A circuit copper plate shaping device and method

Abstract

The present application discloses a circuit copper plate shaping device and method, including a feeding mechanism, a pre-shaping mechanism, a drying mechanism, a leveling mechanism, and a detection component. The reasonable layout of the auxiliary roller, the transport roller, and the deformation roller in the pre-shaping mechanism of the present application forms a symmetric support structure, enhancing the stability of the circuit copper plate transportation and ensuring uniform transmission of the pre-bending force. The inclined design of the second conveyor belt of the transport component enables the circuit copper plate to gradually enter the pre-bending area during transportation, avoiding damage caused by sudden force application and making the force more uniform. The moving platform can precisely control the position of the deformation roller through screw drive, improving the pre-bending accuracy. The detection component realizes real-time monitoring and closed-loop control of the warping state of the circuit copper plate through the coordinated work of the conveyor frame, the mounting frame, the sensor, and the central processor, can adapt to circuit copper plates of different specifications, and enhances the flexibility and adaptability of the device.

Description

Technical Field

[0001] This application relates to the technical field of circuit copper plate printing, and in particular to a circuit copper plate shaping device and method. Background Art

[0002] Circuit copper plates are prone to warping under the action of high-temperature drying. Due to the large error in the expansion coefficient of the same material substrate, the degree of warping will also be different between different batches. The existing treatment method is to set a circuit copper plate shaping device at the rear of the drying process flow to flatten the warped circuit copper plate. However, when the warping amplitude is too large, the circuit copper plate shaping device will cause the circuit copper plate to tear. Summary of the Invention

[0003] The purpose of this application is to provide a circuit copper plate shaping device and method to solve the problem of circuit copper plate warping.

[0004] In a first aspect, this application provides a circuit copper plate shaping device, adopting the following technical solution: It includes a feeding mechanism, a pre-shaping mechanism, a drying mechanism, a flattening mechanism, and a detection component. The detection component is respectively arranged between the pre-shaping mechanism and the drying mechanism, and between the drying mechanism and the flattening mechanism. The pre-shaping mechanism first bends the circuit copper plate, the detection component measures the bending data of the circuit copper plate, the bent circuit copper plate enters the drying mechanism for drying, the detection component measures the bending data of the circuit copper plate again, and adjusts the pre-shaping mechanism for the bending situation of the circuit copper plate, and finally makes the circuit copper plate enter the flattening mechanism for flattening treatment with a suitable bending radian.

[0005] Through the above solution, the closed-loop control of the pre-bending process and the detection component is realized, significantly optimizing the performance of the circuit copper plate during drying and flattening. Compared with the prior art, it has many advantages. The prior art usually directly uses a shaping device to flatten the circuit copper plate after drying, which is prone to tearing the circuit copper plate due to too large warping amplitude, and lacks the ability of active control and real-time adjustment of warping. By pre-bending the circuit copper plate through the pre-shaping mechanism before drying, the warping during the drying process is actively offset, and combined with the detection component to monitor the bending data of the circuit copper plate in real time, dynamically adjusting the pre-bending amount and flattening pressure to form a closed-loop control. This design not only reduces the risk of circuit copper plate tearing, but also improves the consistency and reliability of the product. In addition, this solution adapts to circuit copper plates of different materials, thicknesses and sizes through automatic control and intelligent adjustment, improves production efficiency and process adaptability, reduces material waste and energy consumption at the same time, and reduces production costs. The introduction of the detection component also realizes the traceability of the process, providing data support for further optimizing process parameters.

[0006] Preferably, the pre-forming mechanism includes a casing, a conveying assembly installed in the casing, a plurality of auxiliary rollers installed in the casing, a moving platform installed in the casing, a plurality of conveying rollers installed on the moving platform, and a deforming roller installed on the moving platform. The auxiliary rollers and the conveying rollers are located on both sides of the deforming roller, the conveying rollers are located above the conveying assembly, a first conveyor belt is wound around the surface of the conveying rollers, at least two deforming rollers change the conveying trajectory of the conveying assembly, and the deforming roller can be in contact with the first conveyor belt.

[0007] Through the above solution, the casing provides an overall support and installation foundation to ensure the stable operation of each component. The conveying assembly is responsible for the conveyance of circuit copper plates / copper plates to ensure that the circuit copper plates smoothly enter the pre-forming mechanism; the cooperation among the auxiliary rollers, the conveying rollers, and the deforming roller can bend the circuit copper plates / copper plates; the moving platform can change the position of the deforming roller, and the deforming roller and the auxiliary rollers can bend the circuit copper plates / copper plates into different response shapes; the cooperation of the conveying assembly, the deforming roller, the conveying rollers, and the first conveyor belt realizes the continuous conveyance and pre-bending treatment of the circuit copper plates, reduces manual intervention, and improves production efficiency. The layout design of the auxiliary rollers, the conveying rollers, and the deforming roller is compact, which not only ensures functionality but also reduces the floor area of the equipment.

