Method for improving milling burrs of PTFE high-frequency board

Abstract

The invention discloses a method for improving plate milling burrs of a PTFE high-frequency plate, and relates to the field of circuit board production, and the method comprises the following steps: carrying out pre-process treatment on the PTFE high-frequency plate; the PTFE high-frequency plate passes through a finished product cleaning line; curing the water films on the two surfaces of the PTFE high-frequency plate, and baking the plate; placing the PTFE high-frequency board subjected to board baking and curing on a milling machine for board milling; enabling the formed PTFE high-frequency plate to pass through a finished product cleaning line so as to remove the water film on the PTFE high-frequency plate surface; enabling the PTFE high-frequency plate after the film is withdrawn to pass through a finished product cleaning line, and synchronously sampling for testing the adhesive force of printing ink; transferring to the next process; the water film is cured on the surface of the PTFE high-frequency board, so that the cured water film provides sufficient adsorption force and supporting force for the PTFE high-frequency board in the board milling process, burrs are prevented from being generated in the board milling process, the water film is removed through water washing, the risk that the adhesive force of ink becomes poor is avoided, and the yield and quality of the PTFE high-frequency board are improved.

Description

Technical Field

[0001] The invention relates to the field of circuit board production, in particular to a method for improving burrs of a PTFE high-frequency gong plate. Background Art

[0002] In the field of electronic manufacturing, PTFE high-frequency boards have unique material properties and are significantly different from common ordinary epoxy resin circuit boards in the manufacturing and processing process, which makes their processing more difficult. Among them, the problem of burrs in the gong plate link is particularly prominent. PTFE material is soft in texture. When the PTFE high-frequency board is gonged, the areas on the PTFE high-frequency board that are not covered by ink and copper foil, when the gong knife is pushed forward, the thrust generated by it can easily cause a large number of burrs on the edge of the gong plate. In places covered with ink and copper foil, copper has a certain adsorption force on PTFE resin, and the ink can also adsorb the resin after curing, so that these positions will not have burrs when gonging. However, the design schemes of circuit boards are diverse, and the gong plate position cannot be covered with ink everywhere, and copper foil is not planned for all parts, so the burr problem cannot be solved by increasing the ink coverage area on the edge of the gong plate.

[0003] At the same time, the industry has also tried many other improvement measures. For example, replacing special tools, starting new gong knives, and even sacrificing tool life to reduce the amount of burrs generated during gonging, but practice has shown that these methods have little effect on improving the problem of burrs. Another idea is to cover the PTFE high-frequency board with a copper-etched bare board when gonging, trying to simulate the effect of covering ink, so as to give support and adsorption force to the PTFE resin at the gong position. Unfortunately, since the area without ink is lower than the area covered with ink, the bare board and the substrate cannot fit tightly, and there is a suspended gap, which makes it impossible to effectively provide sufficient support for the PTFE resin. In the end, burrs still frequently appear during gonging. In addition, the dry film is used to simulate the ink function, provide support and adsorption for the PTFE resin, and then gong. After the gong is completed, the dry film is removed through the film removal section. However, in this method, the strong alkaline solution used to fade the film will "attack" the original ink, increasing the risk of poor ink adhesion and making it difficult to guarantee product quality. Therefore, this method is also difficult to implement. Summary of the invention

[0004] The purpose of the present invention is to provide a method for improving the burrs of a PTFE high-frequency plate gong plate, by solidifying water film on the surface of the PTFE high-frequency plate, so that the solidified water film can provide sufficient adsorption and supporting force to the PTFE high-frequency plate during the gong process, thereby avoiding the generation of burrs during the gong process, and by washing and dehydrating the film, avoiding the risk of poor ink adhesion, thereby improving the yield and quality of the PTFE high-frequency plate.

