Protection assembly of optical waveguide, optical waveguide, equipment and preparation method of protection assembly

Abstract

The invention relates to the technical field of diffraction optical waveguides, and provides a protection assembly of an optical waveguide, the optical waveguide, equipment and a preparation method of the protection assembly, the protection assembly is used for being attached to the optical waveguide to protect the optical waveguide, and the protection assembly comprises a substrate and a plurality of protruding parts arranged on the substrate; the protruding part is prepared from the following raw materials: printing ink and rigid particles, so that the control accuracy of the height of the protruding part is improved.

Description

Technical Field

[0001] The present application relates to the technical field of diffraction optical waveguides, and in particular to an optical waveguide protection component, an optical waveguide, a device, and a method for preparing the protection component. Background Art

[0002] At present, a protective component can be provided on the optical waveguide of a near-eye display device to protect the optical waveguide through the protective component, thereby maintaining the optical performance of the optical waveguide. When preparing the protective component, it is necessary to form ink bumps on the protective component. In the related art, the ink bumps are formed by printing ink on the protective component. Since the ink itself has the characteristic of being easy to deform, the height of the ink will change during the process of printing the ink on the protective component. The height of the ink bumps on the protective component will also change accordingly, which may easily lead to poor control accuracy of the height of the ink bumps on the protective component. Accordingly, in the case of poor control accuracy of the height of the ink bumps, if the protective component is provided on the optical waveguide, the protective component and the optical waveguide are too close or even in contact with each other, which may easily cause interference between the protective component and the optical waveguide, thereby causing the protective component to have an adverse effect on the light processing ability of the optical waveguide, thereby adversely affecting the display effect of the optical waveguide. Summary of the invention

[0003] The main purpose of the present application is to provide a protective component for an optical waveguide, an optical waveguide, an apparatus and a method for preparing the protective component, aiming to solve the technical problem that during the preparation process of the protective component, due to the easy deformation property of the ink, the height of the ink bumps on the protective component is poorly controlled, thereby resulting in poor protection effect of the protective component on the optical waveguide.

[0004] In a first aspect, an embodiment of the present application provides a protective component for an optical waveguide, the protective component being used to be attached to the optical waveguide to protect the optical waveguide, the protective component comprising a substrate and a plurality of protrusions disposed on the substrate;

[0005] The protrusions are made from the following raw materials: ink and rigid particles.

[0006] In a second aspect, an embodiment of the present application further provides an optical waveguide, on which the above-mentioned protective component is bonded.

[0007] In a third aspect, an embodiment of the present application further provides a near-eye display device, wherein the near-eye display device includes the optical waveguide as described above.

[0008] In a fourth aspect, an embodiment of the present application further provides a method for preparing a protection component, wherein the protection component is a protection component of an optical waveguide, and the preparation method comprises:

[0009] mixing the ink with the rigid particles to obtain a mixed material;

[0010] adding the mixed material onto a printing platform;

[0011] Printing the mixed material onto a substrate via the printing platform;

[0012] The mixed material on the substrate is subjected to a photocuring treatment to obtain a protective component.

[0013] The embodiments of the present application provide a protective component of an optical waveguide, an optical waveguide, an apparatus, and a method for preparing the protective component. The protective component is used to be bonded to the optical waveguide to protect the optical waveguide. The protective component includes a substrate and a plurality of protrusions arranged on the substrate; the protrusions are made of the following raw materials: ink and rigid particles.

[0014] Based on the characteristic that rigid particles are not easily deformed, in the process of preparing the protective component of the optical waveguide, the particle size of the rigid particles can be used to compensate for the height change of the ink in the process of preparing the protrusion, which is conducive to improving the accuracy of controlling the height of the protrusion. Based on the improvement of the accuracy of controlling the height of the protrusion, the protrusion of the protective component can be used to avoid the protective component and the optical waveguide from being too close to each other, so as to avoid interference between the protective component and the optical waveguide. Accordingly, in the case where there is no interference between the protective component and the optical waveguide, the protective component does not have an adverse effect on the light processing ability of the optical waveguide, and thus the protective component does not have an adverse effect on the display effect of the optical waveguide. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0016] Figure 1 It is a structural schematic diagram of an optical waveguide protection component provided in an embodiment of the present application;

