Optical interconnect, chip package, computing system, and artificial intelligence device
By designing optical interconnects in the computing system, using the optical distribution tree and the optical propagation link to achieve efficient transmission of optical signals, the problem of limited optical signal applications in the prior art is solved, and independent optical signal transmission and information transmission between chips are realized.
Patent Information
- Application Number
- CN202311424121.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2023-10-30
- Publication Date
- 2025-05-02
AI Technical Summary
In the prior art, the application of optical signals in computing systems is subject to many limitations, and it is difficult to effectively realize efficient interconnection and information transmission of optical signals between chips.
An optical interconnection is proposed, including a first optical distribution tree and a plurality of optical propagation links, and an optical signal is distributed to a plurality of optical output ports through the optical distribution tree, and an optical information transmission channel is formed between the chips through the optical propagation link.
It realizes independent optical signal transmission between chips, simplifies interface layout, reduces the waveguide requirement for core-core optical waveguide connections, and is suitable for information transmission in artificial intelligence devices and computing systems.
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Figure CN119921866A_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the field of chips, and in particular to an optical interconnect, a chip package, a computing system, and an artificial intelligence device. Background Art
[0002] Computations performed on electronic data encoded in analog or digital form by electrical signals are typically implemented using electronic computing hardware, such as on an integrated circuit (e.g., a processor, an application specific integrated circuit (ASIC), or a system on a chip (SoC)), an electronic circuit board, or other electronic circuits. The use of optical signals in computing systems is subject to many limitations. Summary of the invention
[0003] According to one aspect of the present invention, an optical interconnect is provided, comprising a first optical distribution tree, the first optical distribution tree comprising an optical input port and a plurality of optical output ports, the first optical distribution tree being configured to distribute light from the optical input port to the plurality of optical output ports, the plurality of optical output ports comprising a first optical output port and a second optical output port;
[0004] a plurality of optical transmission links, each of the plurality of optical transmission links comprising an optical transmitter, a second optical distribution tree, and a plurality of optical receivers, wherein the second optical distribution tree is configured to form an optical information transmission channel between the optical transmitter and the plurality of optical receivers;
[0005] The multiple optical propagation links include a first optical propagation link and a second optical propagation link, the first optical propagation link is coupled to the first optical output port, the second optical propagation link is coupled to the second optical output port, the optical transmitter of the first optical propagation link is configured to receive light from the first optical output port, and the optical transmitter of the second optical propagation link is configured to receive light from the second optical output port.
[0006] In some embodiments, the optical transmitter of the first optical transmission link is configured to modulate the light received from the first optical output port and send the modulated optical signal to the corresponding second optical distribution tree;
[0007] The optical transmitter of the second optical transmission link is configured to modulate the light received from the second optical output port and send the modulated optical signal to the corresponding second optical distribution tree.
[0008] In some embodiments, for each of the optical transmission links, the optical transmitter is configured to receive a first electrical signal and generate an optical signal for transmission based on the first electrical signal, wherein the first electrical signal carries information to be transmitted, and wherein each of the optical receivers is configured to generate a second electrical signal based on the received optical signal.
[0009] In some embodiments, in the optical transmission direction of the optical propagation link, the second optical distribution tree includes a first bend, a second bend, and a third bend, and also includes a first optical splitter located between the first bend and the second bend, and a second optical splitter after the third bend.
[0010] In some embodiments, the optical receiver includes a photodiode to generate the second electrical signal according to the received optical signal.
[0011] In some embodiments, the first optical distribution tree includes a plurality of optical splitters.
[0012] In some embodiments, the optical splitter includes at least one of a Y-shaped beam splitter, a multimode interferometer, and a directional coupler.
[0013] In some embodiments, the second optical distribution tree includes a plurality of optical splitters.
[0014] In some embodiments, the optical splitter includes at least one of a Y-shaped beam splitter, a multimode interferometer, and a directional coupler.
[0015] In some embodiments, the optical interconnect is a photonic integrated circuit chip.
[0016] According to one aspect of the present invention, a chip package is proposed, comprising the optical interconnect, and a first chip, comprising a plurality of clusters, each of the clusters comprising a plurality of cores; wherein, for each of the cores of the plurality of clusters, the optical interconnect is configured to provide an information transmission channel between the core and each of the plurality of clusters.
[0017] In some embodiments, each of the clusters includes an electrical signal receiving port; the multiple optical transmission links of the optical interconnects correspond to the multiple cores of the multiple clusters, respectively, so that each core in the multiple clusters is coupled to one of the optical transmission links; each of the optical transmission links is configured to be coupled to one of the multiple cores in the multiple clusters and to each of the multiple clusters to provide an information transmission channel between the core and the electrical signal receiving port of each of the multiple clusters; for each of the optical transmission links, the optical transmitter is configured to receive a first electrical signal and generate an optical signal for transmission based on the first electrical signal, wherein the first electrical signal carries information to be transmitted from one of the cores, and each of the multiple optical receivers is coupled to one of the multiple clusters, wherein each of the optical receivers is configured to generate a second electrical signal based on the received optical signal to provide information transmitted to the corresponding cluster.