[0005] The above-mentioned optimized structure of the present invention is realized by the following technical scheme: A method for improving the burrs of a PTFE high-frequency gong plate comprises the following steps: Step S1: performing pre-processing on the PTFE high-frequency board; Step S2: passing the PTFE high-frequency board through a finished product cleaning line to clean the surface of the PTFE high-frequency board; Step S3: curing the water film on both sides of the PTFE high-frequency plate and baking the plate, so that the water film can provide adsorption and support force when the PTFE high-frequency plate is gonged; Step S4: placing the PTFE high-frequency plate after curing on the baking plate on a gong machine for gong; Step S5: passing the formed PTFE high-frequency board through a finished product cleaning line to remove the water film on the surface of the PTFE high-frequency board; Step S6: the PTFE high-frequency board after dewatering the film passes through the finished product cleaning line to clean the surface of the PTFE high-frequency board, and samples are simultaneously taken for ink adhesion test; Step S7: Go to the next process.

[0006] In some embodiments, S3 includes the following steps: Step S31, using a screen printer to screen print water film on one side of the cleaned PTFE high-frequency board, and then using a kilo-layer rack to place the board after single-sided screen printing, with the printed side facing upward and the unprinted side in contact with the kilo-layer rack; Step S32, placing the PTFE high-frequency board with the water film printed on one side into a vertical furnace for baking; Step S33, using a screen printer to screen print water film on the unprinted side of the PTFE high-frequency board after the board is baked, and after single-sided screen printing is completed, use a kimono rack to place the board, with the newly printed side facing up; Step S34, placing the PTFE high-frequency plate in a vertical furnace for secondary baking.

[0007] In some embodiments, in step S31 and step S33, the screen printer uses an 18T white screen, a scraper speed of 130-180 mm / sec, and a pressure of 60-85 kgf / cm 2 The scraper pressure is high to screen print water film on the PTFE high frequency board.

[0008] In some embodiments, in step S32 and step S34, during the baking process, the temperature of the vertical furnace is 95°-110°, and the baking time is 8 min-11 min.

[0009] In some embodiments, in step S2 and step S6, the PTFE high-frequency board passes through the finished product washing line at a speed of 4.2-4.8 m / min, and the water washing pressure of the finished product washing line is 0.8-1.1 kg / cm 2 .

[0010] In some embodiments, in step S5, the PTFE high-frequency board passes through the finished product washing line at a speed of 3.9-4.2 m / min, and the water washing pressure of the finished product washing line is 1.1-1.4 kg / cm 2 .

[0011] In some embodiments, in step S5, before the PTFE high-frequency board passes through the finished product cleaning line, the pickling section before the finished product cleaning line is closed.

[0012] In some embodiments, in step S4, three PTFE high-frequency plates cured by baking are stacked together and covered with a common pad.

[0013] In some embodiments, in step S4, batch production of PTFE high-frequency plates is started only after the first PTFE high-frequency plate is confirmed to be qualified.

[0014] In some embodiments, in step S6, the test result of the ink adhesion of the PTFE high-frequency board needs to meet the requirement that the 3M glue does not fall off when being pulled three times continuously at the same position.

[0015] One or more of the above technical solutions in the embodiments of the present invention have at least the following technical effects or advantages: By solidifying the water film on the surface of the PTFE high-frequency board, the solidified water film provides sufficient adsorption and supporting force for the PTFE high-frequency board, so that in the gong process, the cutting of the flexible material by the tool is converted into the overall cutting of the flexible material coated with the hard material by the tool, so that the tool can cut the material more smoothly, avoiding the generation of burrs on the cutting edge of the PTFE high-frequency board, and removing the water film on the surface of the PTFE high-frequency board by water washing, avoiding the risk of poor adhesion of the ink on the PTFE high-frequency board due to the strong alkaline solution, thereby improving the yield and quality of the PTFE high-frequency board. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0017] Figure 1 It is a process flow chart of the present invention. DETAILED DESCRIPTION

[0018] Embodiments of the present invention are described in detail below, examples of which are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are intended to be used to explain the present invention, and should not be construed as limiting the present invention.

[0019] In the description of the present invention, it should be understood that the terms "length", "width", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating the orientation or position relationship are based on the orientation or position relationship shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0020] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present invention, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0021] In the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0022] refer to Figure 1 A method for improving the burrs of PTFE high-frequency gong plates includes the following processing steps in sequence: Operation process: pre-process, cleaning the board surface, screen printing the first side of the water film, first board baking, screen printing the second side of the water film, second board baking, gong board, dewatering film, finished product cleaning, next process.

