Lamp bead packaging method and lamp bead packaging structure

Abstract

The invention relates to a lamp bead packaging method and a lamp bead packaging structure. The lamp bead packaging method comprises the following steps: fixing a lamp bead on a substrate; the surface of the substrate is covered with a black adhesive film, the periphery and the top face of the lamp bead are completely covered with the black adhesive film, and the top face, covering the top face of the lamp bead, of the black adhesive film is higher than the top face, located on the periphery of the lamp bead, of the black adhesive film; removing the black adhesive film covering the top surface of the lamp bead to expose the top surface of the lamp bead; and packaging a packaging adhesive layer on the lamp beads and the black adhesive film. The surface of the substrate is covered with the black adhesive film, the black adhesive film can cover the peripheral side faces of the lamp beads, only the light-emitting faces of the top faces of the lamp beads are reserved, optical defects caused by unevenness of the side faces of the lamp beads are eliminated, and the non-uniformity of invisible cutting faces can be effectively shielded; the problem of pocking marks on the side edge caused by the invisible cutting process of the lamp bead is effectively solved, the light emitting uniformity and appearance quality of the product are remarkably improved, and the problem that the pocking marks exist on the side edge of the lamp bead visually and the display effect of the product is reduced is solved.

Description

Technical Field

[0001] The present application relates to the field of LED packaging technology, and in particular to a lamp bead packaging method and a lamp bead packaging structure. Background Art

[0002] At present, Micro-LED made of semiconductor materials has the characteristics of self-luminescence, small chip size and high integration. Compared with LCD and OLED, its brightness, resolution, energy consumption, response speed, thermal stability and other indicators are more advantageous. At the same time, the emergence of Micro-LED has promoted the rapid development of augmented reality (AR), virtual reality (VR), head-up display (HUD) and wearable display devices.

[0003] In the related art, in the manufacturing process of Micro luminous lamp beads, invisible cutting technology is a commonly used cutting method. This technology uses a laser to form a stress layer inside the wafer, and then breaks the wafer along the stress layer through subsequent processes to achieve the separation of the lamp beads. Compared with traditional mechanical cutting, this method has the advantages of reducing physical damage, improving cutting accuracy and saving materials. However, in actual applications, invisible cutting technology may cause unevenness in the side cutting surface of the lamp beads, such as rough or uneven surface structure and burrs. Although these unevennesses will not directly affect the light output angle and flatness of the top, when observing the luminous effect of the lamp beads from the side, there will be local brightness inconsistency, which will cause visual pitting problems on the side, reducing the display effect of the product, especially in the application of high-end display screens.

[0004] Therefore, it is necessary to design a new lamp bead packaging method and lamp bead packaging structure to overcome the above problems. Summary of the invention

[0005] The present application provides a lamp bead packaging method and a lamp bead packaging structure, which can solve the technical problem in the related art that visual pitting exists on the side of the lamp bead, thereby reducing the display effect of the product.

[0006] In a first aspect, an embodiment of the present application provides a lamp bead packaging method, which comprises the following steps: Fixing the lamp beads on the substrate; Covering the surface of the substrate with a black film, so that the black film completely covers the periphery and top surface of the lamp bead, and the top surface of the black film covering the top surface of the lamp bead is higher than the top surface of the black film located around the lamp bead; Remove the black film covering the top surface of the lamp bead to reveal the top surface of the lamp bead; Encapsulate the encapsulation glue layer on the lamp beads and the black adhesive film.

[0007] In combination with the first aspect, in one embodiment, the black film is covered on the surface of the substrate so that the black film completely covers the periphery and top surface of the lamp bead, and the top surface of the black film covering the top surface of the lamp bead is higher than the top surface of the black film located around the lamp bead, including: Attaching the black adhesive film to the transparent support film; Cover the surface of the substrate with lamp beads with a black adhesive film with a transparent support film, and put it into a high-temperature vacuum equipment; In the high-temperature vacuum equipment, a first elastomer is used to apply pressure to the transparent support film so that the black film is tightly attached to the surface of the substrate and completely covers the surrounding and top surfaces of the lamp beads, and the top surface of the black film covering the top surface of the lamp beads is higher than the top surface of the black film located around the lamp beads.