[0008] Preferably, at least two sets of the auxiliary rollers and the conveying rollers are located in the same vertical plane, the auxiliary rollers are at the same horizontal height, and at least two conveying rollers are at the same horizontal height.

[0009] Through the above solution, the auxiliary rollers are at the same horizontal height and in the same vertical plane as the conveying rollers, forming a symmetrical support structure, further enhancing the stability of the conveyance of the circuit copper plates; the deforming roller, in cooperation with the auxiliary rollers, the conveying rollers, and the first conveyor belt, applies a pre-bending force to the circuit copper plates. The symmetrical layout of the auxiliary rollers ensures that the pre-bending force is evenly transmitted in the entire width direction of the circuit copper plates; the layout and position design of the auxiliary rollers ensure that the circuit copper plates move along a predetermined trajectory during conveyance and pre-bending, avoiding deviation or distortion; during the pre-bending process, the force applied by the deforming roller to the circuit copper plates may cause the circuit copper plates to be distorted or deviated, and the supporting effect of the auxiliary rollers can effectively offset the influence of these external forces; the supporting effect of the auxiliary rollers ensures that the circuit copper plates are evenly stressed during the pre-bending process, reducing damage caused by excessive local stress.

[0010] Preferably, the conveying assembly includes a belt roller rotatably connected to the casing, a second conveyor belt installed on the belt roller, and a first power source that respectively drives the belt roller and the conveying rollers to rotate. The auxiliary rollers are in contact with the second conveyor belt, and a part of the second conveyor belt is horizontally inclined by 10° - 20° under the action of the auxiliary rollers.

[0011] Through the above solution, the inclined design of the second conveyor belt enables the circuit copper plate to gradually enter the pre-bending area during transportation, avoiding deformation or damage caused by sudden force. The inclined angle makes the force on the circuit copper plate more uniform during the pre-bending process, avoiding local stress concentration; the auxiliary roller abuts against the second conveyor belt to ensure its stability during the inclination, further improving the transportation stability and the precision of pre-bending. The inclined angle design makes the force on the circuit copper plate more uniform during the pre-bending process, avoiding local stress concentration and improving the precision and consistency of pre-bending.

[0012] Preferably, the moving platform includes a first lead screw rotatably connected to the machine housing, a first optical rod fixedly connected to the machine housing, a moving plate slidably connected to the first optical rod, a second power source for driving the rotation of the first lead screw, a second lead screw rotatably connected to the moving plate, a third power source for driving the rotation of the second lead screw, and a mounting block that moves relative to the moving plate. The deformation roller is rotatably connected to the mounting block, and the third power source is mounted on the moving plate.

[0013] Through the above solution, through the cooperation of the first lead screw and the first optical rod, the moving platform can accurately move in the horizontal direction, changing the distance between the deformation roller and the auxiliary roller in the vertical direction, so that the circuit copper plate / copper plate can be bent with different amplitudes; through the cooperation of the second lead screw and the mounting block, the deformation roller can accurately move in the vertical direction to adjust the amplitude and strength of pre-bending; the lead screw drive has the characteristics of high precision and high rigidity, and can achieve precise control of the position of the deformation roller, improving the precision of pre-bending.

[0014] Preferably, the detection component includes a conveyor frame, a mounting frame fixedly connected to the conveyor frame, a plurality of sensors mounted on the mounting frame, and a central processor. The circuit copper plate is transported through the conveyor frame to the lower part of the sensors. The sensors acquire the warping information of the circuit copper plate and transmit the warping information to the central processor for analysis and processing. The central processor controls the pre-flattening mechanism so that the circuit copper plate enters the drying mechanism with a suitable bend.

[0015] Through the above scheme, the detection component realizes real-time monitoring and closed-loop control of the warping state of the circuit copper plate through the coordinated work of the conveyor rack, the mounting rack, the sensor and the central processor, and significantly optimizes the pre-bending and drying process. The core functions of the detection component include: the conveyor rack is used to smoothly transport the circuit copper plate, the mounting rack fixes the sensor to accurately measure the warping information of the circuit copper plate (such as height, bending angle, etc.), and the sensor transmits the collected data to the central processor for analysis and processing. The central processor dynamically adjusts the parameters of the pre-adjustment mechanism according to the feedback data of the sensor to ensure that the circuit copper plate enters the drying mechanism in a suitable bending state; the detection component realizes closed-loop control of the pre-bending process through real-time monitoring and feedback control, ensuring that the bending state of the circuit copper plate always meets the requirements, and improving the accuracy and consistency of pre-bending. Secondly, the precise measurement of the sensor and the dynamic adjustment function of the central processor make the circuit copper plate evenly stressed during the pre-bending process, avoiding damage caused by local stress concentration, while preventing excessive bending and reducing the risk of tearing the circuit copper plate. In addition, the universal design and dynamic adjustment capability of the detection component enable it to adapt to circuit copper plates of different specifications, enhancing the flexibility and adaptability of the equipment; in terms of production efficiency, the automated control of the detection component reduces manual intervention, achieves continuous production, and significantly improves production efficiency. At the same time, through real-time monitoring and feedback control, the equipment can quickly adjust the pre-bending parameters, reducing equipment adjustment time and further improving production efficiency. In terms of product quality, the detection component ensures that the bending state of the circuit copper plate is consistent, reduces defects caused by human operation or process fluctuations, and improves product consistency and reliability.

