Production and manufacturing method and system of display panel

Abstract

The invention relates to the field of production and manufacturing, in particular to a production and manufacturing method and system of a display panel. The method comprises the following steps: acquiring pickup head information of electromagnetic equipment and chip information after a pickup head adsorbs a to-be-transferred chip, and determining real-time adsorption information of the to-be-transferred chip according to the chip information and the pickup head information; acquiring a real-time transfer image and transfer equipment information in the transfer process, and determining real-time motion information according to the real-time transfer image, the real-time adsorption information and the transfer equipment information; target substrate information is obtained, a real-time adjustment scheme of the to-be-transferred chip in the transferring process is determined according to the target substrate information and the real-time movement information, and the movement process of the to-be-transferred chip is adjusted according to the real-time adjustment scheme. By acquiring and analyzing the pickup head information and the chip information, an accurate reference basis is provided for parameter adjustment of the chip in the transfer process, so that it is ensured that the chip accurately falls on the target substrate, and the production qualification rate of the display panel is remarkably increased.

Description

Technical Field

[0001] The present application relates to the field of manufacturing, and in particular to a method and system for manufacturing a display panel. Background Art

[0002] With the rapid development and popularization of LED display technology, LED display panels are widely used in daily production and life. At the same time, the manufacturing of LED display panels has also attracted attention. In the production process of LED display panels, a mass transfer process is involved. In the mass transfer process, the Micro-LED chip is transferred from the substrate to the target display substrate using electromagnetic transfer technology, which can make the manufactured LED display panel meet the production design requirements.

[0003] However, due to the mechanical nature of electromagnetic transfer technology, there is an objective deviation between the ideal electromagnetic transfer technology and the actual mass transfer process during mass transfer, resulting in inaccurate distribution of Micro-LED chips on the target substrate, thereby affecting the production qualification rate of LED display panels. Summary of the invention

[0004] The present application provides a method and system for manufacturing a display panel to solve the above-mentioned problems.

[0005] In a first aspect, the present application provides a method for manufacturing a display panel, the method comprising: Acquire the pickup head information of the electromagnetic device and the chip information after the pickup head absorbs the chip to be transferred, and determine the real-time absorption information of the chip to be transferred according to the chip information and the pickup head information; Acquire a real-time transfer image and transfer equipment information during the transfer process, and determine real-time motion information according to the real-time transfer image, the real-time adsorption information and the transfer equipment information; The target substrate information is acquired, and a real-time adjustment scheme of the chip to be transferred during the transfer process is determined according to the target substrate information and the real-time motion information, and the motion process of the chip to be transferred is adjusted according to the real-time adjustment scheme.

[0006] Through this solution, the pickup head information and chip information of the electromagnetic device are obtained, the adsorption status of the chip to be transferred is grasped in real time, and the real-time adsorption information of the chip to be transferred is determined based on this. By obtaining the real-time transfer image and transfer equipment information during the transfer process, combined with the real-time adsorption information, the motion trajectory and current state of the chip to be transferred are accurately determined to form real-time motion information. The target substrate information is obtained, and the real-time motion information is integrated to formulate a real-time adjustment plan during the transfer process of the chip to be transferred. According to the real-time adjustment plan, the transfer process of the chip to be transferred is adjusted in real time to avoid production errors caused by unstable adsorption or motion deviation, thereby ensuring that the chip to be transferred is accurately and smoothly transferred to the target substrate. Effectively improve production accuracy and efficiency, reduce operational errors, and ensure high-quality display panel manufacturing.

[0007] Optionally, the chip information includes the chip weight of the current chip and the standard contact area between the chip to be transferred and the pickup head, the pickup head information includes the real-time current, and determining the real-time adsorption information of the chip to be transferred according to the chip information and the pickup head information includes: Acquire a pickup monitoring image, and determine the surface roughness of the pickup head and the contact area between the chip to be transferred and the pickup head according to the pickup monitoring image; According to the surface roughness, the standard contact area, the contact area, the chip weight and the real-time current, the real-time adsorption strength of the chip to be transferred on the pickup head is determined and calculated according to the following formula: ; in, represents the real-time adsorption intensity, Indicates the preset adjustment constant, represents the real-time current, represents the chip weight, represents the contact area, Indicates the degree of surface roughness, represents the standard contact area, Indicates the preset current enhancement factor; The real-time adsorption intensity is incorporated into the real-time adsorption information.

[0008] Through this solution, the surface roughness of the pickup head and the contact area between the chip to be transferred and the pickup head are analyzed through the pickup monitoring image. This helps to accurately calculate the adsorption strength of the chip to be transferred on the pickup head. The real-time adsorption strength is calculated by applying the formula based on the surface roughness, standard contact area, real-time contact area, chip weight and real-time current. The real-time adsorption strength is incorporated into the real-time adsorption information to accurately monitor and adjust the adsorption state of the pickup process, thereby improving the stability and accuracy of the chip to be transferred, and ensuring the safety and transfer efficiency of the chip to be transferred.

[0009] Optionally, the chip information includes a real-time motion temperature of the chip to be transferred when it moves after being released, and the real-time motion information is determined according to the real-time transfer image, the real-time adsorption information and the transfer device information, including: Determine, according to the real-time transfer image, the chip surface roughness of the chip to be transferred and the arrival time required for the chip to be transferred to reach the current position after the release starts; According to the real-time movement temperature, the arrival time, the chip surface roughness, the real-time current, the chip weight and the real-time adsorption strength, the real-time movement speed of the chip to be transferred during the movement is determined and calculated according to the following formula: ; in, represents the real-time motion speed, represents the preset friction coefficient, Indicates the friction coefficient at preset temperature, represents the preset rough friction coefficient, represents the surface roughness of the chip, Indicates the preset current absorption coefficient, represents the arrival time, represents the real-time adsorption intensity, represents the chip weight, represents the real-time motion temperature, represents the real-time current; The real-time motion speed is incorporated into the real-time motion information.

[0010] Through this solution, the surface roughness of the chip is analyzed through real-time transfer images, and the required arrival time is determined based on the motion trajectory of the chip to be transferred from release to the current position. Combined with the real-time motion temperature, arrival time, surface roughness, real-time current, chip weight and real-time adsorption strength, the formula is applied to calculate the real-time motion speed of the chip to be transferred during the motion process. The friction coefficient, the influence of temperature on friction, the correlation between current and adsorption force and other factors are comprehensively considered to accurately reflect the speed change of the chip to be transferred during the motion process. By introducing parameters such as preset friction coefficient, temperature friction coefficient, rough friction coefficient and current adsorption coefficient, the comprehensiveness and accuracy of the calculation are ensured. After the real-time motion speed is calculated, this information will be used as part of the real-time motion information to monitor the motion state of the chip to be transferred in real time, provide accurate data support for subsequent operations, optimize adsorption and stability control during the motion process, and improve the efficiency and reliability of the transfer of the chip to be transferred.

[0011] Optionally, the target substrate information includes an ideal landing position of the chip to be transferred, and determining a real-time adjustment scheme of the chip to be transferred during the transfer process according to the target substrate information and the real-time motion information includes: Predicting the actual landing position of the chip to be transferred on the target substrate according to the real-time movement speed, the real-time adsorption strength and the chip weight; Determining a distance between the actual landing point and the ideal landing point according to the actual landing point; Obtain a position distance error range, and determine whether the landing point position distance is within the position distance error range; If not, the real-time adjustment strength of the magnetic field is determined according to the actual landing point position, the landing point position distance, the position distance error range and the chip weight, and the real-time adjustment strength is incorporated into the real-time adjustment plan.

[0012] Through this scheme, the actual landing point of the chip to be transferred on the target substrate is predicted by real-time movement speed, real-time adsorption strength and chip weight, ensuring a preliminary estimate of the target landing point. The actual landing point is compared with the ideal landing point, the landing point distance between the two is calculated, and the corresponding error range is determined. If the actual landing point exceeds the error range, adjustment is required. According to the actual landing point, distance error and chip weight, the required magnetic field adjustment strength is calculated to correct the landing point deviation of the chip to be transferred. The real-time adjustment strength is incorporated into the real-time adjustment scheme to ensure that the chip to be transferred can accurately fall in the ideal position. By accurately predicting and dynamically adjusting the magnetic field strength, the position error in the transfer of the chip to be transferred is effectively reduced, and the accuracy and stability of the transfer process are improved.

[0013] Optionally, the real-time adsorption information includes an adsorption angle, the pickup head information includes the magnetic field strength and magnetic field direction of the pickup head, the real-time motion information includes an initial release speed of the chip to be transferred when released, and after determining the real-time adjustment strength of the magnetic field according to the actual landing point position, the landing point position distance, the position distance error range and the chip weight, the method further includes: Determining a velocity magnetic field angle according to the initial release speed and the magnetic field direction; Determining an equivalent charge amount according to the magnetic field strength, the velocity magnetic field angle and the initial release speed; According to the chip weight, the adsorption angle, the magnetic field strength, the initial release speed, the equivalent charge, the speed magnetic field angle, the magnetic field direction and the real-time adsorption strength, the real-time movement angle of the chip to be transferred during movement is determined and calculated according to the following formula: ; in, represents the real-time motion angle, represents the real-time adsorption intensity, represents the adsorption angle, represents the chip weight, represents the equivalent charge, represents the magnetic field strength, represents the velocity magnetic field angle, represents the initial release rate; Acquire an ideal motion angle, and determine an angle deviation value according to the ideal motion angle and the real-time motion angle; According to the angle deviation value, the real-time adjustment strength and the magnetic field direction, the direction adjustment angle of the magnetic field direction is determined, and the direction adjustment angle is incorporated into the real-time adjustment scheme.

[0014] Through this scheme, the angle between the speed and the magnetic field is determined according to the initial release speed and magnetic field direction of the chip to be transferred. The equivalent charge is calculated by combining the magnetic field strength, the speed magnetic field angle and the initial release speed. By considering factors such as chip weight, adsorption angle, magnetic field strength, initial release speed, equivalent charge, speed magnetic field angle, etc., the formula is used to calculate the real-time motion angle of the chip to be transferred during the movement. It reflects the changes in the motion state of the chip to be transferred under the action of the external magnetic field. According to the deviation between the ideal motion angle and the actual motion angle, the angle deviation value is calculated. If a deviation exists, the magnetic field direction will be adjusted to determine the required direction adjustment angle and incorporate it into the real-time adjustment plan. Through this dynamic adjustment, it is ensured that the chip to be transferred can maintain the ideal motion trajectory during the transfer process, thereby improving the motion accuracy and stability of the chip to be transferred and optimizing the control during the transfer process.