[0008] In combination with the first aspect, in one implementation, before the first elastic body is used to apply pressure to the transparent supporting film, the thickness of the black adhesive film is greater than the thickness of the lamp bead.

[0009] In combination with the first aspect, in one embodiment, before using the first elastomer to apply pressure to the transparent supporting film, the substrate with the black adhesive film is placed on a supporting carrier or a second elastomer in a high-temperature vacuum equipment; wherein the supporting carrier is provided with a receiving groove for accommodating the device on the back side of the substrate.

[0010] In combination with the first aspect, in one embodiment, after the first elastic body is used to apply pressure to the transparent support film so that the black adhesive film is closely attached to the surface of the substrate and completely covers the surroundings and top surface of the lamp bead, the method further includes: After the black film cools down, the transparent support film is torn off, and the black film together with the substrate is placed in an oven for baking and curing.

[0011] In combination with the first aspect, in one embodiment, removing the black film covering the top surface of the lamp bead to expose the top surface of the lamp bead includes: The black film on the top surface of the lamp bead is etched using an ion beam to remove the black film covering the top surface of the lamp bead, and at the same time, the top surface of the black film around the lamp bead is flush with the top surface of the lamp bead.

[0012] In combination with the first aspect, in one implementation, in the process of using ion beam to etch the black film on the top surface of the lamp bead, a suitable gas is used as an auxiliary process gas.

[0013] In combination with the first aspect, in one embodiment, the step of encapsulating the encapsulation adhesive layer on the lamp beads and the black adhesive film includes: attaching the encapsulation adhesive layer to the transparent support film; Covering the encapsulation adhesive layer with a transparent support film on the surface of the substrate with a black adhesive film, and placing it in a high-temperature vacuum device; In the high-temperature vacuum equipment, a third elastomer is used to apply pressure to the transparent support film so that the encapsulation adhesive layer is tightly attached to the black adhesive film and the surface of the lamp beads.

[0014] In combination with the first aspect, in one embodiment, the black film is covered on the surface of the substrate so that the black film completely covers the periphery and top surface of the lamp bead, and the top surface of the black film covering the top surface of the lamp bead is higher than the top surface of the black film located around the lamp bead, including: The black film is covered on the surface of the substrate by 3D printing spray ink or piezoelectric valve dispensing, so that the black film completely covers the surrounding and top surfaces of the lamp beads, and the top surface of the black film covering the top surface of the lamp beads is higher than the top surface of the black film located around the lamp beads.

[0015] In a second aspect, an embodiment of the present application provides a lamp bead packaging structure, which is prepared by the above-mentioned lamp bead packaging method, and the lamp bead packaging structure includes: A substrate, on which lamp beads are fixed; A black adhesive film, the black adhesive film covers the surface of the substrate, and the black adhesive film covers the periphery of the lamp bead; The encapsulation adhesive layer is encapsulated on the surface of the black adhesive film and the lamp bead.

[0016] The beneficial effects brought by the technical solution provided in the embodiments of the present application include: By covering the surface of the substrate with a black film, the black film can cover the sides of the lamp bead and only retain the luminous surface of the top surface of the lamp bead, eliminating the optical defects caused by the unevenness of the side of the lamp bead, and effectively shielding the unevenness of the invisible cutting surface. It can effectively improve the side pitting problem caused by the invisible cutting process of the lamp bead and significantly improve the luminous uniformity and appearance quality of the product, solving the technical problem of visual pitting on the side of the lamp bead in the related technology, which reduces the display effect of the product. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0018] Figure 1 A flow chart of a lamp bead packaging method provided in an embodiment of the present application; Figure 2 A schematic diagram of the structure after lamp beads are fixed on the substrate provided in the embodiment of the present application; Figure 3A schematic diagram of a structure in which a black adhesive film provided in an embodiment of the present application is covered on a surface of a substrate through a transparent supporting film; Figure 4 A schematic diagram of a structure in which a first elastic body is used to apply pressure to a transparent supporting film according to an embodiment of the present application; Figure 5 A schematic diagram of a structure in which a black adhesive film is hot pressed onto a substrate surface according to an embodiment of the present application; Figure 6 A schematic diagram of the structure of a black film on the top surface of a lamp bead etched using an ion beam according to an embodiment of the present application; Figure 7 A schematic diagram of the structure after removing the black adhesive film on the top surface of the lamp bead and removing the transparent supporting film provided in the embodiment of the present application; Figure 8 This is a schematic diagram of the structure after the encapsulation glue layer is encapsulated on the substrate provided in an embodiment of the present application.