[0018] In some embodiments, the optical interconnect carries the first chip.
[0019] According to one aspect of the present invention, a chip package is provided, comprising an optical interconnect and a chip; wherein the optical interconnect carries the chip.
[0020] According to one aspect of the present invention, an artificial intelligence device is provided, including a chip package.
[0021] According to one aspect of the present invention, a computing system is provided, including a chip package.
[0022] According to one aspect of the present invention, an information transmission method is provided, wherein the method uses an optical interconnection to perform information transmission, wherein the optical interconnection comprises: a first optical distribution tree, the first optical distribution tree comprises an optical input port and a plurality of optical output ports, the first optical distribution tree is configured to distribute light from the optical input port to the plurality of optical output ports, the plurality of optical output ports comprises a first optical output port and a second optical output port; a plurality of optical transmission links, each of the plurality of optical transmission links comprises an optical transmitter, a second optical distribution tree, and a plurality of optical receivers, the second optical distribution tree is configured to form an optical information transmission channel between the optical transmitter and the plurality of optical receivers; the plurality of optical transmission links comprises a first optical transmission link and a second optical transmission link, the first optical transmission link is coupled to the first optical output port, the second optical transmission link is coupled to the second optical output port, the optical transmitter of the first optical transmission link is configured to receive light from the first optical output port, and the optical transmitter of the second optical transmission link is configured to receive light from the second optical output port;
[0023] The information transmission method comprises:
[0024] providing light to the optical input port of the first optical distribution tree so that the first optical distribution tree distributes the light from the optical input port to the plurality of optical output ports, the plurality of optical output ports including a first optical output port and a second optical output port;
[0025] The optical transmitter of the first optical transmission link receives a first electrical signal, the first electrical signal carrying information to be transmitted;
[0026] The optical transmitter of the first optical transmission link receives light from the first optical transmission port, and modulates the light from the first optical transmission port according to the first electrical signal to generate an optical signal for transmission;
[0027] The second optical distribution tree of the first optical transmission link distributes the modulated optical signal to the corresponding plurality of optical receivers.
[0028] In some embodiments, each of the optical receivers of the first optical transmission link generates a second electrical signal based on a received optical signal.
[0029] In some embodiments, the information to be transmitted carried by the first electrical signal comes from the first core of the first cluster among multiple clusters of a first chip; the multiple optical receivers correspond to the multiple clusters respectively; each of the optical receivers generates a second electrical signal based on the received optical signal to provide information transmitted to the corresponding cluster.
[0030] The embodiments of the present invention can realize that the cores in the cluster can independently send information in the form of light through optical interconnects, and then propagate the information to multiple clusters in the form of light. It is suitable for simply controlling the core to send information to the cluster, or transmit information, and also has the advantages of simplifying the interface layout. In addition, the cluster can further transmit information to the core inside the cluster. In some embodiments, in the information transmission channel from the core to the cluster, an optical interconnect can be used to provide an optical information transmission channel. After receiving the information from the optical interconnect, the cluster transmits it to multiple cores in the cluster through electrical signals to transmit the information from one core to a core in the cluster via the cluster. In addition, light can be distributed to some optical propagation links through the first optical distribution tree to optimize the input of light. Advantages also include delivering light to different suitable locations through the layout of the second optical distribution tree to adapt to, for example, the location distribution of different clusters.
[0031] Various aspects, features, advantages, etc. of the embodiments of the present invention will be described in detail below in conjunction with the accompanying drawings. According to the following detailed description in conjunction with the accompanying drawings, the above aspects, features, advantages, etc. of the present invention will become more clear. BRIEF DESCRIPTION OF THE DRAWINGS
[0032] Figure 1 FIG. 4 is a side view of a chip package according to an embodiment of the present invention.
[0033] Figure 2 FIG. 4 is a schematic diagram of a first chip in an embodiment of the present invention.
[0034] Figure 3 FIG. 1 is a schematic diagram of a cluster in an embodiment of the present invention.
[0035] Figure 4 FIG. 4 is a schematic diagram of an optical transmission link in an embodiment of the present invention.
[0036] Figure 5 A schematic diagram showing the connection relationship of components in the first optical distribution tree is shown.
[0037] Figure 6 The schematic diagram shows the approximate location and connection relationship of the components in the optical propagation link. DETAILED DESCRIPTION
[0038] In order to facilitate understanding of various aspects, features and advantages of the technical solution of the present invention, the present invention is described in detail below in conjunction with the accompanying drawings. It should be understood that the various embodiments described below are only for illustration and are not intended to limit the scope of protection of the present invention.
