Silicon wafer cleaning device

Abstract

The invention discloses a silicon wafer cleaning device, and relates to the technical field of semiconductor preparation. Comprising a cleaning table; the cleaning plate is horizontally arranged in the cleaning table; the silicon wafer placing rack assembly is arranged on the cleaning plate; the vertical silicon wafer assembly and the movable cleaning table are arranged on the two opposite sides of the silicon wafer containing frame assembly respectively. The fixed cleaning assembly is arranged on the cleaning table, and the fixed cleaning assembly corresponds to the silicon wafer placing frame assembly in position; the silicon wafer placing frame assembly comprises a main placing frame and an auxiliary placing plate which are arranged on the cleaning plate in parallel, a first incomplete circular groove is formed in the main placing frame, a second incomplete circular groove is formed in the auxiliary placing plate, the area of the first incomplete circular groove is larger than that of the second incomplete circular groove, and the first incomplete circular groove and the second incomplete circular groove are spliced to form a complete circular groove. The silicon wafer cleaning device has the advantages that the silicon wafer cleaning effect is improved by adjusting the position of the silicon wafer, and the like.

Description

Technical Field

[0001] The invention relates to the technical field of semiconductor preparation, and in particular to a silicon wafer cleaning device. Background Art

[0002] In the manufacturing process of semiconductor devices, the surface of silicon wafers needs to be cleaned to prevent contaminants adhering to the surface of silicon wafers from affecting the quality of the manufactured devices. Therefore, a cleaning device is needed to clean silicon wafers. However, the general cleaning devices currently place silicon wafers in a cleaning machine or a cleaning basket when cleaning silicon wafers, and the position of the silicon wafers cannot be changed, which easily leads to dead corners in cleaning, resulting in poor cleaning effect. Summary of the invention

[0003] In view of the above-mentioned technical deficiencies, an object of the present invention is to provide a silicon wafer cleaning device having the advantages of being able to improve the cleaning effect of the silicon wafer by adjusting the position of the silicon wafer.

[0004] In order to solve the above technical problems, the present invention adopts the following technical solution: The present invention provides a silicon wafer cleaning device, comprising: Washing station; A cleaning plate, the cleaning plate is horizontally arranged in the cleaning table; A silicon wafer placement rack assembly, wherein the silicon wafer placement rack assembly is arranged on a cleaning plate; Silicon wafer vertical assembly; The movable cleaning table, the silicon wafer vertical assembly and the movable cleaning table are respectively arranged on two opposite sides of the silicon wafer placement rack assembly; A fixed cleaning component is arranged on the cleaning table, and the fixed cleaning component corresponds to the position of the silicon wafer placement rack component; Among them, the silicon wafer placement rack assembly includes a main placement rack and an auxiliary placement plate arranged in parallel on the cleaning plate, the silicon wafer vertical assembly is located on the side of the cleaning plate close to the main placement rack, the movable cleaning table is located on the side of the cleaning table close to the auxiliary placement plate, an incomplete circular groove one is arranged on the main placement rack, and an incomplete circular groove two is arranged on the auxiliary placement plate. The area of ​​the incomplete circular groove one is larger than the area of ​​the incomplete circular groove two, and the incomplete circular groove one and the incomplete circular groove two are spliced ​​into a complete circular groove.

[0005] Preferably, two lower water tanks are arranged in parallel and spaced apart on the top surface of the cleaning table, and the two lower water tanks are respectively located on the other two opposite sides of the cleaning plate. The bottom of the cleaning table is a hollow structure, and the lower water tank is connected to the cleaning table to facilitate the discharge and collection of water after cleaning the silicon wafers.

[0006] Preferably, a flip motor is provided on the side wall inside the cleaning table, and the end of the main placement rack away from the incomplete circular groove is provided on the output shaft of the flip motor, so that after the silicon wafers are placed on the silicon wafer placement rack assembly for cleaning, the flip motor is started to drive the main placement rack to flip, so that the cleaned silicon wafers can be taken out, or cleaned again through the movable cleaning table.

