Processing method of precise micro through hole in quartz glass product

Abstract

The invention relates to the technical field of semiconductor packaging, in particular to a processing method for a precise micro through hole in a quartz glass product, which comprises the following steps: S1, carrying out laser treatment on a target area of a glass substrate to form a preformed hole with a small aperture in the glass substrate; s2, performing etching and chambering treatment on the prefabricated hole in the glass substrate through an etching solution, and obtaining a micro through hole after etching is completed; wherein the chambering treatment mode in the step S2 is to enable the etching liquid to circularly flow in the preformed hole of the glass substrate in two directions for etching. By improving the mass transfer efficiency of the etching liquid in the micro-through hole, the etching uniformity of each part of the micro-through hole is improved, and then the quartz glass micro-through hole which is controllable in diameter, uniform in shape and small in size difference degree can be obtained.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor packaging, and more specifically, to a method for processing precise micro-through holes on quartz glass products. Background Art

[0002] In the manufacturing process of large-scale integrated circuits and other electronic components, through silicon via (TSV) adapters have the functions of reducing signal delay, reducing capacitance and inductance, achieving low power consumption and high-speed communication of chips, increasing bandwidth and realizing the miniaturization requirements of device integration. However, when transmitting high-frequency or high-speed signals, the overall performance of the TSV adapter will decrease due to its own high dielectric loss, so a low dielectric loss material is urgently needed to replace the TSV adapter.

[0003] Quartz glass has excellent insulation properties, and its loss factor is 2-3 orders of magnitude lower than that of silicon, which greatly reduces substrate loss and parasitic effects, ensuring the integrity of the transmitted signal. Therefore, using quartz glass to replace silicon through-glass vias (TGVs) is currently an ideal solution. The key challenge facing TGV technology is that there is currently no deep hole etching process similar to silicon, making it difficult to manufacture quartz glass microvias with a high aspect ratio.

[0004] Currently, the commonly used methods for preparing glass through holes include mechanical drilling, dry / wet etching, high-energy laser direct ablation and laser-induced degeneration.

[0005] Among them, the mechanical drilling method is to use a tool of a specific size to directly perform mechanical processing and drilling on the glass material.

[0006] Dry / wet etching uses a gas or liquid etching solution to process specific areas of the glass material with the assistance of a mask with a specific pattern to obtain a through hole.

[0007] The principle of laser ablation is that under the action of high-energy laser, the atoms in the punching area produce high-frequency oscillations and are rapidly heated. The atoms fall off the substrate and are ablated and volatilized, thus forming a through hole.

[0008] The principle of the laser-induced denaturation method is to use ultrashort pulse lasers to induce continuous denaturation areas in glass. The glass in the denatured areas has a faster etching rate in hydrofluoric acid and can be effectively removed by subsequent acid etching treatment to form through holes.

[0009] Publication number CN114560634A discloses a method for processing a through hole in anisotropic glass, which uses a laser combined with ultrasonic guided wet etching to process the glass. First, the target area of ​​the glass is laser processed to obtain a prefabricated hole, and then the surface is treated. Subsequently, the glass is placed in a container filled with an etching solution and placed in an ultrasonic device and heated to a fixed temperature. After a period of etching, an irregular glass hole is obtained. However, the holes obtained by this method have problems of irregular shapes and large size differences (the etching efficiency inside the hole is extremely low compared to the outside, and the through hole finally obtained is not a straight through hole with the same size at the top and bottom, and there is a large size difference between the two ends, and a large size difference between the inside and outside of the through hole). Summary of the invention

[0010] The main purpose of the present invention is to provide a method for processing precision micro-through holes on quartz glass products to solve the technical problems mentioned in the background technology.

[0011] In order to solve the above technical problems, the present invention proposes a method for processing precision micro-through holes on a quartz glass product, comprising the following steps:

[0012] S1, performing laser processing on a target area of ​​a glass substrate to form a prefabricated hole with a tiny aperture on the glass substrate;

[0013] S2, etching and expanding the prefabricated holes on the glass substrate using an etching solution, and obtaining micro-through holes after etching;

[0014] The hole enlargement treatment method in step S2 is to make the etching liquid circulate bidirectionally in the prefabricated hole of the glass substrate for etching.