[0017] Figure 2 It is a structural schematic diagram of a protective component of an optical waveguide involved in the related art;

[0018] Figure 3 is a schematic diagram of the interference phenomenon between the protection component and the optical waveguide involved in the related art;

[0019] Figure 4 is a schematic diagram of the structure of an optical waveguide provided in an embodiment of the present application;

[0020] Figure 5 is a schematic block diagram of a near-eye display device provided in an embodiment of the present application;

[0021] Figure 6 It is a schematic diagram of a process for preparing a protective component provided in an embodiment of the present application. DETAILED DESCRIPTION

[0022] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0023] The flowcharts shown in the accompanying drawings are only examples and do not necessarily include all the contents and operations / steps, nor must they be executed in the order described. For example, some operations / steps may also be decomposed, combined or partially merged, so the actual execution order may change according to actual conditions.

[0024] Embodiments of the present application provide a protective component of an optical waveguide, an optical waveguide, a device, and a method for preparing the protective component.

[0025] In conjunction with the accompanying drawings, some embodiments of the present application are described in detail below. In the absence of conflict, the following embodiments and features in the embodiments can be combined with each other.

[0026] Exemplarily, the protection component is used to fit with the optical waveguide to protect the optical waveguide. For example, the optical waveguide may be provided with a grating structure, and the grating structure provided on the optical waveguide may be protected by the protection component. Of course, this is not limited to this and is not limited here.

[0027] In related technologies, such as Figure 2 As shown, the protrusions of the protective component are generally ink bumps. The ink bumps are made from the raw material of ink. Due to the easy deformation of ink, the ink is easily affected by force during the preparation of the protective component. For example, when the silk screen steel mesh or printing platform prints the ink bumps of the protective component, it will exert a corresponding force on the ink. When the ink is acted upon by force, the height of the ink is likely to change, and the height of the ink bumps prepared by the ink will also change accordingly. In the case where the height of the ink bumps of the protective component is lower than the corresponding height threshold, if the protective component is bonded to the optical waveguide, it is easy for the protective component and the optical waveguide to be too close to each other and in contact with each other, causing interference between the protective component and the optical waveguide. In the case where interference occurs between the protective component and the optical waveguide, it is easy to have an adverse effect on the light processing capability of the optical waveguide, and thus adversely affect the display effect of the optical waveguide. As shown in FIG. Figure 3As shown, when the height of the ink bumps of the protective component bonded to the optical waveguide is lower than the corresponding height threshold, such as when the height of the ink bumps is less than 5 μm, the waveguide pressure between the ink bumps of the protective component and the wafer provided with the optical waveguide will be large, such as about 20N force, which can easily cause interference between the protective component and the optical waveguide.

[0028] Moreover, in the related art, the cohesive force when printing ink on the substrate of the protective component through the silk screen steel mesh is difficult to control. Under the influence of the thickness of the steel mesh and the easy deformation characteristics of the ink, it is easy to cause the height of the ink bumps formed on the protective component to be lower than the corresponding height threshold, such as 5μm. Furthermore, in the related art, the silk screen steel mesh will be deformed after repeated use, and the silk screen steel mesh is difficult to maintain to the original design value, which is easy to cause the height of the ink printed on the protective component to change, thereby causing the height of the ink bumps formed on the protective component to be lower than the corresponding height threshold, such as 5μm.

[0029] Based on this, there is an urgent need to improve the preparation method of the optical waveguide protection component to improve the control accuracy of the height of the protrusion of the protection component, thereby improving the protection effect of the protection component on the optical waveguide.

[0030] See also Figure 1 , Figure 1 It is a schematic structural diagram of an optical waveguide protection component provided in an embodiment of the present application.

[0031] like Figure 1 As shown, the protection component includes a substrate and a plurality of protrusions formed on the side of the substrate; the protrusions are made of the following materials: ink and rigid particles.

