An electrostatic chuck and a process for bonding

Abstract

The application provides a novel electrostatic chuck bonding device and method, comprising a vacuum operating cavity, upper and lower pressing panels, upper and lower telescopic devices and a vacuum glue injection device. The electrostatic chuck to be bonded is placed in the vacuum operating cavity, an equal-height fixing block is placed between the metal base and the dielectric layer of the electrostatic chuck, the height of the equal-height fixing block needs to be equal to the thickness of the adhesive layer, the outer edge of the adhesive layer is reserved with a pouring port, and the vacuum glue injection device is connected outside the pouring port to pour the adhesive into the adhesive layer in the vacuum operating cavity through the pouring port. The electrostatic chuck manufactured by the bonding device and method has the characteristics of high adhesive strength, no air bubbles and the like, and the different cavity structures contained in each adhesive layer can be filled with the adhesive; the edge and the internal thermal conductivity are consistent, which will not affect the temperature uniformity of the electrostatic chuck, and the defect control of large-area bonding is good.

Description

Technical Field

[0001] This invention relates to the field of electrostatic chucks, and more specifically to a new electrostatic chuck bonding process and apparatus. Background Technology

[0002] Electrostatic chucks are carriers in precision wafer processing equipment. They are key semiconductor components that use electrostatic adsorption to hold wafers flat and uniformly, primarily used in etching, CVD, PVD, and IMP processes. According to Moore's Law, continuous advancements in semiconductor technology lead to increasing device integration on wafer surfaces and smaller, more precise device dimensions. Therefore, the processing precision and uniformity of the electrostatic chucks supporting the wafers must continuously improve, leading to the development of temperature-controlled electrostatic chucks. Temperature-controlled electrostatic chucks typically have built-in heaters and can be divided into temperature zones for temperature control, with up to 196 temperature zones. They are integrated by bonding various components such as a metal base, heater, and ceramic parts. Furthermore, high-end electrostatic chucks on the market currently require a thicker intermediate adhesive layer to provide sufficient space for wire bonding operations. Numerous studies have found that micron- and millimeter-sized air bubbles in the adhesive layer can lead to reduced heat transfer, decreased adhesive strength, and increased dielectric loss, which is detrimental to the application of electrostatic chucks in high-temperature environments, plasma, and high-energy ion implantation.

[0003] The electrostatic chuck is integrated using a semi-cured adhesive bonding process. The adhesive itself is made of silicone resin and inorganic fillers, with a viscosity of approximately 30,000-50,000 CP. However, the adhesive in this bonding process is in a semi-cured state, resulting in poor adhesion between the adhesive and the insulating layer. This leads to drawbacks such as poor adhesion between the adhesive and the insulating layer, low hardness after curing, and easy wrinkling of the adhesive during bonding, which can cause bonding failure. Alternatively, the electrostatic chuck can be integrated using a brushing or coating adhesive bonding process. This involves evenly distributing the adhesive on the base using printing or coating processes, then bonding the insulating layer, and finally placing it in a vacuum press to complete the bonding. The adhesive itself is made of silicone resin and inorganic fillers, with a viscosity of approximately 6,000-30,000 CP. This bonding process can only achieve bonding of relatively thin adhesive layers. If the adhesive layer is too thick, it is difficult to control the uniformity of the thickness of the entire adhesive layer, and it is difficult to guarantee zero defects during the bonding process. Therefore, it has the disadvantages of not being able to perform bonding processes for thicker adhesive layers, requiring high adhesive viscosity, being relatively complex to operate, requiring high skill from operators, and having defects in the adhesive layer during the bonding process.

[0004] Therefore, there is a need to provide a new electrostatic chuck bonding process that can solve the above problems, especially a new electrostatic chuck bonding process for the thick adhesive layer required for high-end electrostatic chucks. Summary of the Invention

[0005] The purpose of this invention is to provide a novel electrostatic chuck bonding method and apparatus, particularly an integration method for electrostatic chucks with irregular structures on certain dielectric layer bonding surfaces.