[0016] Preferably, the leveling mechanism includes a box body, a plurality of rotating rollers rotatably connected to the box body, a plurality of leveling rollers rotatably connected to the box body, and a fourth power source for driving the leveling rollers to rotate, the leveling rollers are located above the plurality of rotating rollers, and the plurality of leveling rollers are installed at the same horizontal height.

[0017] Through the above scheme, the horizontal alignment of the leveling roller ensures that the circuit copper plate is evenly stressed during the leveling process, thereby improving the leveling accuracy; the supporting function of the rotating roller ensures that the circuit copper plate remains stable during the leveling process, avoiding deviation or distortion; the drive of the fourth power source realizes the automatic control of the leveling roller, thereby improving production efficiency.

[0018] In a second aspect, the present application provides a circuit copper plate shaping method, which adopts the following technical solution: comprising the above-mentioned circuit copper plate shaping device, specifically comprising the following steps:

[0019] S1. Input the size information of the copper plate into the operation interface of the central processing unit;

[0020] S2. The feeding mechanism transports the copper plate into the entire production line. The pre-forming mechanism pre-bends the copper plate, and the detection component obtains the bending amplitude information of the copper plate bending.

[0021] S3. The pre-bent copper plate is dried by the drying component, and the bent copper plate restores its deformation towards the opposite direction of the bend.

[0022] S4. The dried copper plate obtains the bending amplitude information of the copper plate bending through the detection component. If the bending of the copper plate at this time exceeds the preset value for entering the flattening mechanism, the central processing unit adjusts the numerical value of the pre-bending of the copper plate by the pre-forming mechanism, so that the copper plate after drying can enter the flattening mechanism with a suitable bending amplitude.

[0023] By adopting the above scheme, through the coordination of the central processing unit and the real-time feedback of the detection component, the intelligent control of the pre-bending, drying and flattening processes of the circuit copper plate is realized, and the production efficiency and product quality are significantly optimized. The specific process includes four steps: First, input the size information of the copper plate through the operation interface of the central processing unit to provide basic data for subsequent processes; Second, the feeding mechanism transports the copper plate to the production line, the pre-forming mechanism pre-bends the copper plate, and the detection component obtains the bending amplitude information in real time; Then, the pre-bent copper plate enters the drying component, and during the drying process, the copper plate restores its deformation towards the opposite direction of the pre-bending, effectively offsetting the warping generated by drying; Finally, the dried copper plate obtains the bending amplitude information through the detection component. If it exceeds the preset value, the central processing unit dynamically adjusts the pre-bending amount of the pre-forming mechanism to ensure that the copper plate enters the flattening mechanism with a suitable bending amplitude.

[0024] First, through data input and closed-loop control, the intelligentization and automation of the process are realized, reducing manual intervention and improving production efficiency. Second, the real-time monitoring and dynamic adjustment functions ensure the accuracy of the pre-bending and drying effects, improving the consistency and reliability of the products. Third, the pre-bending process effectively offsets the warping generated during the drying process, reduces the warping amplitude after drying, and reduces the difficulty of the flattening process. Fourth, the real-time detection and feedback control functions reduce the risk of damage to the copper plate during the flattening process and reduce the scrap rate. Fifth, the dynamic parameter adjustment and general design enable the equipment to adapt to copper plates of different specifications, enhancing the flexibility of the production line.

[0025] Preferably, the bending amplitude information in step S2 and step S4 includes the maximum warping height, the bending amplitude, and the position of the maximum warping height.

[0026] By adopting the above solution, the bending amplitude information obtained by the detection component includes the maximum warping height, the bending amplitude, and the position of the maximum warping height. These data provide the central processing unit with comprehensive information on the warping state of the circuit copper plate, thus enabling precise control of the pre-bending and drying processes. The maximum warping height reflects the severity of the overall warping of the circuit copper plate. The bending amplitude determines whether the warping degree is within the allowable range through quantitative calculation (the ratio of the maximum warping height to the length of the circuit copper plate), while the position of the maximum warping height helps analyze the distribution of warping and provides position information for adjusting the pre-bending process.

