Glue uniformizing system and method and coating equipment

Abstract

According to the glue uniformizing system and method and the coating equipment, the glue uniformizing system comprises a glue uniformizing part and a glue scraping part, the glue uniformizing part is arranged in the stroke range of a glue outlet, and when the glue outlet moves to the preset glue uniformizing position, the glue uniformizing part rotates along the axis of the glue uniformizing part at the original position according to the set rotating speed, the set number of turns and the set direction; the glue uniformizing part is used for adhering redundant glue liquid at the glue outlet to the peripheral surface of the glue uniformizing part; the glue scraping part is in sliding butt joint with the peripheral surface of the glue uniformizing part, and when the glue uniformizing part rotates, the glue scraping part scrapes off the glue solution adhered to the peripheral surface of the glue uniformizing part, so that the glue uniformizing distance between the glue uniformizing part and the glue outlet is always kept within a set threshold value, and the amount of the glue solution coated on the semiconductor substrate by the glue outlet is uniform and consistent; by means of the structural design, structural components for spraying cleaning liquid in the prior art are saved, the production cost is reduced, and the phenomena that in the prior art, due to the fact that a cleaning component moves relative to the glue outlet, consumption is caused, and a semiconductor substrate is polluted due to falling of abrasion powder are avoided.

Description

Technical Field

[0001] The invention relates to a glue leveling system and method, and also relates to coating equipment comprising the glue leveling system and applying the glue leveling method. Background Art

[0002] Before the glue coating system coats the glue, excess glue will adhere to the glue outlet, and the excess glue will be coated on the semiconductor substrate, causing uneven glue.

[0003] In the prior art, before the glue coating system coats glue, a flushing agent for diluting the glue liquid is first sprayed on the periphery of the glue outlet through a flushing liquid supply component, and then the flushing agent and glue liquid adhering to the glue outlet are scraped off by a sliding abutment component.

[0004] However, in the process of the sliding abutment component sliding and scraping off excess glue at the glue outlet, a part of the sliding abutment component that is cut into powder due to wear becomes wear powder, which may cause contamination of the substrate due to the consumption of the sliding abutment component and the falling of the wear powder. Moreover, the flushing liquid supply component also requires the cooperation of a pressure component to be able to spray the cleaning liquid at the glue outlet, which has a complex structure and increases the production cost.

[0005] Based on the above reasons, there is an urgent need for a glue spreading system that can solve the above problems so that the amount of glue liquid spread by the glue coating system on the semiconductor substrate is uniform. Summary of the invention

[0006] The object of the present invention is to overcome the deficiencies of the above-mentioned prior art and to provide a glue spreading system, method and coating equipment, which simplifies the structure of coating cleaning liquid and scraping glue liquid, reduces production costs, and can quickly remove excess glue liquid at the glue outlet, thereby ensuring that the amount of glue liquid coated on the semiconductor substrate at the glue outlet is uniform.

[0007] The present invention provides a glue spreading system, which is used in conjunction with a glue coating system and is used to remove excess glue at a glue outlet of the glue coating system before the glue coating system coats the glue, and comprises:

[0008] The glue spreading part is arranged within the travel range of the glue outlet, and the glue spreading part is configured so that when the glue outlet moves to the glue spreading position, the glue spreading part rotates along its axis at the original position according to the set speed, number of turns and direction, so as to adhere the excess glue at the glue outlet to the outer peripheral surface of the glue spreading part;

[0009] The glue scraping part is configured to slide against the outer peripheral surface of the glue spreading part. When the glue spreading part rotates, the glue scraping part scrapes off the glue liquid adhered to the outer peripheral surface of the glue spreading part, so that the glue spreading distance between the glue spreading part and the glue outlet is always maintained within a set threshold.

[0010] Preferably, the glue spreading position is located above the glue spreading portion, and when the glue outlet moves to the glue spreading position, the axis of the glue spreading portion is configured to be directly opposite to the center of the glue outlet in the length direction.

[0011] Preferably, the glue scraping portion has a tip for slidingly abutting against the glue spreading portion, and the tip is used to scrape off the glue liquid adhered to the outer peripheral surface of the glue spreading portion.

[0012] Preferably, the scraper portion is a polyhedron, and the tip is formed at the intersection of two surfaces of the scraper portion.

[0013] Preferably, the glue spreading part is a glue spreading wheel, and the tip of the glue scraping part is slidably abutted against an outer peripheral surface corresponding to the horizontal diameter of the glue spreading wheel.

[0014] Furthermore, the coating system further comprises:

[0015] The first sensing part is used to detect the position of the glue outlet. When the glue outlet moves to the glue spreading position, the first sensing part outputs the current position signal of the glue outlet to the outside;

[0016] A first power unit, used for driving the glue spreading unit to rotate;

[0017] The driving controller outputs a first control instruction for controlling the operation of the first power unit according to the received position signal. The first power unit drives the glue spreading unit to rotate at a set speed, number of turns and direction according to the received first control instruction, so as to remove excess glue at the glue outlet.

