Potting drive transformers and electronic equipment
The potted drive transformer is designed with insulating heat dissipation medium filling and closed magnetic circuit design to solve the heat dissipation and insulation problems of the drive transformer, achieve efficient heat dissipation and improve insulation performance, and ensure the stability and reliability of the device under high-power operation.
Patent Information
- Application Number
- CN202510106797.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2025-01-23
- Publication Date
- 2025-09-23
- Estimated Expiration
- 2045-01-23
AI Technical Summary
The existing drive transformers have insufficient heat dissipation and insulation performance, which causes the device to overheat, fail in insulation, and even burn out when running at high power.
It adopts a potting structure, with metal terminals arranged at the bottom of the frame, the winding wire wrapped around the frame, and the potting cover forming a accommodating cavity filled with insulating heat dissipation medium. The magnetic core group is buckled on the frame and the potting cover to form a closed magnetic circuit, optimizing heat dissipation and insulation performance.
It improves the heat dissipation efficiency and insulation performance of the device, enhances reliability, avoids performance degradation and insulation failure caused by overheating, extends service life, and reduces performance degradation caused by changes in the external environment.
Smart Images

Figure CN119920568B_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the technical field of magnetic devices, and in particular to a potted drive transformer and electronic equipment. Background Art
[0002] As an important electromagnetic component in electronic circuits, drive transformers are widely used in power conversion, signal transmission and isolation circuits. The current mainstream drive transformers are usually assembled from components such as the skeleton, magnetic core, and wire wrap through multiple processes. Their overall performance and structural stability depend to a large extent on the precision and assembly process of each component. In related technologies, the main heat dissipation method for drive transformers is through natural heat dissipation. However, this heat dissipation method has certain disadvantages. If the current at the device input end is too large or the device wire diameter is too small during design, the paint film of the device wire wrap will be melted, causing defects in the client circuit board. In severe cases, the transformer will burn out. This situation needs to be changed. Summary of the Invention
[0003] In view of this, the present application provides a potted drive transformer and electronic equipment to solve the above-mentioned technical problems.
[0004] To achieve the above objectives, according to the first aspect, the technical solution adopted is:
[0005] A potting type drive transformer, comprising:
[0006] A frame, wherein a plurality of metal terminals are arranged at the bottom end of the frame;
[0007] A winding coil, wherein the winding coil is wound on the frame, and each lead connector of the winding coil is electrically connected to each of the metal terminals;
[0008] A potting cover, wherein the potting cover is sleeved on the frame and is recessed to form a receiving cavity adapted for the frame and the winding coil, the receiving cavity having a potting space relative to the winding coil, and the potting space is filled with an insulating heat dissipation medium that wraps the winding coil;
[0009] A magnetic core group is buckled on the frame and the potting cover.
[0010] The present application is further configured as follows: the magnetic core group includes a first magnetic core and a second magnetic core, the first magnetic core and the second magnetic core are arranged relative to each other to form a frame structure, and the frame structure is sleeved on the skeleton and the potting cover.
[0011] The present application is further configured as follows: the first magnetic core and the second magnetic core are designed in a horizontal Π-shaped structure.
[0012] The present application is further configured as follows: the skeleton has a connecting through hole, and part of the first magnetic core and the second magnetic core are connected in the connecting through hole, so that the magnetic core group is set on the skeleton and the potting cover to form a closed magnetic circuit.
[0013] The present application is further configured as follows: the skeleton includes a winding part and an end plate part, the end plate part is integrally connected to the two ends of the winding part, the winding wire package is wrapped around the outer wall of the winding part, the metal terminal is connected to the end plate part, and the connecting through hole passes through the winding part along the axial direction of the winding part.
[0014] The present application is further configured as follows: an expansion magnet is integrally connected to one side of the first magnetic core and the second magnetic core away from the connecting through hole, and the expansion magnet is attached to the top plane of the potting cover.
