PCBA board processing production line intelligent control system

Abstract

The invention relates to the technical field of PCBA board production and manufacturing, in particular to an intelligent control system for a PCBA board processing production line. According to the system, PCBs and electronic elements are processed into PCBA boards through a fixing module, a printing module and a welding module, then an abnormal ratio is calculated based on the number of abnormal PCBA boards detected by a detection module and the total number of the PCBA boards through an analysis unit, and whether the processing process of the PCBA boards meets the standard or not is judged based on the abnormal ratio; a corresponding processing mode is determined based on the judgment result, the corresponding processing mode comprises the steps that the PCBA board is output, or a corresponding instruction is generated based on the determined reason that the PCBA board does not meet the standard, a control unit adjusts operation parameters of the corresponding device according to the instruction, and the parameters comprise the judgment benchmark of an analysis unit, the solder paste supplementing frequency of a printing module and the clamping force of a fixing module. And the production efficiency of the PCBA board processing process is improved by correcting the operation parameters.

Description

Technical Field

[0001] The present invention relates to the technical field of PCBA board production and manufacturing, and in particular to an intelligent control system for a PCBA board processing production line. Background Art

[0002] PCBA board, also known as printed circuit board, is an important electronic component. The current processing of PCBA board usually involves printing solder paste on PCB board, then using SMT patch to place electronic components on the pads coated with solder paste on the PCB board, then soldering the electronic components to the PCB board through reflow soldering to obtain PCBA board, and then using testing equipment to test the PCBA board to ensure that the PCBA board can be used normally, and then repairing it when an abnormal PCBA board is detected.

[0003] At present, the existing technology only detects abnormal PCBA boards and repairs them when inspecting the processed PCBA boards, but lacks a means to analyze the inspection results and adjust the processing production line of the PCBA boards based on the analysis results, so as to improve the qualified rate of PCBA board processing by adjusting the production line. Summary of the invention

[0004] To this end, the present invention provides an intelligent control system for a PCBA board processing production line to solve the problem in the prior art of lacking analysis based on detection results and adjusting corresponding devices of the production line based on the analysis results, thereby improving the qualified rate of PCBA boards.

[0005] To achieve the above object, the present invention provides an intelligent control system for a PCBA board processing production line, comprising:

[0006] An input module is used to convey a number of PCB boards and a number of electronic components;

[0007] A fixing module, which is arranged at the output end of the input module and is used to clamp and fix a plurality of the PCB boards and a plurality of the electronic components;

[0008] A printing module, which is arranged on one side of the fixing module, is used to fix the printed board with holes on the surface of the PCB board, and the positions of the holes correspond to the positions of the pads on the PCB board, and to apply solder paste to the pads on the PCB board through the printed board with holes;

[0009] A welding module, which is arranged on the other side of the fixing module, and is used to weld a plurality of the electronic components to the pad positions of the PCB board to obtain a PCBA board;

[0010] A conveying module, which is arranged at the output end of the fixing module and is used to convey a plurality of the PCBA boards;

[0011] A detection module, which is arranged at the output end of the conveying module, and is used to perform a path detection on a plurality of the PCBA boards to determine whether there is an abnormality in the path of the PCBA boards;

[0012] An analysis unit connected to the detection module is used to determine the number of abnormal PCBA boards based on the detection results, determine whether the PCBA board processing process meets the standards based on the abnormal ratio, and determine a corresponding processing method based on the determination result, including: outputting the PCBA board if it meets the standards, or generating a corresponding instruction based on the determined reason for not meeting the standards, wherein the abnormal ratio is the ratio between the number of abnormal PCBA boards and the total number of PCBA boards;

[0013] A control unit, which is respectively connected to the analysis unit, the detection unit, the printing module and the fixing module, is used to adjust the operating parameters of the corresponding device based on the instructions, and the parameters include: the judgment basis of the analysis unit, the solder paste replenishment frequency of the printing module and the clamping force of the fixing module.

[0014] Further, the analysis unit is used to re-determine whether the PCBA board processing process meets the standards based on the comparison result of the abnormal ratio and the preset abnormal ratio pre-stored in the analysis unit, or based on the total number of the PCB boards delivered by the input module, and, when it is determined that the PCBA board processing process does not meet the standards, determine the reason for non-compliance with the standards based on the average value, wherein the average value is the ratio between the total number of abnormal paths and the total number of abnormal PCBA boards.

[0015] Further, the analysis unit is also used to re-determine whether the PCBA board processing process does not meet the standard based on the comparison result of the total number of PCB boards with the preset total number of PCB boards pre-stored in the analysis unit, or to reduce the preset abnormal ratio pre-stored in the analysis unit based on the quantity difference, wherein the quantity difference is the difference between the preset total number of PCB boards and the total number of PCB boards.

[0016] Furthermore, the analysis unit is also used to reduce the preset abnormality ratio based on the comparison result of the quantity difference with the preset quantity difference pre-stored in the analysis unit, and the reduction degree of the preset abnormality ratio is proportional to the quantity difference.

[0017] Furthermore, the analysis unit is also used to determine the reason why the PCBA board processing process does not meet the standards based on the comparison result of the average value and the preset average value pre-stored in the analysis unit, and generate a corresponding correction method based on the determined reason, including: increasing the solder paste replenishment frequency of the printing module, increasing the clamping force of the fixing module, or obtaining the variance based on the total number of abnormal paths and redetermining the reason for not meeting the standards based on the variance.

