A high-temperature resistant screen printing ink for chips and its preparation method

Abstract

This application relates to the technical field of chip printing inks. More specifically, it relates to a high-temperature resistant ink for chip screen printing and a preparation method thereof. The high-temperature resistant ink for chip screen printing is prepared from the following raw materials in parts by weight: 50-60 parts of silicone resin, 10-20 parts of epoxy resin, 2-6 parts of curing agent, 2-8 parts of auxiliary agent, 40-60 parts of solvent, and 0-5 parts of pigment. The high-temperature resistant ink for chip screen printing prepared by using the above raw materials has good high-temperature resistance and adhesion performance. During the use of the chip, the ink is not easy to change color or fall off.

Description

Technical Field

[0001] This application relates to the technical field of chip printing inks, and more specifically, to a high-temperature resistant ink for chip screen printing screens and a preparation method thereof. Background Art

[0002] After the production of chips, SMT processing is required during the preparation process to obtain qualified chips. Before SMT processing, a layer of protective ink needs to be coated on the chip surface to protect the chip from damage during SMT processing and subsequent use. Generally, the main protective inks are UV system resin inks. UV system resin inks include resins, monomers, additives, and photoinitiators. UV system resin inks cure quickly and have become the first choice for most merchants. However, during SMT processing, the temperature can reach 220 - 260 °C. Under high-temperature conditions, the cured protective ink layer will discolor. When the SMT processing time is a bit longer, there may even be a situation of falling off. Therefore, improvement is needed. Summary of the Invention

[0003] In order to improve the problem of the influence of high temperature on the protective ink layer during SMT processing, this application provides a high-temperature resistant ink for chip screen printing screens and a preparation method thereof.

[0004] In the first aspect, this application provides a high-temperature resistant ink for chip screen printing screens, adopting the following technical solution:

[0005] A high-temperature resistant ink for chip screen printing screens, the high-temperature resistant ink for chip screen printing screens is prepared from the following raw materials in parts by weight:

[0006] 50 - 60 parts of silicone resin

[0007] 10 - 20 parts of epoxy resin

[0008] 2 - 6 parts of curing agent

[0009] 1 - 2 parts of auxiliary agent

[0010] 40 - 60 parts of solvent

[0011] 0 - 5 parts of pigment.

[0012] Preferably, the silicone resin is polymethylphenyl silicone resin and polyaryl silicone resin, wherein, the weight part of polymethyl silicone resin is 20 - 25 parts, and the weight part of polyaryl silicone resin is 30 - 35 parts;

[0013] Preferably, the epoxy value of the epoxy resin is 2 - 10 eq / 100g.

[0014] By adopting the above technical solutions, the high-temperature resistant screen printing ink for chips prepared has good high-temperature resistance and adhesion performance. Among them, silicone resin can improve the high-temperature resistance of the ink, so that there is no yellowing or blistering phenomenon during the SMT process of the chips. Although silicone resin can improve the high-temperature resistance, it will cause the adhesion performance of the ink to decline, making the ink unable to stably adhere to the surface of the chips. In this regard, in this application, epoxy resin with a specific epoxy value is added and used in combination with silicone resin to further improve the adhesion performance and printing performance of the ink system. When epoxy resin and silicone resin are cured, a highly cross-linked network structure will be generated, and this network structure will stably adhere to the surface of the chips and has good strength, and is not easy to discolor or fall off.

[0015] The curing agent causes the silicone resin and epoxy resin to cure into a film, improving the hardness, heat resistance temperature and adhesion fastness of the cured ink layer.

[0016] Preferably, the high-temperature resistant screen printing ink for chips also includes 5-10 parts by weight of vinyl ester resin, and at 25 °C, the viscosity is 800-5000 cps.