[0027] In step S2, this bending amplitude information is used to evaluate the pre-bending effect. The central processing unit determines whether the pre-bending achieves the expected effect based on the maximum warping height and the bending amplitude, and at the same time analyzes the uniformity of the pre-bending through the position of the maximum warping height. If the detection result does not meet the requirements, the central processing unit will dynamically adjust the pre-bending amount of the pre-adjusting mechanism to ensure that the pre-bending effect meets the process standard. In step S4, the bending amplitude information is used to evaluate the drying effect. The central processing unit determines whether the warping is within the allowable range based on the maximum warping height and the bending amplitude after drying, and at the same time optimizes the force and distribution of the pre-bending through the position of the maximum warping height. If the warping amplitude after drying exceeds the preset value, the central processing unit will adjust the pre-bending amount to ensure that the circuit copper plate enters the flattening mechanism with an appropriate bending amplitude.

[0028] Preferably, the bending amplitude of the copper plate after pre-bending in step S2 is between 2% and 3%, the bending amplitude of the copper plate after drying in step S3 is between 1.2% and 1.7%, and the preset value of the flattening mechanism in step S4 is 2%.

[0029] By adopting the above solution, by precisely controlling the bending amplitude in the pre-bending, drying, and flattening processes, the quality and efficiency of copper plate production are significantly optimized. Specifically, in step S2, the bending amplitude of the copper plate after pre-bending is controlled between 2% and 3% to actively offset the possible warping during the drying process through the pre-bending process. In step S3, the bending amplitude of the copper plate after drying is reduced to between 1.2% and 1.7% to effectively offset the warping generated by drying through the reverse deformation of the pre-bending. In step S4, the preset value of the flattening mechanism is 2%. If the bending amplitude after drying exceeds this value, the central processing unit will dynamically adjust the pre-bending amount of the pre-adjusting mechanism to ensure that the copper plate enters the flattening mechanism with an appropriate bending amplitude.

[0030] By precisely controlling the pre-bending and drying processes, the bending amplitude of the copper plate is ensured to be within a reasonable range, improving the process accuracy and product consistency. Secondly, the optimization of the pre-bending and drying processes enables the copper plate to be uniformly stressed during the leveling process, reducing the risk of local stress concentration and damage. Thirdly, the dynamic adjustment function of the central processing unit and the real-time feedback of the detection component form a closed-loop control, adapting to copper plates of different specifications and enhancing the versatility and flexibility of the equipment. Fourthly, the automated control and continuous production capacity significantly improve the production efficiency, reducing manual intervention and equipment adjustment time.

[0031] In summary, the present application includes at least one of the following beneficial technical effects:

[0032] 1. Through the coordination of the central processing unit and the real-time feedback of the detection component, intelligent control of the pre-bending, drying, and leveling processes of the circuit copper plate is achieved. From the operation process, the copper plate size information is first input, and then pre-bending, drying, and subsequent detection and adjustment are carried out. The whole process reduces manual intervention and improves production efficiency. The bending amplitude in the pre-bending, drying, and leveling processes is precisely controlled. For example, the bending amplitude of the copper plate after pre-bending is controlled at 2% - 3%, and is reduced to 1.2% - 1.7% after drying, effectively offsetting the warping caused by drying and reducing the difficulty of the leveling process. The bending amplitude information obtained by the detection component can provide comprehensive warping state information for the central processing unit to achieve precise control of the process. The dynamic adjustment function of the central processing unit and the real-time feedback of the detection component form a closed-loop control, adapting to copper plates of different specifications, enhancing the flexibility of the production line, reducing the risk of damage to the copper plate during the leveling process, reducing the scrap rate, and improving the consistency and reliability of the product;

[0033] 2. The reasonable layout of the auxiliary roller, transport roller, and deformation roller in the pre-leveling mechanism forms a symmetric support structure, enhancing the stability of the circuit copper plate transportation and ensuring uniform transmission of the pre-bending force. The inclined design of the second conveyor belt of the transport component enables the circuit copper plate to gradually enter the pre-bending area during transportation, avoiding damage caused by sudden stress and making the force more uniform. The mobile platform can precisely control the position of the deformation roller through screw drive, improving the pre-bending accuracy. The detection component realizes real-time monitoring and closed-loop control of the warping state of the circuit copper plate through the collaborative work of the conveyor frame, mounting frame, sensor, and central processing unit, and can adapt to circuit copper plates of different specifications, enhancing the flexibility and adaptability of the equipment. In the leveling mechanism, the horizontal alignment of the leveling rollers and the supporting role of the rotating rollers ensure that the circuit copper plate is uniformly stressed and stable during the leveling process, achieving automated control and improving production efficiency. Description of the Drawings

