Processing control method and device for X-shaped hole electroplating filling process
Through multiple electroplating operations for different pore sizes and hole types and the use of electroplating conversion solution, the problem of insufficient filling of X-shaped holes in the prior art is solved, and the binding force and filling effect of blind holes are improved.
Patent Information
- Application Number
- CN202510237410.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-03-03
- Publication Date
- 2025-05-02
AI Technical Summary
The prior art cannot effectively fill the X-shaped hole, resulting in insufficient binding force of the blind hole in the CORE layer, and may even lead to cracking and loss of conduction at the bottom of the blind hole at high temperatures.
Through a processing control method of the X-type hole electroplating and filling process, the product type is identified according to the design drawing of the PCB substrate, and multiple plating operations are performed for different pore sizes and pore types, including primary or secondary plating, and if necessary, electroplating conversion solution is added to adjust the copper ion concentration to achieve the filling of blind holes.
The bonding force of the blind holes in the CORE layer is improved, the cracking phenomenon at the bottom of the blind hole is avoided, the filling effect of micro-through holes is achieved, and the process and cost are saved.
Smart Images
Figure CN119922842A_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to the field of computer technology, and in particular to a processing control method and a processing control device of an X-shaped hole electroplating filling process, a computer device and a storage medium. Background Art
[0002] The blind holes in the CORE layer have a risk of bonding strength. The blind holes are now designed as X-shaped holes. Generally, the X-shaped hole electroplating can only plate copper on the hole wall. The existing CORE layer high-precision circuit boards all use blind hole filling technology to make the layers conductive. However, because the CORE layer has elements such as brown film at the bottom of the blind hole, it is difficult to clean and affects the bonding strength of the blind hole. Even under high temperature, the bottom of the blind hole will crack, causing non-conduction and functional failure. The existing micro X-shaped hole electroplating technology can only plate copper on the hole wall, and cannot fill the micro X-shaped hole, so the secondary outer layer cannot be stacked in this X-shaped hole to reduce the PCB board area. Summary of the invention
[0003] In view of the above problems, the present embodiment is proposed to provide a processing control device, a computer device and a storage medium for an X-type hole electroplating filling process that overcome the above problems or at least partially solve the above problems.
[0004] In order to solve the above problems, this embodiment discloses a processing control method for an X-shaped hole electroplating filling process, comprising: Get the design drawing of PCB substrate; Identify the PCB product type from the design drawing of the PCB substrate; If the PCB product type is a product type with an X-shaped hole of 3 mil aperture, the control device performs an electroplating operation on the 3 mil X-shaped hole to obtain a PCB product after electroplating; If the PCB product type is a blind hole product type with an aperture of 4-5 mil, the control device performs a secondary electroplating operation on the 4-5 mil blind hole to obtain a PCB product after electroplating; If the PCB product type is an X-shaped hole product type with an aperture of 4-5mil, the control device performs bottom surface electroplating, and then controls the device to add electroplating conversion liquid to perform blind hole electroplating to obtain a plated PCB product.
[0005] Preferably, if the PCB product type is a product type with an X-shaped hole of 3 mil aperture, the control device performs an electroplating operation on the 3 mil X-shaped hole to obtain a PCB product after electroplating, including: When the electroplating coefficient is set to 1, the jet value is 0.2 Hz, and the control equipment sprays the hole filling solution to perform hole filling electroplating on the X-shaped hole with a hole diameter of 3 mil, completing an electroplating operation to obtain a PCB product after electroplating.
[0006] Preferably, if the PCB product type is a blind hole product type with an aperture of 4-5 mil, the control device performs a secondary electroplating operation on the 4-5 mil blind hole to obtain a PCB product after electroplating, including: If the blind hole product type with the aperture and hole type of 4-5mil is identified, the control device performs a primary electroplating operation of 0.9mil on the 4-5mil blind hole, and then performs a secondary electroplating operation of 1.1mil to obtain a PCB product after electroplating.
[0007] Preferably, the method further comprises: Obtaining the changes in the previous copper ion concentration, exchange current density, subsequent copper ion concentration, cathode charge transfer coefficient, overpotential, and cathode surface curvature of the electroplating solution; A comprehensive copper electrodeposition model is generated according to the changes in the preceding copper ion concentration, the exchange current density, the subsequent copper ion concentration, the charge transfer coefficient of the cathode, the overpotential, and the cathode surface curvature of the electroplating solution.
[0008] Preferably, if the PCB product type is a product type with an X-shaped hole of 4-5 mil aperture, the control device performs bottom surface electroplating, and then controls the device to add electroplating conversion liquid to perform blind hole electroplating to obtain a plated PCB product, including: Calculating a specific subsequent copper ion concentration according to the comprehensive copper electrodeposition model; The post-copper ion concentration in the electroplating conversion solution is adjusted to a specific post-copper ion concentration, and after the control device performs bottom surface electroplating, the control device is further controlled to add the electroplating conversion solution with the specific post-copper ion concentration to perform blind hole electroplating to obtain a plated PCB product.