[0006] To achieve the above objectives, the present invention adopts the following technical solution:

[0007] The first aspect of the present invention provides an electrostatic chuck bonding device, characterized in that it comprises:

[0008] Vacuum operating chamber, gas system, upper pressing panel, lower pressing panel, upper telescopic device, lower telescopic device, vacuum glue injection device;

[0009] The top end of the upper telescopic device is connected to the inner top surface of the vacuum operating chamber, and the bottom end of the upper telescopic device is connected to the top end of the upper pressing panel; the bottom end of the lower telescopic device is connected to the inner bottom surface of the vacuum operating chamber, and the top end of the lower telescopic device is connected to the bottom end of the lower pressing panel; an electrostatic chuck is fixed between the upper and lower pressing panels, the bottom end of the upper pressing panel is fixedly connected to the top end of the dielectric layer of the electrostatic chuck, and the top end of the lower pressing panel is fixedly connected to the bottom end of the metal base of the electrostatic chuck.

[0010] The pipe of the vacuum dispensing injection device passes through the vacuum operating chamber, with one end of the pipe located outside the vacuum operating chamber and the other end located on the side of the metal base and the dielectric layer; the inside of the vacuum dispensing injection device is sealed to the vacuum operating chamber.

[0011] The gas system is connected to the vacuum operating chamber.

[0012] Furthermore,

[0013] The gas system includes a first vacuum mechanical pump, a second vacuum molecular pump, an inflation line, an exhaust line, and a vacuum line; one end of the vacuum line is connected to the vacuum operating chamber; one end of the inflation line is connected to the vacuum operating chamber, and the other end is connected to the vacuum line; the exhaust line connects the inflation line and the vacuum line, and the first vacuum mechanical pump and the second vacuum molecular pump are provided between the vacuum line and the exhaust line; an inflation valve is provided at the end of the inflation line near the vacuum operating chamber, a vacuum valve is provided at the end of the vacuum line near the vacuum operating chamber, and an exhaust valve is provided on the exhaust line.

[0014] Furthermore,

[0015] The upper surface of the vacuum operating chamber has a visual observation port;

[0016] And / or, the vacuum operating chamber is equipped with a pressure gauge and a vacuum gauge.

[0017] Furthermore,

[0018] There are uniformly distributed, height-equal fixing blocks between the metal base and the dielectric layer; furthermore,

[0019] The vacuum dispensing device consists of two or four evenly distributed units.

[0020] Furthermore,

[0021] The upper and lower laminated panels maintain a flatness of less than 20μm.

[0022] And / or, the upper and lower pressed panels maintain a parallelism of less than 0.5°.

[0023] And / or, the upper and lower pressing plates can be raised and lowered, and the raising and lowering distance is controllable.

[0024] Furthermore, the equal-height fixing block can have a fixed deformation under a certain pressure;

[0025] Furthermore, there are four equal-height fixing blocks, which are evenly distributed on the outer edge of the space between the metal base and the dielectric layer.

[0026] A second aspect of the present invention provides a method for manufacturing an electrostatic chuck using the above-described electrostatic chuck bonding device, characterized by comprising the following steps:

[0027] Shielding and protection:

[0028] Cover the non-bonding areas of each component of the electrostatic chuck to be bonded with a shielding material, leaving the bonding positions in advance.

[0029] Steps for placing the equal-height fixing block: Place the vacuum chuck to be bonded in an atmospheric environment, fix the metal base of the electrostatic chuck on the lower pressing panel, and fix the dielectric layer of the electrostatic chuck on the upper pressing panel. Place the equal-height fixing block between the metal base and the dielectric layer of the electrostatic chuck, and seal the space between the metal base and the dielectric layer. A filling port is reserved on the side of the sealed space.

[0030] Injection steps: Place the adhesive into the pipeline of the vacuum injection device, ensuring there are no air bubbles in the adhesive; then, evacuate the inside of the chamber, connecting the entire syringe to the vacuum operation chamber and maintaining the vacuum. After evacuation, use the vacuum injection device to inject the adhesive into the adhesive layer, with the adhesive being injected into the adhesive layer through the injection port.

[0031] Pressing steps: After the glue is injected, the vacuum operating chamber is vented to the atmosphere through the gas system, and then high-pressure gas is introduced through the gas system to compress the upper and lower pressing panels. The upper and lower pressing panels compress the components of the electrostatic chuck, making them fit tightly together.

