Substrate support apparatus and leakage control method of temperature control

Abstract

Disclosed are a substrate support apparatus and a leak-proof control method of a temperature control fluid. In a substrate support apparatus that controls temperature by supplying a temperature control fluid, a sealing member is employed that is configured to be actively controlled in volume expansion in consideration of a difference in expansion coefficient between a fluid supply block that supplies the temperature control fluid and an electrostatic chuck due to a material thereof, therefore, leakage of the temperature control fluid is prevented.

Description

Technical Field

[0001] This application claims priority to Korean Patent Application No. 10-2023-0147717, filed on October 31, 2023, which is incorporated herein by reference in its entirety. Background Art Technical Field

[0003] The present invention relates to a substrate supporting device and a leakage prevention control method of a temperature control fluid, and more particularly, to a technology for preventing leakage of the temperature control fluid by adopting a sealing member that actively controls volume expansion in consideration of a difference in expansion coefficients between a fluid supply block that supplies the temperature control fluid and an electrostatic chuck in a substrate supporting device that controls temperature by supplying the temperature control fluid due to their materials.

[0004] Description of the Prior Art

[0005] A process of manufacturing a semiconductor or a display panel is performed in a state in which a substrate such as a wafer is supported by a substrate supporting device such as an electrostatic chuck.

[0006] For example, in a state in which the substrate supporting device supports the substrate, an etching process or a cleaning process is performed using various process gases or process liquids.

[0007] Such processes require temperature changes between high and low temperatures depending on process conditions. The temperature of the substrate to be processed and the substrate processing equipment is controlled by supplying a temperature control fluid, such as a heat transfer medium or a coolant, to the substrate processing equipment.

[0008] In order to prevent leakage of the temperature control fluid, a sealing member such as an O-ring is installed at a connection portion between supply flow paths or the like. Although such a sealing member is adopted, if components made of different materials are in contact with each other and coupled, a gap may be generated between them due to the difference in expansion coefficients when the temperature suddenly changes, and the temperature control fluid may leak through the gap.

[0009] In an example, in order to supply a temperature control fluid to an electrostatic chuck of a substrate processing apparatus, a fluid supply block configured to supply the temperature control fluid contacts a lower surface of the electrostatic chuck, and the fluid supply block is made of a material such as polyetheretherketone (PEEK). When the temperature changes suddenly, a gap may be generated between the electrostatic chuck and the fluid supply block due to different materials of the electrostatic chuck and the fluid supply block and the difference in expansion coefficients therebetween. However, the generated gap may not be fully blocked by a sealing member occupying a fixed area, thereby causing leakage of the temperature control fluid.

[0010] Furthermore, in a case where a cryogenic fluid is supplied, the O-ring fixed to the fluid supply block may fail to achieve sufficient sealing due to the difference in expansion coefficient between the O-ring and the fluid supply block, thereby causing leakage of the cryogenic coolant. Summary of the invention

[0011] The present invention is intended to solve the above-mentioned problems, and an object of the present invention is to provide a technology for preventing leakage of a temperature control fluid by adopting a sealing member, wherein the volume expansion is actively controlled in consideration of a difference in expansion coefficients between a fluid supply block supplying a heat transfer medium or a coolant as a temperature control fluid and an electrostatic chuck due to their different materials or a difference in expansion coefficients between a fluid supply block and a sealing member in a substrate support device due to their different materials.

[0012] Another object of the present invention is to solve the problem of fluid leakage between a fluid supply block made of, for example, polyetheretherketone (PEEK) and an electrostatic chuck, which is caused by a gap generated therebetween due to a sudden change in temperature of different materials of the fluid supply block and the electrostatic chuck, resulting in a different expansion coefficient between the fluid supply block and the electrostatic chuck, and a sealing member occupying a fixed area cannot sufficiently block the generated gap.

[0013] In addition, another object of the present invention is to solve the problem of cryogenic coolant leakage, which is caused by the fact that when supplying cryogenic fluid, the O-ring fixed on the fluid supply block cannot achieve sufficient sealing due to the different expansion coefficients between the O-ring and the fluid supply block.

[0014] The objects to be achieved by the present invention are not limited to the above objects, and other objects and advantages not mentioned herein can be understood from the following description.

[0015] According to aspects of the present invention, the above and other objects can be achieved by providing a substrate supporting device, the device including: an electrostatic chuck, the electrostatic chuck being configured to support a substrate, the electrostatic chuck including a flow path for a temperature control fluid for temperature control; a main body member, which is configured to support the electrostatic chuck; a fluid supply block, which is installed in the main body member, the fluid supply block including a temperature control fluid supply path formed therein to supply the temperature control fluid to the flow path in the electrostatic chuck; a sealing member, which is installed to the fluid supply block, the sealing member including an air injection space defined therein, the sealing member being configured to expand due to the injection of air into the air injection space; and an air supply unit, which is configured to inject air into the sealing member.

[0016] Preferably, the substrate supporting device may further include a controller configured to control the air supply unit to inject air into the sealing member based on a temperature difference between the electrostatic chuck and the fluid supply block or a temperature difference between the fluid supply block and the sealing member to expand the sealing member.

[0017] Furthermore, the air supply unit may include: an air movement path configured to supply air to the sealing member; an air supply device configured to supply air to the air movement path; and an air injection control valve disposed on the air movement path to control the supply of air.

[0018] Furthermore, the air supply unit may further include a pressure measuring component configured to measure the pressure of the air supplied through the air movement path, and the controller may control injection of the air into the sealing member based on the pressure value measured by the pressure measuring component.

[0019] In an example, the air supply unit may further include: a supply air movement path configured to supply air to the sealing member; an air injection control valve disposed on the supply air movement path for controlling the supply of air to be injected; a control air movement path configured to control the air pressure in the sealing member; an air pressure control valve disposed on the control air movement path for controlling the pressure of air supplied to the sealing member; an exhaust air movement path configured to exhaust air from the sealing member; and an air exhaust control valve disposed on the exhaust air movement path to control the exhaust of air from the sealing member.

[0020] In an example, the air supply unit may further include an air heater configured to control the temperature of the air to be supplied, and the controller may control the air heater to control the temperature of the air to be injected according to the expansion degree of the sealing member.

[0021] In an example, the fluid supply block may include a heat transfer medium inlet configured to supply a heat transfer medium to the electrostatic chuck and a heat transfer medium outlet configured to discharge the heat transfer medium from the electrostatic chuck, and the sealing member may include a sealing member installed at the heat transfer medium inlet and a sealing member installed at the heat transfer medium outlet.

[0022] In an example, the fluid supply block may include a coolant inlet configured to supply coolant to the electrostatic chuck and a coolant outlet configured to discharge coolant from the electrostatic chuck, and the sealing member may include: a first sealing portion, which is fastened to the coolant inlet, the first sealing portion includes a first air injection space defined therein, the first sealing portion is configured to expand due to air injected into the first air injection space; a second sealing portion, which is fastened to the coolant outlet, the second sealing portion includes a second air injection space defined therein, the second sealing portion is configured to expand due to air injected into the second air injection space; and a connecting portion, which is configured to connect the first sealing portion and the second sealing portion to each other.

[0023] In an example, the connecting portion of the sealing member may include a connecting space defined therein to connect a first air injection space in the first sealing portion and a second air injection space in the second sealing portion to each other, and an air injection port connected to an air supply unit to supply air to the connecting space or exhaust air from the connecting space.

