Circuit copper plate shaping equipment and method

Abstract

The invention discloses circuit copper plate shaping equipment and method. The circuit copper plate shaping equipment comprises a feeding mechanism, a pre-shaping mechanism, a drying mechanism, a leveling mechanism and a detection assembly. The auxiliary rollers, the conveying rollers and the deformation rollers in the pre-finishing mechanism are reasonably arranged to form a symmetrical supporting structure, the conveying stability of the circuit copper plate is enhanced, and it is ensured that pre-bending force is evenly transmitted. And a second conveying belt of the conveying assembly is obliquely designed, so that the circuit copper plates gradually enter a pre-bending area in the conveying process, damage caused by sudden stress is avoided, and stress is more uniform. The moving platform can accurately control the position of the deformation roller through lead screw transmission, and the pre-bending precision is improved. The detection assembly realizes real-time monitoring and closed-loop control of the warping state of the circuit copper plate through cooperative work of a conveying frame, a mounting frame, a sensor and a central processing unit, can adapt to circuit copper plates of different specifications, and enhances the flexibility and adaptability of the equipment.

Description

Technical Field

[0001] The present application relates to the technical field of circuit copper plate printing, and in particular to a circuit copper plate shaping device and method. Background Art

[0002] Circuit copper plates are prone to warping under high-temperature drying. Due to the large error in the expansion coefficient of the same material substrate, the degree of warping will also vary between different batches. The existing treatment method is to set up circuit copper plate shaping equipment after the drying process to flatten the warped circuit copper plates. However, when the warping amplitude is too large, the circuit copper plate shaping equipment will cause the circuit copper plates to tear. Summary of the Invention

[0003] The purpose of this application is to provide a circuit copper plate shaping device and method to solve the problem of circuit copper plate warping.

[0004] In the first aspect, the present application provides a circuit copper plate shaping equipment, which adopts the following technical scheme: it includes a feeding mechanism, a pre-shaping mechanism, a drying mechanism, a leveling mechanism, and a detection component, and the detection component is respectively arranged between the pre-shaping mechanism and the drying mechanism, and between the drying mechanism and the leveling mechanism. The pre-shaping mechanism first bends the circuit copper plate, and the detection component measures the bending data of the circuit copper plate. The bent circuit copper plate enters the drying mechanism for drying. The detection component measures the bending data of the circuit copper plate again and adjusts the bending situation of the circuit copper plate by the pre-shaping mechanism. Finally, the circuit copper plate enters the leveling mechanism with a suitable bending curvature for leveling.

[0005] This solution achieves closed-loop control of the pre-bending process and inspection components, significantly optimizing the performance of the circuit copper plates during the drying and leveling processes. This approach offers several advantages over existing technologies. Existing technologies typically use shaping equipment to level the circuit copper plates directly after drying, which can easily lead to tearing due to excessive warping and lacks active control and real-time adjustment capabilities for warping. This approach, however, pre-bends the circuit copper plates before drying, actively counteracting any warping during the drying process. Combined with a detection component that monitors the plate's bending data in real time, it dynamically adjusts the pre-bending amount and leveling pressure, creating a closed-loop control system. This design not only reduces the risk of tearing but also improves product consistency and reliability. Furthermore, through automated control and intelligent adjustment, this solution adapts to different materials, thicknesses, and sizes of circuit copper plates, improving production efficiency and process adaptability while reducing material waste, energy consumption, and production costs. The introduction of the inspection component also enables process traceability, providing data support for further optimization of process parameters.

[0006] Preferably, the pre-alignment mechanism includes a casing, a transport component installed on the casing, a plurality of auxiliary rollers installed on the casing, a mobile platform installed on the casing, a plurality of transport rollers installed on the casing, and a deformable roller installed on the mobile platform. The auxiliary rollers and the transport rollers are located on both sides of the deformable roller, the transport roller is located above the transport component, and a first conveyor belt is passed around the surface of the transport roller. At least two deformable rollers change the transport trajectory of the transport component, and the deformable roller can abut against the first conveyor belt.

[0007] Through this solution, the chassis provides overall support and a mounting base, ensuring stable operation of all components. The transport assembly transports the circuit copper plates, ensuring they enter the pre-bending mechanism smoothly. The coordination of the auxiliary rollers, transport rollers, and deforming rollers bends the circuit copper plates. The mobile platform adjusts the position of the deforming rollers, allowing the deforming rollers and auxiliary rollers to bend the circuit copper plates into various shapes. The transport assembly, deforming rollers, transport rollers, and the first conveyor belt coordinate to achieve continuous transport and pre-bending of the circuit copper plates, reducing manual intervention and improving production efficiency. The compact layout of the auxiliary rollers, transport rollers, and deforming rollers ensures functionality while minimizing the equipment footprint.