[0009] The embodiment of the present invention discloses a processing control device for an X-shaped hole electroplating filling process, comprising: A first acquisition module is used to acquire a design drawing of a PCB substrate; An identification module, used for identifying the type of PCB product from the design drawing of the PCB substrate; The first control module is used for controlling the device to perform an electroplating operation on the 3mil X-shaped hole to obtain a PCB product after electroplating if the PCB product type is a product type of an X-shaped hole with a 3mil aperture; The second control module is used for controlling the device to perform a secondary electroplating operation on the 4-5 mil blind hole to obtain a PCB product after electroplating if the PCB product type is a blind hole with a hole diameter of 4-5 mil; The third control module is used to control the device to add electroplating conversion liquid to perform blind hole electroplating after the bottom surface electroplating if the PCB product type is an X-shaped hole product type with an aperture of 4-5 mil, so as to obtain a PCB product after electroplating.
[0010] Preferably, the first control module includes: The first control submodule is used to set the electroplating coefficient to 1 and the jet value to 0.2 Hz, and control the equipment to jet the hole filling solution to perform hole filling electroplating on the X-shaped hole with a hole diameter of 3 mil, complete an electroplating operation, and obtain a PCB product after electroplating.
[0011] Preferably, the second control module includes: The second control submodule is used to control the device to perform a primary electroplating operation of 0.9 mil and a secondary electroplating operation of 1.1 mil on the 4-5 mil blind hole if the aperture and hole type are identified as a blind hole product type of 4-5 mil aperture, to obtain a PCB product after electroplating.
[0012] The embodiment of the present invention further discloses a computer device, including a memory and a processor, wherein the memory stores a computer program, and the processor implements the processing control steps of the above-mentioned X-shaped hole electroplating filling process when executing the computer program.
[0013] The embodiment of the present invention further discloses a computer-readable storage medium on which a computer program is stored. When the computer program is executed by a processor, the processing control steps of the above-mentioned X-shaped hole electroplating filling process are implemented.
[0014] The embodiments of the present invention include the following advantages: In an embodiment of the present invention, the processing control method of the X-type hole electroplating filling process includes: acquiring a design drawing of a PCB substrate; identifying a PCB product type from the design drawing of the PCB substrate; if the PCB product type is a product type of an X-type hole with a 3mil aperture, the control device performs a first electroplating operation on the 3mil X-type hole to obtain a plated PCB product; if the PCB product type is a product type of a blind hole with a 4-5mil aperture, the control device performs a second electroplating operation on the 4-5mil blind hole to obtain a plated PCB product; if the PCB product type is a product type of an X-type hole with a 4-5mil aperture, the control device performs a second electroplating operation on the 4-5mil blind hole to obtain a plated PCB product; if the PCB product type is a product type of an X-type hole with a 4-5mil aperture, the control device performs bottom surface electroplating, and then controls the device to add electroplating conversion liquid to perform blind hole electroplating to obtain a plated PCB product. In an embodiment of the present invention, the concentration of the plating conversion liquid to be added is calculated through a preset model, the plating conversion liquid is added to the first plating liquid to obtain a second plating liquid, and blind hole plating is performed in the second plating liquid to obtain a plated PCB product. There is no need to change the plating tank, which saves steps and costs, improves the bonding strength of the bottom of the blind hole in the CORE layer blind hole stacking design, avoids the cracking phenomenon at the bottom of the blind hole, and achieves the effect of filling the micro-through hole. BRIEF DESCRIPTION OF THE DRAWINGS
[0015] In order to more clearly illustrate the technical solution in this embodiment, the drawings required for use in the description of the embodiment will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.
[0016] Figure 1 This is a flowchart of the steps of an embodiment of a processing control method of an X-shaped hole electroplating filling process of this embodiment; Figure 2 is a schematic diagram of an X-shaped hole before filling in an embodiment of the present invention; Figure 3 is a schematic diagram of setting parameters in an embodiment of the present invention; Figure 4 is a schematic diagram of an X-shaped hole after filling in an embodiment of the present invention; Figure 5 is a schematic diagram of setting parameters in an embodiment of the present invention; Figure 6 is a schematic diagram of setting parameters in an embodiment of the present invention; Figure 7 It is a structural block diagram of an embodiment of a processing control device for an X-shaped hole electroplating filling process of this embodiment; Figure 8 The diagram is a diagram of the internal structure of a computer device according to an embodiment. DETAILED DESCRIPTION
[0017] In order to make the technical problems, technical solutions and beneficial effects solved by this embodiment more clearly understood, this embodiment is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not used to limit the present invention.
