Preparation method of display panel, display panel and display device

Abstract

The embodiment of the invention provides a preparation method of a display panel, the display panel and a display device.The preparation method comprises the steps that a substrate is provided; the substrate comprises a first surface and a second surface which are oppositely arranged, and the first surface is provided with a signal input electrode; providing a circuit board; the circuit board comprises a substrate and a wiring layer. The wiring layer comprises a first electrode and a second electrode which are electrically connected. An electrostatic protection structure is arranged on the side, away from the substrate, of the wiring layer; the electrostatic protection structure comprises an insulating film and a conductive film; fixing the circuit board on the second surface; preparing a connecting wire which is electrically connected with the signal input electrode, the first electrode and the conductive film respectively; and removing the electrostatic protection structure. According to the technology provided by the invention, the probability of electrostatic discharge in the preparation process of the display panel can be reduced, so that the yield of the display panel is improved.

Description

Technical Field

[0001] The present application relates to the field of display technology, and in particular to a method for preparing a display panel, a display panel, and a display device. Background Art

[0002] The preparation process of display panels involves a large number of steps such as product transfer, microscopic inspection, wiping, and film removal, most of which require manual participation. It is very easy to introduce static electricity and generate electrostatic discharge (ESD), causing damage to the display panel, thereby resulting in poor yield of the display panel. Summary of the invention

[0003] Embodiments of the present application provide a method for manufacturing a display panel, a display panel, and a display device to solve or alleviate one or more technical problems in the prior art.

[0004] In a first aspect, an embodiment of the present application provides a method for preparing a display panel, comprising:

[0005] Providing a substrate; the substrate comprises a first surface and a second surface arranged opposite to each other, and the first surface is provided with a signal input electrode;

[0006] A circuit board is provided; the circuit board comprises a substrate and a wiring layer, and the wiring layer comprises a first electrode and a second electrode which are electrically connected;

[0007] An electrostatic protection structure is arranged on a side of the wiring layer away from the substrate; the electrostatic protection structure comprises an insulating film and a conductive film;

[0008] fixing the circuit board to the second surface;

[0009] preparing connection traces electrically connected to the signal input electrode, the first electrode and the conductive film respectively;

[0010] Remove the static protection structure.

[0011] In one embodiment, the orthographic projection of the electrostatic protection structure on the substrate and the orthographic projection of the first electrode on the substrate have an overlapping area, and the ratio of the size of the overlapping area in the first direction to the size of the first electrode in the first direction is 1 / 4 to 1 / 3; the first direction is the extension direction of the connecting line on the second surface.

[0012] In one embodiment, preparing a connection line connected to the signal input electrode and the first electrode respectively comprises:

[0013] A connecting wire is prepared that spans between the first surface and the second surface, and both ends of the connecting wire are electrically connected to the signal input electrode and the first electrode respectively; wherein the connecting wire includes a first connecting portion connected to the first electrode and a second connecting portion connected to the conductive film.

[0014] In one embodiment, a dimension of the second connecting portion in the first direction is greater than or equal to 50 um.

[0015] In one embodiment, removing the electrostatic protection structure includes:

[0016] The electrostatic protection structure and the second connection portion connected to the conductive film are removed.

[0017] In one embodiment, the material of the insulating film includes polyimide, and the material of the conductive film includes indium tin oxide.

[0018] In one embodiment, the circuit board further includes an insulating layer, the insulating layer is located on a side of the wiring layer away from the substrate, the first electrode includes a first part for connecting to the connecting wiring, and the orthographic projection of the insulating layer on the plane where the substrate is located is arranged at an interval with the orthographic projection of the first part on the plane where the substrate is located; and an electrostatic protection structure is arranged on the side of the wiring layer away from the substrate, including:

[0019] An electrostatic protection structure is arranged on a side of the insulating layer away from the substrate.

[0020] In one embodiment, before the electrostatic protection structure is provided on the side of the wiring layer away from the substrate, the method further includes:

[0021] An electrostatic protection circuit and a ground electrode are prepared in the routing layer; wherein the first electrode and the second electrode are electrically connected to the ground electrode through the electrostatic protection circuit, the electrostatic protection circuit includes a transistor, the source and the gate of the transistor are electrically connected to the first electrode and the second electrode respectively, and the drain of the transistor is electrically connected to the ground electrode.

[0022] In one embodiment, the routing layer has a first side edge and a second side edge arranged opposite to each other in a first direction, the first electrode is arranged adjacent to the first side edge, and the second electrode is arranged adjacent to the second side edge; the first electrode and the second electrode are respectively arranged side by side and spaced apart in a second direction, and the second direction is perpendicular to the first direction;

[0023] There are multiple electrostatic protection circuits, and each first electrode and the corresponding second electrode are electrically connected to the corresponding electrostatic protection circuit respectively.