[0008] Preferably, at least two groups of the auxiliary rollers and the transport rollers are located in the same vertical plane, the auxiliary rollers are located at the same horizontal height, and at least two transport rollers are located at the same horizontal height.

[0009] Through the above scheme, the auxiliary rollers are located at the same horizontal height and in the same vertical plane as the transport rollers, forming a symmetrical support structure, which further enhances the stability of the circuit copper plate transportation; the deformable roller cooperates with the auxiliary rollers, the transport rollers, and the first conveyor belt to apply a pre-bending force to the circuit copper plate. The symmetrical layout of the auxiliary rollers ensures that the pre-bending force is evenly transmitted to the entire width direction of the circuit copper plate; the layout and position design of the auxiliary rollers ensure that the circuit copper plate moves along a predetermined trajectory during transportation and pre-bending to avoid deviation or distortion; during the pre-bending process, the force applied by the deformable rollers to the circuit copper plate may cause the circuit copper plate to twist or deflect, and the supporting effect of the auxiliary rollers can effectively offset the influence of these external forces; the supporting effect of the auxiliary rollers ensures that the circuit copper plate is evenly stressed during the pre-bending process, reducing damage caused by excessive local stress.

[0010] Preferably, the transport assembly includes a belt roller rotatably connected to the housing, a second conveyor belt installed on the belt roller, and a first power source for driving the belt roller and the transport roller respectively, the auxiliary roller abuts against the second conveyor belt, and the second conveyor belt portion is horizontally tilted 10°-20° under the action of the auxiliary roller.

[0011] Through the above solution, the inclined design of the second conveyor belt allows the circuit copper plate to gradually enter the pre-bending area during transportation, avoiding deformation or damage caused by sudden force. The inclined angle makes the circuit copper plate more evenly stressed during the pre-bending process, avoiding local stress concentration; the auxiliary roller abuts the second conveyor belt to ensure that it remains stable during the tilting process, further improving the transportation stability and pre-bending accuracy. The inclined angle design makes the circuit copper plate more evenly stressed during the pre-bending process, avoiding local stress concentration, and improving the accuracy and consistency of pre-bending.

[0012] Preferably, the movable platform includes a first screw rod rotatably connected to the housing, a first polished rod fixedly connected to the housing, a movable plate slidably connected to the first polished rod, a second power source driving the first screw rod to rotate, a second screw rod rotatably connected to the movable plate, a third power source driving the second screw rod to rotate, and a mounting block that moves relative to the movable plate, the deformable roller is rotatably connected to the mounting block, and the third power source is mounted on the movable plate.

[0013] Through the above scheme, through the cooperation of the first screw and the first light rod, the mobile platform can move precisely in the horizontal direction, change the vertical distance between the deformable roller and the auxiliary roller, so that the circuit copper plate / copper plate can be bent to different amplitudes; through the cooperation of the second screw and the mounting block, the deformable roller can move precisely in the vertical direction to adjust the amplitude and strength of the pre-bending; the screw transmission has the characteristics of high precision and high rigidity, which can realize the precise control of the position of the deformable roller and improve the accuracy of the pre-bending.

[0014] Preferably, the detection component includes a conveying rack, a mounting rack fixedly connected to the conveying rack, a plurality of sensors mounted on the mounting rack, and a central processing unit. The circuit copper plate is transported to the bottom of the sensor via the conveying rack. The sensor obtains the warping information of the circuit copper plate and transmits the warping information to the central processing unit for analysis and processing. The central processing unit controls the pre-alignment mechanism so that the circuit copper plate enters the drying mechanism with a suitable bend.

[0015] Through the above-mentioned solution, the detection assembly, through the coordinated operation of a conveyor frame, mounting frame, sensors, and a central processing unit, achieves real-time monitoring and closed-loop control of the circuit copper plate's warpage state, significantly optimizing the pre-bending and drying processes. The detection assembly's core functions include: the conveyor frame ensures smooth transportation of the circuit copper plate; the mounting frame secures sensors to accurately measure the plate's warpage information (such as height and bend angle); and the sensors transmit the collected data to the central processing unit for analysis and processing. Based on sensor feedback, the central processing unit dynamically adjusts the parameters of the pre-bending mechanism to ensure that the circuit copper plate enters the drying mechanism in the proper bend state. The detection assembly, through real-time monitoring and feedback control, implements closed-loop control of the pre-bending process, ensuring that the plate's bend state consistently meets the required level, thereby improving pre-bending accuracy and consistency. Furthermore, the precise measurement of the sensors and the dynamic adjustment capabilities of the central processing unit ensure uniform stress distribution during the pre-bending process, avoiding damage caused by localized stress concentrations. This prevents overbending and reduces the risk of tearing the plate. Furthermore, the universal design and dynamic adjustment capabilities of the inspection component enable it to adapt to circuit copper plates of varying specifications, enhancing the equipment's flexibility and adaptability. Regarding production efficiency, the automated control of the inspection component reduces manual intervention, enabling continuous production and significantly improving production efficiency. Furthermore, through real-time monitoring and feedback control, the equipment can quickly adjust pre-bending parameters, reducing equipment adjustment time and further enhancing production efficiency. Regarding product quality, the inspection component ensures consistent bending of the circuit copper plates, reducing defects caused by manual operation or process fluctuations, and improving product consistency and reliability.