[0015] In the present technical solution, the mass transfer rate is increased by allowing the etching liquid to circulate bidirectionally in the prefabricated holes of the glass substrate, thereby increasing the uniformity of etching the entire structure of the prefabricated holes by the etching liquid. In this way, a quartz glass micro-through hole with controllable diameter, uniform shape and small size difference can be obtained. The diameter of the micro-through hole is above 10 μm, the aspect ratio can reach 25:1, and the difference in aperture at both ends is less than 1%.

[0016] In the above technical solution, further, in step S2, a guiding device is used to make the etching liquid flow from one end of the prefabricated hole of the glass substrate to the other end.

[0017] In any of the above technical solutions, further, in step S2, the glass substrate is placed in a container carrying an etching liquid, and the etching liquid is driven to rotate so as to flow in the prefabricated holes of the glass substrate.

[0018] In any of the above technical solutions, further, the glass substrate is perpendicular to the flow direction of the etching solution.

[0019] In any of the above technical solutions, further, in step S2, a mechanical stirrer or a magnetic stirrer is used to drive the glass substrate to rotate.

[0020] In any of the above technical solutions, further, in step S2, the glass substrate is immersed in the container through a corrosion-resistant clamp, and the corrosion-resistant clamp is driven to rotate to drive the glass substrate to rotate synchronously.

[0021] In any of the above technical solutions, further, when processing micro-through holes with a diameter of less than 20 μm, hydrofluoric acid is used as an etching solution;

[0022] When processing micro-through holes of 20 μm or more, a mixed acid of hydrofluoric acid and nitric acid is used as an etching solution.

[0023] In any of the above technical solutions, further, the concentration of hydrofluoric acid is 20wt%; the concentration of nitric acid is 25wt%.

[0024] In any of the above technical solutions, further, the aperture of the prefabricated hole is adjusted according to the processing size requirement of the micro-through hole;

[0025] Wherein, in step S2, the diameter of the micro-through holes on the prepared glass substrate is 10-100 μm; the diameter of the prefabricated holes is 2-5 μm.

[0026] In any of the above technical solutions, further, when the diameter of the micro-through holes on the prepared glass substrate is 10-100 μm, the etching time of the glass substrate is 20-150 min.

[0027] Beneficial effects: Compared with the prior art, the present application first obtains a prefabricated hole with a tiny aperture on a quartz glass sheet by ultrafast laser processing, and then uses an etching solution to expand the prefabricated hole. By adopting a two-way reciprocating stirring method, the mass transfer efficiency inside the micro-through hole during the etching process is enhanced, and the etching uniformity of each part of the micro-through hole is improved, thereby obtaining a quartz glass micro-through hole with controllable diameter, uniform shape and small size difference. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0029] Figure 1 is a comparison diagram of the two ends of the micro-through hole of the glass substrate in Embodiment 1 of the present invention;

[0030] Figure 2is a comparison diagram of the two ends of the micro-through hole in the glass substrate in Embodiment 2 of the present invention;

[0031] Figure 3 is a comparison diagram of the two ends of the micro-through hole of the glass substrate in Embodiment 3 of the present invention;

[0032] Figure 4 It is a comparison diagram of the two sides of the cross section of the micro-through hole of the glass substrate observed by using a Micro CT device in Embodiment 3 of the present invention;

[0033] Figure 5 is a comparison diagram of the two ends of the micro-through hole in the glass substrate in Embodiment 4 of the present invention;

[0034] Figure 6 This is a comparison diagram of the two ends of the micro-through hole in the glass substrate in Comparative Example 1 of the present invention;

[0035] Figure 7 It is a comparison diagram of the two sides of the cross section of the micro-through hole of the glass substrate observed by using a Micro CT device in Comparative Example 1 of the present invention;

[0036] Figure 8 This is a comparison diagram of the two ends of the micro-through hole in the glass substrate in Comparative Example 2 of the present invention;

[0037] Fig. 9 The present invention uses a stirrer to drive the glass substrate to rotate to expand the hole.

[0038] The following are the descriptions of the reference numerals:

[0039] 10. Glass substrate; 20. Etching solution. DETAILED DESCRIPTION

[0040] Below, the example embodiments according to the present application will be described in detail with reference to the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments of the present application, and it should be understood that the present application is not limited to the example embodiments described herein. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0041] It should be noted that, as shown in this application and claims, unless the context clearly indicates an exception, the words "a", "an", "a kind" and / or "the" do not specifically refer to the singular, but may also include the plural. Generally speaking, the terms "include" and "comprise" only indicate the inclusion of clearly identified steps and elements, and these steps and elements do not constitute an exclusive list, and the method or device may also include other steps or elements.