[0018] Furthermore, the coating system further comprises:

[0019] A second sensing part, used for detecting the glue spreading distance between the glue spreading part and the glue outlet, and feeding back the detected numerical information to the driving controller;

[0020] A support portion, used to link the coating knife to translate along the Y direction, and the coating knife is also arranged to slide on the support portion along the Z direction;

[0021] The second power unit is used to drive the coating knife to slide along the Z direction;

[0022] The drive controller outputs a second control instruction for controlling the driving operation of the second power unit according to the difference between the stored standard glue spreading distance value and the current glue spreading distance value fed by the second sensing unit. The second power unit rotates according to the received second control instruction and at the set number of circles, speed and direction, thereby linking the coating knife to move according to the difference distance, so that the glue spreading distance between the glue outlet and the glue spreading unit is within the set threshold.

[0023] The present invention also provides a coating device, including a coating system for uniformly coating glue on a semiconductor substrate, and also including the above-mentioned glue leveling system, wherein the glue leveling system is used to remove excess glue adhering to the glue outlet of the coating system.

[0024] The present invention also provides a method for coating, which is applied to the above coating device and comprises the following steps:

[0025] The glue spreading part is arranged within the travel range of the glue outlet. When the glue outlet moves to the glue spreading position above the glue spreading part, the glue spreading part rotates along its axis at the original position according to the set speed, number of turns and direction, so as to adhere the excess glue at the glue outlet to the outer peripheral surface of the glue spreading part.

[0026] The glue scraping part is slidably abutted against the outer peripheral surface of the glue spreading part. When the glue spreading part rotates, the glue scraping part is used to scrape off the glue liquid adhered to the outer peripheral surface of the glue spreading part, so that the glue spreading distance between the glue spreading part and the glue outlet is always maintained within a set threshold.

[0027] The present invention provides a glue spreading system, method and coating equipment, wherein the glue spreading system includes a glue spreading part and a glue scraping part, wherein the glue spreading part is arranged within the travel range of the glue outlet, and when the glue outlet moves to the glue spreading position, the glue spreading part rotates along its axis at the original position according to the set speed, number of turns and direction, so as to adhere the excess glue at the glue outlet to the outer peripheral surface of the glue spreading part; the glue scraping part is in sliding contact with the outer peripheral surface of the glue spreading part, and when the glue spreading part rotates, the glue scraping part scrapes off the glue adhered to the outer peripheral surface of the glue spreading part, so that the glue spreading distance between the glue spreading part and the glue outlet is always maintained within the set threshold value, thereby ensuring that the amount of glue coated on the semiconductor substrate at the glue outlet is uniform; the above structural design saves the structural components for spraying the cleaning liquid in the prior art, reduces the production cost, and also avoids the consumption caused by the movement of the cleaning components relative to the glue outlet in the prior art, and the phenomenon of falling of wear powder and contamination of the semiconductor substrate. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] In order to more clearly illustrate the technical solution of the present invention, the drawings required for use in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0029] Figure 1 It is a structural diagram of a coating device provided in an embodiment of the present invention.

[0030] Figure 2 It is a structural diagram of a glue spreading system in a coating device provided in an embodiment of the present invention.

[0031] Figure 3It is a structural diagram of a coating knife of a coating system provided by an embodiment of the present invention moving above a coating part of a coating system.

[0032] Figure 4 It is a structural diagram of the glue scraping part installed on the support and limiting assembly in the glue spreading system provided by an embodiment of the present invention.

[0033] Figure 5 It is a structural diagram of the adjustment mechanism in the glue-splitting system provided in an embodiment of the present invention.

[0034] Figure 6 It is a flow chart of a method for coating provided in an embodiment of the present invention.

[0035] The realization of the purpose, functional features and advantages of the present invention will be further explained in conjunction with embodiments and with reference to the accompanying drawings.

[0036] The reference numerals are described as follows:

[0037] Glue spreading system 100, glue spreading part 110, support position 111, glue scraping part 120, tip 121, top surface 122, side surface 123, support and limit assembly 120', support plate 121', step 1211', pressure plate 122', nut 123', guide plate 124, liquid supply part 130, solution tank 131, overflow port 132, base 141, first bolt 1412, damper 142, fixed part 1421, rotating part 1422, first vertical plate 14 23, second vertical plate 143, front surface 1431, top surface 1432, limiting bolt 144, passive gear 146, driving gear 147, friction coefficient adjustment component 150, side connection position 151, top surface connection position 152, top bolt 153, circumferential guide groove 154, second bolt 155, first power unit 161, belt 162, second sensing unit 163, support unit 170, base 171, beam 172, screw motor 180, third sensing unit 190,

[0038] Glue coating system 200, glue outlet 211;

[0039] Glue cleaning system 300;

[0040] Platform 400. DETAILED DESCRIPTION

[0041] In the present invention, the terms "upper", "lower", "left", "right", "front", "back", "top", "bottom", "inside", "outside", "middle", "vertical", "horizontal", "lateral", "longitudinal" and the like indicate positions or state relationships based on the positions or state relationships shown in the drawings. These terms are mainly used to better describe the present invention and its embodiments, and are not used to limit the indicated devices, elements or components to have a specific position, or to be constructed and operated in a specific position.

