COG transparent display screen and preparation method

Abstract

The invention discloses a COG transparent display screen and a preparation method, and belongs to the technical field of display screens. The COG transparent display screen comprises a substrate, a first circuit layer is arranged on the upper surface of the substrate, a transparent first insulating layer is arranged above the first circuit layer, a second circuit layer with the same circuit as the first circuit layer is arranged on the upper surface of the first insulating layer, and a transparent second insulating layer is arranged above the second circuit layer; the first circuit layer and the fourth circuit layer each comprise a plurality of display modules, and after the display modules rotate by 180 degrees in the horizontal plane, the chips and the ICs coincide with the chips and the ICs before rotation. By the adoption of the COG transparent display screen and the preparation method, the problem that an existing transparent screen is poor in display effect after being assembled can be solved.

Description

Technical Field

[0001] The present invention relates to the technical field of display screens, and in particular to a COG transparent display screen and a preparation method thereof. Background Art

[0002] Mini LED transparent screen is an advanced display technology that combines the characteristics of Mini LED backlight technology and transparent display. Mini LED backlight refers to LED chips with a size between 50-200 microns. These small-sized LEDs can control the backlight area more finely, providing higher contrast and richer color performance. The transparent screen uses special materials and structural design to make the background visible through the screen while the screen displays the image, achieving a semi-transparent or fully transparent effect. Mini LED transparent screens are used in commercial advertising, exhibitions, outdoor landscapes and other fields. They mainly lay the circuit layer on the transparent substrate, and then use the mini chip package on the glass substrate to realize image display.

[0003] When the Mini LED transparent screen is assembled left and right or up and down, the effect between the light boards is different from that between non-light boards, which affects the display effect. Summary of the invention

[0004] The purpose of the present invention is to provide a COG transparent display screen and a preparation method thereof, so as to solve the problem that the existing transparent screens have poor display effects after being assembled.

[0005] To achieve the above-mentioned purpose, the present invention provides a COG transparent display screen, comprising a substrate, a first circuit layer is arranged on the upper surface of the substrate, a transparent first insulating layer is arranged above the first circuit layer, a second circuit layer with the same circuit as the first circuit layer is arranged on the upper surface of the first insulating layer, and a transparent second insulating layer is arranged above the second circuit layer; the first circuit layer and the fourth circuit layer each include a plurality of display modules, and after the display module is rotated 180° in a horizontal plane, the chip and IC overlap with those before the rotation.

[0006] Preferably, the display module includes a first pixel point, a second pixel point, a third pixel point and a fourth pixel point with the same structure, and the first pixel point, the second pixel point, the third pixel point and the fourth pixel point are rotated 90° counterclockwise in sequence along the clockwise direction.

[0007] Preferably, the first pixel point, the second pixel point, the third pixel point and the fourth pixel point include a plurality of RGB chips and an IC, and the RGB chip is connected to the IC.

[0008] Preferably, the substrate is a transparent heat-resistant glass plate.

[0009] Preferably, the first circuit layer and the second circuit layer are both copper layers, the thickness of the first circuit layer is 6µm-8µm, and the thickness of the second circuit layer is 1µm-3µm.

[0010] Preferably, the copper layer of the first circuit layer includes a PVD copper layer and an electroplated copper layer, and the electroplated copper layer is located above the PVD copper layer; and the copper layer of the second circuit layer is a PVD copper layer.

[0011] Preferably, the transmittance of the first circuit layer and the second circuit layer is not less than 70%.

[0012] Preferably, an invisible layer for protecting the second circuit layer is provided between the second circuit layer and the second insulating layer.

[0013] Preferably, the stealth layer is a tin-plated layer or a nickel-plated layer.

[0014] The method for preparing the COG transparent display screen comprises the following steps: S1. Deposit a copper layer to 0.5µm-1µm on a transparent heat-resistant glass substrate by PVD to form a PVD copper layer; then electroplate a copper layer on the PVD copper layer to thicken to 6µm-8µm to form a first circuit layer; Or directly apply a 6µm-8µm copper film on the glass substrate to form the first circuit layer; S2, laying a transparent first insulating layer on the first circuit layer; S3, depositing a copper layer to 1µm-3µm on the first insulating layer by PVD to form a second circuit layer; S4, plating an invisible layer on the second circuit layer; S5. Lay a second insulating layer on top of the invisible layer.

[0015] The advantages and positive effects of the COG transparent display screen and the preparation method thereof of the present invention are: 1. By designing the chip and IC layout, the chip and IC can be completely overlapped after rotating 180°, and the chip layout of the upper and lower or left and right light boards is consistent, which improves the display effect and facilitates the assembly operation between light boards.

[0016] 2. The substrate is made of transparent heat-resistant glass, the circuit layer is made of PVD reflective copper plating, and a tin plating layer or a nickel plating layer is set on the second circuit layer to improve the light transmittance of the display screen.