[0007] Preferably, both ends of the opening of the incomplete circular groove one are provided with grooves, and both ends of the opening of the incomplete circular groove two are provided with protrusions that match the grooves, and when the incomplete circular groove one and the incomplete circular groove two are spliced ​​into a complete circular groove, the protrusions are inserted into the grooves at the corresponding positions. When the incomplete circular groove one and the incomplete circular groove two are spliced ​​into a complete circular groove, the silicon wafer can be placed in the complete circular groove, which is convenient for placing the silicon wafer for cleaning.

[0008] Preferably, the silicon wafer vertical assembly includes a vertical plate seat fixedly arranged on the top of the cleaning table, two arc-shaped inner rods movably penetrate the vertical plate seat, and two arc-shaped outer rods corresponding to the two arc-shaped inner rods are arranged on the cleaning plate, and a return spring is arranged in one end of the arc-shaped outer rod close to the arc-shaped inner rod, and one end of the arc-shaped inner rod close to the arc-shaped outer rod movably penetrates into the arc-shaped outer rod and is connected with the return spring, and one end of the arc-shaped inner rod away from the arc-shaped outer rod corresponds to the position of the incomplete circular groove one, and an incomplete circular groove three with the same size as the incomplete circular groove two is arranged on the side wall of the vertical plate seat. When the silicon wafer is placed on the silicon wafer placement rack assembly for cleaning, the flip motor is started to drive the main placement rack to flip in the direction close to the vertical plate seat, so that the silicon wafer is perpendicular to the horizontal plane; at the same time, when the silicon wafer is flipped, the two arc-shaped inner rods can conflict with the silicon wafer to prevent the silicon wafer from falling out of the incomplete circular groove one.

[0009] Preferably, a buffer column assembly is provided between the two arc-shaped inner rods, and the buffer column assembly comprises: A support seat, the support seat is arranged on the cleaning plate; A buffer outer cylinder, which is arranged on the side wall of the support seat; A buffer spring, the buffer spring is arranged in the buffer outer cylinder; A buffer column, one end of the buffer column close to the support seat is coaxially movably arranged in the buffer outer cylinder and connected to the buffer spring, and one end of the buffer column away from the support seat is located between the two arc-shaped inner rods; The buffer roller is rotatably arranged at one end of the buffer column away from the buffer outer cylinder. When the silicon wafer is placed on the silicon wafer placement rack assembly for cleaning, the flip motor is started to drive the main placement rack to flip toward the direction close to the vertical plate seat. The buffer roller can contact the silicon wafer to prevent the silicon wafer from falling before the incomplete circular groove one and the incomplete circular groove three are spliced ​​together.

[0010] Preferably, the movable cleaning station comprises: A water tank with a water pump is arranged on one side of the washing table close to the auxiliary placement plate; A push cylinder, which is arranged on the side wall of a water tank with a water pump; A spray plate is arranged on the piston rod of the pushing cylinder. A plurality of nozzles are arranged on the end face of the spray plate away from the pushing cylinder. The spray plate is connected to a water tank with a water pump through a water pipe. The spray plate, the piston rod of the pushing cylinder and the buffer column are coaxial, so it is convenient to clean the bottom surface of the silicon wafer again through the spray plate.

[0011] Preferably, the fixed cleaning assembly comprises: A second water tank with a water pump is arranged outside the washing table; Upper spray plate; The lower spray plate, the upper spray plate and the lower spray plate are all connected to the water tank with a water pump through the water pipe. The upper spray plate and the lower spray plate are respectively arranged on the top of the cleaning table and the top surface of the cleaning plate, and the positions of the upper spray plate and the lower spray plate correspond to each other in the vertical direction. A plurality of nozzles are arranged on the upper spray plate and the lower spray plate, and the nozzles are oriented in the direction of the complete circular groove formed by the incomplete circular groove one and the incomplete circular groove two, so that the silicon wafers placed in the complete circular groove formed by the incomplete circular groove one and the incomplete circular groove two with the nozzles two oriented in the direction of the complete circular groove formed by the incomplete circular groove one and the incomplete circular groove two can be cleaned conveniently through the upper spray plate and the lower spray plate.