[0018] Furthermore, the analysis unit is also used to increase the solder paste replenishment frequency of the printing module based on the comparison result of the average spacing distance and the preset average spacing distance pre-stored in the analysis unit, and the increase in the solder paste replenishment frequency is inversely proportional to the average spacing distance, wherein the detection unit is also used to detect several of the PCBA boards in sequence and obtain the spacing distance between any two adjacent abnormal PCBA boards, and the analysis unit is also used to calculate the average spacing distance based on the several spacing distances.

[0019] Furthermore, the analysis unit is also used to reduce the replenishment frequency on the basis of the adjusted solder paste replenishment frequency based on the comparison result of the number of abnormal clusters with the preset number of abnormal clusters pre-stored in the analysis unit, and the reduction range is proportional to the number of abnormal clusters, wherein a single abnormal cluster refers to the continuous appearance of more than two abnormal PCBA boards in the same batch of PCBA boards when they are inspected sequentially.

[0020] Furthermore, the analysis unit is also used to redetermine the reason why the PCBA board processing process does not meet the standard based on the comparison result of the variance with the preset variance pre-stored in the analysis unit, and generate a corresponding correction method based on the determined reason, including: increasing the clamping force of the fixing module, or increasing the solder paste replenishment frequency of the printing module.

[0021] Furthermore, the analysis unit is also used to correct the installation coordinates of the electronic component based on a comparison result of the overlap of the abnormal path and a preset overlap pre-stored in the analysis unit, wherein the overlap of the abnormal path refers to the number of times a single abnormal path appears in the same position in several abnormal PCBA boards in the same batch.

[0022] Furthermore, the analysis unit is also used to increase the clamping force of the fixing module based on the comparison result of the average value difference and the preset average value difference pre-stored in the analysis unit, and the increase in the clamping force is proportional to the average value difference, wherein the average value difference is the difference between the average value and the preset average value.

[0023] Compared with the prior art, the beneficial effect of the intelligent control system of a PCBA board processing production line of the present invention is that the system processes PCB boards and electronic components into PCBA boards through a fixing module, a printing module and a welding module, and then calculates an abnormal ratio based on the number of abnormal PCBA boards detected by the detection module and the total number of PCBA boards through an analysis unit, and determines whether the processing process of the PCBA board meets the standard based on the abnormal ratio, and determines a corresponding processing method based on the determination result, including: outputting the PCBA board, or generating a corresponding instruction based on the determined reason for non-compliance with the standard, and the control unit adjusts the operating parameters of the corresponding device on the production line according to the instruction, the parameters including: the determination basis of the analysis unit, the solder paste replenishment frequency of the printing module and the clamping force of the fixing module, and the qualified rate of the PCBA board processing process is improved by correcting the operating parameters of the corresponding device.

[0024] Furthermore, the present invention not only determines whether the PCBA board processing process meets the standards based on the abnormal ratio, but also re-determines whether the PCBA board processing process meets the standards based on the total number of PCB boards delivered by the input module, thereby reducing the occurrence of misjudgment, thereby improving the determination accuracy when determining whether the PCBA board processing process meets the standards.

[0025] Furthermore, when the present invention determines that the PCBA board processing process meets the standard during the re-determination process, it is also necessary to reduce the preset abnormality ratio of the analysis unit based on the comparison result of the quantity difference and the preset quantity difference, and determine the reduction range of the preset abnormality ratio according to the quantity difference, thereby improving the judgment basis for the judgment of the processing process.

[0026] Furthermore, the present invention also determines the specific reasons why the PCBA board processing process does not meet the standards based on the comparison result of the average value and the preset average value pre-stored in the analysis unit, and generates a corresponding correction method based on the determined reason, thereby improving the qualified rate of the PCBA board.

[0027] Furthermore, the present invention also determines the solder paste replenishment frequency of the adjustment printing module based on the average spacing distance and the number of abnormal clusters, and reduces the number of abnormal paths on the abnormal PCBA board by adjusting the solder paste replenishment frequency, thereby improving the qualified rate of the PCBA board.

[0028] Furthermore, the present invention also re-determines the reason why the processing process of the PCBA board does not meet the standard based on the variance, further determines the specific reason for processing the abnormal PCBA board, and improves the accuracy of determining the cause.

[0029] Furthermore, after determining the abnormal PCBA board, the present invention corrects the installation coordinates of the electronic components based on the overlap of the abnormal paths, thereby reducing the occurrence of abnormal PCBA boards caused by installation coordinate deviations, thereby reducing the number of abnormal paths on the PCBA board and improving the qualified rate of the PCBA board.

[0030] Furthermore, the present invention also increases the clamping force of the fixing module based on the comparison result of the average value difference and the preset average value difference, and determines the increase range of the clamping force according to the average value difference to reduce the number of abnormal PCBA boards and improve the qualified rate of PCBA boards. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] Figure 1 It is a module schematic diagram of the intelligent control system of the PCBA board processing production line of the present invention;

[0032] Figure 2 This is a schematic diagram of the structure of the intelligent control system of the PCBA board processing production line of the present invention;

[0033] Figure 3 It is a schematic diagram of the process of the intelligent control system of the PCBA board processing production line of the present invention;

[0034] Figure 4 It is a flow chart of the present invention for determining whether the PCBA board processing process meets the standard based on the abnormal ratio;

[0035] Figure 5 The present invention is a flowchart of determining the reasons why the PCBA board processing process does not meet the standards based on the average value and correcting the reasons.