[0024] In one embodiment, before removing the electrostatic protection structure, the method further includes:

[0025] The flip chip film is bonded to the circuit board; the signal output electrode of the flip chip film is electrically connected to the second electrode; the orthographic projection of the flip chip film on the plane where the substrate is located is spaced from the orthographic projection of the electrostatic protection structure on the plane where the substrate is located.

[0026] In a second aspect, an embodiment of the present application further provides a display panel, which is prepared by using the method for preparing a display panel of any of the above embodiments of the present application, and includes:

[0027] The substrate has a first surface and a second surface arranged opposite to each other, and the first surface is provided with a signal input electrode;

[0028] A circuit board is arranged on the second surface, the circuit board includes a substrate and a wiring layer, the wiring layer includes a first electrode and a second electrode that are electrically connected, and the first electrode is electrically connected to the signal input electrode through a connecting wiring;

[0029] The chip-on-chip film is disposed on the second surface. The chip-on-chip film is integrated with a driving module and a signal output electrode. The signal output electrode is electrically connected to the second electrode.

[0030] In one embodiment, the routing layer further includes an electrostatic protection circuit and a ground electrode, and the first electrode and the second electrode are electrically connected to the ground electrode through the electrostatic protection circuit.

[0031] In a third aspect, an embodiment of the present application further provides a display device, comprising the display panel of the above embodiment of the present application.

[0032] According to the technology of the present application, by providing an electrostatic protection structure on the circuit board, and the conductive film of the electrostatic protection structure is electrically connected to the connecting wire, in multiple preparation processes of the display panel, especially in the process of preparing the connecting wire, the introduced electrostatic charge can be distributed to the conductive film with a larger load area, thereby reducing the voltage difference caused by the concentration of electrostatic charge, and further reducing the probability of electrostatic discharge. Therefore, the method for preparing the display panel of the embodiment of the present application can reduce the probability of electrostatic discharge in the process of preparing the display panel, thereby improving the yield of the display panel.

[0033] The above summary is for illustrative purposes only and is not intended to be limiting in any way. In addition to the illustrative aspects, embodiments and features described above, further aspects, embodiments and features of the present application will be readily apparent by reference to the accompanying drawings and the following detailed description. BRIEF DESCRIPTION OF THE DRAWINGS

[0034] In the accompanying drawings, unless otherwise specified, the same reference numerals throughout the multiple drawings represent the same or similar parts or elements. These drawings are not necessarily drawn to scale. It should be understood that these drawings only depict some embodiments disclosed in the present application and should not be regarded as limiting the scope of the present application.

[0035] Figure 1 A flow chart showing a method for preparing a display panel according to an embodiment of the present application;

[0036] Figure 2 and Figure 3 A top view and a side view of an electrostatic protection structure provided on a circuit board are respectively shown;

[0037] Figure 4 and Figure 5 A top view and a side view are respectively shown of fixing the circuit board to the second surface of the substrate;

[0038] Figure 6 and Figure 7 The top view and side view of the preparation of the connection routing are shown respectively;

[0039] Figure 8 and Fig. 9 The top view and side view of the bonding flip chip film and the removal of the static protection module are shown respectively;

[0040] Fig.10 A schematic diagram showing the preparation of an electrostatic protection circuit and a grounding electrode on a circuit board;

[0041] Fig.11 A schematic diagram showing the structure of an electrostatic protection circuit.

[0042] Description of reference numerals:

[0043] Display panel 1;

[0044] Substrate 10; fixed area 10a; LED chip 11; signal transmission line 12; signal input electrode 121;

[0045] Circuit board 20; substrate 21; wiring layer 22; first electrode 221; second electrode 222; electrostatic protection circuit 223; transistor 2231; source 2231a; drain 2231b; gate 2231c; ground electrode 224; insulating layer 23; connecting wiring 24; first connecting portion 241; second connecting portion 242;

[0046] Chip-on-chip film 30;

[0047] Electrostatic protection structure 40 ; insulating film 41 ; conductive film 42 . DETAILED DESCRIPTION

[0048] In the following, only some exemplary embodiments are briefly described. As those skilled in the art will appreciate, the described embodiments may be modified in various ways without departing from the spirit or scope of the present application. Therefore, the drawings and descriptions are considered to be exemplary and non-restrictive in nature.

