A lead forming process for CQFP packaged components based on the MCCH150 forming machine

Abstract

This invention discloses a lead forming process for CQFP packaged components based on an MCCH150 forming machine, belonging to the field of electrical assembly technology. This invention improves the cutting method, achieving one-time cutting of both side frames, eliminating the impact force on the leads caused by traditional manual cutting and preventing lead bending; it designs a support fixture to solve the problem of horizontal and vertical lead interference present in existing fixtures; it designs a clamping fixture to achieve automatic clamping and fixing of the component body, avoiding the offset and warping problems of traditional manual pressing; it designs a debris cleaning fixture to achieve magnetic adsorption of lead debris, effectively cleaning lead debris remaining on the desktop, equipment, and in crevices; and it eliminates lead interference through the design of a dedicated transfer fixture, enabling safe transfer of the formed component.

Description

Technical Field

[0001] This invention belongs to the field of electrical assembly technology, specifically relating to a process method for wire forming of CQFP packaged components based on an MCCH150 forming machine. Background Technology

[0002] Printed circuit boards (PCBs) are a crucial component of aerospace fiber optic gyroscope inertial measurement units (INS), playing a vital role in signal connectivity and electrical connections. Currently, the research and design of PCBs still utilize CQFP (Crystal QFP) packaged components as key components for signal conversion and transmission, and the quality of their soldering directly affects the reliability of the INS's electrical connections. CQFP packaged components require pre-forming before soldering. While the process engineers have introduced the MCCH150 forming machine, which can form the leads of some surface-mount packaged components, its use still has the following drawbacks:

[0003] First, the operator uses diagonal pliers to cut the frame one by one. During the cutting process, the shearing force of the pliers will impact the chip pins, causing them to bend and deform. In addition, uneven cuts will leave frame residue, making it impossible to align the edges horizontally during molding, which will affect the quality of chip molding.

[0004] Second, the existing support block is suitable for forming chips with a body size of ≥15mm×15mm, but when forming chips <15mm×15mm, the support surface will interfere with the lead wire, making it impossible to form lead wires of all sizes.

[0005] Third, when pressing the chip body by hand during molding, the space for pressing by hand is small when encountering small chips, which cannot fix the chip well and brings the risk of damaging the pins.

[0006] Fourth, traditional anti-static brush cleaning is time-consuming and labor-intensive, and it is difficult to clean certain crevices, leaving residue and creating potential hazards from excess material.

[0007] Fifth, after components are formed, the leads may bend or deform, causing the original packaging box to interfere with the leads and rendering it unusable. Component leads are dense and soft, and are easily deformed if not stored properly.

[0008] Sixth, the current coplanarity testing fixture is made of marble and has not been grounded, which can easily introduce static electricity during component testing.

[0009] Therefore, it is imperative to improve existing assembly processes and technologies to achieve reliable lead forming for CQFP packaged components. Summary of the Invention

[0010] The purpose of this invention is to overcome the shortcomings of the prior art and provide a lead forming method for CQFP packaged components based on the MCCH150 forming machine. This method achieves breakthroughs and optimizations in reliable ceramic frame cutting technology, chip fitting and fixing technology, automatic chip body clamping technology, and efficient lead debris cleaning technology. It eliminates the hidden dangers of manual operation, overcomes the limitations of forming shoulder width and soldering length, and improves lead cutting efficiency and quality.

[0011] The above-mentioned objectives of the present invention are mainly achieved through the following technical solutions:

[0012] A lead forming process for CQFP packaged components based on an MCCH150 forming machine includes the following steps:

[0013] (1) Measure the lead wire dimensions of the components and the corresponding printed circuit board pad dimensions, and set the component forming parameters;

[0014] (2) Place the component on the cutting machine platform with one corner of the component close to the cutting machine platform. Adjust the position of the cutting machine platform so that the edge of the component lead wire is aligned with the lower edge of the cutting groove. Pull down the pressure bar and cut the ceramic frame on both sides of the component at the same time. Repeat the above operation to cut the ceramic frame of adjacent corners in turn.

[0015] (3) Measure the width of the component body, select the support fixture and clamping fixture. The support fixture includes a support end and an installation end. Place the component on the support end so that one edge of the component body is horizontal and closely fitted with the edge of the support end. The clamping fixture presses the component body to fix the component body.