[0015] The present application is further configured as follows: a support boss is integrally connected to the side of the end plate portion facing away from the winding portion, a plurality of pin bumps are arranged at intervals at the bottom end of the support boss, and each of the metal terminals is correspondingly embedded on each of the pin bumps, wherein the top end of the support boss has a support working surface, and protective wing plates are integrally connected to both sides of the potting cover body, and the protective wing plates are affixed to the support working surface.
[0016] The present application is further configured as follows: the metal terminal includes a first connecting pin and a second connecting pin that protrude from the support boss on the pin bump along the axial direction of the winding portion, a parallel interval is maintained between the first connecting pin and the second connecting pin, the lead connector of the winding coil is electrically connected to the first connecting pin, the second connecting pin is externally connected to an external device, and the protective wing plate protrudes from the first connecting pin and the second connecting pin along the axial direction of the winding portion.
[0017] The present application is further configured as follows: fitting holes adapted to the connecting through holes are opened on both sides of the potting cover body, the frame structure for the first magnetic core and the second magnetic core is sleeved on the skeleton and the potting cover body, and assembly grooves are symmetrically opened on the inner wall of the potting cover body, and the inner wall of the assembly groove matches the side contour of the end plate part.
[0018] According to the second aspect, the technical solution adopted is:
[0019] An electronic device comprises the encapsulated drive transformer described in any one of the above items.
[0020] To sum up, compared with the prior art, the present application discloses a potted drive transformer and an electronic device, wherein a plurality of metal terminals are arranged at the bottom end of the skeleton of the potted drive transformer, and the winding wire package is wound on the skeleton, and each lead connector thereof is electrically connected to each metal terminal, wherein the potting cover is sleeved on the skeleton, and the potting cover is recessed to form a accommodating cavity adapted to the skeleton and the winding wire package, and the accommodating cavity has a potting space relative to the winding wire package, and the potting space is filled with an insulating heat dissipation medium that wraps the winding wire package, and the magnetic core group is buckled on the skeleton and the potting cover. That is, through the above arrangement, the heat dissipation performance and insulation performance of the device are optimized, and the reliability of the device is improved. BRIEF DESCRIPTION OF THE DRAWINGS
[0021] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following is a brief introduction to the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present application. For those skilled in the art, other drawings can be obtained based on these drawings without creative work.
[0022] Figure 1 It is a schematic diagram of the three-dimensional structure of the potted drive transformer of the present application;
[0023] Figure 2 This is a schematic diagram of the three-dimensional structure of the potted drive transformer of the present application from another angle;
[0024] Figure 3 yes Figure 1 AA cross-sectional structural diagram;
[0025] Figure 4 This is a schematic diagram of the three-dimensional structure of the potted drive transformer with a hidden potting cover of the present application;
[0026] Figure 5 It is a schematic diagram of the three-dimensional structure of the skeleton of the present application;
[0027] Figure 6 It is a schematic diagram of the three-dimensional structure of the potting cover body of the present application. DETAILED DESCRIPTION
[0028] Exemplary embodiments will be described in detail herein, with examples illustrated in the accompanying drawings. When the following description refers to the drawings, identical numbers in different figures represent identical or similar elements unless otherwise indicated. The embodiments described in the following exemplary embodiments are not intended to represent all embodiments consistent with the present application. Rather, they are merely examples of apparatus and methods consistent with certain aspects of the present application, as detailed in the appended claims.
[0029] It should be noted that, in this document, the terms "include", "comprises" or any other variations thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device comprising a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, an element defined by the sentence "comprising a ..." does not exclude the presence of other identical elements in the process, method, article or device comprising the element. In addition, components, features, and elements with the same name in different embodiments of the present application may have the same meaning or different meanings, and their specific meanings need to be determined based on their explanation in the specific embodiment or further combined with the context of the specific embodiment.
[0030] It should be understood that the specific embodiments described herein are only used to explain the present application and are not intended to limit the present application.
[0031] In the subsequent description, the use of suffixes such as "module", "component" or "unit" to represent elements is only for the purpose of facilitating the description of the present application and has no specific meaning. Therefore, "module", "component" or "unit" can be used interchangeably.
