until the distilled water is not turbid. Dry it in a drying oven at a heating temperature of 100°C and a heat preservation time of 5 minutes.

[0099] (3) Specific welding process:

[0100] S31: align the nine-layer solder sheet with the waveguide cavity of the antenna component, flatten it, and fix it on the antenna component by resistance spot welding;

[0101] S32: Assemble the ten-layer antenna parts in sequence using positioning pins;

[0102] S33: Use high-density alloy pressing blocks and mother-sub board tooling to pressurize the assembled antenna. The mother-sub board thickness is 10mm, and the tooling size is 40mm×40mm.

[0103] S34: Put the assembled antenna and tooling into a vacuum brazing furnace for brazing at a temperature of 620°C and a holding time of 5 minutes.

[0104] After the ten-layer antenna is welded, the thickness error is ≤±0.03mm, the brazing fillet is ≤0.1mm, the accuracy is ±0.02mm, the brazing penetration rate around the waveguide cavity is 100%, the residual brazing material thickness is ≤0.005mm, there is no brazing material accumulation, the antenna standing wave and radiation pattern meet the design requirements, which is significantly better than the existing technology.

[0105] Comparative ratio: Figure 5 The antenna parts shown are implemented as follows:

[0106] (1) Solder preparation process:

[0107] S21: According to Figure 5 Compile laser cutting program from 2D design graphic files of antenna parts;

[0108] S22: placing the brazing material on a workbench and fixing the edge with a pressing block;

[0109] S23: Set the laser process parameters: cutting speed 80mm / s, Q frequency 60kHz, Q release 15ms, current 38A, cutting times 1 time, and then the equipment automatically completes the laser cutting;

[0110] S24: Remove the solder by lightly shaking, turning and rotating it, and place it in a stainless steel box filled with about 1 / 3 volume of distilled water. Float it in an ultrasonic cleaner for cleaning. The cleaning time is 2 minutes and the number of cleaning times is 3. The water should be changed after each cleaning. Clean until the distilled water is not turbid. Dry it in a drying oven at a heating temperature of 100°C and a heat preservation time of 5 minutes.

[0111] (2) Specific welding process:

[0112] S31: align the nine-layer solder sheet with the waveguide cavity of the antenna component, flatten it, and fix it on the antenna component by resistance spot welding;

[0113] S32: Assemble the ten-layer antenna parts in sequence using positioning pins;

[0114] S33: pressurizing the assembled antenna using a universal pressing block;

[0115] S34: Put the assembled antenna and tooling into a vacuum brazing furnace for brazing at a temperature of 620°C and a holding time of 5 minutes.

[0116] After the ten-layer antenna is welded, the thickness error is ≤±0.3mm, the brazing fillet is ≤0.3mm, the accuracy is ±0.02mm, the brazing penetration rate around the waveguide cavity is 90%, there is brazing accumulation in the cavity, the antenna standing wave is out of tolerance, the radiation pattern varies, and cannot meet the design requirements.

[0117] The above description is only a preferred specific implementation manner of the present invention, but the protection scope of the present invention is not limited thereto. Any changes or substitutions that can be easily conceived by any technician familiar with the technical field within the technical scope disclosed by the present invention should be covered within the protection scope of the present invention.

Claims

1. A method for designing a solder for a waveguide antenna, characterized in that: The following steps are involved: S1: Set the maximum design size of a single solder, the distance between the solder and the edge of the part to be soldered, and the distance between the single solders; S2: partitioning the entire solder into different shapes according to the size of the single solder piece, and setting a disconnection structure of the entire solder at the partition boundary; S3: Keep the solder body of the waveguide cavity and the outer edge of the part with appropriate width; S4: Process the solder shape according to the process function; S5: Set a solder body of appropriate width in a large area away from the waveguide cavity and the outer edge of the part; S6: Determine the hole size corresponding to the brazing filler metal according to the diameter of the part hole or the frustum; S7: Set the break line according to the shape of the waveguide cavity of the part; S8: Complete the overall and single-piece design of the solder.

2. The design method according to claim 1, characterized in that: The single-piece solder shape design described in step S1 has a length of less than 280 mm, a width of less than 150 mm, a distance between the solder piece and the edge of the part ≥ 2 mm, and a distance between the solder pieces ≥ 2 mm.

3. The design method according to claim 1, characterized in that: The disconnection structure described in step S2 is arranged at the entity and weight-reducing part, and shall not be arranged at the power branch nodes, narrow slits and arcs of the waveguide cavity.

4. The design method according to claim 1, characterized in that: The solid width of the solder in step S3 is 1 to 1.5 mm.

5. The design method according to claim 1, characterized in that: The specific operation of step S4 is to complete the solder shape processing and realize the process function by using straight line connection and rounding.

6. The design method according to claim 1, characterized in that: The solid width of the solder in step S5 is 2 to 3 mm.

7. The design method according to claim 1, characterized in that: In step S6, the corresponding hole size of the solder sheet is 0.3-0.4 mm larger than the part hole or the frustum, and a solder entity with a width of 1.5-3 mm should be retained around the hole.

8. A method for processing solder designed by any one of claims 1 to 7, characterized in that: The following steps are involved: S21: cutting and leveling the strip solder; S22: Prepare laser cutting program according to two-dimensional design graphic files; S23: placing the brazing material on a workbench and fixing it; S24: After setting the laser process parameters, the equipment automatically completes the laser cutting; S25: Remove the solder and clean and dry it.

9. The processing method according to claim 8, characterized in that: The laser process parameters in step S24 are: cutting speed 80 mm / s, Q 频 ×Q 释放 <1000Hz·s, current 36~40A, cutting times 1~3 times.

10. The processing method according to claim 8, characterized in that: The specific operation of removing the solder in step S25 is to use light shaking, flipping and rotating operations to automatically separate the required part of the solder from the base part.

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