Laser processing system and method based on acousto-optic deflector

Abstract

The invention provides a laser processing system and method based on an acousto-optic deflector. The laser processing system comprises an XYZ motion platform, a controller, a laser, an acousto-optic deflection assembly, a galvanometer and a focusing field lens. The XYZ motion platform drives a workpiece to be machined to move below the machining breadth of the galvanometer, the acousto-optic deflection assembly and the galvanometer modulate the machining path of a laser beam, the acousto-optic deflection assembly, the galvanometer and the XYZ motion platform are all electrically connected with the controller, and the controller controls the acousto-optic deflection assembly to compensate the motion speed and precision of the galvanometer and the XYZ motion platform in real time. The position of a workpiece to be machined is controlled through the XYZ motion platform, meanwhile, the machining path of a laser beam is modulated through the acousto-optic deflection assembly and the galvanometer, and by means of linkage control among the acousto-optic deflection assembly, the galvanometer and the XYZ motion platform, the acousto-optic deflection assembly compensates the motion speed and motion precision of the XYZ motion platform and the galvanometer in real time; therefore, high-speed and high-precision laser processing without frequent start and stop of the XYZ motion platform and the galvanometer is realized.

Description

Technical Field

[0001] The present invention belongs to the technical field of laser processing, and in particular relates to a laser processing system and method based on an acousto-optic deflector. Background Art

[0002] At present, there are acousto-optic, electro-optic, wave plate and other modulation methods to achieve the emission of circularly polarized light from laser optical systems. For example, Chinese patent CN119237966A discloses a method of using one or more rotating wave plates to adjust the light and then cooperate with a galvanometer to drill holes; however, because the galvanometer is a mechanical mirror that drives the lens to deflect the laser, this method has a slow response speed and low precision, and cannot modulate the laser beam in real time according to the processing requirements and in combination with the platform motion trajectory, and cannot meet the increasingly complex and higher precision laser processing requirements. Chinese patent CN117500629A discloses the control method and principle of an acousto-optic deflector (AOD); however, this method cannot be linked with the existing laser drilling platform to achieve high-speed, high-efficiency and uninterrupted laser processing requirements. Summary of the invention

[0003] The purpose of the present invention is to provide a laser processing system based on an acousto-optic deflector, which can at least solve some of the defects existing in the prior art.

[0004] To achieve the above object, the present invention adopts the following technical solution:

[0005] A laser processing system based on an acousto-optic deflector comprises an XYZ motion platform, a controller, a laser, and an acousto-optic deflection assembly, a galvanometer and a focusing field mirror sequentially arranged along the laser output light path; wherein the XYZ motion platform is used to carry a workpiece to be processed and drive the workpiece to move below the processing format of the galvanometer, the acousto-optic deflection assembly and the galvanometer are used to modulate the processing path of the laser beam, the acousto-optic deflection assembly, the galvanometer and the XYZ motion platform are all electrically connected to the controller, and the controller controls the acousto-optic deflection assembly to compensate the movement speed and accuracy of the galvanometer and the XYZ motion platform in real time.

[0006] Furthermore, the above-mentioned laser processing system based on the acousto-optic deflector also includes a paraxial positioning CCD for locating the position of the workpiece to be processed, the paraxial positioning CCD is located on one side of the galvanometer, and the paraxial positioning CCD is electrically connected to the controller.

[0007] Furthermore, the XYZ motion platform is provided with an adsorption fixture for vacuum adsorption of the workpiece to be processed, the flatness of the adsorption fixture is ≤5μm, and the parallelism between the adsorption fixture and the focusing field lens is ≤10μm.

[0008] Furthermore, the acousto-optic deflection assembly includes a beam expander, an acousto-optic deflector and an aperture which are sequentially arranged along the output light path of the laser; the beam expander is used to expand the diameter of the laser beam to the spot size required for entering the acousto-optic deflector; the acousto-optic deflector controls the deflection angle of the laser beam so that the first-order diffraction beam in the laser beam passes through the aperture.

[0009] Furthermore, the acousto-optic deflection assembly also includes a power detection device for detecting the output light power of the laser, and the power detection device is located on the laser light path between the laser and the beam expander.

[0010] Furthermore, a first lens is provided on the laser light path between the acousto-optic deflector and the aperture, and a second lens is provided on the laser light path between the aperture and the galvanometer.

[0011] Furthermore, the acousto-optic deflection assembly also includes a plurality of folding mirrors for changing the transmission direction of the laser.

[0012] Furthermore, there are one or more acousto-optic deflectors.