[0034] Figure 1 is the overall structural schematic diagram of Embodiment 1 of the present application;

[0035] Figure 2 It is a schematic diagram of the overall structure of the loading mechanism in Embodiment 1 of the present application;

[0036] Figure 3 It is a schematic diagram of the overall structure of the pre-shaping mechanism in Embodiment 1 of the present application;

[0037] Figure 4 It is a schematic cross-sectional view of the pre-shaping mechanism in Embodiment 1 of the present application;

[0038] Figure 5 It is the first schematic diagram of the circuit copper plate transportation process in Embodiment 1 of the present application;

[0039] Figure 6 It is the second schematic diagram of the circuit copper plate transportation process in Embodiment 1 of the present application;

[0040] Figure 7 It is a schematic diagram of the overall structure of the mobile platform in Embodiment 1 of the present application;

[0041] Figure 8 It is the third schematic diagram of the circuit copper plate transportation process in Embodiment 1 of the present application;

[0042] Figure 9 It is a schematic diagram of the overall structure of the detection component in Embodiment 1 of the present application;

[0043] Figure 10 It is a schematic diagram of the overall structure of the flattening mechanism in Embodiment 1 of the present application.

[0044] Explanation of reference numerals: 1. Loading mechanism; 11. Placing table; 12. Flipping frame; 121. Long rod; 122. Barbs; 13. Air nozzle; 14. Transport rollers; 2. Pre-shaping mechanism; 21. Machine shell; 22. Transport component; 23. Mobile platform; 231. First lead screw; 232. First optical rod; 233. Moving plate; 234. Mounting block; 235. Second lead screw; 24. Transport rollers; 25. Deformation rollers; 26. Auxiliary rollers; 27. First conveyor belt; 28. Second conveyor belt; 3. Drying mechanism; 4. Detection component; 41. Conveyor frame; 42. Mounting frame; 43. Sensor; 5. Flattening mechanism; 51. Box body; 52. Rotating rollers; 53. Flattening rollers; 54. Fourth power source. Detailed implementation manners

[0045] The following is a further detailed description of the present application with reference to the attached Figure 1 - attached Figure 10 This application is further described in detail. Embodiment 1 of the present application discloses a circuit copper plate shaping device.

[0046] Embodiment 1, referring to Figure 1, A circuit copper plate shaping device, including a feeding mechanism 1, a pre-shaping mechanism 2, a drying mechanism 3, a leveling mechanism 5, and a detection component 4. The feeding mechanism 1 is responsible for transporting the stacked circuit copper plates in a spaced arrangement to the entire production line. The pre-shaping mechanism 2 pre-bends the circuit copper plates. The pre-bent circuit copper plates are dried by the drying mechanism 3. Since the CTE of the copper foil and the substrate is different, their expansion degrees are different when heated, or the uneven thickness of the substrate or copper foil will cause inconsistent expansion when heated, resulting in stress and warping. However, by pre-bending the circuit copper plates in advance, the warping during the drying process can be offset through the pre-bent circuit copper plates, thereby reducing the stress concentration during shaping and lowering the risk of tearing of the circuit copper plates. The detection component 4 is respectively arranged between the pre-shaping mechanism 2 and the drying mechanism 3, and between the drying mechanism 3 and the leveling mechanism 5, to respectively obtain the bending amplitude information of the circuit copper plates before and after drying, realizing the intelligentization and automation of the process, reducing manual intervention, and improving production efficiency. The realization of real-time monitoring and dynamic adjustment functions ensures the accuracy of the pre-bending and drying effects; the leveling mechanism 5 performs the final leveling treatment on the circuit copper plates.

[0047] Reference Figure 2 , The feeding mechanism 1 includes a placement table 11 for placing the circuit copper plates, a nozzle 13, a flipping frame 12, and transport rollers 14. The circuit copper plates are placed obliquely and upright on the placement table 11. The nozzle 13 is installed on a telescopic rod driven by air flow, and the movement of the nozzle 13 is realized through the telescopic rod. The flipping frame 12 consists of a straight long rod 121 and a barb 122, and the flipping frame 12 can be flipped by 90° under the action of a rotating shaft and a motor; the feeding principle is as follows: First, the flipping frame 12 is flipped to the vertical state, so that the barb 122 is located below the placement table 11. The nozzle 13 is driven by the telescopic rod to move to the lower end of the circuit copper plate and adsorb the lower end of the circuit copper plate to abut against the long rod 121 part of the flipping frame 12. At this time, the flipping frame 12 is flipped by 90°, so that the circuit copper plate can be placed on the transport rollers 14 and transported through the transport rollers 14.