[0017] By adopting the above technical solutions, the corrosion resistance and adhesion performance of the ink system are improved. At the same time, vinyl ester resin can also improve the gloss of the ink. The curing of vinyl ester resin and epoxy resin can form a three-dimensional network structure with stable structure and good adhesion performance, improving the adhesion stability between the ink layer and the chips.

[0018] Preferably, the high-temperature resistant screen printing ink for chips also includes 1-2 parts by weight of defoaming agent, and the defoaming agent is polyether modified silicone defoaming agent.

[0019] By adopting the above polyether modified silicone defoaming agent, the bubbles generated during the preparation of the ink are reduced, making the ink system more delicate and obtaining a smooth ink layer during the printing process.

[0020] Preferably, the auxiliary agent is antioxidant or ultraviolet resistant agent.

[0021] By adopting the above technical solutions, the aging resistance of the ink is improved, the influence of external environmental changes on the ink layer on the surface of the chips is reduced, so that the ink layer can maintain good gloss for a long time and is not easy to discolor.

[0022] Preferably, the high-temperature resistant screen printing ink for chips also includes 5-10 parts by weight of lubricant, and the lubricant is prepared from talcum powder, glycerol and tween according to the weight ratio of (10-15):(5-10):3.

[0023] By adopting the above lubricant, the ink flows smoothly without blockage during screen printing. At the same time, the fluidity between silicone resin, epoxy resin and vinyl ester resin is improved, enabling the silicone resin, epoxy resin and vinyl ester resin to penetrate each other, which is beneficial to film formation. Among them, while talcum powder improves the fluidity of the ink system, it can further enhance the strength of the ink layer. Glycerol and Tween can further reduce the surface tension of silicone resin, epoxy resin and vinyl ester resin, promote the fusion of silicone resin, epoxy resin and vinyl ester resin, and improve the high-temperature resistance, adhesion performance and printing performance of the ink.

[0024] Preferably, the high-temperature resistant ink for chip screen printing screen further comprises 5-10 parts by weight of melamine formaldehyde resin, and the density of the melamine formaldehyde resin is 1.13-1.14 g / cm 3 。

[0025] By adding melamine formaldehyde resin to the ink, the high-temperature resistance, adhesion and water resistance of the ink can be further improved.

[0026] Preferably, the high-temperature resistant ink for chip screen printing screen further comprises 1-2 parts by weight of leveling agent, and the leveling agent is BD-3033H, BD-2051, BD-3232, BD-252 or BD-3310.

[0027] The fluidities of silicone resin, epoxy resin and melamine formaldehyde resin are different, which is not conducive to the flow of the ink. By adopting the above leveling agent, the surface tension of silicone resin, epoxy resin and melamine formaldehyde resin is reduced during the preparation of the ink, the leveling property and uniformity of the ink are improved, which is beneficial to the screen plugging of the ink, so that the protective ink layer has good heat resistance and adhesion performance.

[0028] Preferably, the solvent is at least one of toluene, ethyl acetate, xylene and ethanol.

[0029] By adopting the above solvent, it is beneficial to the mixing of silicone resin and epoxy resin, and further enables the silicone resin, epoxy resin, additives and pigments in the ink to be mixed evenly, obtaining an ink with a stable system.

[0030] Preferably, the curing agent is prepared by mixing naphthenate and polyamide-type compound in a weight ratio of (1-2):1.

[0031] By adopting the above curing agent, the ink system can be quickly cured after printing and stably adhered to the surface of the chip. By controlling the dosage ratio of naphthenate and polyamide-type compound, the curing degree of silicone resin and epoxy resin is controlled, so that the cured ink has good heat resistance, adhesion strength and hardness at the same time.

[0032] Preferably, the naphthenate is zinc naphthenate, cobalt naphthenate or lead naphthenate.

[0033] Preferably, the polyamide-type compound is polyamide curing agent 650, polyamide curing agent 651 or polyamide curing agent 300.