[0039] The above description is only an overview of the technical solution of the present invention. In order to more clearly understand the technical means of the present invention, it can be implemented in accordance with the contents of the specification. In order to make the above and other purposes, features and advantages of the present invention more obvious and easy to understand, the following specifically cites a preferred embodiment and describes it in detail with the accompanying drawings as follows.
[0040] Unless otherwise defined, the technical terms or scientific terms used in this disclosure should be understood by people with ordinary skills in the field to which this disclosure belongs. The words "first", "second" and similar words used in this disclosure do not indicate any order, quantity or importance, but are only used to distinguish different components.
[0041] When the number of a component or element is not specifically indicated in the following of the embodiments of the present disclosure, it means that the component or element can be one or more, or can be understood as at least one. "At least one" means one or more, and "more" means at least two.
[0042] In order to make the purpose, features and advantages of the present invention more obvious and easy to understand, the present invention is further described in detail below with reference to the accompanying drawings and specific embodiments.
[0043] Figure 1 , a chip package 1000 is shown, including a first chip 100 and an optical interconnect 300. Optionally, the chip package 1000 also includes a substrate 500. The first chip 100 is mounted on the optical interconnect 300, and the optical interconnect 300 can be used to carry the first chip 100. The substrate 500 is used to carry the optical interconnect 300 and the first chip 100. The first chip 100 can be electrically connected to the optical interconnect 300 through the bonding layer 1041 and the bonding layer 1042. Exemplarily, the optical interconnect 300 communicates with the first chip 100 through the bonding layers 1041 and 1042, for example, receiving an electrical signal from the first chip 100 through the bonding layer 1041, and sending an electrical signal to the first chip 100 through the bonding layer 1042. Exemplarily, the first chip 100 can be, for example, a bare chip.
[0044] By way of example, the chip package 1000 includes one or more chips, and the optical interconnect 300 may support at least one chip, for example, the first chip 100 .
[0045] exist Figure 2, it is shown that the first chip 100 includes 8 clusters, namely clusters 112a, 112b, 112c, 112d, 112e, 112f, 112g, and 112h.
[0046] Figure 3 FIG. 1 shows one of the clusters 112 a, which includes a plurality of cores. Figure 3 It is shown that cluster 112a includes 8 cores. For the first chip 100, it may include multiple clusters, each cluster includes multiple cores, wherein for each of the cores of the multiple clusters, the optical interconnect is configured to provide an information transmission channel between the core and each of the multiple clusters. Exemplarily, each of the clusters includes an electrical signal receiving port, and the optical interconnect is configured to provide an information transmission channel between the core and the electrical signal receiving port of each of the multiple clusters.
[0047] In this example, the first chip 100 includes 8 clusters, each cluster includes 8 cores, that is, the first chip 100 has a total of 64 cores, and the cores can be, for example, computing cores (or processing cores) to perform computing functions. Exemplarily, for the core A01 in the cluster 112a, the optical interconnect 130 is configured to provide an information transmission channel between the core A01 and each of the multiple clusters, and the core A01 can transmit information to each of the 8 clusters (i.e., clusters 112a to 112h), and can further transmit information to each core within the cluster through the cluster.
[0048] Figure 4 An optical transmission link 330 is shown, which schematically illustrates the connection relationship of each device. In some embodiments, the optical interconnect 300 includes a plurality of optical transmission links 330, respectively corresponding to the plurality of cores of the plurality of clusters, so that each core in the plurality of clusters is coupled to one of the optical transmission links 330; each of the optical transmission links is configured to be coupled to one of the plurality of cores in the plurality of clusters and to each of the plurality of clusters, so as to provide an information transmission channel between the core and each of the plurality of clusters (e.g., between the core and the electrical signal receiving port of each cluster). Exemplarily, the optical interconnect 130 includes 64 optical transmission links corresponding to the 64 cores of the first chip 100, each core is coupled to one of the 64 optical transmission links, and the optical transmission link is also coupled to each of the eight clusters, so as to provide an information transmission channel between the core and each of the eight clusters. Thus, each core can independently send information in the form of light through the optical interconnect (the corresponding optical transmitter), and then transmit the information to the cluster in the form of light.
[0049] The embodiment of the present invention establishes an optical propagation channel or information propagation mode that matches the core to the cluster. In addition, it can also reduce unnecessary input ends and output ends, and reduce the waveguide number requirement for the core-core optical waveguide connection.