[0016] Preferably, the leveling mechanism includes a box body, a plurality of rotating rollers rotatably connected to the box body, a plurality of leveling rollers rotatably connected to the box body, and a fourth power source for driving the leveling rollers to rotate. The leveling rollers are located above the plurality of rotating rollers, and the plurality of leveling rollers are installed at the same horizontal height.

[0017] Through the above scheme, the horizontal alignment of the leveling roller ensures that the circuit copper plate is evenly stressed during the leveling process, thereby improving the leveling accuracy; the supporting function of the rotating roller ensures that the circuit copper plate remains stable during the leveling process, avoiding deviation or distortion; the drive of the fourth power source realizes the automatic control of the leveling roller, thereby improving production efficiency.

[0018] In a second aspect, the present application provides a circuit copper plate shaping method, which adopts the following technical solution: comprising the above-mentioned circuit copper plate shaping device, specifically comprising the following steps: S1. Input the size information of the copper plate into the operation interface of the central processing unit; S2, the feeding mechanism transports the copper plate to the entire production line, the copper plate is pre-bent by the pre-bending mechanism, and the bending amplitude information of the copper plate is obtained by the detection component; S3, drying the pre-bent copper plate through a drying assembly, and restoring the bent copper plate to the opposite direction of the bending; S4. The dried copper plate obtains the bending amplitude information of the copper plate through the detection component. If the bending of the copper plate exceeds the preset value for entering the leveling mechanism, the central processing unit adjusts the pre-bending value of the copper plate by the pre-leveling mechanism so that the dried copper plate can enter the leveling mechanism with an appropriate bending amplitude.

[0019] By adopting the above solution, through the coordination of the central processing unit and the real-time feedback of the detection component, intelligent control of the pre-bending, drying and leveling process of the circuit copper plate is achieved, which significantly optimizes production efficiency and product quality. The specific process includes four steps: First, the size information of the copper plate is input through the operation interface of the central processing unit to provide basic data for subsequent processes; secondly, the loading mechanism transports the copper plate to the production line, the pre-bending mechanism pre-bends the copper plate, and the detection component obtains the bending amplitude information in real time; then, the pre-bent copper plate enters the drying component, and during the drying process, the copper plate recovers its deformation in the opposite direction of the pre-bending, effectively offsetting the warping caused by drying; finally, the dried copper plate obtains the bending amplitude information through the detection component. If it exceeds the preset value, the central processing unit dynamically adjusts the pre-bending amount of the pre-bending mechanism to ensure that the copper plate enters the leveling mechanism with an appropriate bending amplitude; First, through data input and closed-loop control, the process is intelligent and automated, reducing manual intervention and improving production efficiency. Second, real-time monitoring and dynamic adjustment functions ensure the accuracy of pre-bending and drying effects, improving product consistency and reliability. Third, the pre-bending process effectively offsets the warping caused during the drying process, reducing the extent of warping after drying, and simplifying the leveling process. Fourth, real-time detection and feedback control functions reduce the risk of damage to the copper plate during the leveling process and reduce the scrap rate. Fifth, dynamic parameter adjustment and universal design enable the equipment to adapt to copper plates of different specifications, enhancing the flexibility of the production line.

[0020] Preferably, the bending amplitude information in step S2 and step S4 includes the maximum warping height, the bending amplitude, and the position of the maximum warping height.

[0021] By adopting this solution, the inspection component acquires bend amplitude information, including maximum warp height, bend amplitude, and the location of maximum warp height. This data provides the central processing unit with comprehensive information on the circuit board's warpage status, enabling precise control of the pre-bending and drying processes. The maximum warp height reflects the severity of the overall warpage of the circuit board. The bend amplitude is quantitatively calculated (the ratio of maximum warp height to circuit board length) to determine whether the warpage is within the allowable range. The location of the maximum warp height helps analyze the warpage distribution and provides location information for adjusting the pre-bending process.

