Laser-assisted stamping processing method and processing device for high silicon steel sheet

Abstract

The invention relates to a laser-assisted stamping processing method for a high silicon steel sheet, which comprises the following steps: performing laser pre-cutting on a segmented high silicon steel strip with the depth of laser pre-cutting being 25-50% of the thickness of the high silicon steel strip, then conveying the pre-cut high silicon steel strip to a stamping platform through a conveyor belt for stamping operation, and meanwhile, performing laser pre-cutting on the high silicon steel strip to obtain a high silicon steel sheet with the depth of laser pre-cutting being 25-50% of the thickness of the high silicon steel sheet. And when the next section of high-silicon steel strip is subjected to laser pre-cutting, the cutting machine and the punching machine work synchronously and coordinately, and during punching operation, the radius of the punching die is smaller than the radius of laser cutting, so that the contact stress between the die and the high-silicon steel strip during punching is reduced. Firstly, a laser cutting mode is adopted for pre-cutting a high silicon steel strip, and the influence of magnetic performance deterioration caused by laser cutting is reduced; and stamping is adopted to reduce the stress of the material, so that a product with a complete edge is obtained, burrs and cracks on the edge are reduced, a high-precision product is obtained, meanwhile, the machining efficiency is improved, the rejection rate is reduced, and the cost is reduced.

Description

Technical Field

[0001] The invention relates to the technical field of high silicon steel sheet processing, in particular to a laser-assisted stamping processing method and a processing device for high silicon steel sheets. Background Art

[0002] High silicon steel is a key soft magnetic material in the field of power electronics. Current mainstream processing technologies have significant limitations when dealing with high silicon steel materials: the mechanical blanking process is limited by the lack of ductility of the material at room temperature, which can easily cause micro-cracks on the cross section and edge delamination defects, seriously affecting the material forming accuracy and yield rate; cracks and fractures are prone to occur during the direct stamping process on existing stamping equipment, resulting in an extremely low yield rate, making it difficult to obtain complete products, and making it impossible to directly stamp and produce them; conventional sawing processing leads to frequent edge collapse due to concentrated cutting stress, making it difficult to meet the requirements of precision device processing.

[0003] If the laser cutting process is adopted, the rapid cooling of the material caused by local high temperature during direct laser cutting can easily lead to cracks or local damage at the cutting edge, which will not only reduce the mechanical properties of the material, but also cause significant deterioration of the magnetic properties due to microstructural changes affected by heat, ultimately affecting the comprehensive performance indicators of the product.

[0004] Therefore, the market is in urgent need of an improved laser-assisted stamping processing method for high-silicon steel and high-brittle soft magnetic materials. The high-silicon steel and high-brittle soft magnetic materials here refer to silicon steel sheets with a silicon content between 3.2% and 6.5%, and are high-brittle materials that are prone to fracture and failure due to their elongation less than 5%. Summary of the invention

[0005] The purpose of the present invention is to provide an improved laser-assisted stamping processing method and processing device for high-silicon steel sheets. By improving the processing technology and structure, the cracks and fractures generated during the stamping process are solved, the yield rate of high-silicon steel sheets is improved, the cost is reduced, and the processing accuracy is improved.

[0006] In order to achieve the above-mentioned purpose, the technical solution of the present invention is: a laser-assisted stamping processing method for high-silicon steel sheets, characterized in that: the processing method comprises the following steps: a. laser pre-cutting the segmented high-silicon steel strip, and the depth of the laser pre-cutting is 25-50% of the thickness of the high-silicon steel strip; b. the pre-cut high-silicon steel strip is sent to the stamping platform via a conveyor belt for stamping operation, and at the same time, the next section of high-silicon steel strip is laser pre-cut, and the laser cutting and the stamping machine work synchronously and coordinatedly; c. during the stamping operation, the radius of the stamping die is smaller than the radius of the laser cutting, which optimizes the contact surface between the die and the material during stamping and reduces the contact stress between the die and the high-silicon steel strip during stamping.