[0042] If the embodiments of the present invention involve directional indications (such as up, down, left, right, front, back, etc.), the directional indications are only used to explain the relative position relationship, movement status, etc. between the components under a certain specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indication will also change accordingly.

[0043] In the present invention, unless otherwise clearly specified and limited, the terms "connection", "fixation", etc. should be understood in a broad sense. For example, "fixation" can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0044] In addition, if there are descriptions involving "first", "second", etc. in the embodiments of the present invention, the descriptions of "first", "second", etc. are only used for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In addition, the meaning of "and / or" appearing in the full text includes three parallel schemes. Taking "A and / or B" as an example, it includes scheme A, or scheme B, or a scheme that satisfies both A and B. In addition, the technical solutions between the various embodiments can be combined with each other, but it must be based on the ability of ordinary technicians in the field to implement. When the combination of technical solutions is contradictory or cannot be implemented, it should be deemed that such a combination of technical solutions does not exist and is not within the scope of protection required by the present invention.

[0045] As shown in the figure, this embodiment proposes a method for processing precision micro-through holes on a quartz glass product, comprising the following steps:

[0046] S1. Laser processing is performed on a target area of ​​a glass substrate to form a prefabricated hole with a micro-aperture on the glass substrate, wherein the aperture of the prefabricated hole is 2-5 μm;

[0047] S2, etching and expanding the prefabricated holes on the glass substrate by using an etching solution, the etching time is 20-150 minutes, and after the etching is completed, a micro-through hole can be obtained, and the aperture of the micro-through hole is controlled according to the aperture of the prefabricated hole and the etching time. Specifically, a micro-through hole of 10-100 μm can be obtained;

[0048] The hole enlargement treatment method in step S2 is to make the etching liquid circulate bidirectionally in the prefabricated hole of the glass substrate for etching.

[0049] In step S2, a guiding device is used to make the etching liquid flow from one end of the prefabricated hole of the glass substrate to the other end; or the glass substrate 10 is placed in a container carrying the etching liquid 20, and the etching liquid 20 is driven to rotate so as to flow in the prefabricated hole of the glass substrate 10.

[0050] The guiding device may be a pump, which extracts the etching liquid through the pump and then injects the etching liquid from one end of the prefabricated hole of the glass substrate, and makes the etching liquid flow out from the other end of the prefabricated hole. It should be noted that the flow direction of the etching liquid in the prefabricated hole needs to be continuously adjusted to ensure that the size difference between the two ends of the micro-through hole finally obtained is small.

[0051] When the hole is expanded by rotating the glass substrate, the glass substrate can be immersed in the container through a corrosion-resistant fixture, and then the corrosion-resistant fixture is driven to rotate to drive the glass substrate to rotate synchronously.

[0052] The prior art uses ultrasound, but since ultrasound will not speed up the flow of the etching liquid inside the prefabricated hole, the difference in etching rate in the entire structure will increase, which will lead to a large difference in the size of the middle of the prefabricated hole and the size of the two ends of the hole. The guiding device in this embodiment and the method of driving the glass substrate to rotate will force the etching liquid to flow in the prefabricated hole, thereby increasing the mass transfer rate. After that, the etching uniformity of the entire structure of the prefabricated hole will increase. Then, a quartz glass micro-through hole with controllable diameter, uniform shape and small size difference can be obtained. The diameter of the micro-through hole is above 10μm, and the aspect ratio can reach 25:1. The difference in the hole diameter at both ends is less than 1%.

[0053] In this embodiment, it should be noted that when processing micro-through holes below 20 μm, hydrofluoric acid is used as the etching solution;

[0054] When processing micro-through holes of 20 μm and above, a mixed acid of hydrofluoric acid and nitric acid is used as the etching solution;

[0055] Wherein, the concentration of hydrofluoric acid is 20wt%; the concentration of nitric acid is 25wt%.

[0056] In this embodiment, it should be noted that in step S1, ultrafast laser may be used to make the prefabricated holes.