[0042] In addition, some of the above terms may be used to express other meanings in addition to indicating a position or state relationship. For example, the term "on" may also be used to express a certain dependency or connection relationship in some cases. For those skilled in the art, the specific meanings of these terms in the present invention can be understood according to specific circumstances.

[0043] In addition, the terms "installed", "set", "provided with", "connected", and "connected" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral structure; it can be a mechanical connection, or an electrical connection; it can be a direct connection, or an indirect connection through an intermediate medium, or it can be an internal connection between two devices, elements, or components. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0044] In addition, the terms "first", "second", etc. are mainly used to distinguish different devices, elements or components, which may be the same or different in specific types and configurations, and are not used to indicate or imply the relative importance and quantity of the indicated devices, elements or components. Unless otherwise specified, "plurality" means two or more.

[0045] In order to clarify the directional relationship in the figure, a coordinate system with the vertical direction as the Z direction and the horizontal plane as the XY plane is appropriately marked.

[0046] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the accompanying drawings in the embodiments of the present invention.

[0047] like Figure 1 As shown, the present invention also provides a coating device, including a glue spreading system 100, a glue coating system 200 for evenly coating glue on a semiconductor substrate, a glue cleaning system 300 for cleaning the glue coating system 200, and a platform 400 for placing the semiconductor substrate. Before the glue coating system 200 applies glue, the glue spreading system 100 is used to clean excess glue at a glue outlet 211 of the glue coating system 200. After the glue coating system 200 applies glue, the glue cleaning system 300 is used to clean glue adhering to the glue outlet 211.

[0048] In the present invention, the coating system 200 can use various coating liquids such as photoetching liquid for etching-resistant coating, photoetching liquid for color filter, polyimide precursor, silicon, nanometal ink or slurry (paste) containing conductive material. In addition, the semiconductor substrate to be coated may include: glass substrate for liquid crystal display device, glass substrate for PDP, glass substrate for photomask, substrate for color filter, substrate for recording disk, substrate for solar cell, substrate for electronic paper and other precision electronic device substrates, rectangular glass substrate, flexible substrate for thin film liquid crystal, organic EL substrate and other substrates.

[0049] Overview of a Spin Coating System as an Example

[0050] like Figure 2 As shown, a glue spreading system 100 provided in an embodiment of the present invention is used in conjunction with a glue coating system 200 to remove excess glue at a glue outlet 211, including:

[0051] The glue spreading part 110 is disposed within the travel range of the glue outlet 211. The glue spreading part 110 is configured such that when the glue outlet 211 moves to the glue spreading position above the glue spreading part 110, the glue spreading part 110 rotates along its axis at the original position according to the set speed, number of turns and direction, so as to adhere the excess glue at the glue outlet 211 to the outer peripheral surface of the glue spreading part 110.

[0052] Preferably, the glue spreading position is located above the glue spreading part 110, and there is a set glue spreading distance between the glue outlet 211 and the glue spreading part 110. When the glue outlet 211 moves to the glue spreading position, the axis of the glue spreading part 110 is configured to be directly opposite to the center of the glue outlet 211 in the length direction.

[0053] In this embodiment, the glue spreading part 110 is preferably a glue spreading wheel with a circular cross section.

[0054] Furthermore, the glue spreading system 100 also includes two vertical and symmetrically spaced support positions 111 , and the two ends of the glue spreading part 110 are rotatably disposed at the upper ends of the two support positions 111 , so that the horizontally arranged glue spreading part 110 can reciprocate along its axis.

[0055] like Figure 3 As shown, further, the glue scraping part 120 is in sliding contact with the outer peripheral surface of the glue spreading part 110. When the glue spreading part 110 rotates, the glue scraping part 120 can scrape off the glue liquid adhered to the outer peripheral surface of the glue spreading part 110, so that the glue spreading distance L between the glue spreading part 110 and the glue outlet 211 is always maintained within the set threshold, thereby ensuring that the amount of glue coated on the semiconductor substrate by the glue outlet 211 is uniform; the above structural design saves the structural components for spraying the cleaning liquid in the prior art, reduces the production cost, and also avoids the consumption caused by the movement of the cleaning components relative to the glue outlet in the prior art, and the falling of wear powder to contaminate the semiconductor substrate.

[0056] Preferably, the scraper portion 120 has a tip 121 which is in sliding contact with the outer peripheral surface of the glue spreading portion 110. The tip 121 can scrape off the glue adhered to the outer peripheral surface of the glue spreading portion 110, reduce the contact area between the tip 121 and the glue spreading portion 110, and reduce the friction between the tip 121 and the glue spreading portion 110, thereby extending the service life of the scraper portion 120 and the glue spreading portion 110.