[0007] Preferably, in step a, different laser pre-cutting thicknesses h are set according to different high silicon steel strip thicknesses t and silicon content mass fractions s, and the piecewise function between the three is as follows: .

[0008] Furthermore, in step b, in order to make the laser cutting machine and the stamping machine work synchronously and coordinately, the laser cutting time T is set. 1 , the time for developing one film is T 2 , and the relationship between the number of laser cutting N is as follows: Laser cutting path length: ; Among them, the outer radius of the motor stator , stator inner radius , number of slots , slot width , total length of the inner wall of the groove ; Laser cutting time: ; Among them, the laser cutting speed ; Processing time for one film: ; Laser cutting quantity: ,in It is the time it takes for the machine to wait for the next high silicon steel strip to move to the designated position after punching one sheet.

[0009] Furthermore, in step c, the radius of the stamping die is set , where the laser cutting radius is , the laser cut width is .

[0010] A processing device for a laser-assisted stamping processing method for high-silicon steel sheets, characterized in that: the processing device includes a coil unwinding rack, a shearing machine, a cutting platform and a stamping platform, the shearing machine and the cutting platform, and the cutting platform and the stamping platform are all connected by a conveyor belt; at least two cutting machines are arranged in parallel on the cutting platform, and a stamping machine cooperating with the stamping platform is provided on one side of the stamping platform.

[0011] Preferably, a roller transmission mechanism is provided on the stamping platform, the stamping machine is provided with a stamping head, a stamping die is provided below the stamping head, and the stamping die and the stamping head are connected through a slider assembly; a first and a second flywheel are respectively provided on both sides of the stamping head, and a group of cylinders for controlling the slider assembly is provided above the stamping head.

[0012] Furthermore, the radius of the stamping die , where the laser cutting radius is , the laser cut width is .

[0013] Furthermore, the cutting platform includes a machine tool bed and machine tool supporting feet arranged under the machine tool bed, and a transmission mechanism is provided on the machine tool bed; each cutting machine is provided with two parallel cutting heads, and the cutting heads perform laser pre-cutting on the high-silicon steel strip placed on the machine tool bed along the Z-axis direction under the control of the cutting machine.

[0014] Furthermore, a protruding rotating shaft is provided on one side of the coil unwinding rack, and the coiled high-silicon steel strip is mounted on the rotating shaft; a material inlet is provided on one side of the shearing machine, and a material sorting rack is provided at the material inlet, and one end of the high-silicon steel strip is placed into the material inlet after passing through the material sorting rack.

[0015] Compared with the prior art, the technical solution of the present invention not only improves the overall technical solution, but also includes many improvements in details. Specifically, it has the following beneficial effects: 1. The improvement scheme described in the present invention adopts a composite processing technology of laser pre-cutting and then stamping for high silicon steel strips. The high silicon steel strips are first pre-cut by laser cutting to reduce the deterioration of magnetic properties caused by laser cutting; then stamping is used to reduce the stress of the material, thereby obtaining a product with complete edges, reducing burrs and cracks on the edges, and obtaining a high-precision product, while improving processing efficiency, reducing scrap rate, and reducing costs; 2. In the technical solution of the present invention, the segmented high silicon steel strip is pre-cut by laser, and the depth of the laser pre-cutting is 25-50% of the thickness of the high silicon steel strip. Since the cutting depth is shallow, the laser cutting speed can be significantly improved, thereby reducing the processing time and improving the processing efficiency; at the same time, the shallow cutting depth helps to reduce the thermal impact of laser cutting on the high silicon steel strip, further reduce the deterioration of magnetic properties, and ensure the quality of the finished product; 3. In the process of the present invention, the pre-cut high silicon steel strip is sent to the stamping platform through a conveyor belt for stamping operation. At the same time, the next section of high silicon steel strip is being pre-cut by laser. The cutting machine and the stamping machine work synchronously and coordinately, which significantly improves the processing efficiency and reduces the production cost. 4. In the process method of the present invention, during the stamping operation, the radius of the stamping die is smaller than the radius of the laser cutting, which optimizes the contact surface between the die and the material during stamping, reduces the appearance of burrs on the stamping section, and reduces the contact stress between the die and the material during stamping, thereby extending the service life of the die; further, the smaller die size reduces the difficulty of material processing and improves the processing accuracy; due to the previous pre-cutting process, the effective stamping depth of the high silicon steel strip is reduced in the stamping process, the punching force required by the stamping machine is reduced, the energy consumption of the equipment is reduced, and the service life is extended; 5. In the structure of the present invention, the processing device includes a coil unwinding rack, a shearing machine, a cutting platform and a punching platform. The shearing machine and the cutting platform, as well as the cutting platform and the punching platform are connected by conveyor belts. The entire equipment has a compact and reasonable layout and efficient operation, which can meet the needs of high-quality mass production, further improve the integrity and yield rate of the product, and has great market promotion and utilization value. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a structural schematic diagram of the present invention.