[0032] Curing step: Turn on the heating function of the upper and lower pressing panels to allow the adhesive to cure.

[0033] Cooling and removal steps: After the adhesive has cured, vent the vacuum operating chamber to the atmosphere, open the bonding device, and remove the electrostatic chuck.

[0034] Furthermore,

[0035] In the adhesive injection step, when adhesive overflows from the corresponding channel observed in the visual observation window, it is determined that the adhesive layer has been completely filled with adhesive.

[0036] Preferably, the silicone-based adhesive is silicone.

[0037] Preferably, the vacuum operating chamber is evacuated to a pressure below 10 Pa.

[0038] And / or,

[0039] In the pressing step, gas at a pressure higher than standard atmosphere is introduced into the vacuum operating chamber through the gas system's inflation valve.

[0040] And / or,

[0041] The curing step includes: heating the adhesive to 80-150℃ for curing, wherein the viscosity of the adhesive is 10000-20000CP;

[0042] Preferably, the adhesive is cured at 100-150°C.

[0043] Furthermore,

[0044] In the step of placing the equal-height fixed blocks

[0045] The equal-height fixing blocks are evenly distributed on the adhesive layer; preferably, the equal-height fixing blocks are evenly distributed on the outer edge of the adhesive layer, and more preferably, the number of equal-height fixing blocks is 4, which are placed on the outer edge of the adhesive layer in the 3 o'clock, 6 o'clock, 9 o'clock and 12 o'clock directions.

[0046] Furthermore, the material of the equal-height fixing block is preferably an elastomer, flexible metal material, etc.

[0047] Furthermore, the thickness of the adhesive layer is between 1.00 mm and 2.00 mm.

[0048] Beneficial effects:

[0049] Compared with the prior art, the integrated device and manufacturing method of the electrostatic chuck of the present invention have the following advantages:

[0050] 1. The bonding device and method of the present invention can achieve an adhesive layer thickness greater than 1 mm, with high bonding strength and high hardness after curing, and can be used to manufacture high-end electrostatic chucks with thick adhesive layers; while the existing brushing and coating process cannot achieve a thick adhesive layer; therefore, the bonding device and method of the present invention can be applied to the process of manufacturing high-end electrostatic chucks with thick adhesive layers, and the operation is simple.

[0051] 2. The bonding device and method of the present invention can achieve uniform and bubble-free bonding even for adhesive layers with heterogeneous structures. The heterogeneous cavity structures contained in the adhesive layer can be filled by the adhesive. The thermal conductivity of the edges and the interior is consistent, which will not affect the temperature uniformity of the electrostatic chuck. Compared with the existing brushing and gluing bonding process, it can achieve fewer defects in large-area bonding, with good heat transfer, high bonding strength and low dielectric loss, which is beneficial for the application of electrostatic chucks in high-temperature environments, plasma and high-energy ion implantation. Attached Figure Description

[0052] Figure 1 This is a schematic diagram of the structure of a variable temperature electrostatic chuck;

[0053] Figure 2 Image showing an irregularly shaped cavity on the dielectric ceramic plate corresponding to the upper surface of the adhesive layer;

[0054] Figure 3 This is a schematic diagram of the contour block distribution;

[0055] Figure 4 This is a schematic diagram of the electrostatic chuck integrated device;

[0056] Figure 5 This is a schematic diagram of the gas system in the electrostatic chuck integrated device;

[0057] Figure 6 A flowchart of a method for manufacturing an electrostatic chuck;

[0058] Figure 7 Ultrasonic flaw detection images for an example;

[0059] Among them, 110-dielectric layer, 120-adhesive layer, 130-metal base, 410-vacuum operating chamber, 480-gas system, 430-upper pressing panel, 435-lower pressing panel, 420-upper telescopic device, 425-lower telescopic device, 440-dielectric layer, 450-first vacuum dispensing device, 455-second vacuum dispensing device, 460-height fixing block, 470-metal base, 480-gas system, 510-first vacuum mechanical pump, 520-second vacuum molecular pump, 530-gas filling line, 540-gas exhaust line, 550-vacuum line, 560-gas filling valve, 570-gas exhaust valve, 580-vacuum valve, 590-gas tank Detailed Implementation

[0060] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of the present invention. Based on the described embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0061] Unless otherwise defined, the technical or scientific terms used in this invention shall have the ordinary meaning understood by one of ordinary skill in the art to which this disclosure pertains. The terms "first," "second," and similar terms used in this invention do not indicate any order, quantity, or importance, but are merely used to distinguish different components. Terms such as "comprising" or "including" mean that the element or object preceding the word encompasses the elements or objects listed following the word and their equivalents, without excluding other elements or objects.