[0032] For example, the substrate of the protection component may include multiple surfaces. Considering that multiple protrusions need to be provided on the surface of the substrate, the surface with the largest size can be selected from the multiple surfaces of the substrate as the surface for printing the protrusions.

[0033] In some embodiments, the ink may include an ink with photocurable properties. The ink with photocurable properties can form a film or dry ink under the irradiation of light of corresponding wavelengths. For example, the ink may include ultraviolet light curing (UV) ink, other photocurable inks, etc., which are not limited here. UV ink can use ultraviolet light of different wavelengths and energies to polymerize monomers in the ink binder into polymers under ultraviolet irradiation, thereby forming a film and drying the ink.

[0034] Exemplarily, the rigid particles may include particles having the characteristic of being difficult to deform. In some embodiments, the refractive index of the rigid particles is close to the refractive index of the material used to prepare the optical waveguide. In the case where the protrusion of the protective component is prepared using ink and rigid particles, and the protective component is bonded to the optical waveguide, the rigid particles in the protrusion will not adversely affect the optical properties of the optical waveguide, such as causing no additional optical scattering. For example, in the case where the material used to prepare the optical waveguide includes a light-curing (UV) resin, based on the refractive index of the UV resin being between 1.49-1.60, the refractive index of the rigid particles can be set to between 1.49-1.60, and / or, the refractive index of the rigid particles can also be set to be close to 1.49 or close to 1.60, without limitation. Based on this, the rigid particles may include silica particles, other particles other than silica particles that have the characteristic of being difficult to deform and have a refractive index close to the refractive index of the UV resin, etc., without limitation.

[0035] Take the rigid particles including silica particles as an example. Silica particles (SiO2) can include silica particles in a spherical form. Silica particles have the characteristic of not being easily deformed, and, compared to ink, silica particles have a higher support strength. Accordingly, since the refractive index of silica particles is close to that of the preparation material of the optical waveguide, such as UV resin, when the protrusion of the protective component is prepared using ink and silica particles as raw materials, and the protective component is bonded to the optical waveguide, the silica particles will not cause additional optical scattering. Based on this, the silica particles will not adversely affect the optical properties of the optical waveguide. Silica particles can also be called silica microspheres, silica nanospheres, etc., which are not limited here.

[0036] In the process of preparing the protrusions, at least one rigid particle can be arranged in each protrusion. The particle sizes of different rigid particles arranged in different protrusions are the same. Taking the rigid particles including silica particles as an example, at least one silica particle can be arranged in each protrusion, and the particle sizes of different silica particles arranged in different protrusions are the same.

[0037] When the protrusion of the protective component is prepared by using ink and rigid particles, the particle size of the rigid particles can be used to compensate for the height change of the ink before and after the protrusion is prepared, so that the height of the protrusion is within the corresponding height threshold range, such as keeping the height of the protrusion greater than or equal to 5μm and less than or equal to 10μm.

[0038] For example, after the corresponding protrusion is formed on the side of the substrate of the protective component, the height of the protrusion can be detected. In an exemplary embodiment, it is possible to determine whether the height of the protrusion is in the corresponding height threshold range by observing whether rigid particles are provided in the protrusion. Taking the rigid particles including silica particles as an example, when silica particles are provided in the protrusion, it can be determined that the height of the protrusion is greater than or equal to 5μm and less than or equal to 10μm. In the case where silica particles are not provided in the protrusion, it can be determined that the height of the protrusion is less than 5μm. When observing whether rigid particles are provided in the protrusion, it can be observed through a microscope. For example, whether silica particles are provided in the protrusion of the protective component through a microscope. Of course, it is not limited to this and is not limited here. Based on this, when detecting the height of the protrusion of the protective component, it is not necessary to measure the true height of the protrusion with high precision to determine whether the height of the protrusion is in the corresponding height threshold range, which is conducive to improving the convenience of height detection of the protrusion.

[0039] In this way, when preparing the protective component of the optical waveguide, the protrusion of the protective component is prepared using ink and rigid particles. The particle size of the rigid particles can be used to compensate for the height change of the ink during the preparation of the protrusion, which is beneficial to improve the accuracy of controlling the height of the protrusion.