[0034] In a second aspect, the present application provides a preparation method for a high-temperature resistant ink for chip screen printing screens, adopting the following technical solutions:

[0035] A preparation method for a high-temperature resistant ink for chip screen printing screens includes the following preparation steps:

[0036] S1. Mix the solvent, silicone resin and other resins evenly, add them to the reaction device for dispersion, then add epoxy resin and lubricant while stirring, evacuate the air, grind and stir until viscous, with a viscosity of 1000 - 1100 cps;

[0037] S2. Break the vacuum, then add raw materials other than additives, pigments and curing agents, evacuate the air, grind and stir, break the vacuum, and discharge to obtain a high-temperature resistant ink for chip screen printing screens.

[0038] By adopting the above technical solutions, a delicate and uniform ink system is obtained, and it can be stored for a long time without stratification. First, the silicone resin is mixed with the solvent, so that part of the silicone is dissolved, which is convenient for subsequent grinding. The compatibility between the silicone resin and the epoxy resin is poor. Therefore, the solvent and the silicone resin are first mixed and stirred to disperse the silicone resin, reduce the internal cohesion between the silicone resin molecules, and then the epoxy resin and the lubricant are added to the dispersed silicone resin to improve the compatibility between the silicone resin and the epoxy resin. In order to further enable the silicone resin and the epoxy resin to be stably stored, by means of vacuum grinding, the viscosity of the ground product reaches 1000 - 1100 cps, so that the silicone resin and the epoxy resin can coexist stably and are convenient for use.

[0039] Preferably, the grinding and stirring speed in step S1 is 2500 - 3000 r / min.

[0040] In summary, the present application has the following beneficial effects:

[0041] 1. This application uses silicone resin, epoxy resin, curing agent, additives, solvent and pigment. Among them, the silicone resin is polymethyl silicone resin and polyaryl silicone resin, and the epoxy value of the epoxy resin is 2-10 eq / 100g to prepare a high-temperature resistant ink for chip screen printing, which can improve the high-temperature resistance and adhesion performance of the ink, so that the ink can be used at a temperature of 260°C without yellowing or foaming. Under the action of the curing agent, the silicone resin and the epoxy resin can form a three-dimensional network structure and stably adhere to the chip surface to form an ink layer, and this ink layer has good heat resistance.

[0042] 2. By adding vinyl ester resin to the raw materials of the high-temperature resistant ink for chip screen printing, the glossiness of the ink is further improved. At the same time, the vinyl ester resin and the epoxy resin can cure to form a three-dimensional network structure with stable structure and good adhesion performance, improving the bonding stability between the ink layer and the chip.

[0043] 3. The curing agent is prepared by mixing naphthenate and polyamide-type compound in a weight ratio of (1-2):1 to control the curing degree of the silicone resin and the epoxy resin, so that the cured ink has good heat resistance, bonding strength and hardness at the same time. Detailed implementation mode

[0044] Example

[0045] Example 1

[0046] A high-temperature resistant ink for chip screen printing is prepared by the following method:

[0047] S1. By weight, 40 parts of solvent and 50 parts of silicone resin are mixed evenly, added to the reaction device for dispersion, and then 10 parts of epoxy resin are added while stirring, and vacuum is pumped. Grind and stir until viscous, with a viscosity of 1000 cps, and the stirring and grinding speed is 2500 r / min;

[0048] S2. Break the vacuum, then add 2 parts of additives and 2 parts of curing agent, pump vacuum, grind and stir, break the vacuum, and discharge to obtain a high-temperature resistant ink for chip screen printing.

[0049] The solvent is toluene, the silicone resin is 20 parts of polymethylphenyl silicone resin and 50 parts of polyaryl silicone resin, the additive is an oxidant, and the curing agent includes 1 part by weight of silane coupling agent KH550 and 1 part by weight of polyamide curing agent 651.

[0050] The polymethylphenyl silicone resin is purchased from Hubei Longsheng Sihai New Materials Co., Ltd., and its viscosity is 12-30S at 25°C in a coating-4 cup, and the model is 1040.