[0018] In a core concept of an embodiment of the present invention, PCB products with various types of holes are identified according to design drawings of different PCB substrates, and graded processing is performed according to different hole diameters and hole types to improve product processing efficiency. Specifically, when the hole diameter and hole type of the PCB product are identified as 3mil micro-through holes, electroplating is performed once according to preset parameters. If the hole diameter and hole type of the PCB product are 4-5mil blind holes, secondary electroplating is required, with the first plating being 0.9mil to reduce the waist of the blind hole so that the hole-filling solution can form an explosion mechanism during the second electroplating. The second time of plating is 1.1mil, and the micro-through hole is filled on the basis of the first electroplating; further, if the aperture and hole type of the PCB product are 4-5mil micro-through holes, the bottom of the 4-5mil micro-through hole is first sealed in the first electroplating solution to convert it into a blind hole, and then the concentration of the electroplating conversion liquid to be added is calculated by the preset model, and the electroplating conversion liquid is added to the first electroplating solution to obtain the second electroplating solution, and the blind hole is electroplated in the second plating solution to obtain the plated PCB product. There is no need to change the plating tank, which saves processes and costs, improves the bonding strength of the bottom of the blind hole in the CORE layer blind hole stacking design, avoids the cracking phenomenon at the bottom of the blind hole, and achieves the effect of filling the micro-through hole.
[0019] The processing control method of the X-shaped hole electroplating filling process provided in this embodiment can be applied to an application environment including a terminal and a server. The terminal communicates with the server through a network. The terminal can be, but is not limited to, various personal computers, laptops, smart phones, tablet computers, and portable wearable devices. The server can be implemented as an independent server or a server cluster composed of multiple servers. The terminal is connected to a variety of semiconductor devices, and the embodiment of the present invention does not impose too many restrictions on this.
[0020] Reference Figure 1 , shows a flowchart of a processing control method embodiment of an X-shaped hole electroplating filling process of this embodiment, which may specifically include the following steps: Step 101, obtaining a design drawing of a PCB substrate; In an embodiment of the present invention, the design drawing may include design data of the PCB substrate, such as the direction of the metal circuit, the length and width of the metal circuit, the line spacing, the aperture, the hole type, the minimum distance from the grinding hole to the line, the size and spacing of the pads, the minimum width and font size of the wire, etc. The embodiment of the present invention does not impose too many restrictions on this. It should be noted that the design drawing can be stored in a terminal or a server, and the embodiment of the present invention does not impose too many restrictions on this.
[0021] The PCB substrate may refer to a PCB substrate that has undergone multiple pre-semiconductor steps. For example, the PCB substrate may have undergone steps such as inner layer production, lamination, browning, laser drilling, etc. The embodiments of the present invention do not impose excessive restrictions on this.
[0022] Step 102, identifying the PCB product type from the design drawing of the PCB substrate; Further applied to the embodiment of the present invention, after obtaining the design drawing of the PCB substrate, the PCB product type can be identified from the design drawing of the PCB substrate. Specifically, the aperture and hole type can be identified. The aperture can include 3-5 mil, and the hole type can include through hole, blind hole and X-shaped hole, etc. The embodiment of the present invention does not impose too many restrictions on this. Different PCB product types are divided according to the aperture and hole type, which facilitates the next step of electroplating processing and improves product processing efficiency.
[0023] Step 103, if the PCB product type is a product type of an X-shaped hole with a hole diameter of 3 mil, the control device performs an electroplating operation on the 3 mil X-shaped hole to obtain a PCB product after electroplating; In a specific example, if the PCB product type is a product type with an X-shaped hole of 3 mil aperture, the X-shaped hole before filling is as follows: Figure 2 As shown, the control device performs an electroplating operation on the 3milX-type hole to obtain a PCB product after electroplating, including: setting the electroplating coefficient to 1, the jet value to 0.2hz, and the setting parameters Figure 3 As shown in the figure, the control device sprays the hole filling solution to fill the X-shaped hole with a diameter of 3 mil for hole filling electroplating, completing one electroplating operation to obtain the electroplated PCB product. The X-shaped hole after filling is as shown in the figure. Figure 4 As shown, in the embodiment of the present invention, the blind hole is designed as a through hole with a diameter of 3 mil, which can avoid the problem of cleaning the bottom browning layer. After parameter adjustment DOE experimental test, it is found that when the plating coefficient is 1 and the jet value is 0.2 Hz, the through hole filling effect is best.
[0024] Step 104, if the PCB product type is a blind hole product type with an aperture of 4-5 mil, the control device performs a secondary electroplating operation on the 4-5 mil blind hole to obtain a PCB product after electroplating; In another preferred embodiment of the embodiment of the present invention, if the PCB product type is a blind hole product type with an aperture of 4-5mil, the control device performs a secondary electroplating operation on the 4-5mil blind hole to obtain a plated PCB product, including: if the aperture and hole type of the blind hole product type with an aperture of 4-5mil is identified, the control device performs a primary electroplating operation of 0.9mil on the 4-5mil blind hole, and then performs a secondary electroplating operation of 1.1mil to obtain a plated PCB product. Specifically, the parameters of the primary electroplating operation are set as follows: Figure 5 As shown, the parameters of the secondary plating operation are set as Figure 6 As shown in the embodiment of the present invention, for blind hole diameters of 4-5mil and dielectrics of 4-5mil, secondary electroplating is required. The first plating is 0.9mil, so that the waist of the micro-via is reduced, so that the hole-filling solution can form an explosion mechanism during the second electroplating. The second plating is 1.1mil again, and the micro-via is filled on the basis of the first electroplating to achieve the effect of filling the micro-via.