[0015] Optionally, the target substrate information includes target substrate magnetic permeability, the chip information includes chip magnetic permeability, and determining a real-time adjustment scheme of the chip to be transferred during the transfer process according to the target substrate information and the real-time motion information includes: Determining the spacing distance between the chip to be transferred and the target substrate according to the real-time transfer image; According to the real-time movement speed, the spacing distance, the magnetic permeability of the target substrate, the initial release speed, the magnetic permeability of the chip, the real-time adsorption strength and the chip weight, the speed adjustment value of the magnetic field attenuation speed of the chip to be transferred during the release process is determined and calculated according to the following formula: ; in, Indicates the speed adjustment value, Indicates the preset speed coefficient, represents the real-time adsorption intensity, represents the real-time motion speed, Represents the preset distance attenuation constant, represents the separation distance, represents the initial release rate, represents the chip magnetic permeability, represents the chip weight, represents the magnetic permeability of the target substrate; The speed adjustment value is incorporated into the real-time adjustment scheme.

[0016] Through this scheme, the spacing distance between the chip to be transferred and the target substrate is determined by the real-time transfer image. Combined with the real-time movement speed, spacing distance, magnetic permeability of the target substrate, magnetic permeability of the chip, initial release speed, real-time adsorption strength and chip weight, the magnetic field attenuation speed adjustment value of the chip to be transferred during the release process is calculated. By introducing the preset speed coefficient and attenuation constant, the speed of the magnetic field attenuation during the release process of the chip to be transferred is accurately reflected, and data support is provided for subsequent adjustments. The obtained speed adjustment value will be incorporated into the real-time adjustment scheme to ensure that the magnetic field attenuation of the chip to be transferred during the transfer process is effectively controlled, thereby optimizing the release process of the chip to be transferred and improving the accuracy and stability of the transfer.

[0017] Optionally, the target substrate information includes the substrate roughness and real-time surface temperature of the target substrate, and after determining the real-time adjustment scheme of the chip to be transferred during the transfer process according to the target substrate information and the real-time motion information, the method further includes: Determining whether there are contaminants on the target substrate according to the real-time transfer image; If so, determining the actual number of chips and the type of contaminants on the target substrate based on the real-time transfer image; Determining the actual degree of adhesion of the contaminant on the target substrate according to the contaminant type and the real-time surface temperature; The acoustic wave cleaning frequency is determined according to the actual adhesion degree, the chip weight, the real-time surface temperature, the substrate roughness and the actual number of chips, and is calculated according to the following formula: ; in, represents the sonic cleaning frequency, Indicates the preset cleaning coefficient, Indicates the actual degree of adhesion, represents the chip weight, Indicates the roughness of the substrate, represents the real-time surface temperature, Indicates the actual chip quantity.

[0018] Through this solution, the real-time transfer image is used to determine whether there are contaminants on the target substrate. If there are contaminants, the image is further analyzed to determine the actual number of chips and the type of contaminants on the target substrate. According to the type of contaminant and the real-time surface temperature, the degree of adhesion of the contaminant on the substrate is evaluated. Taking into account the actual degree of adhesion, chip weight, real-time surface temperature, substrate roughness and the actual number of chips, the appropriate ultrasonic cleaning frequency is calculated to ensure the best cleaning effect. The combined effect of the preset cleaning coefficient, actual degree of adhesion, chip weight, substrate roughness, real-time surface temperature and number of chips ensures that the cleaning effect is as expected under different cleaning conditions. By adjusting the ultrasonic cleaning frequency in real time, the contaminants on the target substrate can be effectively removed, ensuring the smooth transfer process of the chips to be transferred and improving the transfer accuracy and efficiency.

[0019] Optionally, the chip information includes chip size and chip shape of each type of chip to be transferred, and determining a real-time adjustment scheme of the chip to be transferred during the transfer process according to the target substrate information and the real-time motion information includes: Determine the real-time position of each chip to be transferred when it reaches above the target substrate according to the real-time transfer image; Matching the ideal landing point position and the real-time position, and determining the deviation angle of each chip to be transferred between the real-time position and the ideal landing point position; Determining a rotation priority of a target substrate according to the chip size and the chip shape; According to the deviation angle and the rotation priority, an angle rotation order of the target substrate is determined, and the angle rotation order is incorporated into the real-time adjustment scheme.

[0020] Through this scheme, the real-time position of each chip to be transferred when it reaches the top of the target substrate is determined by real-time transfer images. The real-time position of each chip to be transferred is matched with the ideal landing point position, so as to calculate the deviation angle of each chip to be transferred. It reflects the degree of deviation of the chip to be transferred from the ideal target position during the transfer process. According to the size and shape of each chip to be transferred, the rotation priority of the target substrate is determined, that is, which chips to be transferred need to be rotated more preferentially to reduce the deviation. According to the deviation angle and rotation priority, the angular rotation order of the target substrate is determined, so as to adjust the angle of the substrate in an orderly manner to ensure that the chip to be transferred can fall in the ideal position as accurately as possible. Through this dynamic adjustment scheme, the transfer process of the chip to be transferred can be precisely controlled, thereby effectively reducing the position deviation of the chip to be transferred and improving the accuracy and efficiency of the transfer.

[0021] Optionally, the real-time motion information includes a real-time motion direction, and determining a real-time adjustment scheme of the chip to be transferred during the transfer process according to the target substrate information and the real-time motion information includes: Predicting the movement trajectory of the chip to be transferred after release according to the initial release speed, the chip weight, the real-time adsorption strength and the magnetic field direction; Determining the actual movement trajectory of the chip to be transferred after being released according to the real-time movement direction and the real-time movement speed; Matching the motion trajectory with the actual motion trajectory, and if the motion trajectory is inconsistent with the actual motion trajectory, determining the secondary motion direction and secondary motion speed corresponding to the secondary motion of the chip to be transferred after being released according to the real-time transfer image; Acquire airflow information, and determine the airflow velocity and airflow intensity according to the airflow information; Determining a secondary motion trajectory corresponding to each type of chip to be transferred according to the secondary motion direction, the airflow velocity, the airflow intensity, the chip weight and the secondary motion velocity; According to the secondary motion trajectory and the magnetic field strength, a gradient adjustment value of the magnetic field is determined, and the gradient adjustment value is incorporated into the real-time adjustment scheme.

[0022] Through this solution, the real-time position of each chip to be transferred when it reaches the top of the target substrate is determined by real-time transfer images. The real-time position of each chip to be transferred is matched with the ideal landing point position to calculate the deviation angle of the chip to be transferred, that is, the angle difference between the actual position and the ideal position. According to the size and shape of each chip to be transferred, the rotation priority of the target substrate is determined to ensure that the rotation order of the substrate can optimize the positioning accuracy of the chip to be transferred to the greatest extent. According to the deviation angle and rotation priority, the rotation order of the target substrate is further determined to most effectively place the chip to be transferred to the ideal position. Through this dynamic adjustment process, the precise alignment of the chip to be transferred on the target substrate is ensured, and the accuracy and efficiency of the transfer process are optimized.

[0023] In a second aspect, the present application provides a display panel manufacturing system, the system comprising: An adsorption information determination module is used to obtain the pickup head information of the electromagnetic device and the chip information after the pickup head adsorbs the chip to be transferred, and determine the real-time adsorption information of the chip to be transferred according to the chip information and the pickup head information; A motion information determination module, used to obtain a real-time transfer image and transfer device information during the transfer process, and determine real-time motion information according to the real-time transfer image, the real-time adsorption information and the transfer device information; The adjustment scheme determination module is used to obtain target substrate information, determine the real-time adjustment scheme of the chip to be transferred during the transfer process according to the target substrate information and the real-time motion information, and adjust the transfer process of the chip to be transferred according to the real-time adjustment scheme. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, a brief introduction will be given below to the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative labor.

[0025] Figure 1 A schematic diagram of an application scenario provided for an embodiment of the present application; Figure 2 A flowchart of a method for manufacturing a display panel provided in one embodiment of the present application; Figure 3 A schematic diagram of the structure of a display panel production and manufacturing system provided in one embodiment of the present application. DETAILED DESCRIPTION

[0026] In order to make the purpose, technical scheme and advantages of the embodiments of the present application clearer, the technical scheme in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0027] In addition, the term "and / or" in this article is only a description of the association relationship of associated objects, indicating that there can be three relationships. For example, A and / or B can represent: A exists alone, A and B exist at the same time, and B exists alone. In addition, the character " / " in this article, unless otherwise specified, generally means that the associated objects before and after are in an "or" relationship.

[0028] The embodiments of the present application are further described in detail below in conjunction with the drawings in the specification.

[0029] Due to the mechanical nature of electromagnetic transfer technology, there is an objective deviation between the ideal electromagnetic transfer technology and the actual mass transfer process during mass transfer, resulting in inaccurate distribution of Micro-LED chips on the target substrate, thus affecting the production qualification rate of LED display panels.

[0030] Based on this, the present application provides a method and system for manufacturing a display panel, which obtains the pickup head information and chip information of the electromagnetic device, grasps the adsorption status of the chip in real time, and determines the real-time adsorption information of the chip based on this. By obtaining the real-time transfer image and transfer equipment information during the transfer process, combined with the real-time adsorption information, the movement trajectory and current state of the chip are accurately determined to form real-time motion information. The target substrate information is obtained, and the real-time motion information is integrated to formulate a real-time adjustment plan during the chip transfer process. The chip transfer process is adjusted in real time according to the real-time adjustment plan to avoid production errors caused by unstable adsorption or motion deviation, thereby ensuring that the chip is accurately and smoothly transferred to the target substrate. It effectively improves production accuracy and efficiency, reduces operating errors, and ensures high-quality display panel manufacturing.