[0057] In this embodiment, it should be noted that, in step S2, a mechanical stirrer or a magnetic stirrer is used to drive the corrosion-resistant fixture to rotate.

[0058] In this embodiment, it should be noted that the glass substrate is perpendicular to the flow direction of the etching liquid. Specifically, the glass substrate is placed vertically in the container so that the etching liquid can flow quickly in the prefabricated holes of the glass substrate when the glass substrate rotates.

[0059] The following embodiments are used to describe in detail a method for processing precision micro-through holes on a quartz glass product of the present application.

[0060] Embodiment 1:

[0061] This embodiment provides a method for processing precision micro-through holes on a quartz glass product, comprising the following steps:

[0062] S1. Use ultrafast laser to process a prefabricated hole with a diameter of 2 μm on a quartz glass substrate with a size of 20*20*0.5 mm;

[0063] S2, prepare 20wt% hydrofluoric acid etching solution and place it in a plastic container;

[0064] S3, fix the quartz glass substrate with prefabricated holes with a polytetrafluoroethylene clamp, and then place it vertically in the etching solution;

[0065] S4, turning on the mechanical stirrer or magnetic stirrer, and adjusting the orientation of the quartz glass substrate to make it perpendicular to the flow direction of the etching solution. The quartz glass substrate needs to rotate forward and reverse at a certain frequency;

[0066] S5. After etching for 20 min, turn off the agitator, take out the quartz glass substrate, and thoroughly wash it with ultrapure water and dry it;

[0067] S6. Use a metallographic microscope to observe the structure and size of the two ends of the micro-through hole.

[0068] like Figure 1 As shown, there is no edge collapse or corner chipping around the micro-through holes on the quartz glass substrate. The shape of the micro-through holes is regular and uniform. The diameters at both ends of the micro-through holes are 12.12 μm and 12.06 μm, respectively, with a size difference of 0.49%.

[0069] Embodiment 2:

[0070] This embodiment provides a method for processing precision micro-through holes on a quartz glass product, comprising the following steps:

[0071] S1. Use ultrafast laser to process a prefabricated hole with a diameter of 2 μm on a quartz glass substrate with a size of 20*20*0.5 mm;

[0072] S2, preparing 20wt% hydrofluoric acid and 25wt% nitric acid etching solution, and placing it in a plastic container;

[0073] S3, fix the quartz glass substrate with prefabricated holes with a polytetrafluoroethylene clamp, and then place it vertically in the etching solution;

[0074] S4, turning on the mechanical stirrer or magnetic stirrer, and adjusting the orientation of the quartz glass substrate to make it perpendicular to the flow direction of the etching solution. The quartz glass substrate needs to rotate forward and reverse at a certain frequency;

[0075] S5. After etching for 30 min, turn off the agitator, take out the quartz glass substrate, and thoroughly wash it with ultrapure water and dry it;

[0076] S6. Use a metallographic microscope to observe the structure and size of the two ends of the micro-through hole.

[0077] like Figure 2 As shown, there is no edge collapse or corner chipping around the micro-through hole. The shape of the micro-through hole is regular and uniform. The diameters at both ends of the micro-through hole are 20.24μm and 20.39μm respectively, and the size difference is 0.74%.

[0078] Embodiment three:

[0079] This embodiment provides a method for processing precision micro-through holes on a quartz glass product, comprising the following steps:

[0080] S1. Use ultrafast laser to process a prefabricated hole with a diameter of 2 μm on a quartz glass substrate with a size of 20*20*0.5 mm;

[0081] S2, preparing 20wt% hydrofluoric acid and 25wt% nitric acid etching solution, and placing it in a plastic container;

[0082] S3, fix the quartz glass substrate with prefabricated holes with a polytetrafluoroethylene clamp, and then place it vertically in the etching solution;

[0083] S4, turning on the mechanical stirrer or magnetic stirrer, and adjusting the orientation of the quartz glass substrate to make it perpendicular to the flow direction of the etching solution. The quartz glass substrate needs to rotate forward and reverse at a certain frequency;

[0084] S5. After etching for 40 min, turn off the agitator, take out the quartz glass substrate, and thoroughly wash it with ultrapure water and dry it;

[0085] S6. Use a metallographic microscope to observe the structure and size of both ends of the micro-through hole;

[0086] S7. Use Micro CT equipment to observe the internal structure and size of the micro-through holes.