[0051] The polyaryl silicone resin is phenyl silicone resin, purchased from Shandong Changyao New Materials Co., Ltd., with the model number CY-D2.

[0052] The epoxy value of the epoxy resin is 2 eq / 100 g.

[0053] The differences between Examples 2 to 7 and Example 1 are as follows: the types, dosages and test parameters of some raw materials are different, and the remaining experimental steps are the same as those in Example 1. The types, dosages and test parameters of the raw materials used in Examples 1 to 7 are shown in Table 1:

[0054] Table 1 Types, Dosages and Test Parameters of Raw Materials Used in Examples 1 to 7

[0055]

[0056] Example 8

[0057] A high-temperature resistant ink for chip screen printing screen. The difference between this example and Example 1 is that the high-temperature resistant ink for chip screen printing screen further includes 5 parts by weight of vinyl ester resin, with a viscosity of 800 cps at 25 °C, which is added together with the silicone resin, and the types, dosages and experimental steps of the remaining raw materials are the same as those in Example 1.

[0058] Example 9

[0059] A high-temperature resistant ink for chip screen printing screen. The difference between this example and Example 1 is that the high-temperature resistant ink for chip screen printing screen further includes 10 parts by weight of vinyl ester resin, with a viscosity of 5000 cps at 25 °C, which is added together with the silicone resin, and the types, dosages and experimental steps of the remaining raw materials are the same as those in Example 1.

[0060] Example 10

[0061] A high-temperature resistant ink for chip screen printing screen. The difference between this example and Example 1 is that the high-temperature resistant ink for chip screen printing screen further includes 1 part by weight of defoamer, and the defoamer is polyether-modified silicone defoamer, which is added together with the curing agent, and the types, dosages and experimental steps of the remaining raw materials are the same as those in Example 1.

[0062] The polyether-modified silicone defoamer is purchased from Tianjin Daixu Chemical Trading Co., Ltd., and the grade is first-class product.

[0063] Example 11 (A + C)

[0064] A high-temperature resistant ink for chip screen printing screen. The difference between this embodiment and Embodiment 8 is that the high-temperature resistant ink for chip screen printing screen further includes 2 parts by weight of an antifoaming agent, which is a polyether-modified silicone antifoaming agent, and is added together with the curing agent. The types, dosages, and experimental steps of the remaining raw materials are the same as those in Embodiment 8.

[0065] The polyether-modified silicone antifoaming agent is purchased from Shandong Jueneng Chemical Co., Ltd. and its model is JN-2085.

[0066] Embodiment 12

[0067] A high-temperature resistant ink for chip screen printing screen. The difference between this embodiment and Embodiment 1 is that the high-temperature resistant ink for chip screen printing screen further includes 5 parts by weight of a lubricant. Each part of the lubricant is prepared from talcum powder, glycerin, and Tween in a weight ratio of 10:5:3, and is added together with the curing agent. The types, dosages, and experimental steps of the remaining raw materials are the same as those in Embodiment 1.

[0068] Embodiment 13

[0069] A high-temperature resistant ink for chip screen printing screen. The difference between this embodiment and Embodiment 1 is that the high-temperature resistant ink for chip screen printing screen further includes 10 parts by weight of a lubricant. Each part of the lubricant is prepared from talcum powder, glycerin, and Tween in a weight ratio of 15:10:3, and is added together with the curing agent. The types, dosages, and experimental steps of the remaining raw materials are the same as those in Embodiment 1.

[0070] Embodiment 14

[0071] A high-temperature resistant ink for chip screen printing screen. The difference between this embodiment and Embodiment 13 is that the high-temperature resistant ink for chip screen printing screen further includes 5 parts by weight of vinyl ester resin, and at 25°C, the viscosity is 800 cps, and it is added together with the silicone resin. The types, dosages, and experimental steps of the remaining raw materials are the same as those in Embodiment 13.

