A welding device for an LED lamp bead and a substrate

Abstract

The present invention relates to the technical field of welding, and specifically relates to a welding device for an LED lamp bead and a substrate, which includes an outer housing and a control rod installed at the middle position above the outer housing. The top end of the control rod is connected to a support plate, and three groups of support and regulation mechanisms are installed above the support plate. The solder paste storage cavity, the suction cup assembly, and the hot air gun are respectively supported and installed by the fixing frames in the three groups of support and regulation mechanisms. Moreover, a bottom frame for automatically controlling the flow of the paste is connected to the outer side of the bottom surface of the solder paste storage cavity, and paste application through holes are opened in both the inner part of the bottom surface of the solder paste storage cavity and the inner part of the bottom surface of the bottom frame. The welding device for the LED lamp bead and the substrate can perform paste application operations on a plurality of paste application grooves on the circular substrate body at the same time, and at the same time, the positive electrode and the negative electrode can be coated with paste through the paste application through holes in each group, without continuous paste application for multiple times, thereby improving the efficiency of paste application and the efficiency of welding.

Description

Technical Field

[0001] The present invention relates to the technical field of welding, and particularly to a welding device for an LED lamp bead and a substrate. Background Art

[0002] A single LED lamp bead cannot be used directly. Multiple LED lamp beads need to be welded onto a substrate. The substrate can provide a reliable electrical connection for the LED lamp beads to ensure that current can pass smoothly, enabling the LED lamp beads to be used for normal lighting, and ensuring the reliability and long-term stability of the performance of LED products.

[0003] For example, in the prior art, the patent with the publication number "CN117066633A" and the patent name "A SMT LED Lamp Bead Substrate Welding Device and Its SMT Lamp" discloses that when welding lamp beads placed on the top of a lamp strip, the motor is turned on. When the motor works, it drives the lead screw to rotate, causing the ball nut pair to move left and right on the lead screw. At the same time, the translation box moves left and right, and then the centering frame at the bottom of the working box moves left and right, which can perform left and right translation work on the welding position. By using the first electric telescopic rod, when the first electric telescopic rod works, it controls the front and back movement of the working box, which can perform front and back adjustment on the welding position to assist in welding different positions of the lamp strip. When welding the lamp beads and the lamp strip, the lamp strip is placed in the middle of the workbench top, and then the tin liquid is dropped at the tin groove on the top of the lamp strip. The lamp beads are placed on the tin groove, and an operator uses a hot air blower to melt the tin liquid to weld the lamp beads and the lamp strip. Also, in the prior art, the patent with the publication number "CN117583687A" and the patent name "An LED Lamp Bead Welding Device" discloses that through the rotating holes, connecting columns, and pushing grooves on both sides, the pushing component can drive the rotating component to rotate synchronously when pushing. Through the negative pressure in the solder pipe, the extrusion of solder paste is realized. And the array of locking teeth and locking blocks realizes a continuous step adjustment function, which can freely control the amount of solder paste extruded, adapt to different amounts of solder paste required for different sizes of LED lamp beads, has strong adaptability, and is easy to operate. By precisely controlling the amount of solder paste extruded, waste can be reduced, production costs can be lowered, and production efficiency can be further improved. It can ensure that the heat input amount at each welding point is uniform, which is beneficial to ensuring the quality, strength, uniformity, and consistency of the welding joint. And the amount of solder extruded at the positive and negative poles of a lamp post is the same, so that when the lamp beads are welded, the solder paste automatically shrinks, making it easier for the lamp beads to automatically adjust and match the position of the installation groove, avoiding the need to manually align and adjust the position of the lamp beads during welding, and improving the aesthetics of lamp bead welding.

