Heat dissipation structure of power electronic module
By designing multiple protruding medium flow channels in the heat dissipation structure of the power electronic module, changing the flow direction of the cooling medium and making it contact with the heat dissipation substrate at an angle, the problem of low heat exchange efficiency caused by the flow direction of the cooling medium being parallel to the heat dissipation substrate in the prior art is solved, and a more efficient heat dissipation effect is achieved.
Patent Information
- Application Number
- CN202510141215.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-02-08
- Publication Date
- 2025-05-02
AI Technical Summary
In the heat dissipation structure of the existing power electronic module, the flow direction of the cooling medium is parallel to the heat dissipation substrate, resulting in an increase in the fluid viscosity effect and a low heat exchange efficiency.
A power electronic module heat dissipation structure is designed, including a heat dissipation substrate and a heat exchange member. A dielectric flow channel is provided in the heat exchange member. A plurality of protrusions are arranged at intervals in the dielectric flow direction. The free ends of adjacent protrusions point opposite, forming an inclusive contact to reduce the fluid viscosity effect.
By changing the flow direction of the cooling medium and making it contact with the heat dissipation substrate at an angle, the fluid viscosity effect is significantly reduced and the heat exchange efficiency and heat dissipation effect are improved.
Smart Images
Figure CN119922882A_ABST
Abstract
Description
Technical Field
[0001] The invention relates to the technical field of heat dissipation of electronic devices, and in particular to a heat dissipation structure of a power electronic module. Background Art
[0002] Heat dissipation performance is a core parameter that characterizes power electronic modules. Especially with the development of new power electronic devices and miniaturized power electronic modules, their power density has increased rapidly, and the requirements for heat dissipation performance have become increasingly stringent.
[0003] At present, the common heat sink structure in power electronic modules generally consists of two parts: the heat sink substrate and the heat exchange component. There are two types of heat exchange component structures that are commonly used. The first type of heat exchange component structure is usually called a fin structure. The fin-shaped protrusion structure is perpendicular to the heat sink substrate and parallel to the flow direction of the coolant. It can increase the heat dissipation area and improve the heat dissipation efficiency. The second heat dissipation structure is usually called a columnar structure, see Figure 1 As shown, the columnar heat dissipation structure includes an existing heat dissipation substrate 3 and a plurality of columnar protrusions 4 perpendicular to the existing heat dissipation substrate 3 and arranged in a staggered regular pattern. This structure can not only increase the heat dissipation area, but also enhance the turbulence effect of the coolant. The columnar protrusions 4 can be cylindrical, elliptical, diamond-shaped, water drop-shaped, etc.
[0004] The above two heat exchange component structures have a disadvantage, which is that the flow direction of the cooling medium 5 is always almost parallel to the existing heat dissipation substrate 3. Figure 2 As shown, due to the viscosity effect of the liquid, the surface of the existing heat dissipation substrate 3 is also the location with the highest temperature, the flow rate of the cooling medium is limited, and the heat exchange efficiency is low. Summary of the invention
[0005] The object of the present invention is to provide a power electronic module heat dissipation structure, which can enhance the turbulence effect of the cooling medium and improve the heat exchange efficiency.
[0006] In order to achieve the above object, the technical solution adopted by the present invention is as follows:
[0007] In a first aspect, the present invention provides a power electronic module heat dissipation structure, comprising a heat dissipation substrate, one side of the heat dissipation substrate being a power electronic module mounting surface, and the other side being fixed with a heat exchange component, wherein at least one medium flow channel is provided in the heat exchange component, and a plurality of protrusions are provided in the medium flow channel at intervals along a medium flow direction, and the free ends of adjacent protrusions point in opposite directions.
[0008] Furthermore, the heat exchange component includes a plurality of plates fixed vertically to the side of the heat dissipation substrate, and the plurality of plates together form a accommodating space, which includes an inlet flow channel, an outlet flow channel and a heat exchange area; a plurality of medium flow channels are formed in the heat exchange area, the inlet flow channel is sequentially connected to the inlet side of each of the medium flow channels, and the outlet flow channel is sequentially connected to the outlet side of each of the medium flow channels.
[0009] Furthermore, the inlet flow channel and the outlet flow channel are arranged in parallel and at intervals, and the heat exchange zone is located between the inlet flow channel and the outlet flow channel; the heat exchange zone includes a plurality of partitions arranged in parallel and at intervals, the partitions are vertically fixed to the side of the heat dissipation substrate, and adjacent partitions and the side of the heat dissipation substrate or partitions adjacent to the plate body and the plate body and the side of the heat dissipation substrate are surrounded to form a plurality of medium flow channels.