[0023] The specific processing steps are as follows: Step S1: Pre-process: completing the normal process of characters, etc. This is the prior art and has no impact on the entire method.

[0024] Step S2: Cleaning the board surface: Send the PTFE high-frequency board after the previous process to the finished product cleaning line before testing. The PTFE high-frequency board can move at a speed of 4.5m / min. The finished product cleaning line can clean the PTFE high-frequency board once at a water washing pressure of 1.0kg / cm² to ensure that the PTFE high-frequency board surface is clean and free of impurities, which is convenient for the subsequent curing of the water film and avoids the presence of impurities affecting the connection strength between the water film and the PTFE high-frequency board surface, thereby ensuring that the PTFE high-frequency board is in the gong plate. The solidified water film can provide sufficient adsorption and support force to avoid the generation of burrs during the gong plate process.

[0025] Step S3: Curing water film on both sides of the PTFE high-frequency board: Step S31, screen printing the first side of the water film: use 18T white screen, on the character screen printer, with a scraper speed of 130-180mm / sec, 60-85kgf / cm 2 The PTFE high-frequency board is printed on one side with the scraper pressure. After printing, the PTFE high-frequency board is placed on the melaleuca rack with the printed side facing up and the unprinted side in contact with the melaleuca rack to prevent the melaleuca rack from scratching the silk-screened water film on the PTFE high-frequency board, thereby ensuring the connection strength between the water film and the PTFE high-frequency board surface.

[0026] Step S32, first board baking: put the PTFE high-frequency board with single-sided screen printing of water film into a vertical furnace, the baking temperature can be 95°-110°, the baking time can be 8min-11min, so that the water film is solidified and a film layer is formed on the PTFE high-frequency board.

[0027] Step S33, screen printing the second side of the water film: send the PTFE high-frequency board after the first baking to the character screen printer again, use 18T white screen, and single-sided print the other side that is not screen-printed at a scraper speed of 130-180mm / sec and a scraper pressure of 60-85kgf / cm2. After printing, place the PTFE high-frequency board on the melaleuca rack with the printed side facing up to avoid contact between the uncured water film and the melaleuca rack, making the water film on the PTFE high-frequency board uneven, thereby affecting the connection strength between the water film and the PTFE high-frequency board after curing.

[0028] Step S34, second board baking: put the PTFE high-frequency board with the second side of the water film printed on it into the vertical furnace again, the baking temperature can be 95°-110°, the baking time can be 8min-11min, and ensure that the water film is completely cured so that both sides of the PTFE high-frequency board are covered with a layer of film.

[0029] By covering both surfaces of the PTFE high-frequency plate with a layer of film formed by solidified water film, the solidified water film provides sufficient adsorption and supporting force for the PTFE high-frequency plate. Therefore, during the gong-rolling process of the PTFE high-frequency plate, the cutting of the flexible material by the tool is converted into the overall cutting of the flexible material clamped in the middle of the hard material, so that the tool can cut the material more smoothly, inhibiting the formation of burrs during the gong-rolling process of the PTFE high-frequency plate, thereby avoiding the generation of burrs during the gong-rolling process.

[0030] Step S4: gong plate: place the PTFE high-frequency plate after curing on the baking plate on the gong machine for gonging. In order to improve the efficiency of gonging, three PTFE high-frequency plates after curing on the baking plate can be stacked together, and a common pad can be placed on top for gonging. Three PTFE high-frequency plates are stacked together for gonging. While improving the efficiency of gonging, mutual forces can be formed between the bonding surfaces of the PTFE high-frequency plates, and the adsorption force between the cured water film and the surface of the PTFE high-frequency plate can be improved. When the PTFE high-frequency plate is gonged, it works together with the cured water film on the surface of the PTFE high-frequency plate to improve the support force of the single PTFE high-frequency plate, further inhibit the formation of burrs in the gonging process of the PTFE high-frequency plate, and avoid the generation of burrs in the gonging process.