[0022] In step S2, these bending amplitude information are used to evaluate the pre-bending effect. The central processing unit determines whether the pre-bending has achieved the expected effect based on the maximum warping height and the bending amplitude, and analyzes the uniformity of the pre-bending through the position of the maximum warping height. If the test results do not meet the requirements, the central processing unit will dynamically adjust the pre-bending amount of the pre-straightening mechanism to ensure that the pre-bending effect meets the process standards. In step S4, the bending amplitude information is used to evaluate the drying effect. The central processing unit determines whether the warping is within the allowable range based on the maximum warping height and the bending amplitude after drying, and optimizes the strength and distribution of the pre-bending through the position of the maximum warping height. If the warping amplitude after drying exceeds the preset value, the central processing unit will adjust the pre-bending amount to ensure that the circuit copper plate enters the leveling mechanism with an appropriate bending amplitude.

[0023] Preferably, the bending amplitude of the copper plate after pre-bending in step S2 is 2% to 3%, the bending amplitude of the copper plate after drying in step S3 is 1.2% to 1.7%, and the preset value of the leveling mechanism in step S4 is 2%.

[0024] By adopting the above solution, the quality and efficiency of copper plate production are significantly optimized by precisely controlling the bending amplitude during the pre-bending, drying, and leveling processes. Specifically, in step S2, the bending amplitude of the copper plate after pre-bending is controlled at 2% to 3%, and the pre-bending process actively offsets the warping that may occur during the drying process; in step S3, the bending amplitude of the copper plate after drying is reduced to 1.2% to 1.7%, and the reverse deformation of the pre-bending effectively offsets the warping caused by drying; in step S4, the preset value of the leveling mechanism is 2%. If the bending amplitude after drying exceeds this value, the central processing unit will dynamically adjust the pre-bending amount of the pre-leveling mechanism to ensure that the copper plate enters the leveling mechanism with an appropriate bending amplitude.

[0025] By precisely controlling the pre-bending and drying processes, the bending amplitude of the copper plates is ensured to be within a reasonable range, improving process accuracy and product consistency. Secondly, the optimization of the pre-bending and drying processes ensures uniform stress distribution during the flattening process, reducing localized stress concentration and the risk of damage. Thirdly, the dynamic adjustment function of the central processing unit and the real-time feedback from the detection components form a closed-loop control loop that adapts to copper plates of different specifications and enhances the versatility and flexibility of the equipment. Fourthly, automated control and continuous production capabilities significantly improve production efficiency and reduce manual intervention and equipment adjustment time.

[0026] In summary, this application includes at least one of the following beneficial technical effects: 1. Through the coordination of the central processing unit and the real-time feedback of the detection components, intelligent control of the pre-bending, drying and leveling processes of the circuit copper plate is achieved. From the perspective of the operating process, the copper plate size information is first input, and then pre-bending, drying and subsequent detection and adjustment are carried out. The entire process reduces manual intervention and improves production efficiency. The bending amplitude in the pre-bending, drying and leveling processes is accurately controlled. For example, the bending amplitude of the copper plate is controlled at 2% - 3% after pre-bending, and reduced to 1.2% -1.7% after drying, which effectively offsets the warping caused by drying and reduces the difficulty of the leveling process. The bending amplitude information obtained by the detection component can provide the central processing unit with comprehensive warping status information to achieve precise control of the process. The dynamic adjustment function of the central processing unit and the real-time feedback of the detection component form a closed-loop control, which can adapt to copper plates of different specifications and enhance the flexibility of the production line. At the same time, it reduces the risk of damage to the copper plate during the leveling process, reduces the scrap rate, and improves the consistency and reliability of the product. 2. The rational layout of the auxiliary rollers, transport rollers, and deforming rollers in the pre-straightening mechanism forms a symmetrical support structure, which enhances the stability of the circuit copper plate transportation and ensures uniform transmission of the pre-bending force. The tilted design of the second conveyor belt of the transport component allows the circuit copper plate to gradually enter the pre-bending area during transportation, avoiding damage caused by sudden force and making the force more uniform. The mobile platform can accurately control the position of the deforming roller through screw transmission to improve the pre-bending accuracy. The detection component realizes real-time monitoring and closed-loop control of the warping state of the circuit copper plate through the coordinated work of the conveyor frame, mounting frame, sensor and central processing unit. It can adapt to circuit copper plates of different specifications and enhance the flexibility and adaptability of the equipment. In the leveling mechanism, the horizontal alignment of the leveling rollers and the supporting role of the rotating rollers ensure that the circuit copper plate is evenly stressed and remains stable during the leveling process, realizing automated control and improving production efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] Figure 1 This is a schematic diagram of the overall structure of Example 1 of the present application; Figure 2 This is a schematic diagram of the overall structure of the feeding mechanism in Example 1 of the present application; Figure 3 This is a schematic diagram of the overall structure of the pre-processing mechanism in Example 1 of the present application; Figure 4 This is a cross-sectional schematic diagram of the pre-adjustment mechanism in Example 1 of the present application; Figure 5 This is the first schematic diagram of the circuit copper plate transportation process in Example 1 of the present application; Figure 6 This is the second schematic diagram of the circuit copper plate transportation process in Example 1 of the present application; Figure 7 This is a schematic diagram of the overall structure of the mobile platform in Example 1 of the present application; Figure 8 This is the third schematic diagram of the circuit copper plate transportation process in Example 1 of the present application; Figure 9 Schematic diagram of the overall structure of the detection component in Example 1 of the present application; Figure 10 It is a schematic diagram of the overall structure of the leveling mechanism in Example 1 of the present application.