[0050] In some embodiments, each of the optical transmission links 330 includes an optical transmitter 331, an optical distribution tree 332, and a plurality of optical receivers, for example Figure 3 The optical receivers 333a, 333b, 333c, 333d, 333e, 333f, 333g and 333h in the optical distribution tree 332 are configured to form an optical information transmission channel between the optical transmitter and the multiple optical receivers (333a~333h); and, for each of the optical transmission links 330, the optical transmitter is configured to receive a first electrical signal and generate an optical signal for transmission based on the first electrical signal, wherein the first electrical signal carries the information to be transmitted from one of the cores; each of the multiple optical receivers is coupled to one of the multiple clusters, wherein each of the optical receivers is configured to generate a second electrical signal based on the received optical signal to provide information transmitted to the corresponding cluster. Exemplarily, taking the optical transmission link 330 corresponding to the core A01 as an example, it includes an optical transmitter 331, an optical distribution tree 332 and 8 optical receivers (333a~333h), and the optical distribution tree 332 is configured to form an optical information transmission channel between the optical transmitter 331 and the 8 optical receivers (333a~333h). The 8 optical receivers output the information carried by the second electrical signal. The second electrical signal of the optical receiver can be directly output to the corresponding cluster to transmit information, and can also be converted into an electrical signal (for example, converted into a third electrical signal) and then output to the corresponding cluster to transmit information.
[0051] In some embodiments, the optical transmitter generates an optical signal carrying the information by modulation according to the first electrical signal. For example, the optical transmitter 331 includes a modulator, which can modulate an initial optical signal that does not carry information according to the first electrical signal, and the initial optical signal can come from the waveguide 351. The modulated light, i.e., the optical signal carrying information, is output to the optical distribution tree 332 through the waveguide 352. Exemplarily, the light from the light source (not shown) can be coupled to the waveguide 351 through a grating coupler.
[0052] Exemplarily, the optical distribution tree 332 may include an optical splitter. Figure 4Seven optical splitters are shown, namely, optical splitters 341 to 347. The optical splitter may include at least one of a Y-shaped beam splitter, a multi-mode interferometer (MMI) and a directional coupler. The optical splitter can distribute the input light. For example, the optical splitter 341 distributes the input light according to 50%:50% and then outputs it. The coupling (connection) between the optical splitters in the figure adopts a waveguide connection. For example, the optical splitter 341 is connected to the optical splitter 342 and the optical splitter 343 through the waveguide 353 and the waveguide 354, respectively. The optical splitters 344, 345, 346, and 347 are respectively connected to the optical receivers corresponding to the optical receivers through waveguides. For example, the optical splitter 344 is connected to the optical receivers 333a and 333b through the waveguide 355 and the waveguide 356, respectively. Exemplarily, the optical splitters 341 to 347 all distribute the input light according to 50%:50%, so that 1 / 8 (i.e., 12.5% optical power) of the light input to the optical distribution tree 332 via the waveguide 352 is output to each optical receiver, for example, the optical receiver 333a receives 1 / 8=12.5% of the input light of the optical distribution tree 332 via the waveguide 353. For the first chip 100, it includes 8 clusters, each cluster includes 8 cores, that is, the first chip 100 has a total of 64 cores, and the optical interconnect 130 includes 64 optical transmission links 330 corresponding to the 64 cores of the first chip 100, each core is coupled to an optical transmission link 330 of the 64 optical transmission links, and the optical transmission link 330 is also coupled to each of the 8 clusters to provide an information transmission channel between the core and each of the 8 clusters. Each cluster may include an electrical signal receiving port to receive an electrical signal output from an optical receiver. For example, for the optical transmission link 330 corresponding to core A1, cluster 112a corresponds to optical receiver 333a to receive information from core A1, and cluster 112b corresponds to optical receiver 333b to receive information from core A1. In order to enable each core to send information, each core may include an electrical signal sending port, that is, 64 cores correspond to 64 electrical signal sending ports respectively; in order to enable each cluster to be configured to receive information from 64 cores, each cluster may include 64 electrical signal receiving ports (corresponding to 64 cores), and 8 clusters are provided with 64×8=512 electrical signal receiving ports in total. Exemplarily, since there is no need to design an optical interconnection for direct interconnection between cores (which requires 64×64 ports), the number of interfaces between the optical interconnection and the first chip can be reduced, especially in reducing the design requirements for the transmitting end interface, while ensuring the transmission requirements from the core to the cluster, and taking into account the requirements of the cluster sending to the core within the cluster.
[0053] In some embodiments, each of the plurality of clusters is configured to: propagate the information received from the optical interconnect to the plurality of cores of the cluster via electrical signals. Thus, in the information transmission channel from the core to the cluster, the optical interconnect can be used to provide an optical information transmission channel. After receiving the information from the optical interconnect, the cluster transmits the information to the plurality of cores in the cluster via electrical signals, so as to transmit the information from one core to one core in the cluster. Each core can independently send information in the form of light via the optical interconnect (corresponding optical transmitter). In this process, the process of optical information signal propagation and electrical signal propagation within the cluster is successively experienced.