[0049] Figure 1 FIG. 1 is a flow chart showing a method for preparing a display panel 1 according to an embodiment of the present application. Figure 1 As shown, the preparation method of the embodiment of the present application includes the following steps:

[0050] S101: providing a substrate 10; the substrate 10 comprises a first surface and a second surface arranged opposite to each other, and a signal input electrode 121 is arranged on the first surface;

[0051] S102: providing a circuit board 20; the circuit board 20 includes a substrate 21 and a wiring layer 22, and the wiring layer 22 includes a first electrode 221 and a second electrode 222 that are electrically connected;

[0052] S103: Disposing an electrostatic protection structure 40 on a side of the wiring layer 22 away from the substrate 21; the electrostatic protection structure 40 includes an insulating film 41 and a conductive film 42;

[0053] S104: fixing the circuit board 20 to the second surface of the substrate 10;

[0054] S105: preparing a connection line 24 electrically connected to the signal input electrode 121, the first electrode 221 and the conductive film 42 respectively;

[0055] S106 : removing the electrostatic protection structure 40 .

[0056] The display panel 1 of the embodiment of the present application can be any type of display panel 1. In some specific examples, the display panel 1 can be an MLED (Micro Light Emitting Diode) display panel. It is understandable that the MLED display panel uses a tiny LED chip 11 as a light source. Compared with traditional LEDs, Micro LEDs have a smaller size and a higher pixel density, and can provide better brightness and delicate image display effects.

[0057] Exemplarily, in step S101, the first surface of the substrate 10 can be understood as the front surface of the substrate 10, and the second surface of the substrate 10 can be understood as the back surface of the substrate 10. The front surface of the substrate 10 can be the surface of the substrate 10 facing the display direction. The first surface of the substrate 10 is also provided with an LED chip 11 electrically connected to the signal input electrode 121, and the LED chip 11 emits light under the drive of the driving signal.

[0058] For example, in step S102, the circuit board 20 may be a flexible printed circuit (FPC). A flexible printed circuit is a printed circuit board made of polyimide (PI) or polyester film as a substrate, which has high reliability and excellent flexibility, and has the characteristics of high wiring density, light weight, thin thickness, and good bendability. In some examples, the material of the substrate 21 of the circuit board 20 may include polyimide, and the material of the wiring layer 22 may specifically include copper.

[0059] Figure 2 and Figure 3 1 and 2 show a top view and a side view of an electrostatic protection structure provided on a circuit board. Figure 2 and Figure 3 As shown, the wiring layer 22 has a first side edge and a second side edge that are arranged opposite to each other in a first direction, the first electrode 221 is arranged adjacent to the first side edge, and the second electrode 222 is arranged adjacent to the second side edge. The first direction may be the extending direction of the connecting wiring 24 on the second surface, for example, it may be the length direction or the width direction of the substrate 10. Specifically, the substrate 10 has a designated side edge, and the signal input electrode 121 on the first surface of the substrate 10 is arranged adjacent to the designated side edge. The first side edge of the wiring layer 22 is arranged adjacent to the designated side edge of the substrate 10, and the second side edge of the wiring layer 22 is arranged away from the designated side edge of the substrate 10. By arranging the first electrode 221 adjacent to the first side edge and the second electrode 222 adjacent to the second side edge, the distance between the first electrode 221 and the designated side edge of the substrate 10 can be reduced, thereby reducing the wiring length of the connecting wiring 24 connecting the first electrode 221 and the signal input electrode 121.

[0060] More specifically, the first electrodes 221 and the second electrodes 222 are arranged side by side and spaced apart in a second direction, and the second direction is perpendicular to the first direction. Exemplarily, the plurality of first electrodes 221 and the plurality of second electrodes 222 are arranged one by one, and the first electrodes 221 and the second electrodes 222 are electrically connected through a connecting line. The second electrode 222 is used to be electrically connected to the signal output electrode on the chip-on-film 30 of the display panel 1.

[0061] Exemplarily, in step S103, the electrostatic protection structure 40 includes an insulating film 41 and a conductive film 42 which are stacked, and the orthographic projections of the insulating film 41 and the conductive film 42 on the plane where the substrate 10 is located overlap. The orthographic projection of the electrostatic protection structure 40 on the plane where the substrate 10 is located can be staggered with at least part of the orthographic projection of the first electrode 221 on the plane where the substrate 10 is located and at least part of the orthographic projection of the second electrode 222 on the plane where the substrate 10 is located, so that the electrostatic protection structure 40 can avoid at least part of the first electrode 221 and the second electrode 222, thereby exposing at least part of the first electrode 221 and at least part of the second electrode 222, thereby facilitating the connection between the first electrode 221 and the connecting wire 24 and the second electrode 222 and the signal output electrode of the flip chip film 30.

