OLED mask marking structure and OLED etching marking method

Abstract

The invention relates to an OLED mask marking structure and an OLED etching marking method, an ITO mask is provided with a first positioning identification area, an MAM mask is provided with a second positioning identification area, and identification points of the first positioning identification area and the second positioning identification area are overlapped in space; the first positioning identification area comprises a first hollow alignment frame and a first special-shaped alignment mark, and other identification points are solid alignment frames; the second positioning recognition area comprises a second hollow alignment frame and a plurality of second special-shaped alignment marks, and the second hollow alignment frame is arranged corresponding to the positions of the first special-shaped alignment marks. According to the OLED mask marking structure and the manufacturing method thereof, identification points of the OLED mask marking structure on each mask are specially designed, so that even if an MAM etching sequence is adjusted, mask positioning during etching before and after can still be effectively carried out, the same set of masks can adapt to the MAM etching process firstly and the MAM etching process later, the cost input can be saved, and the production efficiency is improved. The machining process is simplified, and the machining efficiency is improved.

Description

Technical Field

[0001] The present invention relates to the field of display device manufacturing, and in particular to an OLED mask marking structure and an OLED etching marking method. Background Art

[0002] PM-OLED is also known as organic light-emitting semiconductor. Under the action of the electric field, the holes generated by the anode and the electrons generated by the cathode will move, and are injected into the hole transport layer and the electron transport layer respectively, and migrate to the light-emitting layer. When the two meet in the light-emitting layer, energy excitons are generated, thereby exciting the light-emitting molecules to finally produce visible light. In the entire OLED production process, photolithography is a very critical process, and 4 functional layers need to be made. The first MAM (molybdenum aluminum molybdenum, MoALMo) etching is used as a peripheral auxiliary electrode to reduce the starting voltage of the device, etc. The second ITO (indium tin metal oxide, Indium Tin Oxide) etching is used as an anode circuit, and the third insulating layer is used for insulation and pixel segmentation. The fourth isolation column is used as a cathode segmentation. Mark points, i.e., identification points, are designed on the masks corresponding to the above four functional layers so that the masks of each functional layer can be accurately fitted.

[0003] The process flow of PMOLED yellow light in the early stage is MAM etching, ITO etching, insulating layer production, cathode isolation column production, that is, MAM etching process first. With the advancement of narrow frame and the improvement of yield of old process, the etching process has evolved into post-MAM etching process, that is, the process flow is ITO etching, MAM etching, insulating layer production, cathode isolation column production. The two process flows make the process methods have their own advantages and disadvantages. Generally, one process flow will be selected for implementation according to specific design requirements or customer needs. Generally speaking, different masks need to be designed for different process flows, resulting in high mask design costs. At present, there is no relevant mask design that can meet both processes at the same time. Summary of the invention

[0004] A main purpose of the present invention is to overcome at least one of the above-mentioned defects, and to provide an OLED mask marking structure and an OLED etching marking method, which can simultaneously meet the requirements of the pre-MAM etching process and the post-MAM etching process, reduce production costs, and simplify the processing technology.

[0005] In order to achieve the above object, the technical solution adopted by the present invention is: The present invention provides an OLED mask marking structure, wherein the OLED mask comprises an ITO mask and a MAM mask, wherein the ITO mask has a first positioning identification area, and the MAM mask has a second positioning identification area, wherein: The first positioning identification area includes at least four identification points, the second positioning identification area includes at least four identification points, and the identification points of the first positioning identification area and the second positioning identification area overlap in space; The at least four identification points in the first positioning identification area include a first hollow alignment frame and a first special-shaped alignment mark, and the remaining identification points are solid alignment frames; The at least four identification points of the second positioning identification area include a second hollow alignment frame and a plurality of second special-shaped alignment marks, and the second hollow alignment frame is arranged corresponding to the position of the first special-shaped alignment mark.

[0006] According to one embodiment of the present invention, the OLED mask includes an insulating layer mask, the insulating layer mask has a third positioning identification area, the third positioning identification area includes at least four identification points, the at least four identification points of the third positioning identification area include a third hollow alignment frame and multiple solid positioning frames, and the third hollow alignment frame corresponds to the position setting of a solid positioning frame in the first positioning identification area.

