Electronic equipment liquid cooling system, electronic equipment and electronic equipment liquid cooling control method

Abstract

The invention discloses an electronic equipment liquid cooling system, electronic equipment and an electronic equipment liquid cooling control method, and relates to the technical field of electronic equipment heat dissipation. The liquid cooling pipeline is communicated with the condensing device, a cooling medium in the liquid cooling pipeline sequentially passes through a first component, a third component and a second component of the electronic equipment and flows back to the condensing device, and the heating power consumption of the third component is larger than that of the first component or the second component. And when the cooling medium passes through at least one component, the gas-liquid state is changed. The cooling medium in the liquid cooling pipeline fully utilizes the absorption potential of the phase state of each stage when the gas-liquid two-phase state changes, and the heat dissipation characteristics of each component are combined, so that the highest heat dissipation effect is achieved, the problem that the cooling effect of a two-phase liquid cooling system in the related technology is poor is solved, and the service life of the two-phase liquid cooling system is prolonged. The purpose of greatly improving the cooling effect of the two-phase liquid cooling system is achieved.

Description

Technical Field

[0001] The present application relates to the technical field of heat dissipation of electronic equipment, and in particular to an electronic equipment liquid cooling system, an electronic equipment, and an electronic equipment liquid cooling control method. Background Art

[0002] At present, in the liquid cooling system of electronic equipment such as servers, two-phase cold plates are widely used because they have the advantage of solving high thermal density and high power consumption. In a two-phase liquid cooling system, the efficiency of boiling heat transfer is much higher than that of single-phase convection heat transfer. However, in the current two-phase liquid cooling system, the vaporization of the coolant cannot be stably controlled. If the coolant cannot be fully vaporized in the heat source, that is, the dryness is too small, then most of the coolant will flow through the heat source in liquid form, which will greatly reduce the heat exchange efficiency. If the coolant is completely vaporized in all heat sources, that is, the dryness is too large, then the further overheating of the coolant will not be able to effectively absorb the heat from the heat source, which will also reduce the cooling efficiency, resulting in poor cooling effect of the two-phase liquid cooling system as a whole. Summary of the invention

[0003] The present application provides an electronic equipment liquid cooling system, an electronic equipment and an electronic equipment liquid cooling control method, so as to at least solve the problem of poor cooling effect of the two-phase liquid cooling system in the related art.

[0004] The present application provides a liquid cooling system for an electronic device, comprising: a condensing device; a liquid cooling pipeline, the liquid cooling pipeline is connected to the condensing device, a cooling medium in the liquid cooling pipeline passes through a first component, a third component, and a second component of the electronic device in sequence, and flows back to the condensing device, the heat consumption of the third component is greater than that of the first component or the second component, and the gas-liquid state of the cooling medium changes when passing through at least one component.

[0005] The present application also provides an electronic device, comprising: a cabinet; at least one electronic node, the electronic node is arranged in the cabinet, the electronic node comprises a first component, a second component and a third component; the above-mentioned electronic device liquid cooling system, the liquid cooling pipeline is arranged between the cabinet and the electronic node.

[0006] The present application also provides a liquid cooling control method for an electronic device, which is executed using the above-mentioned electronic device. The liquid cooling control method for an electronic device includes: obtaining the node power consumption of each component in the electronic device and the node flow of the liquid cooling pipeline in which it is located, and comparing the relationship between the node power consumption and the node flow with a preset condition. If the preset condition is not met, controlling and adjusting the opening of a valve on the electronic device until the relationship between the node power consumption and the node flow meets the preset condition; obtaining the whole machine power consumption of the electronic device and the whole machine flow of the liquid cooling pipeline, and comparing the relationship between the whole machine power consumption and the whole machine flow with the preset condition. If the preset condition is not met, controlling and adjusting the opening of a control valve at the inlet of the liquid cooling pipeline until the relationship between the whole machine power consumption and the whole machine flow meets the preset condition.

[0007] Through the present application, since the matching relationship between the first component, the second component, the third component and the liquid cooling pipeline is optimized, the liquid cooling pipeline is adopted to pass through the first component, the third component and the second component in sequence, so that the cooling medium in the liquid cooling pipeline can fully utilize the absorption potential of each phase when the gas-liquid two-phase state changes, and combine the heat dissipation characteristics of each component to achieve the highest heat dissipation effect, solve the problem of poor cooling effect of the two-phase liquid cooling system in the related technology, and achieve the purpose of greatly improving the cooling effect of the two-phase liquid cooling system. BRIEF DESCRIPTION OF THE DRAWINGS

[0008] In order to more clearly illustrate the embodiments of the present application, the following is a brief introduction to the drawings required for use in the embodiments. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0009] Figure 1 This is a structural block diagram of a liquid cooling system for an electronic device according to an embodiment of the present application;

[0010] Figure 2 A front view of an electronic device according to an embodiment of the present application;

[0011] Figure 3 A side view of an electronic device according to an embodiment of the present application;

[0012] Figure 4 This is a schematic diagram of the structure of a liquid cooling pipeline on the back panel of an electronic device according to an embodiment of the present application;

[0013] Figure 5 A schematic diagram of the structure of a liquid cooling pipeline of a graphics node of an electronic device according to an embodiment of the present application;

[0014] Figure 6 A schematic diagram of the structure of a liquid cooling pipeline of a computing node of an electronic device according to an embodiment of the present application;

[0015] Figure 7 This is a schematic diagram of the overall structure of the liquid cooling pipeline of the electronic device according to an embodiment of the present application;

[0016] Figure 8 This is a flow chart of a liquid cooling control method for an electronic device according to an embodiment of the present application.