[0012] The beneficial effects of the present invention are: 1. Silicon wafers can be placed in a silicon wafer placement rack assembly, and the top and bottom surfaces of the silicon wafers can be cleaned by a fixed cleaning assembly; the main placement rack can also be turned over and used in conjunction with the vertical plate seat to clean the bottom surface of the silicon wafer again, thereby improving the cleaning effect of the silicon wafer and avoiding the accumulation of dust and dirty water on the bottom surface of the silicon wafer when using a fixed cleaning assembly to clean the silicon wafer, thereby improving the cleaning effect.

[0013] 2. The setting of the silicon wafer placement rack assembly can be based on the silicon wafer being flipped to different positions, and the flipping motor can be started to drive the main placement rack to rotate toward the auxiliary placement plate, so that the incomplete circular groove one and the incomplete circular groove two are spliced ​​into a complete circular groove, which is convenient for cleaning the top and bottom surfaces of the silicon wafer by fixing the cleaning assembly; or the main placement rack can be rotated to a position 90 degrees to the horizontal plane, and the bottom surface of the silicon wafer can be cleaned again by the movable cleaning table; the positions of the incomplete circular groove one and the incomplete circular groove two can also be staggered, so as to facilitate the removal of the silicon wafer from the complete circular groove.

[0014] 3. The setting of the buffer column assembly is conducive to keeping the position of the silicon wafer stable when cleaning the bottom surface of the silicon wafer. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0016] Figure 1 A schematic structural diagram of a silicon wafer cleaning device provided in an embodiment of the present invention.

[0017] Figure 2 A schematic structural diagram of a silicon wafer placement rack assembly of a silicon wafer cleaning device provided in an embodiment of the present invention.

[0018] Figure 3 A schematic diagram of the position of an upper spray plate of a silicon wafer cleaning device provided in an embodiment of the present invention.

[0019] Figure 4 A schematic structural diagram of a buffer column assembly of a silicon wafer cleaning device provided in an embodiment of the present invention.

[0020] Figure 5 A schematic diagram of the position of an incomplete circular groove of a silicon wafer cleaning device provided in an embodiment of the present invention.

[0021] Figure 6 A schematic diagram of the second position of an incomplete circular groove of a silicon wafer cleaning device provided in an embodiment of the present invention.

[0022] Figure 7 A schematic diagram of the position of a return spring of a silicon wafer cleaning device provided in an embodiment of the present invention.

[0023] Explanation of the reference numerals: 1. cleaning table; 11. water tank; 2. cleaning plate; 3. wafer placement rack assembly; 31. main placement rack; 311. incomplete circular groove one; 312. groove; 32. auxiliary placement plate; 321. incomplete circular groove two; 322. protrusion; 33. flip motor; 4. vertical wafer assembly; 41. vertical plate seat; 42. arc-shaped inner rod; 43. arc-shaped outer rod; 431. return spring; 44. incomplete circular groove three; 5. movable cleaning table; 51. water tank one with water pump; 52. pushing cylinder; 53. spray plate; 6. fixed cleaning assembly; 61. upper spray plate; 62. lower spray plate; 7. buffer column assembly; 71. support seat; 72. buffer outer cylinder; 73. buffer spring; 74. buffer column; 75. buffer roller. DETAILED DESCRIPTION

[0024] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0025] Embodiment 1 like Figures 1 to 3 , Figures 5 and 6 As shown, the present invention provides a silicon wafer cleaning device, including a cleaning table 1; a cleaning plate 2 is horizontally arranged in the cleaning table 1; a silicon wafer placement rack assembly 3 is arranged on the cleaning plate 2; a silicon wafer vertical assembly 4 and a movable cleaning table 5 are respectively arranged on two opposite sides of the silicon wafer placement rack assembly 3; a fixed cleaning assembly 6 is arranged on the cleaning table 1, and the fixed cleaning assembly 6 corresponds to the position of the silicon wafer placement rack assembly 3; the silicon wafer placement rack assembly 3 includes a main placement rack 31 and an auxiliary placement plate 32 arranged in parallel on the cleaning plate 2, and the silicon wafer vertical assembly 4 is located near the cleaning plate 2. On one side of the main placing rack 31, the movable cleaning table 5 is located on the side of the cleaning table 1 close to the auxiliary placing plate 32, an incomplete circular groove 1 311 is arranged on the main placing rack 31, and an incomplete circular groove 2 321 is arranged on the auxiliary placing plate 32, the area of ​​the incomplete circular groove 1 311 is larger than the area of ​​the incomplete circular groove 2 321, and the incomplete circular groove 1 311 and the incomplete circular groove 2 321 are spliced ​​into a complete circular groove; a flip motor 33 is arranged on the side wall inside the cleaning table 1, and the end of the main placing rack 31 away from the incomplete circular groove 1 311 is arranged on the output shaft of the flip motor 33.