[0024] In an example, the air supply unit may further include an air heater configured to control a temperature of air supplied through the air moving path, and the controller may control the air heater to control the temperature of the air injected into the sealing member.

[0025] According to another aspect of the present invention, a method for preventing leakage of a temperature control fluid is provided, the method comprising: a temperature control fluid supplying step, supplying the temperature control fluid through a fluid supply module to control the temperature of an electrostatic chuck or a substrate, or cooling the electrostatic chuck or the substrate; an air supplying step, supplying air to a sealing member through an air supply unit based on a temperature difference between the electrostatic chuck and a fluid supply block or a temperature difference between the fluid supply block and a sealing member; and a sealing step, expanding the sealing member to prevent leakage of the temperature control fluid.

[0026] Preferably, the air supply step may include a temperature difference determining step, in which a controller determines a temperature difference between the electrostatic chuck and the fluid supply block or a temperature difference between the fluid supply block and the sealing member; a condition setting step, in which the controller sets conditions for an air injection amount and pressure for expanding the sealing member based on the temperature difference; and an air injection step, in which the controller controls an air supply unit under the set conditions to inject air into the sealing member.

[0027] In addition, the sealing step may include an air pressure control step, in which a pressure measurement value of air injected into the sealing member is obtained by a controller, and an air supply unit is controlled by the controller based on the pressure measurement value and a set pressure range to control the air pressure in the sealing member.

[0028] In an example, in the temperature control fluid supply step, the fluid supply block may supply the heat transfer medium as the temperature control fluid to the flow path of the electrostatic chuck through the heat transfer medium inlet. The air supply step may include a temperature difference determination step, in which a controller determines the temperature difference between the electrostatic chuck and the fluid supply block or the temperature difference between the fluid supply block and the sealing member according to the supply of the heat transfer medium; a condition setting step, in which a controller sets one or more conditions of the amount, pressure and temperature of the air injected for expanding the sealing member installed to the heat transfer medium inlet of the fluid supply block based on the temperature difference according to the supply of the heat transfer medium; and an air injection step, in which the controller opens the air injection control valve based on the temperature difference, and controls the air supply unit under the set condition to inject air into the sealing member through the supply air movement path.

[0029] In an example, in the sealing step, if the air pressure in the sealing member exceeds a set pressure range, the controller may control an air pressure control valve disposed on a control air movement path to control the air injected into the sealing member.

[0030] In an example, in the temperature control fluid supply step, the fluid supply block may discharge the heat transfer medium as the temperature control fluid from the flow path of the electrostatic chuck through the heat transfer medium outlet. The air supply step may also include a temperature difference determination step, in which a controller determines the temperature difference between the electrostatic chuck and the fluid supply block or the temperature difference between the fluid supply block and the sealing member according to the discharge of the heat transfer medium; a condition setting step, in which a controller sets one or more conditions of the amount, pressure and temperature of air injected for expanding the sealing member installed to the heat transfer medium outlet of the fluid supply block based on the temperature difference according to the discharge of the heat transfer medium; and an air injection step, in which an air injection control valve is opened by the controller based on the temperature difference, and the air supply unit is controlled by the controller under the set conditions to inject air into the sealing member through the supply air movement path.

[0031] In an example, in the temperature control fluid supply step, the fluid supply block may supply coolant as a temperature control fluid to the flow path of the electrostatic chuck through the coolant inlet, and may discharge the coolant from the flow path of the electrostatic chuck. The air supply step may include a temperature difference determination step, in which a controller determines a temperature difference between the electrostatic chuck and the fluid supply block or a temperature difference between the fluid supply block and the sealing member according to the supply and discharge of the coolant; a condition setting step, in which a controller sets one or more conditions of the amount, pressure, and temperature of air injected for expanding the sealing member mounted to the coolant inlet of the fluid supply block based on the temperature difference according to the supply and discharge of the coolant; and an air injection step, in which an air injection control valve is opened by the controller based on the temperature difference, and the air supply unit is controlled by the controller under the set conditions to inject air into the sealing member through the supply air movement path.

[0032] In an example, in the air injection step, air may be injected into a connection portion of the sealing member and may be supplied to the first and second sealing portions through the connection portion, and in the sealing step, the first and second sealing portions may expand to prevent coolant leakage.

[0033] In an example, in the sealing step, if the air pressure in the sealing member exceeds a set pressure range, the controller may control an air pressure control valve disposed on a control air movement path to control air injected into the first and second sealing portions.

[0034] According to another aspect of the present invention, there is provided a substrate supporting device, comprising: an electrostatic chuck configured to support a substrate, the electrostatic chuck comprising a first flow path and a second flow path formed therein to perform temperature control corresponding to a heat transfer medium and a coolant as temperature control fluids; a main body member configured to support the electrostatic chuck; a fluid supply block installed in the main body member, the fluid supply block being provided with a temperature control fluid supply path, the temperature control fluid supply path comprising a heat transfer medium supply path and a coolant supply path, the heat transfer medium supply path comprising a heat transfer medium inlet and a heat transfer medium outlet to supply the heat transfer medium to the electrostatic chuck; a first flow path of the electric chuck and discharged from the first flow path of the electrostatic chuck, and a coolant supply path including a coolant inlet and a coolant outlet to supply coolant to and discharge from the second flow path of the electrostatic chuck; a sealing member including a first sealing member and a second sealing member, the first sealing member being mounted to each of the heat transfer medium inlet and the heat transfer medium outlet and including an air injection space defined therein to control expansion according to injection of air, and a second sealing member including: a first sealing portion mounted to the coolant inlet and including a first air injection space defined therein; a second sealing portion, The air supply unit includes an air movement path, including a supply air movement path configured to supply air to the sealing member, a control air movement path configured to control the air pressure in the sealing member, and an exhaust air movement path configured to exhaust air from the sealing member; an air control valve, including: an air injection control valve , which is arranged on the supply air movement path to control the supply of injected air; an air pressure control valve, which is arranged on the control air movement path to control the pressure of air supplied to the sealing member; and an air exhaust control valve, which is arranged on the exhaust air movement path to control the exhaust of air from the sealing member; and an air supply device, which includes: a pressure measuring component, which is configured to measure the pressure of air supplied through the air movement path; and a controller, which is configured to control the air supply unit to inject air into the sealing member to expand the sealing member based on the temperature difference between the electrostatic chuck and the fluid supply block or the temperature difference between the fluid supply block and the sealing member. BRIEF DESCRIPTION OF THE DRAWINGS

[0035] The above and other objects, features and other advantages of the present invention will be more clearly understood through the following detailed description taken in conjunction with the accompanying drawings, in which:

[0036] Figure 1An embodiment of a substrate processing apparatus to which a substrate supporting device according to the present invention is applied is shown;

[0037] Figure 2 An embodiment of a fluid supply block of a substrate supporting device according to the present invention is shown;

[0038] Figure 3A and Figure 3B An embodiment of a sealing member according to the present invention is shown;

[0039] Figure 4 A configuration diagram showing an embodiment of an air supply device for a substrate supporting device according to the present invention;

[0040] Figure 5A and Figure 5B Another embodiment of the sealing member according to the present invention is shown;

[0041] Figure 6 A flow chart showing an embodiment of a method for preventing leakage of a temperature control fluid according to the present invention;