[0036] In the figure:

[0037] 1. Input module; 11. Conveying device; 2. Fixing module; 21. Robotic arm; 3. Printing module; 31. Solder paste printer; 32. Perforated printing board; 4. Welding module; 41. Welding gun; 5. Conveying module; 51. Conveyor belt; 6. Detection module. DETAILED DESCRIPTION

[0038] In order to make the objects and advantages of the present invention more clearly understood, the present invention is further described below in conjunction with embodiments; it should be understood that the specific embodiments described herein are only used to explain the present invention and are not used to limit the present invention.

[0039] The preferred embodiments of the present invention are described below with reference to the accompanying drawings. It should be understood by those skilled in the art that these embodiments are only used to explain the technical principles of the present invention and are not intended to limit the protection scope of the present invention.

[0040] It should be noted that, in the description of the present invention, terms such as "up", "down", "left", "right", "inside" and "outside" indicating directions or positional relationships are based on the directions or positional relationships shown in the drawings. This is merely for the convenience of description and does not indicate or imply that the device or element must have a specific orientation, be constructed and operated in a specific orientation. Therefore, it cannot be understood as a limitation on the present invention.

[0041] In addition, it should be noted that in the description of the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For those skilled in the art, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0042] The present embodiment provides an intelligent control system for a PCBA board processing production line, which can be applied in the process of PCBA board (Printed Circuit Board Assembly) processing operation, where a number of electronic components are welded to a PCB board (Printed Circuit Board) to complete a semi-finished product or a finished product after circuit connection, and then the semi-finished product or the finished product is tested to analyze whether the current processing production line meets the production expectations. When it is analyzed based on the test results that the current production line does not meet the standards in the processing process, the reasons for the non-compliance can be determined, and then a corresponding correction method is generated according to the determined reasons to adjust the processing production line, thereby improving the qualified rate of the production line for PCBA board processing, thereby improving the production efficiency of the entire production line.

[0043] See also Figure 1 As shown, it is a module schematic diagram of the intelligent control system of the PCBA board processing production line in this embodiment. Figure 2As shown, it is a structural schematic diagram of the intelligent control system of the PCBA board processing production line in this embodiment. The system includes: an input module 1, a fixing module 2, a printing module 3, a welding module 4, a conveying module 5, a detection module 6, an analysis unit (not shown in the figure), and a control unit (not shown in the figure). The input module 1 is used to convey a number of PCB boards and a number of electronic components; the fixing module 2 is arranged at the output end of the input module 1, and is used to clamp and fix a number of the PCB boards and a number of the electronic components; the printing module 3 is arranged on one side of the fixing module 2, and is used to fix the perforated printed board 32 on the surface of the PCB board and the position of the hole corresponds to the pad position on the PCB board, and to apply the solder paste to the pad position on the PCB board through the perforated printed board 32; the welding module 4 is arranged on the other side of the fixing module 2, and is used to solder a number of the electronic components to the pad position of the PCB board to obtain the PCBA board; the conveying module 5 is arranged at the output end of the fixing module 2, and is used to convey a number of the PCBA boards; the detection module 6 is arranged at the output end of the conveying module 5, and is used to pass through a number of the PCBA boards The circuit is detected to determine whether there is an abnormality in the circuit of the PCBA board; the analysis unit (not shown in the figure) is connected to the detection module 6 to determine the number of abnormal PCBA boards based on the detection results, determine whether the PCBA board processing process meets the standards based on the abnormal ratio, and determine the corresponding processing method based on the determination result, including: outputting the PCBA board if it is determined to meet the standards, or generating corresponding instructions based on the determined reasons for not meeting the standards, wherein the abnormal ratio is the ratio between the number of abnormal PCBA boards and the total number of PCBA boards; the control unit (not shown in the figure) is respectively connected to the analysis unit, the detection unit, the printing module 3 and the fixing module 2, to adjust the operating parameters of the corresponding device based on the instructions, and the parameters include: the determination basis of the analysis unit, the solder paste replenishment frequency of the printing module 3 and the clamping force of the fixing module 2.