[0026] Before cleaning the silicon wafer, start the flip motor 33 to drive the main placement rack 31 to rotate towards the auxiliary placement plate 32, so that the incomplete circular groove 1 311 and the incomplete circular groove 2 321 are spliced ​​into a complete circular groove (at this time, the main placement rack 31 and the auxiliary placement plate 32 are on the same horizontal plane), and the silicon wafer can be placed in the complete circular groove (the incomplete circular groove 1 311 and the incomplete circular groove 2 321 are both step groove structures); at this time, the top and bottom surfaces of the silicon wafer placed in the complete circular groove can be cleaned by fixing the cleaning component 6; when using the fixed After the fixed cleaning component 6 finishes cleaning the silicon wafers, the flip motor 33 can be started to drive the main placement rack 31 to rotate in the direction away from the auxiliary placement plate 32 (that is, drive the main placement rack 31 to rotate in the direction away from the cleaning plate 2. Since the area of ​​the incomplete circular groove 1 311 is larger than the area of ​​the incomplete circular groove 2 321, the main placement rack 31 can drive the silicon wafer to rotate to a state where the angle between 20 and 45 degrees with the horizontal plane). At this time, the positions of the incomplete circular groove 1 311 and the incomplete circular groove 2 321 are staggered, and the silicon wafer can be taken out from the complete circular groove.

[0027] After the silicon wafers are cleaned in the complete circular groove using the fixed cleaning assembly 6, the flip motor 33 is started to drive the main placement rack 31 to rotate in a direction away from the auxiliary placement plate 32, so that the main placement rack 31 rotates to a position 90 degrees to the horizontal plane (until the ground of the silicon wafer rotates to the direction of the movable cleaning table 5). During the rotation of the main placement rack 31, the silicon wafer vertical assembly 4 can contact the silicon wafer, thereby preventing the silicon wafer from falling from the complete circular groove, and the bottom surface of the silicon wafer can be cleaned again by the movable cleaning table 5.

[0028] Both ends of the opening of the incomplete circular groove 1 311 are provided with grooves 312, and both ends of the opening of the incomplete circular groove 2 321 are provided with protrusions 322 that are compatible with the grooves 312, and when the incomplete circular groove 1 311 and the incomplete circular groove 2 321 are spliced ​​into a complete circular groove, the protrusion 322 is snapped into the groove 312 at the corresponding position; so that when the flip motor 33 is started to drive the main placement frame 31 to rotate in the direction close to the auxiliary placement plate 32, after the incomplete circular groove 1 311 and the incomplete circular groove 2 321 are spliced ​​into a complete circular groove (at this time, the main placement frame 31 and the auxiliary placement plate 32 are on the same horizontal plane), the protrusion 322 on the incomplete circular groove 2 321 is snapped into the groove 312 at the corresponding position on the incomplete circular groove 1 311, which is beneficial to maintaining a close fit between the main placement frame 31 and the auxiliary placement plate 32, and is beneficial to the stable placement of the silicon wafer.

[0029] Two lower water tanks 11 are arranged in parallel and at intervals on the top surface of the cleaning table 1, and the two lower water tanks 11 are respectively located on the other two opposite sides of the cleaning plate 2. The bottom of the cleaning table 1 is a hollow structure, and the lower water tank 11 is connected to the cleaning table 1, so that the water after the silicon wafers are cleaned by the movable cleaning table 5 and / or the fixed cleaning component 6 flows through the lower water tank 11 to the bottom of the cleaning table 1 for collection, which is convenient for unified treatment later.