[0040] Exemplarily, the rigid particles include silicon dioxide particles; the content of the silicon dioxide particles in the protrusions is 3%-10% by weight.

[0041] For example, the content of silicon dioxide particles in the protrusions may include 3%, 4%, 5%, 6.5%, 7%, 8.2%, 9.4%, 10%, etc., which is not limited here.

[0042] In some embodiments, the content of ink in the protrusion is 90%-97% by weight. For example, the content of ink in the protrusion may include 90%, 90.6%, 91.8%, 93%, 93.5%, 95%, 96%, 97%, etc., without limitation.

[0043] For rigid particles other than silica particles, since the weights of different types of rigid particles may be different, the content of the rigid particles other than silica particles in the protrusions may vary according to the weight of the rigid particles. Accordingly, the content of the ink in the protrusions may also vary according to the weight of the rigid particles.

[0044] Since the protrusion is mainly composed of ink and supplemented by rigid particles, such as silica particles, the height change of the ink before and after the preparation of the protrusion is compensated by the particle size of the rigid particles. Therefore, the proportion of ink in the protrusion is relatively high, and the proportion of silica particles in the protrusion is relatively low. In an exemplary embodiment, the content of silica particles in the protrusion can be related to the particle size of silica in weight percentage. For example, the larger the particle size of the silica particles, the larger the content of the silica particles in the protrusion. The smaller the particle size of the silica particles, the smaller the content of the silica particles in the protrusion, which is not limited here.

[0045] In some embodiments, the height of the protrusion is greater than or equal to 5 μm and less than or equal to 10 μm, and the particle size of the rigid particles is 3 μm-8 μm.

[0046] For example, the height of the rigid particles may include 3 μm, 4.2 μm, 5.6 μm, 6.3 μm, 7 μm, 8 μm, etc., which is not limited here.

[0047] In the case where the protrusion of the protection component is made of ink and rigid particles, since the ink needs to be mixed with the rigid particles, the height of the protrusion can be determined according to the mixing height corresponding to the ink and the rigid particles. Among them, as the number of rigid particles mixed in the ink increases, the height of the ink can change accordingly. Based on this, in the case where the protrusion is made of ink and rigid particles, the particle size of the rigid particles can be used to compensate for the height change of the ink before and after the preparation of the protrusion, so that the height of the protrusion can be greater than or equal to 5μm and less than or equal to 10μm. In the case where the height of the protrusion is greater than or equal to 5μm and less than or equal to 10μm, the waveguide pressing when the protrusion of the protection component is attached to the optical waveguide will be small, such as less than 20N force, which can avoid the optical waveguide and the protection component being too close to each other, resulting in interference between the optical waveguide and the protection component. In the case where no interference occurs between the protection component and the optical waveguide, the protection component does not adversely affect the light processing ability of the optical waveguide, and thus the protection component does not adversely affect the display effect of the optical waveguide.

[0048] In some embodiments, the rigid particles have a particle size of 6.95 μm to 7.05 μm.

[0049] For example, the particle size of the rigid particles may include 6.95 μm, 7 μm, 7.05 μm, etc., which is not limited here.

[0050] When the particle size of the rigid particles is 6.95μm-7.05μm, it can be ensured that the height of the protrusions made of ink and rigid particles is greater than or equal to 5μm and less than or equal to 10μm. Therefore, when the optical waveguide is protected by the protective component, it can be avoided that the optical waveguide and the protective component are too close to each other, causing interference between the optical waveguide and the protective component.

[0051] For example, in the process of forming a plurality of protrusions on the side surface of the substrate, the locations of the protrusions on the side surface of the substrate may be designed.

[0052] In some embodiments, the substrate includes a first surface, the first surface faces a side surface of the optical waveguide on which the grating structure is disposed, and the protrusion is disposed on the first side surface.

[0053] For example, the substrate of the protection component may include a first surface and a second surface. The size of the first surface is larger than the size of the second surface. Considering that a plurality of protrusions need to be provided on the substrate, the first surface with a larger size may be determined as a side surface facing the optical waveguide on which the grating structure is provided, so as to provide the protrusion on the first side surface. For another example, the first surface may include two opposite first surfaces, and one of the first surfaces may be selected as a side surface facing the optical waveguide on which the grating structure is provided, so as to provide the protrusion on one of the first surfaces.