[0017] The above drawings include the following reference numerals:

[0018] 10. Condensing device; 20. Liquid cooling pipeline; 21. First section; 211. Common section; 212. Branch section; 22. Second section; 23. Third section; 30. Control valve; 40. Flow meter; 50. Valve; 60. Collection device; 70. Control device; 80. Cabinet; 81. Backplane; 90. Electronic node; 91. First component; 92. Second component; 93. Third component; 100. Current distributor; 110. First cooling device. DETAILED DESCRIPTION

[0019] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0020] It should be noted that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present application. The terms "installed", "connected" and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two elements. The terms "parallel", "perpendicular" and "equal" include the situations described and situations similar to the situations described, and the range of the similar situations is within the acceptable deviation range, where the acceptable deviation range is determined by a person of ordinary skill in the art taking into account the measurement being discussed and the errors associated with the measurement of a specific quantity (i.e., the limitations of the measurement system). For example, "parallel" includes absolute parallelism and approximate parallelism, wherein the acceptable deviation range of approximate parallelism can be, for example, a deviation within 5°; "perpendicular" includes absolute perpendicularity and approximate perpendicularity, wherein the acceptable deviation range of approximate perpendicularity can also be, for example, a deviation within 5°. "Equal" includes absolute equality and approximate equality, wherein the acceptable deviation range of approximate equality can be, for example, that the difference between the two equalities is less than or equal to 5% of either one. For those of ordinary skill in the art, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0021] In order to enable those skilled in the art to better understand the present application, the present application is further described in detail below in conjunction with the accompanying drawings and specific implementation methods.

[0022] In order to solve the problem of poor cooling effect of a two-phase liquid cooling system in the related art, the present application provides an electronic device liquid cooling system, an electronic device, and an electronic device liquid cooling control method.

[0023] like Figure 1 A liquid cooling system for an electronic device is shown, comprising a condensing device 10 and a liquid cooling pipeline 20. The liquid cooling pipeline 20 is connected to the condensing device 10. The cooling medium in the liquid cooling pipeline 20 passes through a first component 91, a third component 93, and a second component 92 of the electronic device in sequence, and flows back to the condensing device 10. The heat consumption of the third component 93 is greater than that of the first component 91 or the second component 92. The gas-liquid state of the cooling medium changes when passing through at least one component.

[0024] This embodiment optimizes the design of the matching relationship between the first component 91, the second component 92, the third component 93 and the liquid cooling pipeline 20, and adopts the form of the liquid cooling pipeline 20 passing through the first component 91, the third component 93, and the second component 92 in sequence, so that the cooling medium in the liquid cooling pipeline 20 can fully utilize the absorption potential of each phase when the gas-liquid two-phase state changes, and combine the heat dissipation characteristics of each component to achieve the highest heat dissipation effect, thereby achieving the purpose of greatly improving the cooling effect of the two-phase liquid cooling system.

[0025] In this embodiment, the heat consumption of the first component 91, the second component 92 and the third component 93 is arranged from low to high, so that the power consumption of the liquid cooling pipeline 20 passing through the above three components is arranged in the form of "low, high and medium", which can further improve the cooling effect and enable the three components to be well cooled. Of course, in addition to the above-mentioned setting method, other arrangements can also be used.

[0026] For example, in an embodiment not shown in the figure, the power consumption of the first component 91, the second component 92 and the third component 93 is the highest, and the power consumption of the second component 92 and the third component 93 are both relatively low, so that the power consumption of the liquid cooling pipeline 20 passing through the above three components is arranged in a "high-low-low" order. Of course, there are other more arrangements.

[0027] It should be noted that, since the number of components may not be limited to three, the arrangement of the above components may only be the arrangement of some components through which the liquid cooling pipeline 20 passes. For example, other components may be added between the "low, high, and medium" arrangement of this embodiment, and the components also include a fourth component. The arrangement of the components through which the liquid cooling pipeline 20 passes is a first component 91, a fourth component, a third component 93, and a second component 92. In other words, as long as any three components through which the liquid cooling pipeline 20 passes meet the required power consumption arrangement requirements, the liquid cooling pipeline 20 may pass through more components, and the arrangement of these components may be set as required.

[0028] The cooling medium of this embodiment has an undersaturated liquid state, a saturated liquid state, a saturated vapor state, and a superheated vapor state. Among them, the undersaturated liquid state is that the cooling medium is in a completely liquid state, and there is a certain heat absorption space before it becomes a gaseous state. The saturated liquid state is that the cooling medium is in a liquid state, and at the same time is in a critical state between the liquid state and the gaseous state. At this time, the cooling medium will appear in a gaseous state if it absorbs heat again. The saturated vapor state is that the cooling medium is in a gaseous state, and is in a critical state where it has just completely changed from a liquid state to a gaseous state. The superheated vapor state is a state formed by the cooling medium continuing to absorb heat on the basis of the saturated vapor state.