[0004] When the welding device in the above-mentioned prior art performs welding work, since there is only one discharge port at the bottom of the solder paste tube, the solder paste tube can only apply solder paste to the paste application groove on the substrate corresponding to the positive or negative electrode on one lamp post at a time. Therefore, multiple consecutive operations are required to complete all the paste application operations, which is time-consuming and laborious, resulting in a low efficiency of applying solder paste during welding and a low welding efficiency between the LED lamp beads and the substrate. Therefore, we propose a welding device for LED lamp beads and substrates to solve the problems raised above. Summary of the Invention

[0005] The purpose of the present invention is to provide a welding device for LED lamp beads and substrates to solve the problem in the above-mentioned background technology that when the welding device on the current market performs welding work, since there is only one discharge port at the bottom of the solder paste tube, the solder paste tube can only apply solder paste to the paste application groove on the substrate corresponding to the positive or negative electrode on one lamp post at a time. Therefore, multiple consecutive operations are required to complete all the paste application operations, which is time-consuming and laborious, resulting in a low efficiency of applying solder paste during welding and a low welding efficiency between the LED lamp beads and the substrate.

[0006] To achieve the above purpose, the present invention provides the following technical solution: A welding device for LED lamp beads and substrates, including an outer shell, and a control rod installed in the middle position above the outer shell. The top of the control rod is connected to a support plate. Three sets of support and regulation mechanisms are installed above the support plate. The solder paste storage cavity, the suction cup assembly, and the hot air gun are respectively supported and installed by the fixing frames in the three sets of support and regulation mechanisms. A temporary storage tray is installed on the outer shell below the suction cup assembly. Moreover, a bottom frame for automatically controlling the flow of solder paste is connected to the outer side of the bottom surface of the solder paste storage cavity. Solder paste through holes are provided in both the inner part of the bottom surface of the solder paste storage cavity and the inner part of the bottom surface of the bottom frame. A support for placing the substrate body is connected to the outer shell in front of the support plate.

[0007] Preferably, the support and regulation mechanism includes a support frame, a first electric push rod, and a fixing frame. The support frame in an inverted "U" shape is installed on the support plate. A first electric push rod for controlling the lifting of the fixing frame is fixed inside the upper part of the support frame. The output end of the first electric push rod is connected to the fixing frame. The lengths of the three fixing frames are all different.

[0008] Preferably, a piston assembly is attached and connected inside the solder paste storage cavity. The upper surface of the piston assembly is connected to the output end of a second electric push rod penetrating and installed inside the upper part of the solder paste storage cavity.

[0009] Preferably, a fixing block with an inclined side is installed outside the support plate. The shape of the temporary storage tray is the same as that of the substrate body. The number of groups of solder paste through holes in the bottom surfaces of the solder paste storage cavity and the bottom frame is the same as the number of grooves on the temporary storage tray, and they correspond one by one. Moreover, each group of solder paste through holes is provided with two.

[0010] Preferably, the bottom frame is rotatably connected to the solder paste storage cavity, and the upper part of the bottom frame is connected to a scroll spring nested outside the solder paste storage cavity. An arc-shaped adjustment bump is installed on one side of the bottom frame close to the support plate. The adjustment bump is arranged above the fixed block, and the adjustment bump forms a rotating structure through the fixed block.

[0011] Preferably, a funnel-shaped air outlet cover is installed on the bottom surface of the hot air gun.

[0012] Preferably, an automatic locking component is sleeved outside the support base, and the automatic locking component includes a calibration frame and a locking frame. A circular locking frame is installed below the calibration frame in the shape of a funnel. The diameter of the upper part of the calibration frame is larger than that of the lower part of the calibration frame, and the diameter of the lower part of the calibration frame is equal to the diameter of the locking frame.

[0013] Preferably, the bottom surface of the locking frame and the bottom surface of the support base are both connected to the upper surface of the outer shell through spring support columns. The spring support columns are composed of manual telescopic rods and return springs.

[0014] Preferably, a circular self-control plate is installed outside the control rod below the support plate, and an arc-shaped self-control groove is formed on the bottom surface of the self-control plate. The arc length of the self-control groove is less than one-fourth of the circumference of the self-control plate.