[0030] Embodiment 2 Based on the first embodiment, Figures 1 to 7As shown, the silicon wafer vertical assembly 4 includes a vertical plate seat 41 fixedly arranged on the top of the cleaning table 1, and two arc-shaped inner rods 42 are movably penetrated on the vertical plate seat 41. Two arc-shaped outer rods 43 corresponding to the two arc-shaped inner rods 42 are arranged on the cleaning plate 2. A return spring 431 is arranged in one end of the arc-shaped outer rod 43 close to the arc-shaped inner rod 42, and one end of the arc-shaped inner rod 42 close to the arc-shaped outer rod 43 is movably penetrated into the arc-shaped outer rod 43 and connected with the return spring 431. The end of the arc-shaped inner rod 42 away from the arc-shaped outer rod 43 corresponds to the position of the incomplete circular groove 1 311. The side wall of the vertical plate seat 41 is provided with a spring corresponding to the incomplete circular groove 1 311. An incomplete circular groove three 44 of the same size as the circular groove two 321; a buffer column assembly 7 is arranged between the two arc-shaped inner rods 42, and the buffer column assembly 7 includes a support seat 71, and the support seat 71 is arranged on the cleaning plate 2; a buffer outer cylinder 72 is arranged on the side wall of the support seat 71; a buffer spring 73 is arranged in the buffer outer cylinder 72; one end of the buffer column 74 close to the support seat 71 is coaxially movably arranged in the buffer outer cylinder 72 and is connected to the buffer spring 73, and the end of the buffer column 74 away from the support seat 71 is located between the two arc-shaped inner rods 42; a buffer roller 75 is rotatably arranged at the end of the buffer column 74 away from the buffer outer cylinder 72.

[0031] When the silicon wafers are cleaned using the fixed cleaning assembly 6, the flip motor 33 is started to drive the main placement rack 31 to rotate in a direction away from the cleaning plate 2. Since the area of ​​the incomplete circular groove 1 311 is larger than the area of ​​the incomplete circular groove 2 321, the main placement rack 31 can drive the silicon wafers to rotate. During the rotation of the main placement rack 31, the end of the arc-shaped inner rod 42 away from the arc-shaped outer rod 43 can contact the silicon wafers (as the main placement rack 31 rotates, the return spring 431 can be gradually compressed, so that the arc-shaped inner rod 42 gradually enters the arc-shaped outer rod 43), which is conducive to keeping the silicon wafer in a stable position in the incomplete circular groove 1 311; and during the rotation of the silicon wafers driven by the main placement rack 31 At the same time, the silicon wafer will conflict with the buffer roller 75. As the main placement rack 31 rotates, the buffer spring 73 can be gradually compressed (the buffer column 74 moves in the buffer outer cylinder 72), so that the position of the silicon wafer of the main placement rack 31 during the rotation process can be kept stable under the conflict between the arc-shaped inner rod 42 and the buffer roller 75, until the main placement rack 31 rotates to a position 90 degrees with the horizontal plane (at this time, the incomplete circular groove 1 311 on the main placement rack 31 and the incomplete circular groove 3 44 on the side wall of the vertical plate seat 41 are spliced ​​into a complete circular groove, which is conducive to maintaining the stability of the silicon wafer position, and the incomplete circular groove 3 44 is a step groove structure), and the bottom surface of the silicon wafer can be cleaned again through the movable cleaning table 5.

[0032] The movable cleaning table 5 includes a water tank 51 with a water pump, which is arranged on one side of the cleaning table 1 close to the auxiliary placement plate 32; a pushing cylinder 52 is arranged on the side wall of the water tank 51 with a water pump; a spray plate 53 is arranged on the piston rod of the pushing cylinder 52, and a plurality of nozzles are arranged on the end surface of the spray plate 53 away from the pushing cylinder 52, and the spray plate 53 is connected to the water tank 51 with a water pump through a water pipe 1, and the spray plate 53, the piston rod of the pushing cylinder 52 and the buffer column 74 are coaxial; when the main placement rack 31 rotates to a position 90 degrees with the horizontal plane, the pushing cylinder 52 can be started to drive the spray plate 53 to move toward the direction of the silicon wafer vertical assembly 4, and the water in the water tank 51 with a water pump can be sprayed out from the nozzle through the water pipe 1 and the spray plate 53 to clean the bottom surface of the silicon wafer again, thereby preventing dust and sewage from adhering to the bottom surface of the silicon wafer after the silicon wafer is cleaned using the fixed cleaning assembly 6.