[0062] Figure 4 and Figure 5 1 and 2 respectively show a top view and a side view of fixing the circuit board to the second surface of the substrate. Figure 4 and Figure 5As shown, in step S104, the second surface of the substrate 10 may be provided with a fixing area 10a, and the fixing area 10a is used to fix the circuit board 20. The embodiment of the present application does not specifically limit the fixing method of the circuit board 20 on the fixing area 10a. For example, the circuit board 20 can be fixed to the fixing area 10a by bonding.

[0063] Figure 6 and Figure 7 The top view and side view of the preparation of the connection line are shown respectively. Figure 6 and Figure 7 As shown, in step S105, the material of the connecting trace 24 may include silver, the connecting trace 24 may be set on the substrate 10 through a 3D printing process, and the connecting trace 24 crosses the designated side edge of the substrate 10 from the first surface of the substrate 10 and extends to the second surface of the substrate 10, so that one end of the connecting trace 24 is electrically connected to the signal input electrode 121 located on the first surface of the substrate 10 and the other end is electrically connected to the first electrode 221 of the circuit board 20 located on the second surface of the substrate 10.

[0064] In some examples, such as Figure 5 , Figure 7 and Fig. 9 As shown, the first surface of the substrate 10 is provided with a signal transmission line 12, and the LED chip 11 is provided on the first surface of the substrate and is electrically connected to the signal transmission line 12. The portion of the signal transmission line 12 adjacent to the side edge of the substrate forms a signal input electrode 121 for connecting to the line 24.

[0065] Generally, the preparation process of a display panel may include: (1) obtaining a substrate, cutting and grinding the raw material of the substrate 1 to obtain a substrate; (2) obtaining a circuit board, and fixing the circuit board to the substrate; (3) preparing a connection line connecting a first electrode on the circuit board and a signal input electrode 121 on the substrate; (4) bonding an LED chip electrically connected to the signal input electrode 121 on the substrate; (5) bonding a flip chip to the substrate, and electrically connecting the signal output electrode on the flip chip to the second electrode on the circuit board; and (6) performing a lighting test on the display panel.

[0066] Since the above-mentioned multiple preparation processes involve a large number of steps such as product transfer, microscopic inspection, wiping, and film removal, most of which require manual participation, it is very easy to introduce static electricity and generate electrostatic discharge (ESD), resulting in damage to the display panel.

[0067] In order to improve the anti-ESD capability during the preparation of the display panel, one solution is to connect as many traces as possible on the circuit board to distribute the electrostatic charge to a larger load area and reduce the local voltage; another solution is to connect the traces on the circuit board to the ground wire or the common electrode to conduct the introduced electrostatic current to the ground. However, in the first solution, in order to achieve narrow borders and splicing, the MLED display panel usually adopts the method of setting connecting traces on the side of the substrate. The outer side of the connecting trace is only covered with a thin layer of OC film, and the anti-ESD capability is weak. Therefore, it is difficult to avoid ESD by relying solely on the first solution. In the second solution, in the preparation process of the display panel, it is difficult to avoid ESD before preparing the ground path. Therefore, it is difficult to effectively improve the anti-ESD capability by relying solely on the second solution. Therefore, it is difficult to effectively avoid electrostatic discharge in the preparation process of the display panel in the current related technology, resulting in poor yield of the display panel.

[0068] In the embodiment of the present application, by setting an electrostatic protection structure 40 on the circuit board 20, and the conductive film 42 of the electrostatic protection structure 40 is electrically connected to the first electrode 221 and the connecting wire 24 respectively, in multiple preparation processes of the display panel 1, especially in the preparation of the connecting wire 24, the introduced electrostatic charge can be distributed to the conductive film 42 with a larger load area, thereby reducing the voltage difference caused by the concentration of electrostatic charge, and further reducing the probability of electrostatic discharge. Therefore, the preparation method of the display panel 1 of the embodiment of the present application can reduce the probability of electrostatic discharge in the process of preparing the display panel 1, thereby improving the yield of the display panel 1.

[0069] In one embodiment, before step S106, the preparation method of the embodiment of the present application may further include the following steps:

[0070] The flip chip film 30 is bonded to the circuit board 20; the signal output electrode of the flip chip film 30 is electrically connected to the second electrode 222; the orthographic projection of the flip chip film 30 on the plane where the substrate 10 is located is spaced from the orthographic projection of the electrostatic protection structure 40 on the plane where the substrate 10 is located.