[0048] Reference Figure 2 , Figure 3 and Figure 4, the pre-forming mechanism 2 includes a housing 21, a conveying assembly 22 installed in the housing 21, two auxiliary rollers 26 rotatably connected to the housing 21, a moving platform 23 installed in the housing 21, three conveying rollers 24 rotatably connected to the moving platform 23, and a deformation roller 25 rotatably connected to the moving platform 23; wherein, the conveying assembly 22 includes a belt roller rotatably connected to the housing 21, a second conveyor belt 28 installed on the belt roller, and a first power source for respectively driving the belt roller and the conveying roller 24 to rotate. In Embodiment 1, the first power source is taken as an example of an electric motor, and the electric motor is connected to the belt roller and the conveying roller 24 through a belt drive; the three conveying rollers 24 are parallel to each other and are distributed in a regular triangular shape, the axes of the two auxiliary rollers 26 are at the same horizontal height, and the two auxiliary rollers 26 are in contact with the second conveyor belt 28, and a part of the second conveyor belt 28 is horizontally inclined by 10°-20° under the action of the auxiliary rollers 26. The two conveying rollers 24 at the bottom and the two auxiliary rollers 26 are located in the same vertical plane in pairs; the deformation roller 25 is located between the two auxiliary rollers 26, and a first conveyor belt 27 passes around the surfaces of the three conveying rollers 24, and the deformation roller 25 can be in contact with the first conveyor belt 27.

[0049] Reference Figure 5 and Figure 6 , in the present application, a part of the second conveyor belt 28 is horizontally inclined by 15° under the action of the auxiliary rollers 26. The circuit copper plate is transported at an angle of 15° along the second conveyor belt 28 between the conveying roller 24 and the auxiliary roller 26. The conveying roller 24 and the auxiliary roller 26 sandwich the circuit copper plate. The first conveyor belt 27 and the second conveyor belt 28 transport the circuit copper plate through friction. The end of the circuit copper plate will be turned over at the a surface of the first conveyor belt 27, so that the circuit copper plate can enter the bending section at an appropriate angle; in addition, the inclination of 15° can also make the circuit copper plate keep relatively stable during transportation. When the end of the circuit copper plate is turned over under the action of the a surface of the first conveyor belt 27, the other end will be slightly bent in the direction under the action of gravity, which enables the circuit copper plate to be in contact with the b point of the conveying roller 24 and the auxiliary roller 26, ensuring that the circuit copper plate has stable power to move.

[0050] Reference Figure 7 and Figure 8, the mobile platform 23 includes a first lead screw 231 rotatably connected to the housing 21, a first optical rod 232 fixedly connected to the housing 21, a moving plate 233 slidably connected to the first optical rod 232, a second power source for driving the rotation of the first lead screw 231, a second lead screw 235 rotatably connected to the moving plate 233, a third power source for driving the rotation of the second lead screw 235, and a mounting block 234 that moves relative to the moving plate 233. The deformation roller 25 is rotatably connected to the mounting block 234, and the third power source is mounted on the moving plate 233. The second power source drives the first lead screw 231 to rotate to achieve the horizontal movement of the moving plate 233, thereby realizing the adjustment of the vertical distance between the deformation roller 25 and the auxiliary roller 26, so that the circuit copper plate can be bent into different shapes; the third power source drives the second lead screw 235 to rotate to achieve the vertical movement of the mounting block 234, and further realizes the bending of the circuit copper plate with different bending amplitudes. In this embodiment, there are two sets of lead screws, moving plates 233, and mounting blocks 234, which are respectively installed on both sides of the deformation roller 25. The two sets are connected by a connecting shaft and a gear set, so as to realize the drive of a single power source for corresponding functions.

[0051] Reference Figure 8 , when the distance between the deformation roller 25 and the auxiliary roller 26 is different, the bending pattern of the circuit copper plate is different. During the bending process, the c surface of the first conveyor belt 27 can prevent the further bending of the circuit copper plate. When the deformation roller 25 bends the circuit copper plate, a part of the bent part warps up, and this part can abut against the c surface of the first conveyor belt 27, so that the circuit copper plate cannot be further bent. Moreover, by controlling the bending time of the deformation roller 25, local bending of the circuit copper plate can also be achieved.