[0029] Based on the above state of the cooling medium, the phase state of the aforementioned liquid cooling medium changes as it passes through the first component 91, the third component 93, the second component 92, and the condensing device 10 as follows: the cooling medium in the condensing device 10 is an undersaturated liquid medium, which absorbs heat at the first component 91 to form a saturated liquid medium, then absorbs heat at the third component 93 to form a saturated steam medium, then absorbs heat at the second component 92 to form superheated steam, and then condenses through the condensing device 10 to re-form an undersaturated liquid medium. The above process makes full use of the undersaturated single phase (liquid phase) of the two-phase refrigerant supercooling section to absorb the heat of low-power consumption components, uses the two-phase vaporization latent heat with the highest heat exchange efficiency to absorb the heat of high-power consumption components, and uses the superheat of the single phase (superheated steam) to absorb the heat of medium-power consumption components, thereby making full use of the absorption potential of each part, combining the heat dissipation characteristics of each component, and achieving the highest heat dissipation effect.

[0030] It should be noted that the phase change of the above-mentioned cooling medium is not strict, but may fluctuate. For example, the undersaturated liquid medium can absorb heat through the first component 91 and form a phase close to a saturated liquid or a slightly supersaturated liquid. However, this will affect the subsequent heat absorption effect, causing the overall cooling effect to be slightly reduced. However, compared with the traditional method, the cooling effect can still be improved.

[0031] The electronic equipment liquid cooling system of this embodiment can be used in a whole cabinet server or a single-node server. It is not limited to servers and can also be used in other devices such as switches and routers.

[0032] When used in a single-node device such as a single-node server, the first component 91, the second component 92 and the third component 93 are located in the same electronic node 90. At this time, the liquid cooling pipeline 20 includes a first segment 21, a third segment 23 and a second segment 22 which respectively cooperate with the first component 91, the third component 93 and the second component 92 for heat exchange. The first segment 21, the second segment 22 and the third segment 23 are located in the same electronic node 90 of the electronic device, so that the first segment 21, the second segment 22 and the third segment 23 can respectively cooperate with the first component 91, the second component 92 and the third component 93 to achieve heat exchange of the cooling medium, thereby achieving cooling and heat dissipation of the electronic device.

[0033] When used for a whole cabinet server, the whole cabinet server has multiple electronic nodes 90, and different components are respectively arranged in each electronic node 90. At this time, the liquid cooling pipeline 20 still includes the first segment 21, the third segment 23, and the second segment 22 which respectively cooperate with the first component 91, the third component 93, and the second component 92 for heat exchange. However, unlike the setting of a single-node server, at this time, at least one of the first segment 21, the second segment 22 and the third segment 23 is located at a different electronic node 90 of the electronic device, and can cooperate with the components in different electronic nodes 90, so as to realize heat exchange with the components and then realize heat dissipation.

[0034] This embodiment will be described below mainly using the whole cabinet server as an example, but some subsequent designs can also be used for single-node servers.

[0035] like Figure 4 As shown, in this embodiment, the first segment 21 includes a common segment 211 and a plurality of branch segments 212, each branch segment 212 is connected to the common segment 211, and the branch segment 212 is located in the heat dissipation area of ​​the first component 91. In this way, on the one hand, the branch segment 212 can cooperate with the plurality of first components 91 to achieve a unified heat dissipation effect, and on the other hand, the structural form of the serial-parallel pipeline can realize the control of a single branch segment 212 and the control of the entire first segment 21, thereby providing a structural basis for the subsequent flow control.

[0036] In this embodiment, the electronic equipment liquid cooling system also includes a control valve 30 for controlling the flow rate, and the control valve 30 is provided on the common section 211 and / or at least one branch section 212. In this embodiment, the control valve 30 is provided on both the common section 211 and the branch section 212, and the flow rate of the common section 211 and the branch section 212 can be controlled by the control valve 30. The control valve 30 is mainly used to solve the flow distribution / drift problem of each electronic node 90 in the parallel whole cabinet server. Since there is a flow drift problem between different whole cabinet servers, the flow distribution between the whole cabinet servers can be dynamically adjusted by the control valve 30 on the common section 211. The control valve 30 on the branch section 212 is used to control the heat exchange of the back plate 81 where the first section 21 is located. In winter, the opening of the control valve 30 can be reduced or even closed to reduce the heat exchange of the back plate 81 to avoid the internal temperature of the machine room being too low. In summer, the control valve 30 can be fully opened to increase the heat exchange of the back plate 81 to avoid the internal temperature of the machine room being too high.

[0037] It should be noted that the configuration of the first segment 21 is not only applicable to the whole cabinet server, but also to the single-node server.

[0038] like Figure 7As shown, in the case where there are multiple electronic nodes 90 of the whole cabinet server, this embodiment divides the third components 93 into multiple groups, and the third components 93 of different groups are arranged in layers and arranged in the same or different electronic nodes 90. This embodiment groups the third components 93 according to their types, so that the electronic nodes 90 are divided into computing nodes including central processing modules and graphic nodes including graphic processing modules, wherein the computing nodes and the graphic nodes are respectively located at different layers of the cabinet 80. Based on this, there are multiple third segments 23 in this embodiment, each of which is connected to the first segment 21, and each of which is located at different groups of third components 93. Since the third segments 23 cooperate with each computing node and graphic node respectively, the cooling medium in the first segment 21 can be diverted to each third segment 23, and then enter different electronic nodes 90 respectively, and cooperate with the components therein for heat exchange, thereby realizing heat exchange of the whole cabinet server.