[0031] Before batch gong plate, first confirm the first piece, that is, first use the first piece of PTFE high-frequency board for gong plate to confirm whether the PTFE high-frequency board after gong plate is qualified. After the first piece of PTFE high-frequency board is confirmed to be qualified, batch gong plate will be started. Avoid the influence of parameter adjustments during the gong plate process on the burrs during the gong plate process, avoid the production of batch defective products, and reduce the product defect rate. Pay special attention to handling with care during the gong plate process to avoid damage to the PTFE high-frequency board after gong plate, so as to ensure the yield rate of PTFE high-frequency board.

[0032] Step S5: Dewatering film: The formed PTFE high-frequency board is passed through the finished product cleaning line at a speed of 3.9-4.2m / min. The water washing pressure of the finished product cleaning line is 1.1-1.4kg / cm2 to remove the water film on the surface of the PTFE high-frequency board. Before the PTFE high-frequency board passes through the finished product cleaning line, the pickling section before the finished product cleaning line needs to be closed to avoid the influence of the pickling liquid in the pickling section on the dewatering of the water film, so as to ensure that the water film can be dewatered quickly and effectively. After passing through the finished product cleaning line, it is necessary to check whether there are burrs on the edges of the PTFE high-frequency board to achieve the desired gong plate effect.

[0033] Step S6: Finished product cleaning: After the film is dewatered, the PTFE high-frequency board passes through the finished product cleaning line again at a speed of 4.2-4.8m / min. The water washing pressure of the finished product cleaning line is 0.8-1.1kg / cm2. The residual impurities on the surface of the PTFE high-frequency board are removed by the water pressure of the finished product cleaning line, thereby cleaning the board surface and facilitating the subsequent processing of the PTFE high-frequency board. After the cleaning is completed, the PTFE high-frequency board is sampled for ink adhesion test, and the test results need to meet the requirement that the 3M glue is pulled three times continuously at the same position without oil falling. 3M glue refers to the general term for many adhesive products under 3M Company, covering various types such as double-sided tape, foam glue, electrical tape (polyvinyl chloride electrical insulation tape). It has the characteristics of fast curing, high-strength bonding, heat and moisture resistance, environmental protection and safety, which can achieve efficient testing and accurate test results. Here, 3M glue can use PP resin hot melt adhesive.

[0034] Step S7: Next process: Go to the next process as normal according to the process.

[0035] The water film in the present invention can adopt the WD-7013 hydrolysis coating of Shenzhen Liuxin. The main components of the water film are 80% water-based acrylic resin, 5% color filler, 5% additive and 10% water. The product is pollution-free, non-flammable and non-explosive, smooth and non-sticky, quickly dissolves in water, is clean and thorough, does not require special liquid medicine treatment, has a faster dissolution speed when heated, has good printability, does not block the screen, has good covering power of the printed coating, and can be cured at high temperature, providing adsorption and support for the PTFE high-frequency board when it is on the gong plate.

[0036] The specific working principle is as follows: Before the PTFE high-frequency board is subjected to the gong operation, the present invention passes through the finished product water washing line to clean the PTFE high-frequency board, and then screen prints water film on the two surfaces of the PTFE high-frequency board through a screen printer, solidifies the water film through a vertical furnace, forms a film film on the PTFE high-frequency board, and makes the water film and the PTFE high-frequency board have sufficient adsorption force, so that during the gong process of the PTFE high-frequency board, two solidified water film layers are coated on the outside of the PTFE high-frequency board, providing sufficient support force for the PTFE high-frequency board, so that during the gong process, the cutting of the softer material is converted into the overall cutting of the softer material and the hard material, so that the tool can cut the material more smoothly and reduce the generation of burrs. Finally, the water film is easy to wash by water, and the water film is removed through the finished product washing line, and then the surface of the PTFE high-frequency board is cleaned through the finished product washing line, so as to ensure the cleanliness of the surface of the PTFE high-frequency board and facilitate the subsequent treatment of the PTFE high-frequency board.

[0037] Example 1 In step S2, the board surface cleaning speed is 4.5 m / min, and the board surface cleaning water pressure is 1.0 kg / cm².

[0038] In step S3, the screen printing scraper speed is 150 mm / sec, the screen printing scraper pressure is 70 kgf / cm², the baking plate temperature is 100°, and the baking plate time is 10 min.