[0017] Figure 2 It is another structural schematic diagram of the present invention.

[0018] Figure 3 It is a schematic structural diagram of the cooperation between the plate shearing machine and the coil unwinding rack of the present invention.

[0019] Figure 4 It is a schematic structural diagram of the punching machine of the present invention.

[0020] Figure 5 It is a schematic structural diagram of the cutting platform of the present invention.

[0021] Figure 6 It is a schematic diagram of a section of processed high silicon steel strip according to the present invention.

[0022] Figure 7 for Figure 6 A partial enlarged schematic diagram of .

[0023] Figure 8 It is a schematic diagram of the processing cooperation between the stamping die and the high silicon steel strip of the present invention.

[0024] Reference numerals: 1 coil unwinding rack, 2 shearing machine, 3 cutting platform, 4 stamping platform, 5 high silicon steel strip; 11 rotating shaft; 21 Material storage rack; 31 machine tool bed, 32 machine tool support legs, 33 transmission mechanism, 34 cutting head; 40 roller transmission mechanism 41 punch head, 42 punch die, 43 slider assembly, 44 first flywheel, 45 second flywheel, 46 cylinder, 47 electrical control system, 48 pneumatic clutch, 49 punch press. DETAILED DESCRIPTION

[0025] The technical solution of the present invention will be described clearly and completely below in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0026] The present invention provides a laser-assisted stamping processing method for high-silicon steel sheets, and the processing method comprises the following steps: a. laser pre-cutting segmented high-silicon steel strips, wherein the depth of the laser pre-cutting is 25-50% of the thickness of the high-silicon steel strips; b. the pre-cut high-silicon steel strips are sent to a stamping platform via a conveyor belt for stamping, and at the same time, the next segment of high-silicon steel strips are laser pre-cut, and the cutting machine and the stamping machine work synchronously and in coordination; c. during the stamping operation, the radius of the stamping die is smaller than the radius of the laser cutting, so as to reduce the contact stress between the die and the high-silicon steel strip during stamping.

[0027] The present invention effectively reduces the mechanical stress caused by stamping, reduces the deterioration of magnetic properties, and improves processing efficiency and product quality through laser pre-cutting and stamping composite processing technology. Specifically, the laser pre-cutting of the present invention calculates a reasonable pre-cutting depth according to the thickness of the high-silicon steel strip and the mass fraction of silicon content. Since the depth is 25%-50% of the high-silicon steel strip, the cutting thickness is shallow, which can significantly increase the cutting speed, reduce the processing time, and further improve the processing efficiency. At the same time, the smoothness and dimensional accuracy of the cutting edge are ensured, and the difficulty and defect rate of subsequent stamping processing are reduced.

[0028] In the stamping process of the present invention, a stamping die of special specifications is designed, and the size of the stamping die can be designed to be half the width of the laser cut mark smaller than the size of the pre-cut cut mark. This design optimizes the contact surface between the die and the material during stamping, reduces the burrs on the stamping section, improves the processing accuracy, and reduces the contact stress between the die and the material during stamping, thereby extending the service life of the die. The collaborative operation of laser cutting and stamping technology realizes an efficient processing flow and significantly improves production efficiency.