[0042] 7A to 7C An embodiment of a leakage prevention control process when a heat transfer medium as a temperature control fluid is supplied in a leakage prevention control method of a temperature control fluid according to the present invention is shown;

[0043] FIG. 8A to FIG. 8C An embodiment of a leakage prevention control process when a heat transfer medium as a temperature control fluid is discharged in a leakage prevention control method of a temperature control fluid according to the present invention is shown;

[0044] 9A to 9C An embodiment of a leakage prevention control process when supplying and discharging a coolant as a temperature control fluid in a leakage prevention control method of a temperature control fluid according to the present invention is shown;

[0045] Fig.10 A flow chart showing another embodiment of the method for preventing leakage of a temperature control fluid according to the present invention;

[0046] Fig.11A and Fig. 11B An embodiment of a process of controlling the air pressure in a sealing member in a leakage prevention control method of a temperature control fluid according to the present invention is shown; and

[0047] Fig. 12A and Fig. 12B An embodiment of a process of exhausting air from a sealing member in a leakage prevention control method of a temperature control fluid according to the present invention is shown. DETAILED DESCRIPTION

[0048] Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings, but the present invention is not limited to or restricted to the exemplary embodiments.

[0049] For a fuller understanding of the invention, its operating advantages and objectives attained by its implementation, it is necessary to refer to the accompanying drawings which illustrate exemplary embodiments of the invention and the contents contained therein.

[0050] In addition, the terms used herein are only for the purpose of describing specific embodiments and are not intended to be limiting. As used herein, unless the context clearly indicates otherwise, the singular form may also be intended to include the plural form. In addition, in the following description of the embodiments, the terms "include", "comprise" or "have" are inclusive, and therefore specify the existence of stated features, numbers, steps, operations, elements, components or combinations thereof, but do not exclude the existence or addition of one or more other features, numbers, steps, operations, elements, components or combinations thereof.

[0051] In the following description of the embodiments of the present invention, when known configurations or functions incorporated herein may unnecessarily obscure the subject matter of the present invention, a detailed description thereof will be omitted.

[0052] The present invention provides a technology for preventing leakage of a temperature control fluid by adopting a sealing member, wherein the sealing member is actively controlled in consideration of the difference in expansion coefficients due to the materials between a fluid supply block for supplying a temperature control fluid and an electrostatic chuck in a substrate supporting device for controlling temperature by supplying the temperature control fluid.

[0053] Figure 1 An embodiment of a substrate processing apparatus to which the substrate supporting device according to the present invention is applied is shown.

[0054] The substrate supporting device 100 according to the present invention may be applied to various substrate processing equipment for processing substrates, such as wafers or glass plates, to manufacture semiconductors, displays, and the like.

[0055] The substrate processing device 1 to which the substrate supporting device 100 according to the present invention is applied may be a device that performs a series of substrate processing processes, including etching, ashing, deposition, and cleaning processes, to manufacture semiconductors. Hereinafter, a dry etcher that performs an etching process in a substrate processing device using plasma will be described as an exemplary embodiment of the present invention.

[0056] In the present embodiment, the substrate processing apparatus 1 may be configured to perform an etching process using plasma as a process of processing the substrate S. To this end, the substrate processing apparatus 1 may include a processing chamber 10 , a substrate supporting device 100 , a processing gas supply unit 30 , a shower head 40 , and a plasma generating unit 50 .

[0057] The processing chamber 10 may include a substrate processing space 13 defined therein so as to be isolated from the outside, and the substrate S may be processed by plasma in the substrate processing space 13. The processing chamber 10 may include a chamber body 11. The chamber body 11 may be formed to have the substrate processing space 13 therein. The chamber body 11 may be made of metal. For example, the material of the chamber body 11 may be aluminum (Al). The chamber body 11 may be grounded.

[0058] At least one exhaust port communicating with the substrate processing space 13 may be provided at the bottom of the chamber body 11, and an exhaust unit 15 performing an exhaust operation may be connected to the exhaust port. The exhaust unit 15 may include an exhaust line connected to the exhaust port and a vacuum pump connected to the exhaust line. Due to the exhaust operation of the exhaust unit 15, the pressure in the substrate processing space 13 may be reduced, so that the substrate processing process is performed under a vacuum environment, and byproducts generated during the substrate processing process or gases remaining in the substrate processing space 13 may be discharged to the outside.

[0059] The process gas supply unit 30 may supply the process gas to the inside of the process chamber 10 , and the plasma generation unit 50 may form an electromagnetic field in the process chamber 10 to excite the process gas supplied to the inside of the process chamber 10 into a plasma state.

[0060] The shower head 40 may be disposed at an upper region of the substrate processing space 13 , and may supply the process gas supplied from the process gas supply unit 30 to the substrate processing space 13 in a diffusion manner.

[0061] The plasma generating unit 50 may excite the process gas in the substrate processing space 13 to a plasma state. In an example, the plasma generating unit 50 may include an antenna 51 and a power source 55 disposed at an upper side of the chamber 11.

[0062] The antenna 51 may be disposed in parallel to the electrode plate 130 of the electrostatic chuck 110 with the substrate processing space 13 interposed therebetween. An electric field may be formed in the space between the two electrodes, and the processing gas supplied to the space may be excited to a plasma state.

[0063] The substrate supporting device 100 may be installed in the chamber body 11 . The substrate supporting device 100 may be disposed at a lower area in the substrate processing space 13 , and may support the substrate S. The substrate supporting device 100 may be located at a height spaced upward from the bottom of the chamber body 11 .

[0064] The substrate supporting apparatus 100 may include an electrostatic chuck 110 and a substrate 150 .

[0065] The electrostatic chuck 110 may include a dielectric plate 120 and an electrode plate 130 .

[0066] The dielectric plate 120 may clamp the substrate S using an electrostatic force to support the substrate S. The periphery of the dielectric plate 120 may be surrounded by a focus ring 140 .

[0067] The dielectric plate 120 may be located on top of the electrode plate 130. The dielectric plate 120 may be provided as a disk-shaped dielectric substance. A substrate S may be placed on an upper surface of the dielectric plate 120. In an example, a wafer may be placed as the substrate.

[0068] The upper surface of the dielectric plate 120 may have a smaller radius than the substrate S. Therefore, an edge region of the substrate S may be located outside the dielectric plate 120. The edge of the substrate S may be placed on the upper surface of the focus ring 140.

[0069] The focus ring 140 may be disposed around the edge region of the dielectric plate 120. The focus ring 140 may have a ring shape and may be arranged along the circumference of the dielectric plate 120. An outer portion of the focus ring 140 may be disposed to surround the edge region of the substrate S. The focus ring 140 may control the electromagnetic field so that the density of plasma is uniformly distributed over the entire region of the substrate S. Therefore, plasma may be uniformly formed over the entire region of the substrate S, so that various regions of the substrate S may be uniformly etched.

[0070] The dielectric plate 120 may include an electrostatic electrode 121, a heater 125, and a supply flow path 133 therein. The supply flow path 133 may be formed through the dielectric plate 120 from the lower surface of the dielectric plate 120 to the upper surface of the dielectric plate 120. The supply flow path 133 may be provided in plurality, and the plurality of supply flow paths 133 may be spaced apart from each other. The supply flow path 133 may serve as a channel through which a heat transfer medium is supplied to the lower surface of the substrate S.