[0025] Step 105, if the PCB product type is an X-shaped hole product type with an aperture of 4-5 mil, the control device performs bottom surface electroplating, and then controls the device to add electroplating conversion liquid to perform blind hole electroplating to obtain a plated PCB product.
[0026] In the third case of the embodiment of the present invention, if the PCB product type is an X-type hole product type with an aperture of 4-5 mil, the control device performs bottom surface electroplating, and then controls the device to add electroplating conversion liquid to perform blind hole electroplating to obtain a plated PCB product, including: calculating a specific post-copper ion concentration according to the comprehensive copper electrodeposition model; adjusting the copper ion concentration in the electroplating conversion liquid to a specific post-copper ion concentration, and controlling the device to perform bottom surface electroplating, and then controlling the device to add electroplating conversion liquid with a specific post-copper ion concentration to perform blind hole electroplating to obtain a plated PCB product.
[0027] That is, when the aperture and hole type is an X-type hole with an aperture of 4-5 mil, the through hole can be converted into a blind hole by performing a jet operation of the VCP process on one side of the PCB product or placing one side of the PCB product on a plating tank and controlling the equipment to perform a bottom plating on a single side of the PCB product.
[0028] On the other hand, because there are different component concentrations of the plating solution for bottom surface electroplating and blind hole electroplating, the difference in component concentration can be calculated, that is, the copper ion concentration of the plating conversion solution can be obtained, and the plating solution for bottom surface electroplating can be converted into the plating solution for blind hole electroplating, from a high-acid and low-copper system to a high-copper and low-acid system, and then the blind hole electroplating is carried out. There is no need to change the plating tank or the jet position, which reduces the processing time, saves steps, and saves costs.
[0029] Specifically applied to the embodiment of the present invention, the method also includes: obtaining the changes in the previous copper ion concentration, exchange current density, subsequent copper ion concentration, charge transfer coefficient of the cathode, overpotential, and cathode surface curvature of the electroplating solution; generating a comprehensive copper electrodeposition model based on the changes in the previous copper ion concentration, exchange current density, subsequent copper ion concentration, charge transfer coefficient of the cathode, overpotential, and cathode surface curvature of the electroplating solution.
[0030] Specifically, the expression of the comprehensive copper electrodeposition model is as follows: ; in, is the exchange current density, represents the prior copper ion concentration, Indicates the copper ion concentration at the end, represents the charge transfer coefficient of the cathode, represents the overpotential, Indicates the change in the curvature of the cathode surface; the specific copper ion concentration, that is, the copper ion concentration in the electroplating conversion solution, is added to the first electroplating solution for bottom surface electroplating to form the second electroplating solution for blind hole electroplating, and then the electroplating process of the PCB product is completed.
[0031] In an embodiment of the present invention, the above-mentioned semiconductor may include material pre-baking equipment, inner layer imaging equipment, drilling equipment, electroplating equipment, browning equipment, lamination and lamination equipment, dry film sticking equipment, UV laser equipment, exposure equipment, developing equipment, etching equipment, etc., and the embodiment of the present invention does not impose too many restrictions on this.
[0032] Correspondingly, after the above-mentioned electroplating operation, the equipment can also be controlled to perform outer layer image etching operation, solder mask operation, gold deposition operation, thermosetting text operation, molding operation, cover opening operation, soft board UV molding operation, electrical measurement operation, etc. The embodiments of the present invention do not impose too many restrictions on this.
[0033] In an embodiment of the present invention, the processing control method of the X-type hole electroplating filling process includes: acquiring a design drawing of a PCB substrate; identifying a PCB product type from the design drawing of the PCB substrate; if the PCB product type is a product type of an X-type hole with a 3mil aperture, the control device performs a first electroplating operation on the 3mil X-type hole to obtain a plated PCB product; if the PCB product type is a product type of a blind hole with a 4-5mil aperture, the control device performs a second electroplating operation on the 4-5mil blind hole to obtain a plated PCB product; if the PCB product type is a product type of an X-type hole with a 4-5mil aperture, the control device performs a second electroplating operation on the 4-5mil blind hole to obtain a plated PCB product; if the PCB product type is a product type of an X-type hole with a 4-5mil aperture, the control device performs bottom surface electroplating, and then controls the device to add electroplating conversion liquid to perform blind hole electroplating to obtain a plated PCB product. In an embodiment of the present invention, the concentration of the plating conversion liquid to be added is calculated through a preset model, the plating conversion liquid is added to the first plating liquid to obtain a second plating liquid, and blind hole plating is performed in the second plating liquid to obtain a plated PCB product. There is no need to change the plating tank, which saves steps and costs, improves the bonding strength of the bottom of the blind hole in the CORE layer blind hole stacking design, avoids the cracking phenomenon at the bottom of the blind hole, and achieves the effect of filling the micro-through hole.