[0028] Explanation of the accompanying drawings: 1. Feeding mechanism; 11. Placing table; 12. Turning frame; 121. Long rod; 122. Barb; 13. Air nozzle; 14. Transport roller; 2. Pre-straightening mechanism; 21. Casing; 22. Transport assembly; 23. Moving platform; 231. First screw rod; 232. Light rod; 233. Moving plate; 234. Mounting block; 235. Second screw rod; 24. Transport roller; 25. Deformation roller; 26. Auxiliary roller; 27. First conveyor belt; 28. Second conveyor belt; 3. Drying mechanism; 4. Detection assembly; 41. Transport frame; 42. Mounting frame; 43. Sensor; 5. Leveling mechanism; 51. Box; 52. Rotating roller; 53. Leveling roller; 54. Fourth power source. DETAILED DESCRIPTION

[0029] The following is combined with Figure 1 -Attached Figure 10 The present application is further described in detail. The present application discloses a circuit copper plate shaping device.

[0030] Example 1, with reference to Figure 1 , a circuit copper plate shaping equipment, including a feeding mechanism 1, a pre-shaping mechanism 2, a drying mechanism 3, a leveling mechanism 5, and a detection component 4. The feeding mechanism 1 is responsible for transporting the stacked circuit copper plates to the entire production line in an intermittent manner, the pre-shaping mechanism 2 pre-bends the circuit copper plates, and the pre-bent circuit copper plates are dried by the drying mechanism 3. Due to the different CTE of the copper foil and the substrate, the expansion degree is different when heated, or the uneven thickness of the substrate or the copper foil will lead to inconsistent expansion when heated, resulting in stress and warping. However, the circuit copper plate is bent in advance, and the warping during the drying process is offset by pre-bending the circuit copper plate, thereby reducing stress concentration during shaping and reducing the risk of tearing of the circuit copper plate; the detection component 4 is respectively arranged between the pre-shaping mechanism 2 and the drying mechanism 3, and between the drying mechanism 3 and the leveling mechanism 5, to respectively obtain the bending amplitude information of the circuit copper plate before and after drying, thereby realizing the intelligence and automation of the process, reducing manual intervention, and improving production efficiency. The real-time monitoring and dynamic adjustment functions ensure the accuracy of the pre-bending and drying effects; the leveling mechanism 5 performs the final leveling treatment on the circuit copper plate.

[0031] refer to Figure 2The loading mechanism 1 includes a placement table 11 for placing the circuit copper plate, an air nozzle 13, a turning frame 12 and a transport roller 14. The circuit copper plate is placed upright and tilted on the placement table 11. The air nozzle 13 is installed on a telescopic rod driven by airflow. The movement of the air nozzle 13 is achieved by the telescopic rod. The turning frame 12 is composed of a straight long rod 121 and a barb 122. The turning frame 12 can be turned 90° under the action of the rotating shaft and the motor; the loading principle is as follows: first, the turning frame 12 is turned to a vertical state so that the barb 122 is located below the placement table 11, and the air nozzle 13 is driven by the telescopic rod to move to the lower end of the circuit copper plate, and the lower end of the circuit copper plate is adsorbed to the part of the long rod 121 of the turning frame 12. At this time, the turning frame 12 is turned 90° so that the circuit copper plate can be placed on the transport roller 14 and transported by the transport roller 14.