[0015] Preferably, a convex rod is installed on the rear side of the support base, and a fixed plate is fixed on the front side of the support base. The rear end of the convex rod and the front end of the fixed plate respectively penetrate through the slots formed on the front and rear side surfaces of the locking frame. A connecting spring installed in the slot on the front side surface of the locking frame is connected to the convex rod. The front end of the fixed plate is connected to a first rack assembly. A transmission gear is installed above the outer shell. The left and right sides of the transmission gear are respectively meshed and connected with the first rack assembly and a second rack assembly. The second rack assembly is installed on the front side surface of the locking frame, and the first rack assembly and the second rack assembly move towards each other.

[0016] Compared with the prior art, the beneficial effects of the present invention are as follows: The soldering device for the LED lamp beads and the substrate can perform soldering paste operations on multiple soldering paste grooves on the circular substrate body at the same time. At the same time, the positive and negative electrodes can be coated with paste through the paste through holes in each group, eliminating the need for multiple consecutive paste coatings, thereby improving the efficiency of paste coating and subsequent soldering. The specific content is as follows:

[0017] When the solder paste storage cavity moves downward, by regulating the cooperation of the bumps and the fixed blocks, the bottom frame can be automatically driven to rotate by a certain angle, so that the paste application through holes in the bottom surface of the bottom frame coincide with the paste application through holes in the bottom surface of the solder paste storage cavity. Therefore, through the setting of multiple groups of paste application through holes, with two in each group, the paste application operation can be carried out on multiple paste application grooves on the circular substrate body at the same time. At the same time, the positive and negative electrodes can be pasted simultaneously through the paste application through holes in each group, without continuous paste application multiple times, thus improving the paste application efficiency and the subsequent welding efficiency;

[0018] Through the manipulator, multiple LED lamp beads can be sequentially placed into the slots in the temporary storage tray first. Since the structure of the temporary storage tray is the same as that of the substrate body, later, through the suction cup assembly, multiple LED lamp beads in the temporary storage tray can be transported and placed into the substrate body together, without placing multiple LED lamp beads one by one. At the same time, it is convenient to carry out the welding operation on multiple substrates continuously, thus further improving the welding efficiency of the welding device and meeting the requirements of continuous processing;

[0019] When the self-control board and the self-control groove rotate together, the self-control groove will be separated from the convex rod, and then the self-control board will exert a downward thrust on the convex rod, which is convenient for the convex rod to drive the support seat and the substrate body to move downward together. When the support seat moves downward, through the cooperation of the first rack assembly, the transmission gear and the second rack assembly, the automatic locking assembly can be automatically driven to move upward. Therefore, the funnel-shaped calibration frame in the automatic locking assembly can calibrate the position of the substrate body, so that the center of the substrate body and the center of the support seat are on the same vertical line. Later, the inner side wall of the locking frame is in close contact with the outer side surface of the substrate body, so that the locking frame can clamp and lock the substrate body, avoiding the deviation of the subsequent welding position caused by the movement of the substrate body. Therefore, this structure not only does not require an additional power source, saves energy, but also can automatically clamp and fix the substrate body and automatically release the clamping and fixing, with convenient operation, time-saving and labor-saving, and further improving the subsequent welding efficiency. Brief Description of the Drawings

[0020] Figure 1 It is a three-dimensional structure schematic diagram of the present invention;

[0021] Figure 2 It is a top view structure schematic diagram of the present invention;

[0022] Figure 3 It is a connection structure schematic diagram of the self-control board and the automatic locking assembly of the present invention;

[0023] Figure 4 It is a bottom view structure schematic diagram of the self-control board and the automatic locking assembly of the present invention;

[0024] Figure 5 It is a structure schematic diagram after the self-control board of the present invention rotates;

[0025] Figure 6 Schematic cross-sectional structure diagram of the automatic locking component of the present invention;

[0026] Figure 7 Rear view structure diagram of the suction cup component of the present invention;

[0027] Figure 8 Bottom view structure diagram of the solder paste storage cavity of the present invention;

[0028] Figure 9 Cross-sectional structure diagram of the solder paste storage cavity of the present invention;

[0029] Figure 10 Bottom view structure diagram of the suction cup component of the present invention.