[0087] like Figure 3 As shown, there is no edge collapse or corner chipping around the micro-through hole, the shape of the micro-through hole is regular and uniform, the diameters at both ends of the micro-through hole are 27.33μm and 27.48μm respectively, and the size difference is 0.55%.

[0088] like Figure 4 As shown in the cross-sectional image, it can be seen that the micro-through hole is completely through. The diameter of the openings at both ends is about 34μm, and the diameter of the narrowest part in the middle is about 20μm. The difference between the middle size and the opening size at both ends is less than 30%. It should be pointed out that since the volume resolution of the Micro CT system is 4μm, which is somewhat different from that of the metallographic microscope, there is a certain deviation in the measured size.

[0089] Embodiment 4:

[0090] This embodiment provides a method for processing precision micro-through holes on a quartz glass product, comprising the following steps:

[0091] S1. Use ultrafast laser to process a prefabricated hole with a diameter of 5 μm on a quartz glass substrate with a size of 20*20*0.5 mm;

[0092] S2, preparing 20wt% hydrofluoric acid and 25wt% nitric acid etching solution, and placing it in a plastic container;

[0093] S3, fix the quartz glass substrate with prefabricated holes with a polytetrafluoroethylene clamp, and then place it vertically in the etching solution;

[0094] S4, turning on the mechanical stirrer or magnetic stirrer, and adjusting the orientation of the quartz glass substrate to make it perpendicular to the flow direction of the etching solution. The quartz glass substrate needs to rotate forward and reverse at a certain frequency;

[0095] S5. After etching for 40 min, turn off the agitator, take out the quartz glass substrate, and thoroughly wash it with ultrapure water and dry it;

[0096] S6. Use a metallographic microscope to observe the structure and size of the two ends of the micro-through hole.

[0097] like Figure 5 As shown, there is no edge collapse or corner chipping around the micro-through hole. The shape of the micro-through hole is regular and uniform. The diameters at both ends of the micro-through hole are 95.87μm and 96.12μm respectively, and the size difference is 0.26%.

[0098] Comparative Example 1:

[0099] This comparative example describes the method and process of machining precise micro-through holes on quartz glass products by static etching, so as to illustrate the importance of bidirectional reciprocating stirring to improve the etching mass transfer process.

[0100] S1. Use ultrafast laser to process a prefabricated hole with a diameter of 2 μm on a quartz glass substrate with a size of 20*20*0.5 mm;

[0101] S2, prepare 20wt% hydrofluoric acid and 25wt% nitric acid etching solution, and place it in a plastic container;

[0102] S3, fix the quartz glass substrate with prefabricated holes with a polytetrafluoroethylene clamp, and then place it vertically in the etching solution;

[0103] S4. After etching for 30 minutes, take out the quartz glass substrate, wash it thoroughly with ultrapure water and dry it;

[0104] S5. Use a metallographic microscope to observe the structure and size of both ends of the micro-through hole;

[0105] S6. Use Micro CT equipment to observe the internal structure and size of the micro-through holes.

[0106] like Figure 6 As shown, there is no edge collapse or corner chipping around the micro-through hole, but the shape of one end of the micro-through hole is irregular. The diameters at both ends of the through hole are 22.13μm and 21.14μm respectively, with a size difference of 4.68%.

[0107] like Figure 7 As shown, it can be seen from the cross-sectional image that the micro-through hole is not completely through, and the diameter of the middle part of the micro-through hole drops sharply, which is smaller than the resolution limit of the Micro CT equipment and cannot be imaged. Therefore, it can be confirmed that the diameter of the narrowest part of the small hole is less than 4μm.

[0108] Comparative Example 2:

[0109] This comparative example describes a method and process for machining precise micro-through holes on a quartz glass product using a unidirectional stirring method, in order to illustrate the importance of bidirectional reciprocating stirring in improving the etching mass transfer process.