[0071] Figure 8 and Fig. 9 The top view and side view of the bonding flip chip film and the static protection module are shown respectively. Figure 8 and Fig. 9As shown, the chip-on-film 30 can be fixedly connected to the second surface of the substrate 10 through a bonding process, and the multiple signal output electrodes of the driving module are electrically connected to the multiple second electrodes 222. It can be understood that the chip-on-film 30 is a grain soft film assembly technology that fixes the integrated circuit (IC) of the driving module on the flexible circuit board, and uses a soft additional circuit board as a packaging chip carrier to combine the chip with the flexible substrate 10 circuit, including tape and roll packaging production (TAB substrate 10, its process is called TCP), soft board connection chip assembly, and soft IC carrier board packaging. The chip-on-film 30 is used to generate a driving signal to drive the LED chip 11 to work, and transmits the driving signal to the LED chip 11 through the circuit board 20, wherein the driving signal can specifically include a power driving signal, a pixel data signal, a timing signal, etc.

[0072] Through the above-mentioned implementation mode, in the process of bonding the chip-on-chip film 30 to the circuit board 20, the introduced electrostatic load can be distributed to the conductive film 42 with a larger load area, thereby further reducing the voltage difference caused by the concentration of electrostatic charge, reducing the probability of electrostatic discharge, and further improving the yield of the display panel 1.

[0073] In one embodiment, Figure 6 As shown, the orthographic projection of the electrostatic protection structure 40 on the substrate 21 and the orthographic projection of the first electrode 221 on the substrate 21 have an overlapping area, and the ratio of the size of the overlapping area in the first direction to the size of the first electrode 221 in the first direction is 1 / 4 to 1 / 3, and the first direction is the extension direction of the connecting trace 24 on the second surface.

[0074] Exemplarily, the first electrode 221 includes a first region and a second region connected in the first direction, the electrostatic protection structure 40 covers the first region of the first electrode 221 and avoids the second region of the first electrode 221, and the second region is used to connect with the connecting wire 24 during the preparation of the connecting wire 24, thereby realizing the electrical connection between the first electrode 221 and the connecting wire 24. The ratio of the size of the second region in the first direction to the size of the first electrode 221 in the first direction is 2 / 3 to 3 / 4.

[0075] It can be understood that the larger the area of ​​the electrostatic protection structure 40, the more beneficial it is to reduce the voltage difference of the introduced electrostatic charge. However, in order to avoid the electrostatic protection structure 40 interfering with the electrical connection between the connecting line 24 and the first electrode 221 when preparing the connecting line 24, the electrostatic protection structure 40 needs to avoid part of the first electrode 221 to form a second area for bonding with the connecting line 24.

[0076] By setting the ratio of the size of the overlapping area in the first direction to the size of the first electrode 221 in the first direction to 1 / 4 to 1 / 3, it is possible to ensure that the electrostatic protection structure 40 has a large current-carrying area while reserving sufficient first area for the first electrode 221 to be electrically connected to the connecting trace 24, thereby ensuring the connection stability and reliability between the first electrode 221 and the connecting trace 24.

[0077] In one embodiment, the orthographic projection of the electrostatic protection structure 40 on the substrate 21 is spaced from the orthographic projection of the second electrode 222 on the substrate 21, that is, there is no intersection between the orthographic projection of the electrostatic protection structure 40 on the substrate 21 and the orthographic projection of the second electrode 222 on the substrate 21. This arrangement can prevent the residual material after removing the electrostatic protection structure 40 from affecting the normal operation of the second electrode 222, thereby ensuring the working reliability of the circuit board 20.

[0078] In one embodiment, Figure 7 As shown, step S105 may include:

[0079] A connecting wire 24 is prepared spanning between the first surface and the second surface, and the two ends of the connecting wire 24 are electrically connected to the signal input electrode 121 and the first electrode 221 respectively; wherein the connecting wire 24 includes a first connecting portion 241 connected to the first electrode 221 and a second connecting portion 242 connected to the conductive film 42.

[0080] Exemplarily, the wiring layer 22 may include a plurality of first electrodes 221 arranged side by side and spaced apart in the second direction, and correspondingly, the connecting wiring 24 is a plurality of wirings corresponding to the plurality of first electrodes 221. The first electrodes 221 extend sequentially from the surface of the conductive film 42, the surface of the first electrode 221, the second surface of the substrate 10, the surface of the designated side edge of the substrate 10, the first surface of the substrate 10, and the surface of the signal input electrode 121 to form an electrical connection between the first electrode 221 and the signal input electrode 121. The material of the connecting wiring 24 may include silver, which is specifically prepared by a 3D printing process.

[0081] In some specific examples, the first connection portion 241 of the connecting trace 24 is formed on the surface of the first electrode 221 to electrically connect the connecting trace 24 to the first electrode 221, and the second connection portion 242 of the connecting trace 24 is formed on the surface of the conductive film 42 to electrically connect the connecting trace 24 to the conductive film 42.