[0010] Furthermore, a region on the side of the heat dissipation substrate where a medium flow channel is formed is provided with a plurality of first protrusions extending away from the heat dissipation substrate at intervals along the medium flow direction, a beam body is vertically connected to the side of the partition, a gap is arranged between the beam body and the side of the heat dissipation substrate, a plurality of second protrusions extending toward the heat dissipation substrate are provided on the beam body, and the vertical projections of the first protrusion and the second protrusion on the plane where the heat dissipation substrate is located are staggered along the medium flow direction.
[0011] Furthermore, the heat exchange component is integrally formed with the heat dissipation substrate.
[0012] Furthermore, the protrusion includes a base and a spoiler connected to the end of the base, the spoiler has an arc-shaped cross section, and a diameter of the arc of the spoiler is greater than a width of the base cross section.
[0013] Furthermore, the protrusion extends in a direction perpendicular to the plane where the heat dissipation substrate is located.
[0014] The present invention has the following unexpected beneficial effects:
[0015] 1. The present invention arranges a plurality of protrusions at intervals along the medium flow direction in the medium flow channel, and sets the free ends of adjacent protrusions to point in opposite directions, so that the flow direction of the cooling medium can contact the heat dissipation substrate at an angle. Compared with the heat exchange component in which the flow direction of the cooling medium is parallel to the heat dissipation substrate, the fluid viscosity effect on the surface of the heat dissipation substrate is effectively reduced, thereby enhancing the commutation heat dissipation efficiency and improving the heat dissipation effect of the heat dissipation structure.
[0016] 2. The present invention stipulates that the heat exchange component and the heat dissipation substrate are integrally formed, which improves the overall rigidity of the heat dissipation structure, reduces the deformation of the heat dissipation structure during the packaging process, and improves the long-term reliability of the electronic device containing the heat dissipation structure.
[0017] 3. The present invention stipulates that the cross-section of the raised spoiler is an arc shape, and the arc diameter of the spoiler is larger than the cross-section width of the substrate, which can enhance the spoiler effect of the cooling medium and further improve the heat dissipation efficiency. BRIEF DESCRIPTION OF THE DRAWINGS
[0018] Figure 1 A schematic diagram of the heat dissipation structure of an existing power electronic module is shown.
[0019] Figure 2 A schematic diagram showing the flow direction of the cooling medium in the heat dissipation structure of the existing power electronic module is shown.
[0020] Figure 3 A schematic diagram of the heat dissipation structure of the power electronic module of the present invention is shown.
[0021] Figure 4 A front view of the heat dissipation structure of the power electronic module of the present invention is shown.
[0022] Figure 5 A partially enlarged schematic diagram of the heat dissipation structure of the power electronic module of the present invention is shown.
[0023] Figure 6 A schematic diagram showing the flow direction of the cooling medium in the heat dissipation structure of the power electronic module of the present invention is shown.
[0024] Figure 7 A schematic diagram of thermal simulation results of the heat dissipation structure of the power electronic module of the present invention is shown.
[0025] Figure 8 A schematic diagram of thermal simulation results of the heat dissipation structure of an existing power electronic module is shown.
[0026] Fig. 9 A diagram showing the flow rate of cooling medium in the heat dissipation structure of the power electronic module of the present invention is shown.
[0027] In the figure, 1 is a heat dissipation substrate, 2 is a heat exchange component, 21 is a medium flow channel, 22 is a protrusion, 221 is a first protrusion, 222 is a second protrusion, 223 is a base, 224 is a spoiler, 23 is a plate, 24 is an inlet flow channel, 25 is an outlet flow channel, 26 is a heat exchange area, 27 is a partition, 28 is a beam, 3 is an existing heat dissipation substrate, 4 is a columnar protrusion, and 5 is a cooling medium. DETAILED DESCRIPTION
[0028] The following will describe the embodiments of the present invention with reference to the accompanying drawings and preferred embodiments. Those skilled in the art can easily understand other advantages and effects of the present invention from the contents disclosed in this specification. The present invention can also be implemented or applied through other different specific embodiments, and the details in this specification can also be modified or changed in various ways based on different viewpoints and applications without departing from the spirit of the present invention. It should be understood that the preferred embodiments are only for illustrating the present invention, not for limiting the scope of protection of the present invention.