[0044] Specifically, in this embodiment, the input module 1 includes a conveying device 11, through which a plurality of PCB boards and a plurality of electronic components to be processed are sent to the next production process, namely, the fixing module 2; the fixing module 2 is arranged at the output end of the input module 1, and the fixing module 2 includes a plurality of mechanical arms 21, through which the corresponding PCB boards and electronic components are clamped and fixed at corresponding positions, that is, fixed at positions where welding is required; the printing module 3 is arranged on one side of the fixing module 2, and the printing module 3 includes a solder paste printer 31 and a perforated printing plate 32, the perforated printed board 32 is provided with holes corresponding to the positions of several pads on the PCB board, and the perforated printed board 32 is fixed and attached to the surface of the PCB board by the solder paste printer 31, and it is ensured that the holes on the perforated printed board 32 correspond to the positions of the pads on the PCB board, so that the positions of several pads on the PCB board can be exposed to the outside through the corresponding holes, and then the solder paste is evenly applied to the pad positions by the solder paste printer 31; the welding module 4 is arranged on the other side of the fixing module 2, and includes a plurality of welding guns 41, and the welding guns 41 are used to The subcomponents are welded to the pad positions on the PCB board one by one, and the PCBA board is obtained after the welding is completed. The welding process is consistent with the prior art and will not be described in detail here. The conveying module 5 is arranged at the output end of the fixing module 2. The conveying module 5 includes a conveyor belt 51. After the welding module 4 welds the electronic components to the PCB board to obtain the PCBA board, the PCBA board is placed on the conveyor belt 51 by the mechanical arm 21 in the fixing module 2, and then the several PCBA boards are conveyed to the next production link, that is, to the detection module 6 connected to the conveying module 5 by the conveyor belt 51. There are several passages on the PCBA board, and the detection module 6 performs one-to-one detection on the several passages on the PCBA board to determine whether there are abnormalities in each passage of the PCBA board, such as short circuit or open circuit. When a PCBA board with abnormal passage appears, it is recorded as an abnormal PCBA board. The passage refers to that several electronic components on the PCBA board can transmit normal electrical signals through the passage after welding is completed. Among them, the detection technology is to detect the open circuit, short circuit and welding condition of the electronic components through online testing (ICT). This is the prior art and will not be described in detail here.The analysis unit is connected to the detection module 6, and the number of abnormal PCBA boards in the current batch is determined based on the detection result of the detection module 6, and then the abnormal ratio is calculated by the number of abnormal PCBA boards and the total number of PCBA boards, and the PCBA board processing process is determined based on the abnormal ratio. The standard that the processing process meets refers to the qualified rate of the PCBA board, that is, the number of PCBA boards that can be used normally in the actual production process meets the production plan, and when it is determined that the PCBA board processing process does not meet the standard, the cause is determined, and the corresponding correction method is generated based on the cause, and the corresponding instruction is generated based on the correction method, wherein the abnormal ratio is the ratio between the number of abnormal PCBA boards and the total number of PCBA boards; the control unit is respectively connected to the analysis unit, the detection unit, the printing module 3 and the fixing module 2, and is used to adjust the operating parameters of the corresponding device based on the instruction, including: adjusting the judgment benchmark for the analysis unit, adjusting the solder paste replenishment frequency for the printing module 3, and adjusting the clamping force for the fixing module 2. ;

[0045] See also Figure 3 As shown, it is a schematic diagram of the process of the intelligent control system of the PCBA board processing production line in this embodiment. The process includes:

[0046] S1: Conveying several PCB boards and several electronic components.

[0047] S2: Clamp and fix a plurality of the PCB boards and a plurality of the electronic components.

[0048] S3: Fix the perforated printed board 32 on the surface of the PCB board with the positions of the holes corresponding to the positions of the pads on the PCB board, and apply solder paste to the positions of the pads on the PCB board through the perforated printed board 32.

[0049] S4: Soldering a plurality of the electronic components to the pad positions of the PCB board to obtain a PCBA board.

[0050] S5: conveying a plurality of PCBA boards.

[0051] S6: Performing path detection on the plurality of PCBA boards to determine whether there is an abnormality in the paths of the PCBA boards.

[0052] S7: Determine the number of abnormal PCBA boards based on the detection results, determine whether the PCBA board processing process meets the standards based on the abnormal ratio, and determine the corresponding processing method based on the determination result, including: outputting the PCBA board if it is determined to meet the standards, or generating corresponding instructions based on the determined reasons for not meeting the standards, wherein the abnormal ratio is the ratio between the number of abnormal PCBA boards and the total number of PCBA boards.

[0053] S8: Based on the instruction, the operating parameters of the corresponding device are adjusted, and the parameters include: the judgment criterion of the analysis unit, the solder paste replenishment frequency of the printing module 3 and the clamping force of the fixing module 2.

[0054] See also Figure 4 As shown, it is a flow chart of determining whether the PCBA board processing process meets the standard based on the abnormal ratio in this embodiment. The analysis unit is used to re-determine whether the PCBA board processing process meets the standard based on the comparison result of the abnormal ratio and the preset abnormal ratio pre-stored in the analysis unit, or based on the total number of the PCB boards delivered by the input module 1, and, if it is determined that the PCBA board processing process does not meet the standard, determine the reason for not meeting the standard based on the average value, wherein the average value is the ratio between the total number of abnormal paths and the total number of abnormal PCBA boards.

[0055] Specifically, in this embodiment, the preset abnormal ratio includes a first preset abnormal ratio and a second preset abnormal ratio, the first preset abnormal ratio is less than the second preset abnormal ratio, and the comparison process based on the abnormal ratio and the preset abnormal ratio is as follows:

[0056] If the abnormality ratio is less than or equal to the first preset abnormality ratio, it means that the number of abnormalities in the several PCBA boards in the current detection cycle is relatively small, and it can be determined that the processing process of the PCBA boards meets the standards, and the subsequent production remains unchanged; if the abnormality ratio is greater than the first preset abnormality ratio and less than or equal to the second preset abnormality ratio, it means that it is impossible to accurately determine whether the processing process meets the standards based on the number of abnormalities in the several PCBA boards in the current detection cycle. At this time, it can be re-determined whether the processing process meets the standards based on the total number of PCB boards delivered by the input module 1 to improve the accuracy of the judgment on the PCBA board processing process and avoid the phenomenon of subsequent production confusion caused by inaccurate judgment; if the abnormality ratio is greater than the second preset abnormality ratio, it means that the number of abnormal PCBA boards detected in the current detection cycle is relatively too large, so it can be determined that there are major problems in the current processing process, the processing process does not meet the standards, and it is necessary to determine the reasons for not meeting the standards based on the average value, wherein the average value is the ratio between the total number of abnormal paths and the total number of abnormal PCBA boards, and the detection module 6 is also used to detect a single abnormal PCBA board to determine the number of its abnormal paths, and the total number of abnormal paths is the sum of the number of abnormal paths on all abnormal PCBA boards. Specifically, in this embodiment, the total number of PCBA boards tested in the same batch is set to 100, the first preset abnormality ratio is assigned a value of 0.03, and the second preset abnormality ratio is assigned a value of 0.06. It should be noted that in other embodiments, the first preset abnormality ratio and the second preset abnormality ratio can be assigned according to the actual processing and testing conditions, and no specific limitation is made here.