[0039] Correspondingly, in addition to having multiple third components 93, the second components 92 of the whole cabinet server are also multiple, and the layers where the third components 93 of different groups are located are all provided with second components 92, so that each electronic node 90 is provided with a third component 93 and a second component 92. Correspondingly, there are also multiple second segments 22, and each second segment 22 is located at the second component 92 of different layers, and is connected to the third segment 23 of the same layer, so that each electronic node 90 is provided with a second segment 22. In this way, the cooling medium of the first segment 21 is diverted to the third segment 23 of each electronic node 90, and then enters the second segment 22 of the electronic node 90 through the third segment 23, and then converges from the second segment 22 to enter the condensing device 10 together, thereby realizing the cooling and heat dissipation of each electronic node 90 in the whole cabinet server.

[0040] Of course, the specific arrangement of the third component 93 and the second component 92 can also be adjusted as needed, and different groups of third components 93 and second components 92 can also be set in the same electronic node 90, and the third components 93 can also be grouped according to other factors, not limited to the classification by type in this embodiment. And the number of third components 93 and second components 92 in the same electronic node 90 can also be set as needed, and one or more can be set, so that the electronic node 90 can have multiple functions. At this time, the third segment 23 and the second segment 22 in the electronic node 90 can be further designed as needed, such as adding a parallel structure, so that the components that need heat dissipation in the electronic node 90 can cooperate with the corresponding segments to achieve comprehensive heat dissipation.

[0041] In this embodiment, the electronic equipment liquid cooling system further includes a flow meter 40 and a valve 50, and the inlet end of the second segment 22 is provided with the flow meter 40 and the valve 50. The flow meter 40 and the valve 50 can control the flow of the cooling medium entering each electronic node 90, and can cooperate with the aforementioned control valve 30 to dynamically adjust the flow of the cooling medium in each electronic node 90 of the entire cabinet server, so as to achieve the effect of matching the flow with the power consumption, and further improve the cooling effect.

[0042] The electronic equipment liquid cooling system of this embodiment also includes a collection device 60 and a control device 70. The collection device 60 is electrically connected to the flow meter 40. The collection device 60 can use the flow data in the flow meter 40 and the power consumption of each component. The control device 70 is electrically connected to the collection device 60, the valve 50, the control valve 30 and other components. The control device 70 can receive and process the flow data and power consumption collected by the collection device 60, thereby controlling the opening of the control valve 30 and the valve 50 according to the flow data and the power consumption, thereby realizing the association of power consumption and flow, realizing dynamic adjustment of the cooling conditions of each component, increasing the flow for components or electronic nodes 90 with increased power consumption, and reducing the flow for components or electronic nodes 90 with reduced power consumption, thereby solving the problem of flow drift. This embodiment, through the design of the coordination mode between the liquid cooling pipeline 20 and the components with different power consumption, plus the above-mentioned dynamic adjustment between flow and power consumption, cooperates with each other as a whole, so that the electronic equipment can be stably and reliably cooled and dissipated.

[0043] It should be noted that the dynamic adjustment design of the above-mentioned control valve 30, flow meter 40 and valve 50 is applicable to both the whole cabinet server and the single-node server. When used for the whole cabinet server, it mainly adjusts the power consumption and flow of each electronic node 90, while when used for the single-node server, it mainly adjusts the power consumption and flow of each component.

[0044] The electronic equipment liquid cooling system of this embodiment further includes a circulation pump, which is arranged on the liquid cooling pipeline 20, and in this embodiment is arranged at the outlet of the condensing device 10, so that the circulation pump provides power for the flow of the cooling medium. Since this embodiment fully utilizes the absorption potential of the cooling medium, the power consumption of the circulation pump can be utilized as much as possible, which not only completely eliminates the cavitation risk of the circulation pump faced by the server, but also greatly saves the power consumption of the circulation pump. At the same time, since the supercooling degree at the inlet of the circulation pump meets the requirements, the service life and reliability of the circulation pump are extended.

[0045] like Figures 2 to 7As shown, this embodiment also provides an electronic device, including a cabinet 80, at least one electronic node 90 and the above-mentioned electronic device liquid cooling system, wherein the electronic node 90 is arranged in the cabinet 80, and the electronic node 90 includes a first component 91, a second component 92 and a third component 93, and the electronic node 90 can be one or more. When the electronic node 90 is one, the electronic device is a single-node server, and when the electronic node 90 is multiple, the electronic device is a whole cabinet server. The liquid cooling pipeline 20 is arranged between the cabinet 80 and the electronic node 90. The specific arrangement of the liquid cooling pipeline 20 refers to the description of the above-mentioned electronic device liquid cooling system, which will not be repeated here. The electronic equipment formed by the above-mentioned electronic equipment liquid cooling system can not only fundamentally solve the leakage risk of the current mainstream whole cabinet single-phase liquid cooling server and the problem of being unable to cope with high heat-density components, but also completely eliminate the cavitation risk of the circulation pump faced by the whole cabinet two-phase liquid cooling server, save 60% of the power consumption of the circulation pump, improve the heat dissipation efficiency of the condenser end by 50%, reduce the volume and cost of the condensing heat exchanger of the condensing device by 50%, and solve the flow drift problem of parallel whole cabinet liquid cooling servers.