[0071] The electrostatic electrode 121 may be electrically connected to the first power source 123. The first power source 123 may selectively provide direct current to the electrostatic electrode 121. Due to the current applied to the electrostatic electrode 121, an electrostatic force may act between the electrostatic electrode 121 and the substrate S, and the substrate S may be adsorbed to the dielectric plate 120 by the electrostatic force.

[0072] The heater 125 may be located below the electrostatic electrode 121. The heater 125 may be electrically connected to the second power source 127. The heater 125 may generate resistive heat when receiving current applied thereto from the second power source 127. The generated heat may be transferred to the substrate S through the dielectric plate 120. The substrate S may be maintained at a predetermined temperature by the heat generated by the heater 125. The heater 125 may include a spiral coil.

[0073] The electrode plate 130 may be located below the dielectric plate 120. The lower surface of the dielectric plate 120 and the upper surface of the electrode plate 130 may be bonded to each other using an adhesive. The electrode plate 130 may be made of aluminum. The electrode plate 130 may have an area corresponding to the dielectric plate 120 and may be adhered to the lower surface of the dielectric plate 120. The electrode plate 130 may include a first flow path 131 and a second flow path 135 formed therein.

[0074] The first flow path 131 may serve as a passage through which a heat transfer medium circulates. The first flow path 131 may receive the heat transfer medium from the heat transfer medium supply unit 170 through the fluid supply block 200. In an example, the heat transfer medium may include helium (He).

[0075] A heat transfer medium such as helium (He) may be transferred to the supply flow path 133 through the first flow path 131 and may be supplied to the lower surface of the substrate S. The heat transfer medium such as helium may serve as a medium through which heat transferred from plasma to the substrate S is transferred to the dielectric plate 120 .

[0076] The second flow path 135 may serve as a passage through which the refrigerant circulates. The second flow path 135 may be formed below the first flow path 131. The second flow path 135 may receive the coolant from the refrigerant supply unit 190 through the fluid supply block 200.

[0077] The coolant supplied to the second flow path 135 may circulate along the second flow path 135 to cool the electrode plate 130. As the electrode plate 130 is cooled, the dielectric plate 120 and the substrate S may also be cooled, and thus the substrate S may be maintained at a predetermined temperature.

[0078] In an example, the coolant may be cooled to a low temperature before being supplied. For example, the coolant may be cooled to -70°C or lower (ultra-low temperature). Preferably, the temperature of the coolant may be controlled within a range of room temperature to -70°C.

[0079] The substrate 150 may be located under the electrostatic chuck 110 to support the electrostatic chuck 110 .

[0080] The base plate 150 may be provided with a fluid supply block 200 that supplies a temperature control fluid and a coolant to the electrostatic chuck 110. In the present embodiment, the fluid supply block 200 is shown and described as being installed in the base plate 150. However, in some embodiments, the fluid supply block 200 may be disposed in contact with a lower surface of the base plate 150.

[0081] The fluid supply block 200 according to the present invention is equipped with sealing members 300 and 400 which actively expand to enhance adhesion, thereby preventing leakage of the temperature control fluid.

[0082] Figure 2 An embodiment of a fluid supply block of a substrate supporting device according to the present invention is shown.

[0083] The fluid supply block 200 may supply a heat transfer medium and a coolant as the temperature control fluid.

[0084] The fluid supply block 200 may include a body 210 and temperature control fluid supply paths 220a, 220b, 230a, and 230b. The temperature control fluid supply paths may include heat transfer medium supply paths 220a and 220b and coolant supply paths 230a and 230b.

[0085] The body 210 may be mounted on the substrate 150. The body 210 may be made of a material such as PEEK. The shape of the body 210 may vary depending on circumstances.

[0086] Heat transfer medium supply paths 220 a and 220 b and coolant supply paths 230 a and 230 b may be provided in the body 210 .

[0087] One of the heat transfer medium supply paths 220a and 220b may be a heat transfer medium inlet 220a that receives a heat transfer medium, such as helium, from the heat transfer medium supply unit 170 and supplies it to the first flow path 131 of the electrostatic chuck 110. The other of the heat transfer medium supply paths 220a and 220b may be a heat transfer medium outlet 220b that receives a heat transfer medium, such as helium, discharged from the first flow path 131 of the electrostatic chuck 110 and discharges it to the heat transfer medium supply unit 170.

[0088] In the present embodiment, the heat transfer medium inlet 220a and the heat transfer medium outlet 220b are shown as being spaced apart from each other. However, in some embodiments, the heat transfer medium inlet 220a and the heat transfer medium outlet 220b may be adjacent to each other.

[0089] One of the coolant supply paths 230a and 230b may be a coolant inlet 230a that receives the coolant from the refrigerant supply unit 190 and supplies it to the second flow path 135 of the electrostatic chuck 110. The other of the coolant supply paths 230a and 230b may be a coolant outlet 230b that receives the coolant discharged from the second flow path 135 of the electrostatic chuck 110 and discharges it to the refrigerant supply unit 190.

[0090] In the present embodiment, the coolant inlet 230a and the coolant outlet 230b are shown as being adjacent to each other. However, in some embodiments, the coolant inlet 230a and the coolant outlet 230b may be spaced apart from each other.

[0091] Furthermore, although the fluid supply block 200 is shown as including one heat transfer medium inlet 220a, one heat transfer medium outlet 220b, one coolant inlet 230a, and one coolant outlet 230b, the number of heat transfer medium / coolant inlets and outlets may vary as desired.

[0092] Sealing members 300 and 400 for preventing fluid leakage may be mounted to the heat transfer medium inlet 220a, the heat transfer medium outlet 220b, the coolant inlet 230a, and the coolant outlet 230b.

[0093] In the present invention, the sealing members 300 and 400 may be actively expanded according to the injection of air and thus change in volume.

[0094] Figure 3A and Figure 3B An embodiment of a sealing member according to the present invention is shown.

[0095] In the present embodiment, the sealing member 300 may be a first sealing member that is used when an inlet and an outlet (each of which is equipped with a sealing member) are spaced apart from each other by a predetermined distance or more. Figure 2 In the illustrated embodiment, if the heat transfer medium inlet 220a and the heat transfer medium outlet 220b as the temperature control fluid supply path are located on the fluid supply block 200 and are spaced apart from each other, the sealing member 300 can be individually installed to each of the heat transfer medium inlet 220a and the heat transfer medium outlet 220b.

[0096] The sealing member 300 may include a sealing body 310 made of a flexible material such as rubber or silicon, and the sealing body 310 may be formed in a circular ring. The shape of the sealing body 310 may vary corresponding to the shape of a portion to which the sealing body 310 is mounted.

[0097] The sealing body 310 may include a through hole 350 formed through a central portion thereof, and an end portion of the heat transfer medium inlet 220a or the heat transfer medium outlet 220b may be fitted into a portion of the through hole 350. In addition, the inlet or outlet of the first flow path 131 of the electrostatic chuck 110 may be fitted into the remaining portion of the through hole 350 in the sealing body 310.

[0098] The sealing body 310 may include an air injection space 330 defined therein. The air injection space 330 may be formed corresponding to the annular shape of the sealing body 310.

[0099] The sealing body 310 may expand when air is injected into the air injection space 330. Although the sealing body 310 is described as expanding due to the injection of air into the air injection space 330, the sealing body 310 may expand due to the injection of gas other than air into the air injection space 330. In an example, a non-explosive or reactive inert gas may be used instead of air.