[0054] In some embodiments, the distance between two adjacent protrusions on the substrate is 1.95 mm to 2.05 mm.

[0055] For example, the distance between two adjacent protrusions may include 1.95 mm, 1.96 mm, 1.98 mm, 1.99 mm, 2 mm, 2.01 mm, 2.03 mm, 2.05 mm, etc., which is not limited here.

[0056] Based on the distance between two adjacent protrusions being 1.95 mm to 2.05 mm, a plurality of protrusions can be arranged at intervals on the base of the protection component. Accordingly, the protection component can be attached to the optical waveguide through a plurality of protrusions arranged at intervals, so as to avoid the interference phenomenon caused by the protection component and the optical waveguide being too close, and the intervals between the protrusions can prevent the protrusions from contacting the grating structure arranged in the optical waveguide, so as to avoid adversely affecting the light processing capability of the optical waveguide, thereby avoiding adversely affecting the display effect of the optical waveguide.

[0057] In some embodiments, the diameter of the protrusions is 50 μm-70 μm.

[0058] For example, the diameter of the protrusion may include 50 μm, 52 μm, 55 μm, 60 μm, 63 μm, 64 μm, 68 μm, 70 μm, etc., which is not limited here.

[0059] Based on the diameter of the protrusion being 50 μm-70 μm, the protrusion can be preferably disposed on the substrate of the protection component, such as on the first surface of the substrate of the protection component.

[0060] The optical waveguide protection component provided in the above embodiment is used to be attached to the optical waveguide to protect the optical waveguide. The protection component includes a substrate and a plurality of protrusions arranged on the substrate; the protrusions are made of the following materials: ink and rigid particles.

[0061] Based on the characteristic that rigid particles are not easily deformed, in the process of preparing the protective component of the optical waveguide, the particle size of the rigid particles can be used to compensate for the height change of the ink in the process of preparing the protrusion, which is conducive to improving the accuracy of controlling the height of the protrusion. Based on the improvement of the accuracy of controlling the height of the protrusion, the protrusion of the protective component can be used to avoid the protective component and the optical waveguide from being too close to each other, so as to avoid interference between the protective component and the optical waveguide. Accordingly, in the case where there is no interference between the protective component and the optical waveguide, the protective component does not have an adverse effect on the light processing ability of the optical waveguide, and thus the protective component does not have an adverse effect on the display effect of the optical waveguide.

[0062] See also Figure 4 The embodiment of the present application also provides an optical waveguide, on which the protective component as described above is attached.

[0063] In some embodiments, the optical waveguide includes two opposing third surfaces and two opposing fourth surfaces, and the size of the third surface is larger than the size of the fourth surface. In the case where a grating structure is provided on one of the third surfaces of the optical waveguide, the optical waveguide can be bonded to the protective component through the third surface provided with the grating structure. For example, the third surface provided with the grating structure is bonded to a surface provided with a protrusion on the protective component, such as the first surface of the protective component.

[0064] The optical waveguide may also be provided with optical structures other than the protection component, such as a grating structure, etc., which are not limited here. The grating structure may include a light coupling-in region, a light coupling-out region, etc., which are not limited here.

[0065] The protective component attached to the optical waveguide in the embodiment of the present application can refer to the description of the protective component provided in the above embodiments, and will not be repeated here.

[0066] When the optical waveguide and the protective component are bonded, since the protrusion of the protective component can use the particle size of the rigid particles to compensate for the height change of the ink before and after the protrusion is prepared, the height of the protrusion in the protective component can be within the corresponding height threshold range, such as greater than or equal to 5μm and less than or equal to 10μm, thereby avoiding the protective component and the optical waveguide from being too close, thereby avoiding interference between the protective component and the optical waveguide. Accordingly, when there is no interference between the protective component and the optical waveguide, the protective component does not adversely affect the light processing ability of the optical waveguide, and thus the protective component does not adversely affect the display effect of the optical waveguide, thereby maintaining the optical performance of the optical waveguide.