[0031] Figure 1 A schematic diagram of an application scenario provided for the present application. When manufacturing display panels, the method provided by the present application is applied to obtain and analyze pickup head information and chip information to determine real-time adsorption information; obtain real-time transfer image and transfer device information, and determine real-time motion information based on the real-time transfer image, real-time adsorption information and transfer device information; obtain target substrate information, and determine a real-time adjustment plan based on the target substrate information and real-time motion information.

[0032] Specifically, the method provided by the present application is applied to any server, and the server interacts with the production and manufacturing system and the production monitoring equipment. The production and manufacturing system can be a system for managing and controlling the production and manufacturing process of the display panel. The production and manufacturing system can include a database with a dynamic adjustment function, and the database can store dynamic data of the production and manufacturing process of the display panel. The production monitoring equipment can be a device for monitoring the production and manufacturing process of the display panel. The production monitoring equipment can include a monitoring camera device and a gas monitoring device. The monitoring camera device can be a device for monitoring the transfer process of the chip to be transferred. The gas monitoring device can be a device for monitoring the gas during the transfer process of the chip to be transferred. The server obtains and analyzes the target substrate information, chip information, pickup head information, transfer equipment information and real-time transfer images of the production monitoring equipment of the production and manufacturing system, determines the real-time adjustment plan, and sends the real-time adjustment plan to the production and manufacturing system. By obtaining the pickup head information and chip information, the real-time adsorption information of the chip to be transferred is determined, and the real-time transfer image and transfer equipment information are combined to accurately analyze the real-time motion information of the chip to be transferred, and a real-time adjustment plan is formulated according to the real-time motion information and target substrate information. The transfer process of the chip to be transferred is adjusted in real time according to the real-time adjustment plan to ensure that the chip to be transferred is accurately and smoothly transferred to the target substrate, thereby improving production accuracy and efficiency.

[0033] For specific implementation methods, please refer to the following embodiments.

[0034] Figure 2 This is a flow chart of a method for manufacturing a display panel provided in an embodiment of the present application. The method of this embodiment can be applied to the server in the above scenario. Figure 2 As shown, the method includes: S201, obtaining the pickup head information of the electromagnetic device and the chip information after the pickup head absorbs the chip to be transferred, and determining the real-time absorption information of the chip to be transferred according to the chip information and the pickup head information.

[0035] The pickup head information may be information corresponding to a device for adsorbing the chip to be transferred. The pickup head information may include the real-time current passing through the pickup head and the number of turns of the coil of the pickup head.

[0036] The chip information may be information about the chip to be transferred, and may include the chip plane area and the chip weight.

[0037] The real-time adsorption information may be information indicating the specific state of the chip to be transferred on the pickup head after the chip to be transferred is adsorbed by the pickup head.

[0038] Specifically, due to the influence of factors such as the specifications and size of the chip to be transferred, the current passing through the pickup head, and the number of turns of the pickup head coil, the presentation state of the chip to be transferred after being picked up by the pickup head will change differently.

[0039] Therefore, the pickup head information and chip information of the chip to be transferred are obtained from the manufacturing system. The number of coil turns of the pickup head and the real-time current passing through the pickup head are extracted from the pickup head information, and the chip plane area and chip weight of the chip to be transferred are extracted from the chip information. The number of coil turns, real-time current, chip plane area and chip weight are analyzed using mathematical analysis methods to obtain the actual contact area between the chip to be transferred and the pickup head, and the actual contact area is included in the real-time adsorption information.

[0040] S202, acquiring a real-time transfer image and transfer device information during the transfer process, and determining real-time motion information according to the real-time transfer image, the real-time adsorption information and the transfer device information.

[0041] The real-time transfer image may be an image obtained by real-time monitoring of the process of transferring the chip to be transferred to the target substrate after the pickup head picks up the chip to be transferred.

[0042] The transfer device information may be information of a device corresponding to the process of transferring the chip to be transferred to the target substrate after the pickup head picks up the chip to be transferred. The transfer device information may include a vibration frequency of the transfer device.

[0043] The real-time motion information may be information formed by the motion change of the chip to be transferred during the process in which the chip to be transferred is released from the pickup head and moves to the target substrate after the pickup head picks up the chip to be transferred and reaches above the target substrate.

[0044] Specifically, a real-time transfer image is obtained from a production monitoring device. Transfer device information is obtained from a production manufacturing system. The real-time transfer image is analyzed using an image analysis algorithm to obtain the actual position coordinates of the chip to be transferred on the pickup head before release. The vibration frequency of the transfer device is extracted from the transfer device information. The actual position coordinates, vibration frequency, and actual contact area obtained in step S201 are analyzed using a mathematical analysis method to obtain the real-time motion duration of the chip to be transferred during the motion process, and the real-time motion duration is incorporated into the real-time motion information.

[0045] S203, obtaining target substrate information, determining a real-time adjustment plan for the chip to be transferred during the transfer process according to the target substrate information and the real-time motion information, and adjusting the motion process of the chip to be transferred according to the real-time adjustment plan.

[0046] The target substrate information may be information of the substrate corresponding to the target position where the chip to be transferred finally stops. The target substrate information may include magnetic permeability of the target substrate.

[0047] The real-time adjustment scheme may be a scheme formulated to adjust the real-time movement of the chip to be transferred during the process of the chip to be transferred moving from the pickup head to the target substrate so that the chip to be transferred can accurately fall on a specified position of the target substrate.

[0048] Specifically, the target substrate information is obtained from the manufacturing system. The target substrate magnetic permeability is extracted from the target substrate information. The target substrate magnetic permeability and the real-time motion duration are analyzed using a mathematical analysis method to obtain a real-time current adjustment value of the pickup head, and the real-time current adjustment value is incorporated into a real-time adjustment plan. The real-time adjustment plan is sent to the manufacturing system, and in order to enable the chip to accurately fall on the specified position of the target substrate, the manufacturing system adjusts the real-time motion of the chip to be transferred in real time according to the real-time adjustment plan.

[0049] Through this solution, the pickup head information and chip information of the electromagnetic device are obtained, the adsorption status of the chip to be transferred is grasped in real time, and the real-time adsorption information of the chip to be transferred is determined based on this. By obtaining the real-time transfer image and transfer equipment information during the transfer process, combined with the real-time adsorption information, the motion trajectory and current state of the chip to be transferred are accurately determined to form real-time motion information. The target substrate information is obtained, and the real-time motion information is integrated to formulate a real-time adjustment plan during the transfer process of the chip to be transferred. According to the real-time adjustment plan, the transfer process of the chip to be transferred is adjusted in real time to avoid production errors caused by unstable adsorption or motion deviation, thereby ensuring that the chip to be transferred is accurately and smoothly transferred to the target substrate. Effectively improve production accuracy and efficiency, reduce operating errors, and ensure high-quality display panel manufacturing.

[0050] In some embodiments, a pick-up monitoring image is obtained, and the surface roughness of the pick-up head and the contact area between the chip to be transferred and the pick-up head are determined according to the pick-up monitoring image; the real-time adsorption strength of the chip to be transferred on the pick-up head is determined according to the surface roughness, the standard contact area, the contact area, the chip weight and the real-time current, and the real-time adsorption strength is included in the real-time adsorption information: (1) in, Indicates the real-time adsorption strength, Indicates the preset adjustment constant, Indicates the real-time current, Indicates the chip weight, represents the contact area, Indicates the surface roughness. represents the standard contact area, Indicates the preset current enhancement factor.

[0051] The pickup monitoring image may be an image obtained by monitoring the adsorption surface of the pickup head after the pickup head picks up the chip to be transferred.

[0052] The contact area may be an area formed by the contact range between the chip to be transferred and the pickup head after the pickup head picks up the chip to be transferred.

[0053] The standard contact area may be an area formed by the contact range between the chip to be transferred and the adsorption surface of the pickup head under an ideal state after the pickup head picks up the chip to be transferred.

[0054] The real-time adsorption strength may be a value corresponding to the strength of the adsorption force of the pickup head on the chip to be transferred after the pickup head picks up the chip to be transferred.

[0055] The preset adjustment constant may be a value corresponding to the influence of each calculation factor on the calculation result of the real-time adsorption intensity when calculating the real-time adsorption intensity by normalizing and adjusting.

[0056] The preset current enhancement coefficient may be a value indicating the influence of the real-time current on the calculation result when calculating the real-time adsorption intensity.

[0057] The real-time current may be the current passing through the pickup head coil when the pickup head picks up the chip to be transferred.

[0058] Specifically, the real-time transfer image may include an image obtained by monitoring the adsorption surface of the pickup head. Therefore, the pickup monitoring image is obtained from the monitoring camera device. The pickup monitoring image is analyzed by an image analysis method to obtain the roughness of the pickup head surface and the contact area between the chip to be transferred and the pickup head. The standard contact area between the chip to be transferred and the pickup head is extracted from the chip information. The historical surface roughness, historical standard contact area, historical contact area, historical chip weight and historical real-time current are obtained from the production and manufacturing system, and the historical surface roughness, historical standard contact area, historical contact area, historical chip weight and historical real-time current are analyzed by a linear regression analysis method to obtain a preset adjustment constant and a preset current enhancement coefficient. The surface roughness, standard contact area, contact area, chip weight, real-time current, preset adjustment constant and preset current enhancement coefficient are analyzed by a mathematical analysis method, and the real-time adsorption strength of the chip to be transferred on the pickup head is determined according to formula (1).

[0059] In formula (1), the contact area The larger the value, the stronger the contact force between the chip to be transferred and the pickup head. Standard contact area Used to compare actual contact area. Rough surfaces provide more tiny contact points, thus increasing adhesion. Considering them together is equivalent to adding a practical correction to the contact strength into the formula. When the contact area increases, the adsorption force should also increase accordingly; and the increase in surface roughness will increase the contact force. This is reflected in the formula. By correcting the actual contact area and roughness, the calculation results can be made more consistent with the actual situation. The larger it is, the stronger the contact force and the greater the adsorption force. The influence of surface microstructure is considered. The larger it is, the greater the contact force will generally be, as it directly affects the strength of the adsorption force.