[0039] Example 2 (lowering screen printing parameters) In step S2, the board surface cleaning speed is 4.5 m / min, and the board surface cleaning water pressure is 1.0 kg / cm².

[0040] In step S3, the screen printing scraper speed is 130 mm / sec (reduced), the screen printing scraper pressure is 60 kgf / cm² (reduced), the baking plate temperature is 100°, and the baking plate time is 10 min.

[0041] Example 3 (Adjusting the screen printing parameters) In step S2, the board surface cleaning speed is 4.5 m / min, and the board surface cleaning water pressure is 1.0 kg / cm².

[0042] In step S3, the screen printing scraper speed is 180 mm / sec, the screen printing scraper pressure is 85 kgf / cm², the baking plate temperature is 100°, and the baking plate time is 10 min.

[0043] Example 4 (lowering the baking sheet parameters) In step S2, the board surface cleaning speed is 4.5 m / min, and the board surface cleaning water pressure is 1.0 kg / cm².

[0044] In step S3, the screen printing scraper speed is 150 mm / sec, the screen printing scraper pressure is 70 kgf / cm², the baking plate temperature is 95° (reduced), and the baking plate time is 8 min (shortened).

[0045] Example 5 (Adjusting the parameters of the baking plate) In step S2, the board surface cleaning speed is 4.5 m / min, and the board surface cleaning water pressure is 1.0 kg / cm².

[0046] In step S3, the screen printing scraper speed is 150 mm / sec, the screen printing scraper pressure is 70 kgf / cm², the baking plate temperature is 110°, and the baking plate time is 11 min.

[0047] Example 6 (Adjusting the parameters for cleaning the plate surface) In step S2, the board surface cleaning speed is 4.8 m / min, and the board surface cleaning water pressure is 0.8 kg / cm².

[0048] In step S3, the screen printing scraper speed is 150 mm / sec, the screen printing scraper pressure is 70 kgf / cm², the baking plate temperature is 100°, and the baking plate time is 10 min.

[0049] The burrs of the PTFE high-frequency plate behind the gong plate in the above embodiment were checked, and the test results are shown in the following table:

[0050] illustrate: Experimental quantity: the number of PTFE high-frequency plates tested in each example.

[0051] Number of burr-free plates: In each embodiment, the number of PTFE high-frequency plates with a smooth and burr-free rear surface of the gong plate.

[0052] Qualified rate: the percentage of burr-free number to the number of experiments, that is, qualified rate = (burr-free number / number of experiments) × 100%.

[0053] As can be seen from the table, according to the parameter operation of Example 1, the surface of the PTFE high-frequency board after gong plate is smooth and burr-free, and the highest qualified rate is obtained; in Example 2, due to the reduction of silk screen parameters, the coverage thickness of the water film on the PTFE high-frequency board is insufficient, the strength of the film formed after curing is insufficient, and burrs are generated during the gong plate process; in Example 3, due to the improvement of silk screen parameters, the coverage of the water film on the PTFE high-frequency board is uneven, the strength of the film formed after curing is insufficient, and burrs are generated during the gong plate process; in Example 4, due to the reduction of baking plate parameters, the water film on the PTFE high-frequency board failed to be completely cured, the strength of the formed film was insufficient, and burrs were generated during the gong plate process; in Example 5, due to the improvement of baking plate parameters, the water film was completely cured on the PTFE high-frequency board, but the brittleness of the formed film was insufficient, so that the cured water film was easily broken during the gong plate process, thereby generating burrs; in Example 6, due to the improvement of cleaning board parameters, the PTFE high-frequency board was not thoroughly cleaned, resulting in the presence of impurities in the cured water film, affecting the adsorption force between the water film and the PTFE high-frequency board, thereby generating burrs during the gong plate process. Therefore, in actual production, the parameters in Example 1 should be strictly followed to ensure product quality and pass rate.