[0013] In addition, the present invention also provides a laser processing method based on an acousto-optic deflector, which is implemented by using the above-mentioned laser processing system and includes the following process:

[0014] The XYZ motion platform drives the workpiece to be processed to move below the galvanometer processing area. The galvanometer area is divided into several small areas according to the area of ​​the acousto-optic deflection assembly. After the galvanometer is deflected to several small areas in turn, the acousto-optic deflection assembly area performs laser processing within the small area.

[0015] Furthermore, the above-mentioned laser processing method based on the acousto-optic deflector also includes an XYZ motion platform driving the workpiece to be processed to move below the paraxial positioning CCD, locating one or more characteristic MARK points on the workpiece to be processed by the paraxial positioning CCD and calculating the precise positioning coordinates of the workpiece to be processed and transmitting them to the controller, and the controller then controls the XYZ motion platform to drive the workpiece to be processed to move below the galvanometer processing area.

[0016] Compared with the prior art, the present invention has the following beneficial effects:

[0017] The present invention controls the position of a workpiece to be processed by setting an XYZ motion platform, and modulates the processing path of a laser beam by setting an acousto-optic deflection assembly and a galvanometer. The linkage control among the acousto-optic deflection assembly, the galvanometer and the XYZ motion platform is utilized, so that the acousto-optic deflection assembly compensates the motion speed and motion accuracy of the XYZ motion platform and the galvanometer in real time, thereby realizing high-speed and high-precision laser processing without frequent start-stop of the XYZ motion platform, and effectively reducing the failure rate and wear rate of the XYZ motion platform and the galvanometer due to frequent start-stop.

[0018] The present invention will be further described in detail below with reference to the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 It is a structural schematic diagram of the laser processing system based on the acousto-optic deflector of the present invention;

[0020] Figure 2 is a schematic structural diagram of the acousto-optic deflection assembly of the present invention;

[0021] Figure 3 is a control schematic diagram of a laser processing system based on an acousto-optic deflector of the present invention;

[0022] Figure 4 It is a schematic diagram of the relative positions of the processing formats of the XYZ motion platform, the acousto-optic deflection assembly and the galvanometer in the present invention.

[0023] Explanation of the accompanying drawings: 1. Frame; 2. XYZ motion platform; 3. Adsorption fixture; 4. Paraxial positioning CCD; 5. Laser; 6. Acoustic-optic deflector; 7. Controller; 8. Power detection device; 9. Beam expander; 10. First lens; 11. Aperture; 12. Second lens; 13. Reflecting mirror; 14. Galvanometer; 15. Focusing field lens. DETAILED DESCRIPTION

[0024] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0025] In the description of the present invention, it should be understood that the terms "center", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating the orientation or position relationship are based on the orientation or position relationship shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0026] In the description of the present invention, it should be noted that, unless otherwise clearly stipulated and limited, the terms "installation", "connection" and "connection" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, a conflicting connection or an integral connection. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0027] The terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features; in the description of the present invention, unless otherwise specified, "plurality" means two or more.

[0028] like Figure 1 , Figure 2 , Figure 3 and Figure 4 As shown, this embodiment provides a laser processing system based on an acousto-optic deflector, comprising an XYZ motion platform 2, a controller 7, a laser 5, and an acousto-optic deflection assembly, a galvanometer 14, and a focusing field lens 15 sequentially arranged along the outgoing light path of the laser 5; wherein the XYZ motion platform 2 is used to carry the workpiece to be processed and drive the workpiece to be processed to move, the acousto-optic deflection assembly and the galvanometer 14 are used to modulate the processing path of the laser beam, the focusing field lens 15 is used to focus the modulated laser beam to the processing area, and adjust the parameters such as the size, shape and energy distribution uniformity of the light spot according to the processing requirements, and the acousto-optic deflection assembly, the galvanometer 14, the XY The Z motion platforms 2 are electrically connected to the controller 7, and laser processing is performed through the relative motion of the laser optical path and the XYZ motion platform 2. Since the XYZ motion platform 2 and the galvanometer 14 are driven by motors, the motor's own rotational inertia will prevent it from responding immediately after receiving a signal to change the motion speed or direction, thereby affecting the processing accuracy. In this embodiment, the controller 7 can be used to control the acousto-optic deflection assembly to compensate for the motion speed and accuracy of the galvanometer 14 and the XYZ motion platform 2 in real time. Preferably, the motion speeds between the galvanometer 14 and the XYZ motion platform 2 can be dynamically compensated for each other and the compensated information can be output to the controller 7 in real time.

[0029] Preferably, the laser processing system based on the acousto-optic deflector further includes a paraxial positioning CCD 4 for locating the position of the workpiece to be processed, the paraxial positioning CCD 4 is located on one side of the galvanometer 14 , and the paraxial positioning CCD 4 is electrically connected to the controller 7 .