[0072] Embodiment 15

[0073] A high-temperature resistant ink for chip screen printing screen. The difference between this embodiment and Embodiment 1 is that the high-temperature resistant ink for chip screen printing screen further includes 5 parts by weight of melamine formaldehyde resin. The density of the melamine formaldehyde resin is 1.14 g / cm3, and it is added together with the silicone resin. The types, dosages, and experimental steps of the remaining raw materials are the same as those in Embodiment 1.

[0074] Embodiment 16

[0075] A high-temperature resistant ink for chip screen printing screen. The difference between this example and Example 8 is that the high-temperature resistant ink for chip screen printing screen further includes 10 parts by weight of melamine formaldehyde resin. The density of the melamine formaldehyde resin is 1.14 g / cm3, and it is added together with the silicone resin. The types, dosages, and experimental steps of the remaining raw materials are the same as those in Example 8.

[0076] Example 17

[0077] A high-temperature resistant ink for chip screen printing screen. The difference between this example and Example 13 is that the high-temperature resistant ink for chip screen printing screen further includes 10 parts by weight of melamine formaldehyde resin. The density of the melamine formaldehyde resin is 1.13 g / cm3, and it is added together with the silicone resin. The types, dosages, and experimental steps of the remaining raw materials are the same as those in Example 13.

[0078] Example 18

[0079] A high-temperature resistant ink for chip screen printing screen. The difference between this example and Example 1 is that the high-temperature resistant ink for chip screen printing screen further includes 1 part by weight of a leveling agent, and the leveling agent is BD-3033H. The types, dosages, and experimental steps of the remaining raw materials are the same as those in Example 1.

[0080] Example 19

[0081] A high-temperature resistant ink for chip screen printing screen. The difference between this example and Example 8 is that the high-temperature resistant ink for chip screen printing screen further includes 2 parts by weight of a leveling agent, and the leveling agent is BD-2051, which is added together with the curing agent. The types, dosages, and experimental steps of the remaining raw materials are the same as those in Example 8.

[0082] Example 20

[0083] A high-temperature resistant ink for chip screen printing screen. The difference between this example and Example 14 is that the high-temperature resistant ink for chip screen printing screen further includes 2 parts by weight of a leveling agent, and the leveling agent is BD-3232, which is added together with the curing agent. The types, dosages, and experimental steps of the remaining raw materials are the same as those in Example 14.

[0084] Example 21

[0085] A high-temperature resistant ink for chip screen printing screen. The difference between this example and Example 1 is that the curing agent is prepared by mixing naphthenate and polyamide-type compound in a weight ratio of 1:1, and it is added together with the curing agent. The types, dosages, and experimental steps of the remaining raw materials are the same as those in Example 1.

[0086] The naphthenate is cobalt naphthenate.

[0087] The polyamide-based compound is polyamide curing agent 651.

[0088] Example 22

[0089] A high-temperature resistant ink for chip screen printing, the difference between this example and Example 8 is that: the curing agent is prepared by mixing naphthenate and polyamide-based compound in a weight ratio of 2:1, and is added together with the curing agent. The types, dosages, and experimental steps of the remaining raw materials are the same as those in Example 1.

[0090] The naphthenate is zinc naphthenate.

[0091] The polyamide-based compound is polyamide curing agent 650.

[0092] Comparative example

[0093] Comparative example 1

[0094] A high-temperature resistant ink for chip screen printing, the difference between this comparative example and Example 1 is that: the polypropylene resin is replaced with an equal amount of epoxy resin. The types, dosages, and experimental steps of the remaining raw materials are the same as those in Example 1.

[0095] The polyurethane resin is purchased from Jiangsu Pulosi Biotechnology Co., Ltd., and the density is 1.005 g / cm 3 .