[0019] In the figure: 1. Substrate; 2. Lamp beads; 3. Black film; 4. Encapsulation adhesive layer; 10. Transparent supporting film; 20. First elastic body; 30. Support carrier. DETAILED DESCRIPTION

[0020] In order to enable those skilled in the art to better understand the solution of the present application, the technical solution in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0021] The embodiments of the present application provide a lamp bead packaging method and a lamp bead packaging structure, which can solve the technical problem in the related art that visual pitting exists on the side of the lamp bead, thereby reducing the display effect of the product.

[0022] See also Figure 1 As shown, a lamp bead packaging method provided in an embodiment of the present application may include the following steps: S1: Fix the lamp bead 2 on the substrate 1.

[0023] See also Figure 2As shown, in step S1, a proper amount of solder paste can be printed on the substrate 1 to solidify the lamp bead 2 at a specified position of the substrate 1; then the lamp bead 2 is soldered by a reflow soldering device to form a reliable electrical connection between the lamp bead 2 and the substrate 1. In this embodiment, the substrate 1 is preferably a PCB, and of course, other substrates 1 that can achieve electrical connection can also be used; and the lamp bead 2 in this embodiment is preferably a Micro lamp bead 2, and multiple lamp beads 2 can be fixed on the substrate 1 according to needs.

[0024] S2: Cover the surface of the substrate 1 with a black film 3 so that the black film 3 completely covers the periphery and top surface of the lamp bead 2 , and the top surface of the black film 3 covering the top surface of the lamp bead 2 is higher than the top surface of the black film 3 located around the lamp bead 2 .

[0025] See also Figure 5 As shown, in step S2, after the black film 3 is covered on the surface of the substrate 1, it is tightly fixed to the surface of the substrate 1. At the same time, the black film 3 will fill the gaps between the multiple lamp beads 2 and completely cover the outer surfaces of the lamp beads 2. At this time, the black film 3 will not only completely cover the four sides of the lamp beads 2, but also completely cover the top surfaces of the lamp beads 2. At this time, the top surface of the black film 3 covering the top surface of the lamp beads 2 is higher than the top surface of the black film 3 located around the lamp beads 2.

[0026] S3: Remove the black film 3 covering the top surface of the lamp bead 2 to expose the top surface of the lamp bead 2. Figure 7 As shown, in this step, only the black film 3 covering the top surface of the lamp bead 2 is removed, and the black film 3 on the sides of the lamp bead 2 is not removed; after this step, the sides of the lamp bead 2 are still completely covered by the black film 3.

[0027] S4: encapsulating the encapsulation adhesive layer 4 on the lamp bead 2 and the black adhesive film 3.

[0028] See also Figure 8 As shown, in step S4, the panel with the black film 3 is molded and packaged, which can effectively protect the surface of the lamp beads 2 after packaging, while ensuring good sealing and structural strength.

[0029] In this embodiment, a black film 3 is covered on the surface of the substrate 1. The black film 3 can cover the sides of the lamp bead 2, leaving only the top luminous surface of the lamp bead 2, eliminating the optical defects caused by the uneven side of the lamp bead 2, effectively shielding the unevenness of the invisible cutting surface, effectively improving the side pitting problem caused by the invisible cutting process of the lamp bead 2, and significantly improving the luminous uniformity and appearance quality of the product, solving the technical problem of visual pitting on the side of the lamp bead 2 in the related art, which reduces the display effect of the product. At the same time, by filling the black film 3, the contrast of the lamp bead packaging structure is further increased; by covering the side defects and burrs of the lamp bead 2, the side view of the lamp bead packaging structure is further improved; and by setting the black film 3, the color consistency of each panel can be increased, and the defects left on the substrate 1 during the panel processing can be effectively covered, further improving the appearance of the panel.