[0032] In the description of this application, it should be noted that the terms "upper," "lower," "left," "right," "inner," and "outer," etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings and are intended solely to facilitate the description of this application and simplify the description. They do not indicate or imply that the devices or components referred to must have a specific orientation, be constructed, or operate in a specific orientation. Therefore, they should not be construed as limitations on this application. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.
[0033] The technical solutions shown in this application will be described in detail below through specific embodiments. It should be noted that the description order of the following embodiments does not limit the priority order of the embodiments.
[0034] See also Figures 1 to 6 The potted drive transformer of the embodiment of the present application includes a skeleton 1, a winding wire package 3, a potting cover 4 and a magnetic core group 5.
[0035] During the specific implementation process, several metal terminals 2 are arranged at the bottom end of the skeleton 1, the winding coil 3 is wound on the skeleton 1, each lead connector of the winding coil 3 is electrically connected to each metal terminal 2, the potting cover 4 is sleeved on the skeleton 1, and the potting cover 4 is recessed to form a accommodating cavity 41 that adapts to the skeleton 1 and the winding coil 3. The accommodating cavity 41 has a potting space 6 relative to the winding coil 3, and the potting space 6 is filled with an insulating heat dissipation medium that wraps the winding coil 3. At the same time, the magnetic core group 5 is buckled on the skeleton 1 and the potting cover 4.
[0036] In the encapsulated drive transformer of this embodiment, each lead connector at the bottom of the skeleton 1 is electrically connected to each metal terminal 2 to provide a stable electrical connection point for the lead of the winding coil 3 through the metal terminal 2. The encapsulating cover 4 forms an encapsulating space 6 with the skeleton 1 and the winding coil 3 through the recessed accommodating cavity 41. The insulating heat dissipation medium filled in the encapsulating space 6 can tightly wrap the winding coil 3, and conduct the heat generated during the operation of the device winding to improve the heat dissipation efficiency of the winding coil 3, effectively avoid performance degradation or insulation failure due to overheating, maintain the stability of the device during high-power operation, and extend the service life of the transformer.
[0037] Among them, the filling design of the insulating heat dissipation medium in the potting space 6 plays a role of heat conduction and insulation, that is, the structural design of the accommodating cavity 41 ensures that the insulating heat dissipation medium can completely fill the gap around the winding wire package 3 and the skeleton 1, eliminate the air layer, and ensure the heat dissipation and insulation effect, and the magnetic core group 5 is buckled on the skeleton 1 and the potting cover 4 to form a complete closed magnetic circuit, construct a complete drive transformer composition, and reduce the electromagnetic interference problem caused by magnetic flux leakage.
[0038] That is, the skeleton 1, the potting cover 4, the winding wire package 3 and the magnetic core group 5 are integrated and assembled by sleeve and buckle, and the structure is compact. The protective design of the potting cover 4 and the accommodating cavity 41 effectively reduces the impact of the external environment (such as humidity, dust, vibration, etc.) on the internal components, improves the mechanical strength and impact resistance of the entire transformer, prevents performance degradation caused by changes in the external environment, ensures long-term stable operation of the device, and solves the problem of paint film melting loss of the device wire package due to excessive current at the device input end or too small device wire diameter during design, client circuit board defects and driving transformer burning.
[0039] It should be noted that the insulating heat dissipation medium of this embodiment may include silicone material, epoxy resin material or polyurethane material according to specific application scenarios and performance requirements. Preferably, the insulating heat dissipation medium is a thermally conductive insulating gel.
[0040] In one embodiment, the skeleton 1 is formed by one-piece injection molding. The one-piece injection molding process not only simplifies the production process and reduces the complexity of assembly, but also provides excellent insulation protection to prevent the corrosion of the device by external moisture, dust and corrosive substances, thereby improving the environmental adaptability of the product, thereby ensuring the close connection between the skeleton 1 and the potting cover 4 and the magnetic core group 5. This close combination can reduce the risk of loosening and vibration of various parts of the device, further enhance the overall stability and durability of the structure, thereby meeting the needs of high-reliability applications of potted drive transformers.