[0096] Comparative example 2

[0097] A high-temperature resistant ink for chip screen printing, the difference between this comparative example and Example 1 is that: the polyurethane resin is replaced with an equal amount of silicone resin. The types, dosages, and experimental steps of the remaining raw materials are the same as those in Example 1.

[0098] The polyurethane resin is purchased from Jiangsu Pulosi Biotechnology Co., Ltd., and the density is 1.005 g / cm 3 .

[0099] Performance detection test

[0100] The prepared ink is subjected to high-temperature storage test, salt spray test, boiling water test, pencil hardness test, and high-temperature welding simulation test.

[0101] Detection method / Test method

[0102] The inks prepared in Examples 1 to 22 and Comparative Examples 1 to 2 are printed on the surface of the chip by screen printing, dried and cured to obtain the printed chips. The scraping slope of the printing is 65 degrees, the printing speed is 350 mm / s, the screen mesh of the screen is 300 meshes, and the screen distance is 3 mm.

[0103] High-temperature storage test: Place the printed chip at an ambient temperature of 250 °C for 24 hours. Take it out, cool it, let it stand for 2 hours, and observe whether there is any discoloration or cracking on the printed chip.

[0104] Salt spray test: Conditions 1. Concentration of brine: 5 ± 1%; 2. pH value: 6.5 - 7.2; 3. Supply air pressure: 10 - 25 psi; 4. Salt spray collection amount: 1 - 2 mL / 80 cm2 / hr; 5. Temperature of the brine bucket: 5 ± 2 °C; 6. Continuous spraying time: 48 hrs. After the experiment, wash it with distilled water for 5 minutes, let it air dry for 6 hours, and observe whether there is any discoloration or cracking on the printed chip.

[0105] Boiling water test: Use pure water at 100 °C to boil the printed chip for 30 minutes; conduct an adhesion test after standing at room temperature for 2 hours. Adhesion test: 1. Scratch 10×10 small grids of 1 mm×1 mm on the surface of the printed chip; 2. Clean the debris on the surface of the specimen with a lint-free cloth; 3. Stick 3M 610# adhesive tape on the small grids, press it flat and let it stand for 5S, then quickly pull up the adhesive tape, calculate the peeling area, and if it exceeds 5%, it is unqualified.

[0106] Pencil hardness test: The Mitsubishi test pencil lead is ≥3H. Apply a pressure of 750 gf, with the angle between the pencil lead and the surface to be tested being 45°, and draw 5 strokes at the position to be tested, each stroke being 10 mm long (using 5 parallel lines with a line spacing > 3 mm, and no interference between the test lines is required. No permanent indentation is allowed on the surface (slight indentation is allowed at the starting point within 0 - 2 mm, but the function must be normal, and no visible abrasion or scratching is allowed on other positions of the surface.

[0107] High-temperature soldering simulation test: Place the printed chip on a high-temperature platform at 260 °C for 5 minutes. Judgment criterion: No change in appearance.

[0108] The test data is shown in Table 2:

[0109] Table 2 Experimental data of performance detection

[0110]

[0111]

[0112] It can be seen from Examples 1 - 22 and Comparative Examples 1 - 2, combined with Table 2, that the high-temperature resistant screen printing ink for chips prepared by using silicone resin, epoxy resin, curing agent, additives and pigments has good bonding performance and high-temperature resistance.

[0113] Comparing Example 1 with Comparative Examples 1 - 2 shows that the use of silicone resin and epoxy resin in this application is beneficial to improving the bonding performance and high-temperature resistance of the high-temperature resistant screen printing ink for chips.

[0114] Comparing Example 1 with Examples 4 to 5 shows that the co - use of polymethylsilicone resin, polyaryl silicone resin and epoxy resin with a specific epoxy value can further improve the adhesion performance and high - temperature resistance of the high - temperature resistant ink for chip screen printing screens.