[0030] In the figure: 1. Outer housing; 2. Control rod; 3. Automatic control board; 301. Automatic control groove; 4. Support plate; 41. Fixed block; 5. Support regulation mechanism; 51. Support frame; 52. First electric push rod; 53. Fixed frame; 6. Solder paste storage cavity; 61. Piston assembly; 62. Second electric push rod; 7. Suction cup component; 8. Temporary storage tray; 9. Hot air gun; 10. Air outlet cover; 11. Support base; 12. Substrate body; 13. Automatic locking component; 131. Calibration frame; 132. Locking frame; 14. Spring support column; 15. Convex rod; 151. Connecting spring; 16. First rack assembly; 161. Fixed plate; 17. Second rack assembly; 18. Transmission gear; 19. Bottom frame; 191. Scroll spring; 192. Regulation convex block; 20. Solder paste application through hole. Specific embodiments

[0031] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0032] Please refer to Figures 1 - 10 , the present invention provides the following technical solutions:

[0033] Embodiment 1: The soldering device for LED lamp beads and substrates in this embodiment can perform solder paste application operations on multiple solder paste application grooves on the circular substrate body 12 at the same time, without continuous solder paste application multiple times, thereby improving the efficiency of solder paste application and the subsequent soldering efficiency. The specific structure refers to the attached Figures 1 - 3 and the attached Figures 7 - 10As shown in the figure, it includes a housing 1 and a control rod 2 installed at the middle position above the housing 1. The top end of the control rod 2 is connected to a support plate 4. Above the support plate 4, three groups of support and regulation mechanisms 5 are installed. The paste storage cavity 6, the suction cup assembly 7, and the hot air gun 9 are respectively supported and installed by the fixing frames 53 in the three groups of support and regulation mechanisms 5. And a temporary storage tray 8 is installed on the housing 1 below the suction cup assembly 7. Moreover, a bottom frame 19 for automatically controlling the flow of the paste is connected to the outer side of the bottom surface of the paste storage cavity 6. Paste through holes 20 are provided in both the inner part of the bottom surface of the paste storage cavity 6 and the inner part of the bottom surface of the bottom frame 19. A support base 11 for placing the substrate body 12 is connected to the housing 1 in front of the support plate 4.

[0034] The support and regulation mechanism 5 includes a support frame 51, a first electric push rod 52, and a fixing frame 53. The support frame 51 in an inverted "U" shape is installed on the support plate 4. The first electric push rod 52 for controlling the lifting of the fixing frame 53 is fixed inside the upper part of the support frame 51. The output end of the first electric push rod 52 is connected to the fixing frame 53. The lengths of the three groups of fixing frames 53 are different. A piston assembly 61 is attached to the inside of the paste storage cavity 6. The upper surface of the piston assembly 61 is connected to the output end of the second electric push rod 62 penetrating and installed inside the upper part of the paste storage cavity 6. A fixing block 41 with an inclined side surface is installed outside the support plate 4. The shape of the temporary storage tray 8 is the same as that of the substrate body 12. The number of groups of the paste through holes 20 in the bottom surfaces of the paste storage cavity 6 and the bottom frame 19 is the same as the number of slots on the temporary storage tray 8, and they correspond one by one. Moreover, two paste through holes 20 are provided in each group. The bottom frame 19 is rotatably connected to the paste storage cavity 6, and the upper part of the bottom frame 19 is connected to a scroll spring 191 nested outside the paste storage cavity 6. An arc-shaped regulation convex block 192 is installed on one side surface of the bottom frame 19 close to the support plate 4. The regulation convex block 192 is arranged above the fixing block 41. The regulation convex block 192 forms a rotating structure through the fixing block 41. A funnel-shaped air outlet cover 10 is installed on the bottom surface of the hot air gun 9.