[0046] The electronic node 90 mentioned in this embodiment includes but is not limited to at least one of a computing node, a switching node and a storage node.

[0047] When there is only one electronic node 90, that is, the electronic device is a single-node device, such as a single-node server, switch, or router, the first component 91, the second component 92, and the third component 93 are all arranged in the electronic node 90. At this time, the liquid cooling pipeline 20 is arranged in the electronic node 90, and heat exchanges with the first component 91, the third component 93, and the second component 92 in sequence to achieve a cooling and heat dissipation effect. At this time, the series-parallel structure of the liquid cooling pipeline 20 can be set according to the components that need to dissipate heat. For example, if three third components 93 are arranged, the third segment 23 can be divided into three parallel branches, and the three parallel branches respectively exchange heat with three third components 93.

[0048] When there are multiple electronic nodes 90, that is, the electronic device is a complete device, such as a complete cabinet server, as shown in FIG. Figure 2 As shown, each electronic node 90 can be arranged in layers in the cabinet 80 in sequence. At this time, the first section 21 of the liquid cooling pipeline 20 can be integrally installed between each electronic node 90 and pass through the heat dissipation area of ​​the first component 91 of each electronic node 90, so that it can respectively cooperate with the first component 91 of each electronic node 90 for heat exchange, and the second section 22 and the third section 23 are respectively installed in each electronic node 90, so that each electronic node 90 is provided with the second section 22 and the third section 23 of the liquid cooling pipeline 20, and the second section 22 and the third section 23 can cooperate with the second component 92 and the third component 93 in the respective electronic node 90 for heat exchange.

[0049] Optionally, the first component 91 includes at least one of an input / output module and a hard disk module, the second component 92 includes at least one of a power module and a storage module, and the third component 93 includes at least one of a graphics processing module and a central processing module. Of course, the first component 91, the second component 92, and the third component 93 are not limited to the specific examples mentioned above in this embodiment, and they can also be increased or decreased as needed, and more components such as a fourth component and a fifth component can be added as needed.

[0050] like Figure 3 and Figure 7 As shown, the electronic device of this embodiment also includes a distributor and collector 100. Since the function of the distributor and collector 100 is to divide and converge the flow between the first segment 21 of the whole cabinet server and the third segment 23 in each electronic node 90, and between the second segment 22 in each electronic node 90 and the condensing device 10, the distributor and collector 100 is mainly used on the whole cabinet server. For a single-node server, the distributor and collector 100 may be set as needed, or the distributor and collector 100 may not be set. In the scenario based on the whole cabinet server, in this embodiment, a distributor 100 is arranged between the first segment 21 and the third segment 23, and between the second segment 22 and the condensing device 10, more specifically, it is arranged on the inner side of the back plate 81 of the cabinet 80, so that the cooling medium of the first segment 21 is diverted to the third segment 23 of each electronic node 90 through the distributor 100, and after passing through the third segment 23 and the second segment 22, the cooling medium of each second segment 22 is again converged to the condensing device 10 through the distributor 100.

[0051] The above-mentioned divider and collector 100 can be arranged in multiple forms to respectively realize the functions of diverting to the third segment 23 and converging to the condensing device 10, or a single divider and collector 100 can be arranged, which has two independent structural functions of diverting and converging, thereby realizing the effects of diverting and converging at the same time.

[0052] Optionally, the electronic device includes a first cooling device 110, which is arranged at the first component 91. The first cooling device 110 has a heat dissipation area, and the first segment 21 of the liquid cooling pipeline 20 passes through the heat dissipation area and absorbs the heat of the first component 91. Considering that the first component 91 is a component with low power consumption, the first cooling device 110 can be used to cool the first component 91. The first cooling device 110 is preferably in the form of an air cooling device, which is connected to the first component 91, so as to achieve air cooling and heat dissipation of the first component 91. At this time, the air outlet of the air cooling device is used as the heat dissipation area, and the branch segment 212 of the first segment 21 passes through the heat dissipation area, thereby exchanging heat with the hot air in the heat dissipation area to achieve the cooling effect of the first component 91. The air cooling device drives the cold air to pass through the first component 91 to form hot air, and the hot air is converted into cold air through the heat exchange between the first segment 21 and the first segment 21, and is blown out of the cabinet 80.

[0053] like Figure 4 As shown, the cabinet 80 of this embodiment includes a back panel 81, and the air cooling device is arranged at the back panel 81. The air cooling device can be embedded in the back panel 81 or arranged on the inner side of the back panel 81. Ventilation holes are opened on the back panel 81. The heat dissipation area of ​​the air cooling device faces the ventilation holes of the back panel 81, so that the air cooling device can discharge hot air from the ventilation holes to the computer room, and the first section 21 of the liquid cooling pipeline 20 is passed through the back panel 81. The first segment 21 of the present embodiment is provided with four major segments, namely an inlet segment, an outlet segment, two parallel segments and a transition segment, wherein the inlet segment and the outlet segment serve as a common segment 211, and the parallel segment serves as a branch segment 212, both of which extend longitudinally, and the inlet segment and the outlet segment are both located below the parallel segment, and the two parallel segments are arranged laterally with intervals, and a transition segment is provided on the top of the two parallel segments, and the transition segment is connected to the two parallel segments at the same time, so that the flow path of the first segment 21 is: an inlet segment, a parallel segment, a transition segment, another parallel segment, and an outlet segment, and the cooling medium flowing out of the outlet segment is diverted by the distributor 100, and then passes through the flow meter 40 and the valve 50 again to enter the third segment 23 of each electronic node 90.