[0060] Chip weight Directly affects the required suction force. A heavier chip to be transferred will have greater inertia and require a stronger suction force to ensure that it does not fall off or slide during the picking process. By directly multiplying the formula by , which can ensure that the heavier chips to be transferred have sufficient adsorption force. It directly determines the gravity that the adsorption force needs to overcome. ,Formula (1) can adapt to the situation of chips with different weights to be transferred, ensuring the accurate calculation of the adsorption force.

[0061] :The pickup head uses the electromagnetic principle to enhance the adsorption force. The larger the current, the stronger the electromagnetic effect, which in turn enhances the adsorption force. The change of real-time current will affect the strength of the electric field, which directly affects the adsorption strength. By introducing the current enhancement factor , the adsorption force can be dynamically adjusted to cope with the working conditions under different currents, ensuring the stability of the picking process. The introduction of is to compensate for the gap between theoretical calculation and actual operation, and also to take into account the differences between different pick-up heads or chips to be transferred. The introduction of allows the formula to be flexibly adjusted according to actual conditions.

[0062] Through this solution, the surface roughness of the pickup head and the contact area between the chip to be transferred and the pickup head are analyzed through the pickup monitoring image. This helps to accurately calculate the adsorption strength of the chip to be transferred on the pickup head. The real-time adsorption strength is calculated by applying the formula based on the surface roughness, standard contact area, real-time contact area, chip weight and real-time current. The real-time adsorption strength is incorporated into the real-time adsorption information to accurately monitor and adjust the adsorption state of the pickup process, thereby improving the stability and accuracy of the chip to be transferred, and ensuring the safety and transfer efficiency of the chip to be transferred.

[0063] In some embodiments, the chip surface roughness of the chip to be transferred and the arrival time required for the chip to be transferred to reach the current position after the release is started are determined according to the real-time transfer image; the real-time movement speed of the chip to be transferred during the movement is determined according to formula (2) based on the real-time movement temperature, arrival time, chip surface roughness, real-time current, chip weight and real-time adsorption strength, and the real-time movement speed is included in the real-time movement information: (2) in, Indicates the real-time motion speed. represents the preset friction coefficient, Indicates the friction coefficient at preset temperature, represents the preset rough friction coefficient, Indicates the surface roughness of the chip. Indicates the preset current absorption coefficient, Indicates the arrival time, Indicates the real-time adsorption strength, Indicates the chip weight, Indicates real-time motion temperature, Indicates real-time current.

[0064] The arrival time may be the length of time it takes for the chip to be transferred to reach the current position after it is released from the pickup head and starts to move.

[0065] The real-time motion temperature may be the temperature of the chip itself when the chip to be transferred is released from the pickup head and starts to move.

[0066] The real-time movement speed may be a speed corresponding to the movement of the chip to be transferred when the chip to be transferred is released from the pickup head and starts to move.

[0067] The preset friction coefficient may be a value indicating the influence of the friction between the chip to be transferred and the air on the calculation result of the real-time movement speed when calculating the real-time movement speed.

[0068] The preset temperature friction coefficient may be a value indicating the effect of the temperature on the friction between the chip and the air on the calculation result of the real-time motion speed when calculating the real-time motion speed.

[0069] The preset rough friction coefficient may be a value indicating the effect of the chip surface roughness on the friction between the chip and the air on the calculation result of the real-time motion speed when calculating the real-time motion speed.

[0070] The preset current absorption coefficient may be a value indicating the influence of the real-time current on the calculation result of the real-time movement speed when calculating the real-time movement speed.

[0071] Specifically, the real-time transfer image is analyzed using an image analysis method to obtain the chip surface roughness. The real-time transfer image is analyzed using a target detection and tracking algorithm to obtain the arrival time required for the chip to be transferred to reach the current position after the release begins. The historical real-time motion temperature, historical arrival time, historical chip surface roughness, historical real-time current, historical chip weight and historical real-time adsorption strength are obtained from the production and manufacturing system, and the historical real-time motion temperature, historical arrival time, historical chip surface roughness, historical real-time current, historical chip weight and historical real-time adsorption strength are analyzed using a linear regression analysis method to obtain a preset friction coefficient, a preset temperature friction coefficient, a preset rough friction coefficient and a preset current adsorption coefficient. The real-time motion temperature is obtained from the chip information, and a mathematical analysis method is used to analyze the preset friction coefficient, the preset temperature friction coefficient, the preset rough friction coefficient, the preset current adsorption coefficient, the real-time motion temperature, the arrival time, the chip surface roughness, the real-time current, the chip weight and the real-time adsorption strength. The real-time motion speed of the chip to be transferred during the motion process is obtained according to formula (2), and the real-time motion speed is incorporated into the real-time motion information.

[0072] In formula (2), the effect of temperature on friction is expressed by and real-time motion temperature As the temperature increases, the friction of an object tends to change, which can be modeled by the temperature friction coefficient As the temperature increases, the friction coefficient decreases, which means that the movement of the chip to be transferred becomes smoother. This adjustment is based on the effect of temperature on the material properties. Too high or too low a temperature will change the nature of the friction. Affects the friction between the contacting surfaces. A rougher surface generally increases friction, thus slowing down the movement of the chip being transferred. The effect of friction on to adjust, reflecting the difference in friction between rough and smooth surfaces.

[0073] Real-time adsorption strength Generated by the interaction between the electromagnetic field and the chip to be transferred. Real-time current It will affect the strength of the adsorption force, because the electromagnetic adsorption force is proportional to the current. Therefore, the greater the real-time current, The stronger it is, the slower the movement of the chip to be transferred may be. Real-time current The influence of a preset current absorption coefficient Make adjustments. This affects the effect of gravity, which in turn affects the amount of friction. Heavier chips to be transferred will produce greater friction, so more suction force is required to overcome friction.

[0074] Real-time motion temperature Impact on movement: During the electromagnetic transfer process, the temperature of the chip to be transferred is not only affected by the external environment, but also changes due to factors such as friction and current. It is mainly reflected in the following aspects: 1. The friction coefficient of the material will decrease or increase with the increase of temperature, which directly affects the movement of the chip. As the temperature rises, the friction force will decrease, resulting in smoother movement of the chip to be transferred. 2. If the temperature of the chip to be transferred is too high, it will cause material deformation, thermal expansion or changes in electromagnetic properties, which will affect the movement trajectory. 3. Temperature will affect the electromagnetic adsorption force. When the current passes through the electromagnetic field, the temperature change will cause the adsorption force to change, thereby affecting the movement speed of the chip to be transferred. The effect of temperature on the coefficient of friction is described. Controls the effect of temperature changes on friction. When the temperature rises, Increase, The temperature will decrease, thus reducing the influence of friction and making the chip to be transferred move faster. Temperature changes can have a positive or negative effect on friction. It is used to increase the movement speed linearly according to time, reflecting the change in speed of the chip to be transferred from the pick-up to the target substrate.

[0075] Through this solution, the surface roughness of the chip is analyzed through real-time transfer images, and the required arrival time is determined based on the motion trajectory of the chip to be transferred from release to the current position. Combined with the real-time motion temperature, arrival time, surface roughness, real-time current, chip weight and real-time adsorption strength, the formula is applied to calculate the real-time motion speed of the chip to be transferred during the motion process. The friction coefficient, the influence of temperature on friction, the correlation between current and adsorption force and other factors are comprehensively considered to accurately reflect the speed change of the chip to be transferred during the motion process. By introducing parameters such as preset friction coefficient, temperature friction coefficient, rough friction coefficient and current adsorption coefficient, the comprehensiveness and accuracy of the calculation are ensured. After the real-time motion speed is calculated, this information will be used as part of the real-time motion information to monitor the motion state of the chip to be transferred in real time, provide accurate data support for subsequent operations, optimize adsorption and stability control during the motion process, and improve the efficiency and reliability of the transfer of the chip to be transferred.

[0076] In some embodiments, the actual landing position of the chip to be transferred on the target substrate is predicted based on the real-time movement speed, real-time adsorption strength and chip weight; the landing position distance is determined based on the actual landing position and the ideal landing position; the position distance error range is obtained to determine whether the landing position distance is within the position distance error range; if not, the real-time adjustment strength of the magnetic field is determined based on the actual landing position, the landing position distance, the position distance error range and the chip weight, and the real-time adjustment strength is incorporated into the real-time adjustment plan.

[0077] The actual landing point position may be the landing point position of the chip to be transferred on the target substrate obtained by predicting the movement process of the chip to be transferred after being released before the chip to be transferred is released from the pickup head.

[0078] The ideal landing point position may be a corresponding position on the target substrate where the chip to be transferred reaches in an ideal movement state after the chip to be transferred is released from the pickup head and moves.

[0079] The position distance error range may be a range corresponding to the allowable conditions of production error, indicating that the distance between the actual landing position and the ideal landing position of the chip to be transferred is within the range after the chip to be transferred is released from the pickup head and moves.

[0080] The real-time adjustment strength may be an adjustment value determined when the magnetic field strength of the pickup head is adjusted in real time after the chip to be transferred is released from the pickup head and moves.

[0081] Specifically, a mathematical analysis method is used to analyze the real-time motion speed, real-time adsorption strength and chip weight to predict the actual landing position of the chip to be transferred on the target substrate. The ideal landing position of the chip to be transferred on the target substrate is extracted from the target substrate information. A spatial rectangular coordinate system is established with the actual landing position as the coordinate origin, and the ideal landing position is marked in the spatial rectangular coordinate system to obtain the coordinates of the ideal landing position. The ideal landing position coordinates and the coordinate origin are analyzed using a mathematical analysis method to obtain the landing position distance. The position distance error range is obtained from the production and manufacturing system, and the landing position distance is matched with the position distance error range to determine whether the landing position distance is within the position distance error range. If not, the maximum distance error is extracted from the position distance error range. The maximum distance error is subtracted from the landing position distance to obtain a distance subtraction value. Based on the actual landing position, a mathematical analysis method is used to analyze the distance subtraction value and the chip weight to obtain a real-time adjustment strength, and the real-time adjustment strength is incorporated into the real-time adjustment plan.