[0030] Furthermore, in one embodiment, the black film 3 is covered on the surface of the substrate 1 so that the black film 3 completely covers the surroundings and the top surface of the lamp bead 2, and the top surface of the black film 3 covering the top surface of the lamp bead 2 is higher than the top surface of the black film 3 located around the lamp bead 2, which may include: S21 : attaching the black adhesive film 3 to the transparent supporting film 10 .

[0031] S22: Cover the black adhesive film 3 with the transparent support film 10 on the surface of the substrate 1 with the lamp beads 2 (see Figure 3 and placed in a high temperature vacuum device.

[0032] S23: In the high temperature vacuum equipment, the first elastic body 20 is used to apply pressure to the transparent support film 10 (see Figure 4 As shown), the black film 3 is tightly attached to the surface of the substrate 1 and completely covers the surrounding and top surfaces of the lamp beads 2, and the top surface of the black film 3 covering the top surface of the lamp beads 2 is higher than the top surface of the black film 3 located around the lamp beads 2.

[0033] In this embodiment, a prefabricated finished black film 3 is first prepared. Since the black film 3 is thin and brittle, a carrier is required to complete the subsequent process. In this embodiment, it is considered to attach it to the transparent support film 10 (see Figure 3 As shown), to enhance its mechanical strength and ease of operation, this method has high packaging efficiency and good uniformity. At the same time, during the hot pressing process in step S23, the material of the first elastic body 20 can be a material with excellent elasticity and low elastic modulus, such as rubber; see Figure 4As shown, using an elastic body to apply pressure to the transparent support film 10 can avoid damage to the lamp beads 2 due to pressure, and disperse the pressure to achieve consistency of force on the entire panel. Due to the high temperature environment in the high-temperature vacuum equipment, the adhesive surface of the black adhesive film 3 becomes soft, and under the action of vacuuming and the pressure applied by the first elastic body 20, the lamp beads 2 break out of the film, exposing the luminous surface of the top surface (see Figure 5 As shown, at this time, there is still a very thin black film 3 on the top surface of the lamp bead 2, and the height is inconsistent with the black film 3 around the lamp bead 2).

[0034] In other embodiments, in S2, the black film 3 can also be coated on the surface of the substrate 1 by using a variety of high-precision coating processes such as 3D printing spray ink or piezoelectric valve dispensing, so that the black film 3 completely covers the surroundings and top surface of the lamp bead 2, and the top surface of the black film 3 covering the top surface of the lamp bead 2 is higher than the top surface of the black film 3 located around the lamp bead 2. In the process of coating the black film 3, the black film 3 is kept within a range of about 100 um from the top surface of the lamp bead 2 to ensure the feasibility and etching efficiency of subsequent plasma etching.

[0035] Further, in some optional embodiments, before the first elastic body 20 is used to apply pressure to the transparent support film 10, the thickness of the black film 3 is greater than the thickness of the lamp bead 2. In this embodiment, before the black film 3 is hot-pressed, it is necessary to ensure that the thickness of the finished black film 3 is greater than the thickness of the lamp bead 2 (for example, about 30 μm greater). If the black film 3 is thinner than the thickness of the lamp bead 2 or the thickness is the same, the black film 3 will be too thin because it extends on both sides after packaging, and it cannot completely cover the surroundings of the lamp bead 2, resulting in light leakage.