[0100] The sealing body 310 may be provided at one side thereof with an air injection port 331 connected to the air injection space 330 , and the air injection port 331 may be connected to the air movement path 360 .

[0101] The air movement path 360 may be connected to the air supply unit 370 to supply air supplied from the air supply unit 370 to the air injection space 330 in the sealing member 300 .

[0102] The air moving path 360 may include a supply air moving path 361 , a control air moving path 363 , and an exhaust air moving path 365 diverged therefrom.

[0103] The air supply unit 370 may include air injection control valves 371 , 373 , and 375 and an air supply device 380 .

[0104] The air supply device 380 may supply air to the sealing member 300 through the air moving path 360, or may exhaust air from the sealing member 300. Preferably, the air supply device 380 may include an air pressure pump to control air pressure, thereby supplying or sucking air.

[0105] The air movement paths 361 , 363 , and 365 may be provided with air control valves 371 , 373 , and 375 to control the movement of air.

[0106] The supply air moving path 361 may be provided with an air injection control valve 371 to control air supplied to the sealing member 300 through the supply air moving path 361 .

[0107] The control air movement path 363 may be provided with an air pressure control valve 373 to control the air pressure supplied to the sealing member 300. If air pressure having a predetermined level or more is applied to the sealing member 300, the air pressure control valve 373 may discharge air through the control air movement path 363, thereby controlling the air pressure in the sealing member 300.

[0108] The exhaust air movement path 365 may be provided with an air exhaust control valve 375 to control exhaust of the air injected into the sealing member 300 .

[0109] The air supply device 380 may supply air to the air moving path 360 , or may exhaust air from the air moving path 360 .

[0110] The controller 390 may control the air supply unit 370 to actively control the volume of the sealing member 300 .

[0111] In an example, while a process is performed, the controller 390 may control the air supply unit 370 based on a difference between the temperature of the electrostatic chuck 110 and the temperatures of the substrate 150 and the fluid supply block 200 to actively control the volume of the sealing member 300 .

[0112] Specifically, the controller 390 may selectively expand the volume of the sealing member 300 to enhance the adhesion of the sealing member 300 , thereby ensuring stable sealing.

[0113] In addition, the air supply device 380 may control the pressure and temperature of the air and supply the air under the control of the controller 390 .

[0114] in this regard, Figure 4 A configuration diagram showing an embodiment of an air supply device of a substrate supporting device according to the present invention.

[0115] The air supply device 380 may include an air supplier 381 , a pressure measuring component 383 , a temperature measuring component 385 , and an air heater 387 .

[0116] The air supplier 381 may include an air pressure pump, and may control air pressure and supply air under the control of the controller 390 .

[0117] The pressure measuring part 383 may measure the pressure of air supplied through the air supply device 380 , and the controller 390 may control the amount, pressure, and temperature of air supplied to the sealing member 300 based on the measurement result of the supply air pressure.

[0118] The temperature measuring part 385 may measure the temperature of air supplied through the air supply device 380 , and the controller 390 may control the amount, pressure, and temperature of air supplied to the sealing member 300 based on the measurement result of the supply air temperature.

[0119] The air heater 387 may include a heating coil, and may control air temperature and supply air under the control of the controller 390 .

[0120] Figure 5A and Figure 5B Another embodiment of a sealing member according to the present invention is shown.

[0121] In the present embodiment, the sealing member 400 may be a second sealing member that is used when an inlet and an outlet (each of which is equipped with a sealing member) are adjacent to each other at a predetermined distance or less. Figure 2 In the illustrated embodiment, if the coolant inlet 230a and the coolant outlet 230b as the coolant fluid supply paths 230a and 230b are located on the fluid supply block 200 so as to be adjacent to each other, the sealing member 400 may be an integrated sealing member mounted to both the coolant inlet 230a and the coolant outlet 230b.

[0122] The sealing member 400 may include a first sealing portion 410a and a second sealing portion 410b made of a flexible material such as rubber or silicon, and may include a connecting portion 420 formed between the first sealing portion 410a and the second sealing portion 410b, so that the first sealing portion 410a, the second sealing portion 410b and the connecting portion 420 may be formed integrally with each other.

[0123] The first sealing portion 410 a may include a first through hole 450 a formed through a central portion thereof, and the second sealing portion 410 b may include a second through hole 450 b formed through a central portion thereof.

[0124] An end portion of the coolant inlet 230a may be fitted into a portion of the first through hole 450a of the first sealing portion 410a, and an inlet of the second flow path 135 of the electrostatic chuck 110 may be fitted into the remaining portion of the first through hole 450a of the first sealing portion 410a.

[0125] Furthermore, an end portion of the coolant outlet 230b may be fitted into a portion of the second through hole 450b of the second sealing portion 410b, and an outlet of the second flow path 135 of the electrostatic chuck 110 may be fitted into the remaining portion of the second through hole 450b of the second sealing portion 410b.

[0126] The first sealing portion 410a may include a first air injection space 430a defined therein, and the second sealing portion 410b may include a second air injection space 430b defined therein. The first and second air injection spaces 430a and 430b may be formed in annular shapes corresponding to the first and second sealing portions 410a and 410b.

[0127] When air is injected into the first air injection space 430 a and the second air injection space 430 b , the first sealing portion 410 a and the second sealing portion 410 b may expand.

[0128] The connection portion 420 may include a connection space 425 defined therein. The connection space 425 in the connection portion 420 may be connected to the first air injection space 430a and the second air injection space 430b.

[0129] The connection portion 420 may be provided at one side thereof with an air injection port 440 connected to the connection space 425 , and the air injection port 440 may be connected to the air movement path 460 .

[0130] The air movement path 460 may be connected to the air supply unit 470 to supply the air supplied by the air supply unit 470 to the first and second air injection spaces 430 a and 430 b in the sealing member 400 .

[0131] The air movement path 460 may include a supply air movement path 461, a control air movement path 463, and an exhaust air movement path 465 branched therefrom. The air supply unit 470 may include air injection control valves 471, 473, and 475 and an air supply device 480. The controller 490 may control the air supply unit 470 to actively control the volume of the sealing member 400.

[0132] Since the configurations and functions of the air supply unit 470 and the controller 490 can be inferred from the above-described embodiments, detailed descriptions thereof will be omitted.

[0133] In addition, the present invention proposes a leakage prevention control method for a temperature control fluid used in the above substrate support device. The leakage prevention control method for a temperature control fluid according to an embodiment of the present invention will be described.

[0134] Since the leakage prevention control method of the temperature control fluid according to the present invention is implemented in the above-mentioned substrate supporting apparatus according to the present invention, the method will be described with reference to the above-mentioned embodiment of the substrate supporting apparatus.

[0135] Figure 6 A flow chart showing an embodiment of a method for preventing leakage of a temperature control fluid according to the present invention.

[0136] While the substrate treatment process is performed, the temperature of the electrostatic chuck 110 and the substrate S may change suddenly (S110). If a heat transfer medium such as helium (He) or a coolant is supplied as a temperature control fluid, the temperature may change more suddenly.

[0137] If a heat transfer medium or a coolant is supplied through the fluid supply block 200 to control the temperature of the electrostatic chuck 110 or the substrate S or to cool it (S120), a gap may be generated due to the difference in expansion coefficient between the electrostatic chuck 110 and the fluid supply block 200 and the difference in expansion coefficient between the fluid supply block 200 and the sealing members 300 and 400, which may cause leakage of the heat transfer medium or the coolant.