[0067] Please refer to Figure 5 An embodiment of the present application also provides a near-eye display device, and the near-eye display device includes the above-mentioned optical waveguide.

[0068] like Figure 5 As shown, the optical waveguide can be provided in a near-eye display device. The near-eye display device can realize the near-eye display function through the optical waveguide. The height of the protrusion of the protective component attached to the optical waveguide is accurately controlled. If the height of the protrusion of the protective component is within the corresponding height threshold range, such as greater than or equal to 5μm and less than or equal to 10μm, the protective component and the optical waveguide can be prevented from being too close, thereby avoiding interference between the protective component and the optical waveguide. Accordingly, in the case where no interference occurs between the protective component and the optical waveguide, the protective component does not adversely affect the light processing ability of the optical waveguide, and thus the protective component does not adversely affect the display effect of the optical waveguide, which is beneficial to maintaining the near-eye display function of the near-eye display device and enhancing the user experience of the near-eye display device.

[0069] In an exemplary embodiment, the optical waveguide can be applied to a near-eye display device. The near-eye display device may include an augmented reality (AR) device. The AR device may include AR glasses, AR helmets, and the like, which are not limited here. Taking AR glasses as an example, if a user needs to perform daily maintenance on the lenses of the AR glasses, such as wiping the AR glasses, then the AR glasses are provided with an optical waveguide bonded with a protective component, and the protrusion on the protective component can protect the optical waveguide from being squeezed by the wiping force during the wiping process of the AR glasses, thereby avoiding interference between the protective component and the optical waveguide, and then maintaining the display effect of the AR glasses.

[0070] Based on the improvement of the highly controlled accuracy of the ink component of the protective component, it can be ensured that no interference occurs between the protective component and the optical waveguide, so as to maintain the display effect of the near-eye display device.

[0071] See also Figure 6The embodiment of the present application also provides a method for preparing a protective component. The protective component is a protective component of an optical waveguide. The protective component can be used to be bonded to the optical waveguide. The optical waveguide bonded with the protective component can be set on a near-eye display device.

[0072] like Figure 6 The method for preparing the protection component includes steps S101 to S104.

[0073] S101, mixing ink with rigid particles to obtain a mixed material.

[0074] In some embodiments, the ink and the rigid particles are stirred to mix the ink and the rigid particles to obtain a mixed material. For example, the ink and the rigid particles can be stirred by an ink agitator to obtain a mixed material. In an exemplary embodiment, the rigid particles include silica particles as an example. In terms of weight percentage, silica particles with a content of 6% and a particle size of 7μm can be added to the ink, and the ink to which the silica particles are added is stirred by an ink agitator to obtain a mixed material. For example, the total weight of the ink and the silica particles stirred each time is greater than or equal to 100 grams. For another example, the time for stirring the ink and the silica particles each time is greater than or equal to 10 minutes. Of course, the mixing method of the ink and the rigid particles is not limited to this, and is not limited here.

[0075] S102, adding the mixed material onto the printing platform.

[0076] When the mixed material is obtained, the mixed material can be added to a printing platform so that the printing platform can print the substrate of the protective component.

[0077] S103, printing the mixed material onto the substrate of the protective component through a printing platform.

[0078] The printing platform can print the mixed material onto the substrate of the protective component, and the substrate of the protective component can be printed with the mixed material formed by mixing ink and silica.

[0079] S104, performing photocuring treatment on the mixed material on the substrate to obtain a protective component.

[0080] For example, when the mixed material on the substrate is subjected to a photocuring treatment, the mixed material on the substrate can be irradiated with ultraviolet light. Of course, this is not limited to this and is not limited here. By subjecting the mixed material on the substrate to a photocuring treatment, the ink in the mixed material can form a film or dry ink, thereby forming a protrusion on the substrate of the protective component. Accordingly, when the protrusion is formed on the substrate of the protective component, the preparation of the protective component can be completed.

[0081] The protection components of the embodiments of the present application can refer to the descriptions of the protection components provided in the above embodiments, which will not be repeated here.