[0017] The technical solution of the present invention is further described in detail below through the accompanying drawings and embodiments. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 is a schematic diagram of a cross-sectional structure of an embodiment of the present invention; Figure 2 is a schematic diagram of the structure of a display module according to an embodiment of the present invention; Figure 3 is a schematic diagram of the structure of the first circuit layer according to an embodiment of the present invention; Figure 4 is a schematic diagram of the structure of the second circuit layer according to an embodiment of the present invention; Figure 5 This is a schematic diagram of the circuit screen structure of the standard arrangement of the present invention; Figure 6 Schematic diagram of the structure of the rotationally arranged circuit screen of the present invention.

[0019] Reference numerals 1. Substrate; 2. First circuit layer; 3. First insulating layer; 4. Second circuit layer; 5. Invisible layer; 6. Second insulating layer; 7. First pixel point; 8. Second pixel point; 9. Third pixel point; 10. Fourth pixel point. DETAILED DESCRIPTION

[0020] In the description of the present invention, it should be noted that the terms "upper", "lower", "inside", "outside", etc. indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, or the positions or positional relationships in which the invented product is usually placed when in use. They are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention. In the description of the present invention, it should also be noted that, unless otherwise clearly specified and limited, the terms "setting", "installation", and "connection" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be an indirect connection through an intermediate medium, or it can be a connection between the two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0021] In this application, unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by technicians in the technical field of this application. In the event of any inconsistency, the meaning described in this specification or the meaning derived from the contents recorded in this specification shall prevail. In addition, the terms used herein are only for the purpose of describing the embodiments of the present application and are not intended to limit the present application. In order to accurately describe the technical content in this application and to accurately understand the present invention, the following explanations or definitions are given to the terms used in this specification before describing the specific embodiments: The embodiments of the present invention are described in detail below in conjunction with the accompanying drawings.

[0022] like Figure 1A COG transparent display screen includes a substrate 1, which is a transparent heat-resistant glass plate. A first circuit layer 2 is arranged on the upper surface of the substrate 1, a transparent first insulating layer 3 is arranged above the first circuit layer 2, a second circuit layer 4 having the same circuit as the first circuit layer 2 is arranged on the upper surface of the first insulating layer 3, and a transparent second insulating layer 6 is arranged above the second circuit layer 4. The second insulating layer 6 is used to encapsulate the display screen.

[0023] like Figure 2 , Figure 3 , Figure 4 As shown. The first circuit layer 2 and the fourth circuit layer each include a plurality of display modules, and the display modules are connected. The display module includes a first pixel point 7, a second pixel point 8, a third pixel point 9 and a fourth pixel point 10 with the same structure, and the first pixel point 7, the second pixel point 8, the third pixel point 9 and the fourth pixel point 10 each include a plurality of RGB chips and ICs (integrated circuits), and the RGB chips are connected to the ICs.

[0024] The first pixel point 7, the second pixel point 8, the third pixel point 9 and the fourth pixel point 10 are rotated 90° counterclockwise in the clockwise direction, so that the chip and the IC overlap with those before the rotation after the display module rotates 180° in the horizontal plane. By disrupting the arrangement of the LED lights of the first pixel point 7, the second pixel point 8, the third pixel point 9 and the fourth pixel point 10, the messy combination can even out the difference in left and right viewing angles, reduce the display difference at the splicing point, and improve the display effect at the splicing point.

[0025] The first circuit layer 2 and the second circuit layer 4 are both copper layers. The copper layer of the first circuit layer includes a PVD copper layer and an electroplated copper layer, and the electroplated copper layer is located above the PVD copper layer. A copper film of a specific thickness can also be directly applied to the substrate 1. The copper layer of the second circuit layer is a PVD copper layer. Using PVD (physical vapor deposition) to form a copper layer is conducive to improving the smoothness of the copper layer surface and the uniformity of the thin copper layer. The copper layer can improve the transmission effect of electrical signals.

[0026] The thickness of the first circuit layer 2 is 6µm-8µm, preferably 7µm. The thickness of the second circuit layer 4 is 1µm-3µm, preferably 2µm. The line width of the first circuit layer 2 and the second circuit layer 4 is as small as possible to reduce the occupied area of ​​the overall circuit, ensure that the light transmittance of the first circuit layer 2 and the second circuit layer 4 is not less than 70%, and improve the transparency of the display screen.

[0027] An invisible layer 5 is provided between the second circuit layer 4 and the second insulating layer 6 to protect the second circuit layer 4. The invisible layer 5 is a tin-plated layer or a nickel-plated layer. The tin-plated layer and the nickel-plated layer can not only protect the circuit, but also make the circuit look more transparent after light reflection, thereby improving the transmittance of the display screen.

[0028] The first insulating layer 3 and the second insulating layer 6 are made of existing polyimide, epoxy resin, polycarbonate, PET, etc. as needed, and are connected to the substrate 1 by using existing methods such as gluing or hot pressing.

[0029] The method for preparing the COG transparent display screen comprises the following steps: S1. A copper layer is deposited on a transparent heat-resistant glass substrate 1 to a thickness of 0.5µm-1µm by PVD to form a PVD copper layer. Then, a copper layer is electroplated on the PVD copper layer to increase the thickness to 7µm to form a first circuit layer 2.

[0030] Alternatively, a 7µm copper film is directly applied on the glass substrate 1 to form the first circuit layer.