[0035] First, move the entire welding device into the working area. Place a substrate body 12 on the bracket 11 through the manipulator. Then, place multiple LED beads into the slots in the temporary storage tray 8 in sequence through the manipulator. Start the first electric push rod 52 in the support regulation mechanism 5 connected to the suction cup assembly 7. The first electric push rod 52 drives the corresponding fixed frame 53 and the suction cup assembly 7 to move downward. The suction cup assembly 7 simultaneously adsorbs multiple LED beads on the temporary storage tray 8. Then, similarly, the suction cup assembly 7 drives multiple LED beads to move upward. Next, start the motor inside the outer shell 1. The motor drives the control rod 2 to rotate clockwise by 90°. The control rod 2 drives the support plate 4 and the three groups of support regulation mechanisms 5 to rotate together. Thus, one group of support regulation mechanisms 5 drives the solder paste storage cavity 6 to rotate to directly above the substrate body 12, and another group of support regulation mechanisms 5 drives the suction cup assembly 7 to rotate to the right side. Similarly, the other group of support regulation mechanisms 5 drives the hot air gun 9 and the air outlet cover 10 to rotate to the rear side.

[0036] Next, start the first electric push rod 52 in one group of support regulation mechanisms 5. The first electric push rod 52 drives the fixed frame 53 and the solder paste storage cavity 6 to move downward. At the same time, start the second electric push rod 62 above the solder paste storage cavity 6. The output end of the second electric push rod 62 drives the piston assembly 61 to move downward. The piston assembly 61 pushes the solder paste in the solder paste storage cavity 6 downward. At the same time, when the solder paste storage cavity 6 moves downward, it drives the bottom frame 19 and the regulation convex block 192 to move downward together. When the regulation convex block 192 moves into contact with the fixed block 41, since one side surface of the fixed block 41 is inclined, the fixed block 41 applies a thrust to the downward-moving arc-shaped regulation convex block 192. Then, the regulation convex block 192 automatically drives the bottom frame 19 to rotate by a certain angle. At this time, the scroll spring 191 stores energy. When the regulation convex block 192 continues to move downward, one side surface of the regulation convex block 192 is in close contact with the vertical surface of the fixed block 41. Therefore, the stability of the rotated bottom frame 19 is ensured, so that the paste application through holes 20 in the bottom surface of the rotated bottom frame 19 coincide with the paste application through holes 20 in the bottom surface of the solder paste storage cavity 6. Then, the solder paste in the solder paste storage cavity 6 flows downward through multiple groups of paste application through holes 20. Since each group of paste application through holes 20 has two, multiple positions corresponding to the positive and negative electrodes of the LED beads in the substrate body 12 can be paste-applied simultaneously, without paste-applying each position in the substrate body 12 one by one, thereby improving the paste application efficiency.