[0036] In the above technical solution, in one embodiment, before the first elastic body 20 is used to apply pressure to the transparent support film 10, the substrate 1 with the black adhesive film 3 can be placed on a support carrier 30 in a high-temperature vacuum device (see Figure 4 As shown) or on a second elastomer; wherein, the support carrier 30 is provided with a receiving groove for receiving devices on the back side of the substrate 1. In this embodiment, since the back side of the substrate 1 is generally provided with electronic devices such as resistors or ICs, that is, the back side of the substrate 1 is not a plane, during the hot pressing process, the substrate 1 is placed on the second elastomer or the support carrier 30 with a receiving groove for hot pressing. The second elastomer or the support carrier 30 can not only support the substrate 1, but also accommodate the devices on the back side of the substrate 1, so as to avoid damage to the devices such as resistors or ICs on the back side of the substrate 1. The second elastomer can also be a material with excellent elasticity and low elastic modulus, such as rubber, so that the second elastomer can be elastically deformed to accommodate the devices on the back side of the substrate 1.

[0037] Furthermore, in one embodiment, after the first elastic body 20 is used to apply pressure to the transparent support film 10 so that the black film 3 is closely attached to the surface of the substrate 1 and completely covers the surroundings and top surface of the lamp bead 2, the following step may be further included: after the black film 3 cools down, the transparent support film 10 is torn off, and the black film 3 and the substrate 1 are put into an oven for baking and curing. In this step, the transparent support film 10 is removed after use, and the structure of the black film 3 is ensured to be fixed after baking and curing.

[0038] Preferably, in some embodiments, the step of removing the black film 3 covering the top surface of the lamp bead 2 to expose the top surface of the lamp bead 2 may include: using an ion beam to etch the black film 3 on the top surface of the lamp bead 2 to remove the black film 3 covering the top surface of the lamp bead 2 (see Figure 6 As shown in FIG. 2 ), the top surface of the black film 3 around the lamp bead 2 is flush with the top surface of the lamp bead 2. Figure 6 As shown, in this embodiment, the ion beam etching technology is preferably used to remove the black adhesive film 3 covering the top surface of the lamp bead 2 or higher than the top surface of the lamp bead 2 and located around the lamp bead 2, so that the black adhesive film 3 covering the top surface of the lamp bead 2 is removed, and at the same time, the top surface of the black adhesive film 3 located around the lamp bead 2 is also flush with the top surface of the lamp bead 2; that is, the black adhesive layer on the entire panel reaches the same thickness as the lamp bead 2 (see Figure 7 as shown).

[0039] On the basis of the above technical solution, in one embodiment, in the process of using ion beam to etch the black film 3 on the top surface of the lamp bead 2, a suitable gas is used as an auxiliary process gas. In the process of etching, chemical reactions and physical particle collisions in this embodiment use a suitable gas as an auxiliary process gas, such as chlorine, oxygen, fluoride and other gases or a mixture of these gases, and chemical and physical etching are used together, so that the etching effect is better, ensuring efficient and accurate removal of the excess black film 3, while protecting the light-emitting surface on the top of the lamp bead 2.

[0040] Further, in one embodiment, see Figure 8 As shown, the encapsulation adhesive layer 4 is encapsulated on the lamp bead 2 and the black adhesive film 3, including: S41 : attaching the encapsulation adhesive layer 4 to the transparent support film 10 .

[0041] S42: Cover the packaging adhesive layer 4 with the transparent support film 10 on the surface of the substrate 1 with the black adhesive film 3, and put it into a high-temperature vacuum equipment.

[0042] S43: In a high-temperature vacuum device, a third elastic body is used to apply pressure to the transparent support film 10 , so that the encapsulation adhesive layer 4 is closely attached to the black adhesive film 3 and the surface of the lamp beads 2 .

[0043] In this embodiment, when encapsulating the encapsulation glue layer 4 to the substrate 1, the finished transparent support film 10 can be attached to the surface of the substrate 1 and placed in a high-temperature device, and pressure is applied by a third elastomer, so that the encapsulation glue layer 4 is tightly bonded to the substrate 1, further accelerating the MiP (Mini / Micro LED in Package) packaging rate.

[0044] In other embodiments, the encapsulation adhesive layer 4 may also be encapsulated by molding, which is not limited here.