[0029] The technical solution of the present invention breaks through the limitations of traditional processing methods in the mass production of high silicon steel and high brittle soft magnetic materials, and can achieve efficient and high-quality production of high brittle soft magnetic materials. At the same time, the technical solution successfully retains the magnetic properties of the material, ensures the integrity and yield rate of the product, further improves the processing accuracy of the product, and reduces the production cost.

[0030] Example 1 In this embodiment, the processing method includes the following steps: a. Pre-cut the segmented high silicon steel strip by laser, and the depth of the laser pre-cutting is 25-50% of the thickness of the high silicon steel strip. Due to the shallow cutting depth, the laser cutting speed can be significantly improved, thereby reducing the processing time and improving the processing efficiency. At the same time, the shallow cutting depth helps to reduce the thermal impact of laser cutting on the material and further reduce the deterioration of magnetic properties; b. The pre-cut high silicon steel strip is sent to the stamping platform through a conveyor belt for stamping. At the same time, the next section of high silicon steel strip is being pre-cut by laser, and the cutting machine and the stamping machine work synchronously and coordinately. Specifically, the laser cutting equipment is equipped with N laser heads, each laser head accurately cuts a pre-cut part on this section of the strip within T minutes, and the cut strip is sent to the stamping machine. At the same time, the shearing machine transfers a new section of strip and continues the cutting and stamping operations, thereby realizing the synchronous operation of stamping and laser cutting and significantly improving the processing efficiency; c. During the stamping operation, the radius of the stamping die is smaller than the radius of the laser cutting, which reduces the contact stress between the die and the high-silicon steel strip during stamping and extends the service life.

[0031] Specifically, in step a, different laser pre-cutting thicknesses h are set according to different high silicon steel strip thicknesses t and silicon content mass fractions s. The piecewise function between the three is as follows: .

[0032] In step b, in order to make the cutting machine and the punching machine work synchronously and coordinately, the laser cutting time T is set. 1 , the time for developing one film is T 2 , and the relationship between the number of laser cutting N is as follows: Laser cutting path length: ; Among them, the outer radius of the motor stator , stator inner radius , number of slots , slot width , total length of the inner wall of the groove ; Laser cutting time: ; Among them, the laser cutting speed ; Processing time for one film: ; Laser cutting quantity: ,in It is the time it takes for the machine to wait for the next high silicon steel strip to move to the designated position after punching one sheet.

[0033] In step c, set the radius of the stamping die , where the laser cutting radius is , the laser cut width is .

[0034] In summary, this embodiment adopts laser pre-cutting and stamping composite processing technology, and firstly pre-cuts the high silicon steel sheet by laser cutting, which not only improves the cutting speed and quality, but also reduces the deterioration of magnetic properties caused by laser cutting. Then, the pre-cut high silicon steel sheet is sent to the stamping process through the conveying mechanism, and the stamping die is used in the stamping process to reduce the stress between the die and the material, so as to obtain a complete and high-quality product, and realize the improvement of processing efficiency and quality.

[0035] Example 2

[0036] In this embodiment, a processing device for a laser-assisted stamping processing method for high-silicon steel sheets is described. The processing device includes a coil unwinding rack, a shearing machine, a cutting platform and a stamping platform. The shearing machine and the cutting platform, and the cutting platform and the stamping platform are connected by a conveyor belt for conveying the high-silicon steel strip to be processed; at least two cutting machines are arranged in parallel on the cutting platform, which can synchronously laser pre-cut the high-silicon steel strip placed on the cutting platform; a stamping machine is provided on one side of the stamping platform to cooperate with it for stamping the high-silicon steel strip placed on the stamping platform.