[0062] The following is a more detailed description of some embodiments disclosed in this invention. In the specification disclosed in this invention, with the plane where the adhesive layer is located as the horizontal plane, the direction of movement from the adhesive layer towards the dielectric layer, perpendicular to the adhesive layer plane, is called the "upward" direction, and the direction of movement from the adhesive layer towards the metal base is called the "downward" direction. Thus, various positional relationships modified by "up" and "down," or "top" and "bottom," have clear meanings. The direction from the edge of the adhesive layer towards the center is called the "inward" direction, and the direction from the center of the adhesive layer towards the edge is called the "outward" direction. Therefore, relative positional relationships modified by "inward" and "outward" also have clear meanings. In addition, it should be noted that the above terms indicating orientation are merely exemplary and represent the phase positional relationship of various components. The components in the various devices or equipment disclosed in this invention, or the entire device or equipment, can be rotated by a certain angle as a whole.

[0063] In this invention, the electrostatic chuck is a temperature-controlled electrostatic chuck with a built-in heater, such as... Figure 1 As shown, the structure includes a dielectric layer 110, an adhesive layer 120, and a metal base 130. The dielectric layer includes heating and adsorption electrodes. The adhesive layer contains uniformly distributed, height-equalizing blocks that should not affect the bonding effect or temperature uniformity. These height-equalizing blocks can undergo fixed deformation under a certain pressure, thus achieving uniform thickness of the adhesive layer. The number of height-equalizing blocks should not be excessive to control the thickness and uniformity of the adhesive layer. In principle, they can be composed of any material; considering simple and applicable materials, elastomers and flexible metal materials are preferred.

[0064] In some examples, irregularly shaped cavities exist on the dielectric layer corresponding to the upper surface of the adhesive layer, such as... Figure 2 As shown.

[0065] In some examples, the number of equal-height fixing blocks is four, evenly distributed along the outer edge of the adhesive layer. For example... Figure 3 As shown, the equal-height blocks are evenly distributed on the outer edge of the adhesive layer, placed at the 3 o'clock, 6 o'clock, 9 o'clock and 12 o'clock directions.

[0066] The adhesive layer also includes an adhesive, which affects heat transfer; therefore, the ideal thermal conductivity of the adhesive is close to that of a metal. The thermal conductivity of the adhesive is closely related to the material and the preparation process of the adhesive layer. The main component of the adhesive is organic matter, and its heat transfer mechanism limits its thermal conductivity compared to metals such as Al and Cu. Adding inorganic non-metallic thermally conductive particles helps to enhance its thermal conductivity. In this invention, the adhesive needs to be cured at 80-150℃, preferably at 100-150℃; the viscosity of the adhesive is 10000-20000 CP; in this invention, the thickness of the adhesive layer is the same as the height of the contour block and the thickness of the adhesive, and this thickness is between 1.00 mm and 2.00 mm.