[0045] See also Figure 8 As shown, the embodiment of the present application also provides a lamp bead packaging structure, which is prepared by the above-mentioned lamp bead packaging method, and the lamp bead packaging structure includes: a substrate 1, and the substrate 1 is fixed with a lamp bead 2; a black adhesive film 3, the black adhesive film 3 covers the surface of the substrate 1, and the black adhesive film 3 covers the four sides of the lamp bead 2; an encapsulation adhesive layer 4, and the encapsulation adhesive layer 4 is encapsulated in the black adhesive film 3 and the surface of the lamp bead 2.

[0046] The lamp bead packaging structure in this embodiment can be prepared by the lamp bead packaging method provided in any of the above embodiments and realize the corresponding functions, which will not be repeated here.

[0047] In this embodiment, a black film 3 is covered on the surface of the substrate 1. The black film 3 can cover the sides of the lamp bead 2, leaving only the top luminous surface of the lamp bead 2, eliminating the optical defects caused by the uneven side of the lamp bead 2, effectively shielding the unevenness of the invisible cutting surface, effectively improving the side pitting problem caused by the invisible cutting process of the lamp bead 2, and significantly improving the luminous uniformity and appearance quality of the product, solving the technical problem of visual pitting on the side of the lamp bead 2 in the related art, which reduces the display effect of the product. At the same time, by filling the black film 3, the contrast of the lamp bead packaging structure is further increased; by covering the side defects and burrs of the lamp bead 2, the side view of the lamp bead packaging structure is further improved; and by setting the black film 3, the color consistency of each panel can be increased, and the defects left on the substrate 1 during the panel processing can be effectively covered, further improving the appearance of the panel.

[0048] like Figure 8 As shown, the substrate 1 is preferably a PCB; the lamp bead 2 is preferably a Micro lamp bead 2; the material of the black film 3 is preferably a mixture of ink, resin and other substances, and the black film 3 is at the same height as the lamp bead 2, which effectively covers the uneven light-emitting surface of the side of the lamp bead 2 without affecting the top light-emitting; the material of the encapsulation adhesive layer 4 is preferably a mixture of resin, diffusion powder and other substances, and the encapsulation adhesive layer 4 can effectively prevent the panel from colliding with dead lights during use, and adding an appropriate proportion of diffusion powder helps to enhance the light-emitting consistency of the panel.

[0049] In the description of the present application, it should be noted that the terms "upper", "lower", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present application. Unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be an indirect connection through an intermediate medium, or it can be a connection between the two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present application can be understood according to the specific circumstances.

[0050] It should be noted that, in this application, relational terms such as "first" and "second" are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the sentence "comprise a ..." do not exclude the presence of other identical elements in the process, method, article or device including the elements.

[0051] The above description is only a specific implementation of the present application, so that those skilled in the art can understand or implement the present application. Various modifications to these embodiments will be apparent to those skilled in the art, and the general principles defined herein can be implemented in other embodiments without departing from the spirit or scope of the present application. Therefore, the present application will not be limited to the embodiments shown herein, but will conform to the widest range consistent with the principles and novel features applied for herein.

Claims

1. A lamp bead packaging method, characterized in that: It includes the following steps: Fixing the lamp beads (2) on the substrate (1); Covering the surface of the substrate (1) with a black adhesive film (3) so that the black adhesive film (3) completely covers the periphery and top surface of the lamp bead (2), and the top surface of the black adhesive film (3) covering the top surface of the lamp bead (2) is higher than the top surface of the black adhesive film (3) located around the lamp bead (2); Removing the black adhesive film (3) covering the top surface of the lamp bead (2) to expose the top surface of the lamp bead (2); A packaging adhesive layer (4) is packaged on the lamp bead (2) and the black adhesive film (3).

2. The lamp bead packaging method according to claim 1, characterized in that: The method of covering the black adhesive film (3) on the surface of the substrate (1) so that the black adhesive film (3) completely covers the surroundings and the top surface of the lamp bead (2), and the top surface of the black adhesive film (3) covering the top surface of the lamp bead (2) is higher than the top surface of the black adhesive film (3) located around the lamp bead (2), comprises: Attaching the black adhesive film (3) to the transparent support film (10); Covering the surface of the substrate (1) with the lamp beads (2) with a black adhesive film (3) with a transparent support film (10), and placing the substrate (1) in a high-temperature vacuum device; In a high-temperature vacuum device, a first elastic body (20) is used to apply pressure to a transparent support film (10), so that the black adhesive film (3) is tightly attached to the surface of a substrate (1) and completely covers the surroundings and top surface of a lamp bead (2), and the top surface of the black adhesive film (3) covering the top surface of the lamp bead (2) is higher than the top surface of the black adhesive film (3) located around the lamp bead (2).