[0032] refer to Figure 2 、 Figure 3 and Figure 4 The pre-alignment mechanism 2 includes a housing 21, a transport assembly 22 mounted on the housing 21, two auxiliary rollers 26 rotatably connected to the housing 21, a mobile platform 23 mounted on the housing 21, three transport rollers 24 rotatably connected to the housing 21, and a deformable roller 25 rotatably connected to the mobile platform 23; wherein the transport assembly 22 includes a belt roller rotatably connected to the housing 21, a second conveyor belt 28 mounted on the belt roller, and a first power source that drives the belt roller and the transport roller 24 to rotate respectively. In Example 1, the first power source is an electric motor as an example, and the motor is connected to the belt roller and the transport roller 24 through a belt drive. The conveyor rollers 24 are connected; the three transport rollers 24 are parallel to each other and distributed in an upright triangle; the axes of the two auxiliary rollers 26 are at the same horizontal height, and the two auxiliary rollers 26 are in contact with the second conveyor belt 28. The second conveyor belt 28 is partially tilted horizontally by 10°-20° under the action of the auxiliary rollers 26; the two transport rollers 24 at the bottom and the two auxiliary rollers 26 are located in the same vertical plane in pairs; the deformable roller 25 is located between the two auxiliary rollers 26, and the first conveyor belt 27 is passed around the surface of the three transport rollers 24, and the deformable roller 25 can be in contact with the first conveyor belt 27.

[0033] refer to Figure 5 and Figure 6, the second conveyor belt 28 of the present application is horizontally tilted 15° under the action of the auxiliary roller 26, and the circuit copper plate is transported at 15° along the second conveyor belt 28 between the transport roller 24 and the auxiliary roller 26, and the transport roller 24 and the auxiliary roller 26 clamp the circuit copper plate. The first conveyor belt 27 and the second conveyor belt 28 transport the circuit copper plate by friction, and the circuit copper plate will flip at the end along the a-surface of the first conveyor belt 27, so that the circuit copper plate can be advanced into the bending interval at a suitable angle; in addition, the 15° tilt can also make the circuit copper plate remain relatively stable during transportation. When the circuit copper plate flips at the end under the action of the a-surface of the first conveyor belt 27, the other end will bend slightly in the direction under the action of gravity, which allows the circuit copper plate to abut against the transport roller 24 and the auxiliary roller 26 at point b, ensuring that the circuit copper plate has stable dynamic movement.

[0034] refer to Figure 7 and Figure 8 The movable platform 23 includes a first screw rod 231 rotatably connected to the housing 21, a first polished rod 232 fixedly connected to the housing 21, a movable plate 233 slidably connected to the first polished rod 232, a second power source for driving the first screw rod 231 to rotate, a second screw rod 235 rotatably connected to the movable plate 233, a third power source for driving the second screw rod 235 to rotate, and a mounting block 234 that moves relative to the movable plate 233. The deformable roller 25 is rotatably connected to the mounting block 234, and the third power source is installed on the movable plate 233. The second power source drives the first screw rod 231 to rotate to realize the horizontal movement of the movable plate 233, thereby realizing the regulation of the vertical distance between the deformation roller 25 and the auxiliary roller 26, so that the circuit copper plate can be bent into different shapes; the third power source drives the second screw rod 235 to rotate to realize the vertical movement of the mounting block 234, thereby realizing different bending amplitudes of the circuit copper plate; in this embodiment, the screw rod, movable plate 233, and mounting block 234 are each provided with two groups, which are respectively installed on both sides of the deformation roller 25, and the two groups are connected by a connecting shaft and a gear set, thereby realizing the drive of a single power source with corresponding functions.

[0035] refer to Figure 8 When the spacing between the deforming roller 25 and the auxiliary roller 26 varies, the circuit copper plate bends in different ways. During the bending process, the c-side of the first conveyor belt 27 prevents the circuit copper plate from further bending. When the deforming roller 25 bends the circuit copper plate, the curved portion rises in an arc shape, which abuts the c-side of the first conveyor belt 27, preventing the circuit copper plate from bending further. Furthermore, by controlling the bending time of the deforming roller 25, it is possible to bend a portion of the circuit copper plate.

[0036] refer to Figure 9The detection assembly 4 includes a conveyor frame 41, a mounting frame 42 fixedly connected to the conveyor frame 41, a plurality of sensors 43 mounted on the mounting frame 42, and a central processing unit. The circuit copper plate is transported to the bottom of the sensor 43 via the conveyor frame 41. The sensor 43 obtains the warping information of the circuit copper plate and transmits the warping information to the central processing unit for analysis and processing. The central processing unit controls the pre-alignment mechanism 2 so that the circuit copper plate enters the drying mechanism 3 with a suitable bend. The sensor 43 includes an image sensor 43 and an infrared sensor 43. The infrared sensor 43 is used to obtain the maximum warping height and the location of the maximum warping of the circuit copper plate. The infrared sensor 43 uses time as the horizontal axis and height as the vertical axis. In this way, a height curve of the circuit copper plate can be obtained in real time. Combined with the bending speed, the location of the maximum warping of the circuit copper plate can be roughly determined. The image sensor 43 takes a picture of the circuit copper plate to obtain the dimensional information of the circuit copper plate when it is warped, and compares the dimensional information when the circuit copper plate is not warped, and promptly calculates the bending amplitude.