[0016] (4) Place the support fixture for holding the components obtained in the step on the forming machine, pull down the forming machine pressure bar, and complete the component lead wire forming;

[0017] (5) Remove the clamping fixture and take out the components;

[0018] (6) Place the completed components on the coplanarity testing fixture to test the coplanarity of the leads. Check that the coplanarity of the leads is ≤0.1mm.

[0019] (7) Place the completed components into a special transfer fixture for transfer to complete the component lead forming.

[0020] The clamping fixture includes an upper cover plate, a rear screw, and a front screw. The upper cover plate has a through hole, and the rear screw and the front screw connect the clamping fixture and the supporting fixture through the through hole. The clamping fixture fixes the component as follows: Adjust the fixing position of the rear screw nut so that the upper cover plate completely covers the component body, and the front edge of the upper cover plate is aligned with the edge of the supporting end of the supporting fixture; use the front screw and the rear screw to press the upper cover plate tightly against the component body.

[0021] Using the rear screw as a pivot, the top cover can be rotated to the outside of the component clamping area, making it easier to remove and replace the components.

[0022] The support end is located at the edge of the upper surface of the mounting end, and multiple support ends of different specifications can be installed on the support fixture.

[0023] The bottom of the mounting end is provided with a positioning pin, which is connected to the positioning hole on the forming machine platform to fix the support tooling.

[0024] The thickness h of the support end of the support fixture is equal to the component forming shoulder width dimension minus 0.6 ± 0.1 mm, where h is 0.1 mm to 0.6 mm. The width of the support end is 5 mm to 30 mm, and the width of the support end is less than or equal to the width of the component body. The height of the support fixture is 11.9 to 12.1 mm.

[0025] The special transfer fixture is equipped with multiple square slots, the size of which matches the size of the formed component body and the lead wire size, for placing the formed component.

[0026] After the component leads are formed, residual debris is removed using a debris removal tool. The debris removal tool is made of magnetic material and can remove debris from corners and crevices through non-contact magnetic adsorption.

[0027] The supporting fixture and clamping fixture are made of aluminum alloy, which has anti-static and wear-resistant properties; the coplanarity detection fixture and the special transfer fixture are made of stainless steel, which has anti-static properties and is not easy to rust, with a coplanarity of <0.05mm.

[0028] After cutting the ceramic frames on both sides of the component in step (2), rotate the component to several required angles and complete the cutting in sequence.

[0029] A lead forming device for CQFP packaged components based on an MCCH150 forming machine includes a support fixture, a clamping fixture, a coplanarity detection fixture, a debris cleaning fixture, and a dedicated transfer fixture. The support fixture includes a support end and a mounting end. The clamping fixture includes a top cover plate, a rear screw, and a front screw. The support end is located at the edge of the upper surface of the mounting end. Multiple support ends of different specifications can be provided on the support fixture. Components are placed on the support ends. The top cover plate is used to press the components and is fixed by the rear and front screws. The coplanarity detection fixture is used to check the coplanarity of the leads after component forming. The debris cleaning fixture is made of magnetic material and is used to remove debris from corners and gaps through non-contact magnetic adsorption. The dedicated transfer fixture has multiple square slots, the dimensions of which are matched to the dimensions of the formed component body and leads, for placing the formed components.

[0030] Compared with the prior art, the present invention has at least the following beneficial effects:

[0031] (1) This invention replaces the traditional manual diagonal pliers cutting process by improving the cutting process method, which can achieve one-time cutting of both sides of the frame, eliminates the impact on the chip and pins, avoids pin bending, and at the same time, the improved cutting process achieves thorough frame cutting without residue, reduces the risk of manual cutting operation and improves product quality.

[0032] (2) The present invention achieves the support and fixation of various sizes of components by designing special fixing fixtures. The special fixing fixtures can be selected according to the width of the components, eliminating the problem that existing fixtures cannot be used for various sizes of components, solving the problem of lead interference in the use of existing fixtures, and avoiding the deformation of component leads.

[0033] (3) Through the design of support fixtures and clamping fixtures, the present invention realizes the mounting and automatic fixing of the component body on the molding machine, avoiding the problems of inaccurate positioning and offset caused by traditional manual fixing.