[0029] It should be noted that the illustrations provided in the following embodiments are only schematic illustrations of the basic concept of the present invention, and thus the drawings only show components related to the present invention rather than being drawn according to the number, shape and size of components in actual implementation. In actual implementation, the type, quantity and proportion of each component may be changed arbitrarily, and the component layout may also be more complicated.
[0030] In one embodiment, see Figure 3 and Figure 4 As shown, the present invention provides a power electronic module heat dissipation structure, including a heat dissipation substrate 1, the lower side of the heat dissipation substrate 1 is the power electronic module mounting surface, and a heat exchange component 2 is fixed on the upper side. At least one medium flow channel 21 is provided in the heat exchange component 2, and a cooling medium flows through the medium flow channel 21, thereby taking away the heat generated by the power electronic module. A plurality of protrusions 22 are provided in the medium flow channel 21 at intervals along the medium flow direction, and the free ends of adjacent protrusions 22 point in opposite directions.
[0031] The present invention arranges a plurality of protrusions 22 at intervals along the medium flow direction in the medium flow channel 21, and sets the free ends of adjacent protrusions 22 to point in opposite directions, so that the flow direction of the cooling medium can contact the heat dissipation substrate 1 at an angle. Compared with the heat exchange component in which the flow direction of the cooling medium is parallel to the heat dissipation substrate 1, the fluid viscosity effect on the surface of the heat dissipation substrate 1 is effectively reduced. The fluid viscosity effect is one of the important factors that hinder heat transfer. By changing the flow direction of the cooling medium so that it forms an angle with the surface of the heat dissipation substrate 1, this viscosity effect can be significantly reduced, so that the cooling medium can flow more smoothly through the medium flow channel 21, taking away more heat, thereby improving the heat transfer efficiency and the heat dissipation effect of the heat dissipation structure. Such a setting is not only simple and practical, but also can significantly improve the heat dissipation performance of the power electronic module, providing a strong guarantee for the stable operation of the power electronic equipment.
[0032] In a preferred embodiment, see Figures 3 to 5As shown, the heat exchange component 2 includes a plurality of plates 23 vertically fixed to the side of the heat dissipation substrate 1, and the plurality of plates 23 enclose a receiving space, and the receiving space includes an inlet flow channel 24, an outlet flow channel 25 and a heat exchange area 26. A plurality of medium flow channels 21 are formed in the heat exchange area 26, and the inlet flow channel 24 is connected to the inlet side of each of the medium flow channels 21 in sequence, and the outlet flow channel 25 is connected to the outlet side of each of the medium flow channels 21 in sequence.
[0033] The inlet channel 24 is designed to be spacious and smooth as the inlet of the cooling medium to ensure that the cooling medium can smoothly enter the accommodation space. The inlet channel 24 is connected to the inlet side of each heat exchange area 26 in sequence to provide a stable supply of cooling medium for the entire heat exchange process.
[0034] The outlet channel 25 corresponds to the inlet channel 24 and is responsible for guiding out the cooling medium heated after heat exchange. The outlet channel 25 sequentially connects the outlet sides of each heat exchange area 26 to ensure that the cooling medium can leave the accommodation space in an orderly manner.
[0035] The heat exchange area 26 is the core area in the accommodation space and is also the main place where the heat exchange process occurs. A number of specific medium flow channels 21 are designed in the heat exchange area 26 to maximize heat exchange with the heat dissipation substrate 1. At the same time, these medium flow channels 21 are connected in parallel through the inlet flow channel 24 and the outlet flow channel 25 to form a complete heat exchange circuit.
[0036] The present invention forms a compact and efficient heat exchange space by vertically fixing and enclosing multiple plates 23. Such a configuration not only increases the heat exchange area, but also enables the cooling medium to more fully exchange heat with the heat dissipation substrate 1 during the flow process. The design of the inlet flow channel 24 and the outlet flow channel 25 ensures the supply and discharge of the cooling medium, facilitates the connection between the cooling medium and the external circulation system, facilitates the rapid removal of heat, and improves the heat exchange efficiency.
[0037] The heat dissipation structure of the power electronic module of the present invention and the heat dissipation structure of the power electronic module with the existing columnar protrusions are respectively subjected to thermal simulation tests. The results are shown in Figure 7 , Figure 8 And as shown in Table 1.
[0038] Table 1 Thermal simulation results
[0039]
[0040] It can be seen from the comparison that the heat dissipation effect of the present invention is obviously better than the columnar heat dissipation structure of the prior art.