[0037] refer to Figure 10 The leveling mechanism 5 includes a housing 51, a plurality of rotating rollers 52 rotatably connected to the housing 51, a plurality of leveling rollers 53 rotatably connected to the housing 51, and a fourth power source 54 for driving the leveling rollers 53. The leveling rollers 53 are located above the plurality of rotating rollers 52 and are mounted at the same height. The horizontal alignment of the leveling rollers 53 ensures uniform force on the circuit copper plate during the leveling process, improving leveling accuracy. The support provided by the rotating rollers 52 ensures that the circuit copper plate remains stable during the leveling process, preventing deviation or distortion. The drive of the fourth power source 54 enables automated control of the leveling rollers 53, improving production efficiency.

[0038] Example 2, a circuit copper plate shaping method, specifically comprising the following steps: S1. Input the size information of the copper plate into the operation interface of the central processing unit; S2, the feeding mechanism 1 transports the copper plate to the entire production line, the copper plate is pre-bent by the pre-bending mechanism 2, and the bending amplitude information of the copper plate is obtained by the detection component 4; S3, drying the pre-bent copper plate through a drying assembly, and restoring the bent copper plate to the opposite direction of the bending; S4. The dried copper plate obtains the bending amplitude information of the copper plate through the detection component 4. If the bending of the copper plate exceeds the preset value for entering the leveling mechanism 5 at this time, the central processing unit adjusts the pre-bending value of the copper plate by the pre-leveling mechanism 2 so that the dried copper plate can enter the leveling mechanism 5 with a suitable bending amplitude.

[0039] The bending amplitude information in steps S2 and S4 includes the maximum warping height, the bending amplitude, and the location of the maximum warping height. After pre-bending in step S2, the bending amplitude of the copper plate is between 2% and 3%. After drying in step S3, the bending amplitude of the copper plate is between 1.2% and 1.7%. The preset value of the leveling mechanism 5 in step S4 is 2%.

[0040] Example 3, taking a circuit copper plate with a length and width of 300 mm and a thickness of 1.5 mm as an example, the maximum warping height of circuit copper plates of different batches of this specification can reach 6-15 mm after direct drying, and the bending amplitude is equal to the maximum warping height divided by the length of the circuit copper plate. At this time, the bending amplitude of the circuit copper plate is 2%-5%; the maximum warping height of the circuit copper plate is bent to 6-9 mm through the pre-adjustment mechanism 2, and the bending amplitude is controlled between 2%-3%. At this time, it is dried through the drying mechanism 3, and the maximum warping height after drying can reach 4-5 mm, and the bending amplitude is 1.33%-1.67%.

[0041] Example 4: Taking a circuit copper plate with a length and width of 300 mm and a thickness of 1 mm as an example, the maximum warping height of circuit copper plates of different batches of this specification can reach 18-36 mm after direct drying, and the bending amplitude of the circuit copper plate at this time is 3%-6%; the maximum warping height of the circuit copper plate is bent to 14-20 mm through the pre-adjustment mechanism 2, and the bending amplitude is controlled between 2.33%-3.33%. At this time, it is dried through the drying mechanism 3, and the maximum warping height after drying can reach 9-10 mm, and the bending amplitude is 1.5%-1.67%.

[0042] The above are all preferred embodiments of the present application, and are not intended to limit the scope of protection of the present application. Therefore, any equivalent changes made based on the structure, shape, and principle of the present application should be included in the scope of protection of the present application.

Claims

1. A circuit copper plate shaping device, characterized in that: The invention comprises a feeding mechanism (1), a pre-adjusting mechanism (2), a drying mechanism (3), a leveling mechanism (5), and a detection component (4). The detection component (4) is respectively arranged between the pre-adjusting mechanism (2) and the drying mechanism (3), and between the drying mechanism (3) and the leveling mechanism (5). The pre-adjusting mechanism (2) first bends the circuit copper plate, the detection component (4) measures the bending data of the circuit copper plate, the bent circuit copper plate enters the drying mechanism (3) for drying, the detection component (4) measures the bending data of the circuit copper plate again, and adjusts the bending condition of the circuit copper plate by the pre-adjusting mechanism (2), and finally allows the circuit copper plate to enter the leveling mechanism (5) with a suitable bending arc for leveling.