[0052] Reference Figure 9 , the detection component 4 includes a conveyor frame 41, a mounting frame 42 fixedly connected to the conveyor frame 41, a plurality of sensors 43 mounted on the mounting frame 42, and a central processor. The circuit copper plate is transported through the conveyor frame 41 to the lower part of the sensors 43. The sensors 43 acquire the warping information of the circuit copper plate and transmit the warping information to the central processor for analysis and processing. The central processor controls the pre-aligning mechanism 2 so that the circuit copper plate enters the drying mechanism 3 with a suitable bend. The sensors 43 include an image sensor 43 and an infrared sensor 43. The infrared sensor 43 is used to acquire the maximum warping height of the circuit copper plate and the position of the maximum warping point. The infrared sensor 43 takes time as the horizontal axis and height as the vertical axis, so that the height curve graph of the circuit copper plate can be acquired in real time. Combining with the bending speed, the position of the maximum warping point of the circuit copper plate can be roughly obtained; the image sensor 43 takes pictures of the circuit copper plate to acquire the size information of the circuit copper plate during warping, compares it with the size information when the circuit copper plate is not warped, and timely obtains the bending amplitude.

[0053] Reference Figure 10, the leveling mechanism 5 includes a box body 51, a number of rotating rollers 52 rotatably connected to the box body 51, a number of leveling rollers 53 rotatably connected to the box body 51, and a fourth power source 54 for driving the leveling rollers 53 to rotate. The leveling rollers 53 are located above the plurality of rotating rollers 52, and the plurality of leveling rollers 53 are installed at the same horizontal height. The horizontal alignment of the leveling rollers 53 ensures uniform force on the circuit copper plate during the leveling process, improving the leveling accuracy; the supporting function of the rotating rollers 52 ensures the stability of the circuit copper plate during the leveling process, avoiding deviation or distortion; the driving of the fourth power source 54 realizes the automatic control of the leveling rollers 53, improving the production efficiency.

[0054] Embodiment 2, a method for shaping a circuit copper plate, specifically including the following steps:

[0055] S1. Input the size information of the copper plate into the operation interface of the central processing unit;

[0056] S2. The feeding mechanism 1 transports the copper plate into the entire production line. The pre-leveling mechanism 2 pre-bends the copper plate, and the detection component 4 obtains the bending amplitude information of the copper plate bending;

[0057] S3. Dry the pre-bent copper plate through the drying component, and the bent copper plate restores its deformation towards the opposite direction of the bend;

[0058] S4. The dried copper plate obtains the bending amplitude information of the copper plate bending through the detection component 4. If the bending of the copper plate at this time exceeds the preset value for entering the leveling mechanism 5, the central processing unit adjusts the numerical value of the pre-bending of the copper plate by the pre-leveling mechanism 2, so that the dried copper plate can enter the leveling mechanism 5 with a suitable bending amplitude

[0059] Among them, the bending amplitude information in step S2 and step S4 includes the maximum warping height, the bending amplitude, and the position of the maximum warping height. After pre-bending in step S2, the bending amplitude of the copper plate is between 2% and 3%. After drying in step S3, the bending amplitude of the copper plate is between 1.2% and 1.7%. The preset value of the leveling mechanism 5 in step S4 is 2%.

[0060] Embodiment 3, taking a circuit copper plate with a length and width of 300 mm and a thickness of 1.5 mm as an example, the maximum warping height of the circuit copper plates of this specification in different batches can reach 6 - 15 mm directly after drying. The bending amplitude is equal to the maximum warping height divided by the length of the circuit copper plate. At this time, the bending amplitude of the circuit copper plate is 2% - 5%; the maximum warping height of the circuit copper plate is bent to 6 - 9 mm through the pre-leveling mechanism 2, and the bending amplitude is controlled between 2% and 3%. At this time, it is dried through the drying mechanism 3, and the maximum warping height after drying can reach 4 - 5 mm, and the bending amplitude is 1.33% - 1.67%.

[0061] Example 4: Taking a circuit copper plate with a length and width of 300 mm and a thickness of 1 mm as an example, the maximum warping height of the circuit copper plates of this specification in different batches can reach 18 - 36 mm after direct drying, and the bending amplitude of the circuit copper plate at this time is 3% - 6%; the maximum warping height of the circuit copper plate is bent to 14 - 20 mm through the pre-flattening mechanism 2, and the bending amplitude is controlled between 2.33% - 3.33%. At this time, it is dried through the drying mechanism 3, and the maximum warping height after drying can reach 9 - 10 mm, and the bending amplitude is 1.5% - 1.67%.

[0062] The above are all preferred embodiments of the present application. The protection scope of the present application is not limited thereby. Therefore, all equivalent changes made according to the structure, shape, and principle of the present application should be covered within the protection scope of the present application.