[0057] Preferably, the glue scraping part 120 slides against the outer peripheral surface corresponding to the horizontal diameter D of the glue leveling part 110. Here, the glue scraping effect is best. In another embodiment, the tip 121 can also abut against the outer peripheral surface corresponding to the horizontal diameter D of the adjacent glue leveling part 110, which can also achieve a better glue scraping effect. In this embodiment, the glue leveling part 120 preferably rotates counterclockwise.

[0058] like Figure 4 As shown, further, the scraper part 120 is a polyhedron. In the present embodiment, it is preferably a cuboid. The tip 121 is formed by the intersection of the top surface 122 and the side surface 123 of the scraper part 120. The cuboid has four tips in the width direction. The four tips are used alternately, which further extends the service life of the scraper part 120.

[0059] Preferably, the glue scraping part 120 is inclined with respect to the horizontal diameter D of the glue spreading part 110 , and the angle between the two is preferably 135°.

[0060] In this embodiment, the glue spreading system 100 also includes a support and limiting assembly 120', which includes a support plate 121'. A step 1211' is provided on the top of the support plate 121' for placing the glue scraper part 120. The support and limiting assembly 120' also includes a pressure plate 122' and a plurality of nuts 123' for locking and fixing the pressure plate 122' on the support plate 121' and for pressing and limiting the glue scraper part 120, thereby realizing a detachable fixed connection between the glue scraper part 120 and the support and limiting assembly 120', which is convenient for timely replacement of the glue scraper part 120 with a worn tip 121.

[0061] The glue scraping part 120 is made of non-metallic material, including but not limited to rubber, polyurethane and silicone with good glue scraping performance and wear resistance. In the present embodiment, rubber is preferred. Rubber can make the glue scraping part 120 and the glue leveling part 110 fully abut against each other, avoiding the gap between the two, which causes the glue liquid that is not scraped off the outer peripheral surface of the glue leveling part 110 to walk out of the glue outlet 211 and does not need to be removed; the support plate 121' is made of metal material, including but not limited to steel and aluminum. In the present embodiment, aluminum is preferred. Aluminum can both reduce the weight of the support plate 121' and support the glue scraping part 120, thereby avoiding the deformation of the glue scraping part 120 during the glue scraping process.

[0062] like Figure 2 As shown, further, the glue spreading system 100 also includes a liquid supply part 130, the liquid supply part 130 includes a cleaning liquid (not shown) and a solution tank 131 containing the cleaning liquid, and the glue spreading part 110 is partially arranged in the cleaning liquid, and the cleaning liquid is used to dilute the glue liquid adhered to the outer peripheral surface of the glue spreading part 110, thereby reducing the viscosity of the glue liquid, and facilitating the glue scraping part 120 to quickly scrape off the glue liquid adhered to the outer periphery of the glue spreading part 110.

[0063] Preferably, in this embodiment, the solution tank 131 is located directly below the glue-distributing unit 110 , so that the solution tank 131 can collect the glue scraped off by the glue-scraping unit 120 within a maximum range.

[0064] like Figure 4 As shown, further, the glue spreading system 100 also includes a guide plate 124 detachably connected to the support plate 121 ′, the guide plate 124 is arranged toward the solution tank 131, and the guide plate 124 is used to guide the glue scraped by the glue scraping part 120 into the solution tank 131, so as to facilitate the solution tank 131 to collect it.

[0065] like Figure 2 As shown, further, the liquid supply part 130 also includes an overflow port 132 connected to the solution tank 131 , and the overflow port 132 is used to maintain the liquid level of the cleaning liquid in the solution tank 131 at a set horizontal position, thereby avoiding the cleaning liquid from overflowing from the solution tank 131 .

[0066] Overview of the regulating mechanism as an example

[0067] like Figure 5 As shown, further, the glue-splitting system also includes an adjustment mechanism, and the adjustment mechanism includes:

[0068] The base 141 is used for being detachably fixedly connected to the support plate 121' on which the scraper 120 is installed;

[0069] The translation adjustment component is used to adjust the distance between the scraper part 120 and the glue leveling part 110. The translation adjustment component includes a plurality of elongated waist-shaped holes 1411 which are arranged in sequence and extend along the width direction of the base 141. Each elongated waist-shaped hole 1411 is penetrated by a first bolt 1412 which is screwed to the support plate 121. The support plate 121' translates along the width direction of the base 141, which can increase or decrease the spacing distance between the scraper part 120 and the glue leveling part 110.

[0070] Two dampers 142 are respectively arranged at both ends of the base 141. The dampers 142 can be operated at both ends of the base 141, which is convenient to use. The damper 142 includes a fixed part 1421 and a rotating part 1422 that damps the rotation relative to the fixed part 1421. The rotating part 1422 directly or indirectly links the base 141 to rotate at the original position and stops the base 141 at the rotated position.