[0007] According to one embodiment of the present invention, the OLED mask includes an isolation column mask, the isolation column mask has a fourth positioning identification area, the fourth positioning identification area includes at least four identification points, the at least four identification points of the fourth positioning identification area include a fourth hollow alignment frame and multiple solid positioning frames, and the fourth hollow alignment frame corresponds to the position setting of a solid positioning frame in the first positioning identification area.

[0008] According to one embodiment of the present invention, there are two first spare identification points in the first positioning identification area, and the first spare identification points are solid alignment frames; Two second spare identification points in the second positioning identification area, wherein the second spare identification points are special-shaped alignment marks; The OLED mask includes an insulating layer mask and an isolation column mask. The insulating layer mask has a third positioning identification area, and the isolation column mask has a fourth positioning identification area. The third positioning identification area has a hollow alignment frame corresponding to a spare identification point, and the fourth positioning identification area has a hollow alignment frame corresponding to another spare identification point.

[0009] In particular, the present invention provides an OLED mask marking structure, wherein the OLED mask comprises an ITO mask and a MAM mask, wherein the MAM mask has a first positioning identification area, and the ITO mask has a second positioning identification area, wherein: The first positioning identification area includes at least four identification points, the second positioning identification area includes at least four identification points, and the identification points of the first positioning identification area and the second positioning identification area overlap in space; The at least four identification points in the first positioning identification area include a first hollow alignment frame and a first special-shaped alignment mark, and the remaining identification points are solid alignment frames; The at least four identification points of the second positioning identification area include a second hollow alignment frame and a plurality of second special-shaped alignment marks, and the second hollow alignment frame is arranged corresponding to the position of the first special-shaped alignment mark.

[0010] According to one embodiment of the present invention, the OLED mask includes an insulating layer mask, the insulating layer mask has a third positioning identification area, the third positioning identification area includes at least four identification points, the at least four identification points of the third positioning identification area include a third hollow alignment frame and multiple solid positioning frames, and the third hollow alignment frame corresponds to the position setting of a solid positioning frame in the first positioning identification area.

[0011] According to one embodiment of the present invention, the OLED mask includes an isolation column mask, the isolation column mask has a fourth positioning identification area, the fourth positioning identification area includes at least four identification points, the at least four identification points of the fourth positioning identification area include a fourth hollow alignment frame and multiple solid positioning frames, and the fourth hollow alignment frame corresponds to the position setting of a solid positioning frame in the first positioning identification area.

[0012] According to one embodiment of the present invention, there are two first spare identification points in the first positioning identification area, and the first spare identification points are solid alignment frames; Two second spare identification points in the second positioning identification area, wherein the second spare identification points are special-shaped alignment marks; The OLED mask includes an insulating layer mask and an isolation column mask. The insulating layer mask has a third positioning identification area, and the isolation column mask has a fourth positioning identification area. The third positioning identification area has a hollow alignment frame corresponding to a spare identification point, and the fourth positioning identification area has a hollow alignment frame corresponding to another spare identification point.

[0013] In particular, the present invention also provides an OLED etching and marking method, wherein the OLED etching includes ITO etching and MAM etching, and the corresponding OLED patterns are formed by the ITO mask and the MAM mask respectively during the ITO etching and the MAM etching, wherein, during the OLED etching, one or more special-shaped identification marks are first formed on the substrate by the special-shaped alignment marks on the positioning and identification area of ​​the ITO mask or the MAM mask, and then the alignment of the front and rear masks is completed by aligning the special-shaped identification marks with the solid alignment frame on the positioning and identification area of ​​the MAM mask or the ITO mask.

[0014] According to one embodiment of the present invention, the shape of the special-shaped identification mark is a cross, a triangle or other polygons.