[0041] Preferably, the skeleton 1 is made of at least one material selected from PPS, Bakelite or PA. Thus, by selecting a skeleton 1 made of PPS or PA material, the dimensional stability of the skeleton 1 in a high temperature environment can be significantly improved, and the problem of device failure caused by thermal expansion or contraction can be avoided. The Bakelite material has excellent electrical insulation properties, which can effectively reduce the interference of the skeleton 1 to the external electric field, ensuring the safe and reliable operation of the transformer. The PPS material is particularly suitable for humid and highly corrosive working environments due to its excellent chemical corrosion resistance and moisture resistance, and the PA material is also suitable for scenarios requiring impact resistance and vibration resistance. Among them, the high heat resistance of the PPS material makes it suitable for the application of high-frequency and high-power electronic components. The PA material is suitable for application scenarios that require both mechanical strength and durability, providing higher design flexibility. Therefore, by selecting PPS, Bakelite or PA material according to actual needs, the production cost can be reduced while ensuring that the performance meets the requirements, so as to adapt to diverse usage needs and significantly improve the overall performance of the device.
[0042] In one embodiment, the accommodating cavity 41 has a U-shaped structure relative to the potting space 6 formed by the winding coil 3, that is, the inner wall of the potting cover 4 and the outer surface of the winding coil 3 form a U-shaped potting space, thereby ensuring that the insulating heat dissipation medium is fully and smoothly filled in the accommodating cavity 41.
[0043] During the specific implementation process, the magnetic core group 5 includes a first magnetic core 51 and a second magnetic core 52, and the first magnetic core 51 and the second magnetic core 52 are arranged relative to each other to form a frame structure. The frame structure is mounted on the skeleton 1 and the potting cover 4. The frame structure constructed by the first magnetic core 51 and the second magnetic core 52 has overall rigidity and can provide higher stability under external stress. Among them, the frame structure is mounted on the skeleton 1 and the potting cover 4 to further enhance the installation stability of the magnetic core group 5 through tight fit to avoid performance degradation due to looseness. At the same time, the relative arrangement of the first magnetic core 51 and the second magnetic core 52 can make the magnetic field distribution of the device more uniform, avoid magnetic flux leakage, and improve magnetic performance, that is, improve the magnetic flux density utilization rate of the transformer, reduce leakage magnetic loss, and improve the conversion efficiency of the transformer.
[0044] In addition, the structural design of the frame structure being sleeved on the skeleton 1 and the potting cover 4 allows part of the magnets of the first magnetic core 51 and the second magnetic core 52 to be positioned outside, which is beneficial for conducting the heat generated during device operation to the outside and also facilitates rapid installation in the automated assembly process.
[0045] Preferably, the first magnetic core 51 and the second magnetic core 52 are designed in a horizontal Π-shaped structure. The Π-shaped structure design can make the contact area of the first magnetic core 51 and the second magnetic core 52 in the horizontal direction relative to the skeleton 1 larger, thereby enhancing the overall rigidity of the magnetic core group 5. The horizontal Π-shaped structure is symmetrically arranged, which helps to reduce deformation or loosening caused by external force or vibration, and improve the vibration resistance of the driving transformer in a complex mechanical environment. When the Π-shaped structure is arranged horizontally, the first magnetic core 51 and the second magnetic core 52 can fit the skeleton 1 and the winding coil 3 more closely, reducing the air gap between the magnetic cores, making the magnetic circuit more uniform, reducing leakage magnetic flux, reducing magnetic resistance, and improving the magnetic flux density utilization rate of the device.
[0046] In addition, the horizontal Π-shaped structure design makes the size design of the first magnetic core 51 and the second magnetic core 52 more compact, and at the same time forms a complete magnetic field shielding frame outside the winding coil 3, reducing the overall size of the driving transformer and facilitating integration into miniaturized electronic devices to improve device space utilization and meet the demand for high power density devices.
[0047] Furthermore, the skeleton 1 has a connecting through hole 13, and part of the first magnetic core 51 and the second magnetic core 52 are connected in the connecting through hole 13, so that the magnetic core group 5 is sleeved on the skeleton 1 and the potting cover 4 to form a closed magnetic circuit.