[0054] In some embodiments, each of the plurality of clusters is configured to: receive a second electrical signal from an optical interconnect, and propagate the information carried by the second electrical signal to the plurality of cores of the cluster through the electrical signal. For example, taking cluster 112a among the plurality of clusters as an example, cluster 112a receives a second electrical signal from an optical interconnect, and within cluster 111a, the information carried by the second electrical signal is propagated to a plurality of cores, namely cores A01 to A08 (a total of 8 cores), through the electrical signal. Similarly, clusters 112b to 112h also each receive a corresponding second electrical signal carrying information, and then transmit the information to the plurality of cores within the cluster in the form of an electrical signal within each cluster.
[0055] In some embodiments, in order to enable the cluster to receive and read a suitable electrical signal, the second electrical signal may be converted into a third electrical signal, and the third electrical signal is output to the corresponding cluster. The above conversion may be implemented by an output electrical signal conversion circuit, and the third electrical signal may be suitable for cluster reception. Exemplarily, the electrical signal conversion circuit may be provided in a signal conversion chip. Exemplarily, the chip package 1000 may include a signal conversion chip, and the signal conversion chip includes the output electrical signal conversion circuit.
[0056] In some implementations, the optical transmitter generates an optical signal carrying the information by modulation according to the first electrical signal.
[0057] In some embodiments, the multiple cores of the multiple clusters are configured to work collaboratively to solve execution problems of artificial intelligence workloads.
[0058] In some implementations, the plurality of cores of the plurality of clusters are configured to work collaboratively to process a tensor, and each of the cores is configured to work on a different portion of a given tensor.
[0059] In some embodiments, the plurality of clusters include a first cluster, the first cluster includes a first core and a second core, and the chip package is configured to: execute a first part of a computing task at the first core to generate a first result; and execute a second part of a computing task at the second core to generate a second result. For example, core A01 (referred to as the first core) in cluster 112a executes the first part of the computing task, and core A02 (referred to as the second core) executes the second part of the computing task at the second core.
[0060] In some embodiments, alternatively, Figure 2 Some of the eight clusters are located in the first chip, and the others are located in the second chip, and the optical interconnect is used for information transmission between the multiple cores and the clusters. Exemplarily, the multiple clusters are not distributed in the first chip, but are distributed in multiple chips respectively, and the optical interconnect is used to carry the multiple chips for information transmission between the multiple cores and the clusters.
[0061] In an exemplary embodiment, a chip package includes: a plurality of chips, a plurality of clusters distributed on the plurality of chips, each chip including at least one cluster of the plurality of clusters, each of the clusters including a plurality of cores; an optical interconnect; wherein, for each of the cores of the plurality of clusters, the optical interconnect is configured to provide an information transmission channel between the core and each of the plurality of clusters. Exemplarily, the optical interconnect carries the plurality of chips. Exemplarily, a substrate carries the plurality of chips and the optical interconnect.
[0062]
Optical interconnects
[0063] The optical interconnect 300 may include a photonic integrated circuit, which may include an optical transmission link 330 . The optical interconnect 300 may be a photonic integrated circuit chip, for example, manufactured using a semiconductor process.
[0064] The optical interconnect 300 or the optical transmission link 330 may include at least one photonic device in an optical coupling structure, a waveguide, an optoelectronic conversion unit, an electro-optical conversion unit, an optical splitter, and a light source. The number of various photonic devices may be configured as needed, which may be one or more. Among them, the optical transmitter of the optical transmission link 330 may include an electro-optical conversion unit, and the optical receiver may include an optoelectronic conversion unit. Exemplarily, the electro-optical conversion unit may include a modulator to convert an electrical signal into an optical signal. Exemplarily, the optical coupling structure may be used to perform optical coupling with a laser or an optical fiber, so as to input an optical signal into the optical interconnect 300, or output an optical signal from the optical interconnect 300, for example, using an optical fiber to input and output an optical signal; the optical coupling structure may include a grating coupler, an end face coupler, etc. Exemplarily, a waveguide may be used to propagate an optical signal and serve as a channel for information propagation. Exemplarily, the optoelectronic conversion unit may include an optical detector for converting an optical signal into an electrical signal, and the optical detector may include, for example, a photodiode. Exemplarily, the optical interconnect 300 includes a light source, and the light generated by the light source may be coupled to the waveguide and may also be modulated by an electrical signal.
[0065] In an exemplary embodiment, an artificial intelligence device is provided, comprising the chip package.
[0066] In an exemplary embodiment, a computing system is provided, including the chip package.
[0067] In an exemplary embodiment, a method for transmitting information is provided, comprising:
[0068] The optical interconnect receives a first electrical signal carrying information to be transmitted from a first core of a first cluster of the plurality of clusters;
[0069] The optical interconnect propagates the information through an optical transmission link, wherein the optical transmission link includes an optical transmitter, an optical distribution tree, and a plurality of optical receivers;
[0070] The transmitting of the information through the optical transmission link comprises: the optical transmitter receives a first electrical signal and generates an optical signal for transmission according to the first electrical signal, the optical distribution tree distributes light from the optical transmitter to a plurality of optical receivers, each of the plurality of optical receivers is coupled to one of the plurality of clusters, wherein each of the optical receivers generates a second electrical signal according to the received optical signal to provide information transmitted to the corresponding cluster.