[0082] Through this scheme, the actual landing point of the chip to be transferred on the target substrate is predicted by real-time movement speed, real-time adsorption strength and chip weight, ensuring a preliminary estimate of the target landing point. The actual landing point is compared with the ideal landing point, the landing point distance between the two is calculated, and the corresponding error range is determined. If the actual landing point exceeds the error range, adjustment is required. According to the actual landing point, distance error and chip weight, the required magnetic field adjustment strength is calculated to correct the landing point deviation of the chip to be transferred. The real-time adjustment strength is incorporated into the real-time adjustment scheme to ensure that the chip to be transferred can accurately fall in the ideal position. By accurately predicting and dynamically adjusting the magnetic field strength, the position error in the transfer of the chip to be transferred is effectively reduced, and the accuracy and stability of the transfer process are improved.

[0083] In some embodiments, the velocity magnetic field angle is determined according to the initial release speed and the magnetic field direction; the equivalent charge is determined according to the magnetic field strength, the velocity magnetic field angle and the initial release speed; the real-time motion angle of the chip to be transferred during movement is determined according to the chip weight, the adsorption angle, the magnetic field strength, the initial release speed, the equivalent charge, the velocity magnetic field angle, the magnetic field direction and the real-time adsorption strength according to formula (3); the ideal motion angle is obtained, and the angle deviation value is determined according to the ideal motion angle and the real-time motion angle; the direction adjustment angle of the magnetic field direction is determined according to the angle deviation value, the real-time adjustment strength and the magnetic field direction, and the direction adjustment angle is incorporated into the real-time adjustment scheme: (3) in, Indicates the real-time motion angle, Indicates the real-time adsorption strength, represents the adsorption angle, Indicates the chip weight, represents the equivalent charge, represents the magnetic field strength, represents the velocity magnetic field angle, Indicates the initial release velocity.

[0084] The initial release speed may be a speed at the beginning of movement after the chip to be transferred is released from the pickup head.

[0085] The direction of the magnetic field may be a direction corresponding to the magnetic field generated by the pickup head after the pickup head releases the chip to be transferred.

[0086] The velocity magnetic field angle may be the angle formed between the magnetic field direction of the pickup head and the vector of the initial release velocity after the pickup head releases the chip to be transferred.

[0087] The equivalent charge amount may be the charge amount required for the magnetic field force acting on the chip to be transferred in the magnetic field generated by the pickup head.

[0088] The real-time motion angle may be an angle formed between the chip to be transferred and the horizontal line when the chip to be transferred moves after the pickup head releases the chip to be transferred.

[0089] The adsorption angle may be an angle formed between a horizontal line and a direction corresponding to the adsorption force generated by the pickup head on the chip to be transferred when the pickup head adsorbs the chip to be transferred.

[0090] The angle deviation value may be a value obtained by subtracting the ideal motion angle from the real-time motion angle.

[0091] The direction adjustment angle may be a value determined when the angle corresponding to the magnetic field direction of the pickup head is adjusted when the chip to be transferred moves after being separated from the pickup head.

[0092] Specifically, the magnetic field strength and magnetic field direction of the pickup head are extracted from the pickup head information. The adsorption angle is extracted from the real-time adsorption information. The initial release speed is extracted from the real-time motion information. The initial release direction is extracted from the initial release speed, and the initial release direction and the magnetic field direction are marked in the spatial rectangular coordinate system obtained in the above steps to obtain the initial release direction coordinates and the magnetic field direction coordinates. The initial release coordinates and the magnetic field direction coordinates are analyzed using a mathematical analysis method to obtain the speed magnetic field angle. The magnetic field strength, speed magnetic field angle and initial release speed are analyzed using a mathematical analysis method to obtain the equivalent charge. The chip weight, adsorption angle, magnetic field strength, initial release speed, equivalent charge, speed magnetic field angle, magnetic field direction and real-time adsorption strength are analyzed using a mathematical analysis method, and the real-time motion angle is calculated according to formula (3).

[0093] In formula (3), Describes the component of the resultant force that affects the movement angle of the chip to be transferred in the vertical direction (assuming it is the movement direction of the chip): It is the component of the adsorption force in the direction of chip movement, which provides a certain force support. Acting on the chip to be transferred in the vertical direction, a downward force is generated. It is caused by the effect of the magnetic field on the transfer chip. Indicates the magnitude of the force applied to the chip to be transferred in the magnetic field after it is charged. is the adjustment coefficient of the magnetic field force, which represents the component of the magnetic field force in the vertical direction. It represents the resultant force of all forces in the vertical direction (the component in the direction of chip movement), which determines whether the movement of the chip to be transferred is affected by gravity, and how the adsorption force and magnetic field force work together.

[0094] Describes the component of the resultant force that affects the chip's motion angle in the horizontal direction (perpendicular to the chip's motion direction): The effect of magnetic field on the chip to be transferred. Compared with the previous item, Considering the horizontal component of the magnetic field force, It is to adjust the coefficient of this force in the horizontal direction. When the chip to be transferred moves in the magnetic field, the magnetic field force not only has an effect in the vertical direction, but also has a certain effect in the horizontal direction. It comes from the horizontal component of the adsorption force, which determines the adsorption force effect on the chip to be transferred during the release process. It represents the component of the resultant force in the horizontal direction, and describes the combined effect of the magnetic field force and the adsorption force in the horizontal direction on the chip to be transferred when it moves.

[0095] The ideal motion angle is obtained from the manufacturing system, and the ideal motion angle is subtracted from the real-time motion angle to obtain the angle deviation value. The angle deviation value, real-time adjustment strength and magnetic field direction are analyzed using mathematical analysis methods to obtain the direction adjustment angle, which is then incorporated into the real-time adjustment plan.

[0096] Through this scheme, the angle between the speed and the magnetic field is determined according to the initial release speed and magnetic field direction of the chip to be transferred. The equivalent charge is calculated by combining the magnetic field strength, the speed magnetic field angle and the initial release speed. By considering factors such as chip weight, adsorption angle, magnetic field strength, initial release speed, equivalent charge, speed magnetic field angle, etc., the formula is used to calculate the real-time motion angle of the chip to be transferred during the movement. It reflects the changes in the motion state of the chip to be transferred under the action of the external magnetic field. According to the deviation between the ideal motion angle and the actual motion angle, the angle deviation value is calculated. If a deviation exists, the magnetic field direction will be adjusted to determine the required direction adjustment angle and incorporate it into the real-time adjustment plan. Through this dynamic adjustment, it is ensured that the chip to be transferred can maintain the ideal motion trajectory during the transfer process, thereby improving the motion accuracy and stability of the chip to be transferred and optimizing the control during the transfer process.

[0097] In some embodiments, the spacing distance between the chip to be transferred and the target substrate is determined according to the real-time transfer image; the speed adjustment value of the magnetic field attenuation speed of the chip to be transferred during the release process is determined according to the real-time movement speed, the spacing distance, the magnetic permeability of the target substrate, the initial release speed, the magnetic permeability of the chip, the real-time adsorption strength and the chip weight, and the speed adjustment value is incorporated into the real-time adjustment scheme: (4) in, Indicates the speed adjustment value. Indicates the preset speed coefficient, Indicates the real-time adsorption strength, Indicates the real-time motion speed. Represents the preset distance attenuation constant, Indicates the interval distance, represents the initial release velocity, represents the magnetic permeability of the chip, Indicates the chip weight, Indicates the target substrate permeability.

[0098] The spacing distance may be a vertical distance between the chip to be transferred and the target substrate when the pickup head picks up the chip to be transferred and reaches above the target substrate.

[0099] The magnetic permeability of the target substrate may be a value corresponding to a physical quantity of the target substrate's ability to conduct magnetic flux.

[0100] The chip magnetic permeability may be a physical quantity value of the ability of the chip to be transferred to conduct magnetic flux.

[0101] The speed adjustment value may be an adjustment value determined by adjusting the attenuation speed corresponding to the magnetic field generated by the pickup head in order to make the chip fall accurately on the ideal position of the target substrate after the chip to be transferred leaves the pickup head and starts to move.

[0102] The preset speed coefficient may be a value indicating the comprehensive influence of each calculation factor on the calculation result of the speed adjustment value when calculating the speed adjustment value.

[0103] The preset distance attenuation constant may be a value indicating the effect of the interval distance on the calculation result of the speed adjustment value when calculating the speed adjustment value.

[0104] Specifically, computer vision processing technology is used to analyze the real-time transfer image to obtain the interval distance between the chip to be transferred and the target substrate. The historical real-time movement speed, historical interval distance, historical target substrate magnetic permeability, historical initial release speed, historical chip magnetic permeability, historical real-time adsorption strength and historical chip weight are obtained from the production and manufacturing system, and the historical real-time movement speed, historical interval distance, historical target substrate magnetic permeability, historical initial release speed, historical chip magnetic permeability, historical real-time adsorption strength and historical chip weight are analyzed using a linear regression analysis method to obtain a preset speed coefficient and a preset distance attenuation constant. The target substrate magnetic permeability is extracted from the target substrate information. The chip magnetic permeability is extracted from the chip information. The real-time movement speed, interval distance, target substrate magnetic permeability, initial release speed, chip magnetic permeability, real-time adsorption strength, chip weight, preset speed coefficient and preset distance attenuation constant are analyzed using a mathematical analysis method to obtain the speed adjustment peak value of the magnetic field attenuation speed of the chip to be transferred during the release process, and the speed adjustment peak value is incorporated into the real-time adjustment scheme.

[0105] Among them, in formula (4), the numerator is: middle, and Determines the material's ability to respond to magnetic fields. and The larger it is, the more attractive the chip to be transferred will be. The magnetic interaction between the chip to be transferred and the target substrate can be quantified. If the magnetic permeability of the chip to be transferred or the target substrate is higher, the chip to be transferred will be subjected to a stronger magnetic field, requiring a larger speed adjustment (i.e., increasing the magnetic field). ). Assume that the speed of the chip to be transferred when it starts to be released is , the speed of the chip to be transferred will change as the magnetic field force between the chip to be transferred and the target substrate acts. As time goes by, the real-time motion speed It will slow down or speed up due to the change of magnetic field attraction. The larger it is, the more the speed of the chip to be transferred deviates from the initial setting value, and more speed adjustments are needed to correct its motion trajectory. Directly affects the speed adjustment value, which reflects the difference between the actual movement speed of the chip to be transferred and the initial release speed. The larger it is, the greater the degree of adjustment.