[0057] Further, the analysis unit is also used to re-determine whether the PCBA board processing process does not meet the standard based on the comparison result of the total number of PCB boards with the preset total number of PCB boards pre-stored in the analysis unit, or to reduce the preset abnormal ratio pre-stored in the analysis unit based on the quantity difference, wherein the quantity difference is the difference between the preset total number of PCB boards and the total number of PCB boards.

[0058] Specifically, in this embodiment, the comparison process based on the total number of PCB boards and the preset total number of PCB boards is as follows:

[0059] If the total number of PCB boards is less than or equal to the total number of preset PCB boards, it means that the total number of PCBA boards currently manufactured is relatively small. In this way, the relatively small number of abnormal PCBA boards will also cause the abnormal ratio to be maintained between the first preset abnormal ratio and the second preset abnormal ratio. Therefore, it can be determined that the processing process of the PCBA board meets the standard at this time, but it is necessary to correct the judgment benchmark of the analysis unit based on the quantity difference, that is, to reduce and correct the preset abnormal ratio pre-stored in the analysis unit, so as to improve the judgment benchmark for the processing process, wherein the quantity difference is the difference between the total number of preset PCB boards and the total number of PCB boards; if the total number of PCB boards is greater than the total number of preset PCB boards, it means that the total number of PCBA boards currently manufactured is relatively large. In this way, even if the abnormal ratio is maintained between the first preset abnormal ratio and the second preset abnormal ratio, there will be relatively more abnormal PCBA boards. Therefore, it can be determined that the processing process of the PCBA board does not meet the standard. At this time, the reason why the processing process does not meet the standard is determined based on the average value. Specifically, in this embodiment, the preset total number of PCB boards is assigned a value of 105. In other embodiments, the preset total number of PCB boards is assigned according to the actual production situation, which is not specifically limited here.

[0060] Furthermore, the analysis unit is also used to reduce the preset abnormality ratio based on the comparison result of the quantity difference with the preset quantity difference pre-stored in the analysis unit, and the reduction degree of the preset abnormality ratio is proportional to the quantity difference.

[0061] Specifically, in this embodiment, the preset quantity difference includes a first preset quantity difference and a second preset quantity difference greater than the first preset quantity difference, and the comparison process based on the quantity difference and the preset quantity difference is as follows:

[0062] If the quantity difference is less than or equal to the first preset quantity difference, the analysis unit issues an instruction so that the control unit uses the first abnormal ratio correction coefficient to reduce the first preset abnormal ratio to 0.95 times the initial value and the second preset abnormal ratio to 0.90 times the initial value; if the quantity difference is greater than the first preset quantity difference and less than or equal to the second preset quantity difference, the analysis unit issues an instruction so that the control unit uses the second abnormal ratio correction coefficient to reduce the first preset abnormal ratio to 0.85 times the initial value and the second preset abnormal ratio to 0.80 times the initial value; if the quantity difference is greater than the second preset quantity difference, the analysis unit issues an instruction so that the control unit uses the third abnormal ratio correction coefficient to reduce the first preset abnormal ratio to 0.75 times the initial value and the second preset abnormal ratio to 0.70 times the initial value. By reducing the first preset abnormal ratio and the second preset abnormal ratio to reduce the preset abnormal ratio, the judgment criterion is improved, so that the number of abnormal PCBA boards in the subsequent production process is reduced. In this way, the qualified rate of PCBA boards can be improved. Specifically, in this embodiment, the number of PCB boards is set to 100, then the first preset number difference is assigned to 6, and the second preset number difference is assigned to 8. It should be noted that, in other embodiments, the assignment of the first preset number difference and the second preset number difference, as well as the reduction ratio of the first preset abnormal ratio and the second preset abnormal ratio are all determined according to actual production conditions and are not limited here.

[0063] See also Figure 5 As shown, it is a schematic diagram of the process of determining the reasons why the PCBA board processing process does not meet the standards and the correction based on the average value in this embodiment. The analysis unit is also used to determine the reasons why the PCBA board processing process does not meet the standards based on the comparison result of the average value and the preset average value pre-stored in the analysis unit, and generate corresponding correction methods based on the determined reasons, including: increasing the solder paste replenishment frequency of the printing module 3, increasing the clamping force of the fixing module 2, or obtaining the variance based on the total number of the abnormal paths and re-determining the reasons for not meeting the standards based on the variance.