[0030] The specific process of laser processing using the laser processing system based on the acousto-optic deflector of this embodiment is as follows: place the workpiece to be processed on the XYZ motion platform 2, set the processing template and parameters according to the needs, start the laser processing system, the XYZ motion platform 2 drives the workpiece to be processed to move below the paraxial positioning CCD 4, the paraxial positioning CCD 4 locates one or more feature MARK points on the workpiece to be processed and calculates the precise positioning coordinates of the workpiece to be processed, the XYZ motion platform 2 drives the workpiece to be processed to move below the processing format of the galvanometer 14, the format of the galvanometer 14 is divided into several small formats according to the processing format of the acousto-optic deflection component, during processing, the galvanometer 14 is deflected to several small formats in turn, and the acousto-optic deflection component format is laser processed within the small format. In order to fully describe the processing process, the movements of the XYZ motion platform 2, the galvanometer 14 and the acousto-optic deflection assembly are divided into X and Y directions respectively. The acousto-optic deflection assembly can compensate the movement speed and movement accuracy of the XYZ motion platform 2 and the galvanometer 14 in the two directions in real time in the X and Y directions, thereby realizing high-speed and high-precision laser processing without frequent start and stop of the XYZ motion platform 2, and at the same time effectively reducing the failure rate and wear rate of the XYZ motion platform 2 and the galvanometer 14 caused by frequent start and stop.

[0031] In an optional implementation manner, the XYZ motion platform 2 is provided with an adsorption jig 3, and a plurality of vacuum adsorption holes are provided on the adsorption jig 3 for vacuum adsorption of the workpiece to be processed. At the same time, a plurality of fine-thread leveling screws are provided on the adsorption jig 3 to adjust the flatness of the adsorption jig 3. During the laser processing process, the flatness of the adsorption jig 3 needs to be controlled to be ≤5μm, and the parallelism between the adsorption jig 3 and the focusing field lens 15 needs to be ≤10μm. After adsorbing the workpiece to be processed, the vacuum negative pressure range is -65-90kPa.

[0032] Preferably, high-precision position sensors are configured in the three movement directions of X, Y, and Z of the XYZ motion platform 2, and the three position sensors can dynamically compensate each other and output compensated position information to the controller in real time.

[0033] Optional implementations, such as Figure 1 and Figure 2 As shown, the acousto-optic deflection assembly includes a beam expander 9, an acousto-optic deflector (AOD) 6 and an aperture 11 which are sequentially arranged along the output light path of the laser 5; wherein the beam expander 9 is used to expand the diameter of the laser beam to the spot size required for entering the acousto-optic deflector 6, and in this embodiment, the input spot size entering the acousto-optic deflector 6 is designed to be 4±1 mm; the acousto-optic deflector 6 controls the deflection angle of the laser beam so that the first-order diffraction beam in the laser beam passes through the aperture 11, and at the same time, the aperture 11 blocks the diffraction beams of other orders in the laser beam.

[0034] Optimally, the beam expander 9 and the acousto-optic deflector 6 are arranged close to the laser 5. This arrangement is conducive to the laser beam being able to quickly and efficiently enter the acousto-optic deflector 6 for subsequent processing after being generated, reducing the energy loss and optical path deviation risk during the transmission of the laser beam, and ensuring the stability and accuracy of the system operation. The acousto-optic deflector 6 can adjust the deflection direction and deflection angle of the laser beam on a two-dimensional plane to achieve scanning of the laser beam in one-dimensional and two-dimensional directions; the acousto-optic deflector 6 can be arranged in one or more, and when there are multiple acousto-optic deflectors 6, there are generally two, at which time the two acousto-optic deflectors 6 are arranged on the axis of the laser optical path, and the directions in which the two acousto-optic deflectors effectively deflect the light are arranged perpendicular to each other.

[0035] Furthermore, since the laser power affects the laser processing effect, the acousto-optic deflection assembly also includes a power detection device 8 for detecting the output light power of the laser 5. The power detection device 8 is located on the laser light path between the laser 5 and the beam expander 9 to ensure the stability and accuracy of the laser power.

[0036] Optimally, a first lens 10 is provided on the laser optical path between the acousto-optic deflector 6 and the aperture 11, and the laser light beam output by the acousto-optic deflector 6 is focused into the aperture 11 through the first lens 10; at the same time, a second lens 12 is provided on the laser optical path between the aperture 11 and the galvanometer 14, and the laser light beam passing through the aperture 11 is focused through the second lens 12, so that the laser light beam has a higher energy density when passing through the galvanometer 14, and by adjusting the position and focal length of the second lens 12, the diameter, divergence angle and other parameters of the laser light beam can also be changed to adapt to the specifications and application requirements of different galvanometers 14.