2. The circuit copper plate shaping equipment according to claim 1, characterized in that: The pre-alignment mechanism (2) comprises a housing (21), a transport assembly (22) mounted on the housing (21), a plurality of auxiliary rollers (26) mounted on the housing (21), a mobile platform (23) mounted on the housing (21), a plurality of transport rollers (24) mounted on the housing (21), and a deformable roller (25) mounted on the mobile platform (23); the auxiliary rollers (26) and the transport rollers (24) are located on both sides of the deformable roller (25); the transport roller (24) is located above the transport assembly (22); a first conveyor belt (27) passes around the surface of the transport roller (24); at least two deformable rollers (25) change the transport track of the transport assembly (22); and the deformable roller (25) can abut against the first conveyor belt (27).

3. The circuit copper plate shaping equipment according to claim 2, characterized in that: At least two groups of the auxiliary rollers (26) and the transport rollers (24) are located in the same vertical plane, the auxiliary rollers (26) are located at the same horizontal height, and at least two transport rollers (24) are located at the same horizontal height.

4. The circuit copper plate shaping equipment according to claim 3, characterized in that: The transport assembly (22) comprises a belt roller rotatably connected to the housing (21), a second conveyor belt (28) mounted on the belt roller, and a first power source for driving the belt roller and the transport roller (24) to rotate respectively, the auxiliary roller (26) abutting against the second conveyor belt (28), and the second conveyor belt (28) is partially tilted horizontally by 10°-20° under the action of the auxiliary roller (26).

5. The circuit copper plate shaping equipment according to claim 4, characterized in that: The mobile platform (23) comprises a first screw rod (231) rotatably connected to the housing (21), a first light rod (232) fixedly connected to the housing (21), a mobile plate (233) slidably connected to the first light rod (232), a second power source driving the first screw rod (231) to rotate, a second screw rod (235) rotatably connected to the mobile plate (233), a third power source driving the second screw rod (235) to rotate, and a mounting block (234) moving relative to the mobile plate (233), the deformation roller (25) being rotatably connected to the mounting block (234), and the third power source being mounted on the mobile plate (233).

6. The circuit copper plate shaping device according to claim 5, characterized in that: The detection assembly (4) comprises a conveying frame (41), a mounting frame (42) fixedly connected to the conveying frame (41), a plurality of sensors (43) mounted on the mounting frame (42), and a central processing unit. The circuit copper plate is transported to the bottom of the sensor (43) via the conveying frame (41). The sensor (43) obtains warping information of the circuit copper plate and transmits the warping information to the central processing unit for analysis and processing. The central processing unit controls the pre-alignment mechanism (2) so that the circuit copper plate enters the drying mechanism (3) with a suitable bend.

7. The circuit copper plate shaping device according to claim 6, characterized in that: The leveling mechanism (5) comprises a box body (51), a plurality of rotating rollers (52) rotatably connected to the box body (51), a plurality of leveling rollers (53) rotatably connected to the box body (51), and a fourth power source (54) for driving the leveling rollers (53) to rotate, wherein the leveling rollers (53) are located above the plurality of rotating rollers (52), and the plurality of leveling rollers (53) are installed at the same horizontal height.

8. A circuit copper plate shaping method, characterized in that: The circuit copper plate shaping device according to claim 7 specifically comprises the following steps: S1. Input the size information of the copper plate into the operation interface of the central processing unit; S2, the feeding mechanism (1) transports the copper plate to the entire production line, the pre-bends the copper plate through the pre-bend mechanism (2), and the bending amplitude information of the copper plate is obtained through the detection component (4); S3, drying the pre-bent copper plate through a drying assembly, and restoring the bent copper plate to the opposite direction of the bending; S4. The dried copper plate passes through the detection component (4) to obtain the bending amplitude information of the copper plate. If the bending of the copper plate exceeds the preset value for entering the leveling mechanism (5), the central processing unit adjusts the pre-bending value of the copper plate by the pre-leveling mechanism (2), so that the copper plate after drying can enter the leveling mechanism (5) with a suitable bending amplitude.

9. The circuit copper plate shaping method according to claim 8, characterized in that: The bending amplitude information in step S2 and step S4 includes the maximum warping height, the bending amplitude, and the position of the maximum warping height.

10. The circuit copper plate shaping method according to claim 9, characterized in that: After the pre-bending in step S2, the bending amplitude of the copper plate is between 2% and 3%. After the drying in step S3, the bending amplitude of the copper plate is between 1.2% and 1.7%. In step S4, the preset value of the leveling mechanism (5) is 2%.

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