[0034] It should be noted that, for the method embodiments, for the sake of simplicity, they are all described as a series of action combinations, but those skilled in the art should know that this embodiment is not limited by the order of the actions described, because according to this embodiment, some steps can be performed in other orders or simultaneously. Secondly, those skilled in the art should also know that the embodiments described in the specification are all preferred embodiments, and the actions involved are not necessarily required by this embodiment.
[0035] Reference Figure 7 , shows a structural block diagram of a processing control device embodiment of an X-shaped hole electroplating filling process of this embodiment, which may specifically include the following modules: The first acquisition module 301 is used to acquire the design drawing of the PCB substrate; An identification module 302 is used to identify the PCB product type from the design drawing of the PCB substrate; The first control module 303 is used to control the device to perform an electroplating operation on the 3mil X-shaped hole to obtain a PCB product after electroplating if the PCB product type is a product type of an X-shaped hole with a hole diameter of 3mil; The second control module 304 is used to control the device to perform a secondary electroplating operation on the 4-5 mil blind hole to obtain a PCB product after electroplating if the PCB product type is a blind hole with a hole diameter of 4-5 mil; The third control module 305 is used to control the device to add plating conversion liquid to perform blind hole plating after bottom surface electroplating if the PCB product type is an X-shaped hole product type with an aperture of 4-5 mil, so as to obtain a plated PCB product.
[0036] Preferably, the first control module includes: The first control submodule is used to set the electroplating coefficient to 1 and the jet value to 0.2 Hz, and control the equipment to jet the hole filling solution to perform hole filling electroplating on the X-shaped hole with a hole diameter of 3 mil, complete an electroplating operation, and obtain a PCB product after electroplating.
[0037] Preferably, the second control module includes: The second control submodule is used to control the device to perform a primary electroplating operation of 0.9 mil and a secondary electroplating operation of 1.1 mil on the 4-5 mil blind hole if the aperture and hole type are identified as a blind hole product type of 4-5 mil aperture, to obtain a PCB product after electroplating.
[0038] Preferably, the device further comprises: The second acquisition module is used to obtain the previous copper ion concentration, exchange current density, subsequent copper ion concentration, charge transfer coefficient of the cathode, overpotential, and change in cathode surface curvature of the electroplating solution; A generation module is used to generate a comprehensive copper electrodeposition model according to the changes in the previous copper ion concentration, exchange current density, subsequent copper ion concentration, cathode charge transfer coefficient, overpotential, and cathode surface curvature of the electroplating solution.
[0039] Preferably, the third control module includes: A calculation submodule, used for calculating a specific subsequent copper ion concentration according to the comprehensive copper electrodeposition model; The third control submodule is used to adjust the post-copper ion concentration in the electroplating conversion solution to a specific post-copper ion concentration, and after the control device performs bottom surface electroplating, the control device adds the electroplating conversion solution with the specific post-copper ion concentration to perform blind hole electroplating to obtain a PCB product after electroplating.
[0040] As for the device embodiment, since it is basically similar to the method embodiment, the description is relatively simple, and the relevant parts can be referred to the partial description of the method embodiment.
[0041] The specific definition of the processing control device of the X-shaped hole electroplating filling process can be referred to the definition of the processing control method of the X-shaped hole electroplating filling process in the above text, which will not be repeated here. Each module in the above-mentioned processing control device of the X-shaped hole electroplating filling process can be implemented in whole or in part by software, hardware and a combination thereof. The above-mentioned modules can be embedded in or independent of the processor in the computer device in the form of hardware, or can be stored in the memory of the computer device in the form of software, so that the processor can call and execute the operations corresponding to the above modules.
[0042] The processing control device for the X-shaped hole electroplating filling process provided above can be used to execute the processing control method for the X-shaped hole electroplating filling process provided in any of the above embodiments, and has corresponding functions and beneficial effects.
[0043] In one embodiment, a computer device is provided. The computer device may be a terminal, and its internal structure diagram may be as follows: Figure 8 As shown. The computer device includes a processor, a memory, a network interface, a display screen and an input device connected through a system bus. Among them, the processor of the computer device is used to provide computing and control capabilities. The memory of the computer device includes a non-volatile storage medium and an internal memory. The non-volatile storage medium stores an operating system and a computer program. The internal memory provides an environment for the operation of the operating system and the computer program in the non-volatile storage medium. The network interface of the computer device is used to communicate with an external terminal through a network connection. When the computer program is executed by the processor, a method for simulating daylighting is implemented. The display screen of the computer device can be a liquid crystal display screen or an electronic ink display screen, and the input device of the computer device can be a touch layer covering the display screen, or a button, trackball or touchpad set on the computer device housing, or an external keyboard, touchpad or mouse, etc.