[0071] The two first vertical plates 1423 are respectively fixedly connected to the fixing parts 1421 of the two dampers 142 and play a role of supporting the dampers 142;

[0072] A circumferential rotational force is applied to the rotating part 1422 of the damper 142, and the damper 142 is linked to the base 141 to rotate, thereby damping the glue scraping part 120 to rotate to a position abutting against the glue spreading part 110 and causing the glue scraping part 120 to stop at the current abutting position;

[0073] Furthermore, the glue spreading system further includes second vertical plates 143 disposed at both ends of the base 141 for supporting the base 141, the two second vertical plates 143 are rotatably matched with the base 141, and the first vertical plate 1423 and the adjacent second vertical plates 143 are symmetrically arranged;

[0074] Furthermore, the adjustment mechanism also includes a friction coefficient adjustment component 150 for adjusting the friction coefficient between the glue spreading part 110 and the glue scraping part 120. The friction coefficient adjustment component 150 links the base 141 at the current position to move up and down, and is used to adjust the friction coefficient between the glue spreading part 110 and the glue scraping part 120 to within a set threshold value, so that the glue spreading part 110 and the glue scraping part 120 are in sliding contact with each other.

[0075] Preferably, the friction coefficient adjustment component 150 includes side connection positions 151 detachably fixedly installed at both ends of the base 141, and the two side connection positions 151 are respectively arranged corresponding to the front sides 1431 of the two second vertical plates 143, and also includes a top surface connection position 152 fixedly connected to the side connection position 151, and the top surface connection position 152 is configured so that when the scraping part 120 rotates with the base 141 to abut the glue leveling part 110, the top surface connection position 152 rotates to a position opposite to the top surface 1432 of the second vertical plate 143, and a top bolt 153 for abutting the top surface 1432 of the second vertical plate 143 is screwed on the top surface connection position 152, and a first direction is applied to the top bolt 153. A circumferential torque in the first or second direction is applied to cause the top surface connection position 152 to move up and down along the axis of the top bolt 153, so as to expand or reduce the distance between the top surface 1432 of the second vertical plate 143 and the top surface connection position 152, thereby causing the scraping portion 120 to move toward or away from the glue spreading portion 110 (such as moving up and down along the Z direction, including moving upward or downward), so as to adjust the friction coefficient between the glue spreading portion 110 and the scraping portion 120 to within a set threshold value (i.e., adjusting the scraping portion 120 to a state of sliding abutment with the glue spreading portion 110), so as to facilitate the scraping portion 120 to scrape off the glue liquid adhered to the periphery of the glue spreading portion 110, wherein the first direction and the second direction are opposite directions.

[0076] Specifically, the top connection portion 152 is vertically fixed to the side surface of the side connection portion 151 .

[0077] In this embodiment, preferably, when the glue scraping part 120 rotates to a position where it slides and abuts against the glue leveling part 110, the top surface connection position 152 is arranged in parallel with the top surface 1432 of the second vertical plate 143 to expand the displacement distance between the top surface connection position 152 and the top surface 1432 of the second vertical plate 143, thereby avoiding the phenomenon that the inclined top surface connection position 152 collides with the parallel top surface 1432 during the upward and downward displacement along the Z direction.

[0078] Preferably, there are two friction coefficient adjustment components 150, which are respectively arranged in the length direction of the base 141 (see Figure 5 The two side connection positions 151 are respectively mounted on the rotating shafts (not shown) at both ends of the base 141 and are detachably fixedly connected to the ends of the base 141. In this embodiment, the detachable fixed connection is preferably a threaded connection, which is convenient for disassembly and assembly.

[0079] In this embodiment, a circumferential guide groove 154 corresponding to the second vertical plate 143 is arranged on the side connection position 151, and a second bolt 155 screwed to the second vertical plate 143 is passed through the circumferential guide groove 154. After the second bolt 155 is screwed to the second vertical plate 143, it is used to fix and limit the base 141, thereby fixing the scraping part 120 on the base 141 in a position where it is slidably abutted with the glue spreading part 110.

[0080] Furthermore, the glue spreading system 100 also includes a meshing portion provided between the first vertical plate 1423 and the second vertical plate 143, the meshing portion includes a passive gear 146 and a driving gear 147 that mesh with each other, wherein the number of teeth of the passive gear 146 is the same as the number of teeth of the driving gear 147, the rotating shaft of the passive gear 146 is coaxially fixedly connected to the rotating shaft of the base 141, the rotating shaft of the driving gear 147 is coaxially fixedly connected to the rotating part 1422 of the damper 142, the rotating part 1422 of the damper 142 can be linked to the base 141 to rotate evenly through the passive gear 146 and the driving gear 147 that mesh with each other, and the glue scraping part 120 can be accurately rotated and adjusted to a position abutting against the glue spreading part 110.

[0081] In another embodiment, the number of teeth of the passive gear 146 and the active gear 147 can also be set to be different. For example, the number of teeth of the active gear 147 is smaller than that of the passive gear 146. When the passive gear 146 is decelerated, the scraping part 120 can also be accurately adjusted to a position abutting against the glue leveling wheel.