[0037] Specifically, a protruding rotating shaft 11 is provided on one side of the coil unwinding rack 1, and the coiled high-silicon steel strip is mounted on the rotating shaft; a material inlet is provided on one side of the shearing machine 2, and a material sorting rack 21 is provided at the material inlet. One end of the high-silicon steel strip passes through the material sorting rack and is put into the material inlet, and then the high-silicon steel strip is cut into sections with the shearing machine. The high-silicon steel strip after section cutting is sent to the cutting platform through a conveyor belt for subsequent laser pre-cutting.

[0038] Furthermore, the cutting platform 3 includes a machine tool bed 31 and a machine tool supporting foot 32 arranged under the machine tool bed. A transmission mechanism 33 is provided on the machine tool bed to transmit the high-silicon steel strip to be cut; each cutting machine is provided with two parallel cutting heads 34, and the cutting heads move up and down along the Z-axis direction under the control of the cutting machine, so as to perform laser pre-cutting on the high-silicon steel strip placed on the machine tool bed. The high-silicon steel strip after laser pre-cutting is sent to the subsequent stamping platform via a conveyor belt.

[0039] The stamping platform 4 is provided with a roller transmission mechanism 40, the stamping machine is provided with a stamping head 41, a stamping die 42 is provided below the stamping head, and the stamping die is connected to the stamping head through a slider assembly 43; the first and second flywheels 44 and 45 are provided on both sides of the stamping head, respectively, and a group of cylinders 46 for controlling the slider assembly is provided above the stamping head. When working, the cylinder drives the slider assembly to move downward, and the slider assembly drives the stamping die to stamp the high silicon steel strip downward to complete the processing of the product. Among them, the radius of the stamping die is , where the laser cutting radius is , the laser cut width is . The radius of the stamping die is smaller than that of the laser cutting, which optimizes the contact surface between the die and the material during stamping, reduces the appearance of burrs on the stamping section, and reduces the contact stress between the die and the material during stamping, thereby extending the service life of the die. Furthermore, the smaller die size reduces the difficulty of material processing and improves processing accuracy; due to the previous pre-cutting process, the effective stamping depth of high-silicon steel strip is reduced during the stamping process, which reduces the punching force required by the stamping machine, reduces the energy consumption of the equipment, and extends the service life.

[0040] Example 3

[0041] In this embodiment, the high silicon steel strip is firstly pre-cut by laser, and the laser pre-cutting depth is 25% to 50% of the thickness of the silicon steel strip. Due to the shallow cutting depth, the laser cutting speed can be significantly improved, thereby reducing the processing time and improving the processing efficiency. At the same time, the shallow cutting depth helps to reduce the thermal impact of laser cutting on the material, and further reduce the deterioration of magnetic properties. In addition, the high-precision characteristics of laser cutting can ensure the smoothness and dimensional accuracy of the cutting edge, reduce the difficulty and defect rate of subsequent stamping processing; specifically, the higher the silicon content, the more brittle the material, and the greater the required pre-cutting depth. It was found in the experiment that the thinner high silicon steel strip with a thickness of 0.02 to 0.2 mm and a high silicon steel strip with a mass fraction of 3.2wt% can be pre-cut to a thickness of 25%; the high silicon steel strip with a mass fraction of 5wt% can be pre-cut to a thickness of 33.3%, and the high silicon steel strip with a mass fraction of 5wt% can be pre-cut to a thickness of 40%. For high silicon steel strips with a thickness of 0.2~0.02mm, high silicon steel strips with a mass fraction of 3.2wt% can be pre-cut to a thickness of 30%; high silicon steel strips with a mass fraction of 5wt% can be pre-cut to a thickness of 40%; high silicon steel strips with a mass fraction of 5wt% can be pre-cut to a thickness of 50%, and the remaining ranges show a linear relationship, as follows: (1) When hour: It is known that when S=3.2, h=0.25t; when S=5, h=1 / 3t; when s=6.5, h=0.4t; ① When When , according to the linear interpolation formula: , Here x=s, x 1 =3.2,y 1 =0.25t,y 2 =1 / 3t, we can get: ; ; ② When When x 1 =5,x 2 =6.5,y 1 =1 / 3t,y 2 =0.4t, then: ; .