[0037] Then the first electric push rod 52 drives the solder paste storage cavity 6 to move upward. At this time, the operation of the second electric push rod 62 is stopped. At the same time, when the bump 192 is separated from the fixed block 41, the torsion spring 191 can automatically drive the bottom frame 19 to rotate reversely and reset. As a result, the paste application through hole 20 in the bottom surface of the bottom frame 19 does not coincide with the paste application through hole 20 in the bottom surface of the solder paste storage cavity 6. This not only enables the falling paste to be truncated when the bottom frame 19 rotates reversely and resets, facilitating the good application of the paste on the substrate body 12, but also facilitates the sealing operation of the bottom surface of the solder paste storage cavity 6, preventing external air from entering the solder paste storage cavity 6 and affecting the quality of the solder paste. Then, the control rod 2 is driven by the motor to rotate clockwise by 90°. Since the temporary storage tray 8 and the substrate body 12 are symmetrically arranged with respect to the horizontal center line of the support plate 4, the suction cup assembly 7 rotates to the position directly above the substrate body 12. At this time, similarly to the above, the first electric push rod 52 drives the suction cup assembly 7 to move downward. Then, the suction cup assembly 7 places a plurality of LED lamp beads into the corresponding slots on the substrate body 12. Since the structures of the substrate body 12 and the temporary storage tray 8 are the same, the positions of the plurality of LED lamp beads placed on the substrate body 12 can be accurate. Then, the control rod 2 is driven by the motor to rotate clockwise by 90° again. At this time, the hot air gun 9 and the air outlet cover 10 rotate to the position directly above the substrate body 12. Similarly to the above, the first electric push rod 52 drives the hot air gun 9 and the air outlet cover 10 to move downward. The hot air gun 9 and the air outlet cover 10 cooperate to blow hot air onto the upper surface of the substrate body 12, thereby facilitating the soldering of the substrate body 12 to the upper LED lamp beads. Since this part is prior art, no detailed introduction will be made here. Since a substrate body 12 is placed on the support 11 by a manipulator, and the manipulator has good stability in clamping the substrate body 12 and will not cause the substrate body 12 to rotate or shift. At the same time, the manipulator moves back and forth and then moves downward to place a substrate body 12 on the support 11, or the manipulator moves left and right and then moves downward to place a substrate body 12 on the support 11. If the substrate body 12 is offset during placement, it may be slightly offset forward and backward or slightly offset left and right. Therefore, while correcting and fixing the deviation through the automatic locking component 13, the welding holes on the substrate body 12 can be made to coincide with the solder paste storage cavity 6 and the lamp beads adsorbed by the suction cup assembly 7.

[0038] Finally, take out the welded substrate body 12, place another substrate body 12 on the bracket 11, and then, by the same token as described above, the welding work between the other substrate body 12 and the LED lamp beads can be carried out. Therefore, the entire welding device can perform continuous welding work on multiple substrate bodies 12, improving the welding efficiency. At the same time, the temporary storage disk 8 can also be installed on the outer casing 1 on the right side of the support plate 4. In this way, when the solder paste storage cavity 6 applies the paste, the suction cup assembly 7 can adsorb multiple LED lamp beads, facilitating the subsequent direct placement of multiple LED lamp beads on the suction cup assembly 7 at the same time. Therefore, the time spent in the entire welding process can be further shortened, and thus the welding efficiency can be further improved.

[0039] Embodiment 2: The welding device for LED lamp beads and substrates in this embodiment, on the basis of Embodiment 1, not only does not require an additional power source, but also can automatically clamp and fix the substrate body 12 and automatically release the clamping and fixing, thus further improving the subsequent welding efficiency. The specific structure is as shown in the attached Figures 1 - 6 figure. An automatic locking assembly 13 is sleeved outside the bracket 11. The automatic locking assembly 13 includes a calibration frame 131 and a locking frame 132. A circular locking frame 132 is installed below the calibration frame 131 in the shape of a funnel. The diameter of the upper part of the calibration frame 131 is larger than the diameter of the lower part of the calibration frame 131, and the diameter of the lower part of the calibration frame 131 is equal to the diameter of the locking frame 132. The bottom surfaces of the locking frame 132 and the bracket 11 are both connected to the upper surface of the outer casing 1 through spring support columns 14. The spring support column 14 is composed of a manual telescopic rod and a return spring. A circular self-control plate 3 is installed outside the control rod 2 below the support plate 4, and an arc-shaped self-control groove 301 is opened on the bottom surface of the self-control plate 3. The arc length of the self-control groove 301 is less than one-fourth of the circumference of the self-control plate 3. A convex rod 15 is installed on the rear side of the bracket 11, and a fixing plate 161 is fixed on the front side of the bracket 11. The rear end of the convex rod 15 and the front end of the fixing plate 161 respectively penetrate through the slots opened on the front and rear sides of the locking frame 132. A connecting spring 151 installed in the slot on the front side of the locking frame 132 is connected to the convex rod 15. The front end of the fixing plate 161 is connected to the first rack assembly 16. A transmission gear 18 is installed above the outer casing 1. The left and right sides of the transmission gear 18 are respectively meshed with the first rack assembly 16 and the second rack assembly 17. The second rack assembly 17 is installed on the front side of the locking frame 132, and the first rack assembly 16 and the second rack assembly 17 move towards each other.