[0082] like Figure 1 and Figure 2 As shown, further, the coating system further includes:

[0083] A first sensing unit (not shown) is used to detect the position of the glue outlet 211. When the glue outlet 211 moves to the glue spreading position, the first sensing unit outputs a current position signal of the glue outlet 211 to the outside;

[0084] The first power unit 161 is used to drive the glue spreading unit 110 to rotate. Preferably, in this embodiment, the first power unit 161 includes a rotating motor that directly or indirectly drives the glue spreading unit 110 to rotate. The indirect driving method is to sleeve a belt 162 on the end of the glue spreading unit 110 and the output shaft of the rotating motor. The rotating motor rotates according to the set number of circles, speed and direction to link the belt 162 to rotate, thereby linking the glue spreading unit 110 to rotate according to the set number of circles, speed and direction.

[0085] The driving controller (not shown) outputs a first control instruction for controlling the operation of the first power unit according to the received position signal. The first power unit 161 drives the glue spreading unit 110 to rotate according to the set number of revolutions, speed and direction according to the received first control instruction. The glue spreading unit 110 takes out the excess glue at the glue outlet 211 during the rotation process. In this embodiment, the glue spreading unit 110 is limited to rotate only when the coating knife 210 is at the glue spreading position, so as to save the electric energy of the first power unit 161 and reduce the cost.

[0086] like Figure 1 As shown, further, the coating system further includes:

[0087] The second sensing part 163 is used to detect the glue spreading distance between the glue spreading part 110 and the glue outlet 211, and feed back the detected numerical information to the driving controller. In this embodiment, the second sensing part 163 is preferably a plate thickness measuring sensor.

[0088] The support part 170 is linked with the coating knife 210 to translate along the Y direction, wherein the coating knife 210 is further arranged to be slidably arranged on the support part 170 along the Z direction. In this embodiment, the support part 170 includes two symmetrically arranged bases 171 and a crossbeam 172 slidably arranged on the bases along the Z direction for mounting the coating knife 210;

[0089] The second power unit is used to drive the coating knife 210 to slide along the Z direction. In this embodiment, the second power unit includes two screw motors 180 respectively installed on the base 171 for driving the coating knife 210 to move along the Z direction.

[0090] The drive controller outputs a second control instruction for controlling the driving operation of the second power unit according to the difference between the stored standard glue spreading distance value and the current glue spreading distance value fed by the second sensing unit 163. The second power unit rotates according to the received second control instruction and at the set number of circles, speed and direction, and then the coating knife is linked to move according to the difference distance, thereby adjusting the glue spreading distance L between the glue outlet 211 and the glue spreading unit 110 to within the set threshold, thereby ensuring the accuracy of the glue spreading distance L.

[0091] Preferably, when the drive controller receives a signal indicating that the glue outlet 211 moves to the glue spreading position, the drive controller will output a control instruction to control the two screw motors 180 to rotate within a set time.

[0092] Furthermore, the coating system further comprises:

[0093] The third sensing part 190 is used to detect the glue coating distance between the glue outlet 211 and the platform 400, and feed back the detected numerical information to the driving controller. In this embodiment, the third sensing part 190 is preferably a Panasonic displacement sensor.

[0094] The drive controller outputs a third control instruction for controlling the driving operation of the second power unit according to the difference between the stored standard glue coating distance value and the current glue coating distance value fed by the third sensing unit 190. The second power unit rotates according to the received third control instruction and at the set number of circles, speed and direction, thereby linking the coating knife 210 to move according to the difference distance to adjust the glue coating distance between the glue outlet 211 and the platform 400 to within the set threshold value, thereby ensuring the accuracy of the glue coating distance and facilitating the coating of a set thickness of glue on the semiconductor substrate, such as the above-mentioned photoresist, and the semiconductor substrate is adsorbed and positioned on the platform 400 by vacuum adsorption force.

[0095] In this embodiment, the difference distance of the glue spreading distance and the difference distance of the glue coating distance can be obtained by the product of the number of revolutions of the screw motor and the pitch of the screw. For example, if the difference distance is 1 mm and the pitch is 0.5 mm, the screw motor needs to rotate 2 revolutions.

[0096] Overview of the Spinning Method as an Example

[0097] like Figure 6 As shown, the present invention also provides a method for coating, which is applied to the above-mentioned coating device and includes the following steps:

[0098] S1, the glue spreading part 110 is set within the travel range of the glue outlet 211. When the glue outlet 211 moves to the glue spreading position above the glue spreading part 110, the glue spreading part 110 rotates along its axis at the original position according to the set speed, number of turns and direction, so as to adhere the excess glue at the glue outlet 211 to the outer peripheral surface of the glue spreading part 110;

[0099] S2. Adjust the glue scraping part 120 to a position where it slides against the outer peripheral surface of the glue spreading part 110. When the glue spreading part 110 rotates, the glue scraping part 120 scrapes off the glue liquid adhered to the outer peripheral surface of the glue spreading part 110, so that the glue spreading distance between the glue spreading part 110 and the glue outlet 210 is always maintained within the set threshold.