3. The lamp bead packaging method according to claim 2, characterized in that: Before the first elastic body (20) is used to apply pressure to the transparent support film (10), the thickness of the black adhesive film (3) is greater than the thickness of the lamp bead (2).

4. The lamp bead packaging method according to claim 2, characterized in that: Before the first elastic body (20) is used to apply pressure to the transparent support film (10), the substrate (1) with the black adhesive film (3) is placed on a support carrier (30) or a second elastic body in a high-temperature vacuum device; wherein the support carrier (30) is provided with a receiving groove for receiving a device on the back side of the substrate (1).

5. The lamp bead packaging method according to claim 2, characterized in that: After the first elastic body (20) is used to apply pressure to the transparent support film (10) so that the black adhesive film (3) is tightly attached to the surface of the substrate (1) and completely covers the surroundings and top surface of the lamp bead (2), the method further comprises: After the black adhesive film (3) cools down, the transparent support film (10) is torn off, and the black adhesive film (3) together with the substrate (1) are placed in an oven for baking and curing.

6. The lamp bead packaging method according to claim 1, characterized in that: The step of removing the black adhesive film (3) covering the top surface of the lamp bead (2) so that the top surface of the lamp bead (2) is exposed comprises: The black adhesive film (3) on the top surface of the lamp bead (2) is etched using an ion beam, so that the black adhesive film (3) covering the top surface of the lamp bead (2) is removed, and at the same time, the top surface of the black adhesive film (3) located around the lamp bead (2) is flush with the top surface of the lamp bead (2).

7. The lamp bead packaging method according to claim 6, characterized in that: In the process of using ion beam to etch the black adhesive film (3) on the top surface of the lamp bead (2), a suitable gas is used as an auxiliary process gas.

8. The lamp bead packaging method according to claim 1, characterized in that: The encapsulating adhesive layer (4) on the lamp bead (2) and the black adhesive film (3) comprises: Attaching the encapsulating adhesive layer (4) to the transparent supporting film (10); Covering the packaging adhesive layer (4) with the transparent support film (10) on the surface of the substrate (1) with the black adhesive film (3), and placing it in a high-temperature vacuum device; In the high-temperature vacuum equipment, a third elastic body is used to apply pressure to the transparent support film (10), so that the encapsulation adhesive layer (4) is tightly attached to the black adhesive film (3) and the surface of the lamp bead (2).

9. The lamp bead packaging method according to claim 1, characterized in that: The method of covering the black adhesive film (3) on the surface of the substrate (1) so that the black adhesive film (3) completely covers the surroundings and the top surface of the lamp bead (2), and the top surface of the black adhesive film (3) covering the top surface of the lamp bead (2) is higher than the top surface of the black adhesive film (3) located around the lamp bead (2), comprises: The black adhesive film (3) is covered on the surface of the substrate (1) by 3D printing spray ink or piezoelectric valve dispensing, so that the black adhesive film (3) completely covers the surroundings and top surface of the lamp bead (2), and the top surface of the black adhesive film (3) covering the top surface of the lamp bead (2) is higher than the top surface of the black adhesive film (3) located around the lamp bead (2).

10. A lamp bead packaging structure, which is prepared by the lamp bead packaging method according to claim 1, characterized in that: The lamp bead packaging structure comprises: A substrate (1), wherein a lamp bead (2) is fixed to the substrate (1); A black adhesive film (3), the black adhesive film (3) covering the surface of the substrate (1), and the black adhesive film (3) covering the periphery of the lamp bead (2); A packaging adhesive layer (4), the packaging adhesive layer (4) being packaged on the surface of the black adhesive film (3) and the lamp bead (2).

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