[0040] When the manipulator places a substrate body 12 on the bracket 11 and starts the motor inside the outer shell 1, when the motor drives the control rod 2 to rotate clockwise by 90°, at this time the control rod 2 drives the self-control plate 3 and the self-control groove 301 to rotate together. At this time, the arc-shaped self-control groove 301 separates from the convex rod 15, and the bottom surface of the self-control plate 3 is in contact with the convex rod 15, so that the self-control plate 3 exerts a downward thrust on the convex rod 15. Then the convex rod 15 moves downward in the groove on the rear side of the locking frame 132, and at the same time squeezes and stores energy in the connecting spring 151. The convex rod 15 drives the bracket 11 and the substrate body 12 to move downward. At this time, the spring support column 14 on the bottom surface of the bracket 11 is compressed. When the bracket 11 moves downward, it drives the first rack assembly 16 to move downward together through the fixing plate 161. At this time, the fixing plate 161 moves downward in the groove on the front side of the locking frame 132. At this time, the first rack assembly 16 drives the meshing transmission gear 18 to rotate. When the transmission gear 18 rotates, it drives the second rack assembly 17 to move upward. The second rack assembly 17 drives the locking frame 132 and the calibration frame 131 to move upward. At this time, the spring support column 14 on the bottom surface of the locking frame 132 is stretched. At this time, the funnel-shaped calibration frame 131 can correct the position of the misaligned substrate body 12, so that the center of the substrate body 12 and the center of the bracket 11 are on the same vertical line. Then the locking frame 132 moves to a position where the inner side wall is in contact with the outer side surface of the substrate body 12, so that the locking frame 132 can clamp and fix the position of the substrate body 12, avoiding the movement of the substrate body 12 and affecting the subsequent welding work. Then the welding work can be carried out as shown in Embodiment 1. After the welding process is completed, after the self-control plate 3 and the self-control groove 301 rotate, the self-control groove 301 contacts the convex rod 15 again, so that the convex rod 15 automatically moves upward into the self-control groove 301 through the stored energy of the connecting spring 151. Similarly as described above, the bracket 11 moves upward to reset, and the automatic locking assembly 13 moves downward to reset, so as to automatically release the clamping operation on the substrate body 12, facilitating the placement of the next substrate body 12, thereby improving the welding efficiency and completing a series of work.

[0041] Although the present invention has been described in detail with reference to the foregoing embodiments, for those skilled in the art, they can still modify the technical solutions recorded in the foregoing embodiments, or perform equivalent replacements on some of the technical features. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. A device for welding an LED lamp bead to a substrate, comprising an outer shell (1), and a control rod (2) mounted at a middle position above the outer shell (1), wherein the top end of the control rod (2) is connected to a support plate (4), and characterized in that: Three groups of supporting and regulating mechanisms (5) are installed above the support plate (4), and the solder paste storage chamber (6), the suction cup assembly (7) and the hot air gun (9) are supported and installed respectively by the fixing frames (53) in the three groups of supporting and regulating mechanisms (5), and a temporary storage plate (8) is installed on the outer shell (1) below the suction cup assembly (7), and the outer side of the bottom surface of the solder paste storage chamber (6) is connected to a bottom frame (19) for automatically controlling the flow of the paste, and the bottom surfaces of the solder paste storage chamber (6) and the bottom surfaces of the bottom frame (19) are both provided with paste through holes (20), and the outer shell (1) in front of the support plate (4) is connected to a bracket (11) for placing a substrate body (12), and the outer side of the support plate (4) is provided with a side with an inclined shape. The temporary storage disk (8) has a fixed block (41), the temporary storage disk (8) has the same shape as the base plate body (12), the number of groups of paste through holes (20) in the solder paste storage cavity (6) and the bottom surface of the bottom frame (19) is the same as the number of slots on the temporary storage disk (8), and they correspond one to one, and each group of paste through holes (20) is provided with two, the bottom frame (19) is rotatably connected to the solder paste storage cavity (6), and the top of the bottom frame (19) is connected to a vortex spring (191) nested on the outside of the solder paste storage cavity (6), and a side surface of the bottom frame (19) close to the support plate (4) is provided with an arc-shaped regulating protrusion (192), the regulating protrusion (192) is provided above the fixed block (41), and the regulating protrusion (192) forms a rotating structure through the fixed block (41).