[0082] Optionally, a dimension of the second connection portion 242 in the first direction is greater than or equal to 50 um.

[0083] It can be understood that the size of the second connection portion 242 in the first direction is the size of the overlapping portion of the orthographic projection of the connection trace 24 on the substrate 21 and the orthographic projection of the conductive film 42 on the substrate 21 in the first direction.

[0084] Such a configuration can ensure that there is a sufficient contact area between the connection wiring 24 and the conductive film 42 , thereby improving the connection reliability between the connection wiring 24 and the conductive film 42 .

[0085] Optionally, step S106 may specifically include:

[0086] The electrostatic protection structure 40 and the second connection portion 242 connected to the conductive film 42 are removed.

[0087] It is understandable that, since the connection trace 24 is made of silver paste material through a printing process, and the thickness of the connection trace 24 can be about 5um, the connection trace 24 can be regarded as a low-strength flexible film, and the adhesion strength between the connection trace 24 and the substrate 10 and the trace layer 22 surface is much greater than its own structural strength. Based on this, when the electrostatic protection structure 40 is removed, the second connection portion 242 of the connection trace 24 will break with the first connection portion 241 when the electrostatic protection structure 40 is torn off, so that the entire connection trace 24 will not be torn off from the first electrode 221 and the surface of the substrate 10, ensuring the connection stability and reliability of the connection trace 24 with the first electrode 221 and the signal input electrode 121 when the electrostatic protection structure 40 is removed.

[0088] In one implementation, after step S106 , a power-on test may be performed on the display panel 1 .

[0089] In one embodiment, the material of the insulating film 41 includes polyimide (PI), and the material of the conductive film 42 includes indium tin oxide (ITO).

[0090] For example, the insulating film 41 may be a PI film, and the conductive film 42 may be an ITO film.

[0091] In one embodiment, Figure 7 As shown, the circuit board 20 further includes an insulating layer 23, which is located on a side of the wiring layer 22 away from the substrate 21, and the insulating layer 23 avoids the portion where the first electrode 221 and the connecting wiring 24 are in contact; an electrostatic protection structure 40 is provided on a side of the wiring layer 22 away from the substrate 21, including:

[0092] An electrostatic protection structure 40 is disposed on a side of the insulating layer 23 away from the substrate 21 .

[0093] Exemplarily, the material of the insulating layer 23 can be any type of insulating material to provide electrical insulation and mechanical protection for the circuit board 20, thereby ensuring the reliability and stability of the wiring layer 22. For example, the material of the insulating layer 23 may include polyimide, polyamide ester (Polyester), polyether ether ketone (Polyether Ether Ketone), polytetrafluoroethylene (Polytetrafluoroethylene), etc. Among them, the first electrode 221 may include a first area covered by the electrostatic protection module and a second area for fitting with the connecting wiring 24, wherein the insulating layer 23 at least avoids the second area of ​​the first electrode 221 to ensure that the first electrode 221 can fit with the connecting wiring 24.

[0094] In one embodiment, before step S102, the preparation method of the embodiment of the present application may further include the following steps:

[0095] An electrostatic protection circuit 223 and a ground electrode 224 are prepared on the wiring layer 22; wherein the first electrode 221 and the second electrode 222 are electrically connected to the ground electrode 224 through the electrostatic protection circuit 223, and the electrostatic protection circuit 223 includes a transistor 2231, and the source 2231a and the gate 2231c of the transistor 2231 are electrically connected to the first electrode 221 and the second electrode 222 respectively, and the drain 2231b of the transistor 2231 is electrically connected to the ground electrode 224.

[0096] For example, Fig.10 and Fig.11 As shown, an electrostatic protection circuit 223 and a ground electrode 224 can be prepared on the wiring layer 22 by an array process. It can be understood that when electrostatic discharge occurs, when the electrostatic voltage is greater than the turn-on voltage of the transistor 2231, the transistor 2231 is turned on, and the electrostatic current flows to the ground electrode 224 through the source 2231a and the drain 2231b of the transistor 2231.

[0097] Through the above implementation, when static electricity is released, the static electricity current can be guided to the ground electrode 224 through the static electricity protection circuit 223, thereby further improving the ability of the display panel 1 to resist ESD.

[0098] In one embodiment, the routing layer 22 has a first side edge and a second side edge arranged opposite to each other in a first direction, the first electrode 221 is arranged adjacent to the first side edge, and the second electrode 222 is arranged adjacent to the second side edge; the first electrode 221 and the second electrode 222 are respectively a plurality of electrodes arranged side by side and at intervals in the second direction, and the second direction is perpendicular to the first direction; wherein, there are a plurality of electrostatic protection circuits 223, and each first electrode 221 and the corresponding second electrode 222 are respectively electrically connected to the corresponding electrostatic protection circuit 223.