Claims

1. A circuit copper plate shaping device, characterized in that: It includes a feeding mechanism (1), a pre-aligning mechanism (2), a drying mechanism (3), a leveling mechanism (5), and a detection component (4). The detection component (4) is respectively arranged between the pre-aligning mechanism (2) and the drying mechanism (3), and between the drying mechanism (3) and the leveling mechanism (5). The pre-aligning mechanism (2) first bends the circuit copper plate, the detection component (4) measures the bending data of the circuit copper plate, the bent circuit copper plate enters the drying mechanism (3) for drying, the detection component (4) measures the bending data of the circuit copper plate again, and adjusts the bending situation of the circuit copper plate by the pre-aligning mechanism (2). Finally, the circuit copper plate enters the leveling mechanism (5) with a suitable bending arc for leveling treatment; The pre-aligning mechanism (2) includes a machine shell (21), a transportation component (22) installed on the machine shell (21), several auxiliary rollers (26) installed on the machine shell (21), a moving platform (23) installed on the machine shell (21), several transportation rollers (24) installed on the moving platform (23), and a deformation roller (25) installed on the moving platform (23). The auxiliary rollers (26) and the transportation rollers (24) are located on both sides of the deformation roller (25). The transportation rollers (24) are located above the transportation component (22). A first conveyor belt (27) bypasses the surface of the transportation rollers (24). At least two deformation rollers (25) change the transportation trajectory of the transportation component (22), and the deformation roller (25) can be in contact with the first conveyor belt (27); At least two groups of the auxiliary rollers (26) and the transportation rollers (24) are located in the same vertical plane. The auxiliary rollers (26) are at the same horizontal height, and at least two transportation rollers (24) are at the same horizontal height; The transportation component (22) includes a belt roller rotatably connected to the machine shell (21), a second conveyor belt (28) installed on the belt roller, and a first power source that respectively drives the belt roller and the transportation rollers (24) to rotate. The auxiliary rollers (26) are in contact with the second conveyor belt (28), and a part of the second conveyor belt (28) is horizontally inclined by 10° - 20° under the action of the auxiliary rollers (26).

2. The circuit copper plate shaping device according to claim 1, characterized in that: The moving platform (23) includes a first lead screw (231) rotatably connected to the machine shell (21), a first optical rod (232) fixedly connected to the machine shell (21), a moving plate (233) slidably connected to the first optical rod (232), a second power source that drives the first lead screw (231) to rotate, a second lead screw (235) rotatably connected to the moving plate (233), a third power source that drives the second lead screw (235) to rotate, and a mounting block (234) that moves relative to the moving plate (233). The deformation roller (25) is rotatably connected to the mounting block (234), and the third power source is installed on the moving plate (233).

3. The circuit copper plate shaping device according to claim 2, characterized in that: The detection component (4) includes a conveyor frame (41), a mounting frame (42) fixedly connected to the conveyor frame (41), several sensors (43) mounted on the mounting frame (42), and a central processing unit. The circuit copper plate is transported by the conveyor frame (41) to the lower part of the sensors (43). The sensors (43) acquire the warping information of the circuit copper plate and transmit the warping information to the central processing unit for analysis and processing. The central processing unit controls the pre-flattening mechanism (2) so that the circuit copper plate enters the drying mechanism (3) with a suitable curvature.

4. The circuit copper plate shaping device according to claim 3, characterized in that: The flattening mechanism (5) includes a box body (51), several rotating rollers (52) rotatably connected to the box body (51), several flattening rollers (53) rotatably connected to the box body (51), and a fourth power source (54) for driving the flattening rollers (53) to rotate. The flattening rollers (53) are located above the several rotating rollers (52), and the several flattening rollers (53) are installed at the same horizontal height.

5. A method for shaping a circuit copper plate, characterized in that: It is applicable to the circuit copper plate shaping equipment described in claim 4 above, and specifically includes the following steps: S1. Input the size information of the copper plate into the operation interface of the central processing unit; S2. The feeding mechanism (1) transports the copper plate into the entire production line. The copper plate is pre-bent by the pre-flattening mechanism (2), and the bending amplitude information of the copper plate is obtained through the detection component (4); S3. The pre-bent copper plate is dried by the drying component, and the bent copper plate restores its deformation towards the opposite direction of the bend; S4. The dried copper plate obtains the bending amplitude information of the copper plate through the detection component (4). If the bending of the copper plate at this time exceeds the preset value for entering the flattening mechanism (5), the central processing unit adjusts the numerical value of the pre-bending of the copper plate by the pre-flattening mechanism (2) so that the copper plate after drying can enter the flattening mechanism (5) with a suitable bending amplitude.

6. The method for shaping a circuit copper plate according to claim 5, characterized in that: The bending amplitude information in step S2 and step S4 includes the maximum warping height, the bending amplitude, and the position of the maximum warping height.

7. The method for shaping a circuit copper plate according to claim 6, characterized in that: In step S2, the bending amplitude of the copper plate after pre-bending is between 2% and 3%. In step S3, the bending amplitude of the copper plate after drying is between 1.2% and 1.7%. The preset value of the flattening mechanism (5) in step S4 is 2%.

Images