[0048] The connecting through hole 13 of the skeleton 1 is designed to provide a structural basis for the connection between the first magnetic core 51 and the second magnetic core 52 and the skeleton 1, so that the connection between the magnetic cores is tighter and the closure of the magnetic circuit is improved. That is, the magnetic core part is inserted into the connecting through hole 13 of the skeleton 1, and the docking area of the first magnetic core 51 and the second magnetic core 52 is physically guided by the connecting through hole 13 to ensure assembly accuracy and position stability. At the same time, the connecting through hole 13 plays an additional fixing role for the magnetic core group 5 to prevent loosening or displacement due to vibration or external force during use.
[0049] In one embodiment, the skeleton 1 includes a winding portion 11 and an end plate portion 12, the end plate portion 12 is integrally connected to both ends of the winding portion 11, the winding wire package 3 is wound on the outer wall of the winding portion 11, the metal terminal 2 is connected to the end plate portion 12, and the connecting through hole 13 passes through the winding portion 11 along the axial direction of the winding portion 11.
[0050] Specifically, the winding part 11 and the end plate part 12 are connected through an integrated molding process to ensure the stability and processing accuracy of the overall structure of the skeleton 1. The winding part 11 is used to carry the winding coil 3, and the winding coil 3 can be evenly wound on the winding part 11 according to a preset winding method, thereby realizing efficient electromagnetic energy conversion. The end plate part 12 is located at both ends of the winding part 11, and can serve as a supporting structure to provide a fixed point for the winding part 11 and improve the overall mechanical strength. The metal terminal 2 is arranged on the end plate part 12 and is tightly connected thereto. Then the end plate part 12 not only provides a stable installation position for the metal terminal 2, but also ensures the electrical connection between the metal terminal 2 and the lead connector of the winding coil 3. Such a structural design optimizes the arrangement of the winding, simplifies the electrical connection path, improves the reliability and efficiency of the device connection, and improves the durability and service life of the product.
[0051] In addition, the connecting through hole 13 is designed to pass through along the axial direction of the winding part 11, ensuring that the docking parts of the first magnetic core 51 and the second magnetic core 52 can be accurately aligned in the connecting through hole 13, providing a convenient guide for the rapid positioning and assembly of the magnetic core group 5, and also forming an axial heat dissipation channel. Combined with the insulating heat dissipation medium in the potting cover 4, the heat dissipation capacity of the device is further enhanced.
[0052] Preferably, the first magnetic core 51 and the second magnetic core 52 are respectively integrally connected with an expansion magnet 53 on the side away from the connecting through hole 13, and the expansion magnet 53 is attached to the top plane of the potting cover 4, wherein the expansion magnet 53 can optimize the distribution of the magnetic field, compensate for the magnetic field weakening area that may exist at the far end of the magnetic core, and can effectively isolate the magnetic field overflow at the far end of the magnetic core group 5, reduce the impact of magnetic interference on surrounding electronic components, optimize the overall circuit performance, ensure the electromagnetic compatibility between components, and is particularly suitable for high-density electronic equipment, improving the power transmission capability of the device. The expansion magnet 53 is attached to the top plane of the potting cover 4 to ensure the close fit between the magnetic core group 5 and the potting cover 4, forming multi-point support, ensuring the accuracy of assembly between components, simplifying the assembly process, improving production efficiency and product consistency, avoiding the loosening of the magnetic core due to vibration or mechanical shock, and improving the impact resistance of the device.
[0053] In the specific implementation process, the side of the end plate portion 12 facing away from the winding portion 11 is integrally connected with a support boss 14 , and a plurality of pin bumps 15 are arranged at intervals at the bottom end of the support boss 14 , and each metal terminal 2 is correspondingly embedded in each pin bump 15 .
[0054] Then, the support boss 14 is integrally connected to the end plate portion 12, which enhances the overall rigidity of the end plate structure and provides a stable support for the installation of the metal terminal 2. The support boss 14 serves as an extension structure of the end plate portion 12 to provide an air-avoiding space for the arrangement of the metal terminal 2. Several pin bumps 15 avoid excessive concentration between the metal terminals 2, effectively improve the insulation distance between the metal terminals 2, and also provide an additional heat dissipation path for the embedding of the metal terminal 2, while increasing the heat dissipation area.
[0055] Among them, the top of the supporting boss 14 has a supporting working surface 141, and the two sides of the potting cover 4 are integrally connected with protective wing plates 42, which are fitted on the supporting working surface 141 to ensure the stable connection between the potting cover 4 and the skeleton 1, and to prevent the potting cover 4 from being deformed or damaged due to excessive pressure or external force during the assembly process, so as to reduce the loosening or damage of components caused by improper support. In addition, the protective wing plates 42, while playing a protective role, also help to guide the heat dissipation flow of the device. The fit between its shape and the supporting working surface 141 enhances the heat dissipation path of the winding wire package 3, thereby ensuring the heat dissipation effect of the device, ensuring that the product maintains a stable temperature under high load or long-term operation, and extending its service life.
[0056] Optionally, the metal terminal 2 includes a first connecting pin 21 and a second connecting pin 22 protruding from the supporting boss 14 on the pin bump 15 along the axial direction of the winding portion 11. The first connecting pin 21 and the second connecting pin 22 are parallel and spaced apart. The lead connector of the winding coil 3 is electrically connected to the first connecting pin 21, and the second connecting pin 22 is connected to an external device.
[0057] A parallel gap is maintained between the first connecting pin 21 and the second connecting pin 22, thereby effectively reducing the possibility of electromagnetic interference and signal coupling. The second connecting pin 22 is used to connect to an external device, providing an interface for the input or output of the device to achieve functional expansion. Then the metal terminal 2 can not only achieve reliable connection in a limited space, but also improve the electrical performance of the overall structure. For example, the parallel gap design can optimize the electrical insulation performance and prevent the occurrence of short circuit or interference problems. At the same time, the protruding structure design of the metal terminal 2 helps to simplify the installation process and improve the efficiency of the device in the actual assembly process. In addition, the metal terminal 2 is embedded in one side of the end plate portion 12, and the stability of its installation position is enhanced, thereby further improving the long-term reliability and environmental adaptability of the device.
[0058] It should be noted that the protective wing plate 42 protrudes from the first connecting pin 21 and the second connecting pin 22 along the axial direction of the winding part 11, thereby providing a protective space for the first connecting pin 21 and the second connecting pin 22 in terms of physical structure for effective physical protection to avoid damage to the connecting pins. It can also play a role in buffering and dispersing pressure under the action of external force, avoiding direct impact on the first connecting pin 21 and the second connecting pin 22, thereby improving the impact resistance and damage resistance of the device, and the protruding design of the protective wing plate 42 can provide clear positioning and spatial separation during the assembly process, making it easier for the first connecting pin 21 and the second connecting pin 22 to be plugged in or connected in a fixed position, avoiding misoperation.
[0059] In the specific implementation process, fitting holes 43 that are compatible with the connecting through holes 13 are opened on both sides of the potting cover 4, and the frame structure of the first magnetic core 51 and the second magnetic core 52 is sleeved on the skeleton 1 and the potting cover 4, ensuring that the frame structure of the first magnetic core 51 and the second magnetic core 52 can be accurately installed between the skeleton 1 and the potting cover 4 to form a tight fixed relationship, and assembly grooves 44 are symmetrically opened on the inner wall of the potting cover 4, and the inner wall of the assembly groove 44 matches the side contour of the end plate 12, so as to ensure that the potting cover 4 is accurately sleeved on the skeleton 1, thereby ensuring that the accommodating cavity 41 forms a tight potting space 6 relative to the winding wire package 3, and the high density of the insulating heat dissipation medium filled in the potting space 6, that is, the potting cover 4 is designed with the fitting holes 43 and the assembly grooves 44, which not only realizes precise assembly positioning, but also ensures a stable connection between the potting cover and the skeleton 1 and the magnetic core group 5, so that the entire component is not easy to loosen during use, thereby improving the reliability of the device.
[0060] The present application also discloses an electronic device, including a potted drive transformer as in any of the above embodiments. For other working principles and processes of the electronic device of this embodiment, please refer to the description of the potted drive transformer in the above embodiment, which will not be repeated here.
[0061] The above describes in detail the encapsulated drive transformer and electronic device provided by this application. This article uses specific examples to illustrate the principles and implementation methods of this application. It should be noted that in this application, the descriptions of each embodiment have their own focus. For parts that are not detailed or recorded in a particular embodiment, please refer to the relevant descriptions of other embodiments.
[0062] The above are only preferred embodiments of the present application and do not limit the patent scope of the present application. The various technical features of the technical solution of the present application can be arbitrarily combined. In order to make the description concise, all possible combinations of the various technical features in the above embodiments are not described. Any equivalent structure or equivalent process transformation made using the contents of the description and drawings of this application, or directly or indirectly applied in other related technical fields, as long as there is no contradiction in the combination of these technical features, are also included in the patent protection scope of the present application.
Claims
1. A potting type drive transformer, characterized in that: include: A frame, wherein a plurality of metal terminals are arranged at the bottom end of the frame; A winding coil, wherein the winding coil is wound on the frame, and each lead connector of the winding coil is electrically connected to each of the metal terminals; A potting cover, wherein the potting cover is sleeved on the frame and is recessed to form a receiving cavity adapted for the frame and the winding coil, the receiving cavity having a potting space relative to the winding coil, and the potting space is filled with an insulating heat dissipation medium that wraps the winding coil; A magnetic core group, the magnetic core group is buckled on the skeleton and the potting cover, the magnetic core group includes a first magnetic core and a second magnetic core, the first magnetic core and the second magnetic core are arranged relative to each other to form a frame structure, and the frame structure is sleeved on the skeleton and the potting cover; The first magnetic core and the second magnetic core are designed in a horizontal Π-shaped structure, each including a first side column, a second side column, and a connecting column connecting the first side column and the second side column, and the width of the second side column is greater than the width of the first side column; The skeleton has a connecting through hole, and the first side columns of the first magnetic core and the second magnetic core are connected in the connecting through hole, so that the magnetic core assembly is mounted on the skeleton and the potting cover to form a closed magnetic circuit; The second side columns of the first magnetic core and the second magnetic core are respectively integrally connected with an expansion magnet, the expansion magnet is attached to the top plane of the potting cover, and the expansion magnet is the part where the second side column is wider than the first side column.
2. The potted drive transformer according to claim 1, characterized in that: The skeleton includes a winding part and an end plate part, the end plate part is integrally connected to the two ends of the winding part, the winding wire package is wrapped around the outer wall of the winding part, the metal terminal is connected to the end plate part, and the connecting through hole passes through the winding part along the axial direction of the winding part.
3. The potted drive transformer according to claim 2, characterized in that: The side of the end plate portion facing away from the winding portion is integrally connected with a support boss, and a plurality of pin bumps are arranged at intervals at the bottom end of the support boss, and each of the metal terminals is correspondingly embedded on each of the pin bumps, wherein the top end of the support boss has a support working surface, and both sides of the potting cover body are integrally connected with protective wing plates, and the protective wing plates are affixed to the support working surface.
4. The potted drive transformer according to claim 3, characterized in that: The metal terminal includes a first connecting pin and a second connecting pin that protrude from the support boss on the pin bump along the axial direction of the winding portion, a parallel interval is maintained between the first connecting pin and the second connecting pin, the lead connector of the winding coil is electrically connected to the first connecting pin, the second connecting pin is externally connected to an external device, and the protective wing protrudes from the first connecting pin and the second connecting pin along the axial direction of the winding portion.
5. The potted drive transformer according to claim 2, characterized in that: Both sides of the potting cover are provided with fitting holes that are compatible with the connecting through holes, and the frame structure for the first magnetic core and the second magnetic core is sleeved on the skeleton and the potting cover, and the inner wall of the potting cover is symmetrically provided with assembly grooves, and the inner wall of the assembly groove matches the side contour of the end plate.
6. An electronic device, characterized in that: The encapsulated drive transformer comprises the encapsulated drive transformer according to any one of claims 1 to 5.
Citation Information
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