[0099] Exemplarily, the plurality of first electrodes 221 and the plurality of second electrodes 222 can be arranged side by side and spaced apart along the second direction, respectively, and the plurality of first electrodes 221 and the plurality of second electrodes 222 can be spaced apart in the first direction. There can be two grounding electrodes 224 arranged side by side with the plurality of second electrodes 222, and the two grounding electrodes 224 are respectively located on opposite sides of the plurality of second electrodes 222 in the second direction. Among them, the plurality of first electrodes 221 and the plurality of second electrodes 222 can be divided into two groups, each group including a plurality of first electrodes 221 and a plurality of second electrodes 222 electrically connected to each other, each first electrode 221 and its corresponding second electrode 222 are provided with a corresponding electrostatic protection circuit 223, and the two grounding electrodes 224 are respectively electrically connected to the two groups of first electrodes 221 and the second electrodes 222 through the corresponding electrostatic protection circuit 223.

[0100] In a second aspect, an embodiment of the present application further provides a display panel 1, which is prepared by using a method for preparing a display panel 1 according to any one of the above-mentioned embodiments of the present application.

[0101] like Figure 6 and Figure 7 As shown, the display panel 1 includes a substrate 10, a circuit board 20 and a COF 30. Specifically, the substrate 10 has a first surface and a second surface arranged opposite to each other, and the first surface is provided with a signal input electrode 121. The circuit board 20 is arranged on the second surface, and the circuit board 20 includes a substrate 21 and a wiring layer 22, and the wiring layer 22 includes a first electrode 221 and a second electrode 222 that are electrically connected, and the first electrode 221 is used to be electrically connected to the signal input electrode 121 through a connecting wiring 24. The COF 30 is arranged on the second surface, and the COF 30 is integrated with a driving module and a signal output electrode, and the signal output electrode is electrically connected to the first electrode 221.

[0102] According to the display panel 1 of the embodiment of the present application, by using the preparation method of the above embodiment of the present application, the probability of electrostatic discharge occurring during the preparation of the display panel 1 can be reduced, thereby improving the yield of the display panel 1.

[0103] In one embodiment, Fig.10 and Fig.11As shown, the wiring layer 22 further includes an electrostatic protection circuit 223 and a ground electrode 224 , and the first electrode 221 and the second electrode 222 are electrically connected to the ground electrode 224 via the electrostatic protection circuit 223 .

[0104] Exemplarily, the electrostatic protection circuit may include a transistor 2231 , a source 2231 a and a gate 2231 c of the transistor 2231 are electrically connected to the first electrode 221 and the second electrode 222 , respectively, and a drain 2231 b of the transistor 2231 is electrically connected to the ground electrode 224 .

[0105] Through the above implementation, when static electricity is released, the static electricity current can be guided to the ground electrode 224 through the static electricity protection circuit 223, thereby further improving the ability of the display panel 1 to resist ESD.

[0106] In a third aspect, an embodiment of the present application further provides a display device, comprising the display panel of the above embodiment of the present application.

[0107] In addition, other components of the display device in the above embodiment may adopt various technical solutions known to ordinary technicians in this field now and in the future, and will not be described in detail here.

[0108] In the description of this specification, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0109] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of this application, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0110] In this application, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection, an electrical connection, or a communication; it can be a direct connection, or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0111] In the present application, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may include that the first and second features are in direct contact, or may include that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, a first feature being "above", "above" and "above" a second feature includes that the first feature is directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. A first feature being "below", "below" and "below" a second feature includes that the first feature is directly below and obliquely below the second feature, or simply indicates that the first feature is lower in level than the second feature.

[0112] The disclosure above provides many different embodiments or examples to realize the different structures of the present application. In order to simplify the disclosure of the present application, the parts and settings of specific examples are described above. Of course, they are only examples, and the purpose is not to limit the present application. In addition, the present application can repeat reference numerals and / or reference letters in different examples, and this repetition is for the purpose of simplification and clarity, which itself does not indicate the relationship between the various embodiments and / or settings discussed.

[0113] The above is only a specific implementation of the present application, but the protection scope of the present application is not limited thereto. Any technician familiar with the technical field can easily think of various changes or substitutions within the technical scope disclosed in the present application, which should be included in the protection scope of the present application. Therefore, the protection scope of the present application should be based on the protection scope of the claims.