[0100] Furthermore, after step S1 , the coating method further includes a step of diluting the adhesive solution adhered to the outer peripheral surface of the coating part 110 , including partially placing the coating part 110 in the cleaning solution of the solution tank 131 .

[0101] Furthermore, the glue spreading method further includes a step of collecting glue liquid scraped off by the glue scraping unit 120 , including arranging a solution tank 131 directly below the glue spreading unit 110 .

[0102] Furthermore, the coating method further includes the step of maintaining the liquid level of the cleaning solution in the solution tank 131 at a set horizontal position, including providing an overflow port 132 connected to the solution tank 131 , and the excess cleaning solution will be discharged through the overflow port 132 .

[0103] Furthermore, before step S2, the glue spreading method also includes a step of adjusting the displacement distance between the glue scraping part 120 and the glue spreading part 110, including a plurality of elongated waist-shaped holes 1411 arranged in sequence and extending along the width direction of the base 141, each of the elongated waist-shaped holes 1411 is penetrated by a first bolt 1412 screwed to the support plate 121', and the support plate 121' is translated relative to the base 141, which can increase or decrease the spacing distance between the glue scraping part 120 installed on the support plate 121' and the glue spreading part 110.

[0104] Furthermore, the glue spreading method also includes a step of adjusting the glue scraping part 120 to abut against the glue spreading part 110, including a damper 142 arranged at both ends of the base 141, the damper 142 includes a fixed part 1421 and a rotating part 1422 that dampens rotation relative to the fixed part 1421, the rotating part 1422 directly or indirectly links the base 141 to rotate at the original position and stops the base 141 at the rotated position, thereby adjusting the glue scraping part 120 to abut against the glue spreading part 110.

[0105] Furthermore, the glue spreading method also includes a step of adjusting the friction coefficient between the glue scraping part 120 and the glue spreading part 110, including a friction coefficient adjustment component 150, which links the base 141 at the current position to move up and down, and is used to adjust the friction coefficient between the glue spreading part 110 and the glue scraping part 120 to within a set threshold value, so that the glue spreading part 110 and the glue scraping part 120 are in sliding contact with each other.

[0106] Preferably, the friction coefficient adjustment component 150 includes side connection positions 151 which are detachably fixedly mounted at both ends of the base 141 and are respectively arranged corresponding to the front surfaces 1431 of the two second vertical plates 143, and a top surface connection position 152 which is fixedly connected to the side connection position 151. The top surface connection position 152 is configured such that when the scraping portion 120 rotates with the base 141 to abut against the glue-distributing portion 110, the top surface connection position 152 rotates to be arranged opposite to the top surface 1432 of the second vertical plate 143. A positioning bolt 153 is screwed on the connection position 152 and abuts against the top surface 1432 of the second vertical plate 143. A circumferential torque in the first direction or the second direction is applied to the positioning bolt 153 so that the top surface connection position 152 is displaced up and down along the axis of the positioning bolt 153, thereby expanding or reducing the distance between the top surface 1432 and the top surface connection position 152, and further adjusting the friction coefficient between the glue spreading part 110 and the glue scraping part 120 to within a set threshold, wherein the first direction and the second direction are opposite directions.

[0107] Furthermore, before step S1, the glue spreading method also includes a step of adjusting the glue spreading distance between the glue spreading part 110 and the glue outlet 211, including: a second sensing part 163, used to detect the glue spreading distance between the glue spreading part 110 and the glue outlet 211, and feed back the detected numerical information to the drive controller. In this embodiment, the second sensing part 163 is preferably a plate thickness measuring sensor.

[0108] The support portion 170 is linked with the coating knife 210 to translate along the Y direction, wherein the coating knife 210 is further arranged to be slidably arranged on the support portion 170 along the Z direction. In this embodiment, the support plate 170 includes two symmetrically arranged bases 171 and a crossbeam 172 slidably arranged on the base 171 along the Z direction for mounting the coating knife 210;

[0109] The second power unit is used to drive the coating knife to slide along the Z direction. In this embodiment, the second power unit includes two screw motors 180 that respectively drive two ends of the coating knife 210 to move simultaneously along the Z direction.

[0110] The drive controller outputs a second control instruction for controlling the driving operation of the second power unit according to the difference between the stored standard glue spreading distance value and the current glue spreading distance value fed by the second sensing unit 163. The second power unit rotates according to the received second control instruction and at the set number of circles, speed and direction, and then the coating knife is linked to move according to the difference distance, thereby adjusting the glue spreading distance L between the glue outlet 211 and the glue spreading unit 110 to within the set threshold, thereby ensuring the accuracy of the glue spreading distance L.

[0111] Furthermore, the glue spreading method further includes a step of adjusting the glue spreading distance between the glue outlet 211 and the platform 400, including:

[0112] The third sensing part 190 is used to detect the glue coating distance between the glue outlet 211 and the platform 400, and feed back the detected numerical information to the driving controller. In this embodiment, the third sensing part 190 is preferably a Panasonic displacement sensor.