[0037] Optionally, the acousto-optic deflection assembly further includes a plurality of return mirrors 13 for changing the direction of laser transmission. The spatial layout of the optical elements on the laser optical path can be adjusted by setting the return mirrors 13 to save the occupied space of the laser processing system; for example, Figure 2 As shown, the acousto-optic deflection assembly of this embodiment is provided with five folding mirrors 13, which are respectively arranged at the five turning corners of the laser light path.

[0038] Optionally, the laser processing system of this embodiment further includes a frame 1, and the XYZ motion platform 2, controller 7, laser 5, acousto-optic deflection assembly, galvanometer 14 and focusing field lens 15 are all carried on the frame 1 to ensure the stability of the laser processing system.

[0039] The above examples are merely illustrative of the present invention and do not constitute a limitation on the protection scope of the present invention. All designs that are the same or similar to the present invention fall within the protection scope of the present invention.

Claims

1. A laser processing system based on an acousto-optic deflector, characterized in that: The invention comprises an XYZ motion platform, a controller, a laser, and an acousto-optic deflection assembly, a galvanometer and a focusing field lens which are sequentially arranged along the laser output light path; wherein the XYZ motion platform is used to carry a workpiece to be processed and drive the workpiece to be processed to move below the processing format of the galvanometer; the acousto-optic deflection assembly and the galvanometer are used to modulate the processing path of the laser beam; the acousto-optic deflection assembly, the galvanometer and the XYZ motion platform are all electrically connected to the controller; and the controller controls the acousto-optic deflection assembly to compensate the movement speed and accuracy of the galvanometer and the XYZ motion platform in real time.

2. The laser processing system based on the acousto-optic deflector as claimed in claim 1, characterized in that: It also includes a paraxial positioning CCD for locating the position of the workpiece to be processed. The paraxial positioning CCD is located on one side of the galvanometer, and the paraxial positioning CCD is electrically connected to the controller.

3. The laser processing system based on the acousto-optic deflector as claimed in claim 1, characterized in that: The XYZ motion platform is provided with an adsorption fixture for vacuum adsorption of the workpiece to be processed, the flatness of the adsorption fixture is ≤5μm, and the parallelism between the adsorption fixture and the focusing field lens is ≤10μm.

4. The laser processing system based on the acousto-optic deflector as claimed in claim 1, characterized in that: The acousto-optic deflection assembly includes a beam expander, an acousto-optic deflector and an aperture which are sequentially arranged along the output light path of the laser; the beam expander is used to expand the diameter of the laser beam to the spot size required for entering the acousto-optic deflector; the acousto-optic deflector controls the deflection angle of the laser beam so that the first-order diffraction beam in the laser beam passes through the aperture.

5. The laser processing system based on the acousto-optic deflector as claimed in claim 4, characterized in that: The acousto-optic deflection assembly further includes a power detection device for detecting the output light power of the laser, and the power detection device is located on the laser light path between the laser and the beam expander.

6. The laser processing system based on the acousto-optic deflector as claimed in claim 4, characterized in that: A first lens is disposed on the laser light path between the acousto-optic deflector and the aperture, and a second lens is disposed on the laser light path between the aperture and the galvanometer.

7. The laser processing system based on the acousto-optic deflector as claimed in claim 4, characterized in that: The acousto-optic deflection assembly also includes a plurality of folding mirrors for changing the transmission direction of the laser.

8. The laser processing system based on the acousto-optic deflector as claimed in claim 4, characterized in that: The number of the acousto-optic deflector is one or more.

9. A laser processing method based on an acousto-optic deflector, characterized in that: The method is implemented by using the laser processing system according to any one of claims 1 to 8, comprising the following process: The XYZ motion platform drives the workpiece to be processed to move below the galvanometer processing area. The galvanometer area is divided into several small areas according to the area of ​​the acousto-optic deflection assembly. After the galvanometer is deflected to several small areas in turn, the acousto-optic deflection assembly area performs laser processing within the small area.

10. The laser processing method based on the acousto-optic deflector according to claim 9, characterized in that: It also includes that the XYZ motion platform drives the workpiece to be processed to move under the paraxial positioning CCD, locates one or more feature MARK points on the workpiece to be processed through the paraxial positioning CCD and calculates the precise positioning coordinates of the workpiece to be processed and transmits them to the controller, and the controller then controls the XYZ motion platform to drive the workpiece to be processed to move under the galvanometer processing area.

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