[0044] Those skilled in the art will understand that Figure 8 The structure shown in the figure is only a block diagram of a part of the structure related to the solution of the present application, and does not constitute a limitation on the computer device to which the solution of the present application is applied. The specific computer device may include more or fewer components than those shown in the figure, or combine certain components, or have a different arrangement of components.
[0045] In one embodiment, a computer device is provided, including a memory and a processor, wherein a computer program is stored in the memory, and when the processor executes the computer program, the following steps are implemented: Get the design drawing of PCB substrate; Identify the PCB product type from the design drawing of the PCB substrate; If the PCB product type is a product type with an X-shaped hole of 3 mil aperture, the control device performs an electroplating operation on the 3 mil X-shaped hole to obtain a PCB product after electroplating; If the PCB product type is a blind hole product type with an aperture of 4-5 mil, the control device performs a secondary electroplating operation on the 4-5 mil blind hole to obtain a PCB product after electroplating; If the PCB product type is an X-shaped hole product type with an aperture of 4-5mil, the control device performs bottom surface electroplating, and then controls the device to add electroplating conversion liquid to perform blind hole electroplating to obtain a plated PCB product.
[0046] Preferably, if the PCB product type is a product type with an X-shaped hole of 3 mil aperture, the control device performs an electroplating operation on the 3 mil X-shaped hole to obtain a PCB product after electroplating, including: When the electroplating coefficient is set to 1, the jet value is 0.2 Hz, and the control equipment sprays the hole filling solution to perform hole filling electroplating on the X-shaped hole with a hole diameter of 3 mil, completing an electroplating operation to obtain a PCB product after electroplating.
[0047] Preferably, if the PCB product type is a blind hole product type with an aperture of 4-5 mil, the control device performs a secondary electroplating operation on the 4-5 mil blind hole to obtain a PCB product after electroplating, including: If the blind hole product type with the aperture and hole type of 4-5mil is identified, the control device performs a primary electroplating operation of 0.9mil on the 4-5mil blind hole, and then performs a secondary electroplating operation of 1.1mil to obtain a PCB product after electroplating.
[0048] Preferably, the method further comprises: Obtaining the changes in the previous copper ion concentration, exchange current density, subsequent copper ion concentration, cathode charge transfer coefficient, overpotential, and cathode surface curvature of the electroplating solution; A comprehensive copper electrodeposition model is generated according to the changes in the preceding copper ion concentration, the exchange current density, the subsequent copper ion concentration, the charge transfer coefficient of the cathode, the overpotential, and the cathode surface curvature of the electroplating solution.
[0049] Preferably, if the PCB product type is a product type with an X-shaped hole of 4-5 mil aperture, the control device performs bottom surface electroplating, and then controls the device to add electroplating conversion liquid to perform blind hole electroplating to obtain a plated PCB product, including: Calculating a specific subsequent copper ion concentration according to the comprehensive copper electrodeposition model; The post-copper ion concentration in the electroplating conversion solution is adjusted to a specific post-copper ion concentration, and after the control device performs bottom surface electroplating, the control device is further controlled to add the electroplating conversion solution with the specific post-copper ion concentration to perform blind hole electroplating to obtain a plated PCB product.
[0050] In one embodiment, a computer-readable storage medium is provided, on which a computer program is stored, and when the computer program is executed by a processor, the following steps are implemented: Get the design drawing of PCB substrate; Identify the PCB product type from the design drawing of the PCB substrate; If the PCB product type is a product type with an X-shaped hole of 3 mil aperture, the control device performs an electroplating operation on the 3 mil X-shaped hole to obtain a PCB product after electroplating; If the PCB product type is a blind hole product type with an aperture of 4-5 mil, the control device performs a secondary electroplating operation on the 4-5 mil blind hole to obtain a PCB product after electroplating; If the PCB product type is an X-shaped hole product type with an aperture of 4-5mil, the control device performs bottom surface electroplating, and then controls the device to add electroplating conversion liquid to perform blind hole electroplating to obtain a plated PCB product.
[0051] Preferably, if the PCB product type is a product type with an X-shaped hole of 3 mil aperture, the control device performs an electroplating operation on the 3 mil X-shaped hole to obtain a PCB product after electroplating, including: When the electroplating coefficient is set to 1, the jet value is 0.2 Hz, and the control equipment sprays the hole filling solution to perform hole filling electroplating on the X-shaped hole with a hole diameter of 3 mil, completing an electroplating operation to obtain a PCB product after electroplating.
[0052] Preferably, if the PCB product type is a blind hole product type with an aperture of 4-5 mil, the control device performs a secondary electroplating operation on the 4-5 mil blind hole to obtain a PCB product after electroplating, including: If the blind hole product type with the aperture and hole type of 4-5mil is identified, the control device performs a primary electroplating operation of 0.9mil on the 4-5mil blind hole, and then performs a secondary electroplating operation of 1.1mil to obtain a PCB product after electroplating.