Claims

1. A method for preparing a display panel, characterized in that: include: providing a substrate; The substrate comprises a first surface and a second surface arranged opposite to each other, and the first surface is provided with a signal input electrode; Provide circuit boards; The circuit board comprises a substrate and a wiring layer, wherein the wiring layer comprises a first electrode and a second electrode which are electrically connected; An electrostatic protection structure is arranged on a side of the wiring layer away from the substrate; the electrostatic protection structure comprises an insulating film and a conductive film; fixing the circuit board to the second surface; preparing connection wires electrically connected to the signal input electrode, the first electrode and the conductive film respectively; The electrostatic protection structure is removed.

2. The method for preparing a display panel according to claim 1, characterized in that: The orthographic projection of the electrostatic protection structure on the substrate and the orthographic projection of the first electrode on the substrate have an overlapping area, and the ratio of the size of the overlapping area in the first direction to the size of the first electrode in the first direction is 1 / 4 to 1 / 3; the first direction is the extension direction of the connecting trace on the second surface.

3. The method for preparing a display panel according to claim 2, characterized in that: Preparing connection wires connected to the signal input electrode and the first electrode respectively, comprising: A connecting wire is prepared that spans between the first surface and the second surface, wherein both ends of the connecting wire are electrically connected to the signal input electrode and the first electrode respectively; wherein the connecting wire includes a first connecting portion connected to the first electrode and a second connecting portion connected to the conductive film.

4. The method for preparing a display panel according to claim 3, characterized in that: A size of the second connecting portion in the first direction is greater than or equal to 50 um.

5. The method for preparing a display panel according to claim 3, characterized in that: Removing the electrostatic protection structure includes: The electrostatic protection structure and the second connection portion connected to the conductive film are removed.

6. The method for preparing a display panel according to claim 1, characterized in that: The material of the insulating film includes polyimide, and the material of the conductive film includes indium tin oxide.

7. The method for preparing a display panel according to claim 1, characterized in that: The circuit board further comprises an insulating layer, the insulating layer is located on a side of the wiring layer away from the substrate, the first electrode comprises a first portion for connecting to the connecting wiring, and an orthographic projection of the insulating layer on the plane where the substrate is located is spaced apart from an orthographic projection of the first portion on the plane where the substrate is located; An electrostatic protection structure is provided on a side of the wiring layer away from the substrate, comprising: The electrostatic protection structure is arranged on a side of the insulating layer away from the substrate.

8. The method for preparing a display panel according to any one of claims 1 to 7, characterized in that: Before the electrostatic protection structure is provided on the side of the wiring layer away from the substrate, the method further includes: An electrostatic protection circuit and a ground electrode are prepared in the routing layer; wherein the first electrode and the second electrode are electrically connected to the ground electrode through the electrostatic protection circuit, and the electrostatic protection circuit includes a transistor, the source and the gate of the transistor are electrically connected to the first electrode and the second electrode respectively, and the drain of the transistor is electrically connected to the ground electrode.

9. The method for preparing a display panel according to claim 8, characterized in that: The wiring layer has a first side edge and a second side edge arranged opposite to each other in a first direction, the first electrode is arranged adjacent to the first side edge, and the second electrode is arranged adjacent to the second side edge; the first electrode and the second electrode are respectively arranged in a plurality of rows and intervals in a second direction, and the second direction is perpendicular to the first direction; There are multiple electrostatic protection circuits, and each of the first electrodes and the corresponding second electrode are electrically connected to the corresponding electrostatic protection circuit respectively.

10. The method for preparing a display panel according to any one of claims 1 to 7, characterized in that: Before removing the electrostatic protection structure, the method further comprises: The flip chip film is bonded to the circuit board; the signal output electrode of the flip chip film is electrically connected to the second electrode; the orthographic projection of the flip chip film on the plane where the substrate is located is spaced apart from the orthographic projection of the electrostatic protection structure on the plane where the substrate is located.

11. A display panel, characterized in that: The display panel is manufactured by the manufacturing method of the display panel according to any one of claims 1 to 10, and the display panel comprises: A substrate having a first surface and a second surface arranged opposite to each other, wherein the first surface is provided with a signal input electrode; A circuit board is arranged on the second surface, the circuit board includes a substrate and a wiring layer, the wiring layer includes a first electrode and a second electrode that are electrically connected, and the first electrode is electrically connected to the signal input electrode through a connecting wiring; A chip-on-chip film is disposed on the second surface, and a driving module and a signal output electrode are integrated on the chip-on-chip film, and the signal output electrode is electrically connected to the second electrode.

12. The display panel according to claim 11, characterized in that: The routing layer further includes an electrostatic protection circuit and a ground electrode, and the first electrode and the second electrode are electrically connected to the ground electrode through the electrostatic protection circuit.

13. A display device, characterized in that: Comprising the display panel as claimed in claim 11 or 12.

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