[0015] Compared with the prior art, the advantages and beneficial effects of the OLED mask marking structure and OLED etching marking method of the patent application of the present invention are: The OLED mask marking structure is specially designed at the identification points on each mask, so that even if the MAM etching sequence is adjusted, the mask positioning during front and back etching can still be effectively performed, and the same set of masks can be adapted to both the MAM etching process and the MAM etching process, saving the cost of a set of masks. At the same time, there is no need to adjust the etching equipment when switching the processing technology, which simplifies the processing technology and improves the processing efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Hereinafter, some specific embodiments of the present invention will be described in detail in an exemplary and non-limiting manner with reference to the accompanying drawings. The same reference numerals in the accompanying drawings indicate the same or similar components or parts. It should be understood by those skilled in the art that these drawings are not necessarily drawn to scale. In the accompanying drawings: Figure 1 is a schematic diagram of each mask structure of the OLED mask marking structure according to Example 1 of the present invention; Figure 2 is a schematic diagram of each mask structure of an OLED mask marking structure according to Example 2 of the present invention; Figure 3 is a schematic diagram of each mask structure of an OLED mask marking structure according to Example 3 of the present invention; Figure 4 Schematic diagram of each mask structure of the OLED mask marking structure according to Example 4 of the present invention.

[0017] The following are the descriptions of the reference numerals: 10. ITO mask, 20. MAM mask, 30. Insulation layer mask, 40. Isolation column mask; 1. first positioning identification area, 11. first hollow alignment frame, 12. first special-shaped alignment mark, 13. first spare identification point; 2. second positioning identification area, 21. second hollow alignment frame, 22. second special-shaped alignment mark, 23. second spare identification point; 3. The third positioning identification area, 31. The third hollow alignment frame; 4. fourth positioning identification area, 41. fourth hollow alignment frame; 5. Solid alignment frame. DETAILED DESCRIPTION

[0018] The technical solution of the present invention will be described clearly and completely below in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0019] In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, the terms "first", "second", and "third" are used for descriptive purposes only, and cannot be understood as indicating or implying relative importance.

[0020] In addition, the technical features involved in the different embodiments of the present invention described below can be combined with each other as long as they do not conflict with each other.

[0021] The OLED display device used for production and processing in this embodiment may generally include: substrate; An ITO anode is disposed on the substrate; A metal wire layer is disposed on the ITO anode and is located on a side away from the substrate; An insulating layer, disposed on the metal wire layer and located on a side away from the ITO anode; An organic light-emitting layer is disposed on the insulating layer and is located on a side away from the metal wire layer; The metal cathode is disposed on the organic light-emitting layer and is located at a side away from the insulating layer.

[0022] The production process of OLED display devices is generally as follows: Substrate preparation: cutting glass or plastic substrates into finished sizes and cleaning and surface treatment for subsequent thin film deposition; ITO anode film production: transparent ITO (indium tin oxide) material is deposited on one end of the glass substrate to form a thin film; Preparation of metal conductor layer film: Molybdenum aluminum molybdenum (MAM) material is deposited on the ITO anode (the side away from the substrate) to form a thin film. For the convenience of description, the substrate, ITO anode film and metal conductor layer film are collectively referred to as the bottom plate. Preparation of ITO anode and metal wire layer: Use photolithography technology to etch the ITO anode film and the metal wire layer film to form an ITO anode and a metal wire layer corresponding to the design pattern. In this process, an ITO mask 10 and a MAM mask 20 need to be used accordingly; Preparation of the insulating layer: an insulating photolithographic material such as polyimide is disposed on the surface of the metal wire layer to form a thin film to form an insulating layer film, and then the insulating layer film is etched by photolithography to form an insulating layer. An insulating layer mask 30 is used in the etching process; Organic material deposition: using chemical vapor deposition (CVD) to evaporate the organic light-emitting material in the pattern setting area and / or other display areas of the OLED to form the organic light-emitting layer; Cathode manufacturing: firstly, a RIB partition is formed on the surface of the organic light-emitting layer through an isolation column mask 40, and then the cathode material is evaporated to form the metal cathode 6 on the organic light-emitting layer; Finally, the package is performed by bonding the cover plate to the substrate and filling them with organic materials and protective coating to form a package structure.