[0106] Denominator: The strength of the magnetic field usually decreases with increasing distance, so the separation distance In the denominator, it plays a role in weakening the magnetic field force. The farther the distance between the chip to be transferred and the target substrate, the weaker the magnetic field force will be, and a stronger speed adjustment is required to maintain the motion trajectory of the chip to be transferred. In the process, gravity causes the chip to be transferred to always be subjected to a downward force. This force and Closely related. Usually, The larger the adsorption force, the greater the inertia that the magnetic field force needs to overcome, making speed adjustment more difficult. Under the magnetic force between the chip to be transferred and the target substrate, the stronger the adsorption force, the greater the magnetic field force on the chip, and the speed of movement will also change. If the adsorption force is very strong, the acceleration of the chip to be transferred will be greater, and the speed change will be faster, so more precise adjustments are required. Putting it in the denominator reflects its inhibitory effect on speed adjustment: the greater the force on the chip to be transferred, the more difficult it is to change the speed, so a smaller speed adjustment is required. The reason for the denominator is that the farther the distance, the weaker the magnetic field strength, so a smaller speed adjustment value is needed to adjust the chip speed to adapt to the distance attenuation effect. The position of the denominator shows that a larger force will slow down the change in speed, so a relatively small speed adjustment value is needed to adjust the movement of the chip to be transferred.

[0107] Through this scheme, the spacing distance between the chip to be transferred and the target substrate is determined by the real-time transfer image. Combined with the real-time movement speed, spacing distance, magnetic permeability of the target substrate, magnetic permeability of the chip, initial release speed, real-time adsorption strength and chip weight, the magnetic field attenuation speed adjustment value of the chip to be transferred during the release process is calculated. By introducing the preset speed coefficient and attenuation constant, the speed of the magnetic field attenuation during the release process of the chip to be transferred is accurately reflected, and data support is provided for subsequent adjustments. The obtained speed adjustment value will be incorporated into the real-time adjustment scheme to ensure that the magnetic field attenuation of the chip to be transferred during the transfer process is effectively controlled, thereby optimizing the release process of the chip to be transferred and improving the accuracy and stability of the transfer.

[0108] In some embodiments, it is determined whether there are contaminants on the target substrate according to the real-time transfer image; if there are contaminants, the actual number of chips on the target substrate and the type of contaminants are determined according to the real-time transfer image; the actual degree of adhesion of the contaminants on the target substrate is determined according to the type of contaminants and the real-time surface temperature; the acoustic wave cleaning frequency is determined according to the actual degree of adhesion, chip weight, real-time surface temperature, substrate roughness and actual number of chips, and the acoustic wave cleaning frequency is determined according to formula (5): (5) in, Indicates the frequency of sonic cleaning, Indicates the preset cleaning coefficient, Indicates the actual degree of adhesion. Indicates the chip weight, Indicates the roughness of the substrate. Indicates the real-time surface temperature, Indicates the actual number of chips.

[0109] The real-time surface temperature may be the temperature of the target substrate surface when the chip to be transferred is separated from the pickup head and starts to move.

[0110] The actual adhesion degree may be a numerical value corresponding to the degree to which the contaminant is adhered or fixed on the target substrate when the contaminant is on the target substrate.

[0111] The acoustic wave cleaning frequency may be the number of times the acoustic wave vibrates per second when the acoustic wave is used to clean the contaminants when the contaminants are present on the target substrate.

[0112] The preset cleaning coefficient may be a value indicating the comprehensive influence of each calculation factor on the calculation result of the ultrasonic cleaning frequency when calculating the ultrasonic cleaning frequency.

[0113] Specifically, a feature recognition algorithm is used to analyze the real-time transfer image to determine whether there are contaminants on the target substrate. If there are contaminants, the feature recognition algorithm is used to analyze the real-time transfer image to obtain the actual number of chips on the target substrate, the volume of contaminants and the type of contaminants. The real-time surface temperature is extracted from the target substrate information. All possible types of contaminants and their corresponding densities are obtained from the production and manufacturing system, and all possible types of contaminants and their corresponding densities are integrated to obtain a preset type density set. The contaminant type is matched with the preset type density set to obtain the density corresponding to the contaminant type, and the density corresponding to the contaminant type is determined as the contaminant density. The real-time surface temperature, contaminant density and contaminant volume are analyzed using a mathematical analysis method to obtain the actual degree of attachment. The historical actual degree of attachment, historical chip weight, historical real-time surface temperature, historical substrate roughness and historical actual number of chips are obtained from the production and manufacturing system, and the historical actual degree of attachment, historical chip weight, historical real-time surface temperature, historical substrate roughness and historical actual number of chips are analyzed using a linear regression analysis method to obtain a preset cleaning coefficient. The preset cleaning coefficient, actual adhesion degree, chip weight, real-time surface temperature, substrate roughness and actual number of chips are analyzed using mathematical analysis methods, and the acoustic cleaning frequency is calculated according to formula (5).

[0114] Among them, in formula (5), the numerator is: Indicates the actual adhesion degree of contaminants and the inertia of the chip, It determines the physical force that needs to be overcome when the contaminants are cleaned. The greater the degree of real-time adhesion and the heavier the chip, the higher the frequency of ultrasonic cleaning is required to effectively remove the contaminants.

[0115] Denominator: middle, The higher the value, the weaker the actual adhesion of the contaminants, in which case the cleaning frequency will be reduced accordingly. The higher the value, the lower the cleaning frequency required. This parameter helps adjust the effect of temperature on cleaning results. In the process, the higher the roughness of the target substrate, the more difficult it is to clean, which means that a higher acoustic wave frequency is required. Therefore, the roughness of the target substrate has an inverse effect on the demand for acoustic wave frequency. The higher the roughness, the more energy is required to ensure cleaning efficiency. Multiple chips to be transferred means that the acoustic wave energy needs to be dispersed. A lower frequency is required when cleaning each chip to be transferred to avoid over-cleaning of a chip to be transferred, because multiple chips to be transferred increase the distribution requirements of the acoustic wave energy. Therefore, in practical applications, the more chips to be transferred, the lower the cleaning frequency will be.

[0116] Through this solution, the real-time transfer image is used to determine whether there are contaminants on the target substrate. If there are contaminants, the image is further analyzed to determine the actual number of chips and the type of contaminants on the target substrate. According to the type of contaminant and the real-time surface temperature, the degree of adhesion of the contaminant on the substrate is evaluated. Taking into account the actual degree of adhesion, chip weight, real-time surface temperature, substrate roughness and the actual number of chips, the appropriate ultrasonic cleaning frequency is calculated to ensure the best cleaning effect. The combined effect of the preset cleaning coefficient, actual degree of adhesion, chip weight, substrate roughness, real-time surface temperature and number of chips ensures that the cleaning effect is as expected under different cleaning conditions. By adjusting the ultrasonic cleaning frequency in real time, the contaminants on the target substrate can be effectively removed, ensuring the smooth transfer process of the chips to be transferred and improving the transfer accuracy and efficiency.

[0117] In some embodiments, based on the real-time transfer image, the real-time position of each chip to be transferred when it reaches the top of the target substrate is determined; the ideal landing position and the real-time position are matched to determine the deviation angle of each chip to be transferred between the real-time position and the ideal landing position; based on the chip size and chip shape, the rotation priority of the target substrate is determined; based on the deviation angle and the rotation priority, the angular rotation order of the target substrate is determined, and the angular rotation order is incorporated into the real-time adjustment plan.

[0118] The real-time position may be the actual spatial position of the chip to be transferred when the pickup head transfers the chip to be transferred above the target substrate.

[0119] The deviation angle may be a value corresponding to an angle formed by a line connecting the real-time position and the ideal landing position and a vertical line passing through the ideal landing position.

[0120] The rotation priority may be a rotation priority order of each type of chip corresponding to the target substrate when the target substrate is rotated.

[0121] The angular rotation order may be an arrangement order of each rotation angle of the target substrate when it is rotated.

[0122] Specifically, a computer vision algorithm is used to analyze the real-time transfer image to obtain the real-time position of each chip to be transferred when it reaches the top of the target substrate, and the real-time position is marked in the spatial rectangular coordinate system obtained in the above steps to obtain the real-time position coordinates. The ideal landing point position coordinates and the real-time position coordinates are analyzed using a mathematical analysis method to obtain the deviation angle. The chip size and chip shape of each chip to be transferred are extracted from the chip information. Based on the chip shape, the length and width of each chip to be transferred are extracted from the chip size. The length and width of each chip to be transferred are divided to obtain a number of aspect ratios, and the several aspect ratios are arranged in order from large to small to obtain the size arrangement order of the aspect ratios, and the size order of the aspect ratios is determined as the rotation priority of the target substrate. The deviation angles of each chip to be transferred obtained in the above steps are arranged in order from large to small to obtain the deviation angle order. The deviation angle order corresponding to the rotation priority is determined as the angle rotation order, and the angle rotation order is included in the real-time adjustment plan.

[0123] Through this scheme, the real-time position of each chip to be transferred when it reaches the top of the target substrate is determined by real-time transfer images. The real-time position of each chip to be transferred is matched with the ideal landing point position, so as to calculate the deviation angle of each chip to be transferred. It reflects the degree of deviation of the chip to be transferred from the ideal target position during the transfer process. According to the size and shape of each chip to be transferred, the rotation priority of the target substrate is determined, that is, which chips to be transferred need to be rotated more preferentially to reduce the deviation. According to the deviation angle and rotation priority, the angular rotation order of the target substrate is determined, so as to adjust the angle of the substrate in an orderly manner to ensure that the chip to be transferred can fall in the ideal position as accurately as possible. Through this dynamic adjustment scheme, the transfer process of the chip to be transferred can be precisely controlled, thereby effectively reducing the position deviation of the chip to be transferred and improving the accuracy and efficiency of the transfer.

[0124] In some embodiments, the movement trajectory of the chip to be transferred after the release is predicted based on the initial release speed, chip weight, real-time adsorption strength and magnetic field direction; the actual movement trajectory of the chip to be transferred after the release is determined based on the real-time movement direction and real-time movement speed; the movement trajectory is matched with the actual movement trajectory, and if the movement trajectory is inconsistent with the actual movement trajectory, the secondary movement direction and secondary movement speed corresponding to the secondary movement of the chip to be transferred after the release are determined based on the real-time transfer image; the airflow information is obtained, and the airflow velocity and airflow intensity are determined based on the airflow information; the secondary movement trajectory corresponding to each chip to be transferred is determined based on the secondary movement direction, airflow velocity, airflow intensity, chip weight and secondary movement speed; the gradient adjustment value of the magnetic field is determined based on the secondary movement trajectory and the magnetic field strength, and the gradient adjustment value is incorporated into the real-time adjustment plan.