[0082] The above embodiment provides a method for preparing a protective component, wherein the protective component is a protective component for an optical waveguide, and the method comprises mixing ink with silica to obtain a mixed material; adding the mixed material to a printing platform; printing the mixed material onto a substrate of the protective component through the printing platform; and photocuring the mixed material on the substrate to obtain the protective component.

[0083] Based on the property of silicon dioxide that is not easily deformed, in the process of preparing the protective component, the particle size of the rigid particles can be used to compensate for the height change of the ink in the process of preparing the protrusion, which is conducive to improving the accuracy of controlling the height of the protrusion. Based on the improvement of the accuracy of controlling the height of the protrusion, the protrusion of the protective component can be used to avoid the protective component and the optical waveguide from being too close to each other, so as to avoid interference between the protective component and the optical waveguide. Accordingly, in the case where there is no interference between the protective component and the optical waveguide, the protective component does not adversely affect the light processing ability of the optical waveguide, and thus the protective component does not adversely affect the display effect of the optical waveguide.

[0084] It should be understood that the terms used in this specification of the application are only for the purpose of describing specific embodiments and are not intended to limit the application. As used in the specification of the application and the attached claims, unless the context clearly indicates otherwise, the singular forms of "one", "an" and "the" are intended to include plural forms. It should also be understood that the term "and / or" used in the specification of the application and the attached claims refers to any combination of one or more of the items listed in association and all possible combinations, and includes these combinations. It should be noted that in this article, the term "include", "include" or any other variant thereof is intended to cover non-exclusive inclusion, so that the process, method, article or system including a series of elements includes not only those elements, but also includes other elements that are not clearly listed, or also includes elements inherent to such process, method, article or system. In the absence of more restrictions, the elements defined by the sentence "include one..." do not exclude the existence of other identical elements in the process, method, article or system including the element.

[0085] The serial numbers of the embodiments of the present application are for description only and do not represent the advantages and disadvantages of the embodiments. The above description is only a specific implementation mode of the present application, but the protection scope of the present application is not limited thereto. Any technician familiar with the technical field can easily think of various equivalent modifications or replacements within the technical scope disclosed in the present application, and these modifications or replacements should be included in the protection scope of the present application. Therefore, the protection scope of the present application shall be based on the protection scope of the claims.

Claims

1. A protective component for an optical waveguide, the protective component being used to be attached to the optical waveguide to protect the optical waveguide, characterized in that: The protection assembly includes a base and a plurality of protrusions disposed on the base; The protrusions are made from the following raw materials: ink and rigid particles.

2. The protection assembly according to claim 1, characterized in that: The rigid particles include silicon dioxide particles; in terms of weight percentage, the content of the silicon dioxide particles in the protrusions is 3%-10%.

3. The protection assembly according to claim 1 or 2, characterized in that: The height of the protrusion is greater than or equal to 5 μm and less than or equal to 10 μm, and the particle size of the rigid particles is 3 μm-8 μm.

4. The protection assembly according to claim 3, characterized in that: The particle size of the rigid particles is 6.95 μm-7.05 μm.

5. The protection assembly according to claim 1 or 2, characterized in that: The substrate comprises a first surface, the first surface faces a side surface of the optical waveguide on which a grating structure is arranged, and the protrusion is arranged on the first surface.

6. The protection assembly according to claim 5, characterized in that: The distance between two adjacent protrusions on the substrate is 1.95 mm-2.05 mm.

7. The protection assembly according to claim 5, characterized in that: The protrusion has a diameter of 50 μm-70 μm.

8. An optical waveguide, characterized in that: The protection component according to any one of claims 1 to 7 is bonded onto the optical waveguide.

9. A near-eye display device, characterized in that: The near-eye display device comprises the optical waveguide of claim 8.

10. A method for preparing a protective component, characterized in that: The protection component is a protection component of an optical waveguide, and the preparation method comprises: mixing the ink with the rigid particles to obtain a mixed material; adding the mixed material onto a printing platform; Printing the mixed material onto a substrate of a protective component through the printing platform; The mixed material on the substrate is subjected to a photocuring treatment to obtain a protective component.

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