[0042] (2) When hour, It is known that when s=3.2, h=0.3t; when s=5, h=0.4t; when s=6.5, h=0.5t; ① When When, according to the linear interpolation formula, x 1 =3.2,x 2 =5,y 1 =0.3t,y 2 =0.4t, we can get: ; ; ② When When x 1 =5,x 2 =6.5,y 1 =0.4t,y 2 =0.5t, then: ; ; Finally, the complete piecewise function is obtained: .

[0043] Then, the pre-cut high-silicon steel strip is sent to the stamping platform through a conveyor belt for stamping operations. At the same time, the next section of high-silicon steel strip is being pre-cut by laser, and the cutting machine and the stamping machine work synchronously and in coordination. For example, it takes about T minutes to stamp a section of high-silicon steel strip with N pre-cut parts, and the laser cutting equipment can also complete the corresponding cutting task within T minutes. Specifically, the laser cutting equipment is equipped with N laser heads, each of which accurately cuts a pre-cut part on this section of high-silicon steel strip within T minutes, and transfers the cut strip to the stamping machine. At the same time, the shearing machine transfers a new section of the strip and continues the cutting and stamping operations, thereby realizing the synchronous operation of stamping and laser cutting, significantly improving processing efficiency.

[0044] Specifically, the laser cutting path length is: ; Among them, the outer radius of the motor stator (mm), stator inner radius (mm), number of slots , slot width (mm), total length of the inner wall of the groove (mm); Laser cutting time: Among them, laser cutting speed (s / mm); Processing time for one film: ; Laser cutting quantity: ,in It is the time it takes for the machine to wait for the next high silicon steel strip to move to the designated position after punching one sheet.

[0045] Next, during the stamping operation, the radius of the stamping die is smaller than the radius of the laser cutting, which reduces the contact stress between the die and the high-silicon steel strip during stamping. This design optimizes the contact surface between the die and the material during stamping, reduces the burrs on the stamping section, and reduces the contact stress between the die and the material during stamping, thereby extending its service life. At the same time, the smaller die size reduces the difficulty of material processing and improves processing accuracy. In addition, the pre-cutting process reduces the effective stamping depth, reduces the force required for stamping, reduces equipment energy consumption, and further improves processing efficiency and economy.

[0046] Set the radius of the punch die , where the laser cutting radius is (mm), laser cut width is (mm).

[0047] The advantages of the present invention are as follows: 1. We have built an automated production line suitable for high silicon steel, which has realized the efficient cutting process of highly brittle soft magnetic materials and can obtain high-quality silicon steel sheets; 2. By setting the laser pre-cutting process, the laser cutting speed is significantly increased, the processing time is reduced, and the processing efficiency is improved. At the same time, the shallow cutting depth reduces the thermal impact of laser cutting on the material and reduces the deterioration of the magnetic properties of high-silicon steel strips. In addition, the high-precision characteristics of laser cutting ensure the smoothness and dimensional accuracy of the cutting edge of the strip, reducing the difficulty of subsequent stamping processing and reducing the defect rate; 3. Use laser pre-cutting and stamping process to work together, and arrange the sequence of laser cutting and stamping reasonably to achieve efficient processing flow. For example, after stamping a length of strip, the laser cutting equipment completes the corresponding cutting task during this period of time, and transmits the cut strip to the stamping machine. At the same time, the shearing machine transmits a new section of strip to continue cutting and stamping operations, thus achieving synchronous and efficient operation of stamping and laser cutting; 4. After pre-cutting, the size of the stamping die can be designed to be half the width of the laser cut mark smaller than the pre-cutting cut mark, which reduces the burrs on the stamping section and reduces the contact stress between the die and the material during stamping, effectively reducing die wear and extending its service life. At the same time, the smaller die size reduces the difficulty of material processing, improves processing accuracy, reduces the force required for stamping, and reduces equipment energy consumption. Due to the coordinated operation of laser pre-cutting and stamping processing, the production rate of the production line is equivalent to the traditional direct stamping rate, thus realizing efficient mass production of highly brittle soft magnetic materials.