[0125] The motion trajectory may be a motion path obtained by predicting the motion state of the chip to be transferred after the chip to be transferred is separated from the pickup head.

[0126] The actual motion trajectory may be an actual motion path of the chip to be transferred during the process of reaching the target substrate after the chip to be transferred separates from the pickup head and starts to move.

[0127] The secondary movement direction may be a direction corresponding to the secondary movement of the chip to be transferred when the chip to be transferred is affected by external factors after the chip to be transferred separates from the pickup head and starts to move.

[0128] The secondary motion speed may be a speed corresponding to the secondary motion of the chip to be transferred when the chip to be transferred is affected by external factors after the chip to be transferred separates from the pickup head and starts to move.

[0129] The airflow information may be information corresponding to the airflow that affects the movement of the chip to be transferred after the chip to be transferred separates from the pickup head and starts to move.

[0130] The airflow velocity may be the velocity of the airflow that affects the movement of the chip to be transferred after the chip to be transferred separates from the pickup head and starts to move.

[0131] The airflow intensity may be a numerical value corresponding to the strength of the airflow affecting the movement of the chip to be transferred after the chip to be transferred is separated from the pickup head and starts to move.

[0132] The secondary motion trajectory may be a motion path corresponding to the secondary motion of the chip to be transferred after the chip to be transferred is separated from the pickup head and starts to move, and the chip to be transferred is affected by external factors and undergoes secondary motion.

[0133] The gradient adjustment value may be a value determined when the intensity distribution of the magnetic field is adjusted to ensure that the chip to be transferred can accurately land on an ideal landing position of the target substrate after the chip to be transferred leaves the pickup head and starts to move.

[0134] Specifically, the initial release speed, chip weight, real-time adsorption intensity and magnetic field direction are predicted using machine learning and data analysis techniques to obtain the motion trajectory of the chip to be transferred after release. The real-time motion direction is extracted from the real-time motion information. The real-time motion direction and real-time motion speed are analyzed using machine learning and data analysis techniques to obtain the actual motion trajectory. The motion trajectory is matched with the actual motion trajectory. If the actual motion trajectory is inconsistent with the motion trajectory, the real-time transfer image is analyzed using an image analysis method to obtain the secondary motion direction and secondary motion speed. The airflow information is obtained from the gas monitoring device, and the airflow velocity and airflow intensity are extracted from the airflow information. The secondary motion direction, airflow velocity, airflow intensity, chip weight and secondary motion speed are analyzed using machine learning and data analysis techniques to obtain the secondary motion trajectory of each chip to be transferred. The motion trajectory is matched with the secondary motion trajectory to determine the degree of trajectory deviation. The degree of trajectory deviation and magnetic field intensity are analyzed using a mathematical analysis method to obtain a gradient adjustment value, and the gradient adjustment value is incorporated into the real-time adjustment scheme.

[0135] Through this solution, the real-time position of each chip to be transferred when it reaches the top of the target substrate is determined by real-time transfer images. The real-time position of each chip to be transferred is matched with the ideal landing point position to calculate the deviation angle of the chip to be transferred, that is, the angle difference between the actual position and the ideal position. According to the size and shape of each chip to be transferred, the rotation priority of the target substrate is determined to ensure that the rotation order of the substrate can optimize the positioning accuracy of the chip to be transferred to the greatest extent. According to the deviation angle and rotation priority, the rotation order of the target substrate is further determined to most effectively place the chip to be transferred to the ideal position. Through this dynamic adjustment process, the precise alignment of the chip to be transferred on the target substrate is ensured, and the accuracy and efficiency of the transfer process are optimized.

[0136] Figure 3 A schematic diagram of a display panel manufacturing system according to an embodiment of the present application is shown in FIG. Figure 3 As shown, the display panel manufacturing method and system 300 of this embodiment includes: an adsorption information determination module 301 , a motion information determination module 302 , and an adjustment scheme determination module 303 .

[0137] The adsorption information determination module 301 is used to obtain the pickup head information of the electromagnetic device and the chip information after the pickup head adsorbs the chip to be transferred, and determine the real-time adsorption information of the chip to be transferred according to the chip information and the pickup head information; The motion information determination module 302 is used to obtain the real-time transfer image and transfer device information during the transfer process, and determine the real-time motion information according to the real-time transfer image, the real-time adsorption information and the transfer device information; The adjustment scheme determination module 303 is used to obtain target substrate information, determine a real-time adjustment scheme for the chip to be transferred during the transfer process according to the target substrate information and the real-time motion information, and adjust the motion process of the chip to be transferred according to the real-time adjustment scheme.

[0138] Optionally, the adsorption information determination module 301 is specifically used to: Acquire a pickup monitoring image, and determine the surface roughness of the pickup head and the contact area between the chip to be transferred and the pickup head according to the pickup monitoring image; According to the surface roughness, the standard contact area, the contact area, the chip weight and the real-time current, the real-time adsorption strength of the chip to be transferred on the pickup head is determined and calculated according to the following formula: ; in, represents the real-time adsorption intensity, Indicates the preset adjustment constant, represents the real-time current, represents the chip weight, represents the contact area, Indicates the degree of surface roughness, represents the standard contact area, Indicates the preset current enhancement factor; The real-time adsorption intensity is incorporated into the real-time adsorption information.

[0139] Optionally, the motion information determination module 302 is specifically configured to: Determine, based on the real-time transfer image, the chip surface roughness of the chip to be transferred and the arrival time required for the chip to reach the current position after the release starts; According to the real-time movement temperature, the arrival time, the chip surface roughness, the real-time current, the chip weight and the real-time adsorption strength, the real-time movement speed of the chip to be transferred during the movement is determined and calculated according to the following formula: ; in, represents the real-time motion speed, represents the preset friction coefficient, Indicates the friction coefficient at preset temperature, represents the preset rough friction coefficient, represents the surface roughness of the chip, Indicates the preset current absorption coefficient, represents the arrival time, represents the real-time adsorption intensity, represents the chip weight, represents the real-time motion temperature, represents the real-time current; The real-time motion speed is incorporated into the real-time motion information.

[0140] Optionally, the adjustment scheme determination module 303 is specifically configured to: Predicting the actual landing position of the chip to be transferred on the target substrate according to the real-time movement speed, the real-time adsorption strength and the chip weight; Determining a distance between the actual landing point and the ideal landing point according to the actual landing point; Obtain a position distance error range, and determine whether the landing point position distance is within the position distance error range; If not, the real-time adjustment strength of the magnetic field is determined according to the actual landing point position, the landing point position distance, the position distance error range and the chip weight, and the real-time adjustment strength is incorporated into the real-time adjustment plan.

[0141] Optionally, the display panel manufacturing system 300 further includes an adjustment angle determination module 304, which is specifically used to: Determining a velocity magnetic field angle according to the initial release speed and the magnetic field direction; Determining an equivalent charge amount according to the magnetic field strength, the velocity magnetic field angle and the initial release speed; According to the chip weight, the adsorption angle, the magnetic field strength, the initial release speed, the equivalent charge, the speed magnetic field angle, the magnetic field direction and the real-time adsorption strength, the real-time movement angle of the chip to be transferred during movement is determined and calculated according to the following formula: ; in, represents the real-time motion angle, represents the real-time adsorption intensity, represents the adsorption angle, represents the chip weight, represents the equivalent charge, represents the magnetic field strength, represents the velocity magnetic field angle, represents the initial release rate; Acquire an ideal motion angle, and determine an angle deviation value according to the ideal motion angle and the real-time motion angle; According to the angle deviation value, the real-time adjustment strength and the magnetic field direction, the direction adjustment angle of the magnetic field direction is determined, and the direction adjustment angle is incorporated into the real-time adjustment scheme.

[0142] Optionally, the adjustment scheme determination module 303 is specifically configured to: Determining the spacing distance between the chip to be transferred and the target substrate according to the real-time transfer image; According to the real-time movement speed, the spacing distance, the magnetic permeability of the target substrate, the initial release speed, the magnetic permeability of the chip, the real-time adsorption strength and the chip weight, the speed adjustment value of the magnetic field attenuation speed of the chip to be transferred during the release process is determined and calculated according to the following formula: ; in, Indicates the speed adjustment value, Indicates the preset speed coefficient, represents the real-time adsorption intensity, represents the real-time motion speed, Represents the preset distance attenuation constant, represents the separation distance, represents the initial release rate, represents the chip magnetic permeability, represents the chip weight, represents the magnetic permeability of the target substrate; The speed adjustment value is incorporated into the real-time adjustment scheme.

[0143] Optionally, the display panel manufacturing system 300 further includes a cleaning frequency determination module 305, which is specifically used to: Determining whether there are contaminants on the target substrate according to the real-time transfer image; If so, determining the actual number of chips and the type of contaminants on the target substrate based on the real-time transfer image; Determining the actual degree of adhesion of the contaminant on the target substrate according to the contaminant type and the real-time surface temperature; The acoustic wave cleaning frequency is determined according to the actual adhesion degree, the chip weight, the real-time surface temperature, the substrate roughness and the actual number of chips, and is calculated according to the following formula: ; in, represents the sonic cleaning frequency, Indicates the preset cleaning coefficient, Indicates the actual degree of adhesion, represents the chip weight, Indicates the roughness of the substrate, represents the real-time surface temperature, Indicates the actual chip quantity.

[0144] Optionally, the adjustment scheme determination module 303 is specifically configured to: Determine the real-time position of each chip to be transferred when it reaches above the target substrate according to the real-time transfer image; Matching the ideal landing point position and the real-time position, and determining the deviation angle of each chip to be transferred between the real-time position and the ideal landing point position; Determining a rotation priority of a target substrate according to the chip size and the chip shape; According to the deviation angle and the rotation priority, an angle rotation order of the target substrate is determined, and the angle rotation order is incorporated into the real-time adjustment scheme.