[0138] The present invention actively expands the sealing member to enhance the adhesion of the seal, thereby suppressing the generation of gaps and thereby preventing leakage of the temperature control fluid.

[0139] The controllers 390 and 490 determine the temperature difference when performing the substrate processing process. The controllers 390 and 490 may predetermine the temperature of the electrostatic chuck 110, the fluid supply block 200, and the sealing members 300 and 400 according to the execution of each process, may store temperature difference data, and may determine the temperature difference according to the execution of the corresponding process based on the data. Alternatively, a temperature measuring component may be provided, which is used to measure the temperature of the electrostatic chuck 110, the fluid supply block 200, and the sealing members 300 and 400, and the controllers 390 and 490 may determine the temperature difference based on the temperature measured by the temperature measuring component.

[0140] In addition, the controllers 390 and 490 may determine a temperature change based on an expansion coefficient of the fluid supply block 200 and the sealing members 300 and 400 according to the temperature.

[0141] The controller 390 may set conditions of the amount of injected air and the pressure of injected air to expand the sealing member 300 based on the temperature difference.

[0142] In addition, the controller 390 may control the air supply unit 370 to control the amount of injected air and the pressure of injected air and inject air into the air injection space 330 in the sealing member 300 ( S130 ).

[0143] As air is injected thereinto, the sealing member 300 may expand ( S140 ), and may fill a gap between the sealing member 300 and the fluid supply block 200 , and thus the adhesion of the sealing member 300 may be enhanced.

[0144] Therefore, leakage of the temperature control fluid can be prevented (S150).

[0145] Reference 7A to 9C The leakage prevention control method of the temperature control fluid according to the present invention is described in more detail.

[0146] Regarding the leakage control process of the control fluid, 7A to 7CAn embodiment of a leakage prevention control process when a heat transfer medium as a temperature control fluid is supplied in a leakage prevention control method of a temperature control fluid according to the present invention is shown, and FIG. 8A to FIG. 8C An embodiment of a leakage prevention control process when a heat transfer medium as a temperature control fluid is discharged in a leakage prevention control method of a temperature control fluid according to the present invention is shown.

[0147] Regarding the case where a heat transfer medium as a temperature control fluid is supplied to the electrostatic chuck, if helium gas as the heat transfer medium is supplied to the inlet 136a of the first flow path through the heat transfer medium inlet 220a of the fluid supply block, as shown in FIG. Fig. 7A As shown, due to the difference in expansion coefficients between the main body 210 of the fluid supply block and the sealing member 300a, a gap G may be generated, such as Figure 7B shown.

[0148] The controller 390 may open the air injection control valve 371 a provided on the supply air moving path 361 a , and may control the air supply device 380 a to supply air to the air moving path 360 a .

[0149] The air in the air movement path 360 a may be injected into the air injection space 330 a in the sealing member 300 a to expand the sealing member 300 a .

[0150] like Figure 7C As shown, due to the expansion of the sealing member 300a, the gap between the fluid supply block 200 and the sealing member 300a can be filled, and thus the adhesion of the sealing member 300a can be enhanced. Therefore, the leakage of helium gas as a heat transfer medium can be prevented.

[0151] Regarding the case where the heat transfer medium as the temperature control fluid is discharged from the electrostatic chuck, if helium gas as the heat transfer medium is discharged from the outlet 136b of the first flow path through the heat transfer medium outlet 220b of the fluid supply block, as shown in FIG. Fig. 8A As shown, due to the difference in expansion coefficients between the main body 210 of the fluid supply block and the sealing member 300b, a gap G may be generated, such as Figure 8B shown.

[0152] The controller 390 may open the air injection control valve 371 b provided on the supply air moving path 361 b , and may control the air supply device 380 b to supply air to the air moving path 360 b .

[0153] The air in the air movement path 360b may be injected into the air injection space 330b in the sealing member 300b to expand the sealing member 300b.

[0154] like Figure 8CAs shown, due to the expansion of the sealing member 300b, the gap between the fluid supply block 200 and the sealing member 300b can be filled, and thus the adhesion of the sealing member 300b can be enhanced. Therefore, the leakage of helium gas as a heat transfer medium can be prevented.

[0155] Next, regarding the anti-leakage control process of the control fluid, 9A to 9C An example of a leakage prevention control process when a coolant as a temperature control fluid is supplied and discharged in a leakage prevention control method of a temperature control fluid according to the present invention is shown.

[0156] Regarding the case where a coolant as a temperature control fluid is supplied to and discharged from the electrostatic chuck, if the coolant is supplied to the inlet 137a of the second flow path through the coolant inlet 230a of the fluid supply block, and the coolant circulating through the second flow path is discharged through the outlet 137b of the second flow path, as shown in FIG. Fig.9A As shown, due to the difference in expansion coefficients between the main body 210 of the fluid supply block and the sealing member 400, a gap G may be generated, such as Fig. 9B shown.

[0157] The controller 490 may open the air injection control valve 471 provided on the supply air movement path 461 , and may control the air supply device 480 to supply air to the air movement path 460 .

[0158] The air in the air movement path 460 may be injected into the connection space 425 defined in the connection portion 420 of the sealing member 400 , and the injected air may be supplied to the first air injection space 440a in the first sealing portion 410a and the second air injection space 440b in the second sealing portion 410b through the connection space 425 .

[0159] The air injected into the first air injection space 440 a may expand the first sealing portion 410 a , and the air injected into the second air injection space 440 b may expand the second sealing portion 410 b .

[0160] like Fig. 9C As shown, due to the expansion of the sealing member 400, the gap between the fluid supply block 200 and the sealing member 400 may be filled, and thus the adhesion of the sealing member 400 may be enhanced. Therefore, leakage of the coolant may be prevented.

[0161] Fig.10 A flow chart showing another embodiment of the leakage prevention control method for temperature control fluid according to the present invention.

[0162] In describing this embodiment, Figure 6Descriptions of the same components as those of the previous embodiment described will be omitted or briefly given below.

[0163] While performing the substrate treating process, the controllers 390 and 490 may determine a temperature difference between the electrostatic chuck 110 and the fluid supply block 200 or a temperature difference between the fluid supply block 200 and the sealing members 300 and 400 ( S210 ).

[0164] The controllers 390 and 490 may control the air supply devices 380 and 480 of the air supply units 370 and 470 based on the temperature difference to control the temperature of the air to be supplied ( S220 ).

[0165] In addition, the controllers 390 and 490 may set the injection amount and pressure of air to be supplied based on the temperature difference, and may control the air supply units 370 and 470 to inject air into the sealing members 300 and 400 ( S230 ).

[0166] If the sealing members 300 and 400 expand due to air injected therein (S240), the controllers 390 and 490 can obtain air pressure measurements (S250), and can determine whether the air pressure measurements exceed a set pressure range (S260). Here, the set pressure range can be set to allow the sealing members 300 and 400 to expand to achieve a proper seal. The set pressure range can be set based on a temperature difference, an amount of air injected, an air temperature, etc.

[0167] If the air pressure in the sealing members 300 and 400 exceeds the set pressure range, the controllers 390 and 490 may control the air supply units 370 and 470 to discharge air from the sealing members 300 and 400 to reduce the air pressure (S270).

[0168] If the air pressure in the sealing members 300 and 400 is lower than the set pressure range, the controllers 390 and 490 may control the air supply units 370 and 470 to increase the air pressure in the sealing members 300 and 400 .