[0053] Preferably, the method further comprises: Obtaining the changes in the previous copper ion concentration, exchange current density, subsequent copper ion concentration, cathode charge transfer coefficient, overpotential, and cathode surface curvature of the electroplating solution; A comprehensive copper electrodeposition model is generated according to the changes in the preceding copper ion concentration, the exchange current density, the subsequent copper ion concentration, the charge transfer coefficient of the cathode, the overpotential, and the cathode surface curvature of the electroplating solution.
[0054] Preferably, if the PCB product type is a product type with an X-shaped hole of 4-5 mil aperture, the control device performs bottom surface electroplating, and then controls the device to add electroplating conversion liquid to perform blind hole electroplating to obtain a plated PCB product, including: Calculating a specific subsequent copper ion concentration according to the comprehensive copper electrodeposition model; The post-copper ion concentration in the electroplating conversion solution is adjusted to a specific post-copper ion concentration, and after the control device performs bottom surface electroplating, the control device is further controlled to add the electroplating conversion solution with the specific post-copper ion concentration to perform blind hole electroplating to obtain a plated PCB product.
[0055] Those of ordinary skill in the art can understand that all or part of the processes in the above-mentioned embodiment methods can be implemented by instructing the relevant hardware through a computer program, and the computer program can be stored in a non-volatile computer-readable storage medium. When the computer program is executed, it can include the processes of the embodiments of the above-mentioned methods. Among them, any reference to memory, storage, database or other media used in the embodiments provided in this application may include non-volatile and / or volatile memory. Non-volatile memory may include read-only memory (ROM), programmable ROM (PROM), electrically programmable ROM (EPROM), electrically erasable programmable ROM (EEPROM) or flash memory. Volatile memory may include random access memory (RAM) or external cache memory. By way of illustration and not limitation, RAM is available in many forms, such as static RAM (SRAM), dynamic RAM (DRAM), synchronous DRAM (SDRAM), double data rate SDRAM (DDRSDRAM), enhanced SDRAM (ESDRAM), synchronous link (Synchlink) DRAM (SLDRAM), memory bus (Rambus) direct RAM (RDRAM), direct memory bus dynamic RAM (DRDRAM), and memory bus dynamic RAM (RDRAM), etc.
[0056] The various embodiments in this specification are described in a progressive manner, and each embodiment focuses on the differences from other embodiments. The same or similar parts between the various embodiments can be referenced to each other.
[0057] Those skilled in the art will appreciate that the embodiments of the present embodiment may be provided as methods, devices, or computer program products. Therefore, the present embodiment may take the form of a complete hardware embodiment, a complete software embodiment, or an embodiment combining software and hardware. Moreover, the present embodiment may take the form of a computer program product implemented on one or more computer-usable storage media (including but not limited to disk storage, CD-ROM, optical storage, etc.) containing computer-usable program codes.
[0058] The present embodiment is described with reference to the flowchart and / or block diagram of the apparatus, terminal device (system), and computer program product according to the present embodiment. It should be understood that each process and / or block in the flowchart and / or block diagram, as well as the combination of the processes and / or blocks in the flowchart and / or block diagram, can be implemented by computer program instructions. These computer program instructions can be provided to a processor of a general-purpose computer, a special-purpose computer, an embedded processor, or other programmable data processing terminal device to generate a machine, so that the instructions executed by the processor of the computer or other programmable data processing terminal device generate instructions for implementing the processes in the flowchart and / or block diagram. Figure 1 A process or multiple processes and / or boxes Figure 1 A device that provides the functions specified in a block or multiple blocks.
[0059] These computer program instructions may also be stored in a computer-readable memory capable of directing a computer or other programmable data processing terminal device to operate in a specific manner, so that the instructions stored in the computer-readable memory produce a manufactured product including an instruction method, which is implemented in the process Figure 1 A process or multiple processes and / or boxes Figure 1 A function specified in one or more boxes.
[0060] These computer program instructions can also be loaded onto a computer or other programmable data processing terminal device so that a series of operating steps are executed on the computer or other programmable terminal device to produce a computer-implemented process, thereby providing instructions for executing on the computer or other programmable terminal device to implement the process. Figure 1 A process or multiple processes and / or boxes Figure 1 The steps for the functions specified in one or more boxes.
[0061] Although the preferred embodiment of the present embodiment has been described, other changes and modifications may be made to these embodiments once those skilled in the art have learned the basic creative concept. Therefore, the appended claims are intended to be interpreted as including the preferred embodiment and all changes and modifications falling within the scope of the present embodiment.
[0062] Finally, it should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, device, article or terminal device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, device, article or terminal device. In the absence of further restrictions, the elements defined by the sentence "comprise a..." do not exclude the existence of other identical elements in the process, device, article or terminal device including the elements.
[0063] The above describes in detail a processing control method for an X-type hole electroplating filling process, a processing control device for an X-type hole electroplating filling process, a computer device and a storage medium provided by the present invention. Specific examples are used herein to illustrate the principles and implementation methods of the present invention. The description of the above embodiments is only used to help understand the method of the present invention and its core idea. At the same time, for a person skilled in the art, according to the idea of the present invention, there will be changes in the specific implementation method and application scope. In summary, the content of this specification should not be understood as a limitation on the present invention.