[0023] Embodiment 1: This embodiment describes an OLED mask marking structure. The OLED mask in this embodiment includes an ITO mask 10, a MAM mask 20, an insulating layer mask 30 and an isolation column mask 40. The ITO mask 10 has a first positioning identification area 1, the MAM mask 20 has a second positioning identification area 2, the insulating layer mask 30 has a third positioning identification area 3, and the isolation column mask 40 has a fourth positioning identification area 4. Corresponding OLED graphics are also arranged on each mask. The positioning identification areas on each mask overlap in space when put into use. For example, when performing ITO etching, the ITO mask 10 is covered on the surface of the metal wire layer film and then ITO photolithography is performed. After the ITO etching is completed, the ITO mask 10 is removed and then MAM etching is performed. When performing MAM etching, the MAM mask 20 is covered on the surface of the metal wire layer film after the ITO etching is completed and then MAM photolithography is performed. When covering with the MAM mask 20, the second positioning identification area 2 corresponds to the position of the first positioning identification area 1. After the MAM etching is completed, the MAM mask 20 is removed and then the insulating layer mask 30 and the isolation column mask 40 are sequentially covered to perform subsequent insulating layer production and isolation column production.

[0024] In this embodiment, if Figure 1 As shown, the first positioning identification area 1 includes four identification points, the second positioning identification area 2 includes four identification points, similarly, the third positioning identification area 3 includes four identification points, and the fourth positioning identification area 4 includes four identification points. When each mask is put into use, the identification points in each positioning identification area overlap in space; The four identification points of the first positioning identification area 1 include a first hollow alignment frame 11 and a first special-shaped alignment mark 12, and the remaining identification points are solid alignment frames 5; The four identification points of the second positioning identification area 2 include a second hollow alignment frame 21 and a plurality of second special-shaped alignment marks 22, wherein the second hollow alignment frame 21 is arranged corresponding to the position of the first special-shaped alignment mark 12; The four identification points of the third positioning identification area 3 include a third hollow alignment frame 31 and a plurality of solid positioning frames, and the third hollow alignment frame 31 is arranged corresponding to the position of a solid positioning frame in the first positioning identification area 1; The four identification points of the fourth positioning identification area 4 include a fourth hollow alignment frame 41 and a plurality of solid positioning frames. The fourth hollow alignment frame 41 is arranged corresponding to the position of a solid positioning frame in the first positioning identification area 1 .

[0025] It can be understood that when the post-MAM etching process is adopted: ITO etching is performed first, and when the ITO etching is performed, the first special-shaped alignment mark 12 in the first positioning and identification area 1 of the ITO mask 10 forms a first special-shaped identification mark on the surface of the base plate, and when the MAM mask 20 is subsequently covered on the base plate, in order to achieve positioning, the hollow alignment frame in the second positioning and identification area 2 is aligned with the first special-shaped identification mark, and then MAM etching is performed. The second special-shaped alignment mark 22 in the second positioning and identification area 2 of the MAM mask 20 forms two second special-shaped identification marks located in the middle on the surface of the base plate, and the two second special-shaped identification marks are used for positioning the insulating layer mask 30 and the isolation column mask 40 during the subsequent insulating layer production and isolation column production.

[0026] When the MAM etching process is adopted first: MAM etching is performed first, and when MAM etching is performed, the multiple second special-shaped alignment marks 22 in the second positioning identification area 2 of the MAM mask 20 form multiple second special-shaped identification marks on the surface of the base plate, and the second hollow alignment frame 21 forms a square frame-shaped identification mark. When the ITO mask 10 is subsequently covered on the base plate, in order to achieve positioning, the hollow alignment frame in the first positioning identification area 1 is aligned with the second special-shaped identification mark located in the first position, and the first special-shaped alignment mark 12 is aligned with the square frame-shaped identification mark. Then, after the ITO etching is completed, only the two middle second special-shaped identification marks remain. The two second special-shaped identification marks are used for positioning the insulating layer mask 30 and the isolation column mask 40 during the subsequent insulating layer production and isolation column production.

[0027] Embodiment 2: This embodiment makes an improvement on the OLED mask marking structure of Embodiment 1, and adds two spare identification points on each mask.