[0041] In a preferred embodiment, the inlet flow channel 24 and the outlet flow channel 25 are arranged in parallel and spaced apart in the left-right direction, and the heat exchange area 26 is located between the inlet flow channel 24 and the outlet flow channel 25. The heat exchange area 26 includes a plurality of baffles 27 arranged in parallel and spaced apart, and the baffles 27 are vertically fixed to the side of the heat dissipation substrate 1, and adjacent baffles 27 and the side of the heat dissipation substrate 1 or baffles adjacent to the plate body 23 and the plate body 23 and the side of the heat dissipation substrate 1 are surrounded to form a plurality of medium flow channels 21. Such an arrangement has a simple structure, and a plurality of mutually independent and parallel medium flow channels 21 can be formed by the baffles 27 and the plate body 23 in conjunction with the side of the heat dissipation substrate 1, which is easy to manufacture. At the same time, due to the arrangement of the inlet flow channel 24 and the outlet flow channel 25, it is ensured that the cooling medium can flow through the medium flow channel 21 in an orderly manner, thereby realizing efficient heat transfer and exchange.
[0042] In this preferred embodiment, the protrusion 22 is also applied in the medium flow channel 21 formed by the partition 27 and the heat dissipation substrate 1. The protrusion 22 improves the heat transfer efficiency by changing the flow direction of the cooling medium and reducing the fluid viscosity effect.
[0043] In a preferred embodiment, a region on the side of the heat dissipation substrate 1 where the medium flow channel 21 is formed is provided with a plurality of first protrusions 221 extending away from the heat dissipation substrate 1 at intervals along the medium flow direction. A beam 28 is vertically connected to the side of the partition 27, and the beam 28 is arranged with a gap between the side of the heat dissipation substrate 1. The beam 28 is provided with a plurality of second protrusions 222 extending toward the heat dissipation substrate 1, and the vertical projections of the first protrusion 221 and the second protrusion 222 on the plane where the heat dissipation substrate 1 is located are staggered along the medium flow direction.
[0044] The heat dissipation substrate 1 is used as the installation site of the first protrusion 221, and the beam body 28 is used as the installation site of the second protrusion 222. The structure is simple and easy to manufacture. At the same time, since the vertical projections of the first protrusion 221 and the second protrusion 222 on the plane where the heat dissipation substrate 1 is located are staggered along the medium flow direction, not only direct collision and interference between the protrusions 22 are avoided, but also a more complex flow path can be formed when the cooling medium flows through the medium flow channel 21. This complex flow path increases the contact area between the cooling medium and the heat dissipation substrate 1, reduces the fluid viscosity effect, and improves the heat transfer efficiency.
[0045] In a preferred embodiment, the heat exchange component 2 is integrally formed with the heat dissipation substrate 1, which means that there are no additional connectors or interfaces between them, which simplifies the manufacturing process, reduces production costs, improves the overall rigidity of the heat dissipation structure, reduces the deformation of the heat dissipation structure during the packaging process, and improves the long-term reliability of electronic devices containing the heat dissipation structure.
[0046] At the same time, since the heat exchange component 2 and the heat dissipation substrate 1 are integrally formed, the heat conduction path between them is more direct and efficient. When the cooling medium flows through the medium flow channel 21, it can exchange heat with the heat dissipation substrate 1 more quickly, thereby taking away more heat. In addition, the integrally formed design also reduces thermal resistance and improves the heat transfer efficiency.
[0047] The one-piece heat dissipation structure also has significant advantages in terms of maintenance and installation. Since there are no additional connectors or interfaces, potential failure points and maintenance costs are reduced. At the same time, this design also simplifies the installation process, allowing the heat dissipation structure to be installed on power electronic equipment more quickly.
[0048] Although the heat exchange component 2 is integrally formed with the heat dissipation substrate 1, this design does not hinder its flexibility and scalability. By adjusting the layout of the medium flow channel 21, the height and number of the protrusions 22 and other parameters, the heat dissipation performance can be easily optimized to meet the needs of different application scenarios.
[0049] In a preferred embodiment, the protrusion 22 includes a base 223 and a spoiler 224 connected to the end of the base 223 . The spoiler 224 has an arc-shaped cross section, and the arc diameter of the spoiler 224 is greater than the cross-sectional width of the base 223 .
[0050] The base 223 is the main supporting part of the protrusion 22, which is connected to the heat dissipation substrate 1 or the beam body 28, and provides a stable foundation for the spoiler 224. The spoiler 224 is the key part of the protrusion 22, which directly participates in the flow process of the cooling medium, plays a role in changing the flow direction and improving the heat exchange efficiency.