[0169] If the air pressure in the sealing members 300 and 400 is within the set pressure range, the controllers 390 and 490 may control the air supply units 370 and 470 to maintain injection of air so that the air pressure conforms to the set pressure range ( S280 ).

[0170] Fig.11A and Fig. 11B An embodiment of a process of controlling the air pressure in a sealing member in the leakage prevention control method of a temperature control fluid according to the present invention is shown.

[0171] like Fig.11AAs shown, if helium as a heat transfer medium is supplied to the inlet 136a of the first flow path through the heat transfer medium inlet 220a of the fluid supply block, the controller 390 can open the air injection control valve 371a set on the supply air movement path 361a, and can control the air supply device 380a to supply air to the air movement path 360a.

[0172] When air is supplied to expand the sealing member 300a, the controller 390 may determine the expansion degree of the sealing member 300a based on the air pressure measurement value.

[0173] If the air pressure in the sealing member 300a exceeds the set pressure range, the controller 390 may control the air pressure control valve 373b provided on the control air movement path 363b to discharge a certain amount of air from the sealing member 300a, such as Fig. 11B shown.

[0174] If the air pressure in the sealing member 300a is within the set pressure range, the controller 390 may close the air pressure control valve 373b to maintain the air pressure in the sealing member 300a.

[0175] Fig. 12A and Fig. 12B An embodiment of a process of exhausting air from a sealing member in a leakage prevention control method of a temperature control fluid according to the present invention is shown.

[0176] In a state where the temperature difference between the electrostatic chuck 110 and the fluid supply block 200 or the temperature difference between the fluid supply block 200 and the sealing members 300 and 400 is maintained at a predetermined level or lower and thus a gap is not generated, if the sealing member 300a is maintained in an expanded state, stress may continue to accumulate in the sealing member 300a.

[0177] Therefore, if the temperature difference between the electrostatic chuck and the fluid supply block or the temperature difference between the fluid supply block and the sealing member is eliminated and thus no gap is generated, such as Fig. 12A As shown, the controller 390 may open the exhaust air control valve 375a provided on the exhaust air movement path 365a to exhaust air from the sealing member 300a through the air supply device 380a, as shown in FIG. Fig. 12B shown.

[0178] As described above, the present invention adopts a sealing member that actively controls volume expansion in consideration of a difference in expansion coefficients between a fluid supply block that supplies a heat transfer medium or a coolant as a temperature control fluid and an electrostatic chuck due to their different materials, or a difference in expansion coefficients between a fluid supply block and a sealing member in a substrate support device due to their different materials, thereby preventing leakage of the temperature control fluid.

[0179] Specifically, when the temperature suddenly changes during the substrate processing process and a gap is generated due to the expansion difference between the fluid supply block and the electrostatic chuck or between the fluid supply block and the sealing member, the present invention actively expands the sealing member to enhance the adhesion of the sealing member, thereby ensuring a stable seal and preventing leakage of the temperature control fluid.

[0180] According to the above description, the present invention provides a technology for preventing leakage of a temperature control fluid by adopting a sealing member, which actively controls volume expansion in consideration of a difference in expansion coefficients between a fluid supply block supplying a heat transfer medium or a coolant as a temperature control fluid and an electrostatic chuck due to their different materials, or a difference in expansion coefficients between a fluid supply block and a sealing member in a substrate support device due to their different materials.

[0181] Specifically, the present invention provides a technology for actively expanding a sealing member to enhance the adhesion of the sealing member in a state where the temperature suddenly changes when a substrate processing process is performed and a gap is generated due to the expansion difference between a fluid supply block and an electrostatic chuck or between the fluid supply block and the sealing member, thereby ensuring stable sealing and preventing leakage of a temperature control fluid.

[0182] Effects achievable by the present invention are not limited to the above-mentioned effects, and other effects not mentioned herein will be clearly understood by those skilled in the art from the above description.

[0183] It will be apparent to those skilled in the art that various changes may be made to form and detail without departing from the basic features of the invention set forth herein. Therefore, the above detailed description is not intended to be interpreted as limiting the invention in all respects, but is considered as an example. The scope of the invention should be determined by the reasonable interpretation of the appended claims, and all equivalent modifications made without departing from the invention should be included in the appended claims.

Claims

1. A substrate supporting device, comprising: an electrostatic chuck configured to support a substrate and including a flow path for a temperature control fluid therein for temperature control; a body member configured to support the electrostatic chuck; a fluid supply block mounted in the body member, the fluid supply block including a temperature-controlled fluid supply path formed therein to supply the temperature-controlled fluid to the flow path in the electrostatic chuck; a sealing member mounted to the fluid supply block, the sealing member including an air injection space defined therein, the sealing member being configured to expand due to injection of air into the air injection space; as well as An air supply unit is configured to inject air into the sealing member.

2. The substrate supporting device according to claim 1 further comprises a controller, wherein the controller is configured to control the air supply unit based on a temperature difference between the electrostatic chuck and the fluid supply block or a temperature difference between the fluid supply block and the sealing member to inject air into the sealing member, thereby expanding the sealing member.

3. The substrate supporting device according to claim 2, wherein: The air supply unit comprises: an air movement path configured to supply air to the sealing member; an air supply device configured to supply air to the air movement path; and An air injection control valve is provided on the air movement path to control the supply of air.

4. The substrate supporting device according to claim 3, wherein: The air supply unit further includes a pressure measuring component configured to measure the pressure of the air supplied through the air movement path, and Wherein, the controller controls the injection of air into the sealing member based on the pressure value measured by the pressure measuring component.

5. The substrate supporting device according to claim 4, wherein: The air supply unit further comprises: a supply air movement path configured to supply air to the sealing member; an air injection control valve, which is arranged on the supply air movement path to control the supply of air to be injected; a control air movement path configured to control air pressure in the sealing member; an air pressure control valve disposed on the control air movement path to control the pressure of air supplied to the sealing member; an exhaust air movement path configured to exhaust air from the sealing member; and An air discharge control valve is provided on the discharge air movement path to control the discharge of air from the sealing member.

6. The substrate supporting device according to claim 3, wherein: The air supply unit further includes an air heater configured to control the temperature of the air to be supplied, and The controller controls the air heater to control the temperature of the air to be injected according to the expansion degree of the sealing member.

7. The substrate supporting device according to claim 1, wherein: The fluid supply block comprises: a heat transfer medium inlet configured to supply a heat transfer medium to the electrostatic chuck; and a heat transfer medium outlet configured to discharge the heat transfer medium from the electrostatic chuck, and Wherein, the sealing component comprises: a sealing member mounted to the heat transfer medium inlet; and A sealing member is mounted to the heat transfer medium outlet.

8. The substrate supporting device according to claim 1, wherein: The fluid supply block comprises: a coolant inlet configured to supply coolant to the electrostatic chuck; and a coolant outlet configured to discharge the coolant from the electrostatic chuck, and Wherein, the sealing component comprises: a first sealing portion fastened to the coolant inlet, the first sealing portion including a first air injection space defined therein, the first sealing portion being configured to expand due to injection of air into the first air injection space; a second sealing portion fastened to the coolant outlet, the second sealing portion including a second air injection space defined therein, the second sealing portion being configured to expand due to injection of air into the second air injection space; and A connecting portion configured to connect the first sealing portion and the second sealing portion to each other.