[0054] like Figure 5 As shown, for the graphic node, a graphic processing module as the third component 93 and a power supply module as the second component 92 are arranged inside it. There are multiple graphic processing modules, and thus the third segment 23 is provided with multiple parallel parts. The cooling medium flowing out from the back plate 81 enters the third segment 23, is divided in the third segment 23, undergoes phase change through each graphic processing module to absorb heat, and becomes saturated steam with a dryness of about 1. Then, it passes through the power supply module, absorbs the heat of the power supply module by convection of high-speed steam, and then enters the distributor 100 to converge to the condenser in the condensation device 10 to be re-condensed into a liquid with a certain degree of supercooling.

[0055] like Figure 6 As shown, for the computing node, a central processing module as the third component 93 and a storage module as the second component 92 are arranged inside it, and there are multiple central processing modules, so the third segment 23 is provided with multiple parallel parts. The cooling medium flowing out from the back plate 81 enters the third segment 23, is divided in the third segment 23, undergoes phase change through each central processing module to absorb heat, and then becomes saturated steam with a dryness of about 1, and then passes through the storage module, absorbs the heat of the storage module by convection of high-speed steam, and then enters the distributor 100 to converge to the condenser in the condensing device 10 to be re-condensed into a liquid with a certain degree of supercooling.

[0056] In general, the present application utilizes a supercooled coolant with a certain degree of supercooling in a condensing device as a cooling medium. The coolant first absorbs the heat discharged by air cooling from the low-power components inside the node through the backplane. The saturated liquid refrigerant at the backplane outlet enters the distributor 100 inside the node, and then enters the node to cool the high-power components. After the refrigerant becomes saturated steam, it enters the medium-power components. After the heat dissipation of the medium-power components is solved by using high-speed flowing superheated steam, it enters the condensing device to condense into liquid refrigerant, and then enters the circulation pump, and the cycle continues.

[0057] like Figure 8 As shown, this embodiment also provides a liquid cooling control method for electronic equipment, which is executed by the above-mentioned electronic equipment. The liquid cooling control method for electronic equipment includes: obtaining the node power consumption of each component in the electronic equipment and the node flow of the liquid cooling pipeline 20 where the component is located, comparing the relationship between the node power consumption and the node flow with the preset condition, if the preset condition is not met, controlling and adjusting the opening of the valve 50 on the electronic equipment until the relationship between the node power consumption and the node flow meets the preset condition; obtaining the whole machine power consumption of the electronic equipment and the whole machine flow of the liquid cooling pipeline 20, comparing the relationship between the whole machine power consumption and the whole machine flow with the preset condition, if the preset condition is not met, controlling and adjusting the opening of the control valve 30 at the entrance of the liquid cooling pipeline 20 until the relationship between the whole machine power consumption and the whole machine flow meets the preset condition. Through the above-mentioned real-time collection and monitoring of the power consumption and flow of each component, electronic node 90 and the electronic equipment as a whole, the dynamic adjustment of the flow distribution is realized, the effect of matching the flow and power consumption is achieved, thereby avoiding the problem of flow drift and further improving the cooling effect.

[0058] In this embodiment, the preset conditions include: the relationship between flow and power consumption is: power consumption = subcooling × mass flow × liquid refrigerant specific heat + latent heat of vaporization × mass flow + superheat × mass flow × superheated steam specific heat; wherein, subcooling and superheat are preset values, mass flow is obtained by flow meter 40, and latent heat of vaporization, liquid refrigerant specific heat, and superheated steam specific heat are physical parameters. After obtaining the corresponding parameters, the control device 70 calculates whether the power consumption and flow are satisfied according to the above relationship, so that the flow can be adjusted so that the power consumption and flow of each component and electronic node 90 meet the requirements.

[0059] In this embodiment, the electronic equipment liquid cooling control method further includes: when the node power consumption and the node flow, the whole machine power consumption and the whole machine flow meet the preset conditions, obtaining a shutdown instruction, and when the shutdown instruction is not obtained, repeatedly obtaining the node power consumption of each component in the electronic equipment and the node flow of the liquid cooling pipeline 20 where they are located, and obtaining the whole machine power consumption of the electronic equipment and the whole machine flow of the liquid cooling pipeline 20. The above process is to achieve the purpose of real-time collection and monitoring, so that the electronic equipment is in a real-time monitoring state of flow balance when in use, ensuring that problems such as flow drift will not occur.

[0060] In this embodiment, the liquid cooling control method for electronic equipment also includes: obtaining the ambient temperature, controlling the opening of the control valve 30 on the branch section 212 of the liquid cooling pipeline 20 according to the ambient temperature, and the ambient temperature is proportional to the opening of the control valve 30 on the branch section 212 of the liquid cooling pipeline 20. As mentioned above, when the ambient temperature is too low in winter, the opening of the control valve 30 can be reduced or even closed to reduce the heat exchange of the back plate 81 to avoid the temperature inside the machine room being too low. In summer, the control valve 30 can be fully opened to increase the heat exchange of the back plate 81 to avoid the temperature inside the machine room being too high. In this way, liquid cooling and environmental heat dissipation complement each other and work together to achieve efficient cooling and heat dissipation of electronic equipment.