[0113] The drive controller outputs a third control instruction for controlling the driving operation of the second power unit according to the difference between the stored standard glue coating distance value and the current glue coating distance value fed by the third sensing unit 190. The second power unit rotates according to the received third control instruction and in the set number of circles and direction, thereby linking the coating knife 210 to move according to the difference distance, and adjusting the glue coating distance between the glue outlet 211 and the platform 400 to within the set threshold value, thereby ensuring the accuracy of the glue coating distance and facilitating the coating of glue of a set thickness on the semiconductor substrate, which is adsorbed and positioned on the platform 400 by vacuum adsorption force.

[0114] The above is a preferred embodiment of the present invention. It should be pointed out that a person skilled in the art can make several improvements and modifications without departing from the principle of the present invention. These improvements and modifications are also considered to be within the scope of protection of the present invention.

Claims

1. A glue spreading system, used in conjunction with a glue coating system, characterized in that: Before the glue coating system applies glue, the glue spreading system is used to remove excess glue at the glue outlet of the glue coating system, including: A glue spreading part is arranged within the travel range of the glue outlet, and the glue spreading part is configured to rotate along its axis at the original position according to the set speed, number of turns and direction when the glue outlet moves to the predetermined glue spreading position, so as to adhere the excess glue at the glue outlet to the outer peripheral surface of the glue spreading part; The glue scraping part is configured to be in sliding contact with the outer peripheral surface of the glue spreading part. When the glue spreading part rotates, the glue scraping part scrapes off the glue liquid adhered to the outer peripheral surface of the glue spreading part, so that the glue spreading distance between the glue spreading part and the glue outlet is always maintained within a set threshold.

2. The glue-spinning system according to claim 1, characterized in that: The glue spreading position is located directly above the glue spreading portion. When the glue outlet moves to the glue spreading position, the axis of the glue spreading portion is configured to be directly opposite to the center of the glue outlet in the length direction.

3. The glue-spinning system according to claim 1, characterized in that: The glue scraping part has a tip for slidingly contacting with the glue spreading part, and the tip is used to scrape off the glue liquid adhered to the outer peripheral surface of the glue spreading part.

4. The glue-spinning system according to claim 3, characterized in that: The scraping part is a polyhedron, and the tip is formed at the intersection of two surfaces of the scraping part.

5. The glue-spinning system according to claim 3, characterized in that: The glue spreading part is a glue spreading wheel, and the tip of the glue scraping part is slidably abutted against an outer peripheral surface corresponding to a horizontal diameter of the glue spreading wheel.

6. The glue-spinning system according to claim 3, characterized in that: The tip is arranged close to the horizontal diameter of the rubber leveling wheel.

7. The coating system according to any one of claims 1 to 6, characterized in that: include: A first sensing part is used to detect the position of the glue outlet. When the glue outlet moves to the glue spreading position, the first sensing part outputs a current position signal of the glue outlet to the outside; A first power unit, used for driving the glue spreading unit to rotate; The driving controller outputs a first control instruction for controlling the operation of the first power unit according to the received position signal. The first power unit drives the glue spreading unit to rotate according to the set number of circles, speed and direction according to the received first control instruction, so as to remove excess glue at the glue outlet.

8. The glue-spinning system according to claim 7, characterized in that: Also includes: A second sensing part is used to detect the glue spreading distance between the glue spreading part and the glue outlet, and feed back the detected current glue spreading distance numerical information to the driving controller; A support portion, used to link the coating knife to translate along the Y direction, and the coating knife is also arranged to slide on the support portion along the Z direction; The second power unit is used to drive the coating knife to move along the Z direction; The drive controller outputs a second control instruction for controlling the operation of the second power unit based on the difference between the stored standard glue spreading distance value and the current glue spreading distance value fed by the second sensing unit. The second power unit rotates according to the received second control instruction and at the set number of circles, speed and direction, thereby linking the coating knife to move by the difference distance, so as to adjust the glue spreading distance between the glue outlet and the glue spreading unit to within the set threshold.

9. A coating device, comprising a coating system for uniformly coating glue on a semiconductor substrate, and also comprising the coating system described in any one of claims 1 to 8, wherein the coating system is used to remove excess glue adhering to the glue outlet of the coating system.

10. A method for coating, applied to the coating device according to claim 9, comprising the following steps: The glue spreading part is arranged within the travel range of the glue outlet. When the glue outlet moves to a predetermined glue spreading position, the glue spreading part rotates along its axis at the original position according to the set speed, number of turns and direction, so as to adhere the excess glue at the glue outlet to the outer peripheral surface of the glue spreading part. The glue scraping part is adjusted to a position where it slides and abuts against the glue spreading part. When the glue spreading part rotates, the glue scraping part is used to scrape off the glue liquid adhered to the outer peripheral surface of the glue spreading part, so that the glue spreading distance between the glue spreading part and the glue outlet is always maintained within a set threshold.

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