[0064] Specifically, in this embodiment, the preset average value includes a first preset average value and a second preset average value, the first preset average value is less than the second preset average value, and the comparison process based on the average value and the preset average value is as follows:

[0065] If the average value is less than or equal to the first preset average value, the reason why the PCBA board processing process does not meet the standards is insufficient solder paste. Insufficient solder paste causes unreliable soldering at a single soldering point, and the electronic component is not truly installed on the PCB board, which causes an abnormality in the detection of the path. At this time, it is necessary to replenish solder paste in the printing module 3 so that when solder paste is subsequently applied to the PCB board, it can be ensured that the amount of solder paste at the pad position on the PCB board is sufficient for welding requirements; if the average value is greater than the first preset average value and less than or equal to the second preset average value, the reason for non-compliance with the standards cannot be accurately determined, and it is necessary to obtain the variance according to the number of abnormal paths on several abnormal PCBA boards and redetermine the cause based on the variance, that is, determine the abnormal path on a single abnormal PCBA board through the variance. The number of paths is relatively large or relatively small, so as to determine the distribution of abnormal paths, and determine the specific reasons according to the distribution, by drawing a time-quantity curve for multiple abnormal PCBA boards and the number of abnormal PCBA boards recorded in the current detection cycle, and obtaining the variance under the current detection cycle based on the curve; if the average value is greater than the second preset average value, the reason why the PCBA board does not meet the standard during processing is that the clamping force of the fixing module 2 is insufficient, and the insufficient clamping force will cause the PCB board to shake during the welding process, thereby causing a single electronic component to be unable to be accurately welded to the corresponding pad position, and once the PCB board shakes, the number of abnormal paths caused by it will be greater than the number caused by insufficient solder paste, and at this time, the clamping force of the fixing module 2 needs to be increased. Specifically, in this embodiment, the number of paths on a single PCBA board is set to 25, the first preset average value is assigned to 3, and the second preset average value is assigned to 5. In other embodiments, the assignment of the first preset average value and the second preset average value is determined according to the actual number of paths on the PCBA board and the number of abnormal paths, and is not specifically limited here.

[0066] Furthermore, the analysis unit is also used to increase the solder paste replenishment frequency of the printing module 3 based on the comparison result of the average spacing distance and the preset average spacing distance pre-stored in the analysis unit, and the increase in the solder paste replenishment frequency is inversely proportional to the average spacing distance, wherein the detection unit is also used to detect several of the PCBA boards in sequence and obtain the spacing distance between any two adjacent abnormal PCBA boards, and the analysis unit is also used to calculate the average spacing distance based on the several spacing distances.

[0067] Specifically, in this embodiment, several PCBA boards are detected in sequence when the detection module 6 performs detection, and the number of normal PCBA boards between two adjacent abnormal PCBA boards is recorded as the spacing distance, which can reflect the distribution of abnormal PCBA boards in the batch of PCBA boards; the average spacing distance is calculated through several spacing distances, and the larger the average spacing distance, the more scattered the distribution of several abnormal PCBA boards in the total PCBA boards, indicating that the impact of the abnormal path due to insufficient solder paste is smaller, and the amplitude of increasing the replenishment frequency is also smaller. The preset average spacing distance includes a first preset average spacing distance and a second preset average spacing distance greater than the first preset average spacing distance. The comparison process based on the average spacing distance and the preset average spacing distance is as follows:

[0068] If the average spacing distance is less than or equal to the first preset average spacing distance, the control unit uses the first supplementary frequency adjustment coefficient to increase the solder paste replenishment frequency in the printing module 3 to 3 times the initial value; if the average spacing distance is greater than the first preset average spacing distance and less than or equal to the second preset average spacing distance, the control unit uses the second supplementary frequency adjustment coefficient to increase the solder paste replenishment frequency in the printing module 3 to 2.5 times the initial value; if the average spacing distance is greater than the second preset average spacing distance, the control unit uses the third supplementary frequency adjustment coefficient to increase the solder paste replenishment frequency in the printing module 3 to 2 times the initial value. Specifically, in this embodiment, the first preset average spacing distance is assigned a value of 15, and the second preset average spacing distance is assigned a value of 18. It should be noted that in other embodiments, the assignment of the first preset average spacing distance and the second preset average spacing distance and the increase rate of the solder paste replenishment frequency are determined according to actual production conditions and are not limited here.

[0069] Furthermore, the analysis unit is also used to reduce the replenishment frequency on the basis of the adjusted solder paste replenishment frequency based on the comparison result of the number of abnormal clusters with the preset number of abnormal clusters pre-stored in the analysis unit, and the reduction range is proportional to the number of abnormal clusters, wherein a single abnormal cluster refers to the continuous appearance of more than two abnormal PCBA boards in the same batch of PCBA boards when they are inspected sequentially.