[0061] It should be noted that, the multiple in the above embodiments refers to at least two.

[0062] From the above description, it can be seen that the electronic equipment liquid cooling system of the present invention optimizes the design of the coordination relationship between the first component 91, the second component 92, the third component 93 and the liquid cooling pipeline 20, and adopts the form of the liquid cooling pipeline 20 passing through the first component 91, the third component 93, and the second component 92 in sequence, so that the cooling medium in the liquid cooling pipeline 20 fully utilizes the absorption potential of each phase when the gas-liquid two-phase state changes, and combines the heat dissipation characteristics of each component, so as to achieve the highest effect of heat dissipation effect, and achieve the purpose of greatly improving the cooling effect of the two-phase liquid cooling system. At the same time, the electronic equipment of the present application can not only fundamentally solve the leakage risk of the current mainstream whole cabinet single-phase liquid cooling server and the problem of being unable to cope with high heat density components, but also completely eliminate the cavitation risk of the circulating pump faced by the whole cabinet two-phase liquid cooling server, save 60% of the power consumption of the circulating pump, improve the heat dissipation efficiency of the condenser end by 50%, reduce the volume and cost of the condensing heat exchanger of the condensing device by 50%, and solve the flow drift problem of the parallel whole cabinet liquid cooling server.

[0063] The above is a detailed introduction to an electronic device liquid cooling system, an electronic device, and an electronic device liquid cooling control method provided by the present application. This article uses specific examples to illustrate the principles and implementation methods of the present application. The description of the above embodiments is only used to help understand the method of the present application and its core idea. It should be pointed out that for ordinary technicians in this technical field, without departing from the principles of the present application, several improvements and modifications can be made to the present application, and these improvements and modifications also fall within the scope of protection of the claims of the present application.

Claims

1. A liquid cooling system for electronic equipment, characterized in that: include: Condensing device (10); A liquid cooling pipeline (20), the liquid cooling pipeline (20) being in communication with the condensing device (10), the cooling medium in the liquid cooling pipeline (20) sequentially passing through a first component (91), a third component (93), and a second component (92) of the electronic device, and flowing back to the condensing device (10), the heat consumption of the third component (93) being greater than that of the first component (91) or the second component (92), and the gas-liquid state of the cooling medium changing when passing through at least one component.

2. The electronic equipment liquid cooling system according to claim 1, characterized in that: The heat generation and power consumption of the first component (91), the second component (92), and the third component (93) are sequentially from low to high.

3. The electronic equipment liquid cooling system according to claim 1, characterized in that: The undersaturated liquid medium in the condensing device (10) absorbs heat at the first component (91) to form a saturated liquid medium, then absorbs heat at the third component (93) to form a saturated steam medium, then absorbs heat at the second component (92) to form superheated steam, and then condenses at the condensing device (10) to form an undersaturated liquid medium.

4. The electronic equipment liquid cooling system according to claim 1, characterized in that: The liquid cooling pipeline (20) comprises a first segment (21), a third segment (23), and a second segment (22) which respectively cooperate with the first component (91), the third component (93), and the second component (92) for heat exchange; the first segment (21), the second segment (22), and the third segment (23) are located at the same electronic node (90) of the electronic device.

5. The electronic equipment liquid cooling system according to claim 4, characterized in that: The first segment (21) comprises a common segment (211) and a plurality of branch segments (212), each of the branch segments (212) being butt-jointed and connected to the common segment (211), and the branch segments (212) are located within a heat dissipation area of ​​the first component (91).

6. The electronic equipment liquid cooling system according to claim 1, characterized in that: The liquid cooling pipeline (20) comprises a first segment (21), a third segment (23), and a second segment (22) which respectively cooperate with the first component (91), the third component (93), and the second component (92) for heat exchange, and at least one of the first segment (21), the second segment (22), and the third segment (23) is located at a different electronic node (90) of the electronic device.

7. The electronic equipment liquid cooling system according to claim 6, characterized in that: The first segment (21) comprises a common segment (211) and a plurality of branch segments (212), each of the branch segments (212) being butt-jointed and connected to the common segment (211), and the branch segments (212) are located within a heat dissipation area of ​​the first component (91).

8. The electronic equipment liquid cooling system according to claim 7, characterized in that: The electronic equipment liquid cooling system further comprises a control valve (30) for controlling flow, and the control valve (30) is arranged on the common section (211) and / or at least one of the branch sections (212).

9. The electronic equipment liquid cooling system according to claim 6, characterized in that: The third components (93) are multiple and divided into multiple groups. The third components (93) of different groups are arranged in layers and arranged in the same or different electronic nodes (90). The third segments (23) are multiple, each of the third segments (23) is connected to the first segment (21), and each of the third segments (23) is located at the third components (93) of different groups.

10. The electronic equipment liquid cooling system according to claim 9, characterized in that: There are a plurality of second components (92), and the layers where the third components (93) of different groups are located are all provided with the second components (92); there are a plurality of second segments (22), and each second segment (22) is located at the second components (92) of different layers, and is butt-jointed and connected with the third segments (23) of the same layer.