Claims
1. A processing control method for an X-shaped hole electroplating filling process, characterized in that: include: Get the design drawing of PCB substrate; Identify the PCB product type from the design drawing of the PCB substrate; If the PCB product type is a product type with an X-shaped hole of 3 mil aperture, the control device performs an electroplating operation on the 3 mil X-shaped hole to obtain a PCB product after electroplating; If the PCB product type is a blind hole product type with a hole diameter of 4-5 mil, the control device performs a secondary electroplating operation on the 4-5 mil blind hole to obtain a PCB product after electroplating; If the PCB product type is an X-shaped hole product type with an aperture of 4-5mil, the control device performs bottom surface electroplating, and then controls the device to add electroplating conversion liquid to perform blind hole electroplating to obtain a plated PCB product.
2. The method according to claim 1, characterized in that If the PCB product type is a product type with an X-shaped hole of 3 mil aperture, the control device performs an electroplating operation on the 3 mil X-shaped hole to obtain a PCB product after electroplating, including: When the electroplating coefficient is set to 1, the jet value is 0.2hz, and the control equipment sprays the hole filling solution to perform hole filling electroplating on the X-shaped hole with a hole diameter of 3mil, completing an electroplating operation to obtain a PCB product after electroplating.
3. The method according to claim 1, characterized in that If the PCB product type is a blind hole product type with an aperture of 4-5 mil, the control device performs a secondary electroplating operation on the 4-5 mil blind hole to obtain a PCB product after electroplating, including: If the blind hole product type with the aperture and hole type of 4-5mil is identified, the control device performs a primary electroplating operation of 0.9mil on the 4-5mil blind hole, and then performs a secondary electroplating operation of 1.1mil to obtain a PCB product after electroplating.
4. The method according to claim 1, characterized in that: The method further comprises: Obtaining the changes in the previous copper ion concentration, exchange current density, subsequent copper ion concentration, charge transfer coefficient of the cathode, overpotential, and cathode surface curvature of the electroplating solution; A comprehensive copper electrodeposition model is generated according to the changes in the preceding copper ion concentration, the exchange current density, the subsequent copper ion concentration, the charge transfer coefficient of the cathode, the overpotential, and the cathode surface curvature of the electroplating solution.
5. The method according to claim 4, characterized in that If the PCB product type is a product type with an X-shaped hole of 4-5mil aperture, the control device performs bottom surface electroplating, and then controls the device to add electroplating conversion liquid to perform blind hole electroplating to obtain a PCB product after electroplating, including: Calculating a specific subsequent copper ion concentration according to the comprehensive copper electrodeposition model; The post-copper ion concentration in the electroplating conversion solution is adjusted to a specific post-copper ion concentration, and after the control device performs bottom surface electroplating, the control device is further controlled to add the electroplating conversion solution with the specific post-copper ion concentration to perform blind hole electroplating to obtain a plated PCB product.
6. A processing control device for an X-shaped hole electroplating filling process, characterized in that: include: A first acquisition module is used to acquire a design drawing of a PCB substrate; An identification module, used for identifying the type of PCB product from the design drawing of the PCB substrate; The first control module is used for controlling the device to perform an electroplating operation on the 3mil X-shaped hole to obtain a PCB product after electroplating if the PCB product type is a product type of an X-shaped hole with a 3mil aperture; The second control module is used for controlling the device to perform a secondary electroplating operation on the 4-5 mil blind hole to obtain a PCB product after electroplating if the PCB product type is a blind hole with a hole diameter of 4-5 mil; The third control module is used to control the device to add electroplating conversion liquid to perform blind hole electroplating after the bottom surface electroplating if the PCB product type is an X-shaped hole product type with an aperture of 4-5 mil, so as to obtain a PCB product after electroplating.
7. The device according to claim 7, characterized in that The first control module comprises: The first control submodule is used to set the electroplating coefficient to 1 and the jet value to 0.2 Hz, and control the equipment to jet the hole filling solution to perform hole filling electroplating on the X-shaped hole with a hole diameter of 3 mil, complete an electroplating operation, and obtain a PCB product after electroplating.
8. The device according to claim 7, characterized in that The second control module includes: The second control submodule is used to control the device to perform a primary electroplating operation of 0.9 mil and a secondary electroplating operation of 1.1 mil on the 4-5 mil blind hole if the aperture and hole type are identified as a blind hole product type of 4-5 mil aperture, to obtain a PCB product after electroplating.
9. A computer device comprising a memory and a processor, wherein the memory stores a computer program, wherein: When the processor executes the computer program, the steps of the processing control method of the X-type hole electroplating filling process described in any one of claims 1 to 5 are implemented.
10. A computer-readable storage medium having a computer program stored thereon, characterized in that: When the computer program is executed by a processor, the steps of the processing control method of the X-type hole electroplating filling process described in any one of claims 1 to 5 are implemented.