[0031] S2 . Lay a transparent first insulating layer 3 on the first circuit layer 2 .

[0032] S3. Deposit a copper layer to a depth of 2 µm on the first insulating layer 3 by PVD to form a second circuit layer 4.

[0033] S4 , plating an invisible layer 5 on the second circuit layer 4 .

[0034] S5, laying a second insulating layer 6 on the invisible layer 5 to complete the preparation of the COG transparent display screen.

[0035] The performance of the circuit with the standard arrangement is simulated and compared with the circuit with the chip of the present invention rotated 180 degrees. Figure 5 As shown, the rotation layout screen is as follows Figure 6 The color difference is calculated using CIE coordinates.

[0036] In the standard scheme: CIE coordinates x=0.343, y=0.349; overall color uniformity: ∆Emin=0.0005, ∆Emax=0.0035.

[0037] Rotation scheme under the same parameters: CIE coordinates x=0.345, y=0.352; overall color uniformity: ∆Emin=0.0002, ∆Emax=0.0014.

[0038] This shows that the overall color consistency in the rotation scheme is well maintained and there will be no problem of color unevenness.

[0039] Color difference at the joint of the standard light panel: ∆E=0.0019.

[0040] Chromatic difference at the joint of the rotating light panel: ∆E=0.0006.

[0041] Description The rotation scheme optimizes the color inconsistency problem caused by the rotation and splicing of light panels in the standard scheme.

[0042] The color difference between the standard solution and the rotated solution is ∆E=1.3.

[0043] This indicates that the color difference is within the acceptable range and the color difference with the standard solution is small. In the application, this difference can be corrected by selecting the LED lamp.

[0044] The color difference evaluation table is shown in Table 1.

[0045] Table 1 Color difference evaluation table

[0046] Therefore, the COG transparent display screen and the preparation method described in the present invention can solve the problem of poor display effect after the existing transparent screens are assembled.

[0047] Finally, it should be noted that the above embodiments are only used to illustrate the technical solution of the present invention rather than to limit it. Although the present invention has been described in detail with reference to the preferred embodiments, those skilled in the art should understand that they can still modify or replace the technical solution of the present invention with equivalents, and these modifications or equivalent replacements cannot cause the modified technical solution to deviate from the spirit and scope of the technical solution of the present invention.

Claims

1. A COG transparent display screen, characterized in that: It includes a substrate, a first circuit layer is arranged on the upper surface of the substrate, a transparent first insulating layer is arranged above the first circuit layer, a second circuit layer with the same circuit as the first circuit layer is arranged on the upper surface of the first insulating layer, and a transparent second insulating layer is arranged above the second circuit layer; the first circuit layer and the fourth circuit layer each include a plurality of display modules, and after the display module is rotated 180° in the horizontal plane, the chip and IC overlap with those before the rotation.

2. The COG transparent display screen according to claim 1, characterized in that: The display module comprises a first pixel point, a second pixel point, a third pixel point and a fourth pixel point having the same structure, and the first pixel point, the second pixel point, the third pixel point and the fourth pixel point are rotated 90 degrees counterclockwise in sequence along the clockwise direction.

3. The COG transparent display screen according to claim 2, characterized in that: The first pixel point, the second pixel point, the third pixel point and the fourth pixel point include a plurality of RGB chips and an IC, and the RGB chip is connected to the IC.

4. The COG transparent display screen according to claim 1, characterized in that: The substrate is a transparent heat-resistant glass plate.

5. The COG transparent display screen according to claim 1, characterized in that: The first circuit layer and the second circuit layer are both copper layers, the thickness of the first circuit layer is 6µm-8µm, and the thickness of the second circuit layer is 1µm-3µm.

6. The COG transparent display screen according to claim 5, characterized in that: The copper layer of the first circuit layer includes a PVD copper layer and an electroplated copper layer, and the electroplated copper layer is located above the PVD copper layer; the copper layer of the second circuit layer is a PVD copper layer.

7. The COG transparent display screen according to claim 1, characterized in that: The transmittance of the first circuit layer and the second circuit layer is not less than 70%.

8. The COG transparent display screen according to claim 1, characterized in that: An invisible layer for protecting the second circuit layer is arranged between the second circuit layer and the second insulating layer.

9. The COG transparent display screen according to claim 8, characterized in that: The invisible layer is a tin-plated layer or a nickel-plated layer.

10. A method for preparing a COG transparent display screen according to any one of claims 1 to 9, characterized in that: The following steps are involved: S1. Deposit a copper layer to 0.5µm-1µm on a transparent heat-resistant glass substrate by PVD to form a PVD copper layer; then electroplate a copper layer on the PVD copper layer to thicken to 6µm-8µm to form a first circuit layer; Or directly apply a 6µm-8µm copper film on the glass substrate to form the first circuit layer; S2, laying a transparent first insulating layer on the first circuit layer; S3, depositing a copper layer to 1µm-3µm on the first insulating layer by PVD to form a second circuit layer; S4, plating an invisible layer on the second circuit layer; S5. Lay a second insulating layer on top of the invisible layer.

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