[0115] Comparing Example 1 with Example 8 shows that using vinyl ester resin to participate in the preparation of the high - temperature resistant ink for chip screen printing screens can improve the adhesion performance of the high - temperature resistant ink for chip screen printing screens.

[0116] Comparing Example 1 with Example 12 shows that by using talcum powder, glycerin and Tween to prepare a lubricant, it is beneficial to improve the fluidity between silicone resin, epoxy resin and vinyl ester resin, enabling the silicone resin, epoxy resin and vinyl ester resin to penetrate each other, thereby improving the heat - resistant performance of the ink and its adhesion performance to the chip.

[0117] Comparing Example 1 with Example 15 shows that using melamine - formaldehyde resin to participate in the preparation of the high - temperature resistant ink for chip screen printing screens can improve the adhesion performance of the high - temperature resistant ink for chip screen printing screens.

[0118] This specific embodiment is only an interpretation of the present application and does not limit the present application. After reading this specification, those skilled in the art can make modifications to this embodiment without creative contributions as needed, but as long as it is within the scope of the claims of the present application, it is protected by the patent law.

Claims

1. A high-temperature resistant screen printing ink for chips, characterized in that, The high-temperature resistant screen printing ink for chips is prepared from the following raw materials in parts by weight: 50 - 60 parts of silicone resin 10 - 20 parts of epoxy resin 2 - 6 parts of curing agent 2 - 8 parts of auxiliary agent 40 - 60 parts of solvent 0 - 5 parts of pigment; The silicone resin is polymethylphenyl silicone resin and polyaryl silicone resin, wherein the weight of polymethyl silicone resin is 20 - 25 parts, and the weight of polyaryl silicone resin is 30 - 35 parts; The epoxy value of the epoxy resin is 2 - 10 eq / 100g; The high-temperature resistant screen printing ink for chips further includes 5 - 10 parts by weight of vinyl resin, and at 25 °C, the viscosity is 800 - 5000 cps; The high-temperature resistant screen printing ink for chips further comprises 5 to 10 parts by weight of melamine formaldehyde resin, and the density of the melamine formaldehyde resin is 1.13 to 1.14 g / cm 3 ; The auxiliary agent is an ultraviolet absorber or an antioxidant; The curing agent is prepared by mixing naphthenate and polyamide-type compound in a weight ratio of (1 - 2):

1.

2. The high-temperature resistant screen printing ink for chips according to claim 1, wherein: The high-temperature resistant screen printing ink for chips further includes 1 - 2 parts by weight of defoamer, and the defoamer is polyether-modified silicone defoamer.

3. The high-temperature resistant screen printing ink for chips according to claim 1, wherein: The high-temperature resistant screen printing ink for chips further includes 5 - 10 parts by weight of lubricant, and the lubricant is prepared from talcum powder, glycerol and Tween in a weight ratio of (10 - 15):(5 - 10):

3.

4. The high-temperature resistant screen printing ink for chips according to claim 1, wherein: The high-temperature resistant screen printing ink for chips further includes 1 - 2 parts by weight of leveling agent, and the leveling agent is BD-3033H, BD-2051, BD-3232, BD-252 or BD-3310.

5. The high-temperature resistant screen printing ink for chips according to claim 1, characterized in that: The solvent is at least one of toluene, ethyl acetate, xylene and ethanol.

6. A preparation method of a high-temperature resistant screen printing ink for chips as described in any one of claims 1 to 5, characterized in that, It includes the following preparation steps: S1. Mix the solvent, silicone resin and other resins evenly, add them to the reaction device for dispersion, then add epoxy resin and lubricant while stirring, evacuate the air, grind and stir until viscous, and the viscosity is 1000 - 1100 cps; S2. Break the vacuum, then add the raw materials other than the auxiliary agent, pigment and curing agent, evacuate the air, grind and stir, break the vacuum, and discharge to obtain the high-temperature resistant screen printing ink for chips.

Images