11. The electronic equipment liquid cooling system according to claim 9, characterized in that: The electronic equipment liquid cooling system further comprises a flow meter (40) and a valve (50), and the flow meter (40) and the valve (50) are arranged at the inlet end of the second segment (22).

12. The electronic equipment liquid cooling system according to claim 11, characterized in that: The electronic equipment liquid cooling system further comprises a collection device (60) and a control device (70), wherein the collection device (60) is electrically connected to the flow meter (40), and the control device (70) is electrically connected to the collection device (60) and the valve (50).

13. An electronic device, characterized in that: include: Cabinet (80); At least one electronic node (90), the electronic node (90) being arranged in the cabinet (80), the electronic node (90) comprising a first component (91), a second component (92), and a third component (93); In the electronic equipment liquid cooling system according to any one of claims 1 to 12, a liquid cooling pipeline (20) is provided between the cabinet (80) and the electronic node (90).

14. The electronic device according to claim 13, characterized in that: The electronic device is a single-node device, and the liquid cooling pipeline (20) is arranged in the electronic node (90) of the single-node device and performs heat exchange with the first component (91), the third component (93), and the second component (92) in sequence.

15. The electronic device according to claim 13, characterized in that: There are a plurality of electronic nodes (90), the first section (21) of the liquid cooling pipeline (20) passes through the heat dissipation area of ​​the first component (91) of each electronic node (90), and each electronic node (90) is provided with a second section (22) and a third section (23) of the liquid cooling pipeline (20).

16. The electronic device according to claim 15, characterized in that: The electronic device further comprises a distributor (100), wherein the distributor (100) is arranged between the first segment (21) and the third segment (23), and between the second segment (22) and the condensing device (10); the cooling medium of the first segment (21) is distributed to each of the third segments (23) via the distributor (100), and the cooling medium of each of the second segments (22) is converged to the condensing device (10) via the distributor (100).

17. The electronic device according to claim 13, characterized in that: The first component (91) includes at least one of an input / output module and a hard disk module, the second component (92) includes at least one of a power module and a storage module, and the third component (93) includes at least one of a graphics processing module and a central processing module.

18. The electronic device according to claim 13, characterized in that: The electronic device comprises a first cooling device (110), the first cooling device (110) being arranged at the first component (91), the first cooling device (110) having a heat dissipation area, and the first section (21) of the liquid cooling pipeline (20) passing through the heat dissipation area and absorbing heat of the first component (91).

19. The electronic device according to claim 18, characterized in that: The first cooling device (110) is an air cooling device, the air cooling device is connected to the first component (91), and the air outlet of the air cooling device serves as the heat dissipation area.

20. The electronic device according to claim 19, characterized in that: The cabinet (80) has a back plate (81), the air cooling device is arranged on the inner side of the back plate (81) and the heat dissipation area of ​​the air cooling device faces the back plate (81), and the first section (21) of the liquid cooling pipeline (20) is located at the back plate (81).

21. A liquid cooling control method for electronic equipment, characterized in that: The electronic device according to any one of claims 13 to 20 is used to perform the liquid cooling control method of the electronic device, comprising: Obtaining the node power consumption of each component in the electronic device and the node flow rate of the liquid cooling pipeline (20) in which the component is located, comparing the relationship between the node power consumption and the node flow rate with a preset condition, and if the preset condition is not satisfied, controlling and adjusting the opening of the valve (50) on the electronic device until the relationship between the node power consumption and the node flow rate satisfies the preset condition; The whole machine power consumption of the electronic device and the whole machine flow rate of the liquid cooling pipeline (20) are obtained, and the relationship between the whole machine power consumption and the whole machine flow rate is compared with the preset condition. If the preset condition is not met, the opening of the control valve (30) at the inlet of the liquid cooling pipeline (20) is controlled and adjusted until the relationship between the whole machine power consumption and the whole machine flow rate meets the preset condition.

22. The electronic equipment liquid cooling control method according to claim 21, characterized in that: The preset conditions include: The relationship between flow rate and power consumption is: Power consumption = subcooling × mass flow rate × specific heat of liquid refrigerant + latent heat of vaporization × mass flow rate + superheat × mass flow rate × specific heat of superheated steam; The subcooling degree and the superheating degree are preset values, the mass flow rate is obtained through a flow meter (40), and the latent heat of vaporization, the specific heat of the liquid refrigerant, and the specific heat of the superheated steam are physical property parameters.

23. The electronic equipment liquid cooling control method according to claim 21, characterized in that: The electronic equipment liquid cooling control method further includes: When the preset conditions are satisfied between the node power consumption and the node flow, and between the whole machine power consumption and the whole machine flow, a shutdown instruction is obtained; when the shutdown instruction is not obtained, the process of obtaining the node power consumption of each component in the electronic device and the node flow of the liquid cooling pipeline (20) in which the component is located, and the process of obtaining the whole machine power consumption of the electronic device and the whole machine flow of the liquid cooling pipeline (20) are repeated.

24. The electronic equipment liquid cooling control method according to claim 21, characterized in that: The electronic equipment liquid cooling control method further includes: The ambient temperature is obtained, and the opening of the control valve (30) on the branch section (212) of the liquid cooling pipeline (20) is controlled according to the ambient temperature, and the ambient temperature is proportional to the opening of the control valve (30) on the branch section (212) of the liquid cooling pipeline (20).

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