[0028] Specifically, if Figure 2 As shown, the first positioning identification area 1 includes two first spare identification points 13, and the first spare identification points 13 are solid alignment frames 5; The second positioning identification area 2 includes two second spare identification points 23, and the second spare identification points 23 are special-shaped alignment marks; The OLED mask includes an insulating layer mask 30 and an isolation column mask 40. The insulating layer mask 30 has a third positioning identification area 3, and the isolation column mask 40 has a fourth positioning identification area 4. The third positioning identification area 3 corresponds to a spare identification point (the fifth identification point arranged from left to right) and has a hollow alignment frame. The fourth positioning identification area 4 corresponds to another spare identification point (the sixth identification point arranged from left to right) and has a hollow alignment frame.

[0029] The setting of the spare identification point is used as a spare identification position of the mask when the insulating layer or the isolation column is made.

[0030] Embodiment 3: This embodiment makes an improvement on the OLED mask marking structure of Embodiment 1, and two positioning identification areas are respectively provided on each mask.

[0031] like Figure 3 As shown, a positioning identification area is provided on the upper and lower sides of the OLED pattern of each mask, that is, the ITO mask 10 has two first positioning identification areas 1, the MAM mask 20 has two second positioning identification areas 2, the insulating layer mask 30 has two third positioning identification areas 3, and the isolation column mask 40 has two fourth positioning identification areas 4. The arrangement of identification points of the positioning identification areas on different masks is the same as that in Example 1.

[0032] The setting of dual positioning identification areas can further improve the accuracy of mask positioning.

[0033] Embodiment 4: This embodiment describes an OLED mask marking structure. The OLED mask in this embodiment includes a MAM mask 20, an ITO mask 10, an insulating layer mask 30, and an isolation column mask 40. The MAM mask 20 has a first positioning identification area 1, the ITO mask 10 has a second positioning identification area 2, the insulating layer mask 30 has a third positioning identification area 3, and the isolation column mask 40 has a fourth positioning identification area 4. Corresponding OLED graphics are also provided on each mask. Different from Example 1, the first positioning identification area 1 is provided on the MAM mask 20, and the second positioning identification area 2 is provided on the ITO mask 10.

[0034] The positioning identification areas on each mask overlap in space when put into use. For example, when performing MAM etching, the MAM mask 20 is covered on the surface of the metal wire layer film and then MAM photolithography is performed. After the MAM etching is completed, the MAM mask 20 is removed and then ITO etching is performed. When performing ITO etching, the ITO mask 10 is covered on the surface of the metal wire layer film after the MAM etching is completed and then ITO photolithography is performed. When covering with the ITO mask 10, the second positioning identification area 2 corresponds to the position where the first positioning identification area 1 is located. After the ITO etching is completed, the ITO mask 10 is removed and then the insulating layer mask 30 and the isolation column mask 40 are sequentially covered to perform subsequent insulating layer production and isolation column production.

[0035] In this embodiment, if Figure 4As shown, the first positioning identification area 1 includes four identification points, the second positioning identification area 2 includes four identification points, similarly, the third positioning identification area 3 includes four identification points, and the fourth positioning identification area 4 includes four identification points. When each mask is put into use, the identification points in each positioning identification area overlap in space; The four identification points of the first positioning identification area 1 include a first hollow alignment frame 11 and a first special-shaped alignment mark 12, and the remaining identification points are solid alignment frames 5; The four identification points of the second positioning identification area 2 include a second hollow alignment frame 21 and a plurality of second special-shaped alignment marks 22, wherein the second hollow alignment frame 21 is arranged corresponding to the position of the first special-shaped alignment mark 12; The four identification points of the third positioning identification area 3 include a third hollow alignment frame 31 and a plurality of solid positioning frames, and the third hollow alignment frame 31 is arranged corresponding to the position of a solid positioning frame in the first positioning identification area 1; The four identification points of the fourth positioning identification area 4 include a fourth hollow alignment frame 41 and a plurality of solid positioning frames. The fourth hollow alignment frame 41 is arranged corresponding to the position of a solid positioning frame in the first positioning identification area 1 .