[0034] (4) This invention uses a magnetic adsorption method to create a handheld magnetic debris cleaning tool to replace the anti-static brush. It enables the rapid cleaning of residual pin debris on desktops, equipment and in crevices, which is convenient and quick, improves work efficiency, and eliminates the problems of debris residue and difficulty in cleaning debris in crevices that exist in traditional brush cleaning.

[0035] (5) This invention replaces the traditional marble slab material with a metal material coplanarity testing fixture, eliminating the problem of electrostatic damage and realizing non-destructive testing of component leads.

[0036] (6) This invention designs a special transfer fixture for components to replace the traditional method of fixing with antistatic boxes and tape, thereby achieving reliable transfer of the formed components, avoiding bending and damage of the leads caused by external force due to insecure fixing, and enabling the simultaneous transfer of multiple components, thus improving efficiency. Attached Figure Description

[0037] Figure 1 This is a schematic diagram of the lead wire cutting process of the present invention;

[0038] Figure 2 This is a schematic diagram of the supporting tooling for the present invention;

[0039] Figure 3 This is a schematic diagram of the clamping fixture of the present invention;

[0040] Figure 4 This is a schematic diagram of the positioning pin supporting the tooling of the present invention;

[0041] Figure 5 This is a schematic diagram showing the mounting and clamping of CQFP packaged components before molding.

[0042] Figure 6 This is a schematic diagram of the lead fabrication process for CQFP packaged components.

[0043] Figure 7 This is a schematic diagram of the coplanarity detection fixture of the present invention;

[0044] Figure 8 This is a schematic diagram of the debris cleaning fixture of the present invention;

[0045] Figure 9 This is a schematic diagram of the special transfer tooling for this invention. Detailed Implementation

[0046] To make the objectives, technical solutions, and advantages of the present invention clearer, the embodiments of the present invention will be described in further detail below with reference to the accompanying drawings.

[0047] The following are the steps of the process method for wire forming of CQFP packaged components based on the MCCH150 forming machine according to the present invention:

[0048] (1) As Figure 1 The diagram illustrates the wire cutting process of this invention. Component 1 is placed on the cutting machine platform 2, aligning the edges of the wires on both sides of component 1 with the lower edges of the cutting grooves 3 on both sides. The pressure bar is then pulled down, allowing two cutting blades to simultaneously cut the ceramic frame on both sides of one corner of component 1. Component 1 is rotated sequentially to 90°, 180°, and 270° to position and support the component 1 body, thus sequentially cutting the ceramic frame at adjacent corners.

[0049] (2) Figure 2 The diagram shows a schematic of the support fixture 4 of the present invention. The support fixture 4 includes a support end 401 and an mounting end 402. In this figure, the support fixture 4 includes three support ends 401 of different sizes. Measure the width of the component 1 body, select the support fixture 4, requiring that the width of the support fixture 4 be less than or equal to the width of the component 1 body, and the thickness h of the support end 401 of the support fixture 4 be equal to the forming shoulder width of the component 1 minus 0.6 ± 0.1 mm. Place the selected support fixture 4 flat on an anti-static table, and place the component 1 on the support end 401 of the support fixture 4, so that one edge of the component 1 body is tightly fitted with the edge of the support end 401.

[0050] (3) Figure 3The diagram shows the clamping fixture 5 of the present invention. The position of the nut of the rear screw 502 of the clamping fixture 5 is adjusted so that the bottom height of the upper cover plate 501 is consistent with the top height of the component 1 body; the upper cover plate 501 completely covers the component 1 body, and the front edge of the upper cover plate 501 is horizontally aligned with the edge of the support end 401 of the support fixture 4; the two front fixing screws 503 and the rear screw 502 of the upper cover plate 501 are installed and pre-tightened so that the upper cover plate 501 horizontally presses the component 1 body, thereby achieving the final fixation of the component 1 body;

[0051] (4) Figure 4 The diagram shows the positioning pins 403 of the support fixture 4 of the present invention. The two positioning pins 403 at the bottom of the mounting end 402 of the support fixture 4 are aligned with the positioning holes on the platform 9 of the molding machine, and placed flat to achieve quick mounting of the support fixture 4. Figure 5 As shown;

[0052] (5) Figure 6 As shown, pull down the forming machine pressure rod to complete the lead wire forming; remove the two front screws 503 of the upper cover plate 501, loosen the rear screw 502 fixing nut, and use a vacuum pen to remove component 1.