[0067] In one embodiment of the present invention, the electrostatic chuck bonding device includes a vacuum operating chamber 410, a gas system 480, an upper pressing panel 430, a lower pressing panel 435, an upper telescopic device 420, a lower telescopic device 425, a first vacuum glue injection device 450, and a second vacuum glue injection device 455. The top end of the upper telescopic device 420 is connected to the inner top surface of the vacuum operating chamber 410, and the bottom end is connected to the top end of the upper pressing panel 430. The bottom end of the lower telescopic device 425 is connected to the inner bottom surface of the vacuum operating chamber 410, and the top end is connected to the bottom end of the lower pressing panel 435. The bottom end of the upper pressing panel 420 is connected to the electrostatic chuck bonding device 455. The top end of the dielectric layer 440 is fixedly connected, and the top end of the lower pressing panel 435 is fixedly connected to the bottom end of the electrostatic chuck metal base 470. The metal base 470 and the dielectric layer 440 are fixed together by equal-height fixing blocks 460. One end of the first vacuum dispensing device 450 is located outside the vacuum operating chamber 410, and the other end is located inside the vacuum operating chamber 410, and on the side of the metal base 470 and the dielectric layer 440. One end of the second vacuum dispensing device 455 is located outside the vacuum operating chamber 410, and the other end is located inside the vacuum operating chamber 410, and on the side of the metal base 470 and the dielectric layer 440. The first vacuum dispensing device 450 and the second vacuum dispensing device 455 are arranged opposite to each other. The inside of the vacuum dispensing device is sealed to the vacuum operating chamber 410. The gas system 480 is connected to the inside of the vacuum operating chamber 410, and the vacuum operating chamber 410 is equipped with a pressure gauge and a vacuum gauge.

[0068] The metal base 470 of the electrostatic chuck is bonded to the dielectric layer 440 via an adhesive layer. This adhesive layer includes a height-equalizing fixing block 460 and an adhesive. The thickness of the adhesive layer is equal to the height of the fixing block 460 and also equal to the thickness of the adhesive within the adhesive layer. The outer edge of the adhesive layer has a closed structure with a pre-drilled injection port. A vacuum dispensing device is connected to the injection port, and the space between the vacuum dispensing device and the injection port is also sealed. The upper and lower pressing panels can be raised and lowered, with a controllable lifting distance.

[0069] In some examples, the upper lamination panel 430 and the lower lamination panel 435 maintain a parallelism of less than 0.5° and a flatness of less than 20 μm.

[0070] In some examples, the straight line between the first vacuum dispensing device 450 and the second vacuum dispensing device 455 passes through the center of the adhesive layer, such as... Figure 4 As shown in the illustration; in other examples, a third and a fourth vacuum injection device may also be included, the line containing the third and fourth vacuum injection devices also passing through the center of the adhesive layer, and the four vacuum injection devices being evenly distributed circumferentially around the adhesive layer. This method of injection ensures uniformity, allowing the adhesive to evenly fill the entire cavity and preventing air bubbles, especially effective for adhesive layers with irregularly shaped cavities.

[0071] In some examples, the upper surface of the vacuum operating chamber 410 has a visual observation port for observing and determining whether the adhesive in the adhesive layer has been completely filled during the dispensing process.

[0072] In some examples, the gas system 480 includes a first vacuum mechanical pump 510, a second vacuum molecular pump 520, an inflation line 530, an exhaust line 540, and a vacuum line 550; one end of the vacuum line 550 is connected to the vacuum operating chamber 410; one end of the inflation line 530 is connected to the vacuum operating chamber 410, and the other end is connected to the vacuum line 550; the exhaust line 540 is connected between the inflation line 530 and the vacuum line 550; the first vacuum mechanical pump 510 and the second vacuum molecular pump 520 are provided between the vacuum line 550 and the exhaust line 540; an inflation valve 560 is provided at the end of the inflation line 530 near the vacuum operating chamber 410; a vacuum valve 580 is provided at the end of the vacuum line 550 near the vacuum operating chamber 410; and an exhaust valve 570 is provided on the exhaust line 540.

[0073] In one embodiment, combined Figure 6 The manufacturing process of an electrostatic chuck is as follows:

[0074] Masking and protection steps: First, cover the non-adhesive areas of each component of the electrostatic chuck to be bonded with a masking material, leaving the bonding positions.

[0075] Steps for placing the height-equalizing fixing block: Place the vacuum chuck to be bonded in an atmospheric environment, fix the metal base 470 of the electrostatic chuck to the lower pressing panel 435, and fix the dielectric layer 440 of the electrostatic chuck to the upper pressing panel 430. Place the height-equalizing fixing block 460 between the metal base 470 and the dielectric layer 440; and seal the space between the metal base 470 and the dielectric layer 440. A filling port is reserved on the side of the sealed space.