[0071] The information transmission method can be implemented according to the chip packaging in the embodiment of the present invention, and can include corresponding functional methods (steps) that can be implemented by the chip packaging.
[0072] Figure 5A first optical distribution tree 310 is shown, and the first optical distribution tree 310 can be used to input light to at least two optical transmission links of the plurality of optical transmission links to provide the optical transmission links with initial optical signals, which can be used to be modulated to generate optical signals carrying information. To indicate the difference, the optical distribution tree in the optical transmission link is named "second optical distribution tree".
[0073] exist Figure 5 , the first optical distribution tree 310 includes an optical input port 301, and the first optical distribution tree 310 distributes light from the optical input port 301 to a plurality of optical output ports 305a, 305b, 305c, 305d, 305e, 305f, 305g and 305h (305a-h).
[0074] The first optical distribution tree 310 may include an optical splitter. Figure 5 Seven optical splitters are shown, namely, optical splitters 311 to 317. The optical splitter may include at least one of a Y-shaped beam splitter, an MMI, and a directional coupler. The optical splitter may distribute the input light. For example, the optical splitter 341 distributes the input light according to 50%:50% and then outputs it. The coupling (connection) between the optical splitters in the figure adopts a waveguide connection. For example, the optical splitter 311 is connected to the optical splitter 312 and the optical splitter 313 through the waveguide 323 and the waveguide 324 respectively. The optical splitters 314, 315, 316, and 317 each have two optical output ports.
[0075] Exemplarily, the optical splitters 311 to 317 distribute the input light in a 50%:50% ratio, so that 1 / 8 (i.e., 12.5% optical power) of the light input into the first optical distribution tree 310 via the optical input port 301 is output to each optical output port (i.e., ports 305a to 305h). Taking the optical output port 305a as an example, it receives 1 / 8=12.5% of the input light of the first optical distribution tree 310.
[0076] Among them, multiple optical output ports of the first optical distribution tree 310 can be connected to multiple optical transmission links respectively, and the optical output ports of the first optical distribution tree 310 are optically coupled to the optical transmitters of the corresponding optical transmission links to provide the optical transmitters with initial optical signals, and the optical transmitters modulate the initial optical signals according to the electrical signals to generate optical signals for transmission.
[0077] In some embodiments, the first optical distribution tree may have other numbers of optical output ports, such as 16. Exemplarily, the light from the optical input port may be evenly distributed to the 16 optical output ports. Exemplarily, the number of optical output ports may also be, for example, 12, 20, or 32. The distribution may be performed in proportion as required, and is not limited to even distribution.
[0078] Exemplarily, the multiple optical propagation links include a first optical propagation link and a second optical propagation link, the first optical propagation link is coupled to the first optical output port 305a, the second optical propagation link is coupled to the second optical output port 305b, the optical transmitter of the first optical propagation link is configured to receive light from the first optical output port 305a, and the optical transmitter of the second optical propagation link is configured to receive light from the second optical output port 305b.
[0079] In some embodiments, a first optical distribution tree 310 may include a sufficient number of optical output ports (e.g., not less than the number of optical transmission links), each of the multiple optical transmission links may be coupled to an optical output port in the first optical distribution tree 310, and the first optical distribution tree 310 provides light (input of optical energy) for the multiple optical transmission links. For example, the first optical distribution tree 310 includes 16 optical output ports, and the number of the multiple optical transmission links is 16, which may be coupled one by one to the 16 optical output ports.
[0080] In some embodiments, multiple first optical distribution trees 310 may be used to provide a sufficient number of optical output ports, thereby providing light for multiple optical transmission links. For example, if one first optical distribution tree 310 includes 16 optical output ports, and the number of optical transmission links is 64, then four first optical distribution trees 310 (each of which includes 16 optical output ports) may be used, and each first optical distribution tree 310 is coupled to 16 optical transmission links to provide them with optical input. The light input to the optical transmission link may be further modulated to carry information, for example, modulated by an optical transmitter to generate an optical signal carrying information, and then transmitted in the optical transmission link.
[0081] Figure 6 The figure shows the approximate location distribution and connection relationship of the components in an optical transmission link 330. The optical transmission link 330 includes an optical transmitter 331, an optical distribution tree (which can be recorded as a second optical distribution tree to distinguish it from the first optical distribution tree in name), and multiple optical receivers, such as optical receivers 333a, 333b, 333c, 333d, 333e, 333f, 333g and 333h. The optical distribution tree 332 is configured to form an optical information transmission channel between the optical transmitter and the multiple optical receivers (333a to 333h). The optical distribution tree may include a splitter. Figure 6 Seven optical splitters are shown, namely, optical splitters 341-347; the positions of optical receivers 333a-333h roughly correspond to the positions of multiple clusters (ie, clusters 112a-112h).