[0036] It can be understood that when the post-MAM etching process is adopted: ITO etching is performed first, and when ITO etching is performed, the multiple second special-shaped alignment marks 22 in the second positioning and identification area 2 of the ITO mask 10 form multiple second special-shaped identification marks on the surface of the base plate, and the second hollow alignment frame 21 forms a square frame-shaped identification mark. When the MAM mask 20 is subsequently covered on the base plate, in order to achieve positioning, the hollow alignment frame in the first positioning and identification area 1 is aligned with the second special-shaped identification mark located in the first position, and the first special-shaped alignment mark 12 is aligned with the square frame-shaped identification mark. Then, after the MAM etching is completed, only the two middle second special-shaped identification marks remain, and the two second special-shaped identification marks are used for positioning the insulating layer mask 30 and the isolation column mask 40 during the subsequent insulating layer production and isolation column production.

[0037] When the MAM etching process is adopted first: MAM etching is performed first, and when MAM etching is performed, the first special-shaped alignment mark 12 in the first positioning identification area 1 of the MAM mask 20 forms a first special-shaped identification mark on the surface of the base plate, and when the ITO mask 10 is subsequently covered on the base plate, in order to achieve positioning, the hollow alignment frame in the second positioning identification area 2 is aligned with the first special-shaped identification mark, and then ITO etching is performed, and the second special-shaped alignment mark 22 in the second positioning identification area 2 of the ITO mask 10 forms two second special-shaped identification marks located in the middle on the surface of the base plate, and the two second special-shaped identification marks are used for positioning the insulating layer mask 30 and the isolation column mask 40 when the insulating layer and isolation column are subsequently made.

[0038] Embodiment 5: This embodiment describes an OLED etching and marking method, wherein the OLED etching includes ITO etching and MAM etching, and the corresponding OLED patterns are formed by the ITO mask and the MAM mask respectively during the ITO etching and the MAM etching, wherein, during the OLED etching, firstly, one or more special-shaped identification marks are formed on the substrate by the special-shaped alignment marks on the positioning and identification area of ​​the ITO mask or the MAM mask, and then the front and rear masks are aligned with the special-shaped identification marks by the solid alignment frame on the positioning and identification area of ​​the MAM mask or the ITO mask.

[0039] In one embodiment, the shape of the special-shaped identification mark can be selected as a cross, a triangle or other polygons.

[0040] In summary, the OLED mask marking structure of the present application is specially designed at the identification points on each mask, so that even if the MAM etching sequence is adjusted, the mask positioning during the front and back etching can still be effectively performed, thereby achieving the same set of masks being adaptable to both the MAM etching process and the MAM etching process, thereby saving the investment in a set of mask costs. At the same time, there is no need to adjust the etching equipment when switching the processing technology, thereby simplifying the processing technology and improving the processing efficiency.

[0041] The above embodiments are only for illustrating the technical concept and features of the present invention, and their purpose is to enable people familiar with this technology to understand the contents of the present invention and implement them accordingly. They cannot be used to limit the protection scope of the present invention. Any equivalent changes or modifications made according to the spirit of the present invention should be included in the protection scope of the present invention.

Claims

1. An OLED mask marking structure, wherein the OLED mask comprises an ITO mask and a MAM mask, characterized in that: The ITO mask has a first positioning identification area, and the MAM mask has a second positioning identification area, wherein: The first positioning identification area includes at least four identification points, the second positioning identification area includes at least four identification points, and the identification points of the first positioning identification area and the second positioning identification area overlap in space; The at least four identification points in the first positioning identification area include a first hollow alignment frame and a first special-shaped alignment mark, and the remaining identification points are solid alignment frames; The at least four identification points of the second positioning identification area include a second hollow alignment frame and a plurality of second special-shaped alignment marks, and the second hollow alignment frame is arranged corresponding to the position of the first special-shaped alignment mark.