[0048] The above content is a further detailed description of the present invention in combination with specific preferred embodiments, and it cannot be determined that the specific implementation of the present invention is limited to the above descriptions. For ordinary technicians in the technical field to which the present invention belongs, several simple deductions or substitutions can be made without departing from the concept of the present invention, which should be regarded as falling within the scope of protection of the present invention.

Claims

1. A laser-assisted stamping method for high silicon steel sheets, characterized in that: The processing method comprises the following steps: a. pre-cutting the segmented high silicon steel strip with laser, the depth of laser pre-cutting being 25-50% of the thickness of the high silicon steel strip; b. sending the pre-cut high silicon steel strip to the stamping platform via a conveyor belt for stamping operation, while the next segment of high silicon steel strip is pre-cut with laser, and the cutting machine and the stamping machine work synchronously and in coordination; c. during the stamping operation, the radius of the stamping die is smaller than the radius of the laser cutting, so as to reduce the contact stress between the die and the high silicon steel strip during stamping.

2. The laser-assisted stamping method for high silicon steel sheet according to claim 1, characterized in that: In step a, different laser pre-cutting thicknesses h are set according to different high silicon steel strip thicknesses t and silicon content mass fractions s. The piecewise function between the three is as follows: 。 3. The laser-assisted stamping method for high silicon steel sheet according to claim 1, characterized in that: In step b, in order to make the cutting machine and the punching machine work synchronously and coordinately, the relationship between the laser cutting time T1, the time for punching one sheet T2, and the number of laser cutting N is set as follows: Laser cutting path length: ; Among them, the outer radius of the motor stator , stator inner radius , number of slots , slot width , total length of the inner wall of the groove ; Laser cutting time: ; Among them, the laser cutting speed ; Processing time for one film: ; Laser cutting quantity: ,in It is the time it takes for the machine to wait for the next high silicon steel strip to move to the designated position after punching one sheet.

4. The laser-assisted stamping method for high silicon steel sheet according to claim 1, characterized in that: In step c, set the radius of the stamping die , where the laser cutting radius is , the laser cut width is .

5. The processing device of the laser-assisted stamping method for high silicon steel sheet according to claim 1, characterized in that: The processing device includes a coil unwinding rack, a shearing machine, a cutting platform and a punching platform. The shearing machine and the cutting platform, and the cutting platform and the punching platform are connected by a conveyor belt. At least two cutting machines are arranged in parallel on the cutting platform, and a punching machine is provided on one side of the punching platform to cooperate with it.

6. The processing device of the laser-assisted stamping method for high silicon steel sheet according to claim 5, characterized in that: A roller transmission mechanism is provided on the stamping platform, the stamping machine is provided with a stamping head, a stamping die is provided below the stamping head, and the stamping die and the stamping head are connected through a slider assembly; a first and a second flywheel are provided on both sides of the stamping head respectively, and a group of cylinders for controlling the slider assembly is provided above the stamping head.

7. The processing device of the laser-assisted stamping method for high silicon steel sheet according to claim 6, characterized in that: Radius of stamping die , where the laser cutting radius is , the laser cut width is .

8. The processing device of the laser-assisted stamping method for high silicon steel sheet according to claim 5, characterized in that: The cutting platform includes a machine bed and machine support feet arranged under the machine bed, and a transmission mechanism is arranged on the machine bed; each cutting machine is provided with two parallel cutting heads, and the cutting heads perform laser pre-cutting on the high silicon steel strip placed on the machine bed along the Z-axis direction under the control of the cutting machine.

9. The processing device of the laser-assisted stamping method for high silicon steel sheet according to claim 5, characterized in that: A protruding rotating shaft is provided on one side of the coil unwinding rack, and the coiled high silicon steel strip is mounted on the rotating shaft; a material inlet is provided on one side of the shearing machine, and a material sorting rack is provided at the material inlet, and one end of the high silicon steel strip is put into the material inlet after passing through the material sorting rack.

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