[0110] S1. Use ultrafast laser to process a prefabricated hole with a diameter of 2 μm on a quartz glass substrate with a size of 20*20*0.5 mm;

[0111] S2, prepare 20wt% hydrofluoric acid and 25wt% nitric acid etching solution, and place it in a plastic container;

[0112] S3, fix the quartz glass sheet with prefabricated holes with a polytetrafluoroethylene clamp and place it vertically in the etching solution;

[0113] S4, turning on the stirring device, adjusting the orientation of the quartz glass substrate so that it is perpendicular to the flow direction of the etching liquid, and the quartz glass substrate rotates in one direction;

[0114] S5. After etching for 30 minutes, take out the quartz glass substrate, wash it thoroughly with ultrapure water and dry it;

[0115] S6. Use a metallographic microscope to observe the structure and size of both ends of the micro-through hole;

[0116] like Figure 8 As shown, there is no edge collapse or corner chipping around the micro-through hole, but the shape of one end of the micro-through hole is irregular. The diameters at both ends of the through hole are 19.35μm and 21.68μm respectively, with a size difference of 12.04%.

[0118] The measurement data of Examples 1 to 4 and Comparisons 1 and 2 are compared as follows:

[0119]

[0120]

[0121] From the above comparison, it can be seen that the present application adopts a two-way reciprocating stirring method, which effectively improves the etching efficiency of the etching solution on the glass substrate, and can obtain quartz glass precision micro-through holes with controllable diameter, uniform shape and small size difference, and the aspect ratio of the micro-through hole can reach 25:1, and the difference in aperture at both ends is less than 1%.

[0122] The embodiments of the present disclosure have been described above, and the above description is exemplary, not exhaustive, and is not limited to the disclosed embodiments. Many modifications and changes will be apparent to those of ordinary skill in the art without departing from the scope and spirit of the described embodiments. The selection of terms used herein is intended to best explain the principles of the embodiments, practical applications, or improvements to the technology in the market, or to enable other persons of ordinary skill in the art to understand the embodiments disclosed herein.

Claims

1. A method for processing precision micro-through holes on a quartz glass product, characterized in that: The following steps are involved: S1, performing laser processing on a target area of ​​a glass substrate to form a prefabricated hole with a tiny aperture on the glass substrate; S2, etching and expanding the prefabricated holes on the glass substrate using an etching solution, and obtaining micro-through holes after etching; The hole enlargement treatment method in step S2 is to make the etching liquid circulate bidirectionally in the prefabricated hole of the glass substrate for etching.

2. The method for processing precision micro-through holes on a quartz glass product according to claim 1, characterized in that: In step S2, a guiding device is used to make the etching liquid flow from one end of the prefabricated hole of the glass substrate to the other end.

3. The method for processing precision micro-through holes on a quartz glass product according to claim 1, characterized in that: In step S2, the glass substrate is placed in a container carrying an etching liquid, and the etching liquid is driven to rotate so as to flow in the prefabricated holes of the glass substrate.

4. The method for processing precision micro-through holes on a quartz glass product according to claim 3, characterized in that: The glass substrate is perpendicular to the flow direction of the etching solution.

5. The method for processing precision micro-through holes on a quartz glass product according to claim 3, characterized in that: In step S2, a mechanical stirrer or a magnetic stirrer is used to drive the glass substrate to rotate.

6. The method for processing precision micro-through holes on a quartz glass product according to claim 3, characterized in that: In step S2, the glass substrate is immersed in the container through a corrosion-resistant fixture, and the corrosion-resistant fixture is driven to rotate to drive the glass substrate to rotate synchronously.

7. The method for processing precision micro-through holes on a quartz glass product according to claim 1, characterized in that: When processing micro-through holes below 20 μm, hydrofluoric acid is used as the etching solution; When processing micro-through holes of 20 μm or more, a mixed acid of hydrofluoric acid and nitric acid is used as an etching solution.

8. The method for processing precision micro-through holes on a quartz glass product according to claim 7, characterized in that: The concentration of hydrofluoric acid is 20 wt %; the concentration of nitric acid is 25 wt %.

9. The method for processing precision micro-through holes on a quartz glass product according to claim 1, characterized in that: Adjust the aperture of the prefabricated hole according to the processing size requirements of the micro-through hole; Wherein, in step S2, the diameter of the micro-through holes on the prepared glass substrate is 10-100 μm; and the diameter of the prefabricated holes is 2-5 μm.

10. The method for processing precision micro-through holes on a quartz glass product according to claim 9, characterized in that: When the diameter of the micro-through hole on the prepared glass substrate is 10-100 μm, the etching time of the glass substrate is 20-150 minutes.

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