[0053] (6) Figure 7 The image shows the coplanarity testing fixture 6. The completed component 1 is placed on the coplanarity testing fixture 6 to test the coplanarity of the leads.

[0054] (7) Figure 9 As shown, the molded components are placed in a special transfer fixture 8 using a vacuum suction pen for transfer.

[0055] (8) Figure 8 As shown, the debris cleaning fixture 7 is used to clean the debris remaining in the cutting blade, table, and equipment gaps after wire cutting.

[0056] The supporting fixture 4 and the upper cover plate 501 are made of aluminum alloy, which is wear-resistant and has anti-static properties.

[0057] The coplanarity testing fixture 6 is made of stainless steel, which has antistatic properties and is not easily corroded, with a coplanarity of <0.05mm.

[0058] The support fixture 4 is designed with a support end 401 and an installation end 402. The support end 401 is used for mounting the main body of the component 1, and the installation end 402 is used for fixing the support fixture 4 on the forming machine platform 9.

[0059] The thickness h of the support end 401 of the support fixture 4 is equal to the forming shoulder width of component 1 minus 0.6 ± 0.1 mm, where h ranges from 0.1 mm to 0.6 mm. The width of the support end 401 ranges from 5 mm to 30 mm, and is less than or equal to the width of the component 1 body. The height of the support fixture 4 is 11.9-12.1 mm. The height of the support fixture 4 is fixed, and after installation, it ensures consistent control of the height between the support surface and the clamping blade of the forming machine, resulting in high appearance consistency and preventing misalignment.

[0060] The surface coplanarity of the support fixture 4 is ≤0.1mm. By installing it, the height of the lower surface of the component 1 lead and the clamping blade of the forming machine can be kept consistent, resulting in high appearance consistency.

[0061] The clamping fixture cover plate 501 is secured with two front screws 503 and one rear screw 502. The three screws are arranged in an equilateral triangle, which makes the fixation more stable.

[0062] The rear screw 502 of the clamping fixture cover plate 501 can be adjusted to adjust the position and height of the cover plate by adjusting the nut fixing position, so as to meet the clamping requirements of components of different thicknesses.

[0063] The upper cover plate 501 of the clamping fixture is rotatable on the rear side of the support table with the rear screw 502 as the axis, without affecting the removal and replacement of the front components.

[0064] The aforementioned debris cleaning fixture 7 can remove debris from corners and crevices through non-contact magnetic adsorption.

[0065] The special transfer tool 8 is made of stainless steel, which is anti-static and not easily corroded.

[0066] The dedicated transfer fixture 8 can transfer 6 components at the same time, improving production efficiency.

[0067] The internal dimensions of the special transfer fixture 8 are consistent with the dimensions of the component body and lead wires after the component is formed, so there will be no interference.

[0068] The contents not described in detail in this specification are common knowledge to those skilled in the art.

Claims

1. A process for forming leads of a CQFP package device based on a MCCH 150 molding machine, characterized by: The method comprises the following steps: (1) measuring the lead size of the component (1) and the corresponding printed board pad size, and setting the component (1) forming parameters; (2) placing the component (1) on the cutting machine platform (2), with one corner of the component (1) closely attached to the cutting machine platform (2), adjusting the position of the cutting machine platform (2) to align the lead edge of the component (1) with the lower edge of the cutting groove (3), pulling down the pressing rod, and cutting the ceramic frame on both sides of the component (1) at the same time, repeating the above operation to cut the ceramic frame on the adjacent corners in turn; (3) measuring the body width size of the component (1), selecting a supporting tool (4) and a clamping tool (5), the supporting tool (4) comprising a supporting end (401) and a mounting end (402), placing the component (1) on the supporting end (401) so that one side edge of the body of the component (1) is horizontally and closely attached to the edge of the supporting end (401), and clamping the body of the component (1) with the clamping tool (5) to fix the body of the component (1); (4) placing the supporting tool (4) with the clamped component (1) obtained in step (3) on the forming machine, pulling down the pressing rod of the forming machine to complete the lead forming of the component (1); (5) removing the clamping tool (5) and taking off the component (1); (6) placing the formed component (1) on the coplanarity detection tool (6) to detect the lead coplanarity, and checking that the lead coplanarity is less than or equal to 0.1 mm; (7) placing the formed component (1) in the special transfer tool (8) for transfer to complete the lead forming of the component (1).