[0082] Can also refer to Figure 4 A more intuitive connection relationship between the components in the optical transmission link 330 is shown in Figure 6In the embodiment, the optical transmitter 331 can be connected to the optical splitter 341 through a waveguide, the optical splitter 341 is respectively connected to the optical splitter 342 and the optical splitter 343 through a waveguide, the optical splitter 342 is respectively connected to the optical splitter 344 and the optical splitter 345 through a waveguide, and the optical splitter 343 is respectively connected to the optical splitter 346 and the optical splitter 347 through a waveguide. The optical splitter 344, the optical splitter 345, the optical splitter 346 and the optical splitter 347 are respectively connected to two optical receivers.
[0083] Exemplarily, taking the optical transmission link corresponding to core A01 as an example, it includes 1 optical transmitter, an optical distribution tree and 8 optical receivers. The optical distribution tree is configured to form an optical information transmission channel between the optical transmitter and the 8 optical receivers. The optical receiver generates a second electrical signal based on the received optical signal, and the 8 optical receivers output the information carried by the second electrical signal. The second electrical signal of the optical receiver can be directly output to the corresponding cluster to transmit information, or it can be converted into an electrical signal (for example, converted into a third electrical signal) and then output to the corresponding cluster to transmit information.
[0084] In the optical transmission direction of the optical transmission link (or optical distribution tree), the optical distribution tree 332 (second optical distribution tree) may include a first bend 601, a second bend 602, and a third bend 603 in sequence, and also include a first optical splitter ( Figure 6 The beam splitter 341 in the middle), the second beam splitter after the third bending part ( Figure 6 The optical splitter 343 in the embodiment of the present invention can effectively distribute light to the optical receiver at a specific position by setting the curved portion. In addition, this arrangement can be suitable for transmission to the location of the cluster.
[0085] In an exemplary embodiment, a method for transmitting information is provided, which can transmit information using the optical interconnection component in the embodiment of the present invention. The information transmission method includes:
[0086] providing light to the optical input port of the first optical distribution tree so that the first optical distribution tree distributes the light from the optical input port to the plurality of optical output ports, the plurality of optical output ports including a first optical output port and a second optical output port;
[0087] The optical transmitter of the first optical transmission link receives a first electrical signal, the first electrical signal carrying information to be transmitted;
[0088] The optical transmitter of the first optical transmission link receives light from the first optical transmission port, and modulates the light from the first optical transmission port according to the first electrical signal to generate an optical signal for transmission;
[0089] The second optical distribution tree of the first optical transmission link distributes the modulated optical signal to the corresponding plurality of optical receivers.
[0090] In some embodiments, each of the optical receivers of the first optical transmission link generates a second electrical signal based on a received optical signal.
[0091] In some embodiments, the information to be transmitted carried by the first electrical signal comes from the first core of the first cluster among multiple clusters of a first chip; the multiple optical receivers correspond to the multiple clusters respectively; each of the optical receivers generates a second electrical signal based on the received optical signal to provide information transmitted to the corresponding cluster.
[0092] Those skilled in the art should understand that what is disclosed above is only an implementation mode of the present invention, and it certainly cannot be used to limit the scope of rights for patent protection requested by the present invention. Equivalent changes made according to the implementation mode of the present invention are still within the scope covered by the claims of the present invention.
Claims
1. An optical interconnect, comprising a first optical distribution tree, the first optical distribution tree comprising an optical input port and a plurality of optical output ports, the first optical distribution tree being configured to distribute light from the optical input port to the plurality of optical output ports, the plurality of optical output ports comprising a first optical output port and a second optical output port; a plurality of optical transmission links, each of the plurality of optical transmission links comprising an optical transmitter, a second optical distribution tree, and a plurality of optical receivers, wherein the second optical distribution tree is configured to form an optical information transmission channel between the optical transmitter and the plurality of optical receivers; The multiple optical propagation links include a first optical propagation link and a second optical propagation link, the first optical propagation link is coupled to the first optical output port, the second optical propagation link is coupled to the second optical output port, the optical transmitter of the first optical propagation link is configured to receive light from the first optical output port, and the optical transmitter of the second optical propagation link is configured to receive light from the second optical output port.
2. The optical interconnect as claimed in claim 1, wherein: The optical transmitter of the first optical transmission link is configured to modulate the light received from the first optical output port and send the modulated optical signal to the corresponding second optical distribution tree; The optical transmitter of the second optical transmission link is configured to modulate the light received from the second optical output port and send the modulated optical signal to the corresponding second optical distribution tree.