[0076] Injection Procedure: Before vacuuming, place the adhesive into the channels of the first vacuum injection device 450 and the second vacuum injection device 455, ensuring there are no air bubbles in the adhesive. Begin vacuuming the interior of the chamber, maintaining a vacuum throughout the syringe connected to the vacuum operating chamber. After vacuuming is complete, inject the adhesive using the first vacuum injection device 450 and the second vacuum injection device 455. The adhesive is injected through the injection port into the space between the metal base 470 and the dielectric layer 440. When adhesive overflows from the corresponding channel observed in the viewing window, it is confirmed that the adhesive has completely filled the space, forming an adhesive layer.

[0077] Pressing steps: After the glue is injected, the vacuum operating chamber 410 is vented to the atmosphere through the gas system 480, and then high-pressure gas is introduced through the gas system 480 to compress the upper and lower pressing panels. The upper and lower pressing panels compress the components of the electrostatic chuck, making them fit tightly together.

[0078] Curing step: Turn on the heating function of the upper and lower pressing panels to allow the injected adhesive to cure.

[0079] Cooling and removal steps: After the adhesive has cured, the vacuum operating chamber 410 is vented to the atmosphere, the bonding device is opened, and the electrostatic chuck is removed.

[0080] The electrostatic chuck produced by the bonding device includes a single adhesive layer, the interior of which is filled with adhesive. The thickness of the adhesive layer is controlled between 1.00 mm and 2.00 mm.

[0081] In some examples, the adhesive is silicone;

[0082] In some examples, the vacuum operating chamber is evacuated to a pressure below 10 Pa;

[0083] In some examples, the high-pressure gas is a gas with a pressure higher than the standard atmosphere;

[0084] In some examples, the adhesive is cured by heating to 80-150°C, preferably at 100-150°C.

[0085] In some examples, the adhesive viscosity is between 10,000 and 20,000 CP;

[0086] The working principle of the gas system is as follows: turn on the vacuum pump, and the gas in the vacuum operation chamber is drawn away to form a vacuum; open the inflation valve and inflate the chamber through the inflation pipeline; open the exhaust valve and discharge the chamber into the atmosphere.

[0087] Combination Figure 7 As shown, the electrostatic chuck manufactured by the above bonding process and bonding device has the characteristics of high bonding strength and no air bubbles, and the heterogeneous cavity structure contained in each bonding layer can be filled by the adhesive; the thermal conductivity of the edge and the inside is consistent, which will not affect the temperature uniformity of the electrostatic chuck, and the defects of large-area bonding are well controlled.

[0088] The following points need to be explained:

[0089] (1) The accompanying drawings of the embodiments disclosed in this invention only involve the structures involved in the embodiments disclosed in this invention. Other structures can be referred to the general design.

[0090] (2) Where there is no conflict, the features of the same embodiment and different embodiments disclosed in this invention can be combined with each other.

[0091] The above description is merely an exemplary embodiment of the present invention and is not intended to limit the scope of protection of the present invention. The scope of protection of the present invention is determined by the appended claims. Various modifications and improvements to the technical solutions of the present invention made by those skilled in the art without departing from the spirit of the present invention should fall within the scope of protection defined by the claims of the present invention.

Claims

1. An electrostatic chuck bonding device, characterized in that, Includes a vacuum operating chamber, a gas system, an upper pressing panel, a lower pressing panel, an upper telescopic device, a lower telescopic device, and a vacuum glue injection device; The top end of the upper telescopic device is connected to the inner top surface of the vacuum operating chamber, the bottom end of the upper telescopic device is connected to the top end of the upper pressing panel, the bottom end of the lower telescopic device is connected to the inner bottom surface of the vacuum operating chamber, and the top end of the lower telescopic device is connected to the bottom end of the lower pressing panel; an electrostatic chuck is fixed between the upper and lower pressing panels, the bottom end of the upper pressing panel is fixedly connected to the top end of the dielectric layer of the electrostatic chuck, and the top end of the lower pressing panel is fixedly connected to the bottom end of the metal base of the electrostatic chuck; The upper and lower pressing panels can be raised and lowered, and the raising and lowering distance is controllable; the upper and lower pressing panels maintain a parallelism of less than 0.5°; the upper and lower pressing panels maintain a flatness of less than 20μm. The pipe of the vacuum dispensing injection device passes through the vacuum operating chamber, with one end of the pipe located outside the vacuum operating chamber and the other end located on the side of the metal base and the dielectric layer; the inside of the vacuum dispensing injection device is sealed to the vacuum operating chamber. The vacuum dispensing device consists of two or four evenly distributed units. The gas system is connected to the vacuum operating chamber, and a visual observation port is provided on the upper surface of the vacuum operating chamber.