2. The CQFP package device lead forming process method based on the MCCH 150 forming machine according to claim 1, wherein: The clamping tool (5) comprises an upper cover plate (501), a rear screw (502) and a front screw (503), the upper cover plate (501) is provided with a through hole, the rear screw (502) and the front screw (503) are connected to the clamping tool (5) and the supporting tool (4) through the through hole, and the clamping tool (5) fixes the component (1) in the following way: adjusting the nut fixing position of the rear screw (502) to make the upper cover plate (501) completely cover the body of the component (1), and the front end edge of the upper cover plate (501) is aligned with the edge of the supporting end (401) of the supporting tool (4); the front screw (503) and the rear screw (502) press the body of the component (1) tightly.

3. The CQFP package device lead forming process method based on the MCCH 150 forming machine according to claim 2, wherein: The upper cover plate (501) can be rotated to the outside of the component (1) clamping part with the rear screw (502) as the shaft, which is convenient for taking off and replacing the component (1).

4. The CQFP package device lead forming process method based on MCCH 150 forming machine according to claim 1, characterized in that: The supporting end (401) is arranged at the edge position of the upper surface of the mounting end (402), and a plurality of supporting ends (401) of different specifications can be arranged on the supporting tool (4).

5. The CQFP package device lead forming process method based on MCCH 150 forming machine according to claim 1, wherein: The mounting end (402) is provided with a positioning pin (403) at the bottom, which is connected with the positioning hole on the loading table (9) of the forming machine to fix the supporting tool (4).

6. The CQFP package device lead forming process method based on MCCH 150 forming machine according to claim 1, wherein: The support tooling (4) support end (401) thickness h = component (1) molding shoulder width size - 0.6 ± 0.1mm, h is 0.1mm ~ 0.6mm, support end (401) width is 5mm ~ 30mm, support end (401) width ≤ component (1) body width, support tooling (4) height is 11.9-12.1mm.

7. A process for lead forming of CQFP packaged components (1) based on MCCH 150 forming machine according to claim 1, characterized in that: The special transfer tooling (8) is provided with a plurality of square grooves, and the size of the square grooves is matched with the body size and lead size of the molded component (1), and is used for placing the molded component (1).

8. A process for lead forming of CQFP packaged components (1) based on MCCH 150 forming machine according to claim 1, characterized in that: After the lead forming of the component (1) is completed, the residual debris is cleaned by the debris cleaning tooling (7), the debris cleaning tooling (7) is a magnetic material, and the debris in the corners and gaps can be removed by non-contact magnetic adsorption.

9. The CQFP package device lead forming process method based on MCCH 150 forming machine according to claim 1, wherein: The support tooling (4) and the clamping tooling (5) are made of aluminum alloy and have anti-static and wear-resistant properties; the coplanarity detection tooling (6) and the special transfer tooling (8) are made of stainless steel and have anti-static properties and are not easy to rust, and the coplanarity is less than 0.05mm.

10. The CQFP package device lead forming process method based on MCCH 150 forming machine according to claim 1, wherein: After the ceramic frame on both sides of the component (1) is cut in step (2), the component (1) is rotated to a plurality of required angles, and the cutting is sequentially completed.

11. A CQFP package device lead forming apparatus based on MCCH 150 forming machine, characterized in that: The support tooling (4) includes a support end (401) and a mounting end (402), the clamping tooling (5) includes an upper cover plate (501), a rear screw (502) and a front screw (503), the support end (401) is arranged at the edge position of the upper surface of the mounting end (402), a plurality of different specifications of support ends (401) can be arranged on the support tooling (4), the component (1) is placed on the support end (401), the upper cover plate (501) is used to press the component (1), and the rear screw (502) and the front screw (503) are used for fixation, the coplanarity detection tooling (6) is used for coplanarity detection of the lead of the component (1) after molding, the debris cleaning tooling (7) is a magnetic material and is used for non-contact magnetic adsorption to remove the debris in the corners and gaps; the special transfer tooling (8) is provided with a plurality of square grooves, and the size of the square grooves is matched with the body size and lead size of the molded component (1), and is used for placing the molded component (1).

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