[0033] Embodiment 3 Based on the first embodiment, Figure 1 , Figure 3 , Figures 5 and 6 As shown, the fixed cleaning component 6 includes a water tank 2 with a water pump, and the water tank 2 with a water pump is arranged outside the cleaning table 1; the upper spray plate 61 and the lower spray plate 62 are connected to the water tank 2 with a water pump through a water pipe 2, and the upper spray plate 61 and the lower spray plate 62 are respectively arranged on the top of the cleaning table 1 and the top surface of the cleaning plate 2, and the positions of the upper spray plate 61 and the lower spray plate 62 correspond to the positions of the complete circular groove formed by the incomplete circular groove 1 311 and the incomplete circular groove 2 321 in the vertical direction, and a plurality of spray heads 2 are arranged on the upper spray plate 61 and the lower spray plate 62, and the spray heads 2 face the direction of the complete circular groove formed by the incomplete circular groove 1 311 and the incomplete circular groove 2 321; the turning motor 33 drives the main placement rack 31 to turn over (at this time the main placement rack The main placing rack 31 and the auxiliary placing plate 32 are on the same plane), so that after the incomplete circular groove 1 311 and the incomplete circular groove 2 321 are spliced ​​into a complete circular groove, the silicon wafer can be placed horizontally in the complete circular groove (a clamping rod can be rotatably provided on the main placing rack 31 and the auxiliary placing plate 32, that is, one end of the clamping rod is rotatably provided on the main placing rack 31 and the auxiliary placing plate 32, and when the silicon wafer is placed in the complete circular groove, the clamping rod can be rotated so that the other end of the clamping rod contacts the top surface of the silicon wafer); the water in the water tank 2 with a water pump can enter into the nozzle 2, and then enter into the upper spray plate 61 and the lower spray plate 62 respectively, and finally be sprayed out by the nozzle on the upper spray plate 61 and the nozzle 2 on the lower spray plate 62, so as to realize spray cleaning of the top and bottom surfaces of the silicon wafer.

[0034] Obviously, those skilled in the art can make various changes and modifications to the present invention without departing from the spirit and scope of the present invention. Thus, if these modifications and variations of the present invention fall within the scope of the claims of the present invention and their equivalents, the present invention is also intended to include these modifications and variations.

Claims

1. A silicon wafer cleaning device, characterized in that: include: Washing station (1); A cleaning plate (2), the cleaning plate (2) being arranged horizontally inside the cleaning table (1); A silicon wafer placement rack assembly (3), wherein the silicon wafer placement rack assembly (3) is arranged on the cleaning plate (2); Silicon wafer vertical assembly (4); A movable cleaning table (5), a silicon wafer vertical assembly (4) and a movable cleaning table (5) are respectively arranged on two opposite sides of the silicon wafer placement rack assembly (3); A fixed cleaning component (6), the fixed cleaning component (6) being arranged on the cleaning table (1), and the fixed cleaning component (6) corresponds to the position of the silicon wafer placement rack component (3); The silicon wafer placement rack assembly (3) comprises a main placement rack (31) and an auxiliary placement plate (32) arranged in parallel on a cleaning plate (2); the silicon wafer vertical assembly (4) is located on a side of the cleaning plate (2) close to the main placement rack (31); the movable cleaning table (5) is located on a side of the cleaning table (1) close to the auxiliary placement plate (32); an incomplete circular groove 1 (311) is arranged on the main placement rack (31); an incomplete circular groove 2 (321) is arranged on the auxiliary placement plate (32); the area of ​​the incomplete circular groove 1 (311) is larger than the area of ​​the incomplete circular groove 2 (321); the incomplete circular groove 1 (311) and the incomplete circular groove 2 (321) are spliced ​​into a complete circular groove.

2. A silicon wafer cleaning device as claimed in claim 1, characterized in that: Two lower water tanks (11) are arranged in parallel and at intervals on the top surface of the cleaning table (1), and the two lower water tanks (11) are respectively located on the other two opposite sides of the cleaning plate (2); the bottom of the cleaning table (1) is a hollow structure, and the lower water tanks (11) are connected to the cleaning table (1).