[0051] The cross section of the spoiler 224 is in an arc shape, and this design enables the spoiler 224 to produce a softer disturbance effect when the cooling medium flows. Compared with sharp protrusions, the arc-shaped spoiler 224 not only reduces the flow resistance, but more importantly, the arc diameter of the spoiler 224 is greater than the cross-sectional width of the base 223, which means that the spoiler 224 occupies a larger volume in space, thereby more effectively changing the flow direction of the cooling medium, enhancing the turbulence effect of the cooling medium, and further improving the heat dissipation efficiency.
[0052] Observe the flow rate of the thermal simulation cooling medium when it flows through the protrusion 22. The results are shown in Fig. 9 As shown, it can be seen that the flow rate of the cooling medium at the position of the arc protrusion 22 is higher than that at other positions, thereby being able to quickly take away the heat on the heat dissipation substrate 1, thereby improving the heat dissipation effect.
[0053] In a preferred embodiment, the extension direction of the protrusion 22 is perpendicular to the plane of the heat dissipation substrate 1, so that the flow direction of the cooling medium is perpendicular to the heat dissipation substrate 1, which effectively reduces the fluid viscosity effect on the surface of the heat dissipation substrate 1 and enhances the commutation and heat dissipation efficiency.
[0054] The above embodiments are only preferred embodiments for fully illustrating the present invention, and the protection scope of the present invention is not limited thereto. Any equivalent substitution or change made by a person skilled in the art based on the present invention is within the protection scope of the present invention.
Claims
1. A power electronic module heat dissipation structure, comprising a heat dissipation substrate (1), one side of the heat dissipation substrate (1) being a power electronic module mounting surface, and the other side of the heat dissipation substrate (1) being fixed with a heat exchange component (2), characterized in that: At least one medium flow channel (21) is provided in the heat exchange component (2), and a plurality of protrusions (22) are provided at intervals in the medium flow channel (21) along the medium flow direction, with free ends of adjacent protrusions (22) pointing in opposite directions.
2. The power electronic module heat dissipation structure according to claim 1, characterized in that: The heat exchange component (2) comprises a plurality of plates (23) fixed vertically to the side of the heat dissipation substrate (1), the plurality of plates (23) enclosing together to form a receiving space, the receiving space comprising an inlet flow channel (24), an outlet flow channel (25) and a heat exchange area (26); a plurality of medium flow channels (21) are formed in the heat exchange area (26), the inlet flow channel (24) sequentially connects to the inlet side of each of the medium flow channels (21), and the outlet flow channel (25) sequentially connects to the outlet side of each of the medium flow channels (21).
3. The power electronic module heat dissipation structure according to claim 2, characterized in that: The inlet flow channel (24) and the outlet flow channel (25) are arranged in parallel and spaced apart, and the heat exchange area (26) is located between the inlet flow channel (24) and the outlet flow channel (25); The heat exchange area (26) comprises a plurality of partitions (27) arranged in parallel and spaced apart from each other, wherein the partitions (27) are vertically fixed to the side of the heat dissipation substrate (1), and adjacent partitions (27) and the side of the heat dissipation substrate (1) or partitions adjacent to the plate body (23) and the side of the plate body (23) and the side of the heat dissipation substrate (1) are combined to form a plurality of medium flow channels (21).
4. The power electronic module heat dissipation structure according to claim 3, characterized in that: A region of the side surface of the heat dissipation substrate (1) where the medium flow channel (21) is formed is provided with a plurality of first protrusions (221) extending in a direction away from the heat dissipation substrate (1) at intervals along the medium flow direction; a beam body (28) is vertically connected to the side surface of the partition plate (27); the beam body (28) is arranged with a gap between the side surface of the heat dissipation substrate (1); a plurality of second protrusions (222) extending in a direction close to the heat dissipation substrate (1) are provided on the beam body (28); and vertical projections of the first protrusions (221) and the second protrusions (222) on the plane where the heat dissipation substrate (1) is located are arranged in a staggered manner along the medium flow direction.
5. The power electronic module heat dissipation structure according to claim 4, characterized in that: The heat exchange component (2) and the heat dissipation substrate (1) are integrally formed.
6. The power electronic module heat dissipation structure according to claim 1, characterized in that: The protrusion (22) comprises a base (223) and a spoiler (224) connected to the end of the base (223); the spoiler (224) has an arc-shaped cross section, and the arc diameter of the spoiler (224) is greater than the cross-sectional width of the base (221).
7. The power electronic module heat dissipation structure according to claim 1, characterized in that: The protrusion (22) extends in a direction perpendicular to the plane where the heat dissipation substrate (1) is located.