2. The OLED mask marking structure according to claim 1, characterized in that: The OLED mask includes an insulating layer mask, and a third positioning identification area is provided on the insulating layer mask. The third positioning identification area includes at least four identification points. The at least four identification points of the third positioning identification area include a third hollow alignment frame and multiple solid positioning frames. The third hollow alignment frame is set to a position corresponding to a solid positioning frame in the first positioning identification area.

3. The OLED mask marking structure according to claim 1, characterized in that: The OLED mask includes an isolation column mask, and the isolation column mask has a fourth positioning identification area, the fourth positioning identification area includes at least four identification points, and the at least four identification points of the fourth positioning identification area include a fourth hollow alignment frame and multiple solid positioning frames, and the fourth hollow alignment frame is set to correspond to the position of a solid positioning frame in the first positioning identification area.

4. The OLED mask marking structure according to claim 1, characterized in that: Two first spare identification points in the first positioning identification area, wherein the first spare identification points are solid alignment frames; Two second spare identification points in the second positioning identification area, wherein the second spare identification points are special-shaped alignment marks; The OLED mask includes an insulating layer mask and an isolation column mask. The insulating layer mask has a third positioning identification area, and the isolation column mask has a fourth positioning identification area. The third positioning identification area has a hollow alignment frame corresponding to a spare identification point, and the fourth positioning identification area has a hollow alignment frame corresponding to another spare identification point.

5. An OLED mask marking structure, wherein the OLED mask comprises an ITO mask and a MAM mask, characterized in that: The MAM mask has a first positioning identification area, and the ITO mask has a second positioning identification area, wherein: The first positioning identification area includes at least four identification points, the second positioning identification area includes at least four identification points, and the identification points of the first positioning identification area and the second positioning identification area overlap in space; The at least four identification points in the first positioning identification area include a first hollow alignment frame and a first special-shaped alignment mark, and the remaining identification points are solid alignment frames; The at least four identification points of the second positioning identification area include a second hollow alignment frame and a plurality of second special-shaped alignment marks, and the second hollow alignment frame is arranged corresponding to the position of the first special-shaped alignment mark.

6. The OLED mask marking structure according to claim 1, characterized in that: The OLED mask includes an insulating layer mask, and a third positioning identification area is provided on the insulating layer mask. The third positioning identification area includes at least four identification points. The at least four identification points of the third positioning identification area include a third hollow alignment frame and multiple solid positioning frames. The third hollow alignment frame is set to a position corresponding to a solid positioning frame in the first positioning identification area.

7. The OLED mask marking structure according to claim 1, characterized in that: The OLED mask includes an isolation column mask, and the isolation column mask has a fourth positioning identification area, the fourth positioning identification area includes at least four identification points, and the at least four identification points of the fourth positioning identification area include a fourth hollow alignment frame and multiple solid positioning frames, and the fourth hollow alignment frame is set to correspond to the position of a solid positioning frame in the first positioning identification area.

8. The OLED mask marking structure according to claim 1, characterized in that: Two first spare identification points in the first positioning identification area, wherein the first spare identification points are solid alignment frames; Two second spare identification points in the second positioning identification area, wherein the second spare identification points are special-shaped alignment marks; The OLED mask includes an insulating layer mask and an isolation column mask. The insulating layer mask has a third positioning identification area, and the isolation column mask has a fourth positioning identification area. The third positioning identification area has a hollow alignment frame corresponding to a spare identification point, and the fourth positioning identification area has a hollow alignment frame corresponding to another spare identification point.

9. An OLED etching marking method, wherein the OLED etching includes ITO etching and MAM etching, and when performing ITO etching and MAM etching, a corresponding OLED pattern is formed by an ITO mask and a MAM mask respectively, characterized in that: When performing OLED etching, first, one or more special-shaped identification marks are formed on the substrate through the special-shaped alignment marks on the positioning and identification area of ​​the ITO mask or the MAM mask, and then the solid alignment frame on the positioning and identification area of ​​the MAM mask or the ITO mask is used to align the special-shaped identification marks to complete the alignment of the front and rear masks.

10. The OLED etching marking method according to claim 9, characterized in that: The shape of the special-shaped identification mark is a cross, a triangle or other polygons.

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