[0145] Optionally, the adjustment scheme determination module 303 is specifically configured to: Predicting the movement trajectory of the chip to be transferred after release according to the initial release speed, the chip weight, the real-time adsorption strength and the magnetic field direction; Determining the actual movement trajectory of the chip to be transferred after being released according to the real-time movement direction and the real-time movement speed; Matching the motion trajectory with the actual motion trajectory, and if the motion trajectory is inconsistent with the actual motion trajectory, determining the secondary motion direction and secondary motion speed corresponding to the secondary motion of the chip to be transferred after being released according to the real-time transfer image; Acquire airflow information, and determine the airflow velocity and airflow intensity according to the airflow information; Determining a secondary motion trajectory corresponding to each type of chip to be transferred according to the secondary motion direction, the airflow velocity, the airflow intensity, the chip weight and the secondary motion velocity; According to the secondary motion trajectory and the magnetic field strength, a gradient adjustment value of the magnetic field is determined, and the gradient adjustment value is incorporated into the real-time adjustment scheme.

[0146] The system of this embodiment can be used to execute the method of any of the above embodiments. The implementation principles and technical effects are similar and will not be described in detail here.

Claims

1. A method for manufacturing a display panel, characterized in that: include: Acquire the pickup head information of the electromagnetic device and the chip information after the pickup head absorbs the chip to be transferred, and determine the real-time absorption information of the chip to be transferred according to the chip information and the pickup head information; Acquire a real-time transfer image and transfer equipment information during the transfer process, and determine real-time motion information according to the real-time transfer image, the real-time adsorption information and the transfer equipment information; The target substrate information is acquired, and a real-time adjustment scheme of the chip to be transferred during the transfer process is determined according to the target substrate information and the real-time motion information, and the motion process of the chip to be transferred is adjusted according to the real-time adjustment scheme.

2. The method according to claim 1, characterized in that The chip information includes the chip weight of the chip to be transferred and the standard contact area between the chip to be transferred and the pickup head, the pickup head information includes the real-time current, and the real-time adsorption information of the chip to be transferred is determined according to the chip information and the pickup head information, including: Acquire a pickup monitoring image, and determine the surface roughness of the pickup head and the contact area between the chip to be transferred and the pickup head according to the pickup monitoring image; According to the surface roughness, the standard contact area, the contact area, the chip weight and the real-time current, the real-time adsorption strength of the chip to be transferred on the pickup head is determined and calculated according to the following formula: ； in, represents the real-time adsorption intensity, Indicates the preset adjustment constant, represents the real-time current, represents the chip weight, represents the contact area, Indicates the degree of surface roughness, represents the standard contact area, Indicates the preset current enhancement factor; The real-time adsorption intensity is incorporated into the real-time adsorption information.

3. The method according to claim 2, characterized in that The chip information includes the real-time motion temperature of the chip to be transferred when it moves after being released. The real-time motion information is determined according to the real-time transfer image, the real-time adsorption information and the transfer device information, including: Determine, according to the real-time transfer image, the chip surface roughness of the chip to be transferred and the arrival time required for the chip to be transferred to reach the current position after the release starts; According to the real-time movement temperature, the arrival time, the chip surface roughness, the real-time current, the chip weight and the real-time adsorption strength, the real-time movement speed of the chip to be transferred during the movement is determined and calculated according to the following formula: ； in, represents the real-time motion speed, represents the preset friction coefficient, Indicates the friction coefficient at preset temperature, represents the preset rough friction coefficient, represents the surface roughness of the chip, Indicates the preset current absorption coefficient, represents the arrival time, represents the real-time adsorption intensity, represents the chip weight, represents the real-time motion temperature, represents the real-time current; The real-time motion speed is incorporated into the real-time motion information.

4. The method according to claim 3, characterized in that The target substrate information includes an ideal landing position of the chip to be transferred, and determining a real-time adjustment scheme of the chip to be transferred during the transfer process according to the target substrate information and the real-time motion information includes: Predicting the actual landing position of the chip to be transferred on the target substrate according to the real-time movement speed, the real-time adsorption strength and the chip weight; Determining a distance between the actual landing point and the ideal landing point according to the actual landing point; Obtain a position distance error range, and determine whether the landing point position distance is within the position distance error range; If not, the real-time adjustment strength of the magnetic field is determined according to the actual landing point position, the landing point position distance, the position distance error range and the chip weight, and the real-time adjustment strength is incorporated into the real-time adjustment plan.

5. The method according to claim 4, characterized in that The real-time adsorption information includes the adsorption angle, the pickup head information includes the magnetic field strength and magnetic field direction of the pickup head, the real-time motion information includes the initial release speed of the chip to be transferred when it is released, and after determining the real-time adjustment strength of the magnetic field according to the actual landing point position, the landing point position distance, the position distance error range and the chip weight, it also includes: Determining a velocity magnetic field angle according to the initial release speed and the magnetic field direction; Determining an equivalent charge amount according to the magnetic field strength, the velocity magnetic field angle and the initial release speed; According to the chip weight, the adsorption angle, the magnetic field strength, the initial release speed, the equivalent charge, the speed magnetic field angle, the magnetic field direction and the real-time adsorption strength, the real-time movement angle of the chip to be transferred during movement is determined and calculated according to the following formula: ； in, represents the real-time motion angle, represents the real-time adsorption intensity, represents the adsorption angle, represents the chip weight, represents the equivalent charge, represents the magnetic field strength, represents the velocity magnetic field angle, represents the initial release rate; Acquire an ideal motion angle, and determine an angle deviation value according to the ideal motion angle and the real-time motion angle; According to the angle deviation value, the real-time adjustment strength and the magnetic field direction, the direction adjustment angle of the magnetic field direction is determined, and the direction adjustment angle is incorporated into the real-time adjustment scheme.

6. The method according to claim 5, characterized in that The target substrate information includes the target substrate magnetic permeability, the chip information includes the chip magnetic permeability, and determining the real-time adjustment scheme of the chip to be transferred during the transfer process according to the target substrate information and the real-time motion information includes: Determining the spacing distance between the chip to be transferred and the target substrate according to the real-time transfer image; According to the real-time movement speed, the spacing distance, the magnetic permeability of the target substrate, the initial release speed, the magnetic permeability of the chip, the real-time adsorption strength and the chip weight, the speed adjustment value of the magnetic field attenuation speed of the chip to be transferred during the release process is determined and calculated according to the following formula: ； in, Indicates the speed adjustment value, Indicates the preset speed coefficient, represents the real-time adsorption intensity, represents the real-time motion speed, Represents the preset distance attenuation constant, represents the separation distance, represents the initial release rate, represents the chip magnetic permeability, represents the chip weight, represents the magnetic permeability of the target substrate; The speed adjustment value is incorporated into the real-time adjustment scheme.

7. The method according to claim 6, characterized in that The target substrate information includes the substrate roughness and real-time surface temperature of the target substrate. After determining the real-time adjustment scheme of the chip to be transferred during the transfer process according to the target substrate information and the real-time motion information, the method further includes: Determining whether there are contaminants on the target substrate according to the real-time transfer image; If so, determining the actual number of chips and the type of contaminants on the target substrate based on the real-time transfer image; Determining the actual adhesion degree of the contaminant on the target substrate according to the contaminant type and the real-time surface temperature; The acoustic wave cleaning frequency is determined according to the actual adhesion degree, the chip weight, the real-time surface temperature, the substrate roughness and the actual number of chips, and is calculated according to the following formula: ； in, represents the sonic cleaning frequency, Indicates the preset cleaning coefficient, Indicates the actual degree of adhesion, represents the chip weight, Indicates the roughness of the substrate, represents the real-time surface temperature, Indicates the actual chip quantity.

8. The method according to claim 7, characterized in that The chip information includes the chip size and chip shape of each chip to be transferred, and the real-time adjustment scheme of the chip to be transferred during the transfer process is determined according to the target substrate information and the real-time motion information, including: Determine the real-time position of each chip to be transferred when it reaches above the target substrate according to the real-time transfer image; Matching the ideal landing point position and the real-time position, and determining the deviation angle of each chip to be transferred between the real-time position and the ideal landing point position; Determining a rotation priority of a target substrate according to the chip size and the chip shape; According to the deviation angle and the rotation priority, an angle rotation order of the target substrate is determined, and the angle rotation order is incorporated into the real-time adjustment scheme.

9. The method according to claim 8, characterized in that The real-time motion information includes a real-time motion direction, and determining a real-time adjustment scheme of the chip to be transferred during the transfer process according to the target substrate information and the real-time motion information includes: Predicting the movement trajectory of the chip to be transferred after release according to the initial release speed, the chip weight, the real-time adsorption strength and the magnetic field direction; Determining the actual movement trajectory of the chip to be transferred after being released according to the real-time movement direction and the real-time movement speed; Matching the motion trajectory with the actual motion trajectory, and if the motion trajectory is inconsistent with the actual motion trajectory, determining the secondary motion direction and secondary motion speed corresponding to the secondary motion of the chip to be transferred after being released according to the real-time transfer image; Acquire airflow information, and determine the airflow velocity and airflow intensity according to the airflow information; Determining a secondary motion trajectory corresponding to each type of chip to be transferred according to the secondary motion direction, the airflow velocity, the airflow intensity, the chip weight and the secondary motion velocity; According to the secondary motion trajectory and the magnetic field strength, a gradient adjustment value of the magnetic field is determined, and the gradient adjustment value is incorporated into the real-time adjustment scheme.

10. A display panel manufacturing system, characterized in that: include: An adsorption information determination module is used to obtain the pickup head information of the electromagnetic device and the chip information after the pickup head adsorbs the chip to be transferred, and determine the real-time adsorption information of the chip to be transferred according to the chip information and the pickup head information; A motion information determination module, used to obtain a real-time transfer image and transfer device information during the transfer process, and determine real-time motion information according to the real-time transfer image, the real-time adsorption information and the transfer device information; The adjustment scheme determination module is used to obtain target substrate information, determine the real-time adjustment scheme of the chip to be transferred during the transfer process according to the target substrate information and the real-time motion information, and adjust the motion process of the chip to be transferred according to the real-time adjustment scheme.

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