[0070] Specifically, in this embodiment, the number of abnormal PCBA boards in the same batch remains unchanged. When the same batch of PCBA boards is tested, there are multiple abnormal PCBA boards that appear consecutively. At this time, the multiple abnormal PCBA boards that appear consecutively can be recorded as an abnormal cluster. The more abnormal clusters there are, the greater the probability that the solder paste usage of the pad position can be met by replenishing the solder paste once. Therefore, the replenishment frequency can be reduced on the basis of the original solder paste replenishment frequency adjustment. The reduction at this time is relatively smaller than the increase in the solder paste replenishment frequency. The preset number of abnormal clusters includes a first preset number of abnormal clusters and a second preset number of abnormal clusters. The first preset number of abnormal clusters is less than the second preset number of abnormal clusters. The comparison process based on the number of abnormal clusters and the preset number of abnormal clusters is as follows:

[0071] If the number of abnormal clusters is less than or equal to the first preset number of abnormal clusters, the fourth supplementary frequency adjustment coefficient is used by the control unit to reduce the adjusted supplementary frequency to 0.95 times the initial value; if the number of abnormal clusters is greater than the first preset number of abnormal clusters and less than or equal to the second preset number of abnormal clusters, the fifth supplementary frequency adjustment coefficient is used by the control unit to reduce the adjusted supplementary frequency to 0.90 times the initial value; if the number of abnormal clusters is greater than the second preset number of abnormal clusters, the sixth supplementary frequency adjustment coefficient is used by the control unit to reduce the adjusted supplementary frequency to 0.85 times the initial value. Specifically, in this embodiment, the first preset number of abnormal clusters and the second preset number of abnormal clusters are assigned values ​​of 3 and 5, respectively. In other embodiments, the first preset number of abnormal clusters, the second preset number of abnormal clusters, and the ratio of reduction of the adjusted supplementary frequency all need to be based on specific production conditions and are not limited here.

[0072] Furthermore, the analysis unit is also used to redetermine the reason why the PCBA board processing process does not meet the standard based on the comparison result of the variance with the preset variance pre-stored in the analysis unit, and generate a corresponding correction method based on the determined reason, including: increasing the clamping force of the fixing module 2, or increasing the solder paste replenishment frequency of the printing module 3.

[0073] Specifically, in this embodiment, the comparison process based on the variance and the preset variance is as follows:

[0074] If the variance is less than or equal to the preset variance, it means that most abnormal paths are concentrated on several abnormal PCBA boards. At this time, it can be determined that the reason for non-compliance with the standard is insufficient clamping force on the PCB board, resulting in unqualified precision of electronic components assembled on the PCB board, and the clamping force can be increased for the fixed module 2; if the variance is greater than the preset variance, it means that several abnormal paths are relatively evenly distributed on each abnormal PCBA board. At this time, it can be determined that the reason for non-compliance with the standard is insufficient solder paste, and solder paste can be supplemented for the printing module 3. Specifically, in this embodiment, the preset variance is set to 0.4. In other embodiments, the preset variance is set according to the specific situation and is not specifically limited here.

[0075] Furthermore, the analysis unit is also used to correct the installation coordinates of the electronic component based on a comparison result of the overlap of the abnormal path and a preset overlap pre-stored in the analysis unit, wherein the overlap of the abnormal path refers to the number of times a single abnormal path appears in the same position in several abnormal PCBA boards in the same batch.

[0076] Specifically, in this embodiment, the comparison process based on the overlap degree and the preset overlap degree is as follows:

[0077] If the overlap is greater than the preset overlap, it means that the probability of abnormality when installing the electronic component at the pad position on the PCB is greater than the probability of abnormality at other positions. Therefore, the installation coordinates of the electronic component corresponding to the pad position can be corrected and adjusted so that the electronic component corresponding to the pad position can be accurately assembled on the PCB later; if the overlap is less than or equal to the preset overlap, the printing module 3 can be adjusted to replenish the solder paste. Specifically, in this embodiment, the preset overlap is set to 5. In other embodiments, the preset overlap is determined according to the number of other abnormal PCBA boards, which is not limited here.

[0078] Furthermore, the analysis unit is also used to increase the clamping force of the fixing module 2 based on the comparison result of the average value difference and the preset average value difference stored in the analysis unit, and the increase in the clamping force is proportional to the average value difference, wherein the average value difference is the difference between the average value and the preset average value.

[0079] Specifically, in this embodiment, the average value difference is specifically the difference between the average value and the second preset average value; the preset average value difference includes a first preset average value difference and a second preset average value difference greater than the first preset average value difference, and the comparison process based on the average value difference and the preset average value difference is as follows:

[0080] If the average value difference is less than or equal to the first preset average value difference, the control unit uses the first clamping force adjustment coefficient to increase the clamping force to 1.3 times the initial value; if the average value difference is greater than the first preset average value difference and less than or equal to the second preset average value difference, the control unit uses the second clamping force adjustment coefficient to increase the clamping force to 1.6 times the initial value; if the average value difference is greater than the second preset average value difference, the control unit uses the third clamping force adjustment coefficient to increase the clamping force to 1.9 times the initial value. Specifically, in this embodiment, the first preset average value difference is assigned a value of 2, and the second preset average value difference is assigned a value of 4. It should be noted that in other embodiments, the first preset average value difference and the second preset average value difference assignments and the increase ratio of the clamping force all need to be determined according to specific production conditions and are not specifically limited here.

[0081] So far, the technical solutions of the present invention have been described in conjunction with the preferred embodiments shown in the accompanying drawings. However, it is easy for those skilled in the art to understand that the protection scope of the present invention is obviously not limited to these specific embodiments. Without departing from the principle of the present invention, those skilled in the art can make equivalent changes or substitutions to the relevant technical features, and the technical solutions after these changes or substitutions will fall within the protection scope of the present invention.