2. The electrostatic chuck bonding device according to claim 1, wherein the gas system comprises a first vacuum mechanical pump, a second vacuum molecular pump, an inflation pipe, an exhaust pipe, and a vacuum pipe; one end of the vacuum pipe is connected to the vacuum operating chamber; one end of the inflation pipe is connected to the vacuum operating chamber, and the other end is connected to the vacuum pipe; the exhaust pipe is connected between the inflation pipe and the vacuum pipe, and the first vacuum mechanical pump and the second vacuum molecular pump are provided between the vacuum pipe and the exhaust pipe; an inflation valve is provided at the end of the inflation pipe near the vacuum operating chamber, a vacuum valve is provided at the end of the vacuum pipe near the vacuum operating chamber, and an exhaust valve is provided on the exhaust pipe.

3. The electrostatic chuck bonding device according to claim 1 or 2, wherein the vacuum operating chamber is equipped with a pressure gauge and a vacuum gauge.

4. A method for manufacturing an electrostatic chuck using the electrostatic chuck bonding device according to any one of claims 1-3, characterized in that, Includes the following steps: Masking and protection steps: Cover the non-bonding areas of each component of the electrostatic chuck to be bonded with a masking material, leaving the bonding position in advance; Steps for placing the equal-height fixing block: Place the vacuum chuck to be bonded in an atmospheric environment, fix the metal base of the electrostatic chuck on the lower pressing panel, and fix the dielectric layer of the electrostatic chuck on the upper pressing panel. Place the equal-height fixing block between the metal base and the dielectric layer of the electrostatic chuck, and seal the space between the metal base and the dielectric layer. A filling port is reserved on the side of the sealed space. Injection steps: Place the adhesive into the pipeline of the vacuum injection device, ensuring there are no air bubbles in the adhesive; then, evacuate the inside of the chamber using the gas system, connecting the entire syringe to the vacuum operation chamber and maintaining the vacuum. After the vacuum is completed, inject the adhesive using the vacuum injection device. The adhesive is poured into the space between the metal base and the dielectric layer through the injection port, forming an adhesive layer. Pressing steps: After the glue is injected, the vacuum operating chamber is vented to the atmosphere through the gas system, and then high-pressure gas is introduced through the gas system to compress the upper pressing panel and the lower pressing panel. The upper pressing panel and the lower pressing panel compress the components of the electrostatic chuck, making them fit tightly together. Curing step: Turn on the heating function of the upper and lower pressing panels to allow the adhesive to cure. Cooling and removal steps: After the adhesive has cured, vent the vacuum operating chamber to the atmosphere, open the bonding device, and remove the electrostatic chuck.

5. The manufacturing method according to claim 4, characterized in that: In the adhesive injection step, the vacuum operating chamber is evacuated to a pressure below 10 Pa; and / or, in the adhesive injection step, two or four vacuum adhesive injection devices are used to inject adhesive simultaneously; and / or, in the adhesive injection step, when adhesive overflows from the corresponding channel observed through the visual observation window, it is determined that the adhesive has been completely filled; and / or, in the pressing step, gas above standard atmospheric pressure is injected into the vacuum operating chamber through the gas system's inflation valve.

6. The manufacturing method according to claim 4 or 5, characterized in that: In the curing step, the adhesive is heated to 80~150℃ for curing.

7. The manufacturing method according to claim 4 or 5, characterized in that: The adhesive is a silicone-based adhesive; and / or, the viscosity of the adhesive is between 10,000 and 20,000 CP.

8. The manufacturing method according to claim 4 or 5, wherein the equal-height fixing blocks are uniformly distributed on the outer edge of the adhesive layer; and / or, the thickness of the adhesive layer is controlled between 1.00 mm and 2.00 mm.

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