3. A silicon wafer cleaning device as claimed in claim 1, characterized in that: A turning motor (33) is arranged on the side wall inside the cleaning table (1), and an end of the main placement rack (31) away from the incomplete circular groove (311) is arranged on the output shaft of the turning motor (33).

4. A silicon wafer cleaning device as claimed in claim 1, characterized in that: Both ends of the opening of the incomplete circular groove 1 (311) are provided with grooves (312), and both ends of the opening of the incomplete circular groove 2 (321) are provided with protrusions (322) that match the grooves (312), and when the incomplete circular groove 1 (311) and the incomplete circular groove 2 (321) are spliced ​​into a complete circular groove, the protrusions (322) are snapped into the grooves (312) at the corresponding positions.

5. A silicon wafer cleaning device as claimed in claim 1, characterized in that: The silicon wafer vertical assembly (4) comprises a vertical plate seat (41) fixedly arranged on the top of the cleaning table (1); two arc-shaped inner rods (42) are movably penetrated on the vertical plate seat (41); two arc-shaped outer rods (43) are respectively arranged on the cleaning plate (2) and correspond to the two arc-shaped inner rods (42); a return spring (431) is arranged in one end of the arc-shaped outer rod (43) close to the arc-shaped inner rod (42); and one end of the arc-shaped inner rod (42) close to the arc-shaped outer rod (43) is movably penetrated into the arc-shaped outer rod (43) and connected to the return spring (431); one end of the arc-shaped inner rod (42) away from the arc-shaped outer rod (43) corresponds to the position of the incomplete circular groove 1 (311); and an incomplete circular groove 3 (44) having the same size as the incomplete circular groove 2 (321) is arranged on the side wall of the vertical plate seat (41).

6. A silicon wafer cleaning device as claimed in claim 5, characterized in that: A buffer column assembly (7) is provided between the two arc-shaped inner rods (42), and the buffer column assembly (7) comprises: A support seat (71), the support seat (71) being arranged on the cleaning plate (2); A buffer outer cylinder (72), the buffer outer cylinder (72) being arranged on a side wall of the support seat (71); A buffer spring (73), wherein the buffer spring (73) is arranged inside the buffer outer cylinder (72); A buffer column (74), wherein one end of the buffer column (74) close to the support seat (71) is coaxially movably arranged in the buffer outer cylinder (72) and connected to the buffer spring (73), and one end of the buffer column (74) away from the support seat (71) is located between the two arc-shaped inner rods (42); The buffer roller (75) is rotatably arranged at one end of the buffer column (74) away from the buffer outer cylinder (72).

7. A silicon wafer cleaning device as claimed in claim 6, characterized in that: The movable cleaning station (5) comprises: A water tank (51) with a water pump, wherein the water tank (51) with a water pump is arranged on a side of the cleaning table (1) close to the auxiliary placement plate (32); A push cylinder (52), the push cylinder (52) is arranged on the side wall of the water tank (51) with a water pump; A spray plate (53) is arranged on the piston rod of the push cylinder (52); a plurality of spray heads are arranged on the end surface of the spray plate (53) facing away from the push cylinder (52); the spray plate (53) is connected to a water tank (51) with a water pump via a water pipe; the spray plate (53), the piston rod of the push cylinder (52) and the buffer column (74) are coaxial.

8. A silicon wafer cleaning device as claimed in claim 1, characterized in that: The fixed cleaning assembly (6) comprises: A second water tank with a water pump, wherein the second water tank with a water pump is arranged outside the washing table (1); Upper spray plate (61); The lower spray plate (62), the upper spray plate (61) and the lower spray plate (62) are all connected to a water tank with a water pump through a water pipe. The upper spray plate (61) and the lower spray plate (62) are respectively arranged on the top of the washing table (1) and the top surface of the washing plate (2), and the positions of the upper spray plate (61) and the lower spray plate (62) correspond to the positions of the complete circular groove formed by splicing the incomplete circular groove one (311) and the incomplete circular groove two (321) in the vertical direction. The upper spray plate (61) and the lower spray plate (62) are both provided with a plurality of spray heads two, and the spray heads two face the direction of the complete circular groove formed by splicing the incomplete circular groove one (311) and the incomplete circular groove two (321).

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