2. The device for welding an LED lamp bead to a substrate according to claim 1, characterized in that: The support and control mechanism (5) comprises a support frame (51), a first electric push rod (52) and a fixed frame (53). The support frame (51) is in an inverted "U" shape and is mounted on the support plate (4). A first electric push rod (52) for controlling the lifting of the fixed frame (53) is fixed inside the upper part of the support frame (51). The output end of the first electric push rod (52) is connected to the fixed frame (53). The lengths of the three sets of fixed frames (53) are different.

3. The device for welding an LED lamp bead to a substrate according to claim 1, characterized in that: The interior of the solder paste storage chamber (6) is fitted with a piston assembly (61), and the upper surface of the piston assembly (61) is connected to the output end of a second electric push rod (62) installed through the interior of the upper part of the solder paste storage chamber (6).

4. The device for welding an LED lamp bead to a substrate according to claim 1, characterized in that: A funnel-shaped air outlet cover (10) is installed on the bottom surface of the hot air gun (9).

5. The device for welding an LED lamp bead to a substrate according to claim 1, characterized in that: The outer side of the bracket (11) is sleeved with an automatic locking component (13), and the automatic locking component (13) comprises a correction frame (131) and a locking frame (132), and a circular locking frame (132) is installed below the correction frame (131) in a funnel shape, the upper diameter of the correction frame (131) is larger than the lower diameter of the correction frame (131), and the lower diameter of the correction frame (131) is equal to the diameter of the locking frame (132).

6. The device for welding an LED lamp bead to a substrate according to claim 5, characterized in that: The bottom surface of the locking frame (132) and the bottom surface of the bracket (11) are connected to the upper surface of the outer shell (1) via a spring support column (14), and the spring support column (14) is composed of a manual telescopic rod and a reset spring.

7. The device for welding an LED lamp bead to a substrate according to claim 5, characterized in that: A circular self-control plate (3) is installed on the outer side of the control rod (2) below the support plate (4), and an arc-shaped self-control groove (301) is provided on the bottom surface of the self-control plate (3), wherein the arc length of the self-control groove (301) is less than one quarter of the circumference of the self-control plate (3).

8. The device for welding an LED lamp bead to a substrate according to claim 7, characterized in that: A protruding rod (15) is installed on the rear side of the bracket (11), and a fixing plate (161) is fixed on the front side of the bracket (11). The rear end of the protruding rod (15) and the front end of the fixing plate (161) respectively penetrate the grooves provided on the front and rear sides of the locking frame (132). A connecting spring (151) installed in the groove on the front side of the locking frame (132) is connected to the protruding rod (15). The front end of the fixing plate (161) is connected to the first rack assembly (16). A transmission gear (18) is installed above the outer shell (1). The left and right sides of the transmission gear (18) are respectively meshed with the first rack assembly (16) and the second rack assembly (17). The second rack assembly (17) is installed on the front side of the locking frame (132). The first rack assembly (16) and the second rack assembly (17) move toward each other.

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