3. The optical interconnect as claimed in claim 2, wherein for each of the optical transmission links, the optical transmitter is configured to receive a first electrical signal and generate an optical signal for transmission according to the first electrical signal, wherein: The first electrical signal carries information to be transmitted, wherein each of the optical receivers is configured to generate a second electrical signal according to the received optical signal.
4. The optical interconnect as described in claim 3, in the optical transmission direction of the optical propagation link, the second optical distribution tree includes a first bend, a second bend and a third bend, and also includes a first splitter located between the first bend and the second bend, and a second splitter after the third bend.
5. The optical interconnect as claimed in claim 3, wherein: The optical receiver includes a photodiode to generate the second electrical signal according to the received optical signal.
6. The optical interconnection according to any one of claims 1 to 3, wherein: The first optical distribution tree includes a plurality of optical splitters.
7. The optical interconnect of claim 6, wherein: The optical splitter includes at least one of a Y-shaped beam splitter, a multimode interferometer and a directional coupler.
8. The optical interconnect as claimed in any one of claims 1 to 3, wherein: The second optical distribution tree includes a plurality of optical splitters.
9. The optical interconnect of claim 8, wherein: The optical splitter includes at least one of a Y-shaped beam splitter, a multimode interferometer and a directional coupler.
10. The optical interconnect according to any one of claims 1 to 3, wherein: The optical interconnect is a photonic integrated circuit chip.
11. A chip package, comprising the optical interconnection component according to any one of claims 1 to 10, and A first chip includes a plurality of clusters, each of the clusters includes a plurality of cores; in, For each of the cores of the plurality of clusters, the optical interconnect is configured to provide an information transmission channel between the core and each of the plurality of clusters.
12. The chip package according to claim 11, wherein: Each of the clusters includes an electrical signal receiving port; The plurality of optical transmission links of the optical interconnect respectively correspond to the plurality of cores of the plurality of clusters, such that each core in the plurality of clusters is coupled to one of the optical transmission links; Each of the optical transmission links is configured to be coupled to one of the plurality of cores in the plurality of clusters and to each of the plurality of clusters to provide an information transmission channel between the core and the electrical signal receiving port of each of the plurality of clusters; For each of the optical transmission links, the optical transmitter is configured to receive a first electrical signal and generate an optical signal for transmission based on the first electrical signal, wherein the first electrical signal carries information to be transmitted from one of the cores, and each of the plurality of optical receivers is coupled to one of the plurality of clusters, wherein each of the optical receivers is configured to generate a second electrical signal based on the received optical signal to provide information to be transmitted to the corresponding cluster.
13. The chip package according to claim 12, wherein: The optical interconnect carries the first chip.
14. A chip package comprising the optical interconnection component according to claim 1, and chip; in, The optical interconnect carries the chip.
15. An artificial intelligence device, comprising the chip package as claimed in any one of claims 11 to 14.
16. A computing system comprising the chip package according to any one of claims 11 to 14.
17. A method for information transmission, the method using an optical interconnection to perform information transmission, wherein the optical interconnection comprises: a first optical distribution tree, the first optical distribution tree comprising an optical input port and a plurality of optical output ports, the first optical distribution tree being configured to distribute light from the optical input port to the plurality of optical output ports, the plurality of optical output ports comprising a first optical output port and a second optical output port; a plurality of optical transmission links, each of the plurality of optical transmission links comprising an optical transmitter, a second optical distribution tree, and a plurality of optical receivers, wherein the second optical distribution tree is configured to form an optical information transmission channel between the optical transmitter and the plurality of optical receivers; The plurality of optical transmission links include a first optical transmission link and a second optical transmission link, the first optical transmission link is coupled to the first optical output port, the second optical transmission link is coupled to the second optical output port, the optical transmitter of the first optical transmission link is configured to receive light from the first optical output port, and the optical transmitter of the second optical transmission link is configured to receive light from the second optical output port; The information transmission method comprises: providing light to the optical input port of the first optical distribution tree so that the first optical distribution tree distributes the light from the optical input port to the plurality of optical output ports, the plurality of optical output ports including a first optical output port and a second optical output port; The optical transmitter of the first optical transmission link receives a first electrical signal, the first electrical signal carrying information to be transmitted; The optical transmitter of the first optical transmission link receives light from the first optical transmission port, and modulates the light from the first optical transmission port according to the first electrical signal to generate an optical signal for transmission; The second optical distribution tree of the first optical transmission link distributes the modulated optical signal to the corresponding plurality of optical receivers.
18. The information transmission method according to claim 17, wherein: Each of the optical receivers of the first optical transmission link generates a second electrical signal according to a received optical signal.
19. The information transmission method according to claim 17, wherein: The information to be transmitted carried by the first electrical signal comes from a first core of a first cluster among multiple clusters of a first chip; The plurality of optical receivers correspond to the plurality of clusters respectively; Each of the optical receivers generates a second electrical signal according to the received optical signal to provide information to be transmitted to the corresponding cluster.