[0054] The PTFE high-frequency plate obtained in the above embodiment was passed through a finished product cleaning line at a speed of 3.9-4.2 m / min and a water washing pressure of 1.1-1.4 kg / cm2 to dehydrate the film, and then passed through a finished product cleaning line at a speed of 4.2-4.8 m / min and a water washing pressure of 0.8-1.1 kg / cm2 to clean the finished product. After testing, the requirements of 3M glue not losing oil when being pulled three times in a row at the same position were met.

[0055] The above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit the same. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that the technical solutions described in the aforementioned embodiments may still be modified, or some of the technical features may be replaced by equivalents. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A method for improving the burrs of PTFE high-frequency gong plates, characterized in that: The following steps are involved: Step S1: performing pre-processing on the PTFE high-frequency board; Step S2: passing the PTFE high-frequency board through a finished product cleaning line to clean the surface of the PTFE high-frequency board; Step S3: curing the water film on both sides of the PTFE high-frequency plate and baking the plate, so that the water film can provide adsorption and support force when the PTFE high-frequency plate is gonged; Step S4: placing the PTFE high-frequency plate after curing on the baking plate on a gong machine for gong; Step S5: passing the formed PTFE high-frequency board through a finished product cleaning line to remove the water film on the surface of the PTFE high-frequency board; Step S6: the PTFE high-frequency board after dewatering the film passes through the finished product cleaning line to clean the surface of the PTFE high-frequency board, and samples are simultaneously taken for ink adhesion test; Step S7: Go to the next process.

2. A method for improving burrs of PTFE high-frequency gong plates according to claim 1, characterized in that: The step S3 comprises the following steps: Step S31, using a screen printer to screen print water film on one side of the cleaned PTFE high-frequency board, and then using a kilo-layer rack to place the board after single-sided screen printing, with the printed side facing upward and the unprinted side in contact with the kilo-layer rack; Step S32, placing the PTFE high-frequency board with the water film printed on one side into a vertical furnace for baking; Step S33, using a screen printer to screen print water film on the unprinted side of the PTFE high-frequency board after the board is baked, and after single-sided screen printing is completed, use a kimono rack to place the board, with the newly printed side facing up; Step S34, placing the PTFE high-frequency plate in a vertical furnace for secondary baking.

3. A method for improving burrs of PTFE high-frequency gong plates according to claim 2, characterized in that: In step S31 and step S33, the screen printer uses an 18T white screen, a scraper speed of 130-180 mm / sec, and a pressure of 60-85 kgf / cm 2 The scraper pressure is high to screen print water film on the PTFE high frequency board.

4. A method for improving burrs of PTFE high-frequency gong plates according to claim 2, characterized in that: In the step S32 and the step S34, during the baking process, the temperature of the vertical furnace is 95°-110°, and the baking time is 8 min-11 min.

5. A method for improving burrs of PTFE high-frequency gong plates according to claim 1, characterized in that: In step S2 and step S6, the PTFE high-frequency board passes through the finished product washing line at a speed of 4.2-4.8 m / min, and the water washing pressure of the finished product washing line is 0.8-1.1 kg / cm 2 .

6. A method for improving burrs of PTFE high-frequency gong plates according to claim 1, characterized in that: In step S5, the PTFE high-frequency board passes through the finished product washing line at a speed of 3.9-4.2 m / min, and the water washing pressure of the finished product washing line is 1.1-1.4 kg / cm 2 .

7. A method for improving burrs of PTFE high-frequency gong plates according to claim 1, characterized in that: In the step S5, before the PTFE high-frequency board passes through the finished product cleaning line, the pickling section before the finished product cleaning line is closed.

8. A method for improving burrs of PTFE high-frequency gong plates according to claim 1, characterized in that: In step S4, three PTFE high-frequency plates are stacked together after curing on the baking plates, and a common pad is placed on top.

9. The method for improving burrs of PTFE high-frequency gong plates according to claim 1, characterized in that: In the step S4, the batch production of PTFE high-frequency plates is started only after the first PTFE high-frequency plate is confirmed to be qualified.

10. The method for improving burrs of PTFE high-frequency gong plates according to claim 1, characterized in that: In step S6, the test result of the ink adhesion of the PTFE high-frequency board needs to meet the requirement that the 3M glue does not fall off when being pulled three times continuously at the same position.

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