[0082] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. For those skilled in the art, the present invention may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. An intelligent control system for a PCBA board processing production line, characterized in that: include: An input module is used to convey a number of PCB boards and a number of electronic components; A fixing module, which is arranged at the output end of the input module and is used to clamp and fix a plurality of the PCB boards and a plurality of the electronic components; A printing module, which is arranged on one side of the fixing module, is used to fix the printed board with holes on the surface of the PCB board, and the positions of the holes correspond to the positions of the pads on the PCB board, and to apply solder paste to the pads on the PCB board through the printed board with holes; A welding module, which is arranged on the other side of the fixing module, and is used to weld a plurality of the electronic components to the pad positions of the PCB board to obtain a PCBA board; A conveying module, which is arranged at the output end of the fixing module and is used to convey a plurality of the PCBA boards; A detection module, which is arranged at the output end of the conveying module, and is used to perform a path detection on a plurality of the PCBA boards to determine whether there is an abnormality in the path of the PCBA boards; An analysis unit connected to the detection module is used to determine the number of abnormal PCBA boards based on the detection result, determine whether the PCBA board processing process meets the standard based on the abnormal ratio, and determine a corresponding processing method based on the determination result, including: outputting the PCBA board, or generating a corresponding instruction based on the determined reason for non-compliance with the standard, wherein the abnormal ratio is the ratio between the number of abnormal PCBA boards and the total number of PCBA boards; A control unit, which is respectively connected to the analysis unit, the detection unit, the printing module and the fixing module, is used to adjust the operating parameters of the corresponding device based on the instructions, and the parameters include: the judgment basis of the analysis unit, the solder paste replenishment frequency of the printing module and the clamping force of the fixing module.

2. The intelligent control system for the PCBA board processing production line according to claim 1 is characterized in that: The analysis unit is used to re-determine whether the PCBA board processing process meets the standard based on the comparison result of the abnormal ratio and the preset abnormal ratio pre-stored in the analysis unit, or based on the total number of the PCB boards delivered by the input module, and to determine the reason for non-compliance with the standard based on the average value when it is determined that the PCBA board processing process does not meet the standard, wherein the average value is the ratio between the total number of abnormal paths and the total number of abnormal PCBA boards.

3. The intelligent control system for the PCBA board processing production line according to claim 2 is characterized in that: The analysis unit is also used to re-determine whether the PCBA board processing process does not meet the standard based on the comparison result of the total number of PCB boards and the preset total number of PCB boards pre-stored in the analysis unit, or to reduce the preset abnormal ratio pre-stored in the analysis unit based on the quantity difference, wherein the quantity difference is the difference between the preset total number of PCB boards and the total number of PCB boards.

4. The intelligent control system for the PCBA board processing production line according to claim 3 is characterized in that: The analysis unit is further configured to reduce the preset abnormality ratio based on a comparison result between the quantity difference and a preset quantity difference pre-stored in the analysis unit, and the reduction range of the preset abnormality ratio is proportional to the quantity difference.

5. The intelligent control system for the PCBA board processing production line according to claim 2 is characterized in that: The analysis unit is also used to determine the reason why the PCBA board processing process does not meet the standards based on the comparison result of the average value and the preset average value pre-stored in the analysis unit, and generate a corresponding correction method based on the determined reason, including: increasing the solder paste replenishment frequency of the printing module, increasing the clamping force of the fixing module, or obtaining the variance based on the total number of abnormal paths and redetermining the reason for not meeting the standards based on the variance.

6. The intelligent control system for the PCBA board processing production line according to claim 5 is characterized in that: The analysis unit is also used to increase the solder paste replenishment frequency of the printing module based on the comparison result of the average spacing distance and the preset average spacing distance pre-stored in the analysis unit, and the increase in the solder paste replenishment frequency is inversely proportional to the average spacing distance. The detection unit is also used to detect several of the PCBA boards in sequence and obtain the spacing distance between any two adjacent abnormal PCBA boards. The analysis unit is also used to calculate the average spacing distance based on the several spacing distances.

7. The intelligent control system for the PCBA board processing production line according to claim 6 is characterized in that: The analysis unit is also used to reduce the replenishment frequency on the basis of the adjusted solder paste replenishment frequency based on the comparison result of the number of abnormal clusters with the preset number of abnormal clusters pre-stored in the analysis unit, and the reduction range is proportional to the number of abnormal clusters, wherein a single abnormal cluster refers to the continuous appearance of more than two abnormal PCBA boards in the same batch of PCBA boards when they are tested sequentially.

8. The intelligent control system for the PCBA board processing production line according to claim 5 is characterized in that: The analysis unit is also used to redetermine the reason why the PCBA board processing process does not meet the standard based on the comparison result of the variance with the preset variance pre-stored in the analysis unit, and generate a corresponding correction method based on the determined reason, including: increasing the clamping force of the fixing module, or increasing the solder paste replenishment frequency of the printing module.

9. The intelligent control system for the PCBA board processing production line according to claim 8, characterized in that: The analysis unit is also used to correct the installation coordinates of the electronic component based on a comparison result of the overlap of the abnormal path and a preset overlap pre-stored in the analysis unit, wherein the overlap of the abnormal path refers to the number of times a single abnormal path appears in the same position in several abnormal PCBA boards in the same batch.

10. The intelligent control system for the PCBA board processing production line according to claim 5, characterized in that: The analysis unit is also used to increase the clamping force of the fixing module based on the comparison result of the average value difference and the preset average value difference pre-stored in the analysis unit, and the increase in the clamping force is proportional to the average value difference, wherein the average value difference is the difference between the average value and the preset average value.

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