9. The substrate supporting device according to claim 8, wherein: The connecting portion of the sealing member comprises: a connection space defined in the connection portion to connect the first air injection space in the first sealing portion and the second air injection space in the second sealing portion to each other; and An air injection port is connected to the air supply unit to supply air to the connection space or exhaust air from the connection space.

10. The substrate supporting device according to claim 3, wherein: The air supply unit further includes an air heater configured to control a temperature of air supplied through the air movement path, and The controller controls the air heater to control the temperature of the air injected into the sealing member.

11. A method for preventing leakage of a temperature control fluid, the method comprising: a temperature control fluid supplying step, supplying a temperature control fluid through a fluid supply module to control the temperature of the electrostatic chuck or the substrate or to cool the electrostatic chuck or the substrate; an air supplying step of supplying air to the sealing member through an air supply unit based on a temperature difference between the electrostatic chuck and the fluid supply block or a temperature difference between the fluid supply block and the sealing member; as well as A sealing step of expanding the sealing member to prevent leakage of the temperature control fluid.

12. The method according to claim 11, wherein: The air supply step comprises: a temperature difference determining step of determining, by a controller, a temperature difference between the electrostatic chuck and the fluid supply block or a temperature difference between the fluid supply block and the sealing member; a condition setting step of setting, by the controller, conditions of the amount and pressure of air injected for expanding the sealing member based on the temperature difference; and The air injection step controls the air supply unit by the controller under the set conditions to inject air into the sealing member.

13. The method according to claim 11, wherein: The sealing step includes an air pressure control step, in which the controller obtains a pressure measurement value of the air injected into the sealing member, and the controller controls the air supply unit based on the pressure measurement value and a set pressure range to control the air pressure in the sealing member.

14. The method according to claim 12, wherein: In the temperature control fluid supplying step, the fluid supply block supplies a heat transfer medium as the temperature control fluid to a flow path of the electrostatic chuck through a heat transfer medium inlet, and Wherein, the air supply step comprises: a temperature difference determining step of determining, by the controller, a temperature difference between the electrostatic chuck and the fluid supply block or a temperature difference between the fluid supply block and the sealing member according to the supply of the heat transfer medium; a condition setting step of setting, by the controller, one or more conditions of an amount, pressure, and temperature of injected air for expanding a sealing member mounted to the heat transfer medium inlet of the fluid supply block based on the temperature difference according to supply of the heat transfer medium; and The air injection step opens an air injection control valve by the controller based on the temperature difference, and controls an air supply device by the controller under the set condition to inject air into the sealing member through a supply air movement path.

15. The method according to claim 14, wherein: In the sealing step, if the air pressure in the sealing member exceeds a set pressure range, the controller controls an air pressure control valve provided on a control air movement path to control the air injected into the sealing member.

16. The method according to claim 14, wherein: In the temperature control fluid supplying step, the fluid supply block discharges the heat transfer medium as the temperature control fluid from the flow path of the electrostatic chuck through a heat transfer medium outlet, and Wherein, the air supply step further comprises: a temperature difference determining step of determining, by the controller, a temperature difference between the electrostatic chuck and the fluid supply block or a temperature difference between the fluid supply block and the sealing member according to the discharge of the heat transfer medium; a condition setting step of setting, by the controller, one or more conditions of an amount, pressure, and temperature of injected air for expanding a sealing member mounted to the heat transfer medium outlet of the fluid supply block based on the temperature difference according to discharge of the heat transfer medium; and An air injection step of opening the air injection control valve by the controller based on the temperature difference and controlling the air supply device by the controller under the set condition to inject air into the sealing member through the supply air movement path.

17. The method according to claim 12, wherein: In the temperature control fluid supplying step, the fluid supply block supplies a coolant as the temperature control fluid to a flow path of the electrostatic chuck through a coolant inlet and discharges the coolant from the flow path of the electrostatic chuck, and Wherein, the air supply step comprises: a temperature difference determining step of determining, by the controller, a temperature difference between the electrostatic chuck and the fluid supply block or a temperature difference between the fluid supply block and the sealing member according to supply and discharge of the coolant; a condition setting step of setting, by the controller, one or more conditions of an amount, pressure, and temperature of injected air for expanding a sealing member mounted to the coolant inlet of the fluid supply block based on the temperature difference according to supply and discharge of the coolant; and The air injection step opens an air injection control valve by the controller based on the temperature difference, and controls an air supply device by the controller under the set condition to inject air into the sealing member through a supply air movement path.

18. The method according to claim 17, wherein: In the air injection step, air is injected into a connection portion of the sealing member, and the air is supplied to the first sealing portion and the second sealing portion through the connection portion, and Wherein, in the sealing step, the first sealing portion and the second sealing portion expand to prevent leakage of the coolant.

19. The method according to claim 17, wherein: In the sealing step, if the air pressure in the sealing member exceeds a set pressure range, the controller controls an air pressure control valve provided on a control air movement path to control the air injected into the first and second sealing portions.

20. A substrate support device comprising: an electrostatic chuck configured to support a substrate, the electrostatic chuck including a first flow path and a second flow path formed therein to perform temperature control corresponding to a heat transfer medium and a coolant as temperature control fluids; a body member configured to support the electrostatic chuck; a fluid supply block mounted in the body member, the fluid supply block being provided with a temperature control fluid supply path, the temperature control fluid supply path comprising a heat transfer medium supply path and a coolant supply path, the heat transfer medium supply path comprising a heat transfer medium inlet and a heat transfer medium outlet to supply the heat transfer medium to and discharge from the first flow path of the electrostatic chuck, and the coolant supply path comprising a coolant inlet and a coolant outlet to supply the coolant to and discharge from the second flow path of the electrostatic chuck; a sealing member including a first sealing member and a second sealing member, the first sealing member being mounted to each of the heat transfer medium inlet and the heat transfer medium outlet and including an air injection space defined in the first sealing member to control expansion according to injection of air, and the second sealing member including: a first sealing portion being mounted to the coolant inlet and including a first air injection space defined in the first sealing portion; a second sealing portion being mounted to the coolant outlet and including a second air injection space defined in the second sealing portion; and a connecting portion interconnecting the first sealing portion and the second sealing portion and including a connecting space defined in the connecting portion thereof to connect to the first air injection space and the second air injection space, the sealing member being configured to control expansion according to injection of air; an air supply unit, comprising an air movement path, the air movement path comprising: a supply air movement path, the supply air movement path being configured to supply air to the sealing member; a control air movement path, the control air movement path being configured to control the air pressure in the sealing member; and an exhaust air movement path, the air movement path being configured to exhaust air from the sealing member; an air control valve, the air control valve comprising: an air injection control valve, the air injection control valve being arranged on the supply air movement path to control the supply of injected air; an air pressure control valve, the air pressure control valve being arranged on the control air movement path to control the pressure of air supplied to the sealing member; and an air exhaust control valve, the air exhaust control valve being arranged on the exhaust air movement path to control the exhaust of air from the sealing member; and an air supply device, the air supply device comprising: a pressure measuring component, the pressure measuring component being configured to measure the pressure of air supplied through the air movement path; and an air supplier, the air supplier being configured to supply air; and A controller configured to control the air supply unit to inject air into the sealing member to expand the sealing member based on a temperature difference between the electrostatic chuck and the fluid supply block